JP2014033016A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor device that allows reducing the difference of cooling efficiency between a plurality of heat generating bodies by a cooling medium.SOLUTION: An inverter device 10 comprises: first, third, and fifth switching elements Q1, Q3, and Q5; a plurality of diodes D; and a cooler 20. The cooler 20 includes a U-phase coolant passage 32, a V-phase coolant passage, and a W-phase coolant passage 52. Each of the coolant passages 32, 42, and 52 is provided with inflow openings 31c, 41c, and 51c and outflow openings 31d, 41d, and 51d, respectively, and feed passages 34, 44, and 54 are connected to the inflow openings 31c, 41c, and 51c, respectively.

Description

  The present invention is a cooler having a plurality of heat generating elements and a refrigerant flow path inside, the heat generating elements being thermally coupled to the outer surface, and plate fins extending in the flow direction of the cooling medium in the refrigerant flow paths. And a semiconductor device.

  In a semiconductor device, cooling efficiency of a semiconductor element by a cooler is desired. As shown in FIGS. 6A and 6B, a control board 82 is disposed in the case 81 of the power conversion device 80 disclosed in Patent Document 1, and the smoothing is provided on the control board 82. A capacitor 83 is disposed. Further, two cooling passages 84 and 85 are arranged on the control board 82 so as to sandwich the smoothing capacitor 83. The cooling passages 84 and 85 each extend linearly along the length direction of the smoothing capacitor 83. The cooling passages 84 and 85 are formed of groove portions 84a and 85a supported on the control board 82 and lid portions 84b and 85b supported on the groove portions 84a and 85a, respectively.

  In addition, inlets 86 and 87 through which the cooling fluid flows are provided at one end of the cooling passages 84 and 85, and outlets 88 and 89 through which the cooling fluid flows out are provided at the other end of the cooling passages 84 and 85. Yes. The upper arm power module 90 (heating element), which is a semiconductor element, is thermally coupled to the upper surface of the lid portion 84b that forms the cooling passage 84, and the lower arm power module 91 (heating element) forms the cooling passage 85. It is thermally coupled to the upper surface of lid portion 85b.

  Three upper arm power modules 90 are arranged along the flow direction of the cooling fluid in the cooling passage 84, and three lower arm power modules 91 are arranged along the flow direction of the cooling fluid in the cooling passage 85. The upper arm power module 90 and the lower arm power module 91 are cooled by the cooling fluid flowing through the cooling passages 84 and 85.

JP 2012-70570 A

  However, in the power conversion device 80 of Patent Document 1, the cooling fluid exchanges heat with the upper arm power modules 90 and the lower arm power modules 91 as they flow from the inlets 86 and 87 to the outlets 88 and 89. The cooling efficiency decreases as the outlets 88 and 89 are approached. Therefore, among the plurality of upper arm power modules 90 and lower arm power modules 91, the upper arm power modules 90 and lower arm power modules 91 close to the inflow ports 86 and 87 and the upper arm power modules close to the outflow ports 88 and 89. A difference in the cooling efficiency due to the cooling fluid occurs between 90 and the lower arm power module 91.

  An object of the present invention is to provide a semiconductor device capable of reducing a difference in cooling efficiency due to a cooling medium between a plurality of heating elements.

  In order to solve the above-mentioned problems, the invention according to claim 1 includes a plurality of heating elements having a plurality of semiconductor elements, a refrigerant flow path inside, and the heating element is thermally coupled to an outer surface. And a cooler provided with plate fins extending in the flow direction of the cooling medium in the refrigerant flow path, the cooling medium flowing through the supply path and being supplied to the refrigerant flow path In the semiconductor device, the cooler includes a plurality of the refrigerant flow paths, each refrigerant flow path individually includes an inlet and an outlet for the cooling medium, and the supply path is connected to each inlet. The plurality of heating elements are provided so as to be able to exchange heat with the cooling medium in the refrigerant flow path corresponding to each individually, and in each refrigerant flow path, a plurality of semiconductor elements of each heating element are provided for each refrigerant flow path. The cooling medium flows to cool separately It is the gist of.

  According to this, the cooling medium individually flows into the respective refrigerant flow paths from the inlet through the supply path, and flows through the respective refrigerant flow paths without being disturbed by the plate fins. Therefore, the cooling medium flowing through the refrigerant flow path does not flow into the refrigerant flow path after flowing through the other refrigerant flow paths, but the cooling medium that is not heat-exchanged flows into each refrigerant flow path. Therefore, each heating element is individually heat-exchanged by the cooling medium flowing through each refrigerant flow path, and the difference in cooling efficiency between the heating elements can be reduced.

