JP2014049249A - Lamp fitting unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology for improving the position accuracy between a light source and an optical member.SOLUTION: A lamp fitting unit includes: a circuit board 36 on which a semiconductor light emitting element 38 is mounted; and a reflection member 82 fixed to the circuit board 36. In the circuit board 36, a pin 100 for an optical member, which is made of a material different from a base material of the circuit board 36, is provided on a placement surface 36g on which the reflection member 82 is placed. In the reflection member 82, a round hole 90a is provided at a position corresponding to the pin 100 for the optical member. The pin 100 for the optical member is inserted into the round hole 90a thereby positioning the reflection member 82 relative to the circuit board 36.

Description

  The present invention relates to a lamp unit.

  Conventionally, development of a vehicular lamp using a semiconductor light emitting element such as a light emitting diode (hereinafter referred to as “LED” as appropriate) has been underway. For example, an optical unit for a vehicle lamp has been devised that reflects light from a semiconductor light-emitting element by a reflector and irradiates the vehicle forward through a projection lens (see Patent Document 1).

JP 2012-59642 A

  In the aforementioned optical unit, the reflector is fixed to the heat sink, and the light source module is fixed to the heat sink. In this optical unit, the reflector is positioned on the heat sink via the base portion and the light source module is positioned on the heat sink in order to improve the light distribution pattern formation accuracy.

  However, since the light source module and the reflector are not directly positioned, there is room for further improvement from the viewpoint of the accuracy of forming the light distribution pattern.

  This invention is made | formed in view of such a condition, The place made into the objective is to provide the technique which can further improve the positioning accuracy between a light source and an optical member.

  In order to solve the above problems, a lamp unit according to an aspect of the present invention includes a substrate on which a light source is mounted and an optical member fixed to the substrate. The substrate is provided with optical member pins made of a material different from the base material of the substrate on the mounting surface on which the optical member is mounted, and the optical member has pin holes at positions corresponding to the optical member pins. It is provided, and positioning with respect to a board | substrate is made | formed by inserting a pin in this pin hole.

  According to this aspect, since the optical member is directly positioned with respect to the substrate on which the light source is mounted, the positioning accuracy between the light source and the optical component is improved.

  You may further provide the heat radiating member to which a board | substrate is fixed. The substrate is provided with a heat radiating member pin made of a material different from the base material of the substrate on a surface opposite to the mounting surface and facing the heat radiating member, and the heat radiating member corresponds to the heat radiating member pin. A pin hole may be provided at the position, and positioning with respect to the substrate may be performed by inserting a pin for heat dissipation member into the pin hole. Thereby, the positioning accuracy between a board | substrate and a thermal radiation member improves. Further, it is not necessary to provide positioning pins on the heat dissipation member.

  The optical member pin may penetrate to the surface opposite to the mounting surface and be integrated with the heat dissipation member pin. Thereby, since the optical member and the heat radiating member can be positioned with respect to the substrate with the optical member pins, the structure for positioning can be simplified.

  The optical member pin may be a columnar heat transfer member press-fitted into a hole formed in the substrate. Thereby, the heat generated by the light source can be easily released to the optical member, the heat radiating member, and the like.

  The optical member pin may have a taper angle of 1.0 ° or less. Thereby, the change of the diameter by the height of the pin for optical members becomes small, and the freedom degree of the position at the time of positioning an optical member with respect to the pin for optical members improves.

  It should be noted that any combination of the above-described constituent elements and a representation of the present invention converted between a method, an apparatus, a system, etc. are also effective as an aspect of the present invention.

  According to the present invention, the positioning accuracy between the light source and the optical member can be further improved.

It is a schematic longitudinal cross-sectional view of the vehicle lamp which concerns on 1st Embodiment. It is a front view of the light emitting module shown in FIG. It is a front view of the reflective member concerning a 1st embodiment. It is principal part sectional drawing for demonstrating the positioning structure which concerns on 1st Embodiment. It is principal part sectional drawing for demonstrating the positioning structure which concerns on 2nd Embodiment.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and repeated descriptions are omitted as appropriate.

(First embodiment)
FIG. 1 is a schematic longitudinal sectional view of a vehicular lamp according to a first embodiment. FIG. 2 is a front view of the light emitting module 34 shown in FIG. FIG. 3 is a front view of the reflecting member 82 according to the first embodiment. A vehicle lamp 10 shown in FIG. 1 functions as a headlamp used in a vehicle.

