JP2014044004A - Thermal storage device and structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermal storage device that suppresses the height of a heat exchange member performing heat exchange with the outside of the device.SOLUTION: A thermal storage panel 1 comprises: a face plate 11 that performs heat exchange with the outside of a device; a back plate 17 that is provided so as to form a gap with the face plate 11 and forms a closed space from and to the face plate 11; and a phase change material 20 that is encapsulated between the face plate 11 and the back plate 17 and is subjected to phase change between a solid phase and a liquid phase by heat exchanged with the outside of the device. When the encapsulated phase change material 20 is subjected to temperature change beyond a melting point with phase change, the gap between the face plate 11 and the back plate 17 is a distance of being subjected to temperature change beyond the melting point of the phase change material 20 after the phase change of the encapsulated phase material 20 is completed.

Description

  The present invention relates to a heat storage device and a structure.

  In Patent Document 1, in order to provide a lightweight and inexpensive heat storage member that can be applied to a spacecraft, it is provided with a honeycomb structure having a large number of cells, and a capsule in which a heat storage material is included in each cell; A heat storage member filled with a heat conductive filler is disclosed. Then, by filling the honeycomb structure with the heat storage material-encapsulated capsule and the heat conductive filler, even if the heat storage member is thick, it can be a light heat storage member with good heat conductivity and light weight. It is disclosed.

JP 2011-178867 A

  An object of this invention is to provide the thermal storage apparatus which suppressed the height from the heat exchange member which heat-exchanges with the exterior of an apparatus.

  The invention according to claim 1 is provided along the heat exchange member while forming a gap with the heat exchange member, which is a member that exchanges heat with the outside of the apparatus, and between the heat exchange member A sealed member that forms a sealed space, and is sealed in the sealed space formed between the heat exchange member and the sealed member, and is exchanged between the solid phase and the liquid phase by heat exchanged outside the apparatus. A phase change material that changes phase between them, and the gap between the heat exchange member and the sealing member is such that the phase change material enclosed in the sealed space exceeds the melting point while undergoing a phase change and changes in temperature. In this case, the heat storage device is characterized in that the temperature change distance exceeds the melting point of the phase change material after the phase change of the phase change material sealed in the sealed space is completed.

According to a second aspect of the present invention, the space between the heat exchange member and the sealing member in which the phase change material is enclosed includes other members for exchanging heat with the phase change material. The heat storage device according to claim 1, wherein the heat storage device is not provided.
The invention according to claim 3 is the heat storage device according to claim 1, wherein the heat exchange member is formed of a carbon fiber reinforced resin made of pitch-based carbon fibers.

  According to a fourth aspect of the present invention, there is provided a temperature change region that is a region where the temperature changes in response to an external temperature change, a heat exchange member that is a member that exchanges heat with the outside, and the temperature change region and the heat exchange member. A sealing member that is provided along the heat exchange member while forming a gap with the member and that forms a sealed space with the heat exchange member; and formed between the heat exchange member and the sealing member. And a phase change material that changes phase between a solid phase and a liquid phase by heat exchanged with the outside, and the gap between the heat exchange member and the sealing member is When the phase change material enclosed in the sealed space undergoes a temperature change exceeding the melting point with a phase change, the phase change material after the phase change of the phase change material enclosed in the sealed space is completed. The distance at which the temperature changes beyond the melting point of the changing material Is a structure characterized by at.

The invention according to claim 5 is a plate-like member that exchanges heat with the outside of the apparatus, and is formed by a fiber-reinforced resin including fibers arranged along the plate-like surface, and the ceiling member A bottom member formed by the fiber reinforced resin including fibers disposed along the plate-like surface, and the ceiling member and the bottom member. A support member that supports and forms a sealed space inside with the ceiling member and the bottom member, and is disposed in the sealed space, and changes phase between a solid phase and a liquid phase by heat exchanged with the outside. A phase change material, wherein an opening that is continuous with the sealed space is formed, and a sealing portion that is a portion where the opening is sealed is provided in the support member, It is a heat storage device.
The invention according to claim 6 is the heat storage device according to claim 5, wherein the ceiling member and the bottom member have higher thermal conductivity in the plane direction than in the thickness direction.

