JP2014039266A - High-frequency circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency circuit module capable of preventing sneaking of a transmission signal to a reception circuit, and of having a high packaging density.SOLUTION: A first duplexer 110 related to a first frequency band is mounted on a circuit board 200, and a second transmission filter 122 and a second reception filter 124 configuring a second duplexer 120 related to a second frequency band are embedded and provided in the circuit board 200. The second transmission filter 122 and the second reception filter 124 are embedded and provided at a position at least partially overlapped with a projection region provided in the circuit board and formed by projecting the first duplexer 110 in a thickness direction of the circuit board. The first frequency band and the second frequency band are separated from each other by a predetermined frequency or more.

Description

  The present invention relates to a high-frequency circuit module in which a high-frequency circuit is mounted on a circuit board, and more particularly, to a transmission filter that filters a high-frequency signal output from a transmission circuit and a mounting structure of a reception filter that filters a high-frequency signal input to a reception circuit. .

  In recent years, as represented by a multi-function mobile phone called a so-called smart phone, the multi-function and miniaturization of the mobile phone have been attempted. In such a cellular phone, a high-frequency circuit module in which various components necessary for transmitting and receiving a high-frequency signal are mounted on a circuit board is mounted on a motherboard (see, for example, Patent Document 1). In the high-frequency circuit module described in Patent Document 1, a power amplification IC, a transmission filter, a reception filter, and the like are mounted on a circuit board. In addition, passive components such as capacitors constituting a matching circuit and the like are embedded in the circuit board. The high-frequency circuit module described in Patent Document 1 uses two transmitting / receiving systems having a frequency band of a cellular system 800 MHz band and a PCS (Personal Communication Services) system 1.9 GHz band, and a positioning function by GPS (Global Positioning System). Therefore, one receiving system having a GPS receiving band of 1.5 GHz is provided.

JP 2005-277939 A

  The device described in Patent Document 1 includes a transmission / reception system of two frequency bands as described above, but in recent years, it is required to cope with a wider variety of frequency bands and to further reduce the size. However, in the configuration described in Patent Document 1, it has been difficult to mount a large number of transmission / reception systems of frequency bands at high density. In particular, the transmission filter and the reception filter not only have a relatively large mounting area, but also have a problem that the transmission signal is likely to wrap around the reception circuit. The latter problem is a phenomenon in which a high-frequency signal transmitted in the first transmission / reception system wraps around the reception circuit via the second transmission / reception system. This phenomenon occurs because a part of the frequency bands of a plurality of transmission / reception systems overlap or are close to each other. More specifically, consider a case where the transmission band in the frequency band of the first transmission / reception system and the reception band in the frequency band of the second transmission / reception system overlap. It is assumed that the duplexer related to the first transmission / reception system and the duplexer related to the second transmission / reception system are mounted on the circuit board adjacent to each other. In this case, when communication is performed using the first transmission / reception system, the transmission signal is directly electromagnetically coupled to the reception filter of the duplexer related to the second transmission / reception system, or electromagnetically coupled to the antenna wiring. Flows into the reception filter of the duplexer according to the above, passes through the reception filter, and flows into the reception circuit. In recent implementations, the reception circuits of the first transmission / reception system and the second transmission / reception system are often realized by a common integrated circuit. For this reason, in the vicinity of the integrated circuit, the transmission signal flowing through the reception wiring through the reception filter of the duplexer related to the second transmission / reception system is electromagnetically coupled to the wiring of the first transmission / reception system, and the first of the collective circuit The phenomenon of flowing into the receiving circuit of the transmission / reception system occurs.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a high-frequency circuit module that can prevent a transmission signal from wrapping around a reception circuit and has a high mounting density.

  To achieve the above object, a high-frequency circuit module according to the present invention includes a circuit board on which a high-frequency signal transmission circuit and a reception circuit are mounted, and a first signal that filters a signal output from the transmission circuit in a first frequency band. A first reception filter for filtering a signal input to the transmission filter and the reception circuit, and a second transmission filter for filtering a signal output from the transmission circuit in the second frequency band and a first signal for filtering the signal input to the reception circuit. 2 reception filters, the first frequency band and the second frequency band are separated by a predetermined frequency or more, the first transmission filter and the first reception filter are mounted on a circuit board, The two reception filters have a small projection area formed in the circuit board by projecting the first transmission filter and the first reception filter in the thickness direction of the circuit board. It is also embedded in the position where a part overlaps, characterized in that.