  The vehicular lamp 10 is disposed at both left and right ends of the front portion of the vehicle body. As shown in FIG. 1, the vehicular lamp 10 includes a lamp body 12 that is open at the front, and a front cover 14 that is attached to the front portion of the lamp body 12 that is open. The lamp body 12 and the front cover 14 constitute a lamp housing 16, and a lamp chamber 18 is formed inside the lamp housing 16.

  A lamp unit 20 is disposed in the lamp chamber 18. The lamp unit 20 is configured to form a high beam light distribution pattern. A holding member 22 is disposed in the lamp chamber 18. The optical axis adjusting mechanism 24 is configured to move the holding member 22 so as to be tiltable in the left-right direction and the front-rear direction. The holding member 22 is formed of a metal material having high thermal conductivity and has a base portion 26 facing in the front-rear direction. The holding member 22 functions as a part of a heat sink that is a heat radiating member.

  The base portion 26 is provided with supported portions 28, 28, 28 (only two supported portions 28, 28 are shown in FIG. 1) at both upper and lower ends. Radiation fins 30 are provided on the rear surface of the base portion 26 so as to protrude rearward. A heat radiating fan 32 is attached to the rear surface of the heat radiating fin 30.

  A light emitting module 34 is attached from the central part to the upper part of the front surface of the base part 26.

  As shown in FIG. 2, the light emitting module 34 includes a circuit board 36, a plurality of semiconductor light emitting elements 38, and two power supply connectors 40a and 40b.

  As shown in FIG. 2, the circuit board 36 includes an upper part 36a and a lower part 36b. On the left and right side portions of the circuit board 36, a notch portion 36c is formed at one location between the upper side portion 36a and the lower side portion 36b.

  On the circuit board 36, power supply connectors 40a and 40b are disposed on the upper side 36a, and a plurality of semiconductor light emitting elements 38 are disposed on the lower side 36b.

  The semiconductor light emitting elements 38 function as a planar light source that emits light, and are provided side by side in the left-right direction with the light emitting surface facing the front of the vehicle. The semiconductor light emitting element 38 is preferably, for example, an LED element, an LD (Laser Diode) element, an EL (Electro-Luminescence) element, or the like. In the present embodiment, a total of 22 LED arrays are formed, 22 in the horizontal direction and 1 in the vertical direction. In addition, the semiconductor light emitting device 38 according to the present embodiment has a fluorescent layer formed on the LED chip, and is configured to emit white light. In the LED array, a plurality of elements may be arranged in the vertical direction.

  As shown in FIG. 2, the power feeding connectors 40 a and 40 b are arranged at the upper end of the upper part 36 a and are connected to the semiconductor light emitting element 38 by a power feeding circuit 42 formed on the circuit board 36. The power feeding circuit 42 includes a plurality of wiring patterns corresponding to the respective semiconductor light emitting elements 38.

  A connector portion of a wiring cord 48 connected to a control circuit 46 provided in the lamp chamber 18 is connected to the power supply connectors 40a and 40b. Therefore, power is supplied from the control circuit 46 to each semiconductor light emitting element 38 via the wiring cord 48, the power supply connector 40, and the power supply circuit 42. The control circuit 46 controls turning on / off of the plurality of semiconductor light emitting elements 38 included in the light emitting module 34 for each group.

  Next, other members of the vehicular lamp 10 will be described. As shown in FIG. 1, the lower reflector 50 is disposed below the semiconductor light emitting element 38 mounted on the light emitting module 34, and the upper reflector 52 is disposed above the semiconductor light emitting element 38. . The lower reflector 50 has a reflection surface 50a facing substantially upward on the semiconductor light emitting element 38 side. The reflective surface 50a is formed to be a paraboloid, for example. The upper reflector 52 has a reflecting surface 52a facing substantially downward on the semiconductor light emitting element 38 side. The reflection surface 52a is formed to be a hyperboloid, for example.

  The reflecting surface 50a and the reflecting surface 52a reflect the light emitted from each semiconductor light emitting element 38 toward the front. In the present embodiment, the lower reflector 50 and the upper reflector 52 are integrated as a reflecting member to be described later.