  According to invention of Claim 1, compared with the case where it does not have this structure, the heat storage apparatus which suppressed the height from the heat exchange member which heat-exchanges with the exterior of an apparatus can be provided.

It is a schematic block diagram which shows the thermal storage panel which concerns on this Embodiment. It is an exploded view which shows the thermal storage panel which concerns on this Embodiment. It is sectional drawing cut | disconnected by the III-III surface of FIG. It is a conceptual diagram which shows the manufacturing method of a thermal storage panel. It is a conceptual diagram which shows the manufacturing method of a thermal storage panel.

Hereinafter, this embodiment will be described in detail with reference to the accompanying drawings.
<Configuration of heat storage panel 1>
First, with reference to FIG. 1, the structure of the thermal storage panel 1 to which this Embodiment is applied is demonstrated. Here, FIG. 1 is a schematic configuration diagram showing a heat storage panel 1 according to the present embodiment.

A heat storage panel (heat storage device) 1 to which the present exemplary embodiment is applied is provided in an artificial satellite, a house, an automobile, etc. (hereinafter simply referred to as “artificial satellite”) which is an example of a structure, and is adapted to an external temperature change. It is configured to be able to maintain a predetermined temperature for a certain period. To explain further, the heat storage panel 1 faces this temperature change region so as to alleviate a sudden change in temperature in a certain region (temperature change region) within the satellite due to the influence of the external temperature, for example. Provided.
As shown in FIG. 1, the heat storage panel 1 of the present embodiment includes a container 10 formed of a material that promotes heat conduction (a heat conduction promoting material), and the container 10 is filled with heat from outside. A phase change material (Phase Change Material (PCM)) 20 that changes between a solid phase and a liquid phase is provided.

The container 10 is formed of carbon fiber reinforced resin (Carbon Fiber Reinforced Plastics (CFRP), carbon fiber reinforced plastic) which is a carbon-based composite material. More specifically, the container 10 is made of a carbon fiber reinforced resin in which a so-called pitch-based carbon fiber manufactured from pitch is impregnated with a resin such as an epoxy resin.
The epoxy resin is a thermosetting resin and has a curing point of about 130 ° C., for example. In general, pitch-based carbon fibers have higher thermal conductivity than so-called PAN-based carbon fibers manufactured from polyacrylonitrile (PAN). More specifically, PAN-based carbon fiber reinforced resin has a thermal conductivity of about 10 W / mK, for example, while pitch-based carbon fiber reinforced resin has a thermal conductivity of about 80 to 1100 W / mK, for example. .

The phase change material 20 is made of a material that can store heat by utilizing the heat of fusion in the solid-liquid phase change. For example, the phase change material 20 is generally made of a material having a large heat of fusion, such as eicosane (paraffin), water, sodium acetate, sodium sulfate and the like. The material of the phase change material 20 is selected based on the relationship between the temperature assumed in the usage environment of the heat storage panel 1 and the melting point of the phase change material. In addition, the melting | fusing point of eicosane is 50-60 degreeC, for example, and is lower than the hardening point of an epoxy resin.
The phase change material 20 may be made of a material that can store heat by utilizing latent heat in a liquid phase-gas phase change. Since the latent heat of vaporization in the liquid phase-gas phase change is higher than the heat of fusion in the solid phase-liquid phase change, the amount of phase change material 20 used can be suppressed.

Here, with reference to FIG. 2, the structure of the container 10 of the thermal storage panel 1 is demonstrated in detail. FIG. 2 is an exploded view showing the heat storage panel 1 according to the present embodiment.
As shown in FIG. 2, the container 10 includes a front plate 11, a peripheral wall 13, a sealing wall 15, and a back plate 17. Each of these members is formed of pitch-based carbon fiber reinforced resin.

