JP2014030036A - Method for mounting conductive ball on substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method in which conductive balls are mounted on a substrate by a device for filling the conductive balls in a plurality of openings of a mask and a mounting period of time of the conductive balls can be shortened.SOLUTION: In a method for mounting conductive balls on a substrate, a plurality of heads are set so that in a forward route, a plurality of movement areas A1-A4 pass through a first opening group array 121 including several opening groups M arranged successively in the reciprocating direction, and in a backward route, the plurality of movement areas A1-A4 pass through a second opening group array 122 adjacent to the first opening group array 121 without overlapping with the forward route, and the movement areas A1-A4 are reciprocatingly moved to fill the conductive balls into openings.

Description

  The present invention relates to a method for mounting conductive balls on a substrate using a mask.

  In order to obtain an electrical connection when mounting a semiconductor device, a conductive ball (conductive fine particle) such as a solder ball may be used. Patent Document 1 discloses an apparatus for filling a plurality of openings with conductive balls in a state where a mask having a plurality of openings for disposing the conductive balls on the substrate is set on the substrate. . The apparatus includes a plurality of heads for holding a plurality of independent conductive ball groups on a plurality of portions of the mask surface, respectively, and a plurality of conductive ball groups moving on the mask surface. A head moving mechanism for moving the plurality of heads. In this apparatus, a plurality of moving areas in which a plurality of independent groups of conductive balls are held are formed in a plurality of portions on the surface of the mask by a plurality of heads. In this apparatus, typically, conductive balls are mounted (arranged) on a substrate while moving a plurality of heads (a plurality of moving areas) so that a part of the moving area overlaps. In this apparatus, in the region where the conductive balls are filled, for example, the plurality of heads (the plurality of moving areas) are moved so that the moving areas pass twice (overlap by 50%).

JP 2008-42172 A

  The apparatus described in Patent Document 1 uses a plurality of heads and does not disperse fine conductive balls, for example, conductive balls having a diameter of 1 mm or less, specifically about 10 to 500 μm, over the entire surface of the mask. The conductive balls are mounted (arranged) while being held in a limited area. For this reason, the time (tact time) required to mount the conductive ball can be shortened without using the small conductive ball wastefully. On the other hand, in recent years, there has been a demand for a method and apparatus that can further reduce the tact time.

One embodiment of the present invention is a method in which a substrate having a plurality of openings for placing conductive balls on a substrate is aligned with the substrate by an apparatus that fills the plurality of openings with conductive balls. This is a method of mounting a sex ball. The apparatus includes a ball holding means having a plurality of heads each forming a moving area in which a group of conductive balls are held on a part of a surface of the mask, and the ball holding means is adjusted in the interval between the plurality of heads. Moving means for reciprocating movement. The plurality of openings of the mask include a plurality of opening groups provided in a matrix form, and the method includes the following steps.
1. In the forward path, the moving area formed by each head passes through a first aperture group row including a number of aperture groups arranged in series in the direction of reciprocating movement. The second opening group row adjacent to the first opening group row is set so as to pass without overlapping the forward path.
2. A plurality of groups of conductive balls are held in a plurality of moving areas on the surface of the mask by ball holding means, respectively.
3. The moving means reciprocates the ball holding means to fill the plurality of openings of the mask with conductive balls.

  In this method, after setting a plurality of heads at intervals that pass through adjacent opening group rows without overlapping when a plurality of moving areas formed by them reciprocate, a plurality of heads holding conductive balls are set. The moving area is reciprocated with the mutual interval maintained at a predetermined value. It is possible to move a plurality of moving areas in parallel in a state where conductive balls are gathered in a plurality of moving areas having a limited area, and a moving path can be shortened by not overlapping the paths in a reciprocating manner. Therefore, the conductive ball can be mounted on the substrate in a short time and more reliably.

  The ball holding means is provided corresponding to each of the plurality of heads, and includes a plurality of ball supply units that supply the conductive balls to each of the plurality of moving areas via the plurality of heads, and the step of holding Then, it is desirable to include replenishing the conductive balls so that a sufficient number of conductive balls are held inside each of the plurality of moving areas by the plurality of ball replenishment units.

  Another aspect of the present invention is an apparatus for filling a plurality of openings with conductive balls in a state in which a mask having a plurality of openings for arranging the conductive balls on the substrate and the substrate are aligned. is there. The apparatus includes ball holding means having a plurality of heads that respectively form moving areas in which a group of conductive balls are held on a part of the surface of the mask, and moving means for reciprocating the ball holding means. In the forward path, the moving area formed by each head passes through a first aperture group row comprising several aperture groups arranged in series in the direction of reciprocation, and in the return path, And moving means for reciprocally moving the second opening group row adjacent to the first opening group row so as to pass through the second opening group row without overlapping the forward path.

  The ball holding means preferably includes at least three heads. The ball holding means preferably further includes a plurality of ball replenishing units that are provided corresponding to each of the plurality of heads and replenish conductive balls to each of the plurality of moving areas via the plurality of heads.

The top view which shows an example of a ball mounting apparatus. The top view which shows the state which aligned the board | substrate with the mask. Sectional drawing cut | disconnected and shown along the III-III line of FIG. The top view which shows schematic structure of the ball filling apparatus of the ball mounting apparatus of FIG. The front view which shows the ball | bowl holding | maintenance apparatus of the ball | bowl filling apparatus of FIG. FIG. 6 is a side view showing a ball supply unit of the ball holding device of FIG. 5. (A) is a front view which shows the head of the ball | bowl holding | maintenance apparatus of FIG. FIG. 6B is a bottom view showing the head of the ball holding device of FIG. The figure which shows the state with which the ball | bowl filling apparatus of FIG. The figure which shows an example of the locus | trajectory of the center of four moving areas at the time of filling the ball | bowl filling apparatus of FIG. The flowchart for demonstrating the ball mounting method in the ball mounting apparatus of FIG. The figure which shows an example of the locus | trajectory of the center of three moving areas at the time of filling with a conductive ball | bowl to the several opening of a mask.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an example of a ball mounting device (mounting device, ball mounting system, ball mounter). FIG. 2 is a plan view showing a state where the mask is aligned (set) with the substrate. FIG. 3 shows a cross-sectional view taken along line III-III in FIG.

  The ball mounting device 1 is a device for mounting conductive balls (conductive fine particles) B at predetermined positions on the substrate 100. The ball mounting apparatus 1 of the present example uses a printed wiring board as a substrate 100 and a conductive ball B on a plurality of electrodes 101 formed in a predetermined pattern on the printed wiring board 100 in accordance with the predetermined pattern. It is to be installed. The printed wiring board 100 is also called a printed wiring board, a printed circuit board, a printed circuit board, a circuit board, or a printed board, and includes a semiconductor mounting board on which a semiconductor is mounted, a build-up board, a multilayer board, and the like. For this reason, the ball mounting apparatus 1 conducts the plurality of openings 111 in a state where a mask (template) 110 having a plurality of openings 111 for placing the conductive balls B on the substrate 100 is aligned with the substrate 100. A device (ball filling device) 10 for filling the functional ball B is provided.

  The conductive ball B mounted on the electrode 101 of the substrate 100 functions as an electrode (bump) for obtaining electrical connection, and its diameter is, for example, 1 mm or less, specifically, 10 It is about -500 micrometers. Such a conductive ball B is sometimes referred to as a microball, a microball, or a microparticle. The conductive ball B includes solder balls (balls containing silver (Ag), copper (Cu), etc., the main component of which is tin (Sn)), metal balls such as gold or silver, and ceramics. This includes balls or plastic balls that have been subjected to a treatment such as conductive plating. In this example, a solder ball having a diameter of about 90 μm is used as the conductive ball B.

