JP2008098185A - Vehicular lighting fixture - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vehicular lighting fixture capable of properly forming a light distribution pattern. <P>SOLUTION: This vehicular lighting fixture used for vehicles is provided with a light source module to generate light, an optical member to irradiate the light generated by the light source module to the outside of the vehicular lighting fixture, and a light source fixing part to fix the light source module at a reference position where its relative position to the optical member is known. The light source module has a reference part fixed in accordance with the reference position when the light source module is fixed to the light source fixing part, a semiconductor light emitting element to generate light from a light emitting region having at least one linear boundary, and a holding part to hold the semiconductor light emitting element with the linear boundary aligned to a position where its relative position to the reference part is known. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a vehicular lamp. In particular, the present invention relates to a vehicular lamp used in a vehicle.

In a vehicular lamp such as a vehicular headlamp, it may be necessary to form a light distribution pattern with high accuracy from a safety standpoint. This light distribution pattern is formed by an optical system using, for example, a reflecting mirror or a lens (see, for example, Patent Document 1). In recent years, use of a semiconductor light emitting element for a vehicle headlamp has been studied.
JP-A-6-89601 (pages 3-7, FIG. 1-14)

  In the optical design for forming the light distribution pattern, it may be necessary to consider the shape of the light emitting region of the light source. Further, the semiconductor light emitting element generates light from a light emitting region having a predetermined spread, such as the entire surface. Therefore, when a semiconductor light emitting element is used for a vehicle headlamp, the optical design is complicated, and it may be difficult to form an appropriate light distribution pattern.

  In order to solve the above-described problems, in the first embodiment of the present invention, a vehicle lamp used in a vehicle, the light source module for generating light, and the light generated by the light source module are connected to the outside of the vehicle lamp. An optical member that irradiates the light source, and a light source fixing part that fixes the light source module at a reference position whose relative position with respect to the optical member is known. A reference portion that is fixed in accordance with the light emitting region, a semiconductor light emitting element that emits light from a light emitting region having at least one linear boundary, and the relative position of the linear boundary with respect to a reference portion that is known. And a holding portion for holding the semiconductor light emitting element.

  The optical member projects the shape of the light emitting area in front of the vehicle, and forms at least a part of a cut line that defines a light / dark boundary in the light distribution pattern of the vehicular lamp based on the shape of the linear boundary. It's okay. The reference part is one side of the holding part, the light source fixing part has a reference side indicating a reference position, and a surface including one side of the holding part is brought into contact with a surface including the reference side. Thus, the light source module may be fixed by aligning the reference portion with the reference position.

  Further, the semiconductor light emitting element generates light from a light emitting region having at least two linear boundaries that are non-parallel to each other, and the holding unit includes two sides whose relative positions with respect to the two linear boundaries are known. The light source fixing portion has two reference sides, and the surface including each of the two reference sides is brought into contact with the surface including each of the two sides of the holding portion, thereby making the reference portion a reference. It may be adjusted to the position.

  In addition, the reference portion may be a hole or a protrusion formed in the holding portion, and the light source fixing portion may have a fitting portion to be engaged with the reference portion that is a hole or a protrusion at the reference position. Further, the light source module has at least two reference parts, the light source fixing part has at least two reference parts to be fitted with each of at least two reference parts, and one of the two fitting parts is You may fit with the corresponding reference | standard part, having a play in the direction which connects the said 2 fitting part.

  The light source module has a first reference portion that is a hole or a protrusion and a second reference portion that is one side of the holding portion, and the light source fixing portion further has a reference side that indicates a reference position. Then, the reference portion may be aligned with the reference position by bringing the surface including one side of the holding portion into contact with the surface including the reference side.

  According to the second aspect of the present invention, the light source module generates light, and when the light source module is attached to a predetermined reference position, the reference portion fixed to the reference position and at least one straight line A semiconductor light emitting element that emits light from a light emitting region having a shape boundary, and a holding unit that holds the semiconductor light emitting element by aligning the linear boundary with a known position relative to the reference portion.

  The above summary of the invention does not enumerate all the necessary features of the present invention, and sub-combinations of these feature groups can also be the invention.

  Hereinafter, the present invention will be described through embodiments of the invention. However, the following embodiments do not limit the invention according to the scope of claims, and all combinations of features described in the embodiments are included. It is not necessarily essential for the solution of the invention.

  FIG.1 and FIG.2 shows an example of a structure of the vehicle lamp 10 which concerns on one Embodiment of this invention. FIG. 1 is a perspective view of a vehicular lamp 10. FIG. 2 is a horizontal sectional view of the vehicular lamp 10 by a horizontal plane crossing the middle light source unit 20. The purpose of this example is to form the light distribution pattern of the vehicular lamp 10 with high accuracy. The vehicular lamp 10 is a vehicular headlamp used for a vehicle such as an automobile, and irradiates light in front of the vehicle. The vehicular lamp 10 includes a plurality of light source units 20, a cover 12, a lamp body 14, a circuit unit 16, a plurality of heat radiation members 24, an extension reflector 28, and cables 22 and 26.

  Each of the plurality of light source units 20 includes an LED module 100, and irradiates light in a predetermined light distribution pattern forward of the vehicle based on light generated by the LED module 100. For example, the light source unit 20 is supported by the lamp body 14 so as to be tiltable by an aiming mechanism for adjusting the direction of the optical axis of the light source unit 20. The light source unit 20 may be supported by the lamp body 14 so that the direction of the optical axis when the vehicular lamp 10 is attached to the vehicle body is downward, for example, about 0.3 to 0.6 °.

  The plurality of light source units 20 may have the same or similar light distribution characteristics, or may have different light distribution characteristics. In another example, one light source unit 20 may have a plurality of LED modules 100. The light source unit 20 may have a semiconductor laser, for example, instead of the LED module 100.

  The cover 12 and the lamp body 14 form a lamp chamber of the vehicular lamp 10 and accommodate a plurality of light source units 20 in the lamp chamber. The cover 12 and the lamp body 14 may seal and waterproof the light source unit 20. The cover 12 is formed, for example, in a transparent shape by a material that transmits light generated by the LED module 100 and is provided on the front surface of the vehicle so as to cover the front of the plurality of light source units 20. The lamp body 14 is provided so as to face the cover 12 across the plurality of light source units 20 and to cover the plurality of light source units 20 from behind. The lamp body 14 may be formed integrally with the vehicle body.

  The circuit unit 16 is a module in which a lighting circuit for lighting the LED module 100 is formed. The circuit unit 16 is electrically connected to the light source unit 20 via the cable 22. Further, the circuit unit 16 is electrically connected to the outside of the vehicular lamp 10 via the cable 26.

