JP2014065931A - Vapor deposition mask manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a vapor deposition mask that can be made light even when it is made large, and by which an opening of a resin mask and a slit of a metal mask can be precisely formed.SOLUTION: A method for manufacturing a vapor deposition mask 100 formed by laminating a metal mask 15 with a slit 16, and a resin mask 25 provided with an opening 50 corresponding to a vapor deposition manufactured pattern comprises the steps of: preparing a metallic plate 10 with a resin layer on one surface of which a resin layer 20 is provided; forming a resin mask 25 on the resin layer by forming an opening corresponding to the vapor deposition manufactured pattern; and forming the metal mask by applying etching from a face side not contacting the resin mask of the metallic plate and forming a slit penetrating through the metallic plate and overlaid on an opening of the resin mask.

Description

  The present invention relates to a method for manufacturing a vapor deposition mask.

  Conventionally, in the manufacture of an organic EL element, the organic layer or cathode electrode of the organic EL element is formed of, for example, a metal in which a large number of minute slits are arranged in parallel at minute intervals in a region to be deposited. A vapor deposition mask was used. When using this vapor deposition mask, the vapor deposition mask is placed on the surface of the substrate to be vapor-deposited and held by a magnet from the back side, but the rigidity of the slit is extremely small, so when holding the vapor deposition mask on the substrate surface In this case, the slits are easily distorted, which has been an obstacle to the increase in the size of products with high definition or a long slit length.

  Various studies have been made on the vapor deposition mask for preventing the distortion of the slit. For example, Patent Document 1 covers a base plate that also serves as a first metal mask having a plurality of openings, and covers the openings. There has been proposed a vapor deposition mask having a second metal mask having a large number of fine slits in the region and a mask tension holding means for positioning the second metal mask on the base plate in a state where the second metal mask is pulled in the longitudinal direction of the slit. That is, a vapor deposition mask in which two kinds of metal masks are combined has been proposed. According to this vapor deposition mask, it is said that the slit accuracy can be ensured without causing distortion in the slit.

  Recently, with the increase in size of products using organic EL elements or the increase in substrate size, there is an increasing demand for deposition masks, which are used in the manufacture of deposition masks made of metal. Metal plates are also getting bigger. However, with the current metal processing technology, it is difficult to accurately form a fine pattern on a large metal plate, and it is possible to prevent distortion of the slit portion by the method proposed in Patent Document 1 above. However, it cannot cope with high definition. In addition, in the case of a vapor deposition mask made of only metal, the mass increases with the increase in size, and the total mass including the frame also increases, which hinders handling.

JP 2003-332057 A

  The present invention has been made in view of such a situation, and can satisfy the weight reduction even when the size is increased, and can accurately form the opening of the resin mask and the slit of the metal mask. The main object is to provide a method for manufacturing a vapor deposition mask.

  In order to solve the above problems, the present invention comprises a laminate of a metal mask provided with a slit and a resin mask provided on the surface of the metal mask and provided with an opening corresponding to a pattern to be deposited. A method for manufacturing a vapor deposition mask, comprising: preparing a metal plate with a resin layer provided with a resin layer on one surface of the metal plate; and forming an opening corresponding to a pattern to be vapor deposited on the resin layer A step of forming a resin mask, and etching is performed from the side of the metal plate that does not contact the resin mask to form a slit that penetrates the metal plate and overlaps the opening of the resin mask. And a step of forming a metal mask.

  According to the manufacturing method of the vapor deposition mask of this invention, even when it enlarges, weight reduction can be satisfy | filled, and the opening part of a resin mask and the slit of a metal mask can be formed accurately.

It is process drawing for demonstrating an example of the manufacturing method of the vapor deposition mask of this invention. It is a schematic sectional drawing for demonstrating the process of forming a metal mask. It is a schematic sectional drawing which shows the state of the slit inner wall face of the metal mask formed by the manufacturing method which does not satisfy the invention specific matter of the manufacturing method of this invention. (A) is the front view seen from the metal mask side of the vapor deposition mask manufactured with the manufacturing method of this invention, (b) is an expanded sectional view which shows an example of the vapor deposition mask manufactured with the manufacturing method of this invention. (C) is the front view seen from the metal mask side of the vapor deposition mask manufactured with the manufacturing method of this invention. It is a schematic sectional drawing which shows the relationship between a shadow and the thickness of a metal mask.

