JP2014025596A

JP2014025596A - Cooling device

Info

Publication number: JP2014025596A
Application number: JP2012163876A
Authority: JP
Inventors: Takashi Fukui; 孝史福井; Makoto Saito; 信齊藤; Fumitake Unezaki; 史武畝崎
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 2012-07-24
Filing date: 2012-07-24
Publication date: 2014-02-06
Anticipated expiration: 2032-07-24
Also published as: JP5631365B2

Abstract

PROBLEM TO BE SOLVED: To attain a low-cost and highly efficient cooling device capable of simultaneously reducing brine heat concentration and brine cooling load in a case of using brine mixed with freezing-point-lowering additive as a cooled fluid.SOLUTION: A cooling device 1000 includes a main refrigerant circuit A; an injection circuit B; an internal heat exchanger 6; a first heat exchanger 8; a main cooled fluid channel C; a bypass cooled fluid channel D; a second heat exchanger 9; and a third heat exchanger 10.

Description

本発明は、液体である被冷却流体を冷却する冷却装置に関するものである。 The present invention relates to a cooling device that cools a fluid to be cooled that is a liquid.

従来より、被冷却流体を冷却する冷却装置において、被冷却流体の凍結を防止することは冷却装置の信頼性を確保する上で重要な課題である。特に被冷却流体として凝固点を低下させる添加物を混ぜたブラインを使用する冷却装置においては、添加物の含有濃度が低下することでブラインが凍結する可能性がある。また、ブラインと周囲空気とを直接接触させることにより周囲空気を冷却する直接接触式の冷却装置においては、冷媒であるブラインと周囲空気が直接接触することになる。そのため、冷却された空気中の水分が凝縮してブライン中へ混入してしまうことは不可避である。 Conventionally, in a cooling device that cools a fluid to be cooled, preventing freezing of the fluid to be cooled has been an important issue in securing the reliability of the cooling device. In particular, in a cooling device that uses brine mixed with an additive that lowers the freezing point as a fluid to be cooled, the brine may freeze due to a decrease in the concentration of the additive. Moreover, in the direct contact type cooling device that cools the ambient air by bringing the brine and the ambient air into direct contact, the brine that is the refrigerant and the ambient air are in direct contact with each other. Therefore, it is inevitable that moisture in the cooled air is condensed and mixed into the brine.

このようなことから、ブラインにおける添加物の含有濃度低下を防止する目的で、ブラインに混入した水分を除去又は分離することによりブラインを濃縮させる技術がいくつか提案されている。 For this reason, several techniques for concentrating brine by removing or separating moisture mixed in the brine have been proposed for the purpose of preventing a decrease in the concentration of the additive in the brine.

従来技術として、直接接触式クーラに使用するブライン水溶液より水分を除去するブライン濃縮方法において、膜分離により１段目の濃縮を行い、得られた低濃度のブライン水溶液に対し２段目の濃縮を形成する凍結濃縮を行って２段階濃縮処理をなしたブライン濃縮方法とその装置が提案されている（例えば特許文献１参照）。 As a conventional technique, in a brine concentration method that removes moisture from a brine aqueous solution used in a direct contact cooler, the first stage concentration is performed by membrane separation, and the second stage concentration is performed on the obtained low concentration brine aqueous solution. A brine concentration method and an apparatus therefor have been proposed in which freeze-concentration is performed and two-stage concentration processing is performed (see Patent Document 1, for example).

また別の従来技術として、ブラインクーラによって冷却されたブラインにより空気を冷却する空気冷却装置において、加熱ヒータによりブライン濃縮装置のブラインを加熱する、もしくは凝縮器と直列に接続された加熱器によりブライン濃縮装置のブライン又は流通外気を加熱するようにした空気冷却装置が提案されている（例えば特許文献２参照）。 As another conventional technique, in an air cooling device that cools air using brine cooled by a brine cooler, the brine of the brine concentrating device is heated by a heater, or the brine is concentrated by a heater connected in series with the condenser. There has been proposed an air cooling device that heats brine or circulating outside air of the device (see, for example, Patent Document 2).

特開２００１−９２４４号公報（第３、４ページなど）JP 2001-9244 A (3rd, 4th page, etc.) 実公昭５８−２５２５０号公報（第１、２ページなど）Japanese Utility Model Publication No.58-25250 (first and second pages)

このような従来技術は、ブラインに混入した水分を除去又は分離することによりブラインを濃縮させることで、ブラインにおける添加物の含有濃度低下によるブラインの凍結を防止するようにしたものである。しかしながら、このような従来技術においては、膜分離モジュール等を備えたデバイスを別途追加設置する必要があるため、冷却装置としてコストがかかってしまうという課題があった。また、加熱による方法では、加熱投入熱量が大きく、またブライン加熱により戻りブラインが高くなり、戻りブラインの冷却負荷が大きくなるため、効率が悪くなってしまうという課題があった。 In such a conventional technique, the brine is concentrated by removing or separating water mixed in the brine, thereby preventing the brine from freezing due to a decrease in the concentration of the additive in the brine. However, in such a conventional technique, since it is necessary to additionally install a device including a membrane separation module or the like, there has been a problem that the cooling device is costly. In addition, the heating method has a problem that the heat input heat amount is large, the return brine is increased by heating the brine, and the cooling load of the return brine is increased, resulting in poor efficiency.

本発明は、上記のような課題を解決するためになされたもので、被冷却流体として凝固点を低下させる添加物を混ぜたブラインを使用した場合において、ブライン加熱濃縮と、ブライン冷却負荷の軽減を同時に実現でき、安価でかつ高効率な冷却装置を得ることを目的とする。 The present invention has been made in order to solve the above-described problems, and in the case of using brine mixed with an additive that lowers the freezing point as a fluid to be cooled, the brine heating concentration and the brine cooling load can be reduced. The object is to obtain an inexpensive and highly efficient cooling device that can be realized simultaneously.

本発明に係る冷却装置は、冷媒を圧縮する圧縮機、前記圧縮機により圧縮された冷媒を凝縮する凝縮器、前記凝縮器によって凝縮された冷媒を減圧する第１の減圧装置、前記第１の減圧装置によって減圧された冷媒を蒸発させる蒸発器が順次配管接続されて構成された主冷媒回路と、前記凝縮器と前記第１の減圧装置との間と前記圧縮機内の圧縮室とを接続したインジェクション回路と、前記インジェクション回路に設けられた第２の減圧装置と、前記第２の減圧装置で減圧された冷媒と前記凝縮器と前記第１の減圧装置との間の冷媒とで熱交換する内部熱交換器と、前記蒸発器において前記冷媒と熱交換する被冷却流体を前記蒸発器に送出する被冷却流体送出装置と、前記被冷却流体と周囲空気とで熱交換する第１の熱交換器と、前記蒸発器、前記被冷却流体送出装置、前記第１の熱交換器が接続されて構成された主被冷却流体流路と、前記主被冷却流体流路の前記第１の熱交換器と前記蒸発器との間の前記第１の熱交換器側から分岐され、前記主被冷却流体流路の前記第１の熱交換器と前記蒸発器との間の前記蒸発器側に接続されたバイパス被冷却流体流路と、前記圧縮機と前記凝縮器との間の冷媒と前記バイパス被冷却流体流路を流れる前記被冷却流体とで熱交換する第２の熱交換器と、前記インジェクション回路を流れる冷媒と前記バイパス被冷却流体流路において前記第２の熱交換器で熱交換された前記被冷却流体とで熱交換する第３の熱交換器と、を備えたものである。 The cooling device according to the present invention includes a compressor that compresses the refrigerant, a condenser that condenses the refrigerant compressed by the compressor, a first decompression device that decompresses the refrigerant condensed by the condenser, and the first An evaporator for evaporating the refrigerant depressurized by the depressurizing device is connected to the main refrigerant circuit, and the compressor and the compression chamber in the compressor are connected between the condenser and the first depressurizing device. Heat exchange is performed between the injection circuit, the second decompression device provided in the injection circuit, the refrigerant decompressed by the second decompression device, and the refrigerant between the condenser and the first decompression device. An internal heat exchanger, a cooled fluid delivery device that sends a cooled fluid that exchanges heat with the refrigerant in the evaporator, and a first heat exchange that exchanges heat between the cooled fluid and ambient air And the evaporation The cooled fluid delivery device, a main cooled fluid channel configured to be connected to the first heat exchanger, the first heat exchanger and the evaporator of the main cooled fluid channel, A bypass cooled fluid that is branched from the first heat exchanger side between the two and connected to the evaporator side between the first heat exchanger and the evaporator of the main cooled fluid channel A flow path, a second heat exchanger that exchanges heat between the refrigerant between the compressor and the condenser and the cooled fluid that flows through the bypass cooled fluid flow path, and a refrigerant that flows through the injection circuit And a third heat exchanger that exchanges heat with the cooled fluid that has been heat-exchanged with the second heat exchanger in the bypass cooled fluid flow path.

