JP2014049230A - Insulation electric wire and coil using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insulation electric wire in which adhesion of a conductor and an insulation layer is high, and that has an insulation layer in which satisfactory adhesion can be maintained even by heat over an extended period; and a coil using the insulation electric wire.SOLUTION: An insulation electric wire includes: a conductor; an adhesion layer that is formed to adhere to a circumference of the conductor, and includes a base resin and an adhesion agent added to the base resin and having a urethodione bond represented by the following formula (1); and an insulation layer formed at a circumference of the adhesion layer.

Description

  The present invention relates to an insulated wire and a coil using the same. More specifically, the present invention relates to an insulated wire used for an electric device such as a motor and a coil using the same.

  Insulated wires used in electrical equipment such as motors can be coated with an insulating paint in which a base resin such as polyimide, polyamideimide, or polyesterimide is dissolved in an organic solvent and baked on the outer periphery of the conductor, thereby forming a single layer or multiple layers. Some layers are provided with an insulating layer.

  In recent years, demands for miniaturization, higher efficiency, and the like have been increasing year by year for electric devices such as motors. In order to meet this requirement, a process of winding more insulated wires around a motor core and a process of directly inserting an insulated wire into a slot of the core are performed.

  However, as many insulated wires are wound or directly inserted, processing stress applied to the insulated wires increases. As described above, when the processing stress increases, the insulating layer formed on the outer periphery of the conductor is easily damaged, and as a result, the insulating layer may be peeled off from the conductor. For this reason, insulated wires used in electric devices such as motors are required to have an insulating layer that does not easily peel off from a conductor even when processing stress on the insulating layer applied during the processing process increases.

  In response to such demands, for example, a method for improving resistance to processing stress has been proposed by adding an adhesive agent that improves adhesion in an insulating coating, thereby making it difficult for the insulating layer to peel off the conductor. (For example, see Patent Documents 1 to 3). In addition, as an adhesive agent which improves such adhesiveness, mercaptans, thiazoles, melamines, cyano compounds, phenylenediamines, etc. are known, for example.

JP 2001-11312 A JP 2007-246595 A JP 2007-106823 A

  In electric devices such as motors, there is a tendency to increase the voltage for use in miniaturization and high efficiency. For this reason, an electric current larger than that in the conventional case flows through the insulated wire constituting the coil, and the insulated wire is used in an environment where a large amount of heat is generated by the increase in current. In addition, in order to improve the space factor of the insulated wire, it has been studied to arrange the insulated wire more densely. However, if the space factor is improved, the generated heat is difficult to escape, that is, the heat dissipation becomes worse. May end up. In particular, in such an environment, high-temperature heat is applied to the insulating layer for a long time. For this reason, the insulating layer needs to have sufficient adhesion even when heat is applied for a long time.

  However, in the conventional method of adding an adhesive agent that improves adhesion to the insulating coating and making it difficult for the insulating layer to be peeled off from the conductor, the adhesion before the heat is applied is improved. However, due to the influence of heat for a long time, the adhesiveness of the insulating layer to the conductor is extremely lowered, and the insulating layer may be peeled off from the conductor. And when an insulating layer floats in this way, insulation performance cannot fully be exhibited but it will lead to dielectric breakdown.

  Therefore, the present invention provides an insulated wire having an insulating layer that has high adhesion between the conductor and the insulating layer and can maintain sufficient adhesion even with heat for a long time, and a coil using the insulated wire. The purpose is to provide.

  In order to achieve the above object, according to the present invention, the following insulated wires and coils using the same are provided.

[1] An adhesion layer containing a conductor and an adhesive having a uretdione bond represented by the following formula (1) added to the base resin and formed in close contact with the outer periphery of the conductor; An insulated wire comprising: an insulating layer formed on an outer periphery of the adhesion layer.

[2] The insulated wire according to [1], wherein the adhesive is added in a ratio of 3 to 50 parts by mass with respect to 100 parts by mass of the base resin.

[3] The insulated wire according to [1] or [2], wherein the base resin is polyamideimide, polyimide, or polyesterimide.

[4] The insulated wire according to any one of [1] to [3], wherein the adhesion layer is obtained by applying and baking an insulating paint containing the base resin and the adhesion agent on the conductor. .

[5] A coil using the insulated wire according to any one of [1] to [4].

  According to the present invention, there is provided an insulated wire having an insulating layer that has high adhesion between the conductor and the insulating layer and can maintain sufficient adhesion even with heat for a long time, and a coil using the insulated wire. Provided.

[Summary of embodiment]
The insulated wire of the present embodiment is an insulated wire having a conductor and an insulating layer, and is formed in close contact with the outer periphery of the conductor, and the above formula (1) added to the base resin. When the adhesive layer containing the adhesive agent having the uretdione bond represented is further provided, the adhesiveness before the heat is applied is improved, and heat (for example, heat of 150 ° C. or more) is applied for a long time. However, since the adhesiveness with respect to the conductor is unlikely to decrease, it is possible to prevent the insulating layer from peeling off from the conductor.

