JP2014056863A - Semiconductor device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a thinned semiconductor substrate.SOLUTION: A semiconductor device manufacturing method comprises: a process of attaching a support substrate 2 to one principal surface of a processed substrate 1 via an adhesion layer 3; and a process of irradiating the adhesion layer 3, sandwiched by the support substrate 2 and the processed substrate 1, with laser beams to detach the support substrate 2. The semiconductor device manufacturing method further comprises: a process of removing the adhesion layer 3 at least on an edge of the support substrate 2, which protrudes from between the attached support substrate 2 and the processed substrate 1 either before or after the process of detaching the support substrate 2. By doing this, the support substrate 2 can be easily detached from the processed substrate 1 which has been polished, thereby, the processed substrate 1 with an intended thickness can be surely obtained.

Description

  The present invention relates to a method for manufacturing a semiconductor device.

  Manufacturing of a semiconductor device using a large-diameter semiconductor substrate in order to increase the number of semiconductor chips manufactured from one semiconductor substrate (semiconductor wafer) as one means for reducing the cost of the semiconductor device A method is being considered.

  On the other hand, in a semiconductor element such as an IGBT (Insulated Gate Bipolar Transistor) in which a current flows in a vertical (thickness) direction with respect to the semiconductor substrate, the thickness of the semiconductor substrate greatly affects the performance of the semiconductor element. For this reason, in order to maintain or improve the performance of the semiconductor device, it is necessary to thin the semiconductor substrate.

  However, a thinned semiconductor substrate is easily broken and difficult to handle. Further, the mechanical strength of the semiconductor substrate itself is small, and warping and distortion are likely to occur. Such warpage and distortion are further increased by the stress of the film laminated on the semiconductor substrate, and thus the semiconductor substrate may be broken during the manufacturing process. Finally, when dicing the thinned semiconductor substrate into individual semiconductor chips, mechanical stress is applied to the semiconductor substrate, and the semiconductor substrate is cracked.

  Various techniques have been proposed for reducing the mechanical strength of the semiconductor substrate. For example, the mechanical strength of the semiconductor substrate can be increased by performing processing for forming a recess over a wide range, leaving the peripheral portion only on the back side of the semiconductor substrate (see, for example, Patent Document 1). Further, glass is used for the support substrate, and the entire back surface is polished to a desired thickness by attaching to the semiconductor substrate via an adhesive layer, and the support substrate is peeled off to obtain a semiconductor substrate having a desired thickness. (For example, see Patent Documents 2 and 3). In addition, various techniques such as Patent Documents 4 to 6 have been proposed.

JP 2003-332271 A JP 2004-64040 A International Publication No. 2009/142078 JP2011-258841A JP 2005-129652 A JP-A-11-112466

  In Patent Document 3 and the like, in order to peel a support substrate attached to a semiconductor substrate via an adhesive from the semiconductor substrate, the adhesive is irradiated with a laser beam to bond the adhesive interface between the adhesive and the support substrate. A method of sublimating the agent to reduce the adhesive strength of the adhesive has been performed. In order to eliminate the adhesive property of the adhesive to the support substrate by laser irradiation, the adhesive of the support substrate needs to be irradiated with laser light vertically. For this reason, the adhesive that protrudes from between the semiconductor substrate and the support substrate and wraps around the support substrate at an angle different from the bonding interface, even if laser irradiation is performed perpendicularly to the support substrate, It is not possible to give sufficient irradiation energy for sublimation of the adhesive. For this reason, in order to peel off the support substrate from the semiconductor substrate, there is a problem that even if laser irradiation is performed, the adhesive cannot be partially peeled off.

  Therefore, even if the adhesive that protrudes from the end of the support substrate is physically removed, in the subsequent polishing process for thinning the semiconductor substrate, the pressure applied to the end without the adhesive and the other parts Unlike the pressure, as a result, the thickness of the semiconductor substrate is different. In addition, it is difficult to optimize conditions such as an adhesive that prevents the adhesive from protruding, and depending on the conditions, the support substrate may not be peeled off. Therefore, even if the support substrate is attached to the semiconductor substrate via an adhesive and the semiconductor substrate is thinned, the support substrate cannot be properly removed, and it is difficult to obtain only the thinned semiconductor substrate. there were.