  The plurality of heat radiating members 24 are heat sinks provided in contact with at least a part of the light source unit 20. The heat radiating member 24 is formed of a material having a higher thermal conductivity than air, such as metal. The heat radiating member 24 is movable along with the light source unit 20 within a range in which the light source unit 20 is moved with respect to a fulcrum of the aiming mechanism, for example, and is sufficient to adjust the optical axis of the light source unit 20 with respect to the lamp body 14. Provided at intervals. The plurality of heat dissipating members 24 may be integrally formed with one metal member. In this case, heat can be efficiently radiated from the entirety of the plurality of heat radiating members 24.

  The extension reflector 28 is a reflecting mirror formed from the lower part of the plurality of light source units 20 to the cover 12 by, for example, a thin metal plate. The extension reflector 28 is formed so as to cover at least a part of the inner surface of the lamp body 14, thereby concealing the shape of the inner surface of the lamp body 14 and improving the appearance of the vehicular lamp 10.

  Further, at least a part of the extension reflector 28 is in contact with the light source unit 20 and / or the heat dissipation member 24. In this case, the extension reflector 28 has a function of a heat conducting member that conducts heat generated by the LED module 100 to the cover 12. Thereby, the extension reflector 28 radiates heat from the LED module 100. A part of the extension reflector 28 is fixed to the cover 12 or the lamp body 14. The extension reflector 28 may be formed in a frame shape that covers the upper side, the lower side, and the side of the plurality of light source units 20.

  According to this example, the light source unit 20 can be reduced in size by using the LED module 100 as a light source. Moreover, since the freedom degree of arrangement | positioning of the light source unit 20 improves by this, for example, the vehicle lamp 10 with high design property can be provided.

  3 and 4 show an example of the configuration of the light source unit 20. FIG. 3 is an AA vertical sectional view of the light source unit 20. FIG. 4 is a BB vertical sectional view of the light source unit 20. The light source unit 20 is a direct light source unit that irradiates light generated by the LED module 100 to the front of the vehicle, and includes the LED module 100, the substrate 500, a fixing member 202, a lens 204, an extension 208, and a housing 206. .

  The LED module 100 is an example of a light source module that generates light. The LED module 100 is a light source that generates white light, for example, and includes a semiconductor light emitting element 102. The semiconductor light emitting element 102 generates light based on power received from the outside of the light source unit 20 via the cable 22 and the substrate 500. In this example, the semiconductor light emitting element 102 generates light with one side of the straight line as the boundary of the light emitting region. In another example, the semiconductor light emitting element 102 may generate light using, for example, an edge of a light shielding member provided on the surface as a boundary of the light emitting region. The semiconductor light emitting device 102 may generate light from a light emitting region having at least one linear boundary.

  The substrate 500 electrically connects the LED module 100 and the cable 22 by, for example, printed wiring formed on the surface or inside thereof. In this example, the substrate 500 is a plate-like body on which the LED module 100 is placed and fixed, and has a groove 804. The groove 804 accommodates a part of the LED module 100, thereby fixing the LED module 100 at a predetermined reference position. The groove 804 fixes the LED module 100 by bringing a part of the outer surface of the LED module 100 into contact with the inner wall, for example. Therefore, according to this example, the substrate 500 can fix the LED module 100 with high accuracy. The substrate 500 is an example of a light source fixing unit that fixes the LED module 100.

  In this example, at least a part of the substrate 500 is formed of a material having a higher thermal conductivity than air, such as metal. Further, at least a part of the substrate 500 is in contact with the fixing member 202. As a result, the substrate 500 transmits heat generated by the LED module 100 to the fixing member 202.

  The fixing member 202 is a plate-like body having a surface facing the front of the vehicle, for example. The fixing member 202 is provided at a position where the relative position with respect to the lens 204 is known. The fixing member 202 fixes the substrate 500 on the surface thereof so as to face the LED module 100 with the substrate 500 interposed therebetween. Thereby, the fixing member 202 fixes the LED module 100 toward the front of the vehicle, and emits light toward the front of the vehicle.

  The fixing member 202 has a groove 904. The groove 904 accommodates a part of the substrate 500, thereby fixing the substrate 500 at a predetermined position. The groove 904 fixes the substrate 500 by bringing a part of the substrate 500 into contact with the inner wall, for example. According to this example, the fixing member 202 can fix the substrate 500 with high accuracy.

  The fixing member 202 is formed of a material having a higher thermal conductivity than air, such as metal. Thereby, the fixing member 202 has a function of a heat radiating plate that radiates heat generated by the LED module 100. Further, in this example, the fixing member 202 is in contact with the housing 206 at one end, and dissipates the LED module 100 by transferring heat generated by the LED module 100 to the housing 206, for example. Thereby, it can prevent that the emitted light amount of the LED module 100 falls with heat.

  The extension 208 is formed from the vicinity of the LED module 100 to the vicinity of the edge of the lens 204 by using, for example, a thin metal plate. Thereby, the extension 208 covers and conceals the gap between the inner surface of the housing 206 and the LED module 100, and improves the appearance of the vehicular lamp 10 (see FIG. 1). The extension 208 may reflect light generated by the LED module 100.

  The housing 206 is a housing that houses the LED module 100, the substrate 500, the fixing member 202, and the extension 208. The housing 206 has an opening on the front surface, and holds the lens 204 in the opening. The housing 206 may further transfer heat received from the LED module 100 via the substrate 500 and the fixing member 202 to the heat dissipation member 24 (see FIG. 1) and / or the extension reflector 28 (see FIG. 1). Thereby, the LED module 100 can be radiated appropriately.

  The lens 204 is an example of an optical member used for the vehicular lamp 10. The lens 204 forms at least a part of the light distribution pattern by projecting the shape of the light emitting region of the semiconductor light emitting element 102 to the front of the vehicle. In this example, the lens 204 has a focal point F on one side of the semiconductor light emitting element 102 corresponding to the linear boundary in the light emitting region. In this case, for example, the lens 204 forms at least a part of a cut line that defines a light / dark boundary in the light distribution pattern based on the shape of the linear boundary. The lens 204 may irradiate the light generated by the LED module 100 to the outside of the vehicular lamp 10 (see FIG. 1).

  Here, in this example, the fixing member 202 fixes the substrate 500 with high accuracy. The substrate 500 fixes the LED module 100 with high accuracy. Thereby, the substrate 500 fixes the LED module 100 at a reference position whose relative position to the lens 204 is known. Therefore, according to this example, the LED module 100 can be fixed to the lens 204 with high accuracy.