  In the present invention, the first transmission filter and the first reception filter are mounted on a circuit board. On the other hand, the second transmission filter and the second reception filter are mounted in a circuit board. Further, the second transmission filter and the second reception filter are embedded at a position at least partially overlapping a projection region formed by projecting the first transmission filter and the first reception filter in the thickness direction of the circuit board. . That is, the first transmission filter, the first reception filter, the second transmission filter, and the reception filter are relatively close to each other in distance. In the present invention, the first frequency band and the second frequency band are separated from each other by a predetermined frequency or more to prevent the transmission signal passing through the first transmission filter from being electromagnetically coupled to the second reception filter. Similarly, the transmission signal passing through the second transmission filter is prevented from being electromagnetically coupled to the first reception filter. As a result, an improvement in mounting density and a prevention of wraparound of transmission signals to the reception circuit are realized at the same time.

  As an example of a preferred aspect of the present invention, the circuit board includes a ground conductor layer formed between the first transmission filter, the first reception filter, the second transmission filter, and the second reception filter. Can be mentioned. This ground conductor layer can more effectively prevent the transmission signal from wrapping around.

  As a typical aspect of the present invention, the first transmission filter and the first reception filter constitute a first demultiplexing circuit, and the second transmission filter and the second reception filter constitute a second demultiplexing circuit. Can be mentioned. In this case, the first branching circuit is mounted on one package, and the package is mounted on the circuit board. On the other hand, if the second transmission filter and the second reception filter are individually embedded in the circuit board, it is preferable from the viewpoint of transmission and reception isolation and from the viewpoint of improving the mounting density. Here, the demultiplexing circuit is a circuit that electrically separates a transmission signal and a reception signal in order to perform transmission and reception with a common antenna in FDD (Frequency Division Duplex) wireless communication technology. It is also called a “shared circuit”. A duplexer that electrically separates two frequency bands is generally called a duplexer.

  As an example of another preferable aspect of the present invention, the device includes a third transmission filter that filters a signal output from the transmission circuit in a third frequency band and a third reception filter that filters a signal input to the reception circuit, The first frequency band and the third frequency band partially overlap or are close to each other, and the third transmission filter and the third reception filter are more than a predetermined distance from the first transmission filter and the first reception filter on the circuit board. The thing characterized by being mounted in the distant position is mentioned.

  As another example of the preferred embodiment of the present invention, a fourth transmission filter for filtering a signal output from the transmission circuit in a fourth frequency band and a fourth reception filter for filtering a signal input to the reception circuit are provided. The second frequency band and the fourth frequency band partially overlap or are close to each other, and the fourth transmission filter and the fourth reception filter are within the circuit board and are separated from the second transmission filter and the second reception filter. The thing characterized by being embed | buried in the position away from the predetermined distance or more is mentioned.

  The high-frequency circuit module according to the present invention includes a circuit board on which a high-frequency signal transmission circuit and a reception circuit are mounted, a first transmission filter that filters a signal output from the transmission circuit in a first frequency band, and a second frequency A second receiving filter for filtering a signal input to the receiving circuit in the band, the first frequency band and the second frequency band are separated by a predetermined frequency or more, and the first frequency band and the second frequency band One is 1 GHz or more and the other is less than 1 GHz, the first transmission filter is mounted on the circuit board, the second reception filter is embedded in the circuit board, and each of the second reception filters is elastic. It is characterized by comprising an acoustic wave filter.

  In the present invention, the first transmission filter is mounted on the circuit board. On the other hand, the second reception filter is mounted in the circuit board. In the present invention, the first frequency band and the second frequency band are separated by a predetermined frequency or more, specifically, one of the first frequency band and the second frequency band is 1 GHz or more and the other is less than 1 GHz, The transmission signal passing through the first transmission filter is prevented from being electromagnetically coupled to the second reception filter. As a result, an improvement in mounting density and a prevention of wraparound of transmission signals to the reception circuit are realized at the same time.