<Manufacturing method of vapor deposition mask>
Below, the manufacturing method of the vapor deposition mask of this invention (henceforth the manufacturing method of this invention may be called) is concretely demonstrated using drawing. In addition, FIG. 1 is process drawing which shows an example of the manufacturing method of the vapor deposition mask of this invention.

  The manufacturing method of the present invention is a method for manufacturing a vapor deposition mask in which a metal mask provided with a slit and a resin mask provided with an opening corresponding to a pattern for vapor deposition are laminated. Forming a resin mask 25 by forming a metal layer 30 with a resin layer 20 provided with a resin layer 20 on one surface thereof, and forming an opening 50 in the resin layer 20 corresponding to a pattern to be deposited. And the etching process is performed from the side of the metal plate 10 that is not in contact with the resin mask 25 to form a slit 16 that penetrates the metal plate 10 and overlaps the opening 50 of the resin mask 25. Forming.

  The vapor deposition mask manufactured by the manufacturing method of this invention takes the structure by which the resin mask 25 and the metal mask 15 were laminated | stacked. Here, the mass of the vapor deposition mask 100 manufactured by the manufacturing method of the present invention and the mass of the vapor deposition mask material composed only of a conventionally known metal are compared on the assumption that the thickness of the entire vapor deposition mask is the same. Then, the mass of the vapor deposition mask 100 manufactured by the manufacturing method of the present invention is lightened by the amount that a part of the metal material of the conventionally known vapor deposition mask is replaced with the resin material. In addition, in order to reduce the weight by using a vapor deposition mask made of only metal, it is necessary to reduce the thickness of the vapor deposition mask. However, if the vapor deposition mask is thin, When the size is increased, the vapor deposition mask may be distorted or the durability may be reduced. On the other hand, according to the manufacturing method of the present invention, even when the thickness of the entire vapor deposition mask is increased in order to satisfy the distortion and the durability when it is enlarged, due to the presence of the resin mask 25, It is possible to manufacture a vapor deposition mask that can be made lighter than a vapor deposition mask formed of only metal.

  Moreover, the resin material which comprises the resin plate for forming a resin mask has a property which can perform a high definition process compared with a metal material. Therefore, according to the method for manufacturing a vapor deposition mask of the present invention, while providing a high-definition opening 50 corresponding to a pattern to be vapor-deposited on the resin mask 25 while reducing the weight, an object to be vapor-deposited (hereinafter simply referred to as a vapor deposition object). A deposition mask capable of forming a high-definition deposition pattern can be manufactured.

  Hereinafter, each process of the manufacturing method of the vapor deposition mask of this invention is demonstrated concretely. In the following description, first, the process will be mainly described, and the material and the like will be described together with the description of the vapor deposition mask manufactured by the manufacturing method.

(Process for preparing a metal plate with a resin layer)
This step is a step of preparing a metal plate 30 with a resin layer in which the resin layer 20 is provided on one surface of the metal plate 10 as shown in FIG. There is no limitation in particular about the metal plate 30 with a resin layer prepared at this process, The commercially available metal plate 30 with a resin layer may be used as it is, and a resin layer is provided on the surface of a metal plate using various coating methods. The obtained metal plate 30 with a resin layer may be used. Moreover, you may use the metal plate 30 with the resin layer which bonded the metal plate 10 and the resin layer 20 together.

(Process for forming a resin mask)
This step is a step of forming the resin mask 25 by forming the opening 50 corresponding to the pattern to be deposited on the resin layer 20 of the metal plate 30 with the resin layer as shown in FIG. In addition, the pattern produced by vapor deposition in the present specification means a pattern to be produced using the vapor deposition mask. For example, when the vapor deposition mask is used for forming an organic layer of an organic EL element, vapor deposition production is performed. The pattern to be done is the shape of the organic layer.

  The method for forming the opening 50 is not particularly limited. For example, the opening 50 is formed by irradiating the surface of the resin layer 20 with a laser to remove the resin material of the resin layer 20 corresponding to the opening 50. be able to. The laser processing method is a preferable processing method in that a high-definition opening can be formed.

  The laser device used here is not particularly limited, and a conventionally known laser device may be used.