  The present invention has been made in view of such a point, and an object of the present invention is to provide a method of manufacturing a semiconductor device capable of obtaining a thinned semiconductor substrate.

  In order to solve the above problems, a step of attaching a support substrate to one main surface of a substrate to be processed via an adhesive layer, and irradiating the adhesive layer sandwiched between the support substrate and the substrate to be processed with laser light Separating the support substrate, and before or after the step of peeling the support substrate, and protruded from between the attached support substrate and the substrate to be processed. A method for manufacturing a semiconductor device is provided, which includes a step of removing the adhesive layer at the edge of a support substrate.

  According to such a method for manufacturing a semiconductor device, a thinned semiconductor substrate can be obtained.

It is a figure which shows peeling of a support substrate from the to-be-processed substrate of the manufacturing method of the semiconductor device which concerns on 1st Embodiment. It is a figure which shows the detail of the removal of the part which protruded from between the to-be-processed substrate and support substrate of the contact bonding layer which concerns on 1st Embodiment. 6 is a flowchart illustrating an example of a manufacturing process of a semiconductor device according to a second embodiment. It is a figure which shows the attachment process of the support substrate which concerns on 2nd Embodiment, and the thinning process of a semiconductor substrate. It is a figure which shows the removal process of the contact bonding layer which concerns on 2nd Embodiment. It is a figure which shows the peeling process of the support substrate which concerns on 2nd Embodiment. 12 is a flowchart illustrating an example of a manufacturing process of a semiconductor device according to a third embodiment. It is a figure which shows the one part peeling process of the support substrate which concerns on 3rd Embodiment. It is a figure which shows the removal process of the contact bonding layer which concerns on 3rd Embodiment, and the complete peeling process of a support substrate.

Embodiments will be described with reference to the drawings.
[First Embodiment]
In the semiconductor device manufacturing method shown below, a support substrate is attached to a substrate to be processed through an adhesive layer, the substrate to be processed is thinned to a desired thickness, and the support substrate is peeled from the thinned substrate to be processed. It can be made to.

A method for manufacturing such a semiconductor device will be described with reference to FIG.
FIG. 1 is a diagram illustrating peeling of a support substrate from a substrate to be processed in the method for manufacturing a semiconductor device according to the first embodiment.

  FIG. 1 shows two types of peeling steps of the support substrate with respect to the substrate to be processed. One peeling process is the order of FIGS. 1 (A), (B), (C), (D), and the other peeling process is that of FIGS. 1 (A), (E), (F), (D). Each is executed in order.

First, the peeling process performed in order of FIG. 1 (A), (B), (C), (D) is demonstrated.
On the substrate 1 to be processed, predetermined elements such as etching, patterning, and ion implantation are performed to form semiconductor elements (not shown).

  In order to thin the target substrate 1 on which the semiconductor element is formed in this way, a support substrate 2 larger than the diameter of the target substrate 1 is provided on one main surface on which the semiconductor element is formed via the adhesive layer 3. Install. The support substrate 2 is a material having a property of transmitting light, and is made of, for example, glass or plastic. Furthermore, in order to make the thickness between the substrate 1 to be processed and the support substrate 2 uniform, the substrate 1 to be processed and the support substrate 2 are pressed against each other with a predetermined pressure to be brought into close contact with each other.

  At this time, the adhesive layer 3 protrudes from between the support substrate 2 and the substrate 1 to be processed as described above, and as shown in FIG. 1A, the protruding portion 3a of the adhesive layer 3 is the support substrate. Wrap around the edge of 2.

Although not shown, the main surface (upper surface in the drawing) of the substrate 1 to which the support substrate 2 is adhered in this way is polished to make the substrate 1 to have a desired thickness.
After polishing in this way, a process necessary for forming a semiconductor element such as ion implantation is performed on the back surface (surface on which the semiconductor element is not formed) of the substrate 1 to be processed, if necessary. It doesn't matter if you do.