  A plurality of semiconductor chips (semiconductor devices, see FIG. 5) 102 are mounted in a matrix or array on one surface 100b of the printed wiring board 100, and on the opposite surface 100a of the printed wiring board 100, respectively. A plurality of electrodes 101 for connection to the semiconductor chip 102 are provided in a matrix (array) form. That is, a plurality of electrode groups N corresponding to each semiconductor chip 102 are arranged in a discrete state on the other surface 100 a of the printed wiring board 100. In this example, it is assumed that the conductive ball B is mounted in a state where the printed wiring board 100 whose outer periphery is rectangular is arranged in the horizontal direction on the drawing as shown in FIG. The printed wiring board 100 of this example includes a total of 40 electrode groups N in 5 rows and 8 columns.

  Therefore, the mask (template) 110 for disposing the conductive balls B on the printed wiring board 100 has an opening pattern (mask pattern) having a plurality of openings 111. Specifically, the mask 110 includes a plurality of aperture groups M provided in a matrix (array) so as to correspond to the plurality of electrode groups N of the printed wiring board 100. In other words, the mask 110 of this example includes a total of 40 aperture groups M in 5 rows and 8 columns.

  The diameter of each opening 111 depends on the diameter of the conductive ball B, and is typically about 10% larger than the diameter of the conductive ball B. In this example, the mask 110 is provided with an opening 111 having a diameter of about 100 μm at a position corresponding to the electrode 101 formed on the substrate 100 in order to mount the conductive ball B having a diameter of 90 μm on the substrate 100. The opening end of the opening 111 may be chamfered. As shown in FIG. 3, the back relief 113 is formed in the region where the opening group M is formed on the back surface (lower surface) 110 b of the mask 110, and the thickness of the portion where the back relief 113 is not formed ( The mask thickness) is about 100 μm. In the ball filling apparatus 10, the mask 110 is fixed to the mask frame 112 in a state where a certain amount of tension (tension) is applied, and is held by the mask holding apparatus 11.

  As shown in FIG. 1, the ball mounting apparatus 1 loads an XYZθ stage (moving stage) 2 for setting the substrate 100 in a state where the warpage of the substrate 100 is corrected by a method such as vacuum suction, and a substrate 100 ( Loader / unloader device 3 for supplying and unloading (accommodating), a pre-alignment device (aligner) 4 for finely adjusting the position of the substrate 100, and a correction device 5 for correcting the warp of the substrate 100, , A flux application device (flux printing device, screen printing device) 6 for applying a material (flux) F for bonding the substrate 100 and the conductive ball B through the printing mask 6a, and transfer to the substrate 100 Ball filling device (ball vibration device) for arranging (mounting, arranging) the conductive balls B through a mask for filling (filling mask) 110 Stage transfer device 7, which includes an X-axis table (rail), a Y-axis table (rail), a Z-axis table (rail), and a θ table (rail), and transfers (conveys) the stage 2, A substrate transfer robot 8 for transferring the substrate 100; The correction device 5, the flux application device 6, and the ball filling device 10 are arranged side by side in the X direction.

  The loader / unloader device 3 includes a first package (first stocker) 3a for loading (supplying) the substrate 100 and a second package (second stocker) 3b for unloading (accommodating) the substrate 100. Have. The substrate 100 is carried in from the first package 3 a of the loader / unloader device 3 and is carried out to the second package 3 b of the loader / unloader device 3. The transfer robot 8 carries the substrate 100 from the first package 3 a of the loader / unloader device 3 onto the aligner 4, conveys the substrate 100 from the aligner 4 to the moving stage 2, and transfers the substrate 100 from the moving stage 2 to the loader / unloader 3. The unloader 3 carries out the second package 3b.

  The moving stage 2 holds the substrate 100 on its upper surface (XY plane in this example) in a state where the warpage of the substrate 100 is corrected by a method such as vacuum suction. The moving stage 2 moves the substrate 100 to an arbitrary position among the correction device 5, the flux coating device 6, and the ball filling device 10 by the stage transfer device 7. In addition, the moving stage 2 can adjust the position of the substrate 100 in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction. Therefore, in the ball filling apparatus 10, the mask 110 and the substrate 100 can be aligned by the moving stage 2 so that the position of the electrode 101 of the substrate 100 matches the position of the opening 111 of the mask 110.

  FIG. 4 is a plan view (top view) showing a schematic configuration of the ball filling apparatus 10. FIG. 5 is a front view of the ball holding device provided in the ball filling device 10 of FIG. FIG. 6 is a side view of the ball supply unit provided in the ball holding device of FIG.

  As described above, the ball filling apparatus 10 has a state in which the mask 110 having a plurality of openings (openings, apertures) 111 for placing the conductive balls B on the substrate 100 is set (overlapped) on the substrate 100. Device) for filling the plurality of openings 111 of the mask 110 with conductive balls B. The ball filling device 10 includes a ball holding device (ball holding means) 20, a moving device (moving means) 80 for reciprocating the ball holding device 20, and a function of controlling the ball holding device 20 and the moving device 80. And a control unit (control unit) 90. In this ball filling apparatus 10, the ball holding apparatus 20 includes four heads 40 a, 40 b, 40 c, and 40 d, and each head 40 a to 40 d has a limited area (moving area) on the upper surface 110 a of the mask 110. The conductive balls B are filled (swinged) into the plurality of openings 111 of the mask 110 while holding the conductive balls B.

  The ball holding device 20 includes four head units 30a, 30b, 30c, and 30d, and these head units 30a to 30d are independent of the surface 110a (the XY plane in this example) 110a of the mask 110 ( Heads (dispensers) 40a to 40d for forming moving areas (enclosed regions) in which a group of conductive balls B are held, respectively, are provided in a part different from each other, and are provided so as to correspond to the heads. Are provided with ball supply units 50a to 50d for supplying the conductive ball B to the moving area. By the ball holding device 20 of this example, the groups Bg1 to Bg4 of the four conductive balls B are held in four regions (movement areas) A1 to A4 (see FIG. 9), and the ball holding device 20 is moved by the moving device 80. As a result, the moving areas A1 to A4 move on the surface 110a of the mask 110.

As shown in FIGS. 4 and 5, the mobile device 80, the X-axis rails 81x, the pair of Y axis rails 81y ₁ and 81y _2, and a Z-axis rail 81z. X-axis rail 81x includes a motor 82x, the pair of Y axis rails 81y ₁ and 81y ₂ are respectively provided with a motor 82y ₁ and 82y _2, Z-axis rail 81z has a motor 82z . X-axis rail 81x is Y table 83 via a (see FIG. 5) is supported by a pair of Y axis rails 81y ₁ and 81y _2, Z-axis rail 81z is supported by the X-axis rails 81x. In FIG. 4, the Y table 83 is omitted. A head interval adjusting jig 84 extending in the X direction is further attached to the Z-axis rail 81z, and four head units 30a to 30d are attached to the head interval adjusting jig 84. Each of the head units 30a to 30d is attached to a head interval adjusting jig 84 so as to be movable (slidable) in the X direction, and the interval of each of the head units 30a to 30d can be adjusted.

