JP2014031194A - Series of electronic components - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a series of electronic components in which an electronic component mountable in a different orientation is stored and the electronic component can be picked up and mounted with easy operation even when mounted in any orientation.SOLUTION: A pair of cover tapes 14 and 16 are pasted to a pair of opposing main surfaces 12a and 12b of a tape body 12 in which a through hole 13 is formed. An electronic component 20 is stored in a storage space 18 which is partitioned by an inner circumferential surface 13s of the through hole 13 and the cover tapes 14 and 16. In opposing main surfaces 20a and 20b of the electronic component 20, a terminal to mount the electronic component 20 is formed.

Description

  The present invention relates to an electronic component series, and more particularly to an electronic component series in which an electronic component is stored in a tape body.

  Conventionally, an embossed carrier tape has been used for transportation and storage of electronic components. For example, as shown in the perspective view of FIG. 5, an electronic component is stored in the embossed portion 2 of the tape body 1, a cover tape 6 is attached, and the tape is wound around the tape reel 7. Storage or the like is performed (see, for example, Patent Document 1).

JP-A-1-58616

  When such an embossed carrier tape is used for an electronic component in which mounting terminals are formed only on one side, for example, the electronic component is accommodated in the embossed portion so that the terminal of the electronic component faces the bottom surface of the embossed portion. . When mounting an electronic component, the electronic component taken off from the embossed part by peeling off the cover tape is placed at a predetermined position on the circuit board or the like, and the terminals of the electronic component are connected to the land electrode or the like of the circuit board.

  By the way, for example, it is possible to configure an electronic component so that mounting terminals are formed on both of a pair of main surfaces facing each other and mounting can be performed in different postures by using the terminals on one of the main surfaces. Conceivable. If a conventional embossed carrier tape with a cover tape affixed to one side is used for an electronic component having such a configuration, the electronic component can be stored so that one main surface of the electronic component faces the bottom surface of the embossed portion. By operation, a terminal on one main surface of the electronic component can be connected to a land electrode or the like of the circuit board.

  However, if you want to connect the terminal on the other main surface of the electronic component to the land electrode etc. of the circuit board, you need to add a special operation such as changing the electronic component taken out from the embossed part. It is difficult to take out and mount an electronic component with a simple operation.

  In view of such circumstances, the present invention is intended to provide an electronic component series that can store electronic components that can be mounted in different postures, and can take out and mount the electronic components with a simple operation when mounting in any posture. To do.

  In order to solve the above-described problems, the present invention provides an electronic component series configured as follows.

  The electronic component series includes a tape body, a cover tape, and an electronic component. The tape main body has a pair of main surfaces facing each other and extending in a strip shape, and a through hole penetrating between the pair of main surfaces is formed. The pair of cover tapes are attached to the pair of main surfaces of the tape body and cover the through holes. The electronic component is stored in a storage space defined by an inner peripheral surface of the through hole and the pair of cover tapes.

  According to the above configuration, when electronic components that can be mounted in different postures are stored, depending on which posture is mounted, one of the pair of cover tapes is peeled off, so that the electronic components can be easily operated. It can be taken out and mounted.

  In the storage space, electronic components having various configurations can be stored.

  Preferably, the electronic component housed in the housing space has a pair of main surfaces facing the pair of cover tapes, and terminals for mounting the electronic components are formed on the pair of main surfaces. Yes.

  In this case, an electronic component can be taken out and mounted by the same operation as a conventional embossed carrier tape. Moreover, it is easier to store than an electronic component having a lead terminal.

  Preferably, a through hole communicating with the storage space is formed in the cover tape.

  In this case, the electronic component can be protruded from the through hole of the cover tape, and the electronic component can be easily taken out.

  Preferably, the tape main body and the pair of cover tapes are made of a thermoplastic resin.

  In this case, the cover tape can be easily and firmly attached to the tape body.

  The electronic component series of the present invention accommodates electronic components that can be mounted in different postures, and can be taken out and mounted with a simple operation when mounting in any posture.

1 is a perspective view of a series of electronic components (Example 1). (Example 1) which is a perspective view of an electronic component. It is principal part sectional drawing and principal part top view which show the manufacturing process of an electronic component series. Example 1 It is principal part sectional drawing and principal part top view which show the manufacturing process of an electronic component series. (Example 2) It is a perspective view of an embossed carrier tape. (Conventional example)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  <Example 1> The electronic component series 10 of Example 1 will be described with reference to FIGS.

  FIGS. 1A to 1C are perspective views showing a state in which the electronic component series 10 is wound around the reel 30. As shown in FIG. 1A, in the electronic component series 10, cover tapes 14 and 16 are attached to a tape body 12 in which a through hole 13 is formed. An electronic component (not shown in FIG. 1) is accommodated in the through hole 13. As will be described in detail later, the stored electronic component can be taken out by peeling off one of the cover tapes 14 and 16, as shown in FIGS. 1 (b) and 1 (c).

  For example, the electronic components 22 and 24 shown in the perspective views of FIGS. 2A and 2B are accommodated.

