JP2014049586A - Leaf spring pressing member used to fix semiconductor module and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a leaf spring pressing member capable of downsizing the whole semiconductor device, including a structure for fixing a circuit board for control.SOLUTION: A leaf spring pressing member (spring presser bracket 50) is used to fix a semiconductor module. The spring presser bracket 50 comprises bosses 61 to 68 for fixing a circuit board for control to the spring presser bracket 50 on an upper surface 50a. This bracket also includes leaf spring pressing parts 57 to 60 for pressing a leaf spring 40 on a lower surface 50b.

Description

  The present invention relates to a semiconductor device, and more particularly to a leaf spring pressing member used to fix a semiconductor module.

In a semiconductor device, a structure is known in which a semiconductor module is pressed against a cooler or the like by using a leaf spring. For example, in the semiconductor device described in Patent Document 1, the reinforcing beam presses the semiconductor module against the heat sink via a leaf spring, thereby fixing the semiconductor module.
In some cases, a substrate such as a control circuit board is disposed on the opposite side of the cooler across the semiconductor device. In this case, the control circuit board is fixed to the semiconductor device.

JP 2007-329167 A

  However, in the conventional configuration, it is necessary to separately provide a structure for fixing an external structure (for example, a control circuit board) to the semiconductor device, and there is a problem that the whole is increased in size. For example, Patent Document 1 does not describe a structure for fixing a control circuit board, and it is necessary to attach such a structure separately.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a leaf spring pressing member capable of downsizing the entire semiconductor device including a structure for fixing a control circuit board. And

  In order to solve the above-mentioned problem, a leaf spring pressing member according to the present invention is a leaf spring pressing member used for fixing a semiconductor module, and the leaf spring pressing member has a shape having both sides, One of the surfaces is provided with a protrusion for fixing the external structure to the leaf spring pressing member, and the other surface of the both surfaces is provided with a pressing region for pressing the leaf spring.

  According to such a configuration, the leaf spring pressing member presses the leaf spring and fixes the control circuit board.

Three or more protrusions are provided, and on one surface, the height of the upper end of the protrusion disposed closer to the center may be lower than the height of the upper end of the protrusion disposed near the periphery.
In the state where the leaf spring pressing member fixes the semiconductor module, the heights of the upper ends of all the protrusions may be the same.
Two or more pressing areas arranged in a predetermined direction are provided, each of the pressing areas has a pressing edge at both ends in the predetermined direction, and the leaf spring pressing member presses the leaf spring at the pressing edge. Good.
When the leaf spring pressing member and the semiconductor module are projected in the thickness direction, the leaf spring pressing member may extend to positions corresponding to all the switching elements included in the semiconductor module.
The leaf spring may bias the semiconductor module toward the cooler.
You may provide the fixing structure for fixing a leaf | plate spring press member to a cooler in a peripheral part.

  A semiconductor device according to the present invention includes the above-described leaf spring pressing member, a semiconductor module, and a leaf spring.

  According to the leaf spring pressing member of the present invention, since the single member presses the leaf spring and fixes the control circuit board, the entire semiconductor device can be miniaturized.

1 is a top view of a semiconductor device according to a first embodiment of the present invention. FIG. 2 is a front partial cross-sectional view of the semiconductor device of FIG. 1. It is a front fragmentary sectional view of the semiconductor device of FIG. 1 before fastening. It is a top view of the cooler of FIG. It is a figure which shows the state by which the semiconductor module was arrange | positioned on the cooler of FIG. It is a top view of a semiconductor device in the state where a spring retainer bracket was removed. (A) (b) (c) is the top view, front view, and right view which respectively show the structure of the leaf | plate spring of FIG. (A) and (b) are the front sectional view and bottom view which show the structure of the spring clamp bracket of FIG. 1, respectively.

Embodiments of the present invention will be described below with reference to the accompanying drawings.
Embodiment 1 FIG.