Therefore, the four head units 30a to 30d are arranged in the head interval adjusting jig 84 with the X-direction interval set to a desired interval, and the Z-axis rail 81z, the X-axis rail 81x and the Y-axis of the moving device 80. the rail 81y ₁ and 81y _2, can be moved Z-axis direction, the X-axis direction and the Y-axis direction. For this reason, the heads 40a to 40d attached to the head units 30a to 30d are also set in the X direction with the desired distances by the moving device 80, and the Z axis direction, the X axis direction, and the Y axis direction. Can be moved to.

  All the head units 30a to 30d may be slidable in the X direction with respect to the head interval adjusting jig 84. Further, the leftmost and rightmost head units 30 a and 30 d may not slide with respect to the head interval adjusting jig 84. Further, the four head units 30a to 30d may be detachably attached to the head interval adjusting jig 84, respectively. When the conductive balls B are mounted on the substrate 100, if the number of the head units 30a to 30d is large, they are removed and reduced. If the number of head units is to be increased, a new head unit is attached to the head interval adjusting jig 84. You may attach to.

  With this moving device 80, the four heads 40a to 40d can be moved on the surface 110a of the mask 110 in any two-dimensional direction. Accordingly, the four moving areas A1 to A4 formed by the four heads 40a to 40d are crossed over the surface 110a along the surface (upper surface) 110a of the mask 110 while maintaining a predetermined interval in the X direction. Can move in any direction. As the four moving areas A1 to A4 move, the groups Bg1 to Bg4 of four independent conductive balls B held in the moving areas A1 to A4 also move in conjunction with different locations on the surface 110a of the mask 110. .

  The configuration of the moving device 80 is not limited to the above, and the four heads 40a to 40d can be reciprocated in the Y direction so as to cross the surface 110a of the mask 110, and at the end, the X direction can be moved. Any device that can change the position may be used.

  As shown in FIG. 5, the head units 30a to 30d include heads 40a to 40d, ball supply units 50a to 50d, bases (mounting bases) 31a to 31d, head rotating motors 32a to 32d, and a Z direction. And shafts (shafts) 33a to 33d extending in the direction. The head units 30a to 30d are respectively attached to the head interval adjustment jig 84 via the bases 31a to 31d.

  Each of the head units 30a to 30d has a common configuration, and the head unit 30d will be described as a representative. A shaft 33d extends in the vertical direction and connects the motor 32d and the head 40d. Therefore, the head 40d (specifically, the base (head plate) 41 of the head 40d) can be rotationally driven around the shaft 33d by the head rotating motor 32d. In this example, the central axis of the shaft 33d becomes the rotation axis of the head 40d (axis perpendicular to the mask 110), and the head 40d rotates (rotates) around the vertical axis.

  The ball supply unit 50d of the head unit 30d includes a weighing device 52 including a ball container (ball tank) 51, a flexible first ball guide tube 53, and a rigid second ball guide tube 54. ing. The ball replenishing unit 50d replenishes the conductive ball B in the head 40d (in the moving area A4) via the shaft 33d and the head 40d (a base member 41 of the head 40d described later). In this example, the inside of the shaft 33d is hollow, and the ball container 51 and the upper end portion of the shaft 33d are connected via a first ball guide tube 53 and a second ball guide tube 54. Yes.

  FIG. 6 shows the weighing device 52 of the ball supply unit 50d. Each of the weighing devices 52 is for supplying a predetermined amount of the conductive ball B to the moving area A4 through the head 40d. The weighing device 52 includes a ball container (ball tank) 51, an air cylinder 55, a cylinder rod 56, an upper and lower plate 57, a slide base 58, a rotating plate 59, a pin 60, and a pin guide plate 61. ing. The upper end portion of the cylinder rod 56 is connected to the upper and lower plates 57. The upper and lower plates 57 are configured to move up and down along the slide table 58 while being supported by the slide table 58. The upper and lower plates 57 and the rotating plate 59 are connected by pins 60 guided by the pin guide plates 61. The rotating plate 59 is connected to the ball container 51.

  Therefore, when the air cylinder 55 is driven and the cylinder rod 56 is moved up and down, the upper and lower plates 57 move up and down along the slide table 58 via the cylinder rod 56. When the upper and lower plates 57 move up and down, the rotating plate 59 also moves up and down, and this movement becomes a rotational movement of the rotating plate 59 by the pin 60 and the pin guide plate 61. In conjunction with the rotating plate 59, the ball container 51 is also inclined at a predetermined angle (about 45 degrees in this example). In this mechanism, the ball container 51 is inclined (rotated) while being lowered, and the ball container 51 is returned vertically while being raised. Therefore, the length of the first ball guide tube 53 is not changed, and the ball container 51 and the second ball guide tube 54 can communicate with each other only by bending.

  By tilting or turning the ball container 51, a predetermined amount (number) of the conductive balls B are transferred from the ball container 51 to the first ball guide tube 53, the second ball guide tube 54, the shaft 33d, and the base member of the head 40d. Via 41, the moving area A4 formed by the head 40d is supplied. The timing of supplying the conductive ball B by the ball supply unit 50d can be controlled by operating the air cylinder 55 by the control unit 90. Accordingly, the ball supply units 50a to 50d can simultaneously supply a predetermined amount (number) of the conductive balls B to the respective moving areas A1 to A4, and the conductive balls can be supplied at different timings. It is also possible to replenish B.

  In this ball filling apparatus 10, the circular moving areas A1 to A4 move as the heads 40a to 40d move, and the conductive balls B held in the moving areas A1 to A4 are sequentially filled into the openings 111 of the mask 110. Is consumed. For this reason, based on the amount of balls consumed, a suitable number of conductive balls B are introduced (supplemented and supplied) into the moving areas A1 to A4 from the ball supplying units 50a to 50d. It is possible to maintain the amount (number) of the conductive balls B held in each of the balls in an appropriate amount. For example, by supplying the conductive balls B at predetermined time intervals based on the amount of balls consumed per hour, an appropriate amount of the conductive balls B is always present in the moving areas A1 to A4. be able to. The ball supply units 50a to 50d may be controlled by monitoring the amount (number) of conductive balls held in each moving area by an optical sensor or the like.

  With the ball supply units 50a to 50d, it is possible to appropriately maintain the density and concentration (integration degree, number, amount) of the groups Bg1 to Bg4 of the conductive balls B in the moving areas A1 to A4. For this reason, it can suppress that the conductive ball B is no longer filled into the opening 111 of the mask 110 due to a decrease in the density (number) of the conductive balls B in each of the moving areas A1 to A4. In addition, the density (number) of the conductive balls in each of the moving areas A1 to A4 greatly increases, so that the fluidity of the conductive balls is reduced or stacked in an arch shape. It can also be suppressed that the conductive balls B are not filled.

  In addition, it is also possible to replenish the conductive balls B in each of the four moving areas A1 to A4 from one ball replenishment unit. However, it is difficult to distribute a predetermined amount of conductive balls to each of the moving areas A1 to A4 because the distance from one ball supply unit to each of the moving areas A1 to A4 is different or the arrangement of the piping is different. . In this respect, in this example, since the conductive balls B are supplied from the four ball supply units 50a to 50d to the four moving areas A1 to A4, respectively, there is no need to distribute the conductive balls B. The number (amount) of the conductive balls B held in each of the moving areas A1 to A4 can be accurately controlled.

  Next, the heads 40a to 40d of the ball holding device 20 will be described in detail. Since these heads 40a to 40d have the same structure, the head 40a will be described as an example. FIG. 7A is a view of the head 40a as viewed from the front. FIG. 7B is a view of the head 40a as viewed from the bottom. FIG. 8 is an enlarged view showing a state in which the conductive balls B are filled in the plurality of openings 111 of the mask 110 by the head 40a.