  The electronic component 22 shown in FIG. 2A functions as a 2 GHz band low-pass filter when mounted on a circuit board or the like using a terminal 22p formed on one of the principal surfaces 22a and 22b facing each other. When mounted on a circuit board or the like using the terminal 22q formed on the other main surface 22b, it functions as an 800 MHz band low-pass filter.

  The electronic component 24 shown in FIG. 2B functions as a capacitor element when mounted on a circuit board or the like using a terminal 24p formed on one main surface 24a of the main surfaces 24a and 24b facing each other. When mounted on a circuit board or the like using the terminal 24q formed on the main surface 24b, it functions as a resistance element or an inductance element.

  Note that the electronic components to be stored are not limited to those having the same function and different characteristic values or having different functions, and may be those having the same function and characteristic value but different only in terminal arrangement.

  Next, the manufacturing process of the electronic component series 10 will be described with reference to FIG. FIG. 3 is a cross-sectional view and a main part plan view showing a main part of the manufacturing process of the electronic component series 10, and the horizontal direction in the figure is the longitudinal direction of the electronic component series 10.

  First, as shown in the cross-sectional view of the main part in FIG. 3A-1 and the plan view of the main part in FIG. For example, a plurality of through holes 13 penetrating the main surfaces 12a and 12b facing each other and extending in a band shape are formed at predetermined intervals (for example, at equal intervals) by a method such as punching a band-shaped tape member with a mold. .

  Next, as shown in the main part sectional view of FIG. 3B-1 and the main part plan view of FIG. 3B-2, the cover tape 14 is affixed to one main surface 12 a of the tape body 12. For example, the cover tape 14 made of a thermoplastic resin is bonded by heating, or by applying pressure to the cover tape 14 made of a pressure-sensitive tape material coated with a temperature-sensitive adhesive pressure sensitive adhesive. .

  Next, as shown in the cross-sectional view of the main part in FIG. 3C-1 and the plan view of the main part in FIG. 3C-2, the electrons enter the through hole 13 from the other main surface 12b side of the tape body 12. The component 20 is stored. In the electronic component 20, terminals (not shown) for mounting the electronic component 20 are formed on a pair of main surfaces 20a and 20b facing each other. The electronic component 20 is accommodated in the through hole 13 so that one main surface 20a faces the cover tape 14.

  Next, as shown in the cross-sectional view of the main part in FIG. 3 (d-1) and the plan view of the main part in FIG. 3 (d-2), the cover tape 16 is attached to the other main surface 12b of the tape body 12. As with the cover tape 14, the cover tape 16 made of a thermoplastic resin is bonded by heating, or pressure is applied to the cover tape 16 made of a pressure-sensitive tape material.

  Through the above steps, the electronic component series 10 in which the electronic component 20 is stored in the storage space 18 defined by the inner peripheral surface 13s of the through hole 13 and the pair of cover tapes 14 and 16 can be manufactured.

  As described above, the electronic component 20 is accommodated so that the principal surfaces 20a and 20b facing each other on which terminals for mounting the electronic component 20 are formed are opposed to the cover tapes 14 and 16, respectively. When the electronic component 20 is mounted, the cover tape is peeled off as shown in FIGS. 1B and 1C depending on which terminal of the pair of main surfaces 20a and 20b is used for mounting.

  For example, when a terminal formed on one main surface 20a is used for mounting, as shown in FIG. 1B, the other cover tape 16 is peeled off with the other cover tape 16 facing upward, For example, the electronic component 20 is taken out while adsorbing the other main surface 20b of the electronic component 20, and a terminal formed on the one main surface 20a is connected to a land electrode or the like of the circuit board.

  When the terminal formed on the other main surface 20b is used for mounting, as shown in FIG. 1 (c), the electronic component series 10 is turned upside down so that one cover tape 14 faces upward, For example, the electronic component 20 is taken out while adsorbing one main surface 20a of the electronic component 20, and the terminals formed on the other main surface 20b are connected to the land electrodes of the circuit board.

  In either case, the electronic component 20 can be taken out and mounted with the same simple operation as when a conventional embossed carrier tape is used.

  When the tape body 12 and the cover tapes 14 and 16 are formed using a thermoplastic resin, the tape body 12 and the cover tapes 14 and 16 can be easily and firmly joined. Further, when the tape body 12 and the cover tapes 14 and 16 are flexible and formed so as to be wound on a reel or the like, the space occupied by the wound electronic component series 10 is reduced, and the Storage becomes easy.

  <Example 2> The electronic component series 10x of Example 2 will be described with reference to FIG. The electronic component series 10x according to the second embodiment is configured in substantially the same manner as the electronic component series 10 according to the first embodiment. In the following, the same reference numerals are used for the same components as in the first embodiment, and differences from the first embodiment will be mainly described.

  4A and 4B are a cross-sectional view and a main part plan view showing a main part of the manufacturing process of the electronic component series 10x.

  First, as shown in a cross-sectional view of a main part in FIG. 4A-1 and a plan view of a main part in FIG. 4A-2, a tape body 12x having a through hole 13 is prepared.