  A shade driving mechanism 56 that drives the movable shade 54 is disposed below the circuit board 36. The shade drive mechanism 56 includes a drive motor 58, a transmission mechanism (not shown) such as a gear, and a flat cable 60.

  The connector 57 of the drive motor 58 is connected to the control circuit 46 by a flat cable 60. Then, electric power is supplied from the control circuit 46 to the drive motor 58 via the flat cable 60.

  The movable shade 54 is a position on the relatively rear side, is a shielding position C that shields light incident on the lower reflector 50, and is a position on the relatively front side, and is in a shielding state with respect to the lower reflector 50. It rotates between the retracted position O to be released. Then, the incident state of the light emitted from the semiconductor light emitting element 38 and incident on the lower reflector 50 is controlled according to the position of the movable shade 54.

  That is, when the movable shade 54 is at the shielding position C, the reflecting surface 50a of the lower reflector 50 is covered. On the other hand, when the movable shade 54 is at the retracted position O, the light emitted from the semiconductor light emitting element 38 toward the reflecting surface 50a is not shielded. Thereby, the lamp unit 20 can form the high beam light distribution pattern and the partial high beam light distribution pattern in which a part thereof is shielded.

  A lens holder 62 is attached to the front surface of the base portion 26. A projection lens 64 is attached to the front end portion of the lens holder 62. The projection lens 64 is formed in a substantially hemispherical shape, and is arranged so that the convex portion faces forward. The projection lens 64 has a function as an optical member for irradiating and projecting the light emitted from the light emitting module 34 by inverting the image on the focal plane including the rear focus. The projection lens 64 is housed in the lamp body 12 together with the light emitting module 34. Extension reflectors 65 a and 65 b are provided above and below the projection lens 64.

  The optical axis adjusting mechanism 24 has two aiming screws 66 and 68. The aiming screw 66 is disposed on the upper rear side of the lamp chamber 18, and includes a rotation operation part 66a and a shaft part 66b extending forward from the rotation operation part 66a. A thread groove 66c is formed at the front end of the shaft portion 66b.

  The aiming screw 66 is rotatably supported at the rear end portion of the lamp body 12 by the rotation operation portion 66 a and the thread groove 66 c is screwed into the supported portion 28 at the upper portion of the holding member 22. When the rotation operation portion 66a is operated and the aiming screw 66 connected to the supported portion 28 rotates, the holding member 22 is tilted with the other supported portion 28 as a fulcrum in a direction corresponding to the rotation direction, and the lamp unit. 20 optical axis adjustments (aiming adjustments) are performed. The aiming screw 68 has a similar function.

  Next, each part which comprises the lamp unit 20 is explained in full detail.

(Circuit board)
As shown in FIG. 2, the circuit board 36 is provided with a notch 36 c at each of the right side 36 d and the left side 36 e. Two round holes 78a and 78b penetrating the circuit board 36 are formed in the right side portion 36d. An optical member pin to be described later is inserted into the round hole 78a, and a heat dissipation member pin to be described later is inserted into the round hole 78b. Further, two round holes 80a and 80b penetrating the circuit board 36 are formed in the left side portion 36e. An optical member pin to be described later is inserted into the round hole 80a, and a heat dissipation member pin to be described later is inserted into the round hole 80b.

(Reflective member)
The reflection member 82, which is one of the optical members, is a part that is integrally manufactured by injection molding using a thermoplastic resin such as high heat polycarbonate (PC-HT) as a material. The reflecting member 82 is made of a material whose base is transparent. The substrate is preferably made of a material having a transmittance of 80% or more.

  The reflecting member 82 includes a central reflecting portion 84 in which the lower reflector 50 and the upper reflector 52 are provided, and a pair of fixing portions 86 a and 86 b provided at both ends of the central reflecting portion 84.

  The lower reflector 50 has a metal reflective film such as aluminum formed on at least a part of the surface including the reflective surface 50a. Similarly, the upper reflector 52 has a metal reflection film such as aluminum formed on at least a part of the surface including the reflection surface 52a. The fixing portions 86 a and 86 b press the right side portion 36 d and the left side portion 36 e of the light emitting module 34 when the light emitting module 34 is fixed to the circuit board 36.