  In this case, one side of the semiconductor light emitting element 102 can be aligned with the focal point F of the lens 204 with high accuracy. Thereby, the lens 204 can clearly form a cut line. Therefore, according to this example, the light distribution pattern can be appropriately formed with high accuracy. The focal point F is an example of an optical center for the optical member used in the light source unit 20. The optical center is an example of a design reference point for the optical member. In another example, the substrate 500 and the fixing member 202 may be integrally formed by, for example, one member.

  5, 6, and 7 show an example of the configuration of the LED module 100. FIG. 5 is a CC cross-sectional view of the LED module 100. FIG. 6 is an AA cross-sectional view of the LED module 100. FIG. 7 is a BB cross-sectional view of the LED module 100. The LED module 100 includes a semiconductor light emitting element 102, a sealing member 108, a plurality of electrodes 104, a submount 702, a plurality of bonding wires 312, and a holding unit 708.

  The semiconductor light emitting element 102 is a light emitting diode element. For example, the phosphor provided on the surface is irradiated with blue light to generate yellow light that is a complementary color of blue light. In this case, the LED module 100 generates white light based on blue light and yellow light generated by the semiconductor light emitting element 102 and the phosphor, respectively. In another example, the semiconductor light emitting device 102 may generate white light in the phosphor by irradiating the phosphor with ultraviolet light.

  In this example, the semiconductor light emitting element 102 generates light from the surface facing the direction of the lens 204 (see FIG. 3). For example, the semiconductor light emitting element 102 generates light using substantially the entire surface as a light emitting region. The semiconductor light emitting device 102 is an example of a planar light source that generates light from a planar region having a spread.

  In this example, the light emitting region of the semiconductor light emitting device 102 is a substantially square surrounded by four straight sides 310a to 310d. The length L of each side 310 may be about 1 mm, for example. In addition, the light emitting region generates light with the four sides 310a to 310d as boundaries. The light emitting region has at least two linear boundaries that are non-parallel to each other, such as the side 310b and the side 310d. In this example, the lens 204 has a focal point F at the center of the side 310d, and forms at least part of the cut line in the light distribution pattern of the vehicular lamp 10 (see FIG. 1) based on the shape of the side 310d. . The semiconductor light emitting element 102 may further generate light from, for example, an end face connected to the surface of the semiconductor light emitting element 102 with each of the sides 310a to 310d interposed therebetween.

  The sealing member 108 is a mold for sealing the semiconductor light emitting element 102, and is formed of a material that transmits white light generated by the semiconductor light emitting element 102, such as a translucent resin. In this example, at least a part of the sealing member 108 is hemispherical. In this case, the LED module 100 has, for example, an optical axis that passes through the center of the hemisphere and is perpendicular to the surface of the semiconductor light emitting element 102.

  The plurality of electrodes 104 are electrically connected to the substrate 500 (see FIG. 3), and power supplied from the outside of the light source unit 20 via the substrate 500 and the cable 22 (see FIG. 3) is supplied to the bonding wire 312 and the sub-wires. The light is supplied to the semiconductor light emitting element 102 via the mount 702. The plurality of bonding wires 312 electrically connect the plurality of electrodes 104 and the submount 702.

  The submount 702 is a plate-like body made of, for example, silicon, and fixes the semiconductor light emitting element 102 by placing it on the upper surface. The submount 702 includes wiring that electrically connects the bonding wire 312 and the semiconductor light emitting element 102, and supplies power received from the outside of the LED module 100 via the bonding wire 312 to the semiconductor light emitting element 102.

  The holding unit 708 includes a slug 704 and a body 706. The slag 704 fixes the semiconductor light emitting element 102 at a predetermined position by placing the submount 702 on the upper surface and fixing it. In this example, the slag 704 fixes the semiconductor light emitting element 102 so that the center of the side 310d of the semiconductor light emitting element 102 is aligned with the optical axis of the LED module 100 and the side 310d extends in a predetermined direction. . In addition, at least a part of the slag 704 is formed of a material having a higher thermal conductivity than air, such as metal, and transmits heat generated by the semiconductor light emitting element 102 to the outside of the LED module 100.

  The body 706 is formed so as to cover the outer periphery of the slag 704 with, for example, resin. Further, the body 706 fixes the electrodes 104 by accommodating a part of each of the plurality of electrodes 104.

  In this example, the body 706 includes a plurality of sides 402a-d. The plurality of sides 402 a to 402 d is an example of a reference portion that indicates the position of the semiconductor light emitting element 102. At least some of the plurality of sides 402 a to 402 d may be one side of the holding unit 708. In addition, when the LED module 100 is fixed to the substrate 500, at least a part of the plurality of sides 402a to 402d is fixed according to the reference position on the substrate 500.

  The body 706 is fixed to the slag 704. Accordingly, the holding unit 708 holds the semiconductor light emitting element 102 by aligning the side 310d, which is a linear boundary in the light emitting region of the semiconductor light emitting element 102, with a position whose relative position to the sides 402a to 402d is known. In this case, the plurality of sides 402a to 402d are sides whose relative positions with respect to the side 310d are known. The holding unit 708 may include at least two sides that are not parallel to each other and have known relative positions with respect to at least two linear boundaries in the light emitting region.

  According to this example, for example, by fixing the LED module 100 with at least a part of the sides 402a to 402d as a reference, the side 310d of the semiconductor light emitting element 102 can be highly accurate with respect to a predetermined reference position. It can be fixed with. In addition, as described with reference to FIGS. 3 and 4, in this example, the LED module 100 is fixed with high accuracy to a reference position whose relative position with respect to the lens 204 is known. Therefore, according to this example, one side 310d of the semiconductor light emitting element 102 can be aligned and fixed with respect to the lens 204 with high accuracy. Thereby, the vehicular lamp 10 can form a cut line with high accuracy based on the shape of the side 310d. Therefore, according to this example, the light distribution pattern can be appropriately formed. In another example, the holding unit 708 may hold the semiconductor light emitting element 102, for example, by aligning any one of the sides 310a to 310c with a position whose relative position with respect to the sides 402a to 402d is known. Also in this case, for example, the cut line can be formed with high accuracy based on the shape of any of the sides 310a to 310c.

  Hereinafter, the dimensions of the LED module 100 will be described in more detail. In this example, the holding unit 708 fixes the semiconductor light emitting element 102 on the submount 702 with reference to the position of the side 310d. The semiconductor light emitting element 102 is installed on the slag 704 and the submount 702 using, for example, an image processing technique that detects a relative position with respect to the slag 704. Accordingly, the semiconductor light emitting element 102 can be fixed by aligning the one side 310d of the semiconductor light emitting element 102 with high accuracy.