本発明によれば、被冷却流体を濃縮することにより、空気中の水分混入による被冷却流体の添加物含有濃度の低下を防止して、濃度低下に起因する熱交換器内での被冷却流体の凍結を防止することが可能となり信頼性が向上する。 According to the present invention, the fluid to be cooled is concentrated in the heat exchanger by concentrating the fluid to be cooled, thereby preventing a decrease in the additive-containing concentration of the fluid to be cooled due to mixing of moisture in the air. As a result, it is possible to prevent the freezing of the resin and to improve the reliability.

本発明の実施の形態に係る冷却装置の構成図である。It is a block diagram of the cooling device which concerns on embodiment of this invention. 本発明の実施の形態に係る冷却装置の冷媒の状態遷移を示すＰ−ｈ線図である。It is a Ph diagram which shows the state transition of the refrigerant | coolant of the cooling device which concerns on embodiment of this invention. 本発明の実施の形態に係る冷却装置のバイパス流量制御弁の制御処置の流れを示すフローチャートである。It is a flowchart which shows the flow of control treatment of the bypass flow control valve of the cooling device which concerns on embodiment of this invention.

以下、図面に基づいて本発明の実施の形態について説明する。なお、図１を含め、以下の図面では各構成部材の大きさの関係が実際のものとは異なる場合がある。また、図１を含め、以下の図面において、同一の符号を付したものは、同一又はこれに相当するものであり、このことは明細書の全文において共通することとする。さらに、明細書全文に表わされている構成要素の形態は、あくまでも例示であって、これらの記載に限定されるものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in the following drawings including FIG. 1, the relationship of the size of each component may be different from the actual one. Further, in the following drawings including FIG. 1, the same reference numerals denote the same or equivalent parts, and this is common throughout the entire specification. Furthermore, the forms of the constituent elements shown in the entire specification are merely examples, and are not limited to these descriptions.

図１は、本発明の実施の形態に係る冷却装置１０００の構成図である。図１に基づいて冷却装置１０００の構成について説明する。冷却装置１０００は、熱源機１００と室内機２００とを配管接続して構成されている。熱源機１００と室内機２００とは、配管接続部において適宜分離することが可能な構成になっている。 FIG. 1 is a configuration diagram of a cooling device 1000 according to an embodiment of the present invention. The configuration of the cooling device 1000 will be described with reference to FIG. The cooling device 1000 is configured by connecting the heat source device 100 and the indoor unit 200 by piping. The heat source device 100 and the indoor unit 200 are configured to be appropriately separated at the pipe connection portion.

《冷媒回路構成：熱源機１００》
熱源機１００は、圧縮機１、凝縮器２、第１の減圧装置３、蒸発器４、第２の減圧装置５、内部熱交換器６を有しており、これらを配管接続して構成された主冷媒回路Ａ及びインジェクション回路Ｂを冷媒回路として備えている。インジェクション回路Ｂは、主冷媒回路Ａにおける内部熱交換器６と第１の減圧装置３との間の冷媒をバイパスして圧縮機１へインジェクションするように設けられている。このインジェクション回路Ｂには、第２の減圧装置５と、内部熱交換器６が設置されている。 << Refrigerant circuit configuration: heat source machine 100 >>
The heat source device 100 includes a compressor 1, a condenser 2, a first decompression device 3, an evaporator 4, a second decompression device 5, and an internal heat exchanger 6, and these are connected by piping. The main refrigerant circuit A and the injection circuit B are provided as refrigerant circuits. The injection circuit B is provided to bypass the refrigerant between the internal heat exchanger 6 and the first decompression device 3 in the main refrigerant circuit A and inject it into the compressor 1. In this injection circuit B, a second decompression device 5 and an internal heat exchanger 6 are installed.

なお、主冷媒回路Ａの圧縮機１と凝縮器２との間にバイパス配管を接続して、圧縮機１と凝縮器２との間を流れる冷媒を一部バイパスする第１のバイパス冷媒流路Ｅと、インジェクション回路Ｂの内部熱交換器６と圧縮機１との間にバイパス配管を接続して、内部熱交換器６と圧縮機１の間を流れる冷媒を一部バイパスする第２のバイパス冷媒流路Ｆが設けられている。第１のバイパス冷媒流路Ｅ及び第２のバイパス冷媒流路Ｆについては、後段で室内機２００の構成と併せて説明する。 Note that a first bypass refrigerant flow path in which a bypass pipe is connected between the compressor 1 and the condenser 2 of the main refrigerant circuit A to partially bypass the refrigerant flowing between the compressor 1 and the condenser 2. E and a second bypass that bypasses the refrigerant flowing between the internal heat exchanger 6 and the compressor 1 by connecting a bypass pipe between the internal heat exchanger 6 of the injection circuit B and the compressor 1. A refrigerant flow path F is provided. The first bypass refrigerant flow path E and the second bypass refrigerant flow path F will be described later together with the configuration of the indoor unit 200.

（圧縮機）
圧縮機１は、冷媒を吸入し、その冷媒を圧縮して高温・高圧の状態にするものである。圧縮機１は、運転容量（周波数）を可変することが可能な容積式圧縮機で構成されている。運転容量を可変させる制御方法は、例えば、インバータにより制御されるモータの駆動による方法やスライドバルブを用いた方法がある。また、圧縮機１内の圧縮室内（例えば、圧縮途中過程の中間圧縮室）にインジェクション回路Ｂから供給される冷媒をインジェクションすることが可能な構造となっている。なお、図１においては、圧縮機１は１台のみとなっているが、これに限定されず、２台以上の圧縮機が並列もしくは直列に接続されたものであってもよい。 (Compressor)
The compressor 1 sucks refrigerant and compresses the refrigerant to a high temperature and high pressure state. The compressor 1 is composed of a positive displacement compressor capable of changing an operating capacity (frequency). Control methods for varying the operating capacity include, for example, a method of driving a motor controlled by an inverter and a method of using a slide valve. In addition, the refrigerant supplied from the injection circuit B can be injected into a compression chamber (for example, an intermediate compression chamber in the middle of compression) in the compressor 1. In FIG. 1, only one compressor 1 is provided. However, the present invention is not limited to this, and two or more compressors may be connected in parallel or in series.