The front plate 11, which is an example of a heat exchange member and a ceiling member, is a plate-like member arranged toward the outside of an artificial satellite (not shown) provided with the heat storage panel 1. Further, the carbon fibers of the front plate 11 are stacked such that the fiber direction is along the plate plane. In other words, the thermal conductivity in the surface direction of the front plate 11 is larger than the thermal conductivity in the thickness direction of the front plate 11.
The peripheral wall 13 is a member that is provided between the front plate 11 and the back plate 17 and supports the front plate 11 and the back plate 17 so as to form a gap between the front plate 11 and the back plate 17. The peripheral wall 13 in the illustrated example is a substantially U-shaped member that surrounds three sides (three sides) of the periphery of the phase change material 20.
Although details will be described later, the sealing wall 15 is a member that seals the container 10 after the phase change material 20 is disposed therein. The peripheral wall 13 and the sealing wall 15 can be regarded as support members.

  The back plate 17, which is an example of a sealing member and a bottom member, is a plate-like member that is arranged (facing the temperature change region) toward the inside of an artificial satellite (not shown) in which the heat storage panel 1 is provided. . The back plate 17 is formed along the front plate 11 at a predetermined interval from the front plate 11. The carbon fibers of the back plate 17 are stacked such that the fiber direction is along the plate plane. In the illustrated example, the carbon fibers of the back plate 17 are laminated along a direction that intersects (different directions) with the direction of the carbon fibers of the front plate 11. However, it may of course be provided along the front plate 11.

  Here, the container 10 of the heat storage panel 1 to which the present exemplary embodiment is applied is a member that covers the phase change material 20 from the outer periphery. More specifically, the heat storage panel 1 is a substantially planar member provided so as to protrude into a space (accommodating space 35 (see FIG. 4B), which will be described later) in which the phase change material 20 is disposed in the container 10. There is no so-called fin, which is a member (other member) that promotes heat conduction between the phase change material 20 and the container 10.

  Further, the front plate 11 and the back plate 17 of the container 10 to which the present embodiment is applied are integrally provided as one member. More specifically, the container 10 has a configuration in which an opening 35a (see FIG. 4C, which will be described later) continuous with the inside of the container 10 is formed on the side surface of the heat storage panel 1 instead of the front plate 11 and the back plate 17. is there. Here, if the opening 35a (see FIG. 4C) is formed on the surface of the front plate 11 (or the back plate 17), the carbon fibers loaded in the front plate 11 (or the back plate 17) are divided. It becomes the composition to be done. In this case, heat transfer along the carbon fibers of the front plate 11 (or the back plate 17) can be hindered.

  Now, although the heat storage panel 1 formed independently was demonstrated as a structure attached to an artificial satellite, in the aspect by which the phase change material 20 is sealed in the container 10 formed with a carbon fiber reinforced resin. I just need it. Therefore, for example, a part of the container 10 may be constituted by a member that forms an artificial satellite. More specifically, for example, when a wall member or floor member (not shown) constituting the artificial satellite is formed of carbon fiber reinforced resin, a wall member (not shown) is used instead of the front plate 11. To do. That is, the phase change material 20 may be sealed with a wall member (not shown), the peripheral wall 13, the sealing wall 15, and the back plate 17. With this configuration, not only the front plate 11 is unnecessary, but also heat is directly transferred from the wall member (not shown) to the phase change material 20 without using the front plate 11, so that heat exchange can be promoted.

<Operation of heat storage panel 1>
Here, operation | movement of the thermal storage panel 1 to which this Embodiment is applied is demonstrated.
First, the operation of the heat storage panel 1 when the temperature outside the artificial satellite (not shown) provided with the heat storage panel 1 rapidly increases will be described.
As the temperature rises outside, heat from the outside of the heat storage panel 1 is changed in phase inside the heat storage panel 1 through the front plate 11 (or the peripheral wall 13, sealing wall 15 and back plate 17 in addition to the front plate 11). It is transmitted to the material 20. And the phase change material 20 which received the heat | fever changes a phase from a solid phase to a liquid phase.