The plurality of refrigerant channels may be formed inside separate channel forming members, and the cooler may include a plurality of the channel forming members.
According to this, the cooler which provided the some refrigerant | coolant flow path separately can be manufactured easily.

Further, the semiconductor device may constitute at least one of an inverter and a converter by electrically connecting a plurality of the heating elements.
According to this, since at least one of the inverter and the converter has a plurality of heating elements, it is possible to efficiently cool at least one of the inverter and the converter by suppressing a difference in cooling efficiency between the heating elements. it can.

In addition, a discharge path may be connected to each of the plurality of outlets.
According to this, the cooling medium that has flowed out of the refrigerant flow path through the respective outlets can be collectively flowed.

  ADVANTAGE OF THE INVENTION According to this invention, the difference of the cooling efficiency by the cooling medium between several heat generating bodies can be made small.

The figure which shows the electrical constitution of the inverter circuit in embodiment. The perspective view which shows the semiconductor device of embodiment. 2A is a sectional view taken along the line 3a-3a in FIG. 2 showing the U-phase refrigerant flow path, FIG. 2B is a sectional view taken along the line 3b-3b in FIG. 2 showing the V-phase refrigerant flow path, and FIG. FIG. 3C is a cross-sectional view taken along line 3c-3c in FIG. The partially broken top view which shows a cooling device. The top view which shows the semiconductor device of another example. (A) is a top view which shows background art, (b) is sectional drawing which shows background art.

Hereinafter, an embodiment in which a semiconductor device of the present invention is embodied in an inverter device mounted on an electric vehicle will be described with reference to FIGS.
First, the electrical configuration of the inverter device 10 will be described. The inverter device 10 is mounted on an electric vehicle and drives a three-phase motor 15 of the electric vehicle.

  As shown in FIG. 1, the inverter circuit 11 has six switching elements Q1 to Q6 as heating elements, and semiconductor elements are used for the switching elements Q1 to Q6. In this embodiment, IGBTs (insulated gate bipolar transistors) are used as the switching elements Q1 to Q6. In the inverter circuit 11, first and second switching elements Q1 and Q2, third and fourth switching elements Q3 and Q4, and fifth and sixth switching elements Q5 and Q6 are connected in series, respectively. Between the collectors and emitters of the switching elements Q1 to Q6, a semiconductor element and a diode D as a heating element are connected in antiparallel, that is, in a state where the cathode corresponds to the collector and the anode corresponds to the emitter. A set of the first, third and fifth switching elements Q1, Q3, Q5 and the diode D is called an upper arm, respectively, and a set of the second, fourth and sixth switching elements Q2, Q4, Q6 and the diode D is called an upper arm. Are each called the lower arm. Each of the first, third and fifth switching elements Q1, Q3, Q5 and the diode D is a heating element made of a semiconductor element, and the second, fourth and sixth switching elements Q2, Q4, Each set of Q6 and diode D is a heating element made of a semiconductor element.

  The collectors of switching elements Q1, Q3, and Q5 are connected to the positive terminal of DC power supply 13 through wiring 12, respectively, and the emitters of switching elements Q2, Q4, and Q6 are connected to the negative terminal of DC power supply 13 through wiring 14, respectively. Is done. The junction between the switching elements Q1 and Q2 is at the U-phase terminal U of the three-phase motor 15, the junction between the switching elements Q3 and Q4 is at the V-phase terminal V of the three-phase motor 15, and the switching elements Q5 and Q6. The junction point between them is connected to the W-phase terminal W of the three-phase motor 15.

Next, the structure of the inverter device 10 will be described in detail.
As shown in FIG. 2, the inverter device 10 includes a set of a first switching element Q1 and a diode D of the upper arm of the U phase, a set of a third switching element Q3 and a diode D of the upper arm of the V phase, A pair of a fifth switching element Q5 and a diode D of the upper arm of the phase is provided. The U-phase lower arm second switching element Q2 and diode D, the V-phase lower arm fourth switching element Q4 and diode D, and the W-phase lower arm sixth switching element. About an inverter apparatus provided with the group of Q6 and the diode D, since the structure is the same as the inverter apparatus 10 of an upper arm, description is abbreviate | omitted.