  The head 40 a of the ball holding device 20 collects the conductive balls B in the moving area A 1 while pushing away the conductive balls B on the upper surface 110 a of the mask 110, and the conductive balls B in the plurality of openings 111 of the mask 110. It is for filling. The head 40a includes a base member (squeegee support, fixing member) 41 and a squeegee 43 made up of a plurality of bundled linear members. The binding linear member of the squeegee 43 is formed by binding both ends of a plurality of linear members 42 by a method such as caulking. The center of the base member 41 is connected to a shaft 33a extending in a direction perpendicular to the mask 110, and is rotationally driven by a motor 32a (see FIG. 5). The diameter of the linear member 42 constituting the squeegee 43 depends on the material of the material forming the linear member 42, the diameter of the conductive ball B, and the like, but is preferably 30 to 100 μm. The linear member 42 is preferably formed of a material having relatively low rigidity.

  Note that the binding linear member of the squeegee 43 may be any member that can contact the upper surface 110a of the mask 110 relatively softly and can sweep up the conductive balls B on the upper surface 110a of the mask 110. Preferably, the binding linear member of the squeegee 43 is provided with elasticity that does not scrape the conductive ball B once filled in the opening 111 of the mask 110. In this example, each of the heads 40a to 40d includes six squeegees 43. The binding linear members of these squeegees 43 include a horizontal portion 43a of the binding linear member and a lower surface 41a of the base member 41, respectively. In a state where a plurality of linear members 42 constituting the squeegee 43 are twisted so as not to be in close contact with each other, the lower surface 41a of the base member 41 protrudes toward the upper surface 110a of the mask 110 so as to be substantially inverted U-shaped. Is detachably attached.

  The six squeegees 43 are preferably attached substantially radially as shown in FIG. More specifically, each of the six squeegees 43 is tangent to the inner circle A1 at an equal pitch in the circumferential direction around the inner circle A1 that is concentric with the rotating shaft 33a (that is, the moving area indicated by a broken line). Direction (or the tangential direction of the virtual circle slightly inside the inner circle A1), and in this example, it is arranged to extend linearly to the vicinity of the outer periphery of the base member 41 in the counterclockwise direction when viewed from the bottom surface. ing. A pressing plate 44 is provided on the lower surface 41 a of the base member 41 for the purpose of preventing the conductive ball B from adhering to the fixed portion of the squeegee 43. The head 40a is rotationally driven in the counterclockwise direction when viewed from the bottom surface 41a side of the base member 41 around the shaft 33a by the rotation motor 32a.

  In addition, by rotating the arrangement of the squeegee 43 (mirror symmetry), the rotation direction of the heads 40a to 40d (the rotation direction of the heads 40a to 40d) can be clockwise. Further, the number of squeegees 43 attached to the base member 41 is determined by the size of the moving area and the like, and may be two to five, or seven or more. Further, one end of the squeegee 43 may be attached to the side surface of the base member 41. By attaching one end of the squeegee 43 to the side surface of the base member 41, the horizontal portion 43a can be made longer. In any case, it is preferable that the horizontal portion 43a of the squeegee 43 and the lower surface 41a of the base member 41 are attached so that a space is provided between them so as not to be in close contact.

  In the head 40 a, when the squeegee 43 made of a bundled linear member pushes away the conductive ball B on the upper surface 110 a of the mask 110, it is difficult for the conductive ball B to enter between the linear members 42. Further, it is difficult for the conductive ball B to dissipate out of the head 40a over the squeegee 43 made of a binding wire member. Therefore, when the head 40a is rotated counterclockwise when viewed from below with the downward U-shaped central portion (belly portion) 43a of the squeegee 43 in contact with the upper surface 110a of the mask 110, the traveling direction of the squeegee 43 The conductive ball B in the (rotating direction) is pushed away toward the inner circle A1. That is, as the head 40a rotates, the excessive conductive balls B remaining on the upper surface 110a of the mask 110 are collected from the periphery of the inner circle A1 to the inner circle A1 so as not to dissipate. Therefore, by rotating the head 40a, the group Bg1 of the conductive balls B can be held in the moving area A1 having a limited area on the upper surface 110a of the mask 110, and the moving area A1 is also moved by moving the head 40a. it can. The inner circles (moving zones) A1 to A4 are virtual or design.

  As shown in FIG. 8, the conductive balls B are pushed by the squeegee 43 and collected in the moving area A <b> 1, and in the process, the conductive balls B pass through the unfilled openings 111 of the mask 110. It falls naturally into the opening 111 and is mounted (transferred) onto the electrode 101 provided on the substrate 100. Note that reference numeral 109 in FIG. 8 denotes a protective film for protecting the active surface of the semiconductor element 102 and is formed so as to cover the outer peripheral portion of the electrode 101. The flux F is printed on the surface of the electrode 101 that is not covered with the protective film 109. The flux F is preferably printed so that the center of the hole in the protective film 109 rises slightly.

  In addition, the thickness of the mask 110 is determined so that the top of the filled ball B is below the upper surface 110 a of the mask 110 so that the filled conductive ball B is stably held in the opening 111. It is preferable. When the apex of the conductive ball B comes out above the upper surface 110 a of the mask 110, the conductive ball B filled in the opening 111 is easily scraped by the squeegee 43. The distance that the apex of the conductive ball B falls from the upper surface 110a of the mask 110 is preferably about 2 to 10%, more preferably about 5%, of the diameter of the conductive ball B. Thus, when the conductive ball B sinks from the upper surface 110 a of the mask 110, the conductive ball B swung into the opening 111 of the mask 110 is less likely to be scraped out by the squeegee 43.

  When the squeegee 43 moves from left to right in FIG. 8, the conductive balls B are pushed and successively transferred into the opening 111. The linear member 42 constituting the binding linear member of the squeegee 43 has a diameter of about 30 to 100 μm and is small and low in rigidity. Therefore, in the portion of the opening 111 of the mask 110, the surface 110a of the mask 110 is downward. Slightly bend and enter slightly into the opening 111. Therefore, the conductive ball B filled in the opening 111 is pushed into the flux F printed on the electrode 101 by the squeegee 43 (linear member 42), and moves unless a large impact is given to the substrate 100. It is fixed to the extent that it does not. In order to obtain such an effect, the linear member 42 is preferably deformed to such an extent that the conductive ball B filled in the opening 111 is pressed from above. If the filled conductive ball B is not pushed into the flux F, the conductive ball B tends to be detached from a predetermined position in a subsequent process (substrate conveyance, inspection, reflow, etc.).

  As shown in FIG. 8, the squeegee 43 made of a binding linear member is twisted so that the ball moves in the direction of the inner circle. Such a squeegee 43 is crushed at a portion in contact with the mask 110 to have a substantially elliptical cross section (pseudo-elliptical shape), but the linear member 42 itself is not crushed. Therefore, when viewed in cross section, the squeegee 43 abuts both the conductive ball B and the mask 110 obliquely. The squeegee 43 made of the bundled linear member of this example is attached to the base member 41 with a plurality of linear members 42 being twisted. Therefore, as compared with a squeegee that does not twist the linear member, many linear members 42 alternately contact the mask 110 at an angle that leads the conductive ball B toward the center with respect to the angle of the squeegee 43. Touch. Therefore, the angle of the squeegee 43 is an angle at which the conductive balls B can be collected from a wider range, and the angle of the linear member 42 that actually contacts the individual conductive balls B is the conductive direction facing the inside of the squeegee 43. The angle can be set such that the ball B is not easily dissipated. For this reason, when the squeegee 43 made of a twisted bundling linear member is fixed to the base member 41, a relatively large number of conductive balls B are held in the moving areas A1 to A4 in a state in which dissipation is suppressed. it can. By using such heads 40a to 40d, the density (integration degree) of the conductive balls B in the moving areas A1 to A4 can be improved, so that the filling efficiency can be improved and even without overlapping the moving areas A1 to A4. The conductive balls B can be satisfactorily filled in all the openings 111 of the mask 110.

