JP2014056856A - Light-emitting device and luminaire - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device and a luminaire capable of stabilizing the shape of a sealing member relatively easily.SOLUTION: According to the present embodiment, a control film 70 which is shape control means has repellency to oil or water so that it exhibits excellent wettability and a small contact angle with a sealing member 45. For this reason, the shape stability of the sealing member 45 can be easily increased. Furthermore, since the control film 70 is provided so as to be located all around a periphery 51 of the sealing member 45, the shape stability of the sealing member 45 can be effectively restrained, making a variation in the shape of a plurality of sealing members less likely to occur.

Description

  Embodiments described herein relate generally to a light-emitting device in which a light-emitting element mounted on a substrate is covered with a sealing member, and an illumination device using the light-emitting device as a light source.

  A COB (chip on board) type light emitting module is widely used as a light source of a lighting device. This type of light emitting module includes a plurality of light emitting diodes mounted on a substrate. The light emitting diodes are arranged with a space between each other and are individually sealed with a sealing member having translucency.

  The sealing member is made of a material whose main component is a resin containing phosphor particles. The sealing member is cured by being dropped onto the substrate using a dispenser, for example, and heated after the dropping. As a result, the sealing member is maintained in a dome-like shape from the substrate, and the light emitting diodes on the substrate are protected from atmospheric oxygen or moisture.

JP-A-5-299702

  However, since the conventional sealing member is not configured to have a special damming member on the outer peripheral portion of the sealing member, it is difficult to form a plurality of sealing member shapes relatively stably. It was. Moreover, in order to maintain the shape as described above, there is a point that depends on the characteristics of the resin constituting the sealing member. However, since the resin also varies, it is easy to make the shape of a plurality of sealing members without variation. It was difficult to form.

  The objective of this invention is obtaining the light-emitting device and illuminating device which can stabilize the shape of a sealing member comparatively easily.

  The light emitting device according to the embodiment of the present invention is provided by avoiding the substrate having a mounting surface, a metal layer having an element mounting portion or a conductor pattern formed on the mounting surface side of the substrate, and the element mounting portion and the conductor pattern. An insulating layer, a light-emitting element mounted on the element mounting portion, a light-transmitting sealing member that covers the metal layer and the light-emitting element, and has an outer peripheral portion provided on the insulating layer to form a shape raised from the substrate; And a shape control means provided on the insulating layer for controlling the contact angle between the insulating layer and the sealing member.

  According to the embodiment of the present invention, since the shape of the cured sealing member can be formed relatively stably by the shape control means, color variations can be easily suppressed.

The perspective view of the illuminating device which concerns on embodiment The top view of the illuminating device which concerns on embodiment Sectional drawing which follows the F3-F3 line of FIG. The top view of the light emitting module concerning an embodiment The top view of the light emitting module which expands and shows the location of F5 of FIG. Sectional drawing which follows the F6-F6 line of FIG.

  Hereinafter, embodiments will be described with reference to FIGS. 1 to 6.

  1 to 3 show a base light 1 for general illumination. The base light 1 is an example of a lighting device used indoors, for example, and is directly attached to a ceiling surface C of a building.

  The base light 1 includes an apparatus main body 2, a pair of shades 3, a light source 4, and a lighting device 5. The apparatus body 2 includes a chassis 6, a center cover 7, a first side cover 8a, and a second side cover 8b.

  The chassis 6 is formed of a sheet metal material such as a galvanized steel plate, for example, and has an elongated shape extending along the ceiling surface C. The chassis 6 includes a fixed portion 10 and a pair of light source support portions 11a and 11b.

  The fixing part 10 has a substantially flat plate shape, and is fixed to an element constituting a ceiling of a building with a plurality of screws, for example. The light source support portions 11a and 11b are arranged in parallel to each other with the fixing portion 10 interposed therebetween. Each of the light source support portions 11a and 11b has a flat support surface 12. The support surface 12 projects downward from the fixed portion 10 and extends straight in the longitudinal direction of the chassis 6.

  The center cover 7 is supported by the fixed portion 10 of the chassis 6. The center cover 7 protrudes in a V shape from between the light source support portions 11a and 11b toward the lower side of the chassis.

