JP2014054716A - Wire for wire saw, wire saw, cutting method using wire saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide wire for a wire saw which is excellent in durability, and in which poor curing etc. of a conductive layer does not occur.SOLUTION: A conductive layer 15 is formed of ultraviolet curing resin. Here, when specific surface area of metal particles becomes larger than predetermined size (namely, as the metal particles become finer), sufficient curing by ultraviolet irradiation cannot be obtained. In order to sufficiently cure the conductive layer 15 by the ultraviolet irradiation, it is preferable that the specific surface area of the metal particles contained in the conductive layer 15 is 1.9 m/g or less. It is because ultraviolet light does not sufficiently spread over the inside of the conductive layer 15, which results in poor curing when the specific surface area of the metal particles exceeds 1.9 m/g.

Description

  The present invention relates to a wire material for a wire saw that can cut a wafer from a difficult-to-cut material such as a silicon ingot.

  Conventionally, for example, in order to obtain a silicon wafer by slicing a silicon ingot, a wire has been used. For example, there has been a method of slicing an object to be processed while supplying a slurry containing abrasive grains using a steel wire.

  However, in such a method, a grinding waste liquid containing a large amount of abrasive grains and workpiece cutting waste is generated. Therefore, there is a problem that this processing is necessary and the environmental load is large.

  Therefore, there is a method of using a wire saw in which abrasive grains are held by a resin on the outer periphery of a metal wire such as a piano wire (Patent Documents 1 to 3). Such a method eliminates the need for a large amount of waste liquid. On the other hand, there is a method using a wire saw using quartz glass as a core material (Patent Document 4).

Japanese Patent No. 3078020 Japanese Patent No. 4266969 Japanese Patent No. 4175728 JP-A-10-151560

  In the cutting method using a wire saw having a metal wire such as a piano wire as a core material produced by the methods of Patent Documents 1 to 3, the workpiece is usually cut in a state where tension is applied to the wire. For this reason, there is a problem of wire breakage. For this reason, in order to ensure durability, it is necessary to make a wire diameter more than predetermined. However, when the wire diameter is increased, the cutting allowance is increased, so that there is a problem that the yield is lowered.

  Since the method of patent document 4 uses quartz glass with high tensile strength for a core material, it can make a wire saw with a small wire diameter. Moreover, since the resin layer is formed on the outer periphery of the core wire, the growth of microcracks can be prevented. However, in order to hold the abrasive grains by plating, it is necessary to form a conductive layer on the outer periphery of the resin layer.

  Such a conductive layer is formed, for example, by blending metal particles with an ultraviolet curable resin. However, when the ultraviolet curable resin is irradiated with ultraviolet rays, the curing reaction may not sufficiently proceed due to the presence of metal particles. Further, when the wire saw is used, the core wire may be damaged due to the metal particles sinking into the resin layer side.

  The present invention has been made in view of such problems, and an object thereof is to provide a wire saw wire or the like that has excellent durability and does not cause poor curing of a conductive layer.

In order to achieve the above-described object, the first invention includes a core wire made of quartz fiber, a resin layer formed on the outer periphery of the core wire to protect the core wire, a conductive layer formed on the outer periphery of the resin layer, The conductive layer is formed by blending metal particles with an ultraviolet curable resin, the metal particles have a specific surface area of 1.9 m ² / g or less, and the metal particles have an average particle size of 4.9 μm or less. Further, the wire saw wire is characterized in that the thickness of the conductive layer is larger than the average particle diameter of the metal particles.

The particles forming the conductive layer are silver particles, the thickness of the conductive layer is 1 to 5 μm, and the volume resistivity (25 ° C.) of the conductive layer is in the range of 10 ⁻³ to 2 × 10 ^−6. . By setting the volume resistivity of the conductive layer as described above, the abrasive grain holding layer can be stably formed on the outer periphery of the conductive layer. The particles forming the conductive layer are Ag particles, and the average diameter is preferably 1.6 μm or less.