（凝縮器）
凝縮器２は、圧縮機１から吐出された高温高圧の冷媒と外部からの熱源として供給される被熱交換媒体とが熱交換し、外部の熱源に放熱するものである。凝縮器２は、例えば、伝熱管と多数のフィンで構成されたクロスフィン式のフィン・アンド・チューブ型熱交換器で構成するとよい。フィン・アンド・チューブ型熱交換器を用いる場合は、熱交換媒体は空気であり、媒体の送出装置はファン等の駆動手段（図示せず）を用いる。 (Condenser)
The condenser 2 exchanges heat between the high-temperature and high-pressure refrigerant discharged from the compressor 1 and a heat exchange medium supplied as an external heat source, and dissipates heat to the external heat source. The condenser 2 may be constituted by, for example, a cross fin type fin-and-tube heat exchanger constituted by a heat transfer tube and a large number of fins. When a fin-and-tube heat exchanger is used, the heat exchange medium is air, and the medium delivery device uses driving means (not shown) such as a fan.

ただし、凝縮器２は、フィン・アンド・チューブ型熱交換器に限定されず、間隔をおいて薄板を多数並べて、周縁部をシールし、各薄板間に形成された空間を交互に冷媒流路と水流路としてなるプレート式熱交換器で構成してもよい。プレート式熱交換器を用いる場合であって、被熱交換媒体が例えば水のような流体である場合、ポンプ等の送出装置（図示せず）を用いて被熱交換媒体を凝縮器２に供給すればよい。この被熱交換媒体は水に限定するものではなく、同様な作用を示す流体であれば、別の流体であってもよい。 However, the condenser 2 is not limited to the fin-and-tube heat exchanger, and a large number of thin plates are arranged at intervals, the peripheral edge is sealed, and the space formed between the thin plates is alternately formed as a refrigerant flow path. And a plate heat exchanger as a water flow path. When a plate heat exchanger is used and the heat exchange medium is a fluid such as water, the heat exchange medium is supplied to the condenser 2 using a delivery device (not shown) such as a pump. do it. The heat exchange medium is not limited to water, and may be another fluid as long as it exhibits a similar action.

なお、図１においては、凝縮器２が１台のみ搭載されている状態を例に示しているが、これに限定されず２台以上の凝縮器が並列又は直列に接続して搭載するようにしてもよい。さらに、凝縮器２は、ヒートパイプ式熱交換器、マイクロチャネル熱交換器、シェルアンドチューブ式熱交換器、二重管式熱交換器等で構成してもよい。 Although FIG. 1 shows an example in which only one condenser 2 is mounted, the present invention is not limited to this, and two or more condensers are mounted in parallel or in series. May be. Furthermore, the condenser 2 may be configured by a heat pipe heat exchanger, a microchannel heat exchanger, a shell and tube heat exchanger, a double tube heat exchanger, or the like.

（減圧装置）
第１の減圧装置３及び第２の減圧装置５は、冷媒を減圧して膨張させるものである。第１の減圧装置３は、主冷媒回路Ａ内を流れる冷媒の流量の調節等を行うもので、ステッピングモータ（図示せず）により絞りの開度を調整することが可能な電子膨張弁で構成するとよい。第２の減圧装置５は、インジェクション回路Ｂを流れる冷媒の流量の調整等を行うもので、ステッピングモータ（図示せず）により絞りの開度を調整することが可能な電子膨張弁で構成するとよい。なお、電子膨張弁以外にも、受圧部にダイアフラムを採用した機械式膨張弁、又は温度式膨張弁、キャピラリーチューブ等、同様な役割を成すものであれば、他の形式のものを用いてもよい。 (Pressure reduction device)
The first decompression device 3 and the second decompression device 5 decompress and expand the refrigerant. The first pressure reducing device 3 adjusts the flow rate of the refrigerant flowing in the main refrigerant circuit A, and is constituted by an electronic expansion valve that can adjust the opening of the throttle by a stepping motor (not shown). Good. The second decompression device 5 adjusts the flow rate of the refrigerant flowing through the injection circuit B, and may be constituted by an electronic expansion valve capable of adjusting the opening of the throttle by a stepping motor (not shown). . In addition to the electronic expansion valve, other types may be used as long as they have a similar function, such as a mechanical expansion valve adopting a diaphragm for the pressure receiving portion, a temperature expansion valve, a capillary tube, or the like. Good.

（蒸発器）
蒸発器４は、第１の減圧装置３で減圧された低温低圧の冷媒と被冷熱流体とが熱交換するものである。蒸発器４は、例えば間隔をおいて薄板を多数並べて、周縁部をシールし、各薄板間に形成された空間を交互に冷媒流路と被冷却流体流路としてなるプレート式熱交換器で構成するとよい。 (Evaporator)
The evaporator 4 exchanges heat between the low-temperature and low-pressure refrigerant decompressed by the first decompression device 3 and the cooled heat fluid. The evaporator 4 is composed of a plate heat exchanger in which, for example, a large number of thin plates are arranged at intervals, the peripheral edge is sealed, and the space formed between the thin plates is alternately used as a refrigerant flow path and a cooled fluid flow path. Good.

また、蒸発器４は、プレート式熱交換器に限定されず、冷媒と熱交換する熱交換媒体として液体の被冷却流体を用いることができるものであれば他の形式の熱交換器であってもよい。例えば、シェルアンドチューブ式熱交換器で蒸発器４を構成してもよい。 The evaporator 4 is not limited to a plate heat exchanger, and may be any other type of heat exchanger as long as it can use a liquid to be cooled as a heat exchange medium for exchanging heat with a refrigerant. Also good. For example, you may comprise the evaporator 4 with a shell and tube type heat exchanger.

（内部熱交換器）
内部熱交換器６は、凝縮器２と第１の減圧装置３との間を流れる冷媒と、インジェクション回路Ｂにおける第２の減圧装置５と圧縮機１との間を流れる冷媒と、で熱交換するように配置されるものである。内部熱交換器６は、例えば間隔をおいて薄板を多数並べて、周縁部をシールし、各薄板間に形成された空間を交互に冷媒流路と被冷却流体流路としてなるプレート式熱交換器で構成するとよい。なお、内部熱交換器６は、プレート式熱交換器に限定されず、同様の役割を成すものであれば、他の形式の熱交換器であってもよい。 (Internal heat exchanger)
The internal heat exchanger 6 exchanges heat between the refrigerant flowing between the condenser 2 and the first pressure reducing device 3 and the refrigerant flowing between the second pressure reducing device 5 and the compressor 1 in the injection circuit B. It is arranged to do. The internal heat exchanger 6 is, for example, a plate type heat exchanger in which a large number of thin plates are arranged at intervals, the peripheral edge is sealed, and the space formed between the thin plates is alternately used as a refrigerant flow path and a cooled fluid flow path. It is good to comprise. The internal heat exchanger 6 is not limited to a plate heat exchanger, and may be another type of heat exchanger as long as it plays a similar role.

《被冷却流体流路構成：室内機２００》
室内機２００は、主冷媒回路Ａを循環する冷媒と熱交換する被冷却流体が循環する主被冷却流体流路Ｃを備えている。この主被冷却流体流路Ｃに、蒸発器４、被冷却流体を循環させるための被冷却流体送出装置７、周囲空気と主被冷却流体流路Ｃを流れる被冷却流体とを熱交換させる第１の熱交換器８が接続されている。そして、蒸発器４と第１の熱交換器８との間を被冷却流体が循環するように主被冷却流体流路Ｃが構成されている。 << Cooled fluid flow path configuration: indoor unit 200 >>
The indoor unit 200 includes a main cooled fluid channel C through which a cooled fluid that exchanges heat with the refrigerant circulating in the main refrigerant circuit A circulates. In this main cooled fluid flow path C, the evaporator 4, the cooled fluid delivery device 7 for circulating the cooled fluid, the first air that exchanges heat between the ambient air and the cooled fluid flowing in the main cooled fluid flow path C. 1 heat exchanger 8 is connected. The main cooled fluid flow path C is configured so that the cooled fluid circulates between the evaporator 4 and the first heat exchanger 8.