  For example, the holding unit 708 fixes the semiconductor light emitting element 102 so that the distance between the side 310d and the side 402d is a predetermined distance Y2. Here, the distance between the side 310d and the side 402d is, for example, the distance between the projected images when the side 310d and the side 402d are projected on a plane parallel to the surface of the semiconductor light emitting element 102.

  The holding unit 708 preferably fixes the side 310d by adjusting the distance to the side 402d with an accuracy that causes a position error smaller than 0.05% of the length L of one side of the semiconductor light emitting element 102. In this case, the cut line can be appropriately formed. Further, it is more preferable that the holding portion 708 fixes the side 310d with an accuracy that causes a position error smaller than 0.01% of the length L. In this case, the cut line can be formed more appropriately. For example, the holding unit 708 may fix the side 310d with a precision that results in a position error smaller than 0.01 μm.

  In another example, the holding unit 708 may fix the semiconductor light emitting element 102 so that the distance between the side 310d and the side 402c is a predetermined distance Y1. The holding unit 708 may fix the semiconductor light emitting element 102 so that the distance between the side 310c and the side 402d is a predetermined distance Y4, and the distance between the side 310c and the side 402c is a predetermined distance Y3. As described above, the semiconductor light emitting element 102 may be fixed. Note that the side 310 c is the opposite side of the side 310 d on the surface of the semiconductor light emitting element 102. The side 402c is a side facing the side 402d with the semiconductor light emitting element 102 interposed therebetween.

  Further, the holding unit 708 further fixes the semiconductor light emitting element 102 so that the distance between one end of the side 310d and the side 402b is a predetermined distance X3. The distance between one end of the side 310d and the side 402b is, for example, the distance between the side 310b that intersects the side 310d at the one end and the side 402b. In another example, the holding unit 708 may fix the semiconductor light emitting element 102 so that the distance between the other end of the side 310d and the side 402a is a predetermined distance X4.

  In addition, the holding unit 708 may fix the semiconductor light emitting element 102 so that the distance between the center of the side 310d and the side 402b or the side 402a is a predetermined distance X1 or X2. The distance between the center of the side 310d and the sides 402a and 402b is, for example, the middle point of the side 310d and the sides 402a and b when projected onto a plane parallel to the surface of the semiconductor light emitting element 102. This is the distance between the projected images.

  The holding unit 708 fixes the semiconductor light emitting element 102 so that the distance between the surface of the semiconductor light emitting element 102 and the lower surface of the body 706 is a predetermined distance Z1. The lower surface of the body 706 is, for example, a surface that includes at least a part of the plurality of sides 402 a to 402 d and is parallel to the surface of the semiconductor light emitting element 102. In another example, the holding unit 708 may fix the semiconductor light emitting element 102 so that the distance between the surface of the semiconductor light emitting element 102 and the lower surface of the slag 704 is a predetermined distance Z2. According to this example, the semiconductor light emitting element 102 can be fixed with high accuracy.

  FIG. 8 shows an example of the configuration of the substrate 500 together with the LED module 100. In this example, the substrate 500 includes a plurality of pads 504 and 506 and a groove 804.

  The plurality of pads 506 are connected to the plurality of electrodes 104 of the LED module 100 by, for example, soldering. The plurality of pads 504 are connected to the cable 22 by, for example, soldering, and are electrically connected to the plurality of pads 506 by, for example, printed wiring formed on the surface or inside of the substrate 500. Thereby, the board | substrate 500 electrically connects the cable 22 and the LED module 100. FIG.

  The groove 804 fixes the LED module 100 by accommodating a part of the holding portion 708. In this example, the groove 804 has a plurality of sides 502a to 502c. The plurality of sides 502 a to 502 c are examples of reference sides that indicate reference positions where the LED module 100 should be attached. The groove 804 fixes the LED module 100 to the reference position by contacting the outer surface of the holding portion 708 including each of the sides 402a to c with the inner wall surface including each of the sides 502a to 502c. The substrate 500 may fix the LED module 100 by aligning the sides 402a to 402c with the reference position. According to this example, the LED module 100 can be fixed with high accuracy. Thereby, the semiconductor light emitting device 102 can be fixed with high accuracy.

  The substrate 500 has sides 802a to 802d on the side surfaces and is fixed to the fixing member 202 (see FIG. 3) with at least a part of the sides 802a to 802d as a reference. The fixing member 202 fixes the substrate 500 by, for example, contacting the side surface of the substrate 500 including each of the sides 802a to 802c with the inner wall surface of the groove 904 (see FIG. 3). In this case, the fixing member 202 can fix the substrate 500 with high accuracy. Therefore, according to this example, for example, the LED module 100 can be fixed with high accuracy at a reference position whose relative position with respect to the lens 204 (see FIG. 3) is known. Thereby, the vehicular lamp 10 (see FIG. 1) can appropriately form the light distribution pattern.

  FIG. 9 is a conceptual diagram showing an example of a light distribution pattern 300 formed by the vehicular lamp 10 (see FIG. 1). The light distribution pattern 300 is a low beam light distribution pattern formed on a virtual vertical screen arranged at a position 25 m ahead of the vehicular lamp 10. In this example, the vehicular lamp 10 includes a horizontal cut line 302 that defines a light / dark boundary in a substantially horizontal direction, and a diagonal cut line 304 that defines a light / dark boundary in a predetermined diagonal direction that forms an angle of about 15 ° with respect to the horizontal direction. The light distribution pattern 300 is formed.

  In this example, the vehicular lamp 10 includes a plurality of light source units 20 having different light distribution characteristics, and forms a light distribution pattern 300 based on light generated by each light source unit 20. In this case, each light source unit 20 forms a partial region in the light distribution pattern 300. For example, the light source unit 20 described with reference to FIGS. 3 and 4 forms a partial region 306 of the light distribution pattern 300.

  Hereinafter, the light distribution characteristics of the light source unit 20 described with reference to FIGS. 3 and 4 will be described in more detail. In this example, the lens 204 in the light source unit 20 projects the shape of the light emitting area of the semiconductor light emitting element 102 to the front of the vehicle by irradiating the light generated by the semiconductor light emitting element 102 forward, thereby forming the area 306. To do. The lens 204 may enlarge and project the shape of the light emitting area in the horizontal direction.