  The thickness of the resin layer that protects the core wire is in the range of 3 to 20 μm, and the elastic modulus is preferably 500 to 5000 MPa, and more preferably 5 to 20 μm. The core wire preferably has an outer diameter of 60 to 300 μm and a tensile strength of 5000 Mpa or more.

  According to the first invention, since the core wire is made of quartz fiber, it has a higher tensile strength than the conventionally used piano wire. Therefore, breakage of the wire can be prevented and the wire diameter can be reduced. Therefore, it is possible to obtain a wire saw that is excellent in wire durability and has a high yield of work material during cutting.

  Further, if the core wire is simply composed of a quartz fiber, the core wire may be bent due to bending deformation of the core wire or contact between the core wire and the abrasive grains due to the abrasive grains biting during cutting. However, in the present invention, by forming the resin layer on the outer periphery of the core wire, breakage during bending of the core wire can be prevented.

Furthermore, since a conductive layer is formed on the outer periphery of the resin layer, plating is easy. Accordingly, the abrasive grains can be held by the plating layer. At this time, the conductive layer is formed by blending metal particles with an ultraviolet curable resin, and the specific surface area of the metal particles is 1.9 m ² / g or less. Therefore, the conductive layer is reliably cured when irradiated with ultraviolet rays. can do. Furthermore, it is desirable that the average diameter of the metal particles is 4.9 μm or less, the thickness of the conductive layer is in the range of 1 to 5 μm, and the thickness of the conductive layer is larger than the average particle diameter. The average diameter of the metal particles is further desirably 1.6 μm or less.

  Moreover, when the average particle diameter of the metal particles is a predetermined size or less, the metal particles can be prevented from sinking into the resin layer and damaging the core wire when the wire saw is used.

  Moreover, since electrical conductivity is high if a metal particle is a silver particle, high electroconductivity can be acquired. In addition, by setting the thickness of the conductive layer to 1 to 5 μm, the wire saw is not excessively thickened, and conductivity can be reliably obtained.

  The second invention comprises the wire saw wire according to the first invention, comprising an abrasive grain holding layer formed on the outer periphery of the conductive layer, and abrasive grains held on the abrasive grain holding layer, A wire saw, wherein the abrasive grain holding layer is formed by plating.

  According to the second invention, it is possible to obtain a wire saw that is excellent in durability and does not cause poor curing of the conductive layer.

3rd invention is formed in the outer periphery of the core wire which consists of a core wire which consists of quartz fiber, the outer periphery of the said core wire, and protects the said core wire, the conductive layer formed in the outer periphery of the said resin layer, and the said conductive layer An abrasive grain holding layer, and abrasive grains held in the abrasive grain holding layer, and the conductive layer is formed by blending metal particles in an ultraviolet curable resin, and the specific surface area of the metal particles is A cutting method using a wire saw using a wire saw having a particle diameter of 1.9 m ² / g or less and a metal particle having a particle diameter of 4.9 μm or less.

  According to the third aspect of the present invention, it is possible to prevent the wire saw from being broken and to perform the slicing process on the cutting object with high efficiency and reliability.

  ADVANTAGE OF THE INVENTION According to this invention, the wire material for wire saws etc. which are excellent in durability and the poor hardening of a conductive layer, etc. do not arise can be provided.

The figure which shows the cutting device 1. FIG. Sectional drawing of the wire saw 7. FIG. Schematic which shows the fiber manufacturing apparatus 20. FIG. Schematic which shows the wire saw manufacturing apparatus 40. FIG. The figure which shows the evaluation method of the fracture resistance of the wire for wire saws.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view showing a cutting device 1. The cutting device 1 omits the illustration of the holding unit 5 that holds the ingot 3 that is the object to be cut, the roller 9 that has multiple grooves for moving the wire saw 7, and the driving unit 5 and the roller 9. Consists of a motor and the like. The object to be cut is a hard or brittle material such as silicon or sapphire, SiC, a compound semiconductor, glass, or ceramics.