  In addition, the opening 50 can be formed by using an etching method instead of the laser irradiation method. Specifically, a resist material is coated on the surface of the resin layer 20 on the side not in contact with the metal plate 10, and the resist material is masked using a mask corresponding to the opening shape of the opening 50, exposed, and developed. Then, a resist pattern is formed. Next, using the resist pattern and the metal plate 10 as an etching mask, etching is performed using an etching material until the resin layer 20 penetrates. Next, the opening 50 can be formed in the resin layer 20 of the metal plate 30 with a resin layer by washing and removing the resist pattern after the etching process is completed.

  The etching method for forming the opening 50 is not particularly limited. For example, a spray etching method in which an etching material is sprayed from a spray nozzle at a predetermined spray pressure, or an immersion etching in which the etching material is immersed in an etching solution filled with the etching material. For example, a wet etching method such as a spin etching method in which an etching material is dropped, or a dry etching method using gas, plasma, or the like can be used.

  The etching material for etching the resin layer may be appropriately set according to the resin material of the resin layer, and is not particularly limited. For example, when a polyimide resin is used as the resin material of the resin layer 20, an alkaline aqueous solution in which sodium hydroxide or potassium hydroxide is dissolved, hydrazine, or the like can be used as an etching material. Commercially available etching materials can be used as they are, and TPE3000 manufactured by Toray Engineering Co., Ltd. can be used as the polyimide resin etching material.

(Process to form a metal mask)
In this step, as shown in FIGS. 1C to 1E, etching is performed from the side of the metal plate 10 on which the resin mask is not formed, in other words, from the side of the metal plate 10 that is not in contact with the resin mask 25. In this process, the metal mask is formed by forming a slit 16 that penetrates the metal plate 10 and overlaps the opening 50 of the resin mask 25.

  Specifically, as shown in FIG. 1C, a resist material 62 is applied to the surface of the metal plate 10 on the side not in contact with the resin mask 25, and the resist is used using a mask 63 in which a slit pattern is formed. Mask the material, expose and develop. Thus, a resist pattern 64 is formed on the surface of the metal plate 10 as shown in FIG. Then, using the resist pattern 64 as an etching resistant mask, a slit 16 that penetrates the metal plate 10 and overlaps the opening 50 of the resin mask 25 is formed using an etching material, and the resist pattern 64 is formed after the etching is completed. Wash away. Thereby, as shown in FIG.1 (e), the metal mask 15 by which the slit 16 was formed in the metal plate 10 can be obtained.

  As the resist material, it is preferable to use a resist material having good processability and desired resolution. Further, the etching material used in the etching process is not particularly limited, and a known etching material may be appropriately selected.

  Here, in the manufacturing method of the present invention, the resin mask 25 having the opening 50 is formed by the step of forming the resin mask before the step of forming the metal mask 15. Therefore, in this step of forming the metal mask, the slit 16 is formed immediately after the slit 16 that penetrates the metal plate 10 and overlaps the opening 50 of the resin mask 25 is formed by etching using an etching material. As shown in FIG. 2A, the etching material that is used for the progress of and stays in the slit 16 is discharged from the opening 50 without staying in the slit 16. In the formation stage of the slit 16, etching that penetrates the metal plate 10 proceeds by the etching material that stays in the recess that finally becomes the slit 16. Therefore, at the moment when the slit 16 penetrating the metal plate 10 is formed, the flatness of the inner wall surface of the slit 16 is low as shown in FIG.

  In forming the slit 16, after the formation of the slit 16 penetrating the metal plate 10 proceeds, etching toward the inner wall surface 16 </ b> A side of the slit 16 proceeds. Since the etching material provided for the progress of the etching process is discharged from the opening 50 due to the presence of the opening 50 provided in the resin mask 25, the etching toward the inner wall surface 16A side is performed as follows. It is always performed in a state where a fresh etching material is supplied. Thereby, the flatness of the inner wall surface 16A of the slit 16 of the metal mask can be improved, and an extremely fine slit 16 can be formed as shown in FIG.

  The etching time in this step is not particularly limited, but the etching material used for penetrating the metal mask 15 is discharged from the opening 50 immediately after the metal mask 15 penetrates, and is fresh in the slit 16. Etching material is supplied. That is, from this stage, etching with a fresh etching material proceeds. In other words, from this stage, etching for improving the flatness of the inner wall surface of the slit 16 is started. Therefore, the etching time may be appropriately set in consideration of the time for improving the flatness on the inner wall surface 16A side.