  The fixing portion 86a is formed with a penetrating round hole 90a so that an optical member pin to be described later can be fitted. Similarly, an elongated hole 90b is formed in the fixing portion 86b so that an optical member pin to be described later can be fitted.

(Positioning of circuit board and reflecting member)
Next, positioning of the circuit board 36 and the reflecting member 82 will be described. FIG. 4 is a cross-sectional view of a main part for explaining the positioning structure according to the first embodiment. Hereinafter, a case where there are a pair of optical member pins and heat radiation member pins will be described.

  The lamp unit 20 according to the present embodiment includes a circuit board 36 on which a semiconductor light emitting element 38 that is a light source is mounted, and a reflection member 82 as an optical member fixed to the circuit board 36. The circuit board 36 is provided with the optical member pins 100 made of a material different from aluminum nitride which is a base material of the circuit board 36 on the mounting surface 36g on which the reflecting member 82 is mounted. The fixing portion 86 a of the reflecting member 82 is provided with a round hole 90 a as a pin hole at a position corresponding to the optical member pin 100. Similarly, the fixing portion 86 b is provided with a long hole 90 b as a pin hole at a position corresponding to the optical member pin 100.

  The reflecting member 82 is positioned with respect to the circuit board 36 by inserting the optical member pins 100 into the round holes 90a and the elongated holes 90b, respectively. Thereby, since the reflecting member 82 is directly positioned with respect to the circuit board 36 on which the semiconductor light emitting element 38 is mounted, the positioning accuracy between the semiconductor light emitting element 38 and the reflecting member 82 is improved. As a result, a light distribution pattern can be formed with high accuracy.

  The lamp unit 20 according to the present embodiment further includes a base portion 26 and heat radiating fins 30 as heat radiating members to which the circuit board 36 is fixed. The circuit board 36 is provided with a heat radiating member pin 102 made of a material different from the aluminum nitride which is the base material of the circuit board 36 on the back surface 36f opposite to the mounting surface 36g of the light source and facing the base portion 26. Yes. The base part 26 which is one of the heat radiating members is provided with a round hole 76a as a pin hole at a position corresponding to the heat radiating member pin 102, and the heat radiating member pin 102 is inserted into the round hole 76a. Thus, positioning with respect to the circuit board 36 is performed. The base portion 26 is provided with a long hole 76b at a position corresponding to the round hole 80b of the circuit board 36, and the circuit board 36 can be obtained by inserting another heat radiation member pin 102 into the long hole 76b. Positioning with respect to is performed. Thereby, the positioning accuracy between the circuit board 36 and the pin 102 for heat radiating members improves. Further, it is not necessary to provide positioning pins on the base portion 26, and the shape of the base portion 26 can be simplified.

  The optical member pins 100 and the heat radiation member pins 102 according to the present embodiment are columnar heat transfer members (copper or aluminum) press-fitted into holes formed in the circuit board 36. Thereby, the heat generated by the semiconductor light emitting element 38 is easily released to the outside through the reflecting member 82, the base portion 26 on the back surface 36 f side of the circuit board 36, the radiation fins 30, and the like.

  The optical member pin 100 and the heat radiation member pin 102 have a taper angle of 1.5 ° or less, more preferably 1.0 ° or less. That is, the optical member pin 100 and the heat dissipation member pin 102 have small changes in diameter due to height. Thereby, even if the position in the height direction where the optical member pin 100 contacts the inner edge of the round hole 90a of the fixing portion 86a is slightly deviated from the design ideal value, the reflecting member 82 is placed on the circuit board 36. The horizontal deviation from the surface 36g can be small. Therefore, the positioning accuracy of the reflecting member 82 with respect to the circuit board 36 (particularly, the positioning accuracy in the direction horizontal to the mounting surface 36g of the circuit board 36) is improved. Similarly, the positioning accuracy of the base portion 26 and the radiation fin 30 with respect to the circuit board 36 (particularly, positioning accuracy in a direction horizontal to the back surface 36f of the circuit board 36) is improved.

  In normal resin molding or die-cast molding, it is difficult to make the draft angle from the mold 1.5 ° or less. However, a pin having a small taper angle can be easily realized by preparing a rod-like heat transfer member in advance and forming it in the hole like the pin according to the present embodiment.