  The high-frequency circuit module according to the present invention includes a circuit board on which a high-frequency signal transmission circuit and a reception circuit are mounted, a first reception filter that filters a signal input to the reception circuit in a first frequency band, and a second A second transmission filter for filtering a signal output from the transmission circuit in the frequency band, the first frequency band and the second frequency band being separated by a predetermined frequency or more, and the first frequency band and the second frequency band One is 1 GHz or more and the other is less than 1 GHz, the first reception filter is mounted on the circuit board, the second transmission filter is embedded in the circuit board, and the second transmission filter is ( Acoustic wave) filter.

  In the present invention, the first reception filter is mounted on the circuit board. On the other hand, the second transmission filter is mounted in the circuit board. In the present invention, the first frequency band and the second frequency band are separated by a predetermined frequency or more, specifically, one of the first frequency band and the second frequency band is 1 GHz or more and the other is less than 1 GHz, The transmission signal passing through the second transmission filter is prevented from being electromagnetically coupled to the first reception filter. As a result, an improvement in mounting density and a prevention of wraparound of transmission signals to the reception circuit are realized at the same time.

  As described above, according to the present invention, the first transmission filter and the first reception filter related to the first frequency band are mounted on the circuit board, and the second transmission filter and the second reception filter related to the second frequency band are mounted. Since it is embedded in the circuit board, the mounting efficiency is improved. Furthermore, since the first frequency band and the second frequency band are separated from each other by a predetermined frequency or more, the transmission signal is prevented from entering the receiving circuit.

High-frequency circuit module schematic circuit diagram Top view of high-frequency circuit module Cross section of high frequency circuit module

  A high-frequency circuit module according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows a schematic circuit diagram of the high-frequency circuit module. In the present embodiment, only the configuration according to the gist of the present invention will be mainly described for the sake of simplicity.

  The high-frequency circuit module 100 according to the present embodiment is used in a mobile phone that supports four frequency bands. As shown in FIG. 1, the high-frequency circuit module 100 includes a high-frequency switch 101, first to fourth duplexers 110, 120, 130, and 140, high-frequency power amplifiers 151 to 154 for transmission, and a radio frequency integrated circuit (RFIC). 160). In the actual circuit configuration, a matching circuit, a bandpass filter for transmission signals, and the like are provided for each frequency band, but are omitted in this embodiment for the sake of simplicity.

  The high frequency switch 101 switches connection between the first to fourth duplexers 110 to 140 and one external antenna 10.

  Each of the duplexers 110 to 140 includes transmission filters 112, 122, 132, and 142 and reception filters 114, 124, 134, and 144, respectively. The transmission filters 112, 122, 132, 142 and the reception filters 114, 124, 134, 144 include various types such as a surface acoustic wave (SAW) filter and a bulk acoustic wave (BAW) filter. Can be used. In this embodiment, a SAW filter is used. The transmission filters 112, 122, 132, 142 are connected to the transmission port of the RFIC 160 via the high frequency power amplifiers 151-154. The reception filters 114, 124, 134, and 144 are connected to the reception port of the RFIC 160.

  The RFIC 160 performs high-frequency signal modulation / demodulation processing, multiplexing processing, and the like. The reception ports of the RFIC 160 connected to the first and third duplexers 110 and 130 are adjacent to each other. The reception ports of the RFIC 160 connected to the second and fourth duplexers 120 and 140 are adjacent to each other.

  As described above, the high-frequency circuit module 100 according to the present embodiment supports four frequency bands, and the duplexers 110 to 140 perform filtering so that only high-frequency signals in each frequency band pass.

  Specifically, the first duplexer 110 is compatible with 2100 MHz W-CDMA (Wideband Code Division Multiple Access) or LTE (Long Term Evolution). Accordingly, the first transmission filter 112 is a bandpass filter of 1920 to 1980 MHz, and the first reception filter 114 is a bandpass filter of 2110 to 2170 MHz.

  The second duplexer 120 supports 900 MHz band W-CDMA or LTE. Therefore, the second transmission filter 122 is a bandpass filter of 880 to 915 MHz, and the second reception filter 124 is a bandpass filter of 925 to 960 MHz.