  Here, in this example, the lens 204 has a focal point F on the side 310 d of the semiconductor light emitting element 102. The side 310d is a lower side of the semiconductor light emitting element 102 that extends in the horizontal direction. The lens 204 irradiates the light generated by the semiconductor light emitting element 102 with the optical axis of the light source unit 20 intersected. Therefore, the lens 204 projects the shape of the side 310 d of the semiconductor light emitting element 102 onto the position of the upper side of the region 306.

  Further, the lens 204 forms at least a part of the upper side of the region 306 at a position where at least a part of the horizontal cut line 302 is to be formed. Accordingly, the light source unit 20 forms at least a part of the horizontal cut line 302 based on the light / dark boundary formed by the region 306.

  Here, the LED module 100 is fixed to a predetermined reference position with high accuracy using the side 402 (see FIG. 5) aligned with the side 310d. Therefore, according to this example, a clear horizontal cut line 302 can be formed based on the shape of the side 310d. Thereby, an appropriate light distribution pattern can be formed. In another example, the semiconductor light emitting device 102 may be fixed with the side 310d parallel to a predetermined oblique direction, for example. In this case, the light source unit 20 forms at least a part of the oblique cut line 304 based on the shape of the side 310d, for example.

  10 and 11 show another example of the configuration of the light source unit 20. FIG. 10 is an AA horizontal sectional view of the light source unit 20. FIG. 11 is a BB vertical sectional view of the light source unit 20. Except for the points described below, the configurations in FIG. 10 and FIG. 11 that are given the same reference numerals as those in FIG. 3 and / or FIG. 4 have the same or similar functions as the configurations in FIG. Therefore, explanation is omitted.

  In this example, the light source unit 20 includes a cover 252, a plurality of LED modules 100 a and 100 b, a plurality of substrates 500 a and 500 b, a fixing member 202, a plurality of reflecting mirrors 256 and 260, and a housing 206. The cover 252 is formed on the front surface of the light source unit 20 in a transparent shape, for example, with a material that transmits light generated by the semiconductor light emitting element 102.

  The fixing member 202 is provided with the front surface and the back surface facing the left and right direction of the vehicle. And the fixing member 202 fixes each of the some board | substrate 500a, b to each of the surface and the back surface. The fixing member 202 fixes the plurality of substrates 500a and 500b by grooves 904 provided on the front surface and the back surface, respectively.

  Each of the substrates 500a and 500b fixes each of the plurality of LED modules 100a and 100b by a groove 804 provided therein. In this case, the substrate 500a fixes the LED module 100a to a reference position whose relative position with respect to the reflecting mirror 256 is known. The substrate 500b fixes the LED module 100b to a reference position whose relative position with respect to the reflecting mirror 260 is known.

  Here, the reference position corresponding to the LED module 100a is determined in advance such that the relative position with respect to the optical center Fa is known, for example. This reference position is determined, for example, on a line segment that has a point with a known relative position with respect to the optical center Fa at one end and extends in the horizontal direction. The optical center Fa is a design reference point for the reflecting mirror 256, for example. The substrate 500a fixes the LED module 100a so that one vertex of the semiconductor light emitting element 102 in the LED module 100a is aligned with the optical center Fa. The substrate 500b fixes the LED module 100b so that the optical center Fb corresponding to the reflecting mirror 260 and one apex of the semiconductor light emitting element 102 in the LED module 100b coincide. The fixing member 202 and the substrates 500a and 500b fix the plurality of LED modules 100a and 100b with their bottom surfaces facing each other with the fixing member 202 interposed therebetween.

  Each of the plurality of reflecting mirrors 256 and 260 is formed so as to cover the corresponding LED module 100 from the rear of the vehicle, corresponding to each of the plurality of LED modules 100a and 100b. Accordingly, each of the plurality of reflecting mirrors 256 and 260 reflects light generated by the semiconductor light emitting element 102 in the corresponding LED module 100 to the front of the vehicle. The reflecting mirrors 256 and 260 are examples of optical members used in the vehicular lamp 10 (see FIG. 1). The reflecting mirrors 256 and 260 form at least a part of the light distribution pattern of the vehicular lamp 10 by irradiating the front of the vehicle with light generated by the corresponding semiconductor light emitting element 102.

  In the present example, the reflecting mirror 256 includes a plurality of light distribution steps 254a to 254f. The reflecting mirror 256 forms at least a part of an oblique cut line in the light distribution pattern of the vehicular lamp 10 based on the light reflected by the light distribution steps 254a to 254f.

  Here, each of the plurality of light distribution steps 254a to 254f is a portion divided into a rectangular shape or an obliquely trapezoidal shape in the reflecting mirror 256. The light distribution steps 254a to 254f are formed by, for example, hyperbolic paraboloids set according to the shape of the oblique cut line to be formed at each position on a predetermined paraboloid of revolution. Further, the hyperbolic paraboloid is, for example, a biplane whose substantially vertical cross section is formed by a parabola extending toward the front of the light source unit 20 and whose substantially horizontal cross section is formed by a parabola extending toward the rear of the light source unit 20. A curved paraboloid or a curved surface approximated thereto.

  The reflector 260 includes a plurality of light distribution steps 258a-d. The reflecting mirror 260 forms at least a part of a horizontal cut line in the light distribution pattern of the vehicular lamp 10 based on the light reflected by the light distribution steps 258a to 258d. The light distribution steps 258a-d may have the same or similar configuration as the light distribution steps 258a-f. According to this example, the light distribution pattern can be appropriately formed.

  FIG. 12 is a conceptual diagram showing an example of a light distribution pattern 300a formed by the reflecting mirror 256. As shown in FIG. In this example, the light distribution pattern 300a includes a plurality of regions 602a to 602f. Each of the plurality of light distribution steps 254a to 254f respectively reflects the light generated by the semiconductor light emitting element 102 in the LED module 100a (see FIG. 10), thereby forming each of the plurality of regions 602a to 602f.

  In this case, the light distribution step 254a forms a region 602a extending in a substantially horizontal direction. The light distribution steps 254b to 254f form regions 602b to 602f that extend in a predetermined oblique direction. The reflecting mirror 256 forms at least a part of the oblique cut line 304 based on the bright / dark boundary of the regions 602b to 602f.

  Here, the semiconductor light emitting element 102 is fixed so that at least one side is aligned with the optical center Fa of the reflecting mirror 256. The light distribution steps 254a to 254f are formed using the optical center Fa as a common reference point in design. Therefore, according to this example, the oblique cut line 304 can be formed with high accuracy based on the light generated by the LED module 100a. This also makes it possible to appropriately form a light distribution pattern.