  In the cutting device 1, the wire saw 7 is wound many times around the outer periphery of the roller 9 with a predetermined tension applied. The wire saw 7 is fed from one side (in the direction of arrow A in the figure) and wound up from the other side (in the direction of arrow B in the figure). By rotating the roller 9 reversibly by the drive motor, the wire saw 7 can be reciprocated between the rollers 9.

  In a state where the ingot 3 such as silicon for semiconductor is held by the holding portion 5, it is moved perpendicularly to the moving direction of the wire saw 7 (in the direction of arrow C in the figure). The ingot 3 is cut by the wire saw 7 by applying a predetermined load to the holding portion 5 and bringing the ingot 3 into contact with the wire saw 7. That is, the ingot 3 can be sliced into a large number of workpieces at a time. The cutting method of the present invention is not limited to the illustrated example, and can be applied to all cutting processes performed using the wire saw according to the present invention.

  Next, the wire saw 7 will be described. 2A is a cross-sectional view of the wire saw 7, and FIG. 2B is an enlarged view of a portion D in FIG. 2A. The wire saw 7 is mainly composed of a core wire 11, a resin layer 13, a conductive layer 15, a plating layer 17, an abrasive grain 19, and the like.

  The core wire 11 is a quartz fiber having an outer diameter of 60 to 300 μm. If the diameter of the core wire 11 is too thin, the wire saw 7 may be broken during use. Further, if the diameter of the core wire 11 is made too large, the cutting allowance of the object to be cut increases, so that the yield decreases and a large amount of chips are generated. The core wire 11 preferably has a tensile strength of 5000 MPa or more. As such a core wire 11, for example, a glass fiber conventionally used as an optical fiber can be used. For example, if a high-purity silica fiber synthesized by vapor phase is used, it does not contain impurities and has a high tensile strength. The elastic modulus of the high purity silica fiber is 72000 MPa.

  A resin layer 13 is provided on the outer periphery of the core wire 11. The resin layer 13 is for protecting the core wire 11. As described above, the quartz fiber has a very high tensile strength, but there is a risk of breakage against bending deformation. For this reason, by covering the periphery of the core wire 11 with the resin layer 13, it is possible to prevent stress when the wire saw 7 is bent from being concentrated on one place of the wire saw 7, and to prevent breakage of the core wire 11. . For this reason, even if the wire saw 7 is wound around a bobbin or the like, and the winding apparatus 1 is wound between the rollers 9, the wire saw 7 can be prevented from being broken.

  In order to impart bendability to the wire saw 7 and prevent the abrasive grains 19 from biting in, the thickness of the resin layer 13 is preferably 3 to 20 μm, and more preferably 5 to 15 μm. When the resin layer 13 is 3 μm or less, the bendability of the wire saw 7 is deteriorated and the prevention of biting of the abrasive grains 19 becomes insufficient. On the other hand, if the thickness of the resin layer 13 exceeds 20 μm, the outer diameter of the wire saw 7 becomes large and the yield deteriorates, and it takes time to cure the resin when the resin layer 13 is formed.

  The elastic modulus of the resin layer 13 is desirably 500 to 5000 MPa. If the resin layer 13 is too soft, the abrasive grains 19 are embedded in the resin layer 13 during use, and contact between the abrasive grains 19 and the core wire 11 cannot be reliably prevented. Moreover, it is because the bendability of a wire saw will worsen if the resin layer 13 is too hard.

  In addition, as such a resin layer 13, any resin is applicable. For example, a radical curable ultraviolet curable resin such as urethane acrylate or epoxy acrylate, an epoxy resin cation curable ultraviolet curable resin, or a polyimide thermosetting resin can be applied. In addition, an ultraviolet curable resin is preferable from the viewpoint of productivity.