The cooler 20 of the inverter device 10 will be described.
The cooler 20 is formed by juxtaposing a U-phase flow path forming member 31, a V-phase flow path forming member 41, and a W-phase flow path forming member 51. As shown in FIG. 3A and FIG. 4, the U-phase flow path forming member 31 is formed of a rectangular bottom plate 31a and a rectangular box-shaped casing 31b covering the bottom plate 31a. A U-phase refrigerant channel 32 is formed in the channel forming member 31. A U-phase inlet 31c is formed near one long side of the pair of long sides of the bottom plate 31a and near one end in the long side direction, and near the other long side and in the long side direction. A U-phase outlet 31d is formed near one end. A plurality of plate fins 33 are erected in the U-phase refrigerant flow path 32 so as to extend in the short side direction of the bottom plate 31a.

  In the U-phase flow path forming member 31, one end of the U-phase supply path 34 is connected to the outer surface of the bottom plate 31a so as to surround the U-phase inlet 31c. A refrigerant supply path 60 is connected to the end. Further, in the U-phase flow path forming member 31, one end of the U-phase discharge path 35 is connected to the outer surface of the bottom plate 31a so as to surround the U-phase outlet 31d. A refrigerant discharge path 61 is connected to the other end. The U-phase supply path 34 and the U-phase discharge path 35 are arranged on one end side in the long side direction of the U-phase flow path forming member 31, the V-phase flow path forming member 41, and the W-phase flow path forming member 51. Located on the lower side. The U-phase supply path 34 and the U-phase discharge path 35 are disposed with the U-phase flow path forming member 31 interposed therebetween and are disposed on the same straight line. Further, the U-phase supply path 34 and the U-phase discharge path 35 are provided apart from the V-phase flow path forming member 41 and the W-phase flow path forming member 51.

  As shown in FIG. 2, in the U-phase flow path forming member 31, the first switching element Q <b> 1 is joined to the outer surface of the casing 31 b near one end in the long side direction, and the outer surface near the other end is connected to the outer surface near the other end. A diode D is joined. That is, the first switching element Q1 and the diode D constituting the upper arm of the U phase are joined to the outer surface of the U phase flow path forming member 31. Therefore, the first switching element Q <b> 1 and the diode D are arranged along the long side direction of the U-phase flow path forming member 31.

  As shown in FIG. 3B and FIG. 4, the V-phase flow path forming member 41 is formed of a rectangular bottom plate 41a and a rectangular box-shaped casing 41b covering the bottom plate 41a. A V-phase refrigerant channel 42 is formed in the channel forming member 41. A V-phase inlet 41c is formed near one long side of the pair of long sides of the bottom plate 41a and at the center in the long side direction, and near the other long side and at the center in the long side direction. A V-phase outlet 41d is formed. A plurality of plate fins 43 are erected in the V-phase refrigerant flow path 42 so as to extend in the short side direction of the bottom plate 41a.

  In the V-phase flow path forming member 41, one end of the V-phase supply path 44 is connected to the outer surface of the bottom plate 41a so as to surround the V-phase inlet 41c. A refrigerant supply path 60 is connected to the end. One end of a V-phase discharge path 45 is connected to the outer surface of the bottom plate 41a so as to surround the V-phase outlet 41d, and a refrigerant discharge path 61 is connected to the other end of the V-phase discharge path 45. It is connected. The V-phase supply path 44 and the V-phase discharge path 45 are the U-phase flow path forming member 31, the V-phase flow path forming member 41, and the W-phase flow path forming member 51. Is arranged. The V-phase supply path 44 and the V-phase discharge path 45 are arranged with the V-phase flow path forming member 41 interposed therebetween and are arranged on the same straight line. The V-phase supply path 44 and the V-phase discharge path 45 are provided apart from the U-phase flow path forming member 31 and the W-phase flow path forming member 51.

  As shown in FIG. 2, in the V-phase flow path forming member 41, the third switching element Q3 is joined to the outer surface near one end in the long side direction of the casing 41b, and the outer surface near the other end is connected to the outer surface near the other end. A diode D is joined. That is, the third switching element Q3 and the diode D constituting the upper arm of the V phase are joined to the outer surface of the V phase flow path forming member 41. Therefore, the third switching element Q3 and the diode D are arranged along the long side direction of the V-phase flow path forming member 41.