  1 and 2 show a configuration of a semiconductor device 10 according to the first embodiment of the present invention. 1 is a top view, and FIG. 2 is a partial front sectional view. The semiconductor device 10 is an inverter, for example. The semiconductor device 10 includes a cooler 20, a plurality of semiconductor modules 30 to 32, a leaf spring 40, and a spring retainer bracket 50 (leaf spring pressing member). The spring retainer bracket 50 has a thickness direction. In the present embodiment, the thickness direction is the vertical direction, and in the accompanying drawings, the Z-axis is placed in parallel with the thickness direction. The positive direction of the Z axis is the upward direction, and the negative direction is the downward direction. Further, an X axis and a Y axis are placed in two directions perpendicular to the Z axis and perpendicular to each other. In the present embodiment, the X-axis is parallel to the longitudinal direction of the spring retainer bracket 50, that is, the left-right direction, and the Y-axis is parallel to the width direction of the spring retainer bracket 50, that is, the depth direction.

The semiconductor modules 30 to 32 are disposed on the cooler 20. The leaf spring 40 is disposed on the semiconductor modules 30 to 32, and biases the semiconductor modules 30 to 32 toward the cooler 20, thereby pressing the semiconductor modules 30 to 32 against the cooler 20. The spring retainer bracket 50 is disposed on the upper side of the leaf spring 40. The leaf spring 40 and the spring retainer bracket 50 are used for fixing the semiconductor modules 30 to 32.
Since the spring retainer bracket 50 is not an ideal rigid body, the center portion warps upward when actually assembled as shown in FIG. 2, but this warpage is not shown in FIG. The same applies to FIG.

  FIG. 3 shows a partial front sectional view before the semiconductor device 10 is fastened. The spring retainer bracket 50 is fastened and fixed to the cooler 20 as shown in FIG. 2 by screws 70 as fastening means from the state shown in FIG. Since the plate spring 40 and the semiconductor modules 30 to 32 are disposed between the spring holding bracket 50 and the cooler 20, the spring holding bracket 50 presses the plate spring 40 downward as a plate spring pressing member. The leaf spring 40 biases the semiconductor modules 30 to 32 downward.

  FIG. 4 shows a top view of the cooler 20. The cooler 20 has a rectangular shape, and its long side extends in the X-axis direction and its short side extends in the Y-axis direction. The cooler 20 is formed thin as shown in FIG. 3 and has a flat shape. As shown in FIG. 4, a cooling water inlet pipe 21 and a cooling water outlet pipe 22 are attached to both ends in the X-axis direction on the upper surface of the cooler 20.

  The length in the X-axis direction between the root portion of the cooling water inlet pipe 21 and the root portion of the cooling water outlet pipe 22 is set to 200 mm to 250 mm. The cooler 20 has a Y-axis dimension (width) of 50 to 70 mm and a Z-axis dimension (thickness) of 6 to 15 mm. A fin member is disposed inside the cooler 20, and a refrigerant flow path is formed by the fin member.

  Bracket mounting portions 23 are formed at the four corners of the cooler 20, and bosses (projections) 24 are formed on the upper surface of each bracket mounting portion 23. Each boss 24 is formed with a screw hole 24a.

  FIG. 5 shows a state where the semiconductor modules 30 to 32 are arranged on the cooler 20. Three semiconductor modules 30 to 32 are arranged side by side in the X-axis direction above the cooler 20. Each of the semiconductor modules 30 to 32 is placed on the cooler 20 via the silicone grease 33 as shown in FIGS. Each of the semiconductor modules 30 to 32 has a dimension (length) in the X-axis direction of 40 mm to 60 mm and a dimension (width) in the Y-axis direction of 50 to 70 mm. The size of the cooler 20 having the mounting surface for each of the semiconductor modules 30 to 32 is set according to the size and the number of the semiconductor modules 30 to 32 to be mounted. That is, the size of the cooler 20 is set on the basis of the size of the region (mounting region) when all the semiconductor modules 30 to 32 are mounted on the top of the cooler 20 in a plane.