(Second Embodiment)
FIG. 5 is a cross-sectional view of a main part for explaining the positioning structure according to the second embodiment.

  In the present embodiment, the round hole 106 a and the long hole 106 b of the base portion 26 are provided at positions corresponding to the round holes 78 a and 78 b that penetrate the circuit board 36. The optical member pin 104 penetrates to the back surface 36f opposite to the mounting surface 36g, and is integrated with the heat radiation member pin for positioning the base portion 26 and the heat radiation fin 30. Thereby, the positioning of the reflecting member 82 with respect to the circuit board 36 and the positioning of the heat radiating members (the base portion 26 and the heat radiating fins 30) with respect to the circuit board 36 can be performed by the optical member pins 104, so the structure for positioning is simplified Can be

  As described above, the lamp unit according to each embodiment further improves the positioning accuracy between the light source and the optical member because the optical member is positioned with respect to the circuit board without using the heat dissipation member. it can.

  In the case of the circuit board 36 made of ceramics such as aluminum nitride, it is difficult to integrally form a complicated shape. However, a complicated shape can be easily realized by forming a positioning pin by fitting another member of a columnar shape (such as a cylinder or a prism) into a hole in the circuit board.

  Further, when glass epoxy resin is used as the circuit board 36, the semiconductor light emitting device mounted on the circuit board 36 is provided by providing the optical member pins 100 and the heat radiating member pins 102, which are heat transfer members. The heat dissipation of the element 38 can be improved.

  As described above, the optical member pin 100 and the heat dissipation member pin 102 can serve as a heat dissipation member and a positioning role. Moreover, since the heat dissipation member pin 102 enters the holes formed in the base portion 26 and the heat dissipation fins 30 that are heat dissipation members and contacts the wall surfaces of the holes, the heat of the semiconductor light emitting element 38 can be efficiently dissipated.

  Further, since the optical member pin 100 and the heat dissipation member pin 102 are provided on the circuit board 36, it is not necessary to provide positioning pins on the optical member and the heat dissipation member.

  As described above, the present invention has been described with reference to the above-described embodiments. However, the present invention is not limited to the above-described embodiments, and the configurations of the embodiments are appropriately combined or replaced. Those are also included in the present invention. Further, it is possible to appropriately change the combination and processing order in each embodiment based on the knowledge of those skilled in the art and to add various modifications such as various design changes to each embodiment. Embodiments to which is added can also be included in the scope of the present invention.

  For example, the LED array may have a matrix arrangement of m × n (m and n are integers of 2 or more).

  DESCRIPTION OF SYMBOLS 10 Vehicle lamp, 20 Lamp unit, 26 Base part, 30 Radiation fin, 34 Light emitting module, 36 Circuit board, 36f Back surface, 36g Mounting surface, 38 Semiconductor light emitting element, 50 Lower reflector, 52 Upper reflector, 64 Projection lens 76a, 78a Round hole, 82 Reflective member, 90a Round hole, 100 Optical member pin, 102 Radiation member pin, 104 Optical member pin.

Claims (5)

A substrate on which a light source is mounted;
An optical member fixed to the substrate,
The substrate is provided with optical member pins made of a material different from a base material of the substrate on a mounting surface on which the optical member is mounted.
The optical member is provided with a pin hole at a position corresponding to the optical member pin, and the optical member is positioned with respect to the substrate by being inserted into the pin hole.
A lamp unit characterized by that. A heat dissipating member to which the substrate is fixed;
The substrate is provided with a heat dissipation member pin made of a material different from the base material of the substrate on the surface opposite to the mounting surface and facing the heat dissipation member,
The heat dissipating member is provided with a pin hole at a position corresponding to the heat dissipating member pin, and the heat dissipating member pin is inserted into the pin hole to be positioned with respect to the substrate.
The lamp unit according to claim 1.   The said optical member pin penetrates to the surface on the opposite side to the said mounting surface, and is integrated with the said heat radiating member pin, The lamp unit of Claim 2 characterized by the above-mentioned.   The lamp unit according to any one of claims 1 to 3, wherein the optical member pin is a columnar heat transfer member press-fitted into a hole formed in the substrate.   The lamp unit according to any one of claims 1 to 4, wherein the optical member pin has a taper angle of 1.0 ° or less.

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