また、主被冷却流体流路Ｃの第１の熱交換器８から蒸発器４との間にバイパス配管を接続して、第１の熱交換器８から蒸発器４へと戻る被冷却流体の一部をバイパスするバイパス被冷却流体流路Ｄが設けられている。このバイパス被冷却流体流路Ｄには、被冷却流体流量制御弁１１、バイパスされた被冷却流体と圧縮機１より吐出された高温冷媒とで熱交換する第２の熱交換器９、バイパスされた被冷却流体とインジェクション回路Ｂの冷媒と熱交換する第３の熱交換器１０が設置されている。 Further, a bypass pipe is connected between the first heat exchanger 8 and the evaporator 4 in the main cooled fluid channel C, and the cooled fluid returning from the first heat exchanger 8 to the evaporator 4 A bypass to-be-cooled fluid flow path D that bypasses a part is provided. This bypass cooled fluid flow path D is bypassed by a cooled fluid flow rate control valve 11, a second heat exchanger 9 that exchanges heat between the bypassed cooled fluid and the high-temperature refrigerant discharged from the compressor 1. A third heat exchanger 10 is provided for exchanging heat between the cooled fluid and the refrigerant in the injection circuit B.

第１のバイパス冷媒流路Ｅが設けられていることは上述したが、第２の熱交換器９において第１のバイパス冷媒流路Ｅを流れる冷媒と被冷却流体とが熱交換するように構成している。また、第２のバイパス冷媒流路Ｆが設けられていることは上述したが、第３の熱交換器１０において第２のバイパス冷媒流路Ｆを流れる冷媒と被冷却流体とが熱交換するように構成している。 Although the first bypass refrigerant flow path E is provided as described above, the second heat exchanger 9 is configured to exchange heat between the refrigerant flowing through the first bypass refrigerant flow path E and the fluid to be cooled. doing. In addition, as described above, the second bypass refrigerant flow path F is provided, but in the third heat exchanger 10, the refrigerant flowing through the second bypass refrigerant flow path F and the fluid to be cooled exchange heat. It is configured.

そして、第１のバイパス冷媒流路Ｅには第１の冷媒流量制御弁１２、第２のバイパス冷媒流路Ｆには第２の冷媒流量制御弁１３を設置し、これらの冷媒流量制御弁の開度を制御することで各バイパス冷媒流路への冷媒の流入流量を制御するようにしている。なお、バイパス被冷却流体流路Ｄ、第１のバイパス冷媒流路Ｅ、第２のバイパス冷媒流路Ｆにおいては、それぞれ主流路への戻り出口に逆流防止のための逆止弁１４（逆止弁１４ａ〜１４ｃ）を設置している。 A first refrigerant flow control valve 12 is installed in the first bypass refrigerant flow path E, and a second refrigerant flow control valve 13 is installed in the second bypass refrigerant flow path F. The flow rate of the refrigerant flowing into each bypass refrigerant flow path is controlled by controlling the opening degree. In each of the bypass cooled fluid flow path D, the first bypass refrigerant flow path E, and the second bypass refrigerant flow path F, a check valve 14 (check valve) for preventing a backflow is provided at the return outlet to the main flow path. Valves 14a-14c) are installed.

（被冷却流体）
主被冷却流体流路Ｃ及びバイパス被冷却流体流路Ｄを循環する被冷却流体には、水に凝固点を降下させる添加物を混ぜたブラインを用いる。被冷却流体の凍結温度（凝固点）は、添加物の含有濃度（以下、ブライン濃度という）によって異なるため、循環させる被冷却流体の温度よりも低い凝固点になるようにブライン濃度が調整されて使用される。例えば、被冷却流体の温度が−５℃であれば、凝固点が−１５℃となるようにブライン濃度を調整して使用される。添加物の含有濃度を高めてブライン濃度を高くするほど凝固点は低くなり、添加物の含有濃度を低くしてブライン濃度を低くするほど凝固点は高くなる。 (Cooled fluid)
As the cooled fluid that circulates through the main cooled fluid channel C and the bypass cooled fluid channel D, brine in which an additive that lowers the freezing point is mixed with water is used. The freezing temperature (freezing point) of the fluid to be cooled varies depending on the additive concentration (hereinafter referred to as the brine concentration), so the brine concentration is adjusted to be lower than the temperature of the fluid to be circulated. The For example, if the temperature of the fluid to be cooled is −5 ° C., the brine concentration is adjusted so that the freezing point is −15 ° C. The freezing point decreases as the concentration of the additive increases and the brine concentration increases, and the freezing point increases as the concentration of the additive decreases and the brine concentration decreases.

（被冷却流体送出装置）
また、被冷却流体送出装置７は、主被冷却流体流路Ｃ及びバイパス被冷却流体流路Ｄにおいて前述のような被冷却流体を循環させるために用いるものであり、ポンプ等の流体送出装置で構成するとよい。ただし、被冷却流体送出装置７は、ポンプ等の流体送出装置に限定するものではなく、同様な役割を成すものであれば、他形式の送出装置であってもよい。 (Cooled fluid delivery device)
The cooled fluid delivery device 7 is used for circulating the cooled fluid as described above in the main cooled fluid channel C and the bypass cooled fluid channel D, and is a fluid delivery device such as a pump. Configure. However, the fluid delivery device 7 to be cooled is not limited to a fluid delivery device such as a pump, and may be a delivery device of another type as long as it plays a similar role.

（第１の熱交換器）
第１の熱交換器８は、主被冷却流体流路Ｃを流れる被冷却流体と熱交換媒体として供給される周囲空気とを直接接触させて熱交換させる直接接触式のものである。ここでの熱交換媒体は空気であるため、媒体の送出装置はファン等の駆動手段（例えば、図１に示すようなファン８ａ）を用いる。 (First heat exchanger)
The first heat exchanger 8 is a direct contact type in which heat is exchanged by directly contacting the fluid to be cooled flowing through the main fluid flow path C and the ambient air supplied as a heat exchange medium. Since the heat exchange medium here is air, the medium delivery device uses driving means such as a fan (for example, a fan 8a as shown in FIG. 1).

（第２の熱交換器）
第２の熱交換器９は、バイパス被冷却流体流路Ｄを流れる被冷却流体と第１のバイパス冷媒流路Ｅを流れる高温冷媒とを熱交換させるものである。第２の熱交換器９は、構成を特に限定するものではないが、被冷却流体を高温冷媒により加熱して蒸発させるため、被冷却流体の蒸気を外部へ放出できるような開放型の形式のもので構成するとよい。例えば、第２の熱交換器９は、貯湯タンクなどで構成するとよい。 (Second heat exchanger)
The second heat exchanger 9 exchanges heat between the cooled fluid flowing through the bypass cooled fluid flow path D and the high-temperature refrigerant flowing through the first bypass refrigerant flow path E. The configuration of the second heat exchanger 9 is not particularly limited. However, since the fluid to be cooled is evaporated by heating with a high-temperature refrigerant, the second heat exchanger 9 is of an open type that can release the vapor of the fluid to be cooled to the outside. It should be composed of things. For example, the second heat exchanger 9 may be composed of a hot water storage tank or the like.