  The semiconductor modules 30 to 32 are used, for example, to convert direct current into three-phase alternating current. The semiconductor module 30 incorporates (resin-sealed) an upper arm configuration power transistor and a lower arm configuration power transistor in the U phase. The semiconductor module 31 incorporates (resin-sealed) an upper arm configuration power transistor and a lower arm configuration power transistor in the V phase. The semiconductor module 32 incorporates (resin-sealed) an upper arm configuration power transistor and a lower arm configuration power transistor in the W phase. The power transistor is, for example, a MOSFET or IGBT. In each of the semiconductor modules 30 to 32, the upper arm configuration power transistor and the lower arm configuration power transistor are connected (connected) in series. One end (positive input) and the other end (negative input) of the series circuit and between both power transistors (output) are connected to the outside.

  A plate-like positive electrode terminal 34, a plate-like negative electrode terminal 35, and a plate-like output terminal 36 are provided on one side of each of the semiconductor modules 30 to 32. A control signal pin 37 is provided on one side facing the positive terminal 34, the negative terminal 35 and the output terminal 36. Thereby, in the semiconductor device 10, the terminals on the power supply line side (the positive terminal 34, the negative terminal 35, and the output terminal 36) are collectively arranged on one side, while the other side is opposed to the terminal on the power supply line side. Thus, the control signal pins 37 are collectively arranged.

  FIG. 6 shows a top view of the semiconductor device 10 with the spring retainer bracket 50 removed. FIG. 7 shows the configuration of the leaf spring 40. FIGS. 7A, 7B, and 7C are a top view, a front view, and a right side view of the leaf spring 40, respectively. The leaf spring 40 is made of, for example, a spring steel plate. In the present embodiment, the longitudinal direction of the leaf spring 40 is parallel to the X axis and coincides with the longitudinal direction of the spring retainer bracket 50.

  The leaf spring 40 includes a plurality of main body portions arranged in the X-axis direction. In the example of FIGS. 6 and 7, the main body portions 43 a to 43 c are provided at positions corresponding to the semiconductor modules 30 to 32, respectively. Each of the main body portions 43a to 43c includes a planar central portion 41a to 41c arranged horizontally, and both side portions 42a to 42c extending downward from each central portion in the width direction. Both side portions 42 a to 42 c are in contact with the semiconductor module and urged toward the cooler 20.

  The leaf spring 40 includes a plurality of extending portions arranged in the X-axis direction. In the example of FIGS. 6 and 7, four extending portions 44 to 47 are provided. The extending portions 44 to 47 are planar and are arranged horizontally. The extending portions 44 to 47 and the main body portions 43a to 43c are alternately arranged in the X-axis direction. That is, both ends in the longitudinal direction of the leaf spring 40 are constituted by the extending portions 44 and 48, and the intermediate extending portions 45 and 47 respectively connect the two main body portions. Mounting through holes 48 are formed at both ends of the plate spring 40 in the X-axis direction.

FIG. 8 shows the configuration of the spring retainer bracket 50. FIG. 8B is a bottom view of the spring retainer bracket 50, and FIG. 8A is a front cross-sectional view taken along a line AA in FIG. 8B. A top view of the spring retainer bracket 50 is included in FIG.
The spring retainer bracket 50 is made of a metal plate material such as aluminum and has a shape having an upper surface 50a and a lower surface 50b. Here, the upper surface 50a and the lower surface 50b are not limited to being planar, and may include a curved surface, or may include irregularities as in the present embodiment.

  The upper surface 50a is a surface disposed opposite to the external structure of the semiconductor device 10 (for example, the control circuit board 80 shown in FIGS. 2 and 3), and the lower surface 50b is disposed opposite the leaf spring 40. It is a surface. The upper surface 50 a includes a protrusion for fixing the control circuit board 80 to the spring retainer bracket 50. In the present embodiment, this protrusion is configured as eight bosses 61-68. Screw holes are formed in the bosses 61 to 68, and the control circuit board 80 is fixed to the spring pressing bracket 50 by screws 90 (see FIG. 3 and the like).