  As shown in FIG. 3C and FIG. 4, the W-phase flow path forming member 51 is formed of a rectangular bottom plate 51a and a rectangular box-shaped casing 51b covering the bottom plate 51a. A W-phase coolant channel 52 is formed in the channel forming member 51. A W-phase inlet 51c is formed near one of the pair of long sides of the bottom plate 51a and near the other end in the long side direction, and near the other long side and in the long side direction, etc. A W-phase outlet 51d is formed near the end. A plurality of plate fins 53 are erected in the W-phase refrigerant channel 52 so as to extend in the short side direction of the bottom plate 51a.

  In the W-phase flow path forming member 51, one end of the W-phase supply path 54 is connected to the outer surface of the bottom plate 51a so as to surround the W-phase inlet 51c. A refrigerant supply path 60 is connected to the end. In the W-phase flow path forming member 51, one end of a W-phase discharge path 55 is connected to the outer surface of the bottom plate 51a so as to surround the W-phase outlet 51d. A refrigerant discharge path 61 is connected to the other end. The W-phase supply path 54 and the W-phase discharge path 55 are the other end side in the long side direction of the U-phase flow path forming member 31, the V-phase flow path forming member 41, and the W-phase flow path forming member 51. Located on the lower side. The W-phase supply path 54 and the W-phase discharge path 55 are disposed with the W-phase flow path forming member 51 interposed therebetween and are disposed on the same straight line. The W-phase supply path 54 and the W-phase discharge path 55 are provided apart from the U-phase flow path forming member 31 and the V-phase flow path forming member 41.

  As shown in FIG. 2, in the W-phase flow path forming member 51, the fifth switching element Q5 is joined to the outer surface near one end in the long side direction of the casing 51b, and the outer surface near the other end is connected to the outer surface near the other end. A diode D is joined. That is, the fifth switching element Q5 and the diode D constituting the upper arm of the W phase are joined to the outer surface of the W-phase flow path forming member 51. Therefore, the fifth switching element Q5 and the diode D are arranged along the long side direction of the W-phase flow path forming member 51.

  In the cooler 20, the refrigerant as the cooling medium that flows through the refrigerant supply path 60 individually flows into the U-phase refrigerant flow path 32, the V-phase refrigerant flow path 42, and the W-phase refrigerant flow path 52. Further, the refrigerant is individually discharged from the U-phase refrigerant flow path 32, the V-phase refrigerant flow path 42, and the W-phase refrigerant flow path 52 and flows through the refrigerant discharge path 61. Here, if the direction in which the refrigerant extends from the refrigerant supply path 60 toward the refrigerant discharge path 61 is the direction in which a straight line connecting the refrigerant supply path 60 and the refrigerant discharge path 61 extends, The long side direction of the path forming member 31, the V-phase channel forming member 41, and the W-phase channel forming member 51 is perpendicular to the traveling direction of the refrigerant. In addition, the U-phase flow path forming member 31, the V-phase flow path forming member 41, and the W-phase flow path forming member 51 are arranged in parallel along the direction in which the refrigerant travels. Furthermore, the U-phase flow path forming member 31 and the V-phase flow path forming member 41 that are arranged in parallel in the refrigerant traveling direction are separated from each other, and the V-phase flow path forming member 41 and the W-phase flow path forming member 51 are separated. Is separated from

Next, the operation of the inverter device 10 will be described.
The refrigerant that has flowed through the refrigerant supply path 60 and before heat exchange is divided into the U-phase supply path 34, the V-phase supply path 44, and the W-phase supply path 54. Then, the refrigerant that has flowed through the U-phase supply path 34 flows into the U-phase flow path forming member 31 from the U-phase inlet 31 c and flows through the U-phase refrigerant flow path 32. In the U-phase refrigerant flow path 32, the refrigerant is divided into a plurality by the plate fins 33 and flows along the short side direction of the U-phase flow path forming member 31. The divided refrigerant flows into the gaps between the plate fins 33 of the U-phase flow path forming member 31.

  The first switching element Q1 and the diode D constituting the upper arm of the U phase are arranged in a direction perpendicular to the direction in which the refrigerant flows in the U phase refrigerant flow path 32. For this reason, the first switching element Q1 and the diode D exchange heat with the refrigerant. Then, the refrigerant that has flowed between the plate fins 33 and exchanged heat flows out of the U-phase outlet 31d to the outside of the U-phase refrigerant passage 32, flows through the U-phase discharge passage 35, and enters the refrigerant discharge passage 61. Discharged.