  The first side cover 8 a continuously covers one end along the longitudinal direction of the chassis 6 and one end along the longitudinal direction of the center cover 7. The second side cover 8 b continuously covers the other end along the longitudinal direction of the chassis 6 and the other end along the longitudinal direction of the center cover 7.

  The seed 3 is made of a resin material having translucency such as an acrylic resin or a polycarbonate resin. The shade 3 extends straight in the longitudinal direction of the chassis 6.

  As shown in FIG. 3, the shade 3 has an opening 13 that opens toward the light source support portions 11 a and 11 b of the chassis 6. The opening 13 has a slit shape extending in the longitudinal direction of the chassis 6. A pair of holding grooves 14 a and 14 b is formed at the edge of the opening 13. The holding grooves 14 a and 14 b extend over the entire length of the shade 3. The opening ends of the holding grooves 14 a and 14 b face each other with a space in the width direction of the chassis 6.

  Furthermore, the shade 3 is attached to the chassis 6 via a plurality of brackets. When the shade 3 is attached to the chassis 6, the light source support portions 11 a and 11 b of the chassis 6 are covered with the shade 3 from below.

  As shown in FIG. 2, the light source 4 includes light emitting modules 20a, 20b, 20c, 20d, 20e, and 20f which are first to sixth light emitting devices. The first to sixth light emitting modules 20a, 20b, 20c, 20d, 20e, and 20f have an elongated shape extending in the longitudinal direction of the light source support portions 11a and 11b.

  According to the present embodiment, the first to third light emitting modules 20a, 20b, 20c are held in the holding grooves 14a, 14b of one shade 3 and arranged in a line along the longitudinal direction of the one light source support portion 11a. Are lined up. Similarly, the fourth to sixth light emitting modules 20d, 20e, and 20f are held in the holding grooves 14a and 14b of the other shade 3, and are aligned in a line along the longitudinal direction of the other light source support portion 11b. Yes.

  Therefore, the first to sixth light emitting modules 20 a, 20 b, 20 c, 20 d, 20 e, and 20 f are integrated with the shade 3 and covered with the shade 3. Further, the first to sixth light emitting modules 20a, 20b, 20c, 20d, 20e, and 20f are electrically connected in series.

  The lighting device 5 is for controlling the lighting of the first to sixth light emitting modules 20a, 20b, 20c, 20d, 20e, and 20f. Or it supplies to 6th light emitting module 20a, 20b, 20c, 20d, 20e, 20f. The lighting device 5 is supported by the fixed portion 10 of the chassis 6 and is covered with the center cover 7.

  The first to sixth light emitting modules 20a, 20b, 20c, 20d, 20e, and 20f basically have a common configuration. Therefore, in the present embodiment, the first light emitting module 20a will be described as a representative.

  As shown in FIGS. 4 to 6, the first light emitting module 20 a includes a substrate 21. The substrate 21 has a three-layer structure having a base 22, a metal layer 23, and a resist layer 24. The base 22 is made of a synthetic resin such as an epoxy resin or a glass composite substrate, and has an elongated shape extending in the longitudinal direction of the chassis 6.

  The metal layer 23 is made of, for example, copper foil and is laminated on the back surface 22 a of the base 22. The resist layer 24 is made of an insulating material such as synthetic resin. The resist layer 24 is continuously laminated on the outer peripheral portion of the metal layer 23 and the back surface 22 a of the base 22. The metal layer 23 and the resist layer 24 reinforce the substrate 21 in cooperation with each other in order to prevent the substrate 21 from warping.

  The substrate 21 has a pair of side edges 21a and 21b extending in the longitudinal direction. The side edges 21 a and 21 b of the substrate 21 are inserted into the holding grooves 14 a and 14 b of the shade 3 from one end along the longitudinal direction of the shade 3. By this insertion, the substrate 21 is held by the shade 3 and the resist layer 24 of the substrate 21 is in contact with the support surface 12 of the light source support portion 11a.

  As shown in FIGS. 5 to 7, a plurality of conductor patterns 26 and an insulating layer 27 are stacked on the surface 22 b of the base 22. The conductor patterns 26 are arranged in two rows at intervals in the width direction of the substrate 21 and are separated from each other in the longitudinal direction of the substrate 21 for each column.