  As shown in FIG. 8 (a), among the bosses 61-68, the height of the upper ends (bosses 62, 63, 66, 67) of the bosses 61-68 that are arranged closer to the center are those arranged in the periphery. It is lower by ΔH than the height of the upper end of (bosses 61, 64, 65, 68). Here, the meaning of “center side” and “periphery” can be understood by those skilled in the art. For example, “boss arranged near the center” means that the spring retainer bracket 50 is projected in the thickness direction. In this case, it may mean a boss whose distance from the center of gravity of the projected figure is less than a predetermined value. Further, for example, “a boss arranged around” may mean a boss whose distance from the center of gravity of a projected figure exceeds a predetermined value.

The spring retainer bracket 50 includes a fixing structure for fixing the spring retainer bracket 50 to the cooler 20 at the periphery. In addition, a peripheral part means the part which does not overlap with any of the semiconductor modules 30-32 seeing from a Z-axis direction, for example. In the present embodiment, this fixing structure is configured as a flange 52 that extends outward at the four corners. Each of the flanges 52 is formed with a through hole 52a. The spring retainer bracket 50 is fastened and fixed to the cooler 20 by screwing a screw 70 into the screw hole 24a of the boss 24 of the cooler 20 (see FIGS. 3 and 6).
In addition, the meanings of “center side” and “periphery” representing the positions of the bosses 61 to 68 described above may be defined with respect to the flange 52 that is a fixing structure provided at the peripheral edge. For example, the “boss arranged in the periphery” may mean a boss arranged in a position relatively close to any of the flanges 52, and the “boss arranged near the center” The boss | hub arrange | positioned in the position comparatively distant from the flange 52 of this may also be meant. This is because when the spring retainer bracket 50 is fixed to the cooler 20 with the flange 52, the portion of the spring retainer bracket 50 that is farther from the flange 52 is deformed to warp upward.

Further, as shown in FIG. 8 and the like, a leaf spring holding portion 53 for holding the leaf spring 40 is formed on the lower surface 50b of the spring retainer bracket 50.
The leaf spring holding portion 53 has concave portions 54 to 56 at positions corresponding to the main body portions 43 a to 43 c of the leaf spring 40 and has leaf spring pressing portions 57 to 60 at positions corresponding to the extending portions 44 to 47, respectively. Thus, the leaf spring 40 is accommodated. The recesses 54 to 56 and the leaf spring pressing portions 57 to 60 are all formed as depressions in the lower surface 50b as shown in FIG. 8A, but the depth of the leaf spring pressing portions 57 to 60 is the recesses 54 to 56. Shallower than.

  The leaf spring pressing portions 57 to 60 are arranged in the X-axis direction. Each of the leaf spring pressing portions 57 to 60 includes a flat pressing area (in this embodiment, each of the leaf spring pressing sections 57 to 60 constitutes a pressing area), and the pressing area presses the leaf spring 40. . The lengths of the leaf spring pressing portions 57 to 60 in the X-axis direction are W1 to W4, respectively.

  Each of the leaf spring pressing portions 57 to 60 has a pressing edge that contacts the leaf spring 40 at one end or both ends in the X-axis direction. The leaf spring pressing portion 57 has a pressing edge E1 at one end, the leaf spring pressing portion 58 has pressing edges E2 and E3 at both ends, and the leaf spring pressing portion 59 has pressing edges E4 and E5 at both ends. The spring pressing portion 60 has a pressing edge E6 at one end. The plate spring pressing portions 57 to 60 are all flat, but the plate spring 40 is warped downward by pressing. As a result, the portion where the plate spring pressing portions 57 to 60 are in contact with the plate spring 40 is the pressing edge E1. The spring holding bracket 50 presses the leaf spring 40 at the pressing edges E1 to E6.