  The refrigerant that has flowed through the V-phase supply path 44 flows into the V-phase flow path forming member 41 from the V-phase inlet 41c and flows through the V-phase refrigerant flow path 42. The refrigerant flowing into the V-phase refrigerant flow path 42 is not the refrigerant that has flowed through the U-phase flow path forming member 31 and the W-phase flow path forming member 51, but the refrigerant that has just flowed through the refrigerant supply path 60.

  In the V-phase refrigerant flow path 42, the refrigerant is divided into a plurality by the plate fins 43 and flows along the short side direction of the V-phase flow path forming member 41. The divided refrigerant flows at substantially the same flow rate in the gaps between the plate fins. The third switching element Q3 and the diode D constituting the upper arm of the V phase are arranged in a direction perpendicular to the direction in which the refrigerant flows in the V phase refrigerant flow path 42. For this reason, the third switching element Q3 and the diode D exchange heat with the refrigerant almost equally. Then, the refrigerant that flows between the plate fins 43 and exchanges heat flows out from the V-phase outlet 41d to the outside of the V-phase refrigerant flow path 42, flows through the V-phase discharge path 45, and enters the refrigerant discharge path 61. Discharged.

  The refrigerant that has flowed through the W-phase supply path 54 flows into the W-phase flow path forming member 51 from the W-phase inlet 51c and flows through the W-phase refrigerant flow path 52. The refrigerant flowing into the W-phase refrigerant flow path 52 is not the refrigerant that has flowed through the U-phase flow path forming member 31 and the V-phase flow path forming member 41 but the refrigerant that has just flowed through the refrigerant supply path 60.

  In the W-phase refrigerant flow path 52, the refrigerant is divided into a plurality by the plate fins 53 and flows along the short side direction of the W-phase flow path forming member 51. The divided refrigerant flows through the gaps between the plate fins 53. The fifth switching element Q5 and the diode D constituting the upper arm of the W phase are arranged in a direction perpendicular to the direction in which the refrigerant flows in the W phase refrigerant flow path 52. For this reason, the fifth switching element Q5 and the diode D exchange heat with the refrigerant. Then, the refrigerant that has flowed between the plate fins 53 and exchanged heat flows out of the W-phase outlet 51d to the outside of the W-phase refrigerant passage 52, flows through the W-phase discharge passage 55, and enters the refrigerant discharge passage 61. Discharged.

According to the above embodiment, the following effects can be obtained.
(1) The cooler 20 includes a U-phase flow path forming member 31, a V-phase flow path forming member 41, and a W-phase flow path forming member 51. The flow path forming members 31, 41, 51 are individually provided. Inflow ports 31c, 41c, 51c are provided. A refrigerant supply path 60 is connected to each inflow port 31c, 41c, 51c. Therefore, each refrigerant flows into the refrigerant flow paths 32, 42, 52 from the inlets 31c, 41c, 51c individually through the refrigerant supply path 60. Therefore, since the refrigerant not heat-exchanged flows into each refrigerant flow path 32, 42, 52, the first, third and fifth switching elements Q1, Q3, Q5 and the diode D are connected to each refrigerant flow path. It is possible to cool separately at 32, 42 and 52. Therefore, the difference in cooling efficiency between the first, third and fifth switching elements Q1, Q3, Q5 and between the diodes D can be reduced.

  (2) The cooler 20 includes a U-phase flow path forming member 31, a V-phase flow path forming member 41, and a W-phase flow path forming member 51. The flow path forming members 31, 41, 51 are individually provided. Inflow ports 31c, 41c, 51c are provided. And any switching element Q1, Q3, Q5 and the diode D can be cooled with the refrigerant | coolant which is not heat-exchanged, and switching element Q1, Q3, Q5 and the diode D can be driven in the stable state.

  (3) In each refrigerant flow path 32, 42, 52, the refrigerant flows in a direction perpendicular to the direction in which the switching elements Q1, Q3, Q5 and the diode D are arranged. And each plate fin 33, 43, 53 is provided along the direction through which this refrigerant | coolant flows. Therefore, the flow of the refrigerant is not disturbed by the plate fins 33, 43, and 53, and the refrigerant is divided along the arrangement direction of the switching elements Q1, Q3, and Q5 and the diode D so that the switching elements Q1, Q3, and Q5 The diode D can be cooled almost uniformly.