Here, the removal process of the part 3a which protruded between the to-be-processed substrate 1 and the support substrate 2 of the contact bonding layer 3 in this way is demonstrated using FIG.
FIG. 2 is a diagram showing details of removal of a portion of the adhesive layer that protrudes from between the substrate to be processed and the support substrate according to the first embodiment.

  2A schematically illustrates peeling of the conventional support substrate 2, and FIGS. 2B and 2C schematically illustrate removal of the protruding portion 3a of the adhesive layer 3 at the edge of the support substrate 2, respectively. The main part is shown enlarged.

  In the state shown in FIG. 1 (A), conventionally, as shown in FIG. 2 (A), a laser irradiation process for irradiating laser light from the support substrate 2 side (lower side in the figure) is performed. An attempt was made to peel the support substrate 2 from the treatment substrate 1. In this case, the region 3b of the adhesive layer 3 where the laser light is vertically incident is supplied with sufficient irradiation energy, the adhesive at the adhesive interface is sublimated, and the region 3b is separated from the support substrate 2. On the other hand, in the region 3 c parallel to the incident direction of the laser beam of the adhesive layer 3, the adhesive is not sublimated because sufficient irradiation energy is not supplied, and the region 3 b does not peel from the support substrate 2. For this reason, the area | region 3c which contact | connects the side surface of the support substrate 2 of the part 3a which protruded between the to-be-processed substrate 1 and the support substrate 2 of the contact bonding layer 3 was not able to be peeled. Further, when the substrate 1 to be processed is sufficiently thinned, stress is applied to the substrate 1 to be processed at the boundary between the peeled area and the non-peeled area in the adhesive layer 3 as described above. There is also a possibility that the substrate 1 to be processed is broken.

  Therefore, after the protruding portion 3a of the adhesive layer 3 is removed, a laser irradiation process is performed. As a method for removing the protruding portion 3a of the adhesive layer 3, for example, as shown in FIG. 2B (and FIG. 1B), plasma is applied from the substrate 1 side to the substrate 1 side. Process. By such plasma treatment, as shown in FIG. 2C, the protruding portion 3a of the adhesive layer 3 exposed from the substrate 1 to be processed of the adhesive layer 3 can be removed.

Next, the process of peeling the support substrate 2 from the to-be-processed substrate 1 is demonstrated.
As shown in FIG. 1 (C), the laser beam from the support substrate 2 side is removed from the support substrate 2 from which the protruding portion 3a of the adhesive layer 3 that has gone around the edge of the support substrate 2 has been removed. A laser irradiation process for irradiating is performed. Since the portion 3 a of the adhesive layer 3 protruding from between the substrate 1 to be processed and the support substrate 2 was removed by the plasma treatment, most of the remaining adhesive layer 3 was between the substrate 1 to be processed and the support substrate 2. Will exist. In the adhesive layer 3 in such a state, since the laser light irradiated from the support substrate 2 side is vertically incident, the support substrate 2 is easily peeled from the adhesive layer 3. As a result, as shown in FIG. 1D, a substrate 1 to be processed that has been processed to a desired thickness can be obtained.

  By removing the protruding portion 3a of the adhesive layer 3 in this manner, the laser beam can be vertically incident on the entire surface of the adhesive layer 3, and the support substrate 2 can be peeled off. Accordingly, it is only necessary that the protruding portion 3a of the adhesive layer 3 in the plasma processing can be removed at least from the outside (the left side in the case of FIG. 2B) from the region 3c (FIG. 2B) in contact with the support substrate 2. When the outer side of the protruding portion 3a of the adhesive layer 3 is removed from the region 3c in contact with the support substrate 2 in this way, the region 3b remains in the adhesive layer 3, and laser light is vertically incident on the entire surface of the region 3b. Therefore, the support substrate 2 can be peeled off.

In the subsequent process, the substrate 1 to be processed is washed to remove the adhesive layer 3, and the substrate 1 to be processed is diced to form a semiconductor element.
Next, the peeling process performed in order of FIG. 1 (A), (E), (F), (D) is demonstrated.