  The third duplexer 130 corresponds to W-CDMA or LTE in the 1900 MHz band. Therefore, the third transmission filter 132 is a bandpass filter of 1850 to 1910 MHz, and the third reception filter 134 is a bandpass filter of 1930 to 1990 MHz. The transmission frequency band of the first duplexer 110 and the reception frequency band of the third duplexer 130 partially overlap.

  The fourth duplexer 140 corresponds to W-CDMA or LTE in the 850 MHz band. Accordingly, the fourth transmission filter 142 is a bandpass filter of 824 to 849 MHz, and the fourth reception filter 144 is a bandpass filter of 869 to 894 MHz. The reception frequency band of the fourth duplexer 140 and the transmission frequency band of the second duplexer 120 partially overlap.

  Next, the structure of the high-frequency circuit module 100 will be described with reference to FIGS. 2 is a top view of the high-frequency circuit module, and FIG. 3 is a cross-sectional view in the direction of arrow A in FIG.

  As shown in FIGS. 2 and 3, the high-frequency circuit module 100 has the RFIC 160, the first duplexer 110, and the third duplexer 130 mounted on the upper surface of the circuit board 200. Here, the first duplexer 110 includes a first transmission filter 112 and a first reception filter 114 housed in one surface-mounting package. The same applies to the third duplexer 130. On the other hand, the second duplexer 120 and the fourth duplexer 140 are embedded in the circuit board 200. Here, the second duplexer 120 and the fourth duplexer 140 are configured such that some of the components (transmission filter, reception filter, etc.) are individually embedded in the circuit board 200. That is, it should be noted that the second duplexer 120 and the fourth duplexer 140 are not in a form accommodated in a package, unlike the first duplexer 110 and the third duplexer 130.

  The circuit board 200 is a multilayer board formed by alternately laminating insulator layers and conductor layers. As shown in FIG. 3, the circuit board 200 includes a core layer 210 that is a metal conductor layer having good conductivity and is relatively thick, and a plurality of the circuit boards 200 formed on one main surface (upper surface) of the core layer 210. Insulator layer 221 and conductor layer 222, and a plurality of insulator layers 231 and conductor layer 232 formed on the other main surface (lower surface) of core layer 210. The insulator layers 221 and 231 and the conductor layers 222 and 232 are formed on both main surfaces of the core layer 210 by a build-up method. Here, two of the conductor layers 222 located between the core layer 210 and one main surface (upper surface) of the circuit board 200, and the other main surface (lower surface) of the core layer 210 and the circuit board 200, One of the conductor layers 232 located between the layers is a ground conductor layer 225, 226, 235 to which a reference potential (ground) is applied. The ground conductor layers 225 and 235 are the conductor layers 222 and 232 that are closest to the core layer 210, and are connected to the core layer 210 via via conductors 241, respectively. Therefore, the core layer 210 also functions as a ground conductor. Also, a conductor layer 222 is interposed between the two ground conductor layers 225 and 226, and the wiring formed on the conductor layer 222 can function as a strip line. On one main surface (upper surface) of the circuit board 200, conductive lands 201 and wirings 202 for component mounting are formed. In addition, a terminal electrode 205 for connection to the parent substrate is formed on the other main surface (lower surface) of the circuit board 200. An RFIC 160, high-frequency power amplifiers 151 to 154, a first duplexer 110, and a third duplexer 130 are soldered to the land 201.

  The core layer 210 is formed with a through hole 211 for accommodating a component. A second transmission filter 122 and a second reception filter 124 that constitute the second duplexer 120 are disposed in the through hole 211. Therefore, the core layer 210 preferably has a thickness larger than the height of the built-in component. In the present embodiment, core layer 210 is formed of a metal plate, more specifically, a metal plate made of copper or a copper alloy. An insulator such as a resin is integrally filled with the insulator layer 221 or 231 in the through hole 211 and in the gap with the housing component. Terminal electrodes 122 a and 124 a are formed on the upper surfaces of the second transmission filter 122 and the second reception filter 124. The terminal electrodes 122a and 124a are connected to the wiring conductor layer 222 or the ground conductor layer 225 through the via conductors 242. The fourth duplexer 140 is also embedded in the circuit board 200 in the same manner as the second duplexer 120.