  When the slit 17 is formed by etching in a state where the resin layer provided on the metal plate does not have an opening, that is, in a state where the discharge of the etching material is blocked by the resin layer, FIG. ), After the slit 17 penetrating the metal plate 10 is formed, the etching material provided for forming the slit 17 stays in the slit 17 and stays in the slit 17. Etching toward the inner wall surface 17A side of the slit 17 proceeds by the etching material. Therefore, as shown in FIG. 3B, the flatness of the inner wall surface cannot be improved, and the slit 17 finally formed becomes a slit 17 with low flatness. FIG. 3 is a schematic cross-sectional view showing the state of the slit 17 when the slit 17 is formed using a manufacturing method that does not satisfy the invention-specific matters of the manufacturing method of the present invention.

  There is no particular limitation on the etching method for forming the slit 16, and for example, a spray etching method in which an etching material is sprayed from a spray nozzle at a predetermined spray pressure on the surface of a metal plate may be used. You may use the method of immersing the metal plate 10 provided with the mask 25 in the etching liquid with which the etching material was filled. In addition to this, a method such as a spin etching method in which the metal plate 10 having the resin mask 25 provided on the surface thereof is attached to a turntable and an etching material is dropped can also be used.

  There is no particular limitation on the etching material, and a conventionally known etching material capable of eroding and removing the metal material of the metal plate can be appropriately selected and used. For example, hydrofluoric acid can be used.

  Among the etching processing methods exemplified above, the spray etching method can discharge the etching material provided for forming the slit 16 from the opening 50 using the spray pressure, so that a fresh etching material can be used. This is preferable because it can be sprayed into the slit 16 at all times. It is also a preferable method in that the adjustment of the spray pressure of the etching material and the spray amount of the etching material is easy. The spray pressure and the spray amount by the spray etching method may be appropriately set in consideration of the opening shape of the opening 50 and the like.

  Further, in the case of using an etching processing method in which the etching material is immersed in an etching solution filled with an etching material, in order to efficiently discharge the etching material from the opening 50, the etching solution containing the etching material is stirred. However, it is preferable to carry out.

  Since the opening 50 provided in the resin mask 25 is smaller than the slit 16 finally formed in the metal plate 10, the slit 16 is formed by etching the metal plate 10 from the opening 50 side. It is very difficult to form. Therefore, the etching process for forming the slits 16 in the metal plate 10 needs to be performed from the surface of the metal plate 10 where the resin mask 25 is not provided. That is, it is necessary to perform etching from one side. In this etching process from one side, the etching material used at the stage where the slit 16 is formed stays in the concave portion to be the slit 16, and the end surface of the slit 16 is etched by the deteriorated etching material. However, in the manufacturing method according to the present invention, the opening 50 of the resin mask 25 can play a role of introducing a fresh etching material. Therefore, as described above, the high-definition slit 16 can be formed.

  In this step, etching is performed from the side of the metal plate 10 where the resin mask 25 is not formed. Etching has the property that the etching amount in the width direction decreases in the direction of travel of the etching material, in other words, in the depth direction. Therefore, according to this process in which the etching is performed from the side of the metal plate where the resin mask 25 is not formed, the cross-sectional shape of the slit has an extension toward the deposition source side as shown in FIG. A cross-sectional shape can be obtained, and generation of shadows can be effectively prevented. In addition, the shadow referred to in the present specification is a vapor deposition portion that is insufficient for the pattern to be vapor deposited on the vapor deposition object when the vapor deposition pattern is formed on the vapor deposition object using the vapor deposition mask of the present invention, That is, it refers to a phenomenon in which a vapor deposition portion having a film thickness thinner than the target vapor deposition film thickness occurs.

(Slimming process)
Moreover, in the manufacturing method of this invention, you may perform a slimming process between the processes demonstrated above, or a process. This step is an optional step in the manufacturing method of the present invention, and is a step of optimizing the thickness of the metal mask 15 and the thickness of the resin mask 25. A preferable thickness of the metal mask 15 or the resin mask 25 may be set as appropriate within the range described above, and detailed description thereof is omitted here.