  In the state shown in FIG. 1A, as shown in FIG. 1E, a laser irradiation process of irradiating a laser beam from the support substrate 2 side is performed. In this case, as described with reference to FIG. 2A, the adhesive layer 3 has a region where the laser beam is vertically incident, although the support substrate 2 is peeled off due to the sublimation of the adhesive at the adhesive interface. The support substrate 2 is not peeled off in areas that are not perpendicularly incident. Therefore, only the side surface of the edge portion of the support substrate 2 is in a state of being bonded to the protruding portion 3 a of the adhesive layer 3. In addition, in FIG. 1F described later, a chain line between the support substrate 2 and the adhesive layer 3 represents peeling.

In the state where only the side surface of the support substrate 2 is bonded to the protruding portion 3a of the adhesive layer 3, plasma processing is performed from the substrate 1 to be processed as shown in FIG.
By such plasma treatment, the protruding portion 3a of the adhesive layer 3 is removed, and the support substrate 2 is completely peeled from the substrate 1 to be treated as shown in FIG.

Thereafter, a semiconductor element is formed in the same manner as in the peeling step performed in the order of FIGS. 1A, 1B, 1C, and 1D.
In the plasma processing in the above two types of peeling processes, since the support substrate 2 is attached to the surface of the substrate 1 to be processed, on which the semiconductor element is formed, via the adhesive layer 3, the substrate to be processed Damage to the surface on which the semiconductor element 1 is formed is prevented.

  As described above, in the method of manufacturing a semiconductor device, the support substrate 2 is attached to one main surface of the substrate 1 to be processed via the adhesive layer 3, and the support substrate 2 and the substrate 1 to be processed are sandwiched. Irradiating the adhesive layer 3 with laser light to peel off the support substrate 2. Furthermore, the process of removing at least the adhesive layer 3 at the edge of the support substrate 2 protruding from between the attached support substrate 2 and the substrate 1 to be processed either before or after the process of peeling the support substrate 2 is performed. To have. Thereby, the support substrate 2 can be easily peeled from the substrate 1 to be polished, and the substrate 1 having a desired thickness can be reliably obtained.

  If the step of removing the protruding portion 3a of the adhesive layer 3 is performed before the support substrate 2 is peeled off by irradiating the laser beam, the adhesive layer 3 other than the protruding portion 3a of the adhesive layer 3 may be removed. There is. For this reason, it is preferable to perform the process of removing the part 3a which protruded the contact bonding layer 3 after irradiating a laser beam and peeling a part of support substrate 2. FIG.

[Second Embodiment]
In the second embodiment, a method for manufacturing a semiconductor device including the peeling process of FIGS. 1A, 1B, 1C, and 1D in the first embodiment will be described in detail.

First, an example of a method for manufacturing a semiconductor device will be described with reference to FIG.
FIG. 3 is a flowchart showing an example of the manufacturing process of the semiconductor device according to the second embodiment.

  [Step S11] A desired semiconductor element is formed on the semiconductor substrate. A semiconductor element is formed on a semiconductor substrate through general processes such as mask formation, photolithography, etching, and cleaning.

  [Step S12] A support substrate is attached to the side of the semiconductor substrate on which the semiconductor element is formed via an adhesive layer, and a predetermined pressure is applied to make the thickness between the semiconductor substrate and the support substrate uniform. The semiconductor substrate and the support substrate are pressed against each other to be brought into close contact with each other.

At this time, the adhesive layer protrudes from between the semiconductor substrate and the supporting substrate, and the protruding adhesive layer goes around the edge of the supporting substrate.
[Step S13] The side of the semiconductor substrate to which the support substrate is attached is polished to thin the semiconductor substrate to a desired thickness.

  In addition, after thinning the semiconductor substrate in this manner, ion implantation or the like necessary for forming the semiconductor element is performed on the back surface of the semiconductor substrate (the side where the semiconductor element is not formed) as necessary. It is also possible to carry out the process.