  (4) The flow direction of the refrigerant in each refrigerant flow path 32, 42, 52 is perpendicular to the arrangement direction of the switching elements Q1, Q3, Q5 and the diode D. For this reason, compared with the case where a refrigerant | coolant flows along the arrangement direction of each switching element Q1, Q3, Q5 and the diode D, length of the refrigerant | coolant flow paths 32, 42, and 52 required in order to flow a refrigerant | coolant is shortened. Thus, the cooler 20, and thus the inverter device 10, can be made compact.

  (5) The refrigerant flow paths 32, 42, 52 are formed in the flow path forming members 31, 41, 51, respectively. Therefore, the structure for dividing each refrigerant flow path 32,42,52 separately can be made easily, and the cooler 20 which provided the several refrigerant flow paths 32,42,52 separately is manufactured easily. Can do.

  (6) The inverter device 10 includes an inverter circuit 11 and includes a plurality of switching elements Q1, Q3, and Q5 and a diode D, and the switching elements Q1, Q3, and Q5 using the flow path forming members 31, 41, and 51, respectively. The difference in cooling efficiency between the two is reduced. Therefore, in the inverter device 10, the plurality of switching elements Q1, Q3, Q5 and the diode D can be driven efficiently.

  (7) Each inflow port 31c, 41c, 51c of each flow path forming member 31, 41, 51 is connected to one refrigerant supply path 60 via each supply path 34, 44, 54. For this reason, the refrigerant can be diverted from the refrigerant supply path 60 to the supply paths 34, 44, 54. Therefore, for example, compared with the case where each of the supply paths 34, 44, 54 is individually connected to the refrigerant supply source, each of the supply paths 34, 44, 54 is shortened to make the cooler 20 and thus the inverter device 10 compact. Can be.

  (8) Each outlet 31d, 41d, 51d of each flow path forming member 31, 41, 51 is connected to one refrigerant discharge path 61 via each discharge path 35, 45, 55. For this reason, the refrigerant | coolant which flowed out from each refrigerant | coolant flow path 32,42,52 can be collectively flowed through each outflow port 31d, 41d, 51d. Therefore, for example, compared with the case where each discharge path 35, 45, 55 is individually connected to the refrigerant discharge destination, each discharge path 35, 45, 55 is shortened to make the cooler 20 and thus the inverter device 10 compact. Can be.

  (9) The long-side direction of the U-phase flow path forming member 31, the V-phase flow path forming member 41, and the W-phase flow path forming member 51 is perpendicular to the traveling direction of the refrigerant in the cooler 20. It is juxtaposed to the state. Therefore, the cooling device 20 can be made compact while the switching elements Q1, Q3, Q5 and the diode D can be similarly cooled by the refrigerant in the flow path forming members 31, 41, 51.

  (10) The U-phase discharge path 35 connected to the U-phase flow path forming member 31 is provided in non-contact with the V-phase flow path forming member 41 and the W-phase flow path forming member 51. For this reason, it is possible to prevent the refrigerant in the V-phase refrigerant flow path 42 and the W-phase refrigerant flow path 52 from being heated by the refrigerant heat-exchanged in the U-phase refrigerant flow path 32. The V-phase discharge path 45 connected to the V-phase flow path forming member 41 is provided in non-contact with the W-phase flow path forming member 51. For this reason, it is possible to prevent the refrigerant in the W-phase refrigerant flow path 52 from being heated by the refrigerant heat-exchanged in the V-phase refrigerant flow path 42.

  The V-phase supply path 44 connected to the V-phase flow path forming member 41 is provided in non-contact with the U-phase flow path forming member 31. Therefore, it is possible to prevent the refrigerant before being supplied to the V-phase refrigerant flow path 42 from being heated by the refrigerant heat-exchanged in the U-phase refrigerant flow path 32. The W-phase supply path 54 connected to the W-phase flow path forming member 51 is provided in non-contact with the U-phase flow path forming member 31 and the V-phase flow path forming member 41. Therefore, it is possible to prevent the refrigerant before being supplied to the W-phase refrigerant flow path 52 from being heated by the refrigerant heat-exchanged in the U-phase refrigerant flow path 32 and the V-phase refrigerant flow path 42.

In addition, you may change the said embodiment as follows.
In the embodiment, the arrangement direction of the switching elements Q1, Q3, Q5 and the diode D is arranged so as to be perpendicular to the refrigerant traveling direction, but may not be perpendicular. In each refrigerant flow path 32, 42, 52, a plurality of semiconductor elements may be arranged to be cooled separately for each refrigerant flow path 32, 42, 52.