  FIG. 13 is a conceptual diagram showing an example of a light distribution pattern 300b formed by the reflecting mirror 260. As shown in FIG. In this example, the light distribution pattern 300b includes a plurality of regions 604a to 604d. Each of the plurality of light distribution steps 258a to 258d reflects each of the light generated by the semiconductor light emitting element 102 in the LED module 100b (see FIG. 10), so that each of the plurality of regions 604a to 604d extending in the substantially horizontal direction is performed. Form. The reflecting mirror 260 forms at least a part of the horizontal cut line 302 based on, for example, the light / dark boundary of the region 604a.

  Here, the semiconductor light emitting element 102 is fixed so that at least one side thereof is aligned with the optical center Fb of the reflecting mirror 260. Further, the light distribution steps 258a to 258d are formed using the optical center Fb as a common reference point in design. Therefore, according to this example, the horizontal cut line 302 can be formed with high accuracy based on the light generated by the LED module 100b. This also makes it possible to appropriately form a light distribution pattern.

  FIG. 14 shows another example of the configuration of the LED module 100. Except for the points described below, in FIG. 14, the configurations denoted by the same reference numerals as those in FIGS. 5, 6, and / or 7 are the same as those in FIGS. 5, 6, and / or 7. The description is omitted because it has the same function.

  In this example, the LED module 100 includes a plurality of semiconductor light emitting elements 102. The plurality of semiconductor light emitting elements 102 are arranged side by side in a substantially square region surrounded by virtual line segments 320a to 320d. Line segments 320a to 320d are, for example, part of an envelope including one side of each of the plurality of adjacent semiconductor light emitting elements 102.

  In addition, the holding unit 708 fixes the plurality of semiconductor light emitting elements 102 by matching the distance between one line segment 320d and at least a part of the plurality of sides 402a to 402d. For example, the holding unit 708 fixes the plurality of semiconductor light emitting elements 102 so that the distance between the line segment 320d and the side 402d becomes the distance Y2 instead of the side 310d in the case described with reference to FIGS. . In another example, the holding unit 708 may hold the plurality of semiconductor light emitting elements 102 by matching the distance between any of the line segments 320b to 320d and any of the sides 402a to 402d. Also in this case, the plurality of semiconductor light emitting elements 102 can be fixed with high accuracy.

  The lens 204 (see FIG. 3) has a focal point F at the center of the line segment 320d. In this case, the lens 204 can clearly project the shape of the side of the semiconductor light emitting element 102 on the line segment 320d in front of the vehicle. The lens 204 may project the shape of the light emitting region of the semiconductor light emitting element 102 with this side as a part of the boundary. According to this example, the light distribution pattern can be appropriately formed.

  15, 16, and 17 show still another example of the configuration of the LED module 100. FIG. 15 is a cross-sectional view of the LED module 100 taken along line AA. FIG. 16 is a BB cross-sectional view of the LED module 100. FIG. 17 is a bottom view of the LED module 100. 15, 16, and 17 except for the points described below, the configurations denoted by the same reference numerals as those in FIGS. 5, 6, and / or 7 are the same as those in FIGS. 5, 6, and / or 7. Since it has the same or similar function as the configuration in FIG.

  In this example, the body 706 includes a slag housing portion 952 and an extending portion 954. The slag housing portion 952 is formed so as to cover the outer periphery of the slag 704. Thereby, the slag accommodating part 952 accommodates and fixes the slag 704.

  The extending portion 954 is formed by extending further downward from the lower end of the slag housing portion 952. Here, the downward direction is, for example, a direction from the apex of the hemispherical sealing member 108 toward the center of the hemisphere. In addition, the extending portion 954 has a substantially square hole that is recessed in a direction perpendicular to the surface of the semiconductor light emitting element 102 on the lower surface. This hole has a plurality of sides 402a to 402d in at least a part of the inner wall surface. The sides 402 a to d are an example of a reference portion that indicates the position of the semiconductor light emitting element 102. The plurality of sides 402a to 402d may be sides of the inner wall surface of the hole in the holding unit 708.

  Note that the plurality of sides 402 a to 402 d may be formed on a plane parallel to the surface of the semiconductor light emitting element 102. Moreover, the slag accommodating part 952 and the extending | stretching part 954 may be formed using the said plane as a boundary.

  Further, in this example, the holding unit 708 fixes the semiconductor light emitting element 102 by aligning the side 310d with a position whose relative position with respect to the sides 402a to 402d is known, for example. For example, the holding unit 708 fixes the semiconductor light emitting element 102 such that the distance between the side 310d and the side 402d is Y2, and the distance between one end of the side 310d and the side 402b is X3. In addition, the holding unit 708 fixes the semiconductor light emitting element 102 so that the distance between the surface of the semiconductor light emitting element 102 and the surface including the plurality of sides 402a to 402d is Z1. Also in this case, the semiconductor light emitting element 102 can be fixed with high accuracy. Thereby, the vehicular lamp 10 (see FIG. 1) can appropriately form the light distribution pattern.

  The holding portion 708 may fix the semiconductor light emitting element 102 so that the distance between the surface of the semiconductor light emitting element 102 and the lower end of the extending portion 954 is a predetermined distance Z3. In another example, similarly to the holding unit 708 described with reference to FIGS. 3 to 5, for example, the holding unit 708 matches the distance between one of the sides 310 a to 310 d and one of the sides 402 a to d. A plurality of semiconductor light emitting elements 102 may be held.

  FIG. 18 shows another example of the configuration of the substrate 500 together with the LED module 100 described with reference to FIGS. 15, 16, and 17. Except for the points described below, in FIG. 18, the components denoted by the same reference numerals as those in FIG. 8 have the same or similar functions as those in FIG.

  In this example, the substrate 500 has a plurality of convex portions 510 and 512 that protrude in a direction toward the LED module 100. The plurality of convex portions 510 and 512 are accommodated in the holes in the holding portion 708 so that the LED module 100 is aligned with the reference position. The convex portion 510 has a plurality of sides 502 a to 502 d corresponding to the plurality of sides 402 a to d on the upper surface that should face the LED module 100. The plurality of sides 502a to 502d are an example of a reference side indicating a reference position where the LED module 100 should be attached. This reference position is a position at which the relative position with respect to the lens 204 (see FIG. 3) becomes known when the fixing member 202 (see FIG. 3) fixes the substrate 500, for example.

  The convex portion 510 fixes the LED module 100 at the reference position by contacting the inner wall surface of the holding portion 708 including each of the sides 402a to d by the side surfaces including the sides 502a to 502d. Therefore, according to this example, the LED module 100 can be fixed with high accuracy.