Here, when the phase change material 20 in the heat storage panel 1 undergoes a phase change from a solid phase to a liquid phase, the temperature of the phase change material 20 is maintained at the melting point of the phase change material 20. That is, the phase change material 20 absorbs heat from the outside. Then, after the phase change of the phase change material 20 from the solid phase to the liquid phase is completed, the temperature of the phase change material 20 in the liquid phase rises above the melting point.
From this, when the temperature outside the artificial satellite (not shown) rapidly increases, the heat storage panel 1 mitigates the rapid increase in the internal temperature of the artificial satellite.

Next, the operation of the heat storage panel 1 when the temperature outside the artificial satellite (not shown) rapidly decreases will be described.
As the temperature falls outside, the phase change material 20 arranged in the heat storage panel 1 changes from a liquid phase to a solid phase. Here, when the phase change from the liquid phase to the solid phase proceeds in the phase change material 20 in the heat storage panel 1, the temperature of the phase change material 20 is maintained at the melting point of the phase change material 20, and the phase change material. 20 is in a state of releasing heat to the outside. Then, after the phase change is completed, the temperature of the solid phase change material 20 drops below the melting point.
For this reason, when the temperature outside the artificial satellite (not shown) rapidly decreases, the heat storage panel 1 moderates the rapid decrease in the internal temperature of the artificial satellite.

<Thickness of heat storage panel 1>
Next, the thickness of the heat storage panel 1 will be described with reference to FIG. Here, FIG. 3 is a cross-sectional view taken along the III-III plane of FIG.
The heat storage panel 1 to which this embodiment is applied is formed by suppressing the thickness t1 of the heat storage panel 1 in order to suppress the space required for installing the heat storage panel 1. By controlling the thickness t1, for example, when installing the heat storage panel 1 as a part of a wall member or floor member (not shown) constituting an artificial satellite (not shown) (or together with the wall member or floor member). , Restrictions on the dimensions of the installation location are suppressed.

Here, since the volume of the phase change material 20 in the heat storage panel 1 is suppressed when the thickness t1 of the heat storage panel 1 is suppressed, the amount of heat that the phase change material 20 can exchange with the outside of the heat storage panel 1 is limited. The Rukoto.
In general, the phase change material 20 has a lower thermal conductivity than the container 10. Therefore, if the gap t2 between the front plate 11 and the back plate 17 is excessively increased in order to increase the amount of heat that can be exchanged by the phase change material 20 disposed inside the heat storage panel 1, the front plate 11 (and the back plate 17) may not be uniformly transmitted to the entire phase change material 20.

And when it will be in the state where heat is not transmitted to the phase change material 20 whole, the temperature of the one part phase change material 20 which has already completed the phase change may change before the phase change of the phase change material 20 is complete | finished. More specifically, for example, when the temperature outside the heat storage panel 1 rises, after the entire phase change material 20 in the heat storage panel 1 originally changed from the solid phase to the liquid phase, the liquid phase The temperature of the change material 20 rises above the melting point. However, when it is difficult for heat to be transmitted to the entire phase change material 20, in the region where the heat in the phase change material 20 is sufficiently transmitted even though the region where the heat in the phase change material 20 is not sufficiently transmitted is in a solid state. The temperature of the phase change material 20 that has changed to the liquid phase may start to rise.
In this case, the entire phase change material 20 in the heat storage panel 1 is not available for heat storage. In other words, when heat is not uniformly transmitted to the entire phase change material 20, the amount of heat that the phase change material 20 can exchange with the outside of the heat storage panel 1 is further limited. In addition, the ability to mitigate temperature changes inside the satellite will be limited.

  So, in this Embodiment, after the phase change of the whole phase change material 20 arrange | positioned in the thermal storage panel 1 is complete | finished, the temperature of the phase change material 20 in which the phase change was completed changes exceeding melting | fusing point. A gap t2 between the front plate 11 and the back plate 17 is determined. In other words, in the present embodiment, the gap t2 is determined according to the amount of heat exchanged by the heat storage panel 1 with the outside.