  On the lower surface 50b of the spring retainer bracket 50, attachment pins 69 of the leaf spring 40 are formed at both ends in the X-axis direction. Then, a mounting through hole 48 (see FIG. 7 or the like) of the plate spring 40 is inserted into the mounting pin 69 to position the plate spring 40.

  According to such a configuration of the spring pressing bracket 50, the plate spring 40 disposed on the upper side of the semiconductor modules 30 to 32 is held by the plate spring holding portion 53 formed on the lower surface 50 b of the spring pressing bracket 50. At this time, the leaf spring 40 is pressed and deformed from above by the spring retainer bracket 50 being fastened and fixed to the cooler 20. Thereby, each of the semiconductor modules 30 to 32 is fixed by being pressed downward by the downward urging force received from the leaf spring 40.

  As shown in FIG. 1 etc., the distance between the pressing edge E1 of the leaf spring pressing portion 57 of the spring holding bracket 50 and the center of the central portion 41a of the leaf spring 40 is L1. Similarly, the distance between one pressing edge E2 of the leaf spring pressing portion 58 and the center of the central portion 41a is L2, and the distance between the other pressing edge E3 of the leaf spring pressing portion 58 and the center of the central portion 41b is as follows. L3, the distance between one pressing edge E4 of the leaf spring pressing portion 59 and the center of the central portion 41b is L4, and the distance between the other pressing edge E5 of the leaf spring pressing portion 59 and the center of the central portion 41c is L5, and the distance between the pressing edge E6 of the leaf spring pressing portion 60 and the center of the central portion 41c is L6.

  Since the spring retainer bracket 50 applies a pressing force to the semiconductor modules 30 to 32 via the leaf springs 40, the dimensions thereof are set according to the dimensions and the number of the semiconductor modules 30 to 32 in the same manner as the cooler 20. Is done. The control circuit board 80 is electrically connected to the control signal pins 37 of the semiconductor modules 30 to 32. A spring retainer bracket 50 made of a metal plate such as aluminum is positioned between the control circuit board 80 and the semiconductor modules 30 to 32, and the spring retainer bracket 50 functions as a shield material. That is, the spring retainer bracket 50 also serves as a shield material. In particular, in this embodiment, as shown in FIG. 1 and the like, the spring retainer bracket 50 substantially covers the entire semiconductor modules 30 to 32, so that the shielding effect is strong.

  The semiconductor device 10 is assembled so that the cooler 20, the semiconductor modules 30 to 32, the leaf spring 40, and the spring retainer bracket 50 are stacked in this order from below, and the control circuit board 80 is mounted on the spring retainer bracket 50. It is done. The semiconductor device 10 is fixed in a state where the semiconductor modules 30 to 32 are pressed against the upper surface of the cooler 20 by the action of the leaf spring 40 and the spring holding bracket 50. In the semiconductor device 10, the semiconductor modules 30 to 32 are cooled by the action of the cooler 20.

Next, the operation of the semiconductor device 10 configured as described above will be described.
When the spring retainer bracket 50 is fastened to the cooler 20 by the screw 70, a load is generated in the semiconductor modules 30 to 32. In the spring retainer bracket 50, the press edges E <b> 1 to E <b> 6 serve as force points for applying a load to the leaf spring 40. By changing the distances L1 to L6 between the pressing edges E1 to E6 and the centers of the central portions 41a to 41c of the leaf spring 40, the load on each of the semiconductor modules 30 to 32 can be adjusted. For example, if the lengths W1 to W4 in the X-axis direction are increased without changing the center positions of the leaf spring pressing portions 57 to 60, the distances L1 to L6 are all reduced, so that the leaf spring 40 can be warped upward. Decreases overall and the load increases.