（第３の熱交換器）
第３の熱交換器１０は、バイパス被冷却流体流路Ｄを流れる被冷却流体と第２のバイパス冷媒流路Ｆを流れる冷媒とを熱交換させるものである。第３の熱交換器１０は、構成を特に限定するものではないが、例えば二重管式熱交換器で構成するとよい。なお、第３の熱交換器１０は、二重管式熱交換器に限定するものではなく、同様の役割を成すものであれば、他の形式の熱交換器であってもよい。 (Third heat exchanger)
The third heat exchanger 10 exchanges heat between the cooled fluid flowing through the bypass cooled fluid flow path D and the refrigerant flowing through the second bypass refrigerant flow path F. The configuration of the third heat exchanger 10 is not particularly limited. For example, the third heat exchanger 10 may be a double pipe heat exchanger. The third heat exchanger 10 is not limited to a double-pipe heat exchanger, and may be another type of heat exchanger as long as it plays a similar role.

（流量制御弁）
被冷却流体流量制御弁１１は、バイパス被冷却流体流路Ｄへの被冷却流体のバイパス流量を制御するものである。第１の冷媒流量制御弁１２は、第１のバイパス冷媒流路Ｅへの冷媒のバイパス流量を制御するものである。第２の冷媒流量制御弁１３は、第２のバイパス冷媒流路Ｆへの冷媒のバイパス流量を制御するものである。 (Flow control valve)
The cooled fluid flow rate control valve 11 controls the bypass flow rate of the cooled fluid to the bypass cooled fluid channel D. The first refrigerant flow control valve 12 controls the bypass flow rate of the refrigerant to the first bypass refrigerant flow path E. The second refrigerant flow rate control valve 13 controls the bypass flow rate of the refrigerant to the second bypass refrigerant flow path F.

（計測・制御系）
冷却装置１０００には、計測制御部２０が設置されている。計測制御部２０は、各種検出手段によって検出された検出値（圧力や温度などの計測情報）や、冷却装置１０００の使用者から指示される運転内容に基づいて、圧縮機１の運転方法、各減圧装置の開度、各流量制御弁の開度、ファン送風量などを制御する。計測制御部２０は、その機能を実現する回路デバイスのようなハードウェアで構成することもできるし、マイコンやＣＰＵのような演算装置と、その上で実行されるソフトウェアとにより構成することもできる。 (Measurement / control system)
A measurement control unit 20 is installed in the cooling device 1000. The measurement control unit 20 determines the operation method of the compressor 1 based on the detection values (measurement information such as pressure and temperature) detected by the various detection means and the operation content instructed by the user of the cooling device 1000. It controls the opening of the decompression device, the opening of each flow control valve, the fan air flow rate, and the like. The measurement control unit 20 can be configured by hardware such as a circuit device that realizes the function, or can be configured by an arithmetic device such as a microcomputer or a CPU and software executed thereon. .

主被冷却流体流路Ｃにおける第１の熱交換器８の出口側には被冷却流体濃度検出手段３０が設置されており、主被冷却流体流路Ｃを流れる被冷却流体（ブライン）の濃度を検出する。被冷却流体濃度検出手段３０としては、例えばブライン濃度計を用いるとよい。ブライン濃度計は、図１に示したように主被冷却流体流路Ｃの流路上に設置して実測してもよいし、ハンディータイプの濃度計を用いてもよい。なお、被冷却流体濃度検出手段３０は、ブライン濃度計の使用による方法に限定されず、ブライン濃度を検出可能な手段であれば、別の検出手段であってもよい。 A cooled fluid concentration detecting means 30 is installed on the outlet side of the first heat exchanger 8 in the main cooled fluid channel C, and the concentration of the cooled fluid (brine) flowing through the main cooled fluid channel C Is detected. As the cooled fluid concentration detecting means 30, for example, a brine concentration meter may be used. As shown in FIG. 1, the brine densitometer may be installed on the main cooled fluid flow path C and measured, or a handy type densitometer may be used. The cooled fluid concentration detection means 30 is not limited to a method using a brine concentration meter, and may be another detection means as long as it can detect the brine concentration.

（冷媒）
冷却装置１０００に用いられる冷媒には、例えばＲ４１０Ａ、Ｒ４０７Ｃ、Ｒ４０４Ａ等のＨＦＣ（ハイドロフルオロカーボン）冷媒、Ｒ２２、Ｒ１３４ａ等のＨＣＦＣ（ハイドロクロロフルオロカーボン）冷媒、もしくは炭化水素、ヘリウムのような自然冷媒等があるが、これに限定されず同様の冷媒作用をするものであれば、上記以外のものであってもよい。 (Refrigerant)
Examples of the refrigerant used in the cooling device 1000 include HFC (hydrofluorocarbon) refrigerants such as R410A, R407C, and R404A, HCFC (hydrochlorofluorocarbon) refrigerants such as R22 and R134a, or natural refrigerants such as hydrocarbon and helium. However, the present invention is not limited to this, and may be other than the above as long as the same refrigerant action is performed.

《運転動作》
続いて、冷却装置１０００の運転動作について図１および図２に基づき説明する。図２は、冷却装置１０００の冷媒の状態遷移を示すＰ−ｈ線図である。《Driving operation》
Subsequently, the operation of the cooling device 1000 will be described with reference to FIGS. 1 and 2. FIG. 2 is a Ph diagram illustrating the state transition of the refrigerant in the cooling device 1000.

圧縮機１から吐出された高温高圧のガス冷媒（図２に示す点１）は凝縮器２へ至り、外部からの被熱交換媒体との熱交換作用により凝縮液化し、高圧低温の冷媒となる（図２に示す点２）。凝縮液化した高圧低温の冷媒は、内部熱交換器６で、インジェクション回路Ｂを流れる低温の冷媒と熱交換し、冷却される（図２に示す点３）。この冷媒は内部熱交換器６を出た後、一部の冷媒がインジェクション回路Ｂにバイパスされ、残りの冷媒が第１の減圧装置３にて減圧されて二相冷媒となって、蒸発器４に送られる（図２に示す点４）。蒸発器４に送られた二相冷媒は、被冷却流体送出装置７により供給される被冷却流体との熱交換作用により蒸発し、低圧のガス冷媒となり（図２に示す点５）、圧縮機１に吸入される。 The high-temperature and high-pressure gas refrigerant (point 1 shown in FIG. 2) discharged from the compressor 1 reaches the condenser 2 and is condensed and liquefied by heat exchange with the heat exchange medium from the outside to become a high-pressure and low-temperature refrigerant. (Point 2 shown in FIG. 2). The condensed and liquefied high-pressure and low-temperature refrigerant exchanges heat with the low-temperature refrigerant flowing through the injection circuit B in the internal heat exchanger 6 and is cooled (point 3 shown in FIG. 2). After this refrigerant leaves the internal heat exchanger 6, a part of the refrigerant is bypassed to the injection circuit B, and the remaining refrigerant is decompressed by the first decompression device 3 to become a two-phase refrigerant, and the evaporator 4 (Point 4 shown in FIG. 2). The two-phase refrigerant sent to the evaporator 4 is evaporated by a heat exchange action with the fluid to be cooled supplied by the fluid delivery device 7 to be cooled to become a low-pressure gas refrigerant (point 5 shown in FIG. 2). 1 is inhaled.

一方、インジェクション回路Ｂにバイパスされた冷媒は、第２の減圧装置５で中間圧まで減圧されて低温の二相冷媒となり（図２に示す点６）、その後に内部熱交換器６で高圧冷媒と熱交換し加熱され（図２に示す点７）、圧縮機１にインジェクションされる。圧縮機１の内部では、吸入された冷媒（図２に示す点５）が中間圧まで圧縮、加熱された（図２に示す点８）後に、インジェクションされる冷媒と合流し、温度低下して（図２に示す点９）、再度高圧まで圧縮され吐出される（図２に示す点１）。 On the other hand, the refrigerant bypassed to the injection circuit B is decompressed to the intermediate pressure by the second decompression device 5 to become a low-temperature two-phase refrigerant (point 6 shown in FIG. 2), and then the high-pressure refrigerant in the internal heat exchanger 6. It is heated by exchanging heat with (point 7 shown in FIG. 2) and injected into the compressor 1. Inside the compressor 1, after the sucked refrigerant (point 5 shown in FIG. 2) is compressed and heated to an intermediate pressure (point 8 shown in FIG. 2), it merges with the injected refrigerant and the temperature drops. (Point 9 shown in FIG. 2) is again compressed to a high pressure and discharged (point 1 shown in FIG. 2).