  One of the characteristic points of the present invention is that (a) a part of the duplexer is embedded in the circuit board 200, and (b) the embedded duplexer is one main surface (upper surface) of the circuit board 200. (C) the embedded duplexer has a frequency band of the duplexer mounted on one main surface (upper surface) of the circuit board 200 separated by a predetermined frequency or more. It is that you are. Specifically, (c) is that (c1) the frequency band of the transmission filter of the duplexer on the circuit board and the frequency band of the reception filter of the duplexer in the circuit board are separated by a predetermined frequency or more, and (c2) It means that the frequency band of the reception filter of the duplexer on the circuit board is separated from the frequency band of the transmission filter of the duplexer in the circuit board by a predetermined frequency or more. Here, “separate a predetermined frequency or more” means a degree sufficient to prevent a transmission signal passing through one transmission filter from flowing into RFIC 160 by electromagnetically coupling with the other reception filter, that is, electrical isolation. This means that there is a sufficient interval between the frequency bands to ensure the frequency. For example, the frequency band corresponding to the high frequency circuit module 100 is roughly divided into two groups with high and low frequencies, and the embedded duplexer is different from the frequency band of the duplexer mounted on one main surface (upper surface) of the circuit board 200. It can be considered for a frequency band belonging to a group. As a grouping method, a specific frequency (for example, 1 GHz) or more may be set as a high frequency group, and a lower frequency may be set as a low frequency group. As a result, at least an interval greater than the frequency between the groups can be provided.

  One of the characteristic features of the present invention is that (d) a ground conductor layer is formed between the duplexer mounted on the circuit board 200 and the duplexer embedded in the circuit board 200.

  One of the characteristic points of the present invention is that (e) a plurality of duplexers mounted on or in the circuit board 200 are separated from each other by a predetermined distance or more. Here, “separate a predetermined distance or more” means that the RFIC 160 can achieve a desired reception performance even if a transmission signal passing through one transmission filter is electromagnetically coupled to the other reception filter, that is, electrical isolation is achieved. It means that a space between the two is provided to a sufficient extent to ensure.

  One of the characteristic points of the present invention is that (f) when a plurality of duplexers may be used at the same time, one duplexer is placed on one main surface (upper surface) of the circuit board 200. Mounting and embedding the other duplexer in the circuit board 200. It should be noted that it is more preferable from the viewpoint of electrical isolation and heat dissipation if the embedded duplexer is set so that the duplexer mounted on one main surface (upper surface) of the circuit board 200 and its projection area do not overlap.

  The feature points in the high-frequency circuit module 100 according to the present embodiment will be described. In the present embodiment, as shown in FIGS. 2 and 3, the transmission filter 122 and the reception filter 124 of the second duplexer 120 are embedded at positions where the first duplexer 110 and the projection area overlap. Further, the transmission filter 142 and the reception filter 144 of the fourth duplexer 140 are embedded at a position where the third duplexer 130 and the projection area overlap. Further, the first duplexer 110 and the third duplexer 130 have a distance D1 that does not interfere with each other. Here, the duplexer (the first duplexer 110 or the third duplexer 130) mounted on the circuit board 200 and the duplexer (the second duplexer 120 or the fourth duplexer 140) embedded in the circuit board 200 are used at the same time. There is a possibility.

  According to such a high frequency circuit module 100, since some of the duplexers 120 and 140 are embedded in the circuit board 200, the mounting density is improved. Further, since the duplexers 120 and 140 embedded in the circuit board 200 overlap the projection area, the mounting density is good and various wiring lengths connected to the duplexer can be shortened. It will be good.

  Furthermore, according to the high-frequency circuit module 100 according to the present embodiment, the pass frequency band is sufficiently separated between the duplexers 110 and 130 mounted on the circuit board 200 and the duplexers 120 and 140 embedded in the circuit board 200. Therefore, the transmission signal does not wrap around the receiving circuit. That is, electrical isolation is good. Furthermore, since the ground conductor layers 225 and 226 are formed between the duplexers 110 and 130 mounted on the circuit board 200 and the duplexers 120 and 140 embedded in the circuit board 200, further electrical isolation is achieved. It is good. Furthermore, since the duplexers 110 and 130 mounted on the circuit board 200 are mounted apart from each other by a predetermined distance, electrical isolation can be achieved even if a part of both frequency bands overlap or are close to each other. It is good.