  Each conductor pattern 26 has a mounting pad 28, a first wiring pad 29, and a second wiring pad 30. For example, the mounting pad 28 has a three-layer structure in which first to third metal layers C, N, and S are combined.

  Specifically, the first metal layer C is formed by etching a copper foil laminated on the surface 22 b of the base 22. The second metal layer N is stacked on the first metal layer C. The second metal layer N is formed by applying nickel plating to the first metal layer C. The third metal layer S is stacked on the second metal layer N. The third metal layer S is formed by applying silver plating to the second metal layer N. The third metal layer S constitutes the surface layer of the mounting pad 28. For this reason, the surface of the mounting pad 28 is a silver light reflecting surface 31. The total light reflectance of the light reflecting surface 31 is desirably 90% or more, for example. Further, the mounting pad 28 of the present embodiment is substantially elliptical and includes a pair of recesses 34a and 34b.

  The first and second wiring pads 29 and 30 have an elliptical shape that is much smaller than the mounting pad 28 and have the same size as each other. The first and second wiring pads 29 and 30 have a three-layer structure having the first to third metal layers C, N, and S similarly to the mounting pad 28, and each surface layer is made of silver. . The first and second wiring pads 29 and 30 are formed on the surface 22 b of the base 22 so as to enter the recesses 34 a and 34 b of the mounting pad 28.

  Further, the first and second wiring pads 29 and 30 are separated from the recesses 34 a and 34 b of the mounting pad 28, and are kept electrically insulated from the mounting pad 28. Therefore, it can be said that the recesses 34 a and 34 b of the mounting pad 28 are cut out so as to avoid the first and second wiring pads 29 and 30.

  An antioxidant film 60 is provided on the surface side of the mounting pad 28 and the first and second wiring pads 29 and 30. The anti-oxidation film 60 prevents the silver of each pad from being oxidized and discolored by an external gas, and thus makes it difficult for the reflectance of each pad to be lowered even after aged use.

  The insulating layer 27 is laminated on the surface 22b of the base 22 as shown in FIG. The insulating layer 27 covers a region of the surface 22 b of the base 22 that is out of the mounting pad 28, the first wiring pad 29, and the second wiring pad 30. Therefore, the surface layer of the mounting pad 28, the surface layer of the first wiring pad 29, and the surface layer of the second wiring pad 30 are exposed to the surface side of the substrate 21 without being covered with the insulating layer 27.

  Part of the insulating layer 27 is filled in the recesses 34 a and 34 b of the mounting pad 28, and between the mounting pad 28 and the first wiring pad 29 and between the mounting pad 28 and the second wiring pad 30. Intervened. Furthermore, the insulating layer 27 protrudes in the thickness direction of the substrate 21 from the surface layer of the mounting pad 28, the surface layer of the first wiring pad 29, and the surface layer of the second wiring pad 30.

  And according to this embodiment, the insulating layer 27 is comprised, for example with the white resin material which has electrical insulation. Therefore, the insulating layer 27 has a function as a light reflecting layer. Further, on the insulating layer 27, a control film 70 having an oil repellency function, which is a shape control means for stabilizing the shape of the sealing member 45, is formed. The control film 70 is not provided on the entire insulating layer 27 but is formed only around the insulating layer 27 formed so as to surround the mounting pad 28 and the wiring pads 29 and 30. That is, it is provided only in the region where the sealing member 45 is formed, and the remaining portion is provided such that the surface of the insulating layer 27 is exposed.

  First to third light emitting diodes 36 are mounted on the light reflecting surface 31 of the mounting pad 28. Each of the first to third light emitting diodes 36 is an example of a light emitting element, and is composed of, for example, a common bare chip that emits blue light. The bare chip has a rectangular shape when viewed in a plan view, and has a long side length of 600 to 650 μm and a short side length of 200 to 250 μm, for example. Further, each bare chip has a first electrode 37 as an anode and a second electrode 38 as a cathode. The first and second electrodes 37 and 38 are arranged at intervals in the longitudinal direction of the bare chip. The first to third light emitting diodes 36 are bonded to the light reflecting surface 31 using a die bond material 39 having translucency.