  [Step S14] A thinned semiconductor substrate having a support substrate attached in a predetermined reaction chamber is carried in, and the etching gas supplied into the reaction chamber is turned into plasma. The ion species, radical species, etc. in the plasma are adsorbed from the semiconductor substrate side to the adhesive layer protruding between the semiconductor substrate and the support substrate, and the portion of the adhesive layer where the ion species, radical species, etc. are adsorbed is removed. .

[Step S15] Laser light is irradiated from the support substrate side to the semiconductor substrate and the support substrate from which the protruding adhesive layer has been removed, and the support substrate is peeled off from the semiconductor substrate.
[Step S16] The semiconductor substrate from which the support substrate has been peeled is washed to remove the adhesive layer from the semiconductor substrate.

[Step S17] Such a semiconductor substrate is diced into individual pieces to form a semiconductor element.
A semiconductor device is manufactured by mounting the semiconductor element thus formed on a predetermined circuit board or the like.

Next, details of the steps of the method for manufacturing such a semiconductor device will be described.
The support substrate attaching step (step S12: FIG. 3) and the semiconductor substrate thinning step (step S13: FIG. 3) will be described with reference to FIG.

FIG. 4 is a diagram illustrating a support substrate attaching step and a semiconductor substrate thinning step according to the second embodiment.
4A and 4B show a process of attaching the support substrate 20 to the semiconductor substrate 10, and FIG. 4C shows a process of thinning the semiconductor substrate 10, respectively.

After forming a semiconductor element (not shown) on one main surface 10a of the semiconductor substrate 10 (step S11: FIG. 3), an adhesive layer 30 is formed on one main surface 10a of the semiconductor substrate 10.
As the semiconductor substrate 10, for example, silicon, gallium arsenide, or the like can be used. The shape, size, and the like of the semiconductor substrate 10 depend on the intended use of the substrate to be obtained, but those such as a circle, an ellipse, a square, a rectangle, and a regular polygon are preferable. Moreover, the thickness of the semiconductor substrate 10 is preferably 500 μm or more regardless of the shape. If the thickness is 500 μm or less, the strength of the semiconductor substrate 10 alone is low, and there is a risk of cracks and the like.

The adhesive layer 30 has a thickness of several μm to several tens of μm and is made of an organic material such as polyimide.
Next, the support substrate 20 is aligned with the adhesive layer 30 formed on the semiconductor substrate 10 as described above, and the ambient temperature is in a vacuum of about 300 to 350 degrees (about 1.0 × 10 ⁵ Pa). Then, the support substrate 20 is brought into contact with the semiconductor substrate 10 (FIG. 4A).

  Such a support substrate 20 is a material that transmits light, and is made of, for example, glass or acrylic resin. Further, the support substrate 20 has a surface whose outer shape is larger than the surface of the semiconductor substrate 10. As such a support substrate 20, a substrate having a shape such as a circle, an ellipse, a square, a rectangle, or a regular polygon can be applied.

After the support substrate 20 is brought into contact with the semiconductor substrate 10 via the adhesive layer 30 in this manner, the semiconductor substrate 10 and the support substrate 20 are continuously attached to the semiconductor substrate 10 so that the thicknesses thereof are uniform. supporting substrate 20 (or, a semiconductor substrate 10 to the support substrate 20), for example, attached by pressing at a pressure of ^{14N / cm 2 ~22N / cm 2} .

  At this time, the adhesive layer 30 pressed from the semiconductor substrate 10 and the support substrate 20 protrudes from between the semiconductor substrate 10 and the support substrate 20. The protruding portion 30a of the adhesive layer 30 goes around the edge of the support substrate 20 (FIG. 4B).

  Thus, the other main surface 10b of the semiconductor substrate 10 to which the support substrate 20 is attached is polished or etched to thin the semiconductor substrate 10 to a desired thickness (for example, 30 μm to 85 μm) (FIG. 4 ( C)).

Next, a removal process for removing the protruding portion 30a of the adhesive layer 30 from the semiconductor substrate 10 and the support substrate 20 will be described with reference to FIG.
FIG. 5 is a diagram showing an adhesive layer removing step (step S14: FIG. 3) according to the second embodiment.