  Although omitted in FIG. 1 and the like, generally, a matching circuit is often mounted in the vicinity of each duplexer. In the matching circuit, components are mounted on a circuit board in order to facilitate adjustment after mounting. In the present embodiment, the duplexers 120 and 140 are embedded in the circuit board 200, but the components of the matching circuit connected to the duplexers 120 and 140 are on the circuit board 200 and in the vicinity of the duplexers 120 and 140. I decided to implement it. That is, the matching circuit of the first duplexer 110 and the matching circuit of the second duplexer 120 are mounted in the vicinity. The same applies to the third and fourth duplexers 130 and 140. In the present embodiment, the first and third duplexers 110 and 130 and the second and fourth duplexers 120 and 140 are sufficiently separated from each other in the pass frequency band, and the ground conductor layers 225 and 226 exist. Thus, interference through the matching circuit can be prevented. Further, since the first duplexer 110 and the third duplexer 130 are partially overlapped or close to each other, the matching circuits are separated by a distance that does not interfere with each other, or the coupling is small. Arrange so that Similarly, since the second duplexer 120 and the fourth duplexer 140 are partially overlapped or close to each other, the respective matching circuits are separated by a distance that does not interfere with each other, or the coupling is small. Arrange so that Thereby, interference via the matching circuit can be prevented.

  Furthermore, according to the high-frequency circuit module 100 according to the present embodiment, one of the duplexers 110 and 130 and the duplexers 120 and 140 that may be used at the same time is mounted on the circuit board 200, and the other is the circuit board 200. Since the heat generated in the duplexer, in particular, the transmission filter is not concentrated, the heat can be released through different paths. Thereby, the characteristic deterioration by heat can be prevented.

  Although one embodiment of the present invention has been described above, the present invention is not limited to this. For example, in the above-described embodiment, copper or a copper alloy is exemplified as the material of the core layer 210, but other metals, alloys, resins, and other materials are not required. Further, the presence or absence of conductivity of the core layer 210 is not questioned. Furthermore, in the above-described embodiment, the circuit board 200 having the relatively thick core layer 210 is illustrated, but a multilayer circuit board without the core layer 210 may be used. In the above embodiment, the upper surface of the circuit board 200 is exposed in a state where various components are mounted. However, a case is attached so as to cover the whole or part of the upper surface of the circuit board 200 or a resin or the like is used. You may make it seal.

  In the above-described embodiment, the duplexers 110 and 130 housed in the package are mounted on the circuit board 200. However, the transmission filter and the reception filter constituting the duplexer may be individually mounted on the circuit board 200. . Further, in the above embodiment, the transmission filter and the reception filter constituting the duplexer are embedded as individual components in the circuit board 200, but the duplexer accommodated in the package may be embedded. Furthermore, in the above-described embodiment, one transmission filter and one reception filter are arranged in each through hole 211 formed in the core layer 210, but a plurality of filters may be arranged in one through hole 211.

  Further, the frequency band described in the above embodiment is merely an example, and the present invention can be implemented even in other frequency bands. In the above embodiment, a duplexer is used as an example of a duplexer (antenna duplexer). However, the present invention can be implemented even with a duplexer having three or more pass frequency bands such as a triplexer.

  DESCRIPTION OF SYMBOLS 10 ... Antenna, 100 ... High frequency circuit module, 110, 120, 130, 140 ... Duplexer, 112, 122, 132, 142 ... Transmission filter, 114, 124, 134, 144 ... Reception filter, 160 ... RFIC, 200 ... Circuit board , 210 ... core layer, 211 ... through hole, 225, 226, 235 ... ground conductor layer

The high-frequency circuit module according to the present invention includes a circuit board on which a high-frequency signal transmission circuit and a reception circuit are mounted, a first transmission filter that filters a signal output from the transmission circuit in a first frequency band, and a second frequency A second receiving filter for filtering a signal input to the receiving circuit in the band, the first frequency band and the second frequency band are separated by a predetermined frequency or more, and the first frequency band and the second frequency band One is 1 GHz or more and the other is less than 1 GHz, the first transmission filter is mounted on the circuit board, the second reception filter is embedded in the circuit board, and the second reception filter is an elastic wave (Acoustic Wave) Ri Do from the filter, the circuit board is a multilayer circuit board formed by laminating an insulating layer and a conductor layer, larger thickness than the other conductive layer and ground The second reception filter is disposed in a through hole formed in the core layer. The core layer is a conductor layer that functions as a conductor layer .