  For example, when the resin layer 20 to be the resin mask 25 and the metal plate 10 to be the metal mask 15 are thicker than the preferable thickness described above, the metal plate 10 and the resin layer 20 are used during the manufacturing process. When carrying the vapor deposition mask 100 obtained by the process of forming the said vapor deposition mask, when conveying the laminated body in which the resin layer 20 was provided on the metal plate 10 with which the recessed part was provided. In particular, excellent durability and transportability can be imparted. On the other hand, in order to prevent the occurrence of shadows and the like, the thickness of the vapor deposition mask 100 obtained by the production method of the present invention is preferably an optimum thickness. The slimming process is a useful process for optimizing the thickness of the vapor deposition mask 100 while satisfying durability and transportability during or after the manufacturing process.

  The slimming of the metal plate 10 or the metal mask 15 to be the metal mask 15, that is, the optimization of the thickness of the metal mask is the surface on the side not in contact with the resin layer 20 of the metal plate 10 during or after the above-described steps. Alternatively, it can be realized by etching the surface of the metal mask 15 on the side not in contact with the resin layer 20 or the resin mask 25 using an etching material capable of etching the metal plate 10 or the metal mask 15.

  The same applies to the slimming of the resin layer 20 to be the resin mask 25 and the resin mask 25, that is, the optimization of the thickness of the resin layer 20 and the resin mask 25. An etching material capable of etching the material of the resin layer 20 or the resin mask 25 is used for the surface of the layer 20 that does not contact the metal plate 10 or the metal mask 15 or the surface of the resin mask 25 that does not contact the metal mask 15. This can be realized by etching. Moreover, after forming the vapor deposition mask 100, both the metal mask 15 and the resin mask 25 can be etched, so that the thicknesses of both can be optimized.

<Vapor deposition mask manufactured by the manufacturing method of the present invention>
4A is a front view of the vapor deposition mask 100 manufactured by the manufacturing method of the present invention as viewed from the metal mask 15 side, and FIG. 4B is a diagram of the vapor deposition mask 100 manufactured by the manufacturing method of the present invention. It is an expanded sectional view. In this figure, in order to emphasize the slit provided with the metal mask and the opening provided in the vapor deposition mask, the ratio to the whole is greatly described.

  As shown in FIG. 4, the vapor deposition mask 100 manufactured by the manufacturing method of the present invention is provided with the metal mask 15 provided with the slits 16 and the openings 50 corresponding to the patterns to be vapor-deposited at positions overlapping the slits 16. The resin mask 25 is laminated. Each will be described in detail below.

(Resin mask)
The resin mask 25 is made of resin, and as shown in FIG. 4A, an opening 50 corresponding to a pattern to be deposited is provided.

  For the resin mask 25, a conventionally known resin material can be appropriately selected and used, and the material is not particularly limited. However, a high-definition opening 50 can be formed by laser processing or the like, and heat or aging It is preferable to use a lightweight material having a small dimensional change rate and moisture absorption rate. Examples of such materials include polyimide resin, polyamide resin, polyamideimide resin, polyester resin, polyethylene resin, polyvinyl alcohol resin, polypropylene resin, polycarbonate resin, polystyrene resin, polyacrylonitrile resin, ethylene vinyl acetate copolymer resin, ethylene- Examples thereof include vinyl alcohol copolymer resin, ethylene-methacrylic acid copolymer resin, polyvinyl chloride resin, polyvinylidene chloride resin, cellophane, and ionomer resin. Among the materials exemplified above, a resin material having a thermal expansion coefficient of 16 ppm / ° C. or less is preferable, a resin material having a moisture absorption rate of 1.0% or less is preferable, and a resin material having both conditions is particularly preferable. . Therefore, since the resin layer 20 in the metal plate 30 with a resin layer shown in FIG. 1A will become the resin mask 25 in the future, for example, a resin plate made of the preferred resin material exemplified above is used. It is preferable.