[Embodiment]
Hereinafter, embodiments of an insulated wire and a coil using the insulated wire according to the present invention will be specifically described.

[Insulated wire]
The insulated wire according to the present embodiment contains a conductor and an adhesive having a uretdione bond represented by the above formula (1) added to the base resin and the base resin formed in close contact with the outer periphery of the conductor. And an insulating layer formed on the outer periphery of the adhesion layer.

(Adhesion layer)
In the present embodiment, the adhesion layer contains a base resin and an adhesion agent having a uretdione bond represented by the above formula (1) added to the base resin.

  As the base resin constituting the adhesion layer, for example, polyamideimide, polyimide, or polyesterimide can be suitably used. The adhesion layer can be obtained by applying an insulating paint prepared by dissolving an adhesive, which will be described later, to these base resins in an organic solvent and baking it on the conductor.

  Examples of the polyimide used for the base resin include a polyimide obtained from an acid component composed of an aromatic tetracarboxylic dianhydride and a diamine component composed of an aromatic diamine. The polyamideimide used for the base resin is a polyamideimide obtained from an isocyanate component such as an aromatic diisocyanate and an acid component such as a tricarboxylic acid anhydride, or a diamine component such as an aromatic diamine and an acid such as a tricarboxylic acid anhydride. Examples thereof include polyamideimide obtained from the component and an isocyanate component such as aromatic diisocyanate. Moreover, as a polyesterimide used for base resin, the polyesterimide obtained by acid components and alcohol components, such as a diamine component and a tricarboxylic anhydride, can be mentioned.

  Examples of the diamine component include 4,4′-diaminodiphenyl ether (ODA), 4,4′-diaminodiphenylmethane (DAM), 3,4′-diaminodiphenyl ether (3,4′-DPE), 4,4′- Bis (4-aminophenoxy) biphenyl (BAPB), 1,4-bis (4-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene Bis [4- (4-aminophenoxy) phenyl] sulfone (BAPS), bis [4- (3-aminophenoxy) phenyl] sulfone (BAPS-M), 2,5-bis (4-aminophenoxy) -biphenyl (P-TPE-Q), 9,9-bis (4-aminophenyl) fluorene (FDA), 2,2-bis [4- (4- Minofenokishi) phenyl] propane (BAPP), and bis [4- (4-aminophenoxy) aromatic diamines such as phenyl] ether (BAPE).

  Examples of the isocyanate component include aromatic diisocyanates such as diphenylmethane diisocyanate (MDI), tolylene diisocyanate (TDI), naphthalene diisocyanate, xylylene diisocyanate, biphenyl diisocyanate, diphenyl sulfone diisocyanate, and diphenyl ether diisocyanate.

  Examples of the alcohol component include dihydric alcohols such as ethylene glycol (EG), neopentyl glycol, 1,4-butanediol, 1,6-hexanediol, 1,6-cyclohexanedimethanol, glycerin (G), and triglyceride. Examples include trivalent or higher alcohols such as methylolpropane and pentaerythritol, alcohols having an isocyanurate ring, and the like. Examples of the alcohol having an isocyanurate ring include tris (hydroxymethyl) isocyanurate, tris (2-hydroxyethyl) isocyanurate (THEIC), and tris (3-hydroxypropyl) isocyanurate.

  Examples of the acid component include trimellitic anhydride (TMA), 3,4,4′-benzophenone tricarboxylic acid anhydride, 3,4,4′-biphenyltricarboxylic acid anhydride and the like, and pyromellitic acid. Acid dianhydride (PMDA), 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride (BTDA), 3,3 ′, 4,4′-diphenylsulfone tetracarboxylic dianhydride (DSDA) And aromatic tetracarboxylic dianhydrides such as 4,4′-oxydiphthalic dianhydride (ODPA) and 3,3 ′, 4,4′-biphenylsulfone tetracarboxylic dianhydride (BPDA). it can.

  The adhesion agent constituting the adhesion layer is composed of one having a uretdione bond represented by the above formula (1). For example, those obtained by synthesizing isocyanate and trimellitic anhydride in an excess of the molar amount of the trimellitic anhydride in combination with the isocyanate, or the product name: Vestagon BF1540 manufactured by Huls However, there is no particular limitation as long as it has a uretdione bond.

  This adhesion agent is preferably added at a ratio of 3 to 50 parts by mass with respect to 100 parts by mass of the base resin. In addition, when addition amount remove | deviates from the above-mentioned range (less than 3 mass parts or exceeds 50 mass parts), adhesiveness may become lower than the case where it exists in the range of 3-50 mass parts.