  A conductive layer 15 is provided on the outer periphery of the resin layer 13. The conductive layer 15 is a layer for forming a plating layer 17 described later. The conductive layer 15 is formed between the resin layer 13 and the plating layer 17 that is an abrasive grain holding layer. For this reason, when the conductive layer 15 is deformed, it also serves as a buffer layer that absorbs stress during cutting and prevents the abrasive grains 19 carried on the plating layer 17 from biting into the resin layer 13.

The conductive layer 15 is obtained by adding metal particles 16 such as silver or copper to an ultraviolet curable resin. In consideration of conductivity, the metal particles 16 are preferably silver. The volume resistivity of the conductive layer 15 may be, for example, about 10 ⁻³ to 2 × 10 ⁻⁶ Ω · cm, but is preferably lower. This is because if the volume resistivity is too high, it is difficult to form the plating layer 17. Further, if the metal particles 16 are added excessively in order to reduce the volume resistivity, the metal particles conversely block the ultraviolet rays so that the ultraviolet rays do not reach the entire ultraviolet curable resin constituting the conductive layer 15, and the resin It is because it becomes difficult to harden. That is, the addition amount of the metal particles 16 is set so as to have the above-described volume resistivity. For example, it is possible to achieve the volume resistivity of the conductive layer within the above range by dispersing silver particles in the conductive layer with a volume resistivity of 1.6 × 10 ⁻⁶ Ω · cm. 10 ^{−4 to} 2 × 10 ⁻⁶ Ω · cm.

  In order to stably form the abrasive grain holding layer, the volume resistivity of the conductive layer needs to be in the above range. Therefore, it is desirable that the metal particles have a smaller volume resistivity because the resistance of the conductive layer can be lowered. Further, if metal particles having a low volume resistivity are used, the conductive layer can be made thin. Therefore, the lower the volume resistivity of the metal particles used in the conductive layer, the better.

  In addition, the conductive layer 15 should just be able to form a plating layer uniformly in an outer surface, for example, should just be about 1-5 micrometers. If it exceeds 5 μm, the diameter of the wire saw 7 becomes large. Moreover, if it is less than 1 micrometer, the diameter of the metal particle 16 which can be used is restrict | limited. The size of the metal particles 16 is preferably approximately equal to or less than the thickness of the conductive layer 15.

  As described above, the conductive layer 15 is formed of an ultraviolet curable resin. Here, the inventors have found that the properties of the metal particles 16 added to the ultraviolet curable resin affect the curing of the conductive layer 15. That is, when a predetermined amount of the metal particles 16 is added to the ultraviolet curable resin so as to achieve the volume resistivity described above, the conductive layer 15 is sufficiently cured when irradiated with ultraviolet rays depending on the properties of the metal particles 16. May not be seen.

The inventors have found that the factor that affects the curing of the conductive layer by such ultraviolet irradiation is the specific surface area of the metal particles 16. That is, it has been found that when the specific surface area of the metal particles 16 is larger than a predetermined value (that is, the metal particles 16 are finer), sufficient curing by ultraviolet irradiation cannot be obtained. In order to sufficiently cure the conductive layer 15 by ultraviolet irradiation, the specific surface area of the metal particles 16 included in the conductive layer 15 is desirably 1.9 m ² / g or less. This is because if the specific surface area of the metal particles 16 exceeds 1.9 m ² / g, the ultraviolet rays do not sufficiently reach the inside of the conductive layer 15 and cause curing failure. In order to set the volume resistivity within a predetermined range, the amount of silver particles added may be appropriately adjusted. For example, it can be set as a desired volume resistivity by setting it as about 360 mass parts of metal particles with respect to 100 mass parts of resin.

  On the other hand, if the metal particles 16 are too large, the internal core wire 11 may be damaged by the metal particles 16 when an external force is applied. In order to prevent such damage to the core wire 11 due to the metal particles 16, the diameter of the metal particles 16 is desirably 4.9 μm or less, and more desirably 1.6 μm or less.