  The thickness of the resin mask 25 is not particularly limited, but when vapor deposition is performed using the vapor deposition mask of the present invention, a vapor deposition portion that is insufficient for the pattern to be vapor deposited, that is, a film thinner than the target vapor deposition film thickness. The resin mask 25 is preferably as thin as possible in order to prevent a thickened deposition portion, so-called shadow, from occurring. However, when the thickness of the resin mask 25 is less than 3 μm, defects such as pinholes are likely to occur, and the risk of deformation and the like increases. On the other hand, depending on the thickness of the metal mask 15, if the thickness of the resin mask 25 exceeds 25 μm, a shadow may be generated. Considering this point, the thickness of the resin mask 25 is preferably 3 μm or more and 25 μm or less. By setting the thickness of the resin mask 25 within this range, it is possible to reduce the risk of defects such as pinholes and deformation, and to effectively prevent the occurrence of shadows. Therefore, since the resin layer 20 in the metal plate 30 with a resin layer shown in FIG. 1A will become the resin mask 25 in the future, it is preferable to have the above thickness. In FIG. 1, the resin layer 20 may be bonded to the metal plate via an adhesive layer or an adhesive layer, or the resin layer 20 and the metal plate 10 may be directly bonded. However, when the resin layer 20 and the metal plate 10 are joined via the pressure-sensitive adhesive layer or the adhesive layer, the resin layer 20 and the pressure-sensitive adhesive layer or the resin layer 20 and the adhesive are taken into consideration in consideration of the shadow. It is preferable to set the total thickness with the layer to be in the range of 3 μm to 25 μm.

  There is no particular limitation on the shape and size of the opening 50, and any shape and size corresponding to the pattern to be deposited may be used. Moreover, as shown to Fig.4 (a), the pitch P1 of the horizontal direction of the adjacent opening part 50 and the pitch P2 of the vertical direction can also be set suitably according to the pattern produced by vapor deposition. Accordingly, when the openings 50 are formed in the resin layer 20 in FIG. 1B, the pitches P1 and P2 may be appropriately designed. There is no particular limitation on the position where the opening is provided and the number of processed parts, and one may be provided at a position overlapping the slit 16, or a plurality may be provided in the vertical direction or the horizontal direction. For example, as shown in FIG. 4C, when the slit extends in the vertical direction, two or more openings 50 overlapping the slit 16 may be provided in the horizontal direction.

  There is no particular limitation on the cross-sectional shape of the opening 50, and the end faces of the resin mask that form the opening 50 may be substantially parallel to each other. However, as shown in FIG. It is preferable that the cross-sectional shape has a shape that expands toward the vapor deposition source. In other words, the shape is preferably widened toward the metal mask 15 side. By setting the cross-sectional shape of the opening 50 to the configuration, it is possible to prevent a shadow from being generated in a pattern to be formed when vapor deposition is performed using the vapor deposition mask of the present invention. More specifically, it is preferable that the angle between the bottom end of the bottom of the opening of the resin mask and the top of the top of the opening of the resin mask is in the range of 25 ° to 65 °. Particularly within this range, an angle smaller than the vapor deposition angle of the vapor deposition machine to be used is preferable. Further, in FIG. 4B, the end face forming the opening 50 has a linear shape, but is not limited to this, and has an outwardly convex curved shape, that is, an opening. The entire shape of the part 50 may be a bowl shape. Therefore, when the opening is formed by laser irradiation in FIG. 1B, the cross-sectional shape of the opening is preferably formed as described above. The opening 50 having such a cross-sectional shape performs multi-stage laser irradiation that appropriately adjusts the laser irradiation position and laser irradiation energy when the opening 50 is formed, or changes the irradiation position in stages. Can be formed.

  In the present invention, since the resin mask 25 is used as the configuration of the vapor deposition mask 100, when the vapor deposition is performed using the vapor deposition mask 100, very high heat is applied to the opening 50 of the resin mask 25. There is a possibility that gas is generated from the end face of the resin mask 25 where the opening 50 is formed, and the degree of vacuum in the vapor deposition apparatus is lowered. Therefore, considering this point, it is preferable that a barrier layer 26 is provided on the end surface of the resin mask 25 where the opening 50 is formed, as shown in FIG. By forming the barrier layer 26, it is possible to prevent gas from being generated from the end face where the opening 50 of the resin mask 25 is formed.

  As the barrier layer 26, an inorganic oxide, an inorganic nitride, a metal thin film layer, or a vapor deposition layer can be used. As the inorganic oxide, an oxide of aluminum, silicon, indium, tin, or magnesium can be used, and as the metal, aluminum or the like can be used. The thickness of the barrier layer 26 is preferably about 0.05 μm to 1 μm. Therefore, in the manufacturing method of the present invention described with reference to FIG. 1, the step of forming the barrier layer 26 as described above may be performed after obtaining the vapor deposition mask 100.