  The uretdione bond is easily decomposed to isocyanate by heat. In this embodiment, by adding an adhesive having an uretdione bond, the uretdione bond is decomposed into an isocyanate group by heat when applying and baking the insulating coating. Since the isocyanate group has a high polarity, it is considered that adhesiveness with the conductor is developed.

  Organic solvents for dissolving the base resin include N-methyl-2-pyrrolidone (NMP), γ-butyrolactone, N, N-dimethylacetamide (DMAc), N, N-dimethylformamide (DMF), dimethylimidazolidinone ( DMI), cyclohexanone and methylcyclohexanone. There is no particular limitation as long as it dissolves the base resin. In addition, aromatic alkylbenzenes and the like may be used in combination for dilution purposes. However, it is necessary to consider when there is a possibility of lowering the solubility of the base resin.

  In particular, the thickness of the adhesion layer may be 3 μm or more in consideration of preventing a decrease in the adhesive strength (adhesion strength) between the conductor and the insulation layer and the mechanical strength of the adhesion layer and the insulation layer. preferable. If there is no adverse effect on the characteristics, the insulating layer may be formed only with a paint to which an adhesive containing a uretdione bond is added.

  The adhesion layer in the present embodiment can be obtained by applying and baking the above-described insulating paint on a conductor described later.

(conductor)
Examples of the conductor used in the present embodiment include copper wires made of low-oxygen copper, oxygen-free copper, etc., copper alloy wires, and other metal wires such as aluminum and silver. Further, the cross-sectional shape of the conductor is not particularly limited, but a conductor having a cross-sectional shape formed of a circular shape or a quadrangular shape (including a curved shape at four corners) can be used.

(Insulating layer)
As an insulating layer used for this Embodiment, what consists of resin, such as a polyamideimide, a polyimide, a polyesterimide, H class polyester resin, can be mentioned, for example. This insulating layer may be a partial discharge resistant film in which an inorganic material such as silica or alumina is dispersed, or may be a layer whose partial discharge starting voltage is improved by lowering the dielectric constant. Furthermore, a lubricating layer may be formed on the insulating layer for the purpose of improving surface lubricity.

[coil]
The coil of this Embodiment is comprised using the above-mentioned insulated wire. There is no restriction | limiting in particular as a coil using the above-mentioned insulated wire, It can manufacture by a general purpose method.

  Below, the insulated wire of this invention is demonstrated more concretely using an Example. Note that the present invention is not limited in any way by the following examples.

Example 1
As a base resin, 1000 g of paint using polyamideimide (trade name: HI-406, non-volatile content: 30%, manufactured by Hitachi Chemical Co., Ltd.), isocyanate and trimellitic anhydride are added in excess of the molar amount of isocyanate. 30 g (non-volatile content: 30%) of an adhesive containing a uretdione bond obtained by a synthetic reaction was added (a ratio of 3 parts by mass with respect to 100 parts by mass of the base resin), and the insulating paint was stirred. Got.

  Next, the insulating paint was applied and baked on a copper conductor having an outer diameter of 0.8 mm to form an adhesion layer having a thickness of 3 μm. Then, coating and baking of the above-mentioned polyamideimide-based resin (HI-406) were repeated on the adhesion layer to form an insulating layer having a thickness of 32 μm. The total film thickness of the adhesion layer and the insulating layer was 35 μm. An insulated wire was obtained.

(Examples 2 to 4)
In Example 1, except that the addition amount of the adhesive containing the uretdione bond was added at 100, 200 and 500 g (ratio of 10, 20 and 50 parts by mass with respect to 100 g of the base resin), Example 1 and Similarly, an insulated wire having a total film thickness of 35 μm of the adhesion layer and the insulating layer was obtained.

(Example 5)
As base resin, 1000g of paint using polyimide (trade name: Torenice # 3000, non-volatile content: 18%) is synthesized with isocyanate and trimellitic anhydride in excess of the molar amount of isocyanate. 200 g (20 parts by mass with respect to 100 parts by mass of the base resin) of an adhesive containing a uretdione bond obtained by reacting (non-volatile content: 30%) is added and stirred to obtain an insulating paint. It was.

  Next, the insulating paint was applied and baked on the above-described conductor having an outer diameter of 0.8 mm to form an adhesion layer having a thickness of 3 μm. Thereafter, the above polyimide coating (Trenice # 3000) was applied and baked repeatedly to form an insulating layer having a thickness of 32 μm, and an insulated wire having a total film thickness of 35 μm of the adhesion layer and the insulating layer was obtained.

(Example 6)
In Example 5, except that a paint using polyesterimide (made by Dainichi Seika Kogyo Co., Ltd., trade name: EH-402, nonvolatile content: 40%) was used instead of the paint using polyimide. In the same manner as in Example 5, an insulated wire having a total film thickness of 35 μm of the adhesion layer and the insulating layer was obtained.