  Next, as shown in the main part sectional view of FIG. 4 (b-1) and the main part plan view of FIG. 4 (b-2), between the pair of main surfaces 12a and 12b of the tape body 12x using a mold. By a method such as pressing, recesses 12s and 12t (not shown in FIG. 4B-2) are formed on the pair of main surfaces 12a and 12b of the tape body 12x. The recesses 12s and 12t are formed between the through holes 13 adjacent to each other.

  Next, as shown in the cross-sectional view of the main part in FIG. 4C-1 and the plan view of the main part in FIG. 4C-2, the cover tape 14x is attached to one main surface 12a of the tape body 12x. A through hole 14p communicating with the through hole 13 is formed in the cover tape 14x.

  For example, the cover tape 14x in which the through holes 14p are formed in advance by a punching process using a mold is attached to the tape body 12. The through hole 14p may be formed after the cover tape 14x is attached to the tape body 12 or may be formed simultaneously with the step of attaching the cover tape 14x to the tape body 12.

  Next, as shown in the cross-sectional view of the main part in FIG. 4D-1 and the plan view of the main part in FIG. 4D-2, the electrons enter the through hole 13 from the other main surface 12b side of the tape body 12. The component 20 is stored. Similar to the first embodiment, the electronic component 20 is accommodated in the through hole 13 so that one main surface 20a of the pair of main surfaces 20a and 20b facing each other faces the cover tape 14x.

  Next, as shown in the main part sectional view of FIG. 4E-1 and the main part plan view of FIG. 4E-2, the cover tape 16x is attached to the other main surface 12b of the tape body 12. Similar to the cover tape 14x, the cover tape 16x is formed with a through hole 16p communicating with the through hole 13.

  Through the above steps, the electronic component series 10x can be manufactured.

  The electronic component 20 housed in the electronic component series 10x is a conventional embossed carrier by peeling off one of the cover tapes 14x and 16x depending on which terminal of the pair of main surfaces 20a and 20b is used for mounting. It can be taken out and mounted by the same simple operation as when using a tape.

  Since the recesses 12s and 12t are formed in the tape body 12x of the electronic component series 10x, the tape body 12x can be partially thinned.

  Since the through holes 14p and 16p are formed in the cover tapes 14x and 16x of the electronic component series 10x, when removing one of the cover tapes 14x (or 16x) and taking out the electronic component 20, the other cover tape 16x When the electronic component 20 is protruded from the (or 14x) through-hole 16p (or 14p) with a pin or the like, the electronic component 20 can be easily taken out.

  Further, since the recesses 12s and 12t are formed in the tape body 12x of the electronic component series 10x, the area where the cover tapes 14x and 16x are pasted by pasting the cover tapes 14x and 16x along the recesses 12s and 12t. Can be increased. As a result, the cover tapes 14x and 16x can be more strongly applied, and thus the cover tapes 14x and 16x can be prevented from being inadvertently peeled off from the tape body 12 and the electronic component 20 being dropped from the tape body 12. .

  <Summary> As described above, when the carrier tape for attaching the cover tapes 14 and 16; 14x and 16x on both sides of the tape bodies 12 and 12x is used, terminals are formed on the pair of main surfaces 20a and 20b facing each other. After the electronic component 20 is stored, the electronic component 20 can be taken out and mounted with a simple operation, regardless of which of the main surfaces 20a and 20b is used for mounting.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, even if the electronic component to be stored is an electronic component in which lead terminals protrude on both sides of a pair of main surfaces facing each other, the lead terminal protrudes on one side of the pair of main surfaces facing each other, and the main component on the other side An electronic component having a terminal formed on the surface may be used.

  In the first embodiment, the cover tapes 14 and 16 may be formed with through holes communicating with the through holes 13. In Example 2, you may use the cover tape in which the through-holes 14p and 16p are not formed.

  Further, the cover tapes 14 and 16 may not be formed continuously. For example, it may be intermittently formed for each part covering one through hole 13 or may be intermittently formed for each part covering a plurality of through holes 13.

10, 10x electronic component series 12, 12x tape body 12a, 12b main surface 12s, 12t recess 13 through hole 13s inner peripheral surface 14, 14x cover tape 14p through hole 16, 16x cover tape 16q through hole 18 storage space 20 electronic component 20a , 20b Main surface 22 Electronic parts 22a, 22b Main surface 22p, 22q Terminal 24 Electronic parts 24a, 24b Main surface 24p, 24q Terminal 30 Reel

Claims (4)

A tape body having a pair of main surfaces facing each other and extending in a strip shape, and having a through-hole penetrating between the pair of main surfaces;
A pair of cover tapes attached to the pair of main surfaces of the tape body and covering the through holes;
An electronic component stored in a storage space defined by an inner peripheral surface of the through hole and the pair of cover tapes;
An electronic component series comprising:   The electronic component stored in the storage space has a pair of main surfaces facing the pair of cover tapes, and terminals for mounting the electronic components are formed on the pair of main surfaces. The electronic component series according to claim 1, wherein the electronic component series is characterized.   The electronic component link according to claim 1, wherein a through hole communicating with the storage space is formed in the cover tape.   The electronic component chain according to any one of claims 1 to 3, wherein the tape body and the pair of cover tapes are made of a thermoplastic resin.

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