  Returning to FIG. 4, the control unit (control unit, control means) 90 is connected to a state in which control information can be transmitted / received to / from the ball holding device 20 and the moving device 80, and functions (control the filling device 10) for controlling these operations. Control function) 95.

  The control unit 90 may include a function for controlling the entire ball mounting apparatus 1, that is, a function for controlling the stage 2 and the apparatuses 4, 5, 6 and 8. The control unit 90 that controls the stage 2 and the devices 4, 5, 6, and 8 may be separate from the control unit 90. Many of the control units 90 are configured using a computer or a microcomputer. The control unit 90 includes a memory, in which a control program 90p is stored, and the microcomputer performs a predetermined function by executing the program 90p. The control program (program product) 90p is provided by being recorded on an appropriate recording medium such as a ROM. The ball mounting device 1 of this example and the ball filling device 10 of this example can be controlled via a computer network such as a LAN, and the program 90p can be provided from a server on the network. .

  A function 95 for controlling the filling device of the control unit 90 is a function 91 for holding the four groups Bg1 to Bg4 of the conductive balls B in the four moving areas A1 to A4 of the surface 110a of the mask 110 by the ball holding device 20, respectively. And, with the groups Bg1 to Bg4 being held in the moving areas A1 to A4, the distance between the four moving areas A1 to A4 is maintained at a predetermined value by the moving device 80, and the ball holding device 20 is reciprocated. 92.

  As shown in FIG. 9, the function 92 for reciprocating reciprocates the four heads 40 a to 40 d, and the moving areas A <b> 1 to A <b> 4 formed by the respective heads 40 a to 40 d are respectively provided in the forward path and the return path. , An aperture group row including a number of aperture groups M arranged in series in the direction of reciprocating movement, the first aperture group row 121 in which any of the moving areas A1 to A4 have not passed, It moves adjacent to the opening group row | line | column 121 so that all of movement area | region A1-A4 may pass the 2nd opening group row | line | column 122 which has not passed.

  The function 91 for holding the groups Bg1 to Bg4 of the conductive balls B in the moving areas A1 to A4, respectively, is that the plurality of squeegees 43 contact the surface 110a of the mask 110 with the base members 41 of the plurality of heads 40a to 40d. The function 93 which each forms moving area A1-A4 by rotating in the state which carried out is included. The function 91 for holding is further a function for supplying the conductive balls B by the ball supply units 50a to 50d so that a sufficient number of the conductive balls B are held in the respective moving areas A1 to A4 (ball supply function). 94.

  FIG. 9 shows an example of trajectories T1 to T4 of the centers of the four moving areas A1 to A4 when the conductive balls B are filled into the plurality of openings 111 of the mask 110 in the ball filling apparatus 10 of FIG. Yes. In the printed wiring board 100, as described above, the plurality of electrodes 101 includes five rows and eight columns and a total of 40 electrode groups N provided in a matrix (array) form. Accordingly, a plurality of openings (opening patterns, mask patterns) 111 of the mask 110 for arranging the conductive balls B on such a printed wiring board 100 correspond to the plurality of electrode groups N of the printed wiring board 100, and the matrix A total of 40 aperture groups M, 5 rows by 8 columns, distributed in a shape (array shape).

  In this filling apparatus 10, when the conductive balls B are arranged on the substrate 100, a non-overlapping one-pass route is selected as a moving route (trajectory, region) of the moving areas A <b> 1 to A <b> 4, and the single substrate 100 is electrically conductive. The time required for mounting (arranging) the functional balls B (referred to as tact time) is shortened. In the method of filling a ball into the opening 111 of the mask 110 using the filling device 10, as shown in FIG. 9, first, among the moving areas A1 to A4, the distance between the centers of the moving areas adjacent to each other is as follows. The intervals of the four heads 40a to 40d are set so as to be maintained at a value twice as large as the interval between the centers of the opening group rows adjacent to each other.

  Next, the four heads 40a to 40d of the ball holding device 20 are rotated in a state where their squeegees 43 are in contact with the surface 110a of the mask 110, and an appropriate amount (number) of electrical conductivity is provided by the ball supply units 50a to 50d. By supplying the balls B, the moving areas A1 to A4 are formed on the surface 110a of the mask 110, and the conductive balls B are held in the moving areas A1 to A4 (step of holding). As a result, the groups Bg1 to Bg4 of the four conductive balls B are independently formed in a limited area of the mask 110.

  Next, the ball holding device 20 is reciprocated by the moving device 80, and the center of each moving area A1 to A4 is the first opening group row 121 and the second opening group row 122 in each of the forward path and the return path. Is moved so as to pass through (moving step).

  Each of the moving areas A1 to A4 passes through the first opening group row 121 and the second opening group row 122 through which the moving area has not passed, so that the conductive balls B are placed in a total of eight opening group rows in one round trip. Can be filled. Therefore, the moving balls A1 to A4 are moved back and forth in the Y direction once in the Y direction in 5 rows and 8 columns and a total of 40 opening groups M provided in a matrix (array) on the mask 110. Can be filled. Further, a region (connection region) 123 connecting the first opening group row 121 and the second opening group row 122 in which the moving zones A1 to A4 move in the X direction while reciprocating in the Y direction is also the moving zones A1 to A4. The moving areas A1 to A4 reciprocate along the shortest path. For this reason, the tact time required for mounting (arraying) the conductive balls B on one substrate 100 can be shortened, and the time for manufacturing the substrate 100 on which the conductive balls B are mounted can be shortened.

  The trajectories T1 to T4 of the moving areas A1 to A4 can be arbitrarily set according to the size of the printed wiring board 100 and the arrangement of the electrode group N (opening group M), and the number of heads can be changed. The specific trajectory of the moving area is given as data such as an appropriate function or a look-up table in a program 90p stored in the control unit 90 that controls the ball filling apparatus 10.

  It is preferable that the diameter of moving area A1-A4 is 10 mm-100 mm. A more preferable range of the moving areas A1 to A4 is 20 to 60 mm. The rotation speed of the heads 40a to 40d is preferably 120 rpm or less. A more preferable range of the rotation speed of the heads 40a to 40d is 30 to 90 rpm. Further, if the moving speed of the moving areas A1 to A4 (substantially synonymous with the moving speed of the heads 40a to 40d in this example) is too slow, the tact time becomes long, and if it is too fast, it leads to a filling error. In the filling apparatus 10 and the filling method, the moving distance of the moving areas A1 to A4 can be shortened, so that the tact time can be shortened even if the moving speed is suppressed. For example, the moving speed of the moving areas A1 to A4 is preferably in the range of 2 to 120 mm / s, and more preferably in the range of 5 to 80 mm / s. In the filling apparatus of this example, the moving speed of the heads 40a to 40d is controlled to be 20 to 80 mm / s.