  A plating layer 17 is provided on the outer periphery of the conductive layer 15. The plating layer 17 functions as a holding layer for the abrasive grains 19. The plating layer 17 may be any metal as long as it can hold the abrasive grains 19, but is made of nickel, for example. The abrasive grains 19 are, for example, diamond abrasive grains, although depending on the hardness of the object to be cut.

  The plating layer 17 only needs to be thick enough to hold the abrasive grains 19. The thickness of the plating layer 17 is preferably 1/4 to 1/1 of the average particle diameter of the abrasive grains 19. For example, if the average diameter of the abrasive grains 19 is about 10 to 20 μm, the thickness of the plating layer 17 may be about 5 to 10 μm, for example. This is because if the plating layer is too thin, the holding power of the abrasive grains 19 becomes insufficient, and stable cutting cannot be performed. Further, if the plating layer 17 is too thick, the outer diameter of the wire saw 7 is increased, so that the cutting yield of the work material is reduced and it takes time to form the plating.

  Next, a method for manufacturing the wire saw 7 will be described. FIG. 3 is a schematic view showing the fiber manufacturing apparatus 20 for manufacturing the wire saw wire 35. In the present invention, the production method is not limited as long as the above-described quartz fiber having the tensile strength can be produced.

  First, the fiber preform 21 is manufactured. What is necessary is just to manufacture the glass fine particle deposit body which is the fiber preform | base_material 21 by the OVD method (Outside Vapor Deposition method) etc., for example. In the OVD method, a glass material containing silicon is introduced into a burner together with a combustion gas such as a flammable gas and an auxiliary combustible gas, and the glass material is hydrolyzed or oxidized in a flame. In this method, an aggregate is generated and is deposited on the outer periphery of a mandrel serving as a rotating deposition target to form a glass particulate deposit. The fiber preform 21 can be obtained by making the glass particulate deposits transparent in a furnace.

  The obtained fiber preform 21 is drawn by the fiber manufacturing apparatus 20. The fiber manufacturing apparatus 20 includes a heater 23, a resin layer coating die 25, ultraviolet irradiation devices 27 and 31, a conductive layer coating die 29, a winding device 37, and the like.

  First, the fiber preform 21 is heated and melted by the heater 23 and drawn (in the direction of arrow E in the figure) to obtain a bare fiber 33 having a predetermined diameter. Thereby, a core wire of 60-300 micrometers is obtained. Next, the bare fiber wire 33 is passed through the resin layer coating die 25 to which the liquid resin heated to a certain temperature is supplied, and the liquid resin is applied to the outer periphery. Here, the clearance of the resin layer coating die 25 is set to about twice the coating thickness larger than the coating thickness in consideration of curing shrinkage after ultraviolet irradiation, for example. The resin layer 13 is formed by irradiating the liquid resin with ultraviolet rays by the ultraviolet irradiation device 27.

  Next, the bare fiber 33 on which the resin layer 13 is formed is passed through the conductive layer coating die 29 to which the liquid resin containing the metal particles 16 heated to a certain temperature is supplied, and the liquid resin is applied to the outer periphery. The conductive layer 15 is formed by irradiating ultraviolet rays from the ultraviolet irradiation device 31 and curing the liquid resin. The obtained wire saw wire 35 is wound up by a winding device 37 (in the direction of arrow F in the figure).

  Next, the electrodeposition process of abrasive grains will be described. FIG. 4 is a schematic view showing the wire saw manufacturing apparatus 40. First, wire saw wire 35 is sent to degreasing tank 41 (in the direction of arrow G in the figure). The degreasing tank 41 is a tank in which, for example, an aqueous sodium hydroxide solution is stored, and dirt such as oil adhering to the outer surface of the wire saw wire 35 is removed. In the washing tank 43, the chemical solution or the like of the degreasing tank 41 attached to the surface is washed.

