JP2014020915A5 - - Google Patents
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- Publication number
- JP2014020915A5 JP2014020915A5 JP2012159702A JP2012159702A JP2014020915A5 JP 2014020915 A5 JP2014020915 A5 JP 2014020915A5 JP 2012159702 A JP2012159702 A JP 2012159702A JP 2012159702 A JP2012159702 A JP 2012159702A JP 2014020915 A5 JP2014020915 A5 JP 2014020915A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode substrate
- pressure
- conductive rubber
- sensitive sensor
- rubber member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims 2
- 239000011247 coating layer Substances 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
Description
本発明は、電極基板と導電性ゴム部材とが、近接非接触状態で対向配置されてなる感圧センサにおいて、前記電極基板および前記導電性ゴム部材は、少なくとも固定剤層が設けられた可撓性フィルムからなる絶縁性被覆部材によって周回被覆されていると共に、前記固定剤層を介して前記絶縁性被覆部材に固定されており、前記近接非接触状態の前記電極基板と前記導電性ゴム部材との隙間量が１０μｍ以上、３００μｍ以下であり、前記可撓性フィルムは、ヤング率が２ＧＰａ以上、１０ＧＰａ以下であって、厚みが１０μｍ以上、６０μｍ以下であることを特徴とする感圧センサである。 The present invention provides a pressure-sensitive sensor in which an electrode substrate and a conductive rubber member are arranged to face each other in a close and non-contact state, and the electrode substrate and the conductive rubber member are provided with at least a fixing agent layer. And is covered with an insulating coating member made of a conductive film and fixed to the insulating coating member via the fixing agent layer, and the electrode substrate and the conductive rubber member in the proximity non-contact state, The flexible film has a Young's modulus of 2 GPa or more and 10 GPa or less and a thickness of 10 μm or more and 60 μm or less. .
Claims (3)
The pressure-sensitive sensor according to claim 1, wherein at least one conductive coating layer is formed on a surface of the conductive rubber member facing the electrode substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012159702A JP5945469B2 (en) | 2012-07-18 | 2012-07-18 | Pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012159702A JP5945469B2 (en) | 2012-07-18 | 2012-07-18 | Pressure sensor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014020915A JP2014020915A (en) | 2014-02-03 |
| JP2014020915A5 true JP2014020915A5 (en) | 2015-06-18 |
| JP5945469B2 JP5945469B2 (en) | 2016-07-05 |
Family
ID=50195958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012159702A Expired - Fee Related JP5945469B2 (en) | 2012-07-18 | 2012-07-18 | Pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5945469B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6795097B2 (en) * | 2017-07-26 | 2020-12-02 | 株式会社村田製作所 | Press sensor and electronic device |
| KR102009878B1 (en) * | 2017-11-16 | 2019-10-21 | 이경환 | Manufacture device of parts for pressure sensor and pressure sensor |
| US11460362B2 (en) * | 2019-07-23 | 2022-10-04 | Toyota Motor Engineering & Manufacturing North America, Inc. | Flexible printed pressure transducer with sensor diffusion stack materials and methods incorporating the same |
| WO2021075356A1 (en) * | 2019-10-15 | 2021-04-22 | パナソニックＩｐマネジメント株式会社 | Load sensor |
| JP2023031809A (en) * | 2021-08-25 | 2023-03-09 | 株式会社ブリヂストン | Conductive rubber composition for sensing |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10321075A (en) * | 1997-05-15 | 1998-12-04 | Teikoku Tsushin Kogyo Co Ltd | Membrane-type switch |
| JP2001067971A (en) * | 1999-08-25 | 2001-03-16 | Polymatech Co Ltd | Pressure sensitive conductive sensor |
| JP2002350250A (en) * | 2001-03-19 | 2002-12-04 | Auto Network Gijutsu Kenkyusho:Kk | Sensor unit, sensor mounting bag body and sensor mounting method |
| DE10218613A1 (en) * | 2002-04-25 | 2003-12-04 | Wet Automotive Systems Ag | Mechanical power detection apparatus has detection plate including measurement layers whose characteristics change, if power that is to be detected acts on measurement layers |
-
2012
- 2012-07-18 JP JP2012159702A patent/JP5945469B2/en not_active Expired - Fee Related
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