  FIG. 10 shows a flowchart for explaining an example of the ball mounting method in the ball mounting apparatus 1 of FIG. In step 201, the substrate transport robot 8 loads the substrate 100 from the first package 3a. The substrate 100 is scooped and moved by the tip (hand) of the substrate transport robot 8, and the substrate 100 is placed on the aligner 4. In step 202, the aligner 4 performs pre-alignment of the substrate 100 (pre-alignment). In step 203, the substrate 100 is moved from the aligner 4 to the stage 2, and the substrate 100 is moved to the warp correction device 5 with the substrate 100 placed on the stage 2.

  In the case where the substrate 100 is a printed wiring board, the substrate 100 may be heated to about 100 ° C. by a heating device provided on the stage 2 in order to more effectively correct the warp. The heating temperature depends on conditions such as the substrate 100 and solder, but the minimum is 50 ° C., and the upper (maximum) is a temperature at which the solder does not melt. The heating temperature can be set to 150 ° C., for example. When the warpage of the substrate 100 is small and the substrate 100 comes into close contact with the stage 2 by vacuum suction, the correction step (step 203) can be omitted.

  In step 204, with the substrate 100 placed on the stage 2, the substrate 100 is moved to the flux application device 6, and the flux F is applied onto the electrode 101 of the substrate 100 via the printing mask 6a.

  In step 205, the substrate 100 is moved to the ball filling device 10 with the substrate 100 placed on the stage 2, and the conductive balls B are mounted on the electrodes 101 of the substrate 100 through the transfer mask 110. In this step 205, the filling apparatus 10 causes the conductive balls B to be held in a concentrated manner in the plurality of moving areas A1 to A4, and the moving areas A1 to A4 are not opened groups so as not to draw overlapping trajectories. By selectively moving the surface 110a of the mask 110 along the row, the operation of this step can be completed in a short time for each substrate.

  In step 206, the substrate 100 is moved to an inspection apparatus (not shown), and a mounting error of the conductive ball B is inspected. The inspection result is stored as a processing attribute of the substrate 100, and when a processing attribute for stopping the printing of the flux and the transfer of the ball B is found, the processing is stopped in a predetermined procedure. Yes.

  In step 207, if the inspection result is good, the substrate 100 that has been inspected is unloaded from the inspection apparatus to the second package 3b by the substrate transport robot 8, and the mounting of the conductive ball B is completed. If there is an unprocessed substrate 100, the operation returns to step 201.

  As described above, according to the conductive ball mounting method, the control method of the ball filling device 10 and the ball filling device 10 of this example, the moving areas A1 to A4 typically do not overlap or hardly overlap. Typically, the conductive balls B can be filled in the plurality of openings 111 of the mask 110 in one round trip. Further, according to the conductive ball mounting method, the control method of the ball filling device 10, and the ball filling device 10 of this example, the moving areas A <b> 1 to A <b> 4 are moved from the region of the first opening group row 121 to the second opening group row 122. Typically, the region (region to be connected) 123 that passes when moving to the region does not overlap. Therefore, the time (tact time) required to mount (array) the conductive balls B can be further shortened.

  Further, in this filling device 10, a remaining ball removing device 130 is disposed on the opposite side of the home position (start position, left side in FIG. 1) of the ball holding device 20 (heads 40a to 40d), and the conductive ball B After the filling operation is completed, the conductive balls B left on the surface 110a of the mask 110 can be removed for confirmation. Therefore, drawing the locus where the heads 40a to 40d start and reciprocate from the home position and return to the home position is the most efficient process in the filling device 10 in relation to the operation of the remaining ball removing device 130. (Working sequence).

  In this example, all the heads 40a to 40d pass through the first opening group row 121 and the second opening group row 122, but all the heads 40a to 40d are not necessarily in the first opening group row. It does not have to pass through the row 121 and the second opening group row 122. That is, since the size of the printed wiring board 100 and the arrangement of the electrode groups N are various, it is sufficient that at least one head passes through the first opening group row 121 and the second opening group row 122.

  FIG. 11 shows an example of the locus of the centers of the three moving areas when the plurality of openings 111 of the mask 110 are filled with the conductive balls B. In this example, the conductive ball B is mounted in a state where the printed wiring board 100 is arranged in the vertical direction. Therefore, the printed wiring board 100 includes a total of 40 electrode groups N in 8 rows and 5 columns.

  As described above, in this filling apparatus 10, the conductive balls B can be filled in the two opening group rows 121 and 122 in one reciprocation for each head unit. In this example, there are five electrode group rows and five aperture group rows provided on the mask 110. For this reason, the conductive balls B are filled in five opening group rows (maximum six opening group rows) in one reciprocation by the three head units 30a to 30c. When the electrode group row is an odd row as in this example, one of the heads does not fill the opening 111 with the conductive ball B (passes through the non-filling region) on the return path. However, all the openings 111 of the mask 110 can be filled with the conductive balls B by making a single reciprocation of the plurality of moving areas A1 to A3. Of the three heads 40a to 40c filled with the conductive ball B, the consumption of the conductive ball B varies between the two heads 40a and 40b and the remaining head 40c. However, the ball supply units 50a to 50c are controlled. It can respond by changing.

  As described above, the filling device 10 includes a plurality of rotary heads 40a to 40d, and collects the conductive balls B while contacting the surface 110a of the mask 110 to form the moving areas A1 to A4. A binding wire member is used as the squeegee 43 to increase the recovery rate to the moving areas A1 to A4 and reduce the leakage rate. For this reason, more conductive balls B can be accumulated (concentrated) and held in the moving areas A1 to A4, filling efficiency in the moving area can be increased, and filling errors can be reduced. Therefore, as the route along which the heads 40a to 40d move, it is possible to select a route in which the trajectories of the moving areas A1 to A4 (bands where the respective moving areas can substantially pass and fill) do not overlap. For this reason, since the distance which movement area A1-A4 moves can be shortened to one round trip etc., the time (tact time) required for filling can be shortened.

  Further, by controlling the amount (number) of the conductive balls B held in each of the moving areas A1 to A4 by the ball supply units 50a to 50d, the amount of the conductive balls B held can be changed. It can be maintained at a value close to the limit where leakage does not occur from the zone and the filling rate does not fall due to a decrease in fluidity of the conductive balls B in the moving zone. For this reason, the quantity (number) of the conductive balls B held in the moving areas A1 to A4 can be increased to a level close to the upper limit, the filling efficiency can be improved, and filling mistakes can be reduced. Therefore, by controlling the path of movement of each moving area A1 to A4 like a one-pass or one-stroke drawing without overlapping the areas through which the moving areas A1 to A4 pass, it is efficient for all the openings 111 of the mask 110. Well, it can be filled with conductive balls in a short time. And the board | substrate 100 with which the conductive ball is mounted can be manufactured in a short time.

  In addition, the ball filling apparatus used when realizing the conductive ball mounting method and the filling apparatus control method of the present invention is not limited to the above-described apparatus 10. For example, the ball holding device included in the ball filling device may have at least two heads, preferably at least three heads.

  The above-described embodiments are merely examples for realizing the conductive ball mounting method, the ball filling device control method, and the ball filling device included in the present invention. For example, the moving device is not limited to a moving device using an XY rail, and may be a moving device using an arm.

  One of the objects of the present embodiment is to provide an apparatus, an apparatus control method, and a ball mounting method that can reduce the tact time. However, partial changes and variations obvious to those skilled in the art are considered to be within the scope of the present invention.