  The first electrodes 37 of the first to third light emitting diodes 36 are electrically connected to the first wiring pads 29 via the first bonding wires 41 individually. Similarly, the second electrodes 38 of the first to third light-emitting diodes 36 are electrically connected to the second wiring pads 30 via the second bonding wires 42 individually. As a result, the first to third light emitting diodes 36 bonded to the mounting pads 28 constitute a diode group 43 connected in parallel to each other.

  Also, as shown in FIGS. 4 to 6, a plurality of sealing members 45 are formed on the substrate 21. The sealing members 45 are arranged in two rows at intervals in the width direction of the substrate 21 so as to correspond to the conductor pattern 26, and are separated from each other in the longitudinal direction of the substrate 21 for each row.

  The sealing member 45 is an element for sealing the diode group 43 bonded to the mounting pad 28 and the first and second bonding wires 41 and 42 corresponding to the diode group 43 on the substrate 21. The sealing member 45 includes a predetermined amount of phosphor particles and a predetermined amount of filler mixed in a resin that is a base material.

  As the resin, for example, a resin-based silicone resin or a hybrid-type silicone resin having translucency is preferably used. Resin-type silicone resins and hybrid-type silicone resins have a three-dimensionally cross-linked structure, and are therefore harder than translucent silicone rubber.

  Furthermore, the resin-based silicone resin has a low performance of gas such as oxygen and water vapor permeating as compared with silicone oil and silicone rubber. In this embodiment, the oxygen permeability of the resin is 1200 cm 3 (m 2 · day · atm) or less, and the water vapor permeability is 35 g / m 2 or less. By selecting this type of resin, it is possible to prevent the mounting pad 28 from being deteriorated due to the passage of gas in the atmosphere through the sealing member 45, and to improve the light reflection performance of the light reflection surface 31. Can be maintained. And as the fluorescent substance particle 46, the yellow fluorescent substance particle which is excited by the blue light which a bare chip emits and emits yellow light is used. The phosphor particles mixed with the resin are not limited to yellow phosphor particles. For example, in order to improve the color rendering property of light emitted from the bare chip, red phosphor particles that emit red light when excited by blue light or green phosphor particles that emit green light may be added to the resin. Good.

  The sealing member 45 includes a mounting pad 28, first and second wiring pads 29 and 30 corresponding to the mounting pad 28, a diode group 43 on the mounting pad 28, a diode group 43 and the first and second wiring pads. The first and second bonding wires 41 and 42 straddling between them 29 and 30 are raised from the insulating layer 27 of the substrate 21 so as to be integrally wrapped.

  The sealing member 45 is dropped toward the mounting pad 28 in a liquid state before the resin is cured. When dropping the sealing member 45, it is desirable to use a dispenser. The sealing member 45 dropped toward the mounting pad 28 is cured into a dome shape by heating for 60 minutes at a temperature of 150 ° C., for example.

  In the present embodiment, in the base light 1, when the power switch of the base light 1 is turned on, the direct current voltage is transmitted from the lighting device 5 to the conductors of the first to sixth light emitting modules 20a, 20b, 20c, 20d, 20e, and 20f. Applied to the pattern 26. Thereby, the diode group 43 mounted on the plurality of mounting pads 28 emits light all at once.

  Blue light emitted from the bare chip of the diode group 43 is incident on the sealing member 45. Part of the blue light incident on the sealing member 45 is absorbed by the phosphor particles 46. The remaining blue light passes through the sealing member 45 without being absorbed by the phosphor particles 46.

  The phosphor particles 46 that have absorbed blue light are excited to emit yellow light having a complementary color relationship. The yellow light passes through the sealing member 45. Thereby, yellow light and blue light are mixed with each other inside the sealing member 45 to become white light. The white light passes through the sealing member 45 and the shade 3 and is radiated to the outside of the base light 1 to be used for illuminating the room from the ceiling surface C.

  According to the sealing member 45 of the present embodiment, the resin as the main component has physical properties that can maintain a predetermined shape even in an uncured state immediately after being dropped toward the mounting pad 28. Have. The physical properties of the resin refer to thixotropy, viscosity, hardness and the like. That is, as shown in FIG. 6, the sealing member 45 is mounted on the mounting pad 28, the first and second wiring pads 29 and 30, the diode group 43, even in an uncured stage immediately after being dropped onto the mounting pad 28. A flat dome shape that continuously covers the first and second bonding wires 41 and 42 is maintained.