  Furthermore, the barrier layer preferably covers the deposition source side surface of the resin mask 25. The barrier property is further improved by covering the surface of the resin mask 25 on the vapor deposition source side with the barrier layer 26. In the case of inorganic oxides and inorganic nitrides, the barrier layer is preferably formed by various PVD methods and CVD methods. In the case of a metal, it is preferably formed by a vacuum deposition method. The surface on the vapor deposition source side of the resin mask 25 referred to here may be the entire surface on the vapor deposition source side of the resin mask 25, and only the portion exposed from the metal mask on the surface of the vapor deposition source. There may be.

(Metal mask)
The metal mask 15 is made of metal, and when viewed from the front of the metal mask 15, the metal mask 15 overlaps with the opening 50, in other words, at a position where all the openings 50 provided in the resin mask 25 can be seen. A slit 16 extending in the vertical direction or the horizontal direction is arranged. In FIG. 4A, the slits 16 extending in the vertical direction of the metal mask 15 are continuously arranged in the horizontal direction. The slits 16 may be arranged in a plurality of rows as shown in FIG. 4 or may be only one row.

  The width W of the slit 16 is not particularly limited, but it is preferably designed so as to be at least shorter than the pitch between the adjacent openings 50. Specifically, as shown in FIG. 4A, when the slit 16 extends in the vertical direction, the horizontal width W of the slit 16 is shorter than the pitch P1 of the openings 50 adjacent in the horizontal direction. It is preferable to do. Similarly, although not shown, when the slit 16 extends in the horizontal direction, the vertical width of the slit 16 is preferably shorter than the pitch P2 of the openings 50 adjacent in the vertical direction. On the other hand, the length L in the vertical direction when the slit 16 extends in the vertical direction is not particularly limited, and the vertical length of the metal mask 15 and the opening 50 provided in the resin mask 25 are not limited. What is necessary is just to design suitably according to a position. Therefore, in the manufacturing method of the present invention described with reference to FIG. 1, it is preferable to design as described above when the metal plate is etched.

  The cross-sectional shape of the slit 16 formed in the metal mask 15 is not particularly limited, but as with the opening 50 in the resin mask 25, as shown in FIGS. It is preferable that the shape has a broadening direction. Therefore, in the manufacturing method of the present invention described with reference to FIG. 1, it is preferable that the metal plate 10 is etched so as to have the cross-sectional shape as described above.

  There is no particular limitation on the material of the metal mask 15, and conventionally known materials can be appropriately selected and used in the field of the evaporation mask, and examples thereof include metal materials such as stainless steel, iron-nickel alloy, and aluminum alloy. . Among them, an invar material that is an iron-nickel alloy can be suitably used because it is less deformed by heat.

  Further, when vapor deposition is performed on the substrate using the vapor deposition mask 100 of the present invention, a metal mask 15 may be used when a magnet or the like is disposed behind the substrate and the vapor deposition mask 100 in front of the substrate needs to be attracted by a magnetic force. Is preferably made of a magnetic material. Examples of the magnetic metal mask 15 include pure iron, carbon steel, W steel, Cr steel, Co steel, KS steel, MK steel, NKS steel, Cunico steel, and an Al—Fe alloy. When the material for forming the metal mask 15 is not a magnetic material, the metal mask 15 may be magnetized by dispersing the magnetic powder in the material.

  The thickness of the metal mask 15 is not particularly limited, but is preferably about 5 μm to 100 μm. Considering prevention of shadow during vapor deposition, the thickness of the metal mask 15 is preferably thin. However, when the thickness is smaller than 5 μm, the risk of breakage and deformation increases and handling may be difficult. However, in the present invention, since the metal mask 15 is integrated with the resin mask 25, the risk of breakage and deformation can be reduced even when the thickness of the metal mask 15 is as thin as 5 μm. It can be used if it is 5 μm or more. When the thickness is greater than 100 μm, shadows may be generated, which is not preferable. Therefore, in the manufacturing method of the present invention described with reference to FIG. 1, it is preferable to prepare in consideration of these points when preparing the metal plate 30 with a resin layer. Moreover, the thickness of the metal mask 15 and the resin mask 25 can also be optimized by performing the slimming process which is an arbitrary process described above.