  The plating tank 45 is a tank for electrolytically plating the wire saw wire 35 and electrodepositing diamond abrasive grains. The plating tank 45 is, for example, a nickel bath in which abrasive grains are dispersed in a solution in which nickel is dissolved. A cathode 49 is connected to the wire saw wire 35 that passes through the plating tank 45. A nickel anode 51 is immersed in the plating tank 45. The cathode 49 and the anode 51 are connected to a power source (not shown). Thus, a plating layer having a desired thickness is formed.

  In addition, what was previously processed in the cationic surfactant solution is used for the abrasive grains. By doing in this way, a positive electric charge can be given to an abrasive grain. Accordingly, the abrasive grains can be adsorbed to the wire saw wire 35 connected to the cathode 49 by the Coulomb force.

  In a state where the abrasive grains are held by the plating layer, excess chemicals and the like are washed in the water washing tank 47 and wound up by the winding device 53 (in the direction of arrow H in the figure), whereby a wire saw is manufactured.

  According to the present invention, since the core wire 11 is made of quartz fiber, it has a higher tensile strength than, for example, a conventional piano wire. For this reason, it is possible to suppress breakage of the wire saw and to reduce the outer diameter of the wire saw.

In addition, a conductive layer 15 is provided to form a plating layer 17 that holds the abrasive grains 19. Therefore, the plating layer 17 having a uniform thickness can be easily formed. At this time, by setting the specific surface area of the metal particles 16 included in the conductive layer 15 to 1.9 m ² / g or less, occurrence of poor curing of the conductive layer 15 can be prevented.

  Moreover, a highly durable wire saw can be obtained by making the average particle diameter of the metal particle 16 into 4.9 micrometers or less.

  Further, in order to prevent breakage of the core wire 11, a resin layer 13 is provided on the outer periphery of the core wire 11. For this reason, when the core wire 11 is bent, the core wire 11 is not broken. Further, the resin layer 13 functions as a buffer layer that prevents contact between the abrasive grains 19 and the core wire 11. For this reason, the abrasive grains 19 come into contact with the core wire 11 and do not damage the core wire 11, thereby preventing the core wire 11 from being broken.

  As mentioned above, although embodiment of this invention was described referring an accompanying drawing, the technical scope of this invention is not influenced by embodiment mentioned above. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the technical idea described in the claims, and these are naturally within the technical scope of the present invention. It is understood that it belongs.

  Hereinafter, the fracture resistance and ultraviolet curability of the wire saw wire were evaluated using various metal particles. Table 1 shows the properties and evaluation results of the metal particles used.

  The fracture resistance was evaluated as follows. First, a resin layer having a thickness of 10 μm was formed on the outer periphery of a glass fiber drawn to an outer diameter of 80 μm, and a conductive layer having a thickness of 5 μm was formed on the outer periphery. The conductive layer contained metal particles having various properties. The average particle size of the metal particles was measured using light scattering by dispersing the metal particles in a solvent. The specific surface area of the metal particles was measured by the BET method. In the examples in Table 1, 360 parts by mass of metal particles (in the example, silver) were added to 100 parts by mass of the ultraviolet curable resin, and the materials in Table 1 were prepared.

  The particle shape indicates the general outer diameter of the metal particles, and the spherical shape is not necessarily limited to a sphere, but includes a granular shape. The flakes include those having a flat shape such as a scissors shape. The lump shape is formed by integrally solidifying spherical or flakes. The particle diameter in the lump shape is the diameter of the lump (secondary particle diameter) in which individual particles constituting the lump are collected. In addition, the massive particles described in Example 15 are a collection of fine particle reduced silver powder having a primary particle diameter of 50 nm.

  With respect to the wire saw wire 35 thus obtained, the breaking load was measured by the method shown in FIG. First, the wire saw wire 35 was disposed between the pair of metal plates 55, and the load I was applied so that the wire saw wire 35 was sandwiched between the metal plates 55. The metal plate 55 was 8 mm long.