The high-frequency circuit module according to the present invention includes a circuit board on which a high-frequency signal transmission circuit and a reception circuit are mounted, a first reception filter that filters a signal input to the reception circuit in a first frequency band, and a second A second transmission filter for filtering a signal output from the transmission circuit in the frequency band, the first frequency band and the second frequency band being separated by a predetermined frequency or more, and the first frequency band and the second frequency band One is 1 GHz or more and the other is less than 1 GHz, the first reception filter is mounted on the circuit board, the second transmission filter is embedded in the circuit board, and the second transmission filter is elastic Ri Do from the wave (Acoustic wave) filter, the circuit board is a multilayer circuit board formed by laminating an insulating layer and a conductor layer, larger thickness than the other conductive layer and Grad The second transmission filter is disposed in a through-hole formed in the core layer. The core layer is a conductor layer that functions as a conductor .

Claims (12)

A circuit board on which a high-frequency signal transmission circuit and a reception circuit are mounted;
A first transmission filter for filtering a signal output from the transmission circuit in the first frequency band;
A second reception filter for filtering a signal input to the reception circuit in the second frequency band,
The first frequency band and the second frequency band are separated by a predetermined frequency or more, and one of the first frequency band and the second frequency band is 1 GHz or more and the other is less than 1 GHz,
The first transmission filter is mounted on the circuit board,
The second receiving filter is embedded in the circuit board,
The high frequency circuit module, wherein the second reception filter is an (Acoustic Wave) filter. The high-frequency circuit module according to claim 1, wherein the circuit board includes a ground conductor layer formed between the first transmission filter and the second reception filter. The first reception filter for filtering a signal input to the reception circuit in the first frequency band is provided, and the first transmission filter and the first reception filter constitute a first branching circuit. 2. The high-frequency circuit module according to any one of 2 above. The high-frequency circuit module according to claim 3, wherein the first demultiplexing circuit is mounted on one package, and the package is mounted on a circuit board. The circuit board is composed of a multilayer circuit board formed by laminating an insulator layer and a conductor layer, and includes a core layer that is a conductor layer that is thicker than other conductor layers and functions as a ground,
5. The high-frequency circuit module according to claim 1, wherein the second reception filter is disposed in a through hole formed in the core layer. A circuit board on which a high-frequency signal transmission circuit and a reception circuit are mounted;
A first reception filter for filtering a signal input to the reception circuit in the first frequency band;
A second transmission filter for filtering a signal output from the transmission circuit in the second frequency band,
The first frequency band and the second frequency band are separated by a predetermined frequency or more, and one of the first frequency band and the second frequency band is 1 GHz or more and the other is less than 1 GHz,
The first receiving filter is mounted on the circuit board,
The second transmission filter is embedded in the circuit board,
The high-frequency circuit module, wherein the second transmission filter is an (Acoustic Wave) filter. The high frequency circuit module according to claim 6, wherein the circuit board includes a ground conductor layer formed between the first reception filter and the second transmission filter. The first transmission filter that filters a signal output from the transmission circuit in the first frequency band, and the first transmission filter and the first reception filter constitute a first demultiplexing circuit. The high-frequency circuit module according to any one of 7. The high-frequency circuit module according to claim 8, wherein the first branching circuit is mounted on one package, and the package is mounted on a circuit board. The circuit board is composed of a multilayer circuit board formed by laminating an insulator layer and a conductor layer, and includes a core layer that is a conductor layer that is thicker than other conductor layers and functions as a ground,
The high-frequency circuit module according to any one of claims 6 to 9, wherein the second transmission filter is disposed in a through hole formed in the core layer. 11. The high-frequency circuit module according to claim 1, wherein the transmitting circuit and the receiving circuit use the first frequency band and the second frequency band at the same time. The high-frequency circuit module according to claim 1, wherein the transmission circuit and the reception circuit transmit and receive a high-frequency signal according to FDD (Frequency Division Duplex).

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