  Further, the extending portions 44 and 47 at both ends in the X-axis direction of the leaf spring 40 receive a load only from the single pressing edges E1 and E6, respectively, so that they are in a cantilever state. Since the load is received from the pressing edges E2, E3 and E4, E5, the beam is in a doubly supported state. In this case, the load is relatively small at the pressing edges E1 and E6 in the cantilever state, but by designing the distances L1, L2, L5 and L6 to be smaller than the distances L3 and L4 according to the load, the cantilever It is possible to compensate for the load reduction due to the state.

  In addition, when it is necessary to adjust the load generated in the semiconductor modules 30 to 32 via the leaf spring 40 by changing the shape of the spring retainer bracket 50, it is not necessary to redesign the overall shape of the spring retainer bracket 50. This can be easily achieved by changing only the axial positions of the edges E1 to E6. This is because the pressing portions 57 to 60 are provided with pressing edges E1 to E6 at end portions (one end or both ends) in the arrangement direction, and by changing the axial positions of the pressing edges E1 to E6, the pressing edges E1 to E6 and This is because the distances L1 to L6 with respect to the centers of the central portions 41a to 41c of the leaf spring 40 change, and the load generated via the leaf spring 40 regularly changes accordingly.

  Further, as shown in FIG. 8 and the like, the heights of the upper ends of the bosses 62, 63, 66, 67 closer to the center are lower than the heights of the upper ends of the peripheral bosses 61, 64, 65, 68 by ΔH. As a result, the upward warping of the spring retainer bracket 50 can be absorbed, and the flatness of the control circuit board 80 can be ensured during assembly. The difference in height ΔH between the upper ends of the central bosses 62, 63, 66, 67 and the upper ends of the peripheral bosses 61, 64, 65, 68 is determined when the semiconductor device 10 and the control circuit board 80 are assembled. A person skilled in the art can appropriately determine the warp of the spring retainer bracket 50.

  Even if the adjustment of the height difference ΔH is taken into consideration, the pressing force may be unbalanced between the semiconductor modules 30 and 32 at both ends and the semiconductor module 31 at the center. In such a case, the load can be made uniform by changing the distances L1 to L6.

  Moreover, since the spring retainer bracket 50 is fixed to the cooler 20 through the through hole 52a of the flange 52 provided at the peripheral portion, a boss or a boss or the like is provided on the central portion of the cooler 20 or the semiconductor modules 30 to 32. There is no need to provide a through hole or the like, and the degree of freedom of the configuration of the cooler 20 and the semiconductor modules 30 to 32 is increased. For example, when the cooler 20 is a water-cooled type, it is provided with a cavity for the flow of cooling water. Therefore, when a boss is provided in the central portion, additional consideration is required in terms of strength, and the degree of freedom is limited. Is done.

  In the first embodiment described above, the following modifications can be made.

  In the first embodiment, three semiconductor modules are used. However, the number of the semiconductor modules is not limited and can be changed as appropriate according to the specification (use) of the semiconductor device. The same applies to the leaf spring 40, as long as the number of body portions corresponding to the number of semiconductor modules is formed.

The cooler 20 is not limited to a water-cooled type, and may be an air-cooled heat sink, a heat sink (block), or the like.
In the first embodiment, the silicone grease 33 is used between the semiconductor modules 30 to 32 and the cooler 20, but other heat conducting members such as a heat radiating sheet may be used.

  In the first embodiment, the spring retainer bracket 50 is fastened and fixed to the cooler 20, but the structure for fixing is not limited thereto. For example, the cooler may be fixed to the case, and the spring holding bracket 50 may be fixed to the case. Moreover, you may fix by caulking etc. instead of screwing.

  In addition, the material, shape, and the like of the component can be appropriately changed according to the specification (use) of the semiconductor device. Further, the overall configuration of the semiconductor device can be changed as appropriate according to the specifications (uses) of the semiconductor device.

  Although eight bosses 61 to 68 are provided in the first embodiment, the number of bosses may be three or more.