In one embodiment of the method disclosed above, a mask having a plurality of openings for disposing conductive balls on a substrate is set on the substrate, that is, a plurality of masks are aligned with the substrate. In this method, the conductive balls are mounted on the substrate by an apparatus for filling the openings with conductive balls. The above apparatus used in this method includes a ball holding means having a plurality of heads for forming a moving area in which a group of conductive balls are held on a part of the surface of the mask, and a reciprocating movement of the ball holding means. Moving means. The plurality of openings of the mask include a plurality of opening groups provided in a matrix. The method includes the following steps.
(A1) A plurality of groups of conductive balls are held in a plurality of moving areas on the surface of the mask by the ball holding means (step of holding).
(A2) By moving the ball holding means in a reciprocating manner while keeping the mutual intervals of the plurality of moving areas at a predetermined value by the moving means, the plurality of heads are respectively moved in the forward path and the return path. An aperture group row comprising a number of aperture groups arranged in series in the direction of reciprocating movement, each of which is adjacent to the first aperture group row and the first aperture group row in which any moving area has not passed Then, the moving area is moved so as to pass through the second opening group row that has not passed (moving step).

  Examples of a substrate on which a ball is mounted include a substrate on which a plurality of semiconductor chips (semiconductor devices) such as a printed wiring board (printed circuit board) are mounted in a matrix or array. In such a substrate, the plurality of electrodes includes a plurality of electrode groups provided in a matrix (array) form. Therefore, the plurality of openings of the mask, which is a template for arranging the balls on such a substrate, correspond to the plurality of electrode groups of the substrate and are provided in a plurality of opening groups distributed in a matrix (array). including.

  In this method, a plurality of groups of conductive balls are respectively held in a plurality of moving areas on the surface of the mask by a ball holding means having a plurality of heads, and a distance between the plurality of moving areas is predetermined by the moving means. The ball holding means is reciprocated while maintaining the value. Therefore, even if a small conductive ball is collected in a moving area with a limited area, the amount (number) of the limited conductive balls is transferred to the mask opening if it is limited to the inside of the moving area. (Filling) It is possible to maintain a density at which leakage is unlikely to occur. Further, in this method, in each of the forward path and the return path, each moving area, typically the center of each moving area, is a first opening group row that has not passed and a second opening group that has not passed. The ball holding means is moved so as to pass through the row. Therefore, the moving range of the moving area is limited to a non-passing portion that does not pass through any moving area in the unit of work in which the conductive ball is mounted on a certain substrate on the surface of the mask. . For this reason, in this method, the conductive balls are concentrated and held in the moving area, and the range of the mask surface through which the moving area passes is limited (selected) to the range in which no moving area passes. . For this reason, even with a small conductive ball, it is possible to efficiently fill the opening of the mask by concentrating the conductive ball and selecting the moving route in this method, and the tact time of the operation of transferring the conductive ball is reduced. In addition, a substrate on which conductive balls are mounted can be manufactured in a short time.

  Further, in this method, when each head moves in the forward path and the return path, the moving area moves in the adjacent opening group row (first and second opening group rows) adjacent to each other. For this reason, the moving area formed by each head moves along the shortest route (region) where none of the moving areas pass even during movement between the aperture group rows, and the moving time is shortened.

  Further, in this method, the moving area only needs to have an area sufficient to fill the conductive balls in the openings included in the opening group row that passes in the forward path and the return path, and the trajectory (passage band) through which the moving area passes is obtained. It is not necessary to widen the width of so that it overlaps with the passed area. Therefore, the area of the moving area can be further limited (reduced), and a limited number of conductive balls can be concentrated and held in the limited area. For this reason, the incidence rate of filling mistakes can be further reduced, and the loss rate of conductive balls can also be reduced.

  In this method, a typical example in which the conductive balls can be filled with the most efficiency is such that the ball holding means includes more than half the number of heads of the plurality of opening group rows provided in the mask, and each of these heads is In this case, two opening group rows adjacent to each other in one round trip are filled with conductive balls. In this case, the conductive balls can be filled in the openings of all the masks by reciprocating the ball holding means once, and the occurrence of filling mistakes can be reduced. Therefore, in this method, it is preferable that the ball holding means has a larger number of heads. More preferably, the number of heads provided in the ball holding means is 1/2 or more of the number of opening group rows included in the substrate. Optimally, when the opening group row is an even number, the number of heads provided in the ball holding means is ½ of the number of the opening group row, and when the opening group row is an odd number, the number of heads provided in the ball holding means is the opening. It is the closest integer greater than ½ of the number of group columns. Therefore, in this method, it is preferable that the ball holding means of the apparatus used includes two or more heads, and further, at least three heads. In the moving step, it is desirable to keep the interval between at least three heads at a predetermined value.

  In the process of holding the conductive balls in the moving area and filling the opening of the mask with the moving balls by moving the moving area, the amount (number, density) of the conductive balls in each moving area is the filling efficiency. However, it is desirable that the number be suppressed to such an extent that the fluidity of the conductive ball in the moving area is not hindered and the conductive ball does not leak from the head. Therefore, in this method, the ball holding means of the apparatus to be used is further provided corresponding to each of the plurality of heads, and replenishes the conductive balls to each of the plurality of moving areas via the plurality of heads. It is desirable to have a plurality of ball supply units for the purpose. In the holding step, the conductive balls are preferably supplied so that a sufficient number of the conductive balls are held inside the plurality of moving areas by the plurality of ball supply units.

  By providing the ball replenishment unit so as to correspond to each head, that is, each moving area on a one-to-one basis, the number (density) of conductive balls inside each moving area can be accurately controlled. For this reason, the amount (number, density) of the conductive balls in each moving area can always be kept appropriately concentrated. That is, the amount (number, density) of conductive balls in each moving area can maintain appropriate fluidity, can suppress the leakage of conductive balls, and the shortage of conductive balls occurs during filling. It can be maintained to the extent that it does not occur.

  Further, by providing the ball supply unit, a mechanism for distributing the conductive balls from one ball supply unit to a plurality of heads can be omitted, and several problems related to the distribution mechanism, for example, distribution accuracy, Interference between the communication path to the head and the moving means can be avoided.

  In the ball holding means of the apparatus used in this method, each of the plurality of heads includes a base member and a plurality of bundled linear members formed by binding both ends of the plurality of linear members. The plurality of binding linear members are preferably fixed to the base member in a twisted state. In the holding step, it is desirable to form the moving area by rotating the base members of the plurality of heads in a state where the plurality of binding linear members are in contact with the mask. In a rotary head that collects conductive balls at the center of each head and forms a moving area while each head rotates, a plurality of binding linear members are fixed to the base member in a twisted state. Thus, it is possible to make it difficult for the conductive ball to enter between the linear members. Further, it is possible to make it difficult for the conductive balls to get over the bundling linear member and dissipate out of the head. For this reason, the concentration degree (integration degree) of the amount (number, density) of conductive balls in each moving area can be improved, and dissipation can also be suppressed. Therefore, since the filling efficiency can be improved and filling mistakes can be reduced, it is possible to eliminate the requirement of overlapping moving area trajectories.