  The convex portion 512 is formed to further protrude from the upper surface of the convex portion 510. Further, when the substrate 500 fixes the LED module 100, the upper surface of the convex portion 512 is in contact with the lower surface of the slag 704. Thereby, the convex portion 512 receives the heat generated by the semiconductor light emitting element 102 via the slag 704. According to this example, the LED module 100 can be appropriately fixed. Thereby, the vehicular lamp 10 (see FIG. 1) can appropriately form the light distribution pattern.

  19, 20, and 21 illustrate still another example of the configuration of the LED module 100. FIG. 19 is a CC cross-sectional view of the LED module 100. FIG. 20 is an AA cross-sectional view of the LED module 100. FIG. 21 is a BB cross-sectional view of the LED module 100. Except as described below, in FIG. 19, FIG. 20, and FIG. 21, the same reference numerals as those in FIG. 5, FIG. 6, and / or FIG. Since it has the same or similar function as the configuration in FIG.

  In this example, the LED module 100 has a plurality of protrusions 452a and 45b. The protrusions 452a and b protrude downward from the lower surface of the holding portion 708. The protrusions 452a and b may protrude from the lower surface of the slag 704.

  In addition, the holding unit 708 fixes the semiconductor light emitting element 102 by aligning the side 310d with a position whose relative position with respect to the protrusions 452a and 45b is known, for example. For example, the holding unit 708 fixes the semiconductor light emitting element 102 so that the distance between the side 310d and the protrusion 452a is Y2. In this case, for example, the holding unit 708 fixes the semiconductor light emitting element 102 so that the distances between one end and the other end of the side 310d and the protrusion 452a are X1 and X2. Also in this case, the semiconductor light emitting element 102 can be fixed with high accuracy. Thereby, the vehicular lamp 10 (see FIG. 1) can appropriately form the light distribution pattern.

  The protrusions 452a and 45b are an example of a reference portion that indicates the position of the semiconductor light emitting element 102. The distance between the side 310d and the protrusion 452a is, for example, the distance between the projected images when the side 310d and the central axis of the protrusion 452a are projected on a plane parallel to the surface of the semiconductor light emitting element 102. Is the distance. The distance between one end or the other end of the side 310d and the protrusion 452a is, for example, when the one end or the other end and the central axis of the protrusion 452a are projected on a plane parallel to the surface of the semiconductor light emitting element 102. Of each projected image.

  In another example, the holding unit 708 may fix the semiconductor light emitting element 102 by aligning the side 310d on a straight line connecting the plurality of protrusions 452a and 45b, for example. In addition, the holding unit 708 may fix the semiconductor light emitting element 102 by adjusting the distance between any of the sides 310a to 310d and any of the protrusions 452a and 45b.

  FIG. 22 shows still another example of the configuration of the substrate 500 together with the LED module 100 described with reference to FIGS. 19, 20, and 21. Except for the points described below, in FIG. 22, the components denoted by the same reference numerals as those in FIG. 8 have the same or similar functions as those in FIG.

  In this example, the substrate 500 has a plurality of fitting portions 552a, b provided corresponding to the plurality of protrusions 452a, b. When the board | substrate 500 fixes the LED module 100, each of several fitting part 552a, b engages with each of several protrusion 452a, b. The fitting portions 552a and 552b are provided at a reference position where the LED module 100 should be fixed. This reference position is a position at which the relative position with respect to the lens 204 (see FIG. 3) becomes known when the fixing member 202 (see FIG. 3) fixes the substrate 500, for example. Thereby, the substrate 500 can fix the LED module 100 to the lens 204 with high accuracy.

  Moreover, in this example, one fitting part 552b is fitted with the corresponding protrusion 452b while having play in the direction connecting the two fitting parts 552a and 552b. Further, the other fitting portion 552a is fitted with the corresponding protrusion 452a so that there is almost no play in the direction. Further, both the fitting parts 552a and 552 are fitted with the protrusions 452a and b so that there is almost no play in a direction perpendicular to the direction and parallel to the surface of the substrate 500. In this case, for example, the LED module 100 can be easily attached to the substrate 500 by fitting the protrusion 452a and the fitting portion 552a after fitting the tip of the protrusion 452b to the fitting portion 552b. According to this example, the LED module 100 can be appropriately fixed. Thereby, the vehicular lamp 10 (see FIG. 1) can appropriately form the light distribution pattern.

  In another example, the LED module 100 may have, for example, a hole formed in the holding portion 708 (see FIG. 19) instead of the protrusions 452a and 45b. In this case, the board | substrate 500 may have the protrusion which should be fitted with the said hole as the fitting parts 552a and b. Also in this case, the LED module 100 can be appropriately fixed. Further, the LED module 100 may have a hole formed in the holding portion 708 instead of one of the plurality of protrusions 452a and 452b. The board | substrate 500 may have the hole and protrusion which should be fitted with these as several fitting part 552a, b.

  FIG. 23 shows still another example of the configuration of the LED module 100 and the substrate 500. Except as described below, in FIG. 23, the configurations denoted by the same reference numerals as those in FIGS. 5 to 8, 18 and / or 19 to 22 are the same as those in FIGS. Since it has the same or similar function as the configuration in 19 to 22, the description thereof is omitted.

  In this example, the LED module 100 has a side 402 and a protrusion 452. The side 402 and the protrusion 452 are an example of a reference portion that indicates the position of the semiconductor light emitting element 102 (see FIG. 5).

  Further, the substrate 500 has a convex portion 510 and a fitting portion 552. The convex portion 510 and the fitting portion 552 indicate a reference position where the LED module 100 should be attached. Further, the convex portion 510 includes a side 502.

  When the substrate 500 fixes the LED module 100, the convex portion 510 abuts the outer surface of the LED module 100 including the side 402 with the side surface including the side 502. Further, the fitting portion 552 engages with the protrusion 452. Also in this case, the substrate 500 can fix the LED module 100 with high accuracy. Therefore, also in this example, the vehicular lamp 10 (see FIG. 1) can appropriately form a light distribution pattern.

  FIG. 24 shows still another example of the configuration of the LED module 100. Except for the points described below, in FIG. 24, the same reference numerals as those in FIGS. 5, 6, 7 and / or 14 are the same as those in FIGS. 5, 6, 7 and / or 14. The description is omitted because it has the same or similar function as the configuration.