For example, the container 10 of the heat storage panel 1 is formed of pitch-based carbon fiber reinforced resin, eicosane is used for the phase change material 20, the thickness t1 of the heat storage panel 1 is 2 mm, and the thickness t3 of the front plate 11 and the back plate 17 Is 0.5 mm, the gap t2 between the front plate 11 and the back plate 17 is 1 mm.
For example, the gap t2 is configured in the range of 0.25 mm to 5 mm (the thickness t1 is 0.5 mm to 10 mm, for example). Here, when the gap t2 is smaller than 0.25 mm, it may be difficult to stably create a space between the front plate 11 and the back plate 17. Further, when the gap t2 is larger than 5 mm, the temperature of a part of the phase change material 20 may change beyond the melting point before the phase change of the phase change material 20 is completed.

<Method for manufacturing heat storage panel 1>
Next, with reference to FIG. 4, the manufacturing method of the thermal storage panel 1 is demonstrated. Here, FIG. 4 is a conceptual diagram showing a method for manufacturing the heat storage panel 1.
First, the shape of the front plate 11, the peripheral wall 13, the sealing wall 15, and the back plate 17 is obtained by laminating an intermediate material (prepreg) made by impregnating resin into a tape or fabric in which carbon fibers are aligned in one direction. Respectively. Further, for example, the support member 30 that is a plate-like member is formed of a release material such as polytetrafluoroethylene, olefin resin, fluorine resin, or polyester. The melting point of polytetrafluoroethylene is, for example, 320 ° C., which is higher than the curing point of the epoxy resin.

  Next, as shown to Fig.4 (a), the front board 11, the surrounding wall 13, and the backplate 17 are arrange | positioned so that a part of support material 30 may be covered. And in order to remove excess resin, air, etc. contained in a prepreg, it heats more than the hardening point of resin contained in a prepreg, pressurizing within an autoclave (autoclave shaping | molding). As a result, the resin contained in the prepreg is cured, and the front plate 11, the peripheral wall 13 and the back plate 17 are integrated to form the container body 19. In addition, although illustration is abbreviate | omitted in Fig.4 (a), the sealing wall 15 is also shape | molded by hardening by autoclave shaping | molding separately.

Next, as shown in FIG.4 (b), the support material 30 is extracted from the container main body 19 formed integrally (refer arrow in the figure). Here, since the support member 30 is formed of a release material as described above, the support member 30 can be easily pulled out.
An accommodation space 35 is formed in the container main body 19 in which the support member 30 is disposed. In addition, when the container main body 19 is pressurized in autoclave molding without arranging the support material 30 inside the container main body 19 as described above, there is no member that supports the inner side, so that the accommodation space 35 is not intended. Can be transformed into

  Then, as shown in FIG. 4C, the phase change material 20 is inserted into the accommodation space 35 of the container body 19 (see the arrow in the figure). The phase change material 20 inserted into the storage space 35 of the container body 19 may be in a liquid phase (liquid) state or a solid phase (solid) state. In addition, by inserting (filling) the liquid phase change material 20 into the accommodation space 35, the phase change material 20 can be disposed up to the corner of the accommodation space 35.

And as shown in FIG.4 (d), the sealing wall 15 is further inserted in the accommodation space 35 in which the phase change material 20 was inserted (refer arrow in the figure). At this time, the phase change material 20 is sealed by the container body 19 and the sealing wall 15 by applying, for example, a resin serving as an adhesive to a region where the sealing wall 15 and the container body 19 are in contact with each other. It becomes a state.
In other words, unlike the present embodiment, when the autoclave molding method is performed without using the support material 30, in other words, the periphery of the phase change material 20 is the front plate 11, the peripheral wall 13, the sealing wall 15 and the back plate. When the phase change material 20 is heated in a state where the phase change material 20 is placed in the container 10 in advance, the phase change material 20 that has changed to the liquid phase may leak out of the container 10.

<Modification>
Next, with reference to FIG. 5, the modification of the thermal storage panel 1 is demonstrated. Here, FIG. 5 is a conceptual diagram showing a method for manufacturing the heat storage panel 100.
In the above-described embodiment, it has been described that one storage space 35 is formed in one heat storage panel 1, but a configuration having a plurality of storage spaces 35 in one heat storage panel 1 may be employed. When it has the some accommodation space 35, the thermal storage panel 1 can be enlarged, for example in a plane direction, and the area where the thermal storage panel 1 can heat-exchange with the exterior can be increased. Or the volume of the phase change material 20 with which the thermal storage panel 1 is equipped can be increased.