  In the embodiment, one refrigerant discharge path 61 is connected to each outlet 31d, 41d, 51d of each flow path forming member 31, 41, 51 via each discharge path 35, 45, 55. The discharge paths 35, 45, and 55 connected to the outlets 31d, 41d, and 51d may be directly connected to the refrigerant discharge destination, and the refrigerant discharge path 61 may be eliminated.

  In the embodiment, one refrigerant supply path 60 is connected to each inlet 31c, 41c, 51c of each flow path forming member 31, 41, 51 via each supply path 34, 44, 54. The supply paths 34, 44, 54 connected to the inflow ports 31c, 41c, 51c may be directly connected to the refrigerant supply source, respectively, and the refrigerant supply path 60 may be eliminated.

  In the embodiment, the U-phase refrigerant flow path 32, the V-phase refrigerant flow path 42, and the W-phase refrigerant flow path 52 are separated into separate U-phase flow path forming member 31 and V-phase flow path forming member 41, respectively. Although formed in the W-phase flow path forming member 51, the present invention is not limited to this. A space of one cooler may be partitioned by a partition wall or the like, and a U-phase refrigerant channel 32, a V-phase refrigerant channel 42, and a W-phase refrigerant channel 52 may be provided in one cooler. .

  In the embodiment, the U-phase flow path forming member 31 (U-phase refrigerant flow path 32), the V-phase flow path forming member 41 (V-phase refrigerant flow path 42), and the W-phase flow path forming member 51. Although arranged in the order of (W-phase refrigerant flow path 52), the arrangement order may be arbitrarily changed.

The semiconductor device may be a converter.
In the embodiment, the supply paths 34, 44, 54 and the discharge paths 35, 45, 55 are arranged below the flow path forming members 31, 41, 51, but the supply paths 34, 44, 54 and the respective discharge paths 35, 45, 55 may be arranged on the lateral side or the upper side of the respective flow path forming members 31, 41, 51.

  As shown in FIG. 5, the cooler 20 includes a U-phase flow path forming member 31, a V-phase flow path forming member 41, and a W-phase flow path forming member 51 for cooling the inverter circuit 11. The converter flow path forming member 22 may be provided for cooling the converter circuit. The converter flow path forming member 22 is connected to a converter supply flow path 22a and a converter discharge flow path 22b.

Next, the technical idea that can be grasped from the above embodiment and other examples will be described below.
(A) The semiconductor according to any one of claims 1 to 4, wherein the supply path is not in contact with a flow path forming member different from the connected flow path forming member. apparatus.

  Q1 to Q6: a semiconductor element and a first switching element as a heating element, D: a diode as a semiconductor element and a heating element, 20 ... a cooler, 31, 41, 51 ... a flow path forming member, 31c, 41c, 51c ... Inlet, 31d, 41d, 51d ... Outlet, 32, 42, 52 ... Refrigerant flow path, 33, 43, 53 ... Plate fin, 34, 44, 54 ... Supply path, 35, 45, 55 ... Discharge path.

Claims (4)

A plurality of heating elements having a plurality of semiconductor elements;
A cooler having a refrigerant flow path therein, the heating element being thermally coupled to an outer surface, and a plate fin extending in a flow direction of the cooling medium in the refrigerant flow path;
A semiconductor device configured such that the cooling medium flows through a supply path and is supplied to the refrigerant flow path,
The cooler includes a plurality of the coolant channels, each coolant channel individually includes an inlet and an outlet of the cooling medium, and the supply path is connected to each inlet,
The plurality of heating elements are provided so as to be able to exchange heat with the cooling medium in the refrigerant flow path corresponding to each individually, and in each refrigerant flow path, a plurality of semiconductor elements of each heating element are separately provided for each refrigerant flow path. A semiconductor device characterized in that the cooling medium flows so as to be cooled.   2. The semiconductor device according to claim 1, wherein the plurality of refrigerant flow paths are respectively formed inside separate flow path forming members, and the cooler includes a plurality of the flow path forming members.   The semiconductor device according to claim 1, wherein at least one of an inverter and a converter is configured by electrically connecting a plurality of the plurality of heating elements.   The semiconductor device according to claim 1, wherein a discharge path is connected to each of the plurality of outlets.