  In this example, the LED module 100 includes a plurality of semiconductor light emitting elements 102a to 102c. The plurality of semiconductor light emitting elements 102a to 102c are arranged at a substantially square area surrounded by the virtual line segments 320a to 320d at intervals of, for example, about 0.01 mm or less so that one side is aligned with the virtual line segment 320d. They are arranged side by side across d.

  The holding unit 708 fixes the plurality of semiconductor light emitting elements 102a to 102c by matching the distance between the line segment 320d and at least a part of the plurality of sides 402a to 402d. For example, the holding unit 708 fixes the plurality of semiconductor light emitting elements 102a to 102c so that the distance between the line segment 320d and the side 402d is the distance Y2. In another example, the holding unit 708 may fix the plurality of semiconductor light emitting elements 102a to 102c by matching the distance between any of the line segments 320b to 320d and any of the sides 402a to 402d. Also in this case, the plurality of semiconductor light emitting elements 102a to 102c can be fixed with high accuracy.

  The lens 204 (see FIG. 3) has a focal point F at the center of the line segment 320d. In this case, the lens 204 can clearly project the shapes of the sides of the plurality of semiconductor light emitting elements 102a to 102c on the line segment 320d in front of the vehicle. In this case, the cut line can be appropriately formed by projecting the shapes of the sides of the plurality of semiconductor light emitting elements 102a to 102c. Therefore, according to this example, the light distribution pattern can be appropriately formed.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

1 is a perspective view of a vehicular lamp 10. FIG. 1 is a horizontal sectional view of a vehicular lamp 10. FIG. 3 is a vertical sectional view of the light source unit 20 along AA. FIG. 3 is a BB vertical sectional view of the light source unit 20. FIG. 2 is a CC cross-sectional view of the LED module 100. FIG. FIG. 3 is a cross-sectional view of the LED module 100 along AA. 3 is a BB cross-sectional view of the LED module 100. FIG. 5 is a diagram illustrating an example of a configuration of a substrate 500. FIG. 3 is a conceptual diagram illustrating an example of a light distribution pattern 300. FIG. 4 is a horizontal sectional view of the light source unit 20 along AA. FIG. 3 is a BB vertical sectional view of the light source unit 20. FIG. It is a conceptual diagram which shows an example of the light distribution pattern 300a. It is a conceptual diagram which shows an example of the light distribution pattern 300b. FIG. 5 is a diagram illustrating another example of the configuration of the LED module 100. FIG. 3 is a cross-sectional view of the LED module 100 along AA. 3 is a BB cross-sectional view of the LED module 100. FIG. 2 is a bottom view of the LED module 100. FIG. It is a figure which shows the other example of a structure of the board | substrate 500. FIG. 2 is a CC cross-sectional view of the LED module 100. FIG. FIG. 3 is a cross-sectional view of the LED module 100 along AA. 3 is a BB cross-sectional view of the LED module 100. FIG. It is a figure which shows the further another example of a structure of the board | substrate 500. FIG. It is a figure which shows the further another example of a structure of the LED module 100 and the board | substrate 500. FIG. It is a figure which shows the further another example of a structure of the LED module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Vehicle lamp, 12 ... Cover, 14 ... Lamp body, 16 ... Circuit unit, 20 ... Light source unit, 22 ... Cable, 24 ... Heat radiation member, 26. ··· Cable, 28 ... Extension reflector, 100 ... LED module, 102 ... Semiconductor light emitting element, 104 ... Electrode, 108 ... Sealing member, 202 ... Fixing member, 204 ... Lens 206 206 Housing 208 Extension 252 Cover 254 Light distribution step 256 Reflector 258 Light distribution step 260 Reflector , 300 ... Light distribution pattern, 302 ... Horizontal cut line, 304 ... Diagonal cut line, 306 ... Area, 310 ... Side, 312 ... Bonding wire 320 ... line segment, 402 ... side, 452 ... projection, 500 ... substrate, 502 ... side, 504 ... pad, 506 ... pad, 510 ... convex part, 512 ... convex part, 552 ... fitting part, 602 ... area, 604 ... area, 702 ... submount, 704 ... slug, 706 ... body, 708 ... holding Part, 802 ... side, 804 ... groove, 902 ... side, 904 ... groove, 952 ... slag housing part, 954 ... extension part

Claims (8)

A light source module comprising: a semiconductor light emitting element that generates light from a light emitting region having at least one linear boundary; a holding part that holds the semiconductor light emitting element; and a reference part that is one side of the holding part;
An optical member that radiates light generated from the light emitting region to the outside of the vehicle;
A light source fixing part that has a reference side that contacts the reference part, and fixes the light source module in a state where the reference part and the reference side are in contact with each other;
With
The light source fixing unit is a vehicle lamp that fixes the light source module in a state where an optical center of the optical member is positioned on the linear boundary.   2. The vehicular lamp according to claim 1, wherein a distance from an optical center of the optical member to the reference side is equal to a distance from the linear boundary to the reference portion.   The optical member projects at least a part of a cut line that projects the shape of the light emitting area in front of the vehicle and defines a light / dark boundary in a light distribution pattern formed by the optical member based on the shape of the linear boundary The vehicular lamp according to claim 1, wherein: The semiconductor light emitting device has at least two linear boundaries that are non-parallel to each other,
The holding part has two reference parts,
The light source fixing part has two reference sides, and the two reference parts are arranged at a reference position by bringing the two reference parts into contact with the two reference sides. Item 2. A vehicle lamp according to Item 1. A semiconductor light emitting element for generating light from a light emitting region having at least one linear boundary, a holding part for holding the semiconductor light emitting element, and a first reference part formed as a hole or a protrusion formed in the holding part A light source module comprising:
An optical member that radiates light generated from the light emitting region to the outside of the vehicle;
The light source module has a reference fitting portion that fits into the first reference portion, and the light source module is fixed in a state where the first reference portion and the reference fitting portion are fitted. A light source fixing part;
With
The light source fixing unit is a vehicle lamp that fixes the light source module in a state where an optical center of the optical member is positioned on the linear boundary.   6. The vehicular lamp according to claim 5, wherein a distance from the optical center of the optical member to the reference fitting portion is equal to a distance from the linear boundary to the first reference portion. The holding portion has at least two of the first reference portions,
The light source fixing portion includes two reference fitting portions, and the one of the two reference fitting portions is loosely fitted to the first reference portion. The vehicular lamp according to claim 5, wherein the portion is fixed. The holding part further includes a second reference part that is one side of the holding part,
The light source fixing portion further includes a reference side with which the second reference portion abuts, and the first reference portion is brought into contact with the second reference portion by contacting the reference side. The vehicle lamp according to claim 5, wherein the lamp is disposed at a reference position.

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