  Hereinafter, the relationship between the generation of shadows and the thickness of the metal mask 15 will be described in detail with reference to FIGS. As shown in FIG. 5A, when the thickness of the metal mask 15 is thin, the vapor deposition material released from the vapor deposition source toward the vapor deposition target is the inner wall surface of the slit 16 of the metal mask 15 or the metal mask. It passes through the slit 16 of the metal mask 15 and the opening 50 of the resin mask 25 without colliding with the surface on the side where the resin mask 25 is not provided. Thereby, it becomes possible to form a vapor deposition pattern with a uniform film thickness on the vapor deposition object. That is, the occurrence of shadows can be prevented. On the other hand, as shown in FIG. 5B, when the thickness of the metal mask 15 is thick, for example, when the thickness of the metal mask 15 exceeds 100 μm, a part of the vapor deposition material released from the vapor deposition source. Cannot collide with the inner wall surface of the slit 16 of the metal mask 15 or the surface of the metal mask 15 where the resin mask 25 is not formed, and cannot reach the deposition target. As the amount of the vapor deposition material that cannot reach the vapor deposition target increases, an undeposited portion having a thickness smaller than the target vapor deposition thickness is generated on the vapor deposition target.

  In order to sufficiently prevent the generation of shadows, it is preferable that the cross-sectional shape of the slit 16 is formed so as to expand toward the vapor deposition source, as shown in FIG. With such a cross-sectional shape, even if the thickness of the entire deposition mask is increased for the purpose of preventing distortion that may occur in the deposition mask 100 or improving durability, it is emitted from the deposition source. The deposited material can reach the deposition target without colliding with the surface of the slit 16 or the inner wall surface of the slit 16. More specifically, the angle formed between the bottom end of the bottom 16 of the slit 16 of the metal mask 15 and the bottom surface of the metal mask 15 and the straight line connecting the top of the top of the slit 16 of the metal mask 15 is 25 ° to 65 °. It is preferable to be within the range. In particular, within this range, an angle smaller than the vapor deposition angle of the vapor deposition machine to be used is preferable. With such a cross-sectional shape, even if the thickness of the metal mask 15 is made relatively thick for the purpose of preventing distortion that may occur in the vapor deposition mask 100 or improving durability, the metal mask 15 was released from the vapor deposition source. The vapor deposition material can reach the vapor deposition target without colliding with the inner wall surface of the slit 16. As a result, the occurrence of shadows can be more effectively prevented. FIG. 5 is a partial schematic cross-sectional view for explaining the relationship between the generation of shadows and the slits 16 of the metal mask 15.

  In the present invention, since the etching process is performed from the side of the metal plate 10 where the resin mask 25 is not formed, depending on the nature of the etching solution erosion, specifically, in the direction in which the etching material advances. The cross-sectional shape of the slit 16 is shown in FIGS. 4 and 5 (c) by utilizing the property of the etching process in which the opening of the slit 16 gradually narrows as the etching amount decreases. The cross-sectional shape can be widened toward the deposition source side.

  Although there is no limitation on the use of the vapor deposition mask produced by the vapor deposition mask production method of the present invention described above, for example, the field where formation of a high-definition vapor deposition film is required, such as the organic layer of an organic EL element, It is suitable as a vapor deposition mask used for applications such as cathode electrode formation and organic semiconductor formation.

DESCRIPTION OF SYMBOLS 100 ... Deposition mask 10 ... Metal plate 15 ... Metal mask 16 ... Slit 20 ... Resin layer 25 ... Resin mask 26 ... Barrier layer 30 ... Metal plate with a resin layer 50 ... Opening 62 ... Resist material 63 ... Mask 64 ... Resist pattern

Claims (1)

A method for producing a vapor deposition mask in which a metal mask provided with a slit and a resin mask provided with an opening corresponding to a pattern to be produced by vapor deposition are laminated,
Preparing a metal plate with a resin layer provided with a resin layer on one surface of the metal plate;
Forming a resin mask by forming an opening corresponding to a pattern to be deposited on the resin layer; and
Etching from the side of the metal plate not in contact with the resin mask, forming a metal mask by forming a slit that penetrates the metal plate and overlaps the opening of the resin mask;
A method for producing a vapor deposition mask, comprising:

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