In the first embodiment, four of the eight bosses 61 to 68 (bosses 62, 63, 66, 67) are arranged closer to the center, and the other four (bosses 61, 64, 65, 68) are arranged around Although arranged, the number and arrangement of the bosses may be different. Regardless of the arrangement, if the height of the upper end of each of the bosses near the center is lower than that at the highest position among the upper ends of the peripheral bosses, the control circuit board 80 as in the first embodiment. Flatness can be ensured.
More preferably, the upper ends of all the bosses 61 to 68 are configured to be the same in the state where the spring pressing bracket 50 fixes the semiconductor modules 30 to 32. Or, in a state where the spring retainer bracket 50 fixes the semiconductor modules 30 to 32, the heights of the upper ends of all the bosses 61 to 68 may be configured to fall within a predetermined range.

  In the first embodiment, four leaf spring pressing portions 57 to 60 (or four pressing regions) are provided, but the number of leaf spring pressing portions may be two or more. In particular, when one is added to the number of semiconductor modules, it is preferable because the semiconductor modules can be arranged at both ends and in the gaps of the semiconductor modules arranged in the longitudinal direction.

  In the first embodiment, the spring retainer bracket 50 covers the whole of the semiconductor modules 30 to 32, but may not necessarily cover the whole. Since the main source of noise is a switching element, a corresponding shielding function can be obtained if the shape covers at least the position or region where the switching element is arranged in the semiconductor module. That is, when the spring retainer bracket 50 and the semiconductor modules 30 to 32 are projected in the thickness direction (Z-axis direction), the spring retainer bracket 50 extends to positions corresponding to all the switching elements included in the semiconductor modules 30 to 32. Any shape can be used.

  DESCRIPTION OF SYMBOLS 10 Semiconductor device, 20 Cooler, 30-32 Semiconductor module, 33 Silicone grease, 40 Leaf spring (41a-41c center part, 42a-42c both sides, 43a-43c main body part, 44-47 extending | stretching part, 48 Through for attachment Hole), 50 bracket (plate spring pressing member), 50a upper surface (one surface), 50b lower surface (the other surface), 52 flange (fixing structure for fixing the leaf spring pressing member to the cooler), 52a through hole 53, leaf spring holding portion, 54-56 recess, 57-60 leaf spring pressing portion (pressing area), 61-68 boss (projection), 69 mounting pin, 70 screw, 80 control circuit board (external structure), 90 screws, E1-E6 pressing edges.

Claims (8)

A leaf spring pressing member used for fixing a semiconductor module,
The leaf spring pressing member is a shape having both sides,
A projection for fixing an external structure to the leaf spring pressing member is provided on one of the two surfaces,
A leaf spring pressing member comprising a pressing area for pressing the leaf spring on the other surface of the both surfaces. Comprising three or more of the protrusions;
2. The leaf spring pressing member according to claim 1, wherein the height of the upper end of the protrusion disposed closer to the center is lower than the height of the upper end of the protrusion disposed near the one surface.   3. The leaf spring pressing member according to claim 2, wherein heights of upper ends of all the protrusions are the same in a state where the leaf spring pressing member fixes the semiconductor module. Comprising two or more pressing areas arranged in a predetermined direction;
Each of the pressing areas has pressing edges at both ends in the predetermined direction,
The leaf spring pressing member according to any one of claims 1 to 3, wherein the leaf spring pressing member presses the leaf spring at the pressing edge.   The said leaf | plate spring press member and the said semiconductor module are extended in the position corresponding to all the switching elements contained in the said semiconductor module when the said semiconductor module is projected in the thickness direction. The leaf | plate spring press member as described in any one of these.   The said leaf | plate spring is a leaf | plate spring press member as described in any one of Claims 1-5 which urges | biases the said semiconductor module toward a cooler.   The leaf spring pressing member according to claim 6, further comprising a fixing structure for fixing the leaf spring pressing member to the cooler at a peripheral portion.   A semiconductor device comprising the leaf spring pressing member according to claim 1, the semiconductor module, and the leaf spring.

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