(Examples 7 to 9)
In Example 1, except that the addition amount of the adhesive containing the uretdione bond was added at 10, 550 and 700 g (ratio of 1, 55 and 70 parts by mass with respect to 100 g of the base resin), Example 1 and Similarly, an insulated wire having a total film thickness of 35 μm of the adhesion layer and the insulating layer was obtained.

(Comparative Example 1)
Insulation having a thickness of 0.003 mm by coating and baking the above-mentioned insulating paint on a conductor having an outer diameter of 0.8 mm with a paint using a highly adhesive polyamideimide (trade name: HI-406FA, manufactured by Hitachi Chemical Co., Ltd.) A layer was formed. Thereafter, a coating using polyamideimide (manufactured by Hitachi Chemical Co., Ltd., trade name: HI-406) is applied and baked repeatedly to form an insulating layer having a thickness of 0.032 mm, and an insulating film having a total film thickness of 0.035 mm. I got an electric wire.

(Comparative Example 2)
A coating using a highly adhesive polyester imide (manufactured by Tohoku Paint Co., Ltd., trade name: NH8640JH3Y) is coated on the conductor having an outer diameter of 0.8 mm and baked to form an insulating layer having a thickness of 0.003 mm. Formed. Thereafter, a coating using polyamideimide (manufactured by Hitachi Chemical Co., Ltd., trade name: HI-406) is applied and baked repeatedly to form an insulating layer having a thickness of 0.032 mm, and an insulating film having a total film thickness of 0.035 mm. I got an electric wire.

(Comparative Example 3)
A coating using a highly adhesive polyimide (manufactured by Tohoku Paint Co., Ltd., trade name: SEI-450H-18) is coated on the conductor having an outer diameter of 0.8 mm and baked to have a thickness of 0.003 mm. An insulating layer was formed. Thereafter, a paint using polyimide (trade name: Torenice # 3000, nonvolatile content: 18%) was applied and baked repeatedly to form an insulating layer having a thickness of 0.032 mm. An insulated wire of 035 mm was obtained.

  Table 1 shows the types of base resins used in Examples 1 to 9 and Comparative Examples 1 to 3, the addition amount of the adhesive, and the total film thickness, and obtained in Examples 1 to 9 and Comparative Examples 1 to 3. About the obtained insulated wire, the result of having performed the following evaluation tests is shown collectively.

(Peel test)
The initial peel test was performed as follows. That is, the linear sample obtained from each insulated wire was fixed to two clamps 250 mm apart on the same axis, and the coatings on two sides parallel to the length direction of the sample were removed until reaching the conductor. Thereafter, one of the clamps was rotated, and the number of rotations (the number of times: 360 ° was defined as one time) when the film floated from the conductor was measured. The peel test after heat degradation was conducted at a temperature of 180 ° C. for an insulated wire having an adhesive layer made of a PAI and PI base resin and 160 ° C. for an insulated wire having an adhesive layer made of an EI base resin. Then, the test was conducted by the same method as the initial peel test.

(One-way wear test)
The initial unidirectional wear test was conducted in accordance with JIS C 3216-3 wearability. In the unidirectional wear test after thermal degradation, the test was conducted by the same method as the initial unidirectional wear test after thermal degradation by the same method as the peel test after thermal degradation.

  As shown in Table 1, Examples 1 to 9 provided with adhesive layers formed by applying and baking an insulating paint containing an adhesive containing a uretdione bond represented by the above formula (1) of the present invention on a conductor. Then, it turns out that the adhesiveness with a conductor is high, and the insulated wire which has sufficient adhesiveness can be obtained even with long-time heat. In particular, in Examples 1 to 6 in which the addition amount of the adhesion agent is 3 to 50 phr, the peel residual rate is high compared to Examples 7 to 9, and the adhesion is not easily lowered even by heat for a long time (that is, It can be seen that the insulated wire is capable of maintaining sufficient adhesion.

  On the other hand, in the comparative example 1, it turns out that the insulated wire which has sufficient adhesiveness with respect to heat for a long time was not obtained.

Claims (5)

Conductors,
An adhesion layer containing an adhesive having a uretdione bond represented by the following formula (1) added to the base resin and the base resin formed in close contact with the outer periphery of the conductor;

An insulated wire comprising: an insulating layer formed on an outer periphery of the adhesion layer.   The insulated wire according to claim 1, wherein the adhesive is added at a ratio of 3 to 50 parts by mass with respect to 100 parts by mass of the base resin.   The insulated wire according to claim 1, wherein the base resin is polyamideimide, polyimide, or polyesterimide.   The insulated wire according to any one of claims 1 to 3, wherein the adhesion layer is obtained by applying and baking an insulating paint containing the base resin and the adhesion agent on the conductor.   The coil using the insulated wire of any one of Claims 1-4.