5A shows the plasma treatment for the adhesive layer 30, and FIG. 5B shows the adhesive layer 30 after the plasma treatment.
The thinned semiconductor substrate 10 with the support substrate 20 attached is transferred into an etching chamber of a plasma processing apparatus (not shown) and set at a predetermined position.

  In the etching chamber, a coil is wound around an outer peripheral portion, and a cathode electrode is disposed inside. The thinned semiconductor substrate 10 is set on the cathode electrode of the etching chamber with the support substrate 20 facing the electrode. Further, the etching gas is supplied from the gas inlet, and the used etching gas in the etching chamber is discharged from a predetermined exhaust port. Note that any etching gas may be used as long as it removes the adhesive layer 30 made of an organic material, and oxygen, methane tetrafluoride, or the like can be used. Note that when oxygen is used as an etching gas, the support substrate 20 can be used repeatedly because damage to the support substrate 20 is small, and an increase in cost can be suppressed. Moreover, the flow rate of the gas when supplying such an etching gas is, for example, 100 sccm to 200 sccm, and is supplied for about 7 minutes into the etching chamber.

  In the etching chamber in which the semiconductor substrate 10 is set in this way, the temperature of the semiconductor substrate 10 is heated to 100 to 200 degrees and the pressure is adjusted to be 10 to 100 Pa. Further, predetermined high frequency power is supplied to the coil and the cathode electrode, respectively, and plasma is generated in the etching chamber. In such a state, a high frequency power source is supplied to the cathode electrode, and a bias power is applied to the etching chamber. As a result, the ions present in the plasma acquire directionality, and the protruding portion 30a of the adhesive layer 30 is etched as shown in FIG.

  At this time, the semiconductor substrate 10 serves as a mask with respect to the adhesive layer 30, and only the portion 30a protruding from the semiconductor substrate 10 and the support substrate 20 of the adhesive layer 30 is removed as shown in FIG.

Next, the peeling process (step S15: FIG. 3) which peels the support substrate 20 from the semiconductor substrate 10 is demonstrated using FIG.
FIG. 6 is a diagram showing a support substrate peeling step according to the second embodiment.

6A shows a laser irradiation process for the adhesive layer 30, and FIG. 6B shows the semiconductor substrate 10 after the laser irradiation process.
After removing the protruding portion 30a of the adhesive layer 30, as shown in FIG. 6A, the entire area of the support substrate 20 is irradiated with laser light while being scanned vertically from the support substrate 20 side. At this time, since the protruding portion 30a of the adhesive layer 30 is removed, the laser beam is incident on the entire adhesive surface with the support substrate 20 perpendicularly. And sufficient irradiation energy is supplied to the adhesive surface with the support substrate 20 of the contact bonding layer 30, and the contact bonding layer 30 sublimes. Thereby, the support substrate 20 peels from the semiconductor substrate 10 without damaging the semiconductor substrate 10, and the semiconductor substrate 10 shown by FIG. 6 (B) is obtained.

  The laser light is not particularly limited as long as it can be absorbed by the adhesive layer 30 and converted into heat to sublimate the adhesive layer 30. Such laser light is, for example, laser light having a wavelength of 300 nm to 400 nm that is absorbed by polyimide when the adhesive layer 30 is polyimide.

Here, the surface opposite to the surface bonded to the adhesive layer 30 of the semiconductor substrate 10 may be supported by a stage (not shown).
After this, the processing after step S16 in FIG. 3 is performed, semiconductor elements are formed, and the semiconductor device is manufactured.

  As described above, in the manufacturing method of the semiconductor device described above, the support substrate 20 is attached to the one main surface 10a of the semiconductor substrate 10 via the adhesive layer 30, and from between the attached support substrate 20 and the semiconductor substrate 10. The adhesive layer 30 protruding at least at the edge of the support substrate 20 is removed, and the support substrate 20 is peeled off by irradiating the adhesive layer 30 sandwiched between the support substrate 20 and the semiconductor substrate 10 with laser light. did.