また、主被冷却流体流路Ｃでは、被冷却流体送出装置７によって被冷却流体が蒸発器４に供給され、主冷媒回路Ａの冷媒との熱交換作用により冷却された後、第１の熱交換器８に導かれる。第１の熱交換器８では、熱交換媒体として供給される周囲空気と被冷却流体とを直接接触させて熱交換させることで周囲空気を冷却する。その後、被冷却流体は、第１の熱交換器８から蒸発器４へ戻る。この時に、第１の熱交換器８から蒸発器４への被冷却流体戻り流路で、被冷却流体の一部をバイパスするバイパス被冷却流体流路Ｄへ被冷却流体を流入させて第２の熱交換器９へ送る。 In the main cooled fluid channel C, the cooled fluid is supplied to the evaporator 4 by the cooled fluid delivery device 7 and cooled by heat exchange with the refrigerant in the main refrigerant circuit A, and then the first heat is supplied. Guided to the exchanger 8. In the first heat exchanger 8, the ambient air is cooled by directly contacting the ambient air supplied as the heat exchange medium with the fluid to be cooled to exchange heat. Thereafter, the fluid to be cooled returns from the first heat exchanger 8 to the evaporator 4. At this time, in the fluid to be cooled return path from the first heat exchanger 8 to the evaporator 4, the fluid to be cooled flows into the bypass fluid cooled fluid channel D that bypasses a part of the fluid to be cooled. To the heat exchanger 9.

第２の熱交換器９では、圧縮機１と凝縮器２の間を流れる冷媒を一部バイパスした高温高圧冷媒（図２に示す（１））との熱交換作用により、被冷却流体を加熱して水分を蒸発させる。第２の熱交換器９で加熱された被冷却流体は、第３の熱交換器１０へ流入し、第３の熱交換器１０でインジェクション回路Ｂを流れる中間圧冷媒（図２に示す（２））との熱交換作用により冷却される。冷却された後、被冷却流体は、主被冷却流体流路Ｃへ合流し、主被冷却流体流路Ｃを循環した被冷却流体とともに蒸発器４へ流入する。 In the second heat exchanger 9, the fluid to be cooled is heated by a heat exchange action with a high-temperature and high-pressure refrigerant ((1) shown in FIG. 2) that partially bypasses the refrigerant flowing between the compressor 1 and the condenser 2. To evaporate the water. The fluid to be cooled heated by the second heat exchanger 9 flows into the third heat exchanger 10, and the intermediate-pressure refrigerant (shown in FIG. 2 (2 shown in FIG. 2) flows through the injection circuit B in the third heat exchanger 10. It is cooled by the heat exchange action with)). After being cooled, the cooled fluid merges into the main cooled fluid channel C and flows into the evaporator 4 together with the cooled fluid circulated through the main cooled fluid channel C.

ここで、第１の減圧装置３は、圧縮機１の吸入側の冷媒過熱度が所定値となるように開度調整され、蒸発器４を流れる冷媒の流量を制御する。このため、蒸発器４の出口のガス冷媒は所定の過熱度を有する状態にて圧縮機１へ戻る。 Here, the opening of the first decompression device 3 is adjusted so that the refrigerant superheating degree on the suction side of the compressor 1 becomes a predetermined value, and the flow rate of the refrigerant flowing through the evaporator 4 is controlled. For this reason, the gas refrigerant at the outlet of the evaporator 4 returns to the compressor 1 in a state having a predetermined degree of superheat.

第２の減圧装置５は、インジェクション回路Ｂにおける内部熱交換器６の出口の冷媒過熱度、又は圧縮機１の吐出の冷媒過熱度が所定値となるように開度調整され、インジェクション回路Ｂを流れる冷媒の流量を制御する。 The second decompression device 5 is adjusted in opening degree so that the refrigerant superheat degree at the outlet of the internal heat exchanger 6 in the injection circuit B or the refrigerant superheat degree discharged from the compressor 1 becomes a predetermined value. The flow rate of the flowing refrigerant is controlled.

圧縮機１は、主被冷却流体流路Ｃを流れる被冷却流体の冷却負荷に応じ、かつ、被冷却流体が凍結しない範囲での流量の冷媒が蒸発器４に流れるように、運転容量が制御される。 The compressor 1 has an operating capacity controlled so that a refrigerant having a flow rate within a range in which the cooled fluid does not freeze flows to the evaporator 4 according to the cooling load of the cooled fluid flowing through the main cooled fluid channel C. Is done.

《バイパス流量制御弁の動作方法》
次に、バイパス流量制御弁の動作方法について図３のフローチャートに基づいて説明する。図３は、冷却装置１０００のバイパス流量制御弁の制御処置の流れを示すフローチャートである。被冷却流体流量制御弁１１、第１の冷媒流量制御弁１２、第２の冷媒流量制御弁１３は、被冷却流体であるブラインの濃度状態に応じて開度が調整される。なお、被冷却流体流量制御弁１１、第１の冷媒流量制御弁１２、第２の冷媒流量制御弁１３の開度制御は、計測制御部２０が実行する。《Bypass flow control valve operation method》
Next, the operation method of the bypass flow rate control valve will be described based on the flowchart of FIG. FIG. 3 is a flowchart showing a flow of control treatment of the bypass flow rate control valve of the cooling device 1000. The degree of opening of the cooled fluid flow rate control valve 11, the first refrigerant flow rate control valve 12, and the second refrigerant flow rate control valve 13 is adjusted according to the concentration state of the brine that is the cooled fluid. In addition, the measurement control part 20 performs the opening degree control of the to-be-cooled fluid flow rate control valve 11, the first refrigerant flow rate control valve 12, and the second refrigerant flow rate control valve 13.

計測制御部２０は、運転開始後、まず被冷却流体流量制御弁１１、第１の冷媒流量制御弁１２、第２の冷媒流量制御弁１３の開度を初期値に設定する（ステップＳ１）。この実施の形態では、被冷却流体流量制御弁１１、第１の冷媒流量制御弁１２、第２の冷媒流量制御弁１３の初期値をともに全閉開度とする。 The measurement control part 20 sets the opening degree of the to-be-cooled fluid flow control valve 11, the 1st refrigerant | coolant flow control valve 12, and the 2nd refrigerant | coolant flow control valve 13 to an initial value after a driving | operation start (step S1). In this embodiment, the initial values of the to-be-cooled fluid flow rate control valve 11, the first refrigerant flow rate control valve 12, and the second refrigerant flow rate control valve 13 are all set to the fully closed opening.

次に、計測制御部２０は、被冷却流体濃度検出手段３０によりブライン初期濃度φ₀を検出して設定する（ステップＳ２）。続いて、計測制御部２０は、被冷却流体濃度検出手段３０により現在のブライン濃度φを検出する（ステップＳ３）。そして、計測制御部２０は、現在のブライン濃度φとブライン初期濃度φ₀とを比較する（ステップＳ４）。これにより、計測制御部２０は、バイパス被冷却流体流路Ｄへのバイパス流量を決定するようになっている。 Next, the measurement control unit 20 detects and sets the brine initial concentration φ ₀ by the cooled fluid concentration detecting means 30 (step S2). Subsequently, the measurement control unit 20 detects the current brine concentration φ by the cooled fluid concentration detection means 30 (step S3). Then, the measurement control unit 20 compares the current brine concentration φ with the brine initial concentration φ ₀ (step S4). Thereby, the measurement control part 20 determines the bypass flow volume to the bypass to-be-cooled fluid flow path D.