  As shown in FIG. 5B, diamond abrasive grains 57 were previously fixed to the surface of the metal plate 55 with an adhesive. That is, the wire saw wire 35 is pressed from above and below by the diamond abrasive grains 57. At this time, the load applied to the metal plate 55 was increased by 1 kg, and the load when the wire saw wire 35 was broken was measured. That is, it shows that it is the wire rod for wire saws which is excellent in fracture resistance and is hard to fracture, so that a numerical value (kg) of fracture resistance is large.

Further, the ultraviolet curable property (UV curable property) was evaluated as follows. An ultraviolet curable resin containing metal particles was applied to a glass plate with a film thickness of 10 μm, and irradiated with ultraviolet rays having an irradiation amount of 100 mJ / cm ² . After that, the resin surface that was sticky by touch was designated as “X”, and the resin surface that was completely cured was designated as “◯”.

As is apparent from Table 1, No. 1 having a specific surface area of 1.9 m ² / g or less. In Nos. 1 to 13, the UV curability was “◯”. That is, if the specific surface area is 1.9 m ² / g or less, the conductive layer will not be poorly cured.

  Further, when the particle diameter was 4.9 μm or less, the fracture resistance of 5 kg or more could be secured. Furthermore, when the particle diameter was 1.6 μm or less, the fracture resistance of 6 kg or more could be secured. That is, the smaller the particle diameter, the better the rupture resistance against compression by abrasive grains.

DESCRIPTION OF SYMBOLS 1 ......... Cutting device 3 ......... Ingot 5 ......... Holding part 7 ......... Wire saw 9 ......... Roller 11 ......... Core wire 13 ......... Resin layer 15 ...... Conductive layer 16 ...... Metal particles 17 ......... Plating layer 19 ...... Abrasive grain 20 ...... Fiber manufacturing device 21 ......... Fiber base material 23 ...... Heater 25 ...... Resin layer coating die 27 ...... UV irradiation device 29 ......... Conductive layer coating die 31... UV irradiation device 33... Bare wire 35... Wire saw wire 37. Tank 45 ......... Plating tank 47 ......... Washing tank 49 ......... Cathode 51 ......... Anode 53 ......... Winding device

Claims (6)

A core wire made of quartz fiber;
A resin layer formed on an outer periphery of the core wire and protecting the core wire;
A conductive layer formed on the outer periphery of the resin layer;
Comprising
The conductive layer is formed by blending metal particles in an ultraviolet curable resin, the metal particles have a specific surface area of 1.9 m ² / g or less, and the average particle diameter of the metal particles is 4.9 μm or less. A wire rod for a wire saw, wherein the thickness of the wire is larger than the average particle diameter. The fine particles forming the conductive layer are silver particles, the thickness of the conductive layer is 1 to 5 μm, and the volume resistivity of the conductive layer is in the range of 10 ⁻³ to 2 × 10 ^−6. The wire material for wire saws according to claim 1.   The wire rod for a wire saw according to claim 1 or 2, wherein the resin layer protecting the core wire has a thickness in a range of 3 to 20 µm and an elastic modulus of 500 to 5000 MPa.   The wire rod for a wire saw according to any one of claims 1 to 3, wherein the core wire has an outer diameter of 60 to 300 µm and a tensile strength of 5000 Mpa or more. Using the wire material for a wire saw according to any one of claims 1 to 4,
An abrasive-holding layer formed on the outer periphery of the conductive layer;
Abrasive grains held in the abrasive grain holding layer;
Comprising
The wire saw, wherein the abrasive grain holding layer is formed by plating. A core wire made of quartz fiber;
A resin layer formed on an outer periphery of the core wire and protecting the core wire;
A conductive layer formed on the outer periphery of the resin layer;
An abrasive-holding layer formed on the outer periphery of the conductive layer;
Abrasive grains held in the abrasive grain holding layer;
Comprising
The conductive layer is formed by blending metal particles into an ultraviolet curable resin, and the specific surface area of the metal particles is 1.9 m ² / g or less,
A cutting method using a wire saw, wherein a cutting object is cut using a wire saw in which the metal particles have a particle diameter of 4.9 μm or less.

Images