  As a result, the protruding portion 30a of the adhesive layer 30 is removed, so that the laser light is perpendicularly incident on the entire adhesive surface of the adhesive layer 30 with the support substrate 20. Therefore, the support substrate 20 can be easily peeled off from the semiconductor substrate 10 without damaging the uniformly thinned semiconductor substrate 10 by the polishing process, and the semiconductor substrate 10 having a desired thickness can be reliably obtained. It becomes like this.

[Third Embodiment]
In the third embodiment, a method for manufacturing a semiconductor device including the peeling step of FIGS. 1A, 1E, 1F, and 1D in the first embodiment will be described in detail.

First, an example of a method for manufacturing a semiconductor device will be described with reference to FIGS.
FIG. 7 is a flowchart showing an example of the manufacturing process of the semiconductor device according to the third embodiment.

  In the flowchart shown in FIG. 7, the same steps as those in the flowchart shown in FIG. 3 represent the same steps. Here, description of those steps is omitted, and only steps S24 and S25 are described.

When the steps S11 to S13 are completed, the following steps S24 and S25 are performed.
[Step S24] The support substrate attached to the thinned semiconductor substrate via the adhesive layer is irradiated with laser light from the support substrate side, and corresponds to the region of the adhesive layer where the laser light is vertically incident. Peel off the supporting substrate.

  [Step S25] The semiconductor substrate from which the support substrate has been peeled off from a part of the adhesive layer in Step S24 is carried into a predetermined reaction chamber, and the etching gas supplied into the reaction chamber is turned into plasma. Ion species, radical species, etc. in the plasma are adsorbed from the semiconductor substrate side to the adhesive layer protruding between the semiconductor substrate and the support substrate, and the portion of the adhesive layer where the ion species, radical species, etc. are adsorbed is removed. Thus, the support substrate is completely peeled from the semiconductor substrate.

Thereafter, similarly to the second embodiment, steps S16 and S17 are performed to manufacture the semiconductor device.
Next, details of the steps of the method for manufacturing such a semiconductor device will be described.

The partial peeling process (step S24) of the support substrate will be described with reference to FIG.
FIG. 8 is a diagram showing a part of the peeling process of the support substrate according to the third embodiment.
8A shows a laser irradiation process for the adhesive layer 30, and FIG. 8B shows the semiconductor substrate 10 after the laser irradiation process.

  As shown in FIG. 8A, the support substrate 20 is attached to the thinned semiconductor substrate 10 by attaching the support substrate 20 through the adhesive layer 30 in steps S11 to S13, from the support substrate 20 side. Irradiate the entire region with laser light while scanning vertically.

  At this time, since the region 30d of the adhesive layer 30 corresponding to the main surface of the support substrate 20 facing the semiconductor substrate 10 is perpendicular to the incident laser light, the region 30d is sufficiently supplied with irradiation energy, The adhesive at the adhesive interface sublimes.

  On the other hand, since the protruding portion 30a of the adhesive layer 30 wraps around the edge of the support substrate 20, the vicinity of the region of the side surface of the supporting substrate 20 of the protruding portion 30a is parallel to the incident laser beam. For this reason, sufficient irradiation energy is not supplied and the adhesive at the bonding interface does not sublime.

  Therefore, by irradiating the adhesive layer 30 with the laser light in this way, only the region of the support substrate 20 corresponding to the region 30d of the adhesive layer 30 is peeled off as shown in FIG. The side surface of the support substrate 20 remains adhered to the adhesive layer 30.

Here, the surface opposite to the surface bonded to the adhesive layer 30 of the semiconductor substrate 10 may be supported by a stage (not shown).
Next, the removal process of the adhesive layer and the complete peeling process of the support substrate will be described with reference to FIG.

FIG. 9 is a diagram showing an adhesive layer removing step and a supporting substrate complete peeling step according to the third embodiment.
9A shows the plasma treatment for the adhesive layer 30, and FIG. 9B shows the adhesive layer 30 after the plasma treatment.