現在のブライン濃度φがブライン初期濃度φ₀よりも等しいか或いは大きい場合（ステップＳ４；ＹＥＳ）には、被冷却流体流量制御弁１１、第１の冷媒流量制御弁１２、第２の冷媒流量制御弁１３の開度をそのまま維持する。一方、現在のブライン濃度φがブライン初期濃度φ₀よりも小さい場合（ステップＳ４；ＮＯ）には、ブライン濃度が低下しているので、被冷却流体流量制御弁１１、第１の冷媒流量制御弁１２、第２の冷媒流量制御弁１３の開度を大きくするように開度を変更する（ステップＳ５）。そして、ステップＳ３へ戻って、以後ステップＳ３以降の繰り返しの動作となる。 When the current brine concentration φ is equal to or greater than the initial brine concentration φ ₀ (step S4; YES), the fluid flow control valve 11 to be cooled, the first refrigerant flow control valve 12, and the second refrigerant flow control. The opening degree of the valve 13 is maintained as it is. On the other hand, when the current brine concentration φ is smaller than the initial brine concentration φ ₀ (step S4; NO), the brine concentration has decreased, so the fluid flow control valve 11 to be cooled and the first refrigerant flow control valve 12. The opening degree is changed so as to increase the opening degree of the second refrigerant flow control valve 13 (step S5). Then, the process returns to step S3, and thereafter, the operation is repeated after step S3.

このように各流量制御弁の開度を大きくすることでバイパス流量が増加し、冷媒と被冷却流体の熱交換量が増大する。これにより、第２の熱交換器９ではブライン中に含まれる水分の蒸発量を増大させることができるため、ブラインが濃縮されてブライン濃度が高くなる。 Thus, by increasing the opening degree of each flow control valve, the bypass flow rate increases, and the amount of heat exchange between the refrigerant and the fluid to be cooled increases. Thereby, in the 2nd heat exchanger 9, since the evaporation amount of the water | moisture content contained in a brine can be increased, a brine is concentrated and a brine concentration becomes high.

また、第３の熱交換器１０ではブラインの冷却量が増大するため、バイパス被冷却流体流路Ｄから主被冷却流体流路Ｃに戻るブラインの温度が低くなる。これにより、主被冷却流体流路Ｃに合流する被冷却流体の温度が低くなり、蒸発器４でブラインを冷却する際の冷却負荷が軽減される。 Further, in the third heat exchanger 10, since the cooling amount of the brine is increased, the temperature of the brine returning from the bypass cooled fluid channel D to the main cooled fluid channel C is lowered. Thereby, the temperature of the to-be-cooled fluid which joins the main to-be-cooled fluid flow path C becomes low, and the cooling load when cooling the brine by the evaporator 4 is reduced.

このように冷媒や被冷却流体のバイパス流路にバイパス流量制御弁を設置して、各流量制御弁の開度を必要に応じて制御することで、ブライン濃度が低下していない場合等の冷媒や被冷却流体の不必要な熱交換を回避することができ、熱の有効利用をすることができる。 In this way, the bypass flow control valve is installed in the bypass flow path of the refrigerant and the fluid to be cooled, and the opening degree of each flow control valve is controlled as necessary, so that the refrigerant in the case where the brine concentration is not lowered, etc. And unnecessary heat exchange of the fluid to be cooled can be avoided, and heat can be used effectively.

なお、ここでは、被冷却流体流量制御弁１１、第１の冷媒流量制御弁１２、第２の冷媒流量制御弁１３の３つの流量制御弁の初期開度を全閉開度とした場合について説明したが、別の動作方法として、被冷却流体流量制御弁１１の初期開度は全閉開度とし、第１の冷媒流量制御弁１２、第２の冷媒流量制御弁１３の３つの流量制御弁の初期開度は全開開度としてもよい。その場合は、図３のステップＳ５における開度変更は被冷却流体流量制御弁１１のみ行うこととする。このように被冷却流体流量制御弁１１のみ開度変更動作を行うことで、バイパス被冷却流体流路Ｄの被冷却流体と第１のバイパス冷媒流路Ｅ及び第２のバイパス冷媒流路Ｆの冷媒との熱交換量を制御することができる。 Here, a case where the initial opening degree of the three flow rate control valves of the cooled fluid flow rate control valve 11, the first refrigerant flow rate control valve 12, and the second refrigerant flow rate control valve 13 is set as a fully closed opening degree will be described. However, as another operation method, the initial opening degree of the fluid flow control valve 11 to be cooled is a fully closed opening degree, and the three flow rate control valves of the first refrigerant flow rate control valve 12 and the second refrigerant flow rate control valve 13 are set. The initial opening may be a fully opened opening. In that case, the opening degree change in step S5 in FIG. 3 is performed only for the cooled fluid flow rate control valve 11. Thus, by performing the opening degree changing operation only for the cooled fluid flow rate control valve 11, the cooled fluid in the bypass cooled fluid channel D, the first bypass refrigerant channel E, and the second bypass refrigerant channel F are changed. The amount of heat exchange with the refrigerant can be controlled.

《冷却装置１０００の奏する作用効果》
冷却装置１０００は、被冷却流体を濃縮することにより、空気中の水分混入による被冷却流体の添加物含有濃度の低下を防止することができる。これにより、冷却装置１０００によれば、濃度低下に起因する熱交換器（蒸発器４）内での被冷却流体の凍結を防止することが可能となり信頼性が向上する。 << Function and effect of cooling device 1000 >>
The cooling apparatus 1000 can prevent the additive content concentration of the fluid to be cooled from being reduced due to the mixing of moisture in the air by concentrating the fluid to be cooled. Thereby, according to the cooling apparatus 1000, it becomes possible to prevent the to-be-cooled fluid from freezing in the heat exchanger (evaporator 4) due to a decrease in concentration, and reliability is improved.

また、冷却装置１０００によれば、被冷却流体中に混入した水分の蒸発に冷媒回路の排熱を利用するため、ヒータや膜分離モジュール等の追加デバイスを不要とし、安価に被冷却流体の加熱濃縮をすることができる。 Further, according to the cooling device 1000, since the exhaust heat of the refrigerant circuit is used for the evaporation of moisture mixed in the fluid to be cooled, no additional device such as a heater or a membrane separation module is required, and the fluid to be cooled can be heated at a low cost. It can be concentrated.

さらに、冷却装置１０００によれば、被冷却流体中の水分を蒸発させるために加熱された被冷却流体を低温の中間圧冷媒により冷却して戻すことで、被冷却流体に対する冷却負荷を軽減することができ、高効率なものとなる。 Furthermore, according to the cooling device 1000, the cooling fluid heated to evaporate the water in the cooled fluid is cooled and returned by the low-temperature intermediate pressure refrigerant, thereby reducing the cooling load on the cooled fluid. Can be made highly efficient.

またさらに、冷却装置１０００は、冷媒や被冷却流体のバイパス流路にバイパス流量制御弁を設置して、各流量制御弁の開度を必要に応じて制御するようにしている。そのため、冷却装置１０００によれば、冷媒と被冷却流体との熱交換を制御して、被冷却流体の添加物含有濃度が低下していない場合等の冷媒や被冷却流体の不必要な熱交換を回避することができ、熱の有効利用をすることができる。 Furthermore, the cooling device 1000 is provided with a bypass flow rate control valve in the bypass flow path of the refrigerant or the fluid to be cooled, and controls the opening degree of each flow rate control valve as necessary. Therefore, according to the cooling device 1000, heat exchange between the refrigerant and the fluid to be cooled is controlled, and unnecessary heat exchange between the refrigerant and the fluid to be cooled is performed when the additive-containing concentration of the fluid to be cooled is not reduced. Can be avoided, and heat can be used effectively.