  As shown in FIG. 5, when the heat storage panel 100 has a plurality of storage spaces 35 therein, the storage spaces 351 to 354 are formed to open on the outer periphery of the heat storage panel 100. And the phase change material 201 is inserted in the some location in the thermal storage panel 100 by inserting the phase change materials 201-204 and the sealing walls 151-154 in each accommodation space 351-354 (refer arrow S1-S4). ˜204 is housed.

  In the above-described embodiment, the heat storage panel 1 has been described as a planar member. However, the front plate 11 and the back plate 17 are provided at a predetermined interval, and the front plate 11 and the back plate 17 are provided. The phase change material 20 may be formed as a curved heat storage panel 1. Moreover, you may form the thermal storage panel 1 with which the internal accommodating space 35 continues, combining a some planar member.

  In the above-described embodiment, the carbon fiber reinforced resin has been described. However, the present invention is not limited to the carbon fiber, and other fibers may be used as long as the fiber reinforced resin uses a fiber having high thermal conductivity. Of course it is good.

DESCRIPTION OF SYMBOLS 1 ... Thermal storage panel, 10 ... Container, 11 ... Front plate, 13 ... Perimeter wall, 15 ... Sealing wall, 17 ... Back plate, 19 ... Container main body, 20 ... Phase change material, 30 ... Support material

Claims (6)

A heat exchange member that is a member that exchanges heat with the outside of the apparatus;
A sealing member provided along the heat exchange member while forming a gap with the heat exchange member, and forming a sealed space between the heat exchange member;
A phase change material that is sealed in the sealed space formed between the heat exchange member and the sealing member and changes phase between a solid phase and a liquid phase by heat exchanged outside the apparatus. ,
The gap between the heat exchange member and the sealing member is sealed in the sealed space when the phase change material sealed in the sealed space changes in temperature beyond the melting point with phase change. Further, the heat storage device is a distance that changes in temperature beyond the melting point of the phase change material after the phase change of the phase change material is completed.   The space between the heat exchange member and the sealing member in which the phase change material is enclosed does not include other members for exchanging heat with the phase change material. Item 1. The heat storage device according to item 1.   The heat storage device according to claim 1, wherein the heat exchange member is formed of a carbon fiber reinforced resin made of pitch-based carbon fibers. A temperature change region in which the temperature changes with an external temperature change; and
A heat exchange member that is a member that exchanges heat with the outside;
A sealing member that is provided along the heat exchange member while facing the temperature change region and forming a gap with the heat exchange member, and forms a sealed space with the heat exchange member;
A phase change material that is enclosed in the sealed space formed between the heat exchange member and the sealing member, and that changes phase between a solid phase and a liquid phase by heat exchanged with the outside;
The gap between the heat exchange member and the sealing member is sealed in the sealed space when the phase change material sealed in the sealed space changes in temperature beyond the melting point with phase change. Further, the structure is characterized in that after the phase change of the phase change material is finished, the distance is a distance at which the temperature changes beyond the melting point of the phase change material. It is a plate-like member that exchanges heat with the outside of the device, and a ceiling member that is formed by a fiber reinforced resin including fibers arranged along the plate-like surface;
A plate-like member provided along the ceiling member, and a bottom member formed of the fiber-reinforced resin including fibers arranged along the plate-like surface;
The ceiling member and the bottom member are supported so as to be separated from each other, and the ceiling member and the supporting member that form a sealed space inside the bottom member together with the ceiling member and the bottom member are disposed in the sealed space and exchanged with the outside A phase change material that changes phase between a solid phase and a liquid phase by heat;
An opening that is continuous with the sealed space is formed, and a sealing portion that is a portion where the opening is sealed is provided in the support member.   The heat storage device according to claim 5, wherein the ceiling member and the bottom member have higher thermal conductivity in the plane direction than in the thickness direction.

Images