  In the etching chamber described in the second embodiment, the semiconductor substrate 10 from which only the region of the support substrate 20 corresponding to the region 30d of the adhesive layer 30 is peeled is placed on the cathode electrode, and the support substrate 20 is on the electrode side. set. Similar to the second embodiment, when plasma treatment is performed, ions existing in the plasma acquire directionality, and the protruding portion 30a of the adhesive layer 30 is etched. As a result, the protruding portion 30a of the adhesive layer 30 is removed, so that the side surface of the support substrate 20 that is bonded to the protruding portion 30a of the adhesive layer 30 is released and peeled from the semiconductor substrate 10, A semiconductor substrate 10 shown in FIG. 9B is obtained.

Thereafter, the same processing as that in step S16 and subsequent steps in FIG.
As described above, in the method for manufacturing a semiconductor device, the support substrate 20 is attached to one main surface 10a of the semiconductor substrate 10 via the adhesive layer 30, and the adhesive layer sandwiched between the support substrate 20 and the semiconductor substrate 10 is used. 30 is irradiated with laser light to remove at least the adhesive layer 30 at the edge of the support substrate 20 protruding from between the attached support substrate 20 and the semiconductor substrate 10, so that the support substrate 20 is peeled off. did.

  As a result, the support substrate 20 is peeled except for the edge portion where the protruding portion 30a of the adhesive layer 30 into which the laser beam is vertically incident is wrapped, and the protruding portion 30a of the adhesive layer 30 is removed. The side surface of the support substrate 20 is released. Therefore, the support substrate 20 can be easily peeled off from the semiconductor substrate 10 without damaging the uniformly thinned semiconductor substrate 10 by the polishing process, and the semiconductor substrate 10 having a desired thickness can be reliably obtained. It becomes like this.

  Here, in each of the above-described embodiments, when the semiconductor substrate 10 is supported (or attracted and held) by a stage (not shown) at the time of laser light irradiation, the laser light irradiation is performed as shown in FIG. Thus, it may be from the upper side, or from the lower side as shown in FIG. 1 (C) or (E).

  Alternatively, in each of the above embodiments, each of the laser irradiation and plasma irradiation processes can be performed with the semiconductor substrate 10 on the lower side and the support substrate 20 on the upper side. The processing order of laser irradiation and plasma irradiation is as described in the above embodiments.

  In a state where the semiconductor substrate 10 is attracted (chucked) to a stage (not shown), the adhesive force of the adhesive layer 30 is reduced by irradiating laser light from above the support substrate, and the support substrate is picked up and removed.

  Thus, the semiconductor substrate 10 is held by suction on a stage (not shown), and the support substrate 20 is removed by irradiating the laser beam from above the support substrate 20 to reduce the adhesive force of the adhesive layer 30. It is possible to proceed to the next step while holding the substrate 10 on the stage.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Support substrate 3 Adhesive layer 3a The protruding part 3b, 3c area | region

Claims (7)

Attaching a support substrate to one main surface of the substrate to be processed via an adhesive layer;
Irradiating the adhesive layer sandwiched between the support substrate and the substrate to be processed with a laser beam and peeling the support substrate;
Have
It includes a step of removing at least the adhesive layer at the edge of the support substrate that protrudes between the attached support substrate and the substrate to be processed, either before or after the step of peeling the support substrate. A method of manufacturing a semiconductor device. Performing a plasma treatment to remove the adhesive layer protruding from between the attached support substrate and the substrate to be processed;
The method of manufacturing a semiconductor device according to claim 1. The plasma treatment is performed from the other main surface side of the substrate to be processed.
The method of manufacturing a semiconductor device according to claim 2. The support substrate is made of a material having a property of transmitting the laser light.
The method for manufacturing a semiconductor device according to claim 1, wherein: The support substrate is made of glass or acrylic resin.
The method of manufacturing a semiconductor device according to claim 4. The area of the support substrate is wider than the area of the substrate to be processed.
A method for manufacturing a semiconductor device according to claim 1, wherein: The laser light is irradiated perpendicularly to the adhesive layer from the side of the support substrate where the substrate to be processed is not attached.
The method for manufacturing a semiconductor device according to claim 1, wherein:

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