《冷却装置の変形例》
なお、本実施の形態では熱源機１００と室内機２００とは配管接続部において適宜分離することが可能な構成となっているので、熱源機１００と同様に被冷却流体を冷却して供給する役割を成すものであれば、冷媒回路構成が異なるものを図１に示した熱源機１００の代わりに室内機２００に接続してもよい。《Cooling device modification》
In the present embodiment, since the heat source unit 100 and the indoor unit 200 can be appropriately separated at the pipe connection portion, the role of cooling and supplying the fluid to be cooled similarly to the heat source unit 100 1 may be connected to the indoor unit 200 instead of the heat source unit 100 shown in FIG.

また、図１では熱源機１００、室内機２００の接続台数は各１台であるが、熱源機１００の冷却能力や冷却負荷に応じて、熱源機１００もしくは室内機２００を複数台にするなど接続台数を個別に変更してもよく、台数を限定するものではない。 In FIG. 1, the number of connected heat source units 100 and indoor units 200 is one each. However, depending on the cooling capacity and cooling load of the heat source unit 100, the number of connected heat source units 100 or indoor units 200 is increased. The number may be changed individually, and the number is not limited.

さらに、熱源機１００と室内機２００とで冷却装置１０００を構成するとしたが、これに限定されず、熱源機１００の構成部分と室内機２００の構成部分とを一体化して冷却装置１０００を構成してもよい。 Furthermore, the cooling device 1000 is configured by the heat source unit 100 and the indoor unit 200. However, the present invention is not limited to this, and the cooling unit 1000 is configured by integrating the components of the heat source unit 100 and the components of the indoor unit 200. May be.

本発明の内容を各実施の形態において説明したが、例えば、冷媒の流路構成（配管接続）、被冷却流体の流路構成、圧縮機・熱交換器・減圧装置等の冷媒回路要素の構成、等の内容は、各実施の形態で説明した内容に限定されるものではなく、本発明の技術の範囲内で適宜変更が可能である。 The contents of the present invention have been described in the respective embodiments. For example, the refrigerant flow path configuration (piping connection), the flow path configuration of the fluid to be cooled, the configuration of the refrigerant circuit elements such as the compressor, the heat exchanger, and the pressure reducing device The contents such as, and the like are not limited to the contents described in each embodiment, and can be appropriately changed within the scope of the technology of the present invention.

１圧縮機、２凝縮器、３第１の減圧装置、４蒸発器、５第２の減圧装置、６内部熱交換器、７被冷却流体送出装置、８第１の熱交換器、８ａファン、９第２の熱交換器、１０第３の熱交換器、１１被冷却流体流量制御弁、１２第１の冷媒流量制御弁、１３第２の冷媒流量制御弁、１４逆止弁、１４ａ逆止弁、１４ｂ逆止弁、１４ｃ逆止弁、２０計測制御部、３０被冷却流体濃度検出手段、１００熱源機、２００室内機、１０００冷却装置、Ａ主冷媒回路、Ｂインジェクション回路、Ｃ主被冷却流体流路、Ｄバイパス被冷却流体流路、Ｅ第１のバイパス冷媒流路、Ｆ第２のバイパス冷媒流路。 DESCRIPTION OF SYMBOLS 1 Compressor, 2 Condenser, 3 1st decompression device, 4 Evaporator, 5 2nd decompression device, 6 Internal heat exchanger, 7 Cooled fluid delivery apparatus, 8 1st heat exchanger, 8a fan, 9 Second heat exchanger 10 Third heat exchanger 11 Cooled fluid flow control valve 12 First refrigerant flow control valve 13 Second refrigerant flow control valve 14 Check valve 14a Check Valve, 14b Check valve, 14c Check valve, 20 Measurement control unit, 30 Cooled fluid concentration detection means, 100 Heat source unit, 200 Indoor unit, 1000 Cooling device, A main refrigerant circuit, B injection circuit, C Main cooled Fluid channel, D bypass cooled fluid channel, E first bypass refrigerant channel, F second bypass refrigerant channel.

Claims

A compressor that compresses the refrigerant; a condenser that condenses the refrigerant compressed by the compressor; a first decompressor that decompresses the refrigerant condensed by the condenser; and a refrigerant that is decompressed by the first decompressor. A main refrigerant circuit configured by sequentially connecting evaporators to be evaporated; and
An injection circuit connecting between the condenser and the first pressure reducing device and a compression chamber in the compressor;
A second pressure reducing device provided in the injection circuit;
An internal heat exchanger that exchanges heat between the refrigerant decompressed by the second decompression device and the refrigerant between the condenser and the first decompression device;
A cooled fluid delivery device for delivering to the evaporator a cooled fluid that exchanges heat with the refrigerant in the evaporator;
A first heat exchanger for exchanging heat between the cooled fluid and ambient air;
A main cooled fluid flow path configured to be connected to the evaporator, the cooled fluid delivery device, and the first heat exchanger;
The first heat exchanger of the main cooled fluid flow path is branched from the first heat exchanger side between the first heat exchanger and the evaporator of the main cooled fluid flow path. A bypass to-be-cooled fluid flow path connected to the evaporator side between the evaporator and the evaporator;
A second heat exchanger for exchanging heat between the refrigerant between the compressor and the condenser and the cooled fluid flowing through the bypass cooled fluid channel;
A third heat exchanger that exchanges heat between the refrigerant flowing through the injection circuit and the cooled fluid that has been heat-exchanged by the second heat exchanger in the bypass cooled fluid flow path. And cooling device.

A cooled fluid flow rate control valve for controlling a flow rate of the cooled fluid flowing from the main cooled fluid channel into the bypass cooled fluid channel is provided at a branch inlet of the bypass cooled fluid channel. The cooling device according to claim 1.

A first bypass refrigerant flow path branched from the compressor side of a pipe connecting the compressor and the condenser and connected to the condenser side of the pipe;
A first refrigerant flow control valve that is provided at a branch inlet of the first bypass refrigerant flow path and controls the flow rate of the refrigerant flowing into the first bypass refrigerant flow path,
The second heat exchanger is
The refrigerant between the compressor and the condenser in the first bypass refrigerant flow path and the cooled fluid flowing in the bypass cooled fluid flow path are connected to a position where heat exchange is possible. The cooling device according to claim 1 or 2.

A second bypass refrigerant flow path branched from the internal heat exchanger side of the injection circuit and connected to the compressor side of the injection circuit;
A second refrigerant flow control valve provided at a branch inlet of the second bypass refrigerant flow path for controlling the flow rate of the refrigerant flowing into the second bypass refrigerant flow path,
The third heat exchanger is
The refrigerant flowing through the injection circuit of the second bypass refrigerant flow path and the cooled fluid exchanged by the second heat exchanger in the bypass cooled fluid flow path are connected to a position where heat exchange is possible. The cooling device according to any one of claims 1 to 3, wherein the cooling device is provided.

A cooled fluid concentration detecting means provided in the main cooled fluid flow path for detecting the concentration of the cooled fluid;
A measurement control unit that determines the amount of fluid to be cooled to flow to the bypass fluid-cooled flow path based on the detected value of the fluid-cooled fluid concentration detected by the fluid-cooled fluid concentration detection means. The cooling device according to any one of claims 1 to 4.

The measurement control unit
The fluid to be cooled that flows into the bypass cooled fluid flow path by controlling the opening degree of at least one of the fluid flow rate control valve, the first refrigerant flow rate control valve, and the second refrigerant flow rate control valve. Determining the amount of
The cooling device according to claim 5.