  However, in this embodiment, since the anti-oxidation film 60 is provided on each of the pads 28, 29, and 30, the wettability between the sealing member 45 and the anti-oxidation film 60 is poor and the contact angle becomes relatively large. The sealing member 45 becomes fluid in the area of each pad and the adhesion is lowered. For this reason, the shape of the sealing member 45 tends to be difficult to stabilize. Therefore, as in the present embodiment, the control film 70 is formed on the insulating layer 27 in the region where the sealing member 45 is provided.

  Since the control film 70 has oil repellency as described, it has improved wettability with the sealing member 45 and a contact angle is reduced. For this reason, the adhesion between the control film 70 and the sealing member 45 and the shape stability of the sealing member 45 can be improved. And since the control film | membrane 70 is provided so that it may be located with respect to the perimeter of the outer peripheral part 51 of the sealing member 45, it suppresses effectively that it spreads more than assumption at the time of formation of the sealing member 45. Therefore, even when a plurality of sealing members 45 are formed, variations in shape are less likely to occur. Further, the fixing property of the sealing member 45 is also strengthened.

  In addition, since the control film 70 is formed not only on the outer peripheral portion 51 but also on the inner region of the sealing member 45 as described above, the fixing strength of the sealing member 45 is increased in the outer periphery of the sealing member 45. Since it is secured not only on the part side but also on the inner side, the fixing strength and shape retention effect of the sealing member 45 having a flat dome shape can be further enhanced.

  Further, in the present embodiment, the contact angle between the control film in the insulating layer 27 and the sealing member 45 is 9 degrees, and the contact between the antioxidant film 60 and the sealing member 45 in each pad 28, 29, 30. The angle is 50 degrees, and the contact angle ratio is 0.17. As described above, when the ratio is 0.17 or more, the shape of the sealing member 45 can be stably formed even in a combination with a member having good wettability.

  In this embodiment, the control film 70 has oil repellency, but may be made of a material having water repellency for the same function. In addition to forming a flat film as in the present embodiment, the surface of the insulating layer 27 may be provided so as to be unevenly formed directly or by another member. In this case, it effectively functions as a control means for shape control.

  Furthermore, the planar shape of the sealing member is not limited to an ellipse, and may be a perfect circle, for example. In addition, the light-emitting module is not limited to a light source for base light that is directly attached to the ceiling, but can also be used as a light source for a straight tube lamp that is used in place of a straight tube fluorescent lamp. At the same time, the lighting device is not limited to the base light directly attached to the ceiling, and can be implemented in the same manner even with other types of lighting devices such as street lights and guide lights.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 21 ... Board | substrate, 28 ... Mounting pad which is a metal layer, 29, 30 ... Wiring pad which is a conductor pattern, 27 ... Insulating layer, 36a, 36b, 36c ... Light emitting element, 45 ... Sealing member, 60 ... Antioxidation Layer, 70... Control film as shape control means,

Claims (6)

A substrate having a mounting surface;
A metal layer having an element mounting portion or a conductor pattern formed on the mounting surface side of the substrate;
An insulating layer provided avoiding the element mounting part and the conductor pattern;
A light emitting element mounted on the element mounting portion;
A translucent sealing member that covers the metal layer and the light emitting element, and that has an outer peripheral portion provided on the insulating layer to form a raised shape from the substrate;
A shape control means provided on the insulating layer for controlling the contact angle between the insulating layer and the sealing member;
A light-emitting device comprising:   2. The light emitting device according to claim 1, wherein the shape control means is formed so that a ratio between a contact angle of the sealing member in the insulating layer and a contact angle of the sealing member in the metal layer is 0.17 or more. apparatus.   The light-emitting device according to claim 1, wherein the metal layer has an anti-oxidation film having a contact angle with the sealing member larger than that of the surface metal portion of the metal layer on the surface side.   3. The light emitting device according to claim 1, wherein the shape control means of the insulating layer is a water repellent or oil repellent means provided on the insulating layer.   5. The light emitting device according to claim 1, wherein the shape control means on the insulating layer is uneven means formed on the surface side of the insulating layer. A light emitting device according to any one of claims 1 to 5;
An instrument body provided with a light emitting device;
An illumination device comprising:

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