Another aspect of the method disclosed above is to fill a plurality of openings with conductive balls in a state in which a mask having a plurality of openings for placing the conductive balls on the substrate and the substrate are aligned. This apparatus is a method of controlling the apparatus by a control unit. The above apparatus used in this method reciprocates the ball holding means having a plurality of heads for forming moving areas each holding a group of conductive balls on a part of the surface of the mask, and the ball holding means. Moving means. The plurality of openings of the mask include a plurality of opening groups provided in a matrix. The control method includes the following steps.
(B1) In a state where the plurality of groups of conductive balls are held in the plurality of moving areas on the surface of the mask by the ball holding means, the mutual distance between the plurality of moving areas is kept at a predetermined value by the moving means. By reciprocating the holding means, the plurality of heads are arranged in an opening group row including several opening groups in which the center of each moving area is arranged in the direction of the reciprocating movement in each of the forward path and the backward path. And each of the moving areas is adjacent to the non-passing first opening group row and the first opening group row so that all of the moving zones pass through the non-passing second opening group row. Move (moving step).

  According to this control method, with the conductive balls concentrated and held in a plurality of moving areas, the first opening group row and the second opening that have not passed in the forward path and the return path on the mask surface, respectively. Select each group row and move each head to pass. Therefore, the time (takt time) required for mounting (arranging) the conductive balls can be further reduced.

  The ball holding means of the apparatus used in this control method is preferably provided with at least three heads. Since the number of reciprocations of the ball holding means can be reduced, the tact time can be shortened.

Further, the ball holding means of the apparatus used in this control method is further provided so as to correspond to each of the plurality of heads, and the conductive balls are provided to each of the plurality of moving areas via the plurality of heads. It is preferable to provide a plurality of ball replenishment units for replenishment. In this case, it is preferable that the control method further includes the following steps.
(B2) A sufficient amount (number) of conductive balls are held inside each of the plurality of moving areas by the plurality of ball supply units during the process of moving the conductive balls while holding them in the moving area. In addition, replenish conductive balls.

Further, in the ball holding means of the apparatus used in this control method, each of the plurality of heads includes a base member and a plurality of bundled linear members formed by binding both ends of the plurality of linear members. It is preferable that the plurality of binding linear members are fixed to the base member in a twisted state. In this case, it is preferable that the control method further includes the following steps.
(B3) During the process of moving the conductive ball while holding it in the moving area, the moving area is formed by rotating the base members of the plurality of heads in a state where the plurality of binding linear members are in contact with the mask. about.

  One of the devices disclosed above is for filling a plurality of openings with conductive balls in a state in which a mask having a plurality of openings for arranging the conductive balls on the substrate and the substrate are aligned. Device. This apparatus includes a ball holding means having a plurality of heads for forming moving areas in which a group of conductive balls are held on a part of a surface of a mask, and a distance between the moving areas by a predetermined value. A moving means for reciprocating the ball holding means and a control unit capable of controlling the moving means. The plurality of openings of the mask include a plurality of opening groups provided in a matrix. The control unit reciprocally moves the ball holding means by the moving means while holding the plurality of groups of conductive balls in the plurality of moving areas on the surface of the mask by the ball holding means, thereby moving the plurality of heads. In each of the forward path and the return path, each moving area is an opening group row including a number of opening groups arranged in series in the direction of reciprocating movement, and each of the moving areas is a non-passing first opening. It includes a function of moving the group row and the first opening group row adjacent to each other so as to pass through the second opening group row where all of the moving areas pass.

  This device concentrates the conductive balls in the moving area and typically conducts while reciprocating a selected area of the mask surface so that the moving areas do not overlap or hardly overlap. Fill with sex balls. Therefore, the time (tact time) required for mounting (arranging) the conductive balls can be further reduced as compared with the prior art.

  In this apparatus, the ball holding means preferably includes at least three heads. Since the number of reciprocations of the ball holding means can be reduced, the tact time can be shortened.

  In this device, the ball holding means is further provided corresponding to each of the plurality of heads, and a plurality of balls for supplying conductive balls to each of the plurality of moving areas via the plurality of heads. Preferably, a replenishment unit is provided. The control unit may further include a function of replenishing the conductive balls such that a sufficient amount (number) of the conductive balls are held in each of the plurality of moving areas by the plurality of ball replenishment units. preferable.

  According to this apparatus, since conductive balls can be supplied to each of a plurality of moving areas via a plurality of heads, the amount (number, density) of conductive balls in each moving area is always appropriately set. You can stay focused.

  Furthermore, in this apparatus, each of the plurality of heads is a base member and a plurality of bundled linear members obtained by binding both ends of the plurality of linear members, and each of the heads is in a twisted state. It is desirable to include a plurality of binding linear members fixed to the member and a mechanism for rotating the plurality of heads. The control unit preferably further includes a function of forming a moving area by rotating each base member of the plurality of heads in a state where the plurality of binding linear members are in contact with the mask. In the rotary head, the concentration of the conductive balls can be increased, so that the filling efficiency can be improved and the tact time can be shortened.

DESCRIPTION OF SYMBOLS 1 Ball mounting apparatus, 10 Ball filling apparatus 20 Ball holding apparatus (ball holding means)
40a, 40b, 40c, 40d Head 41 Base member, 42 Linear member, 43 Squeegee 50a, 50b, 50c, 50d Ball replenishment unit 80 Moving device (moving means), 90 Control unit 100 Substrate, 101 Electrode 110 Mask, 111 Opening 121 1st opening group row | line | column, 122 2nd opening group row | line | column A1, A2, A3, A4 Moving area B Conductive ball | bowl Bg1, Bg2, Bg3, Bg4 Conductive ball group M Opening group

Claims (5)

A conductive ball is mounted on the substrate by a device that fills the plurality of openings with the conductive ball in a state where the substrate is aligned with a mask having a plurality of openings for arranging the conductive balls on the substrate. A way to
The device is
Ball holding means comprising a plurality of heads each forming a moving area in which a group of conductive balls is held on a portion of the surface of the mask;
Moving means for reciprocating the ball holding means in a state where the intervals of the plurality of heads are adjusted;
The plurality of openings of the mask includes a plurality of opening groups provided in a matrix form,
The method is
In the forward path, the moving area formed by each head passes through a first aperture group row including a number of aperture groups arranged in series in the reciprocating direction in the forward path. In the return path, setting the second opening group row adjacent to the first opening group row so as to pass without overlapping the forward path;
Holding a plurality of groups of conductive balls in the plurality of moving areas on the surface of the mask, respectively, by the ball holding means;
The moving means includes reciprocating the ball holding means to fill the plurality of openings of the mask with conductive balls. 2. The plurality of ball replenishing units according to claim 1, wherein the ball holding means is provided corresponding to each of the plurality of heads and replenishes a conductive ball to each of a plurality of moving areas via the plurality of heads. With
The holding includes replenishing conductive balls such that a sufficient number of conductive balls are retained within each of the plurality of moving areas by the plurality of ball replenishment units. An apparatus for filling the plurality of openings with conductive balls in a state in which the substrate is aligned with a mask having a plurality of openings for disposing the conductive balls on the substrate,
Ball holding means comprising a plurality of heads each forming a moving area in which a group of conductive balls is held on a portion of the surface of the mask;
A moving means for reciprocating the ball holding means, wherein the plurality of heads are spaced apart from each other in a moving direction formed by each head in a series of directions in the reciprocating movement direction. A state in which the first opening group row including the opening group is passed, and the second opening group row adjacent to the first opening group row is set so as to pass without overlapping with the forward route in the return path. And reciprocating movement means.   4. The apparatus according to claim 3, wherein the ball holding means includes at least three heads. 5. The ball holding device according to claim 3, wherein the ball holding means is further provided corresponding to each of the plurality of heads, and supplies a plurality of conductive balls to each of a plurality of moving areas via the plurality of heads. A device including a ball replenishment unit.

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