JP2014019850A - Composition for ingot slice board and ingot slice board using the same - Google Patents
Composition for ingot slice board and ingot slice board using the same Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims abstract description 20
- 239000011256 inorganic filler Substances 0.000 claims abstract description 16
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 16
- 238000000465 moulding Methods 0.000 claims abstract description 15
- 229920006337 unsaturated polyester resin Polymers 0.000 claims abstract description 11
- 229920005992 thermoplastic resin Polymers 0.000 claims abstract description 9
- 239000003365 glass fiber Substances 0.000 claims description 9
- 238000002156 mixing Methods 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000012778 molding material Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 239000002562 thickening agent Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- 239000004412 Bulk moulding compound Substances 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000003677 Sheet moulding compound Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 150000007519 polyprotic acids Polymers 0.000 description 2
- 229920002689 polyvinyl acetate Polymers 0.000 description 2
- 239000011118 polyvinyl acetate Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 150000001541 aziridines Chemical class 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000010730 cutting oil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 150000004978 peroxycarbonates Chemical class 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000012254 powdered material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
Abstract
Description
本発明は、ブロック（インゴット）をピアノ線を用いてスライスしてシリコンウエハーを製造するのに用いるインゴットスライス台に関し、より詳しくは、同スライス台を成形するための樹脂組成物に関する。 The present invention relates to an ingot slice table used for manufacturing a silicon wafer by slicing a block (ingot) with a piano wire, and more particularly to a resin composition for molding the slice table.
一般に、インゴットブロックを接着剤によりシリコンスライス台上に固定し、インゴットブロックに切削油および切削粉を施しながら、ピアノ線により所望の厚さにインゴットブロックをスライスし、多数のシリコンウエハーを得る。 In general, an ingot block is fixed on a silicon slicing table with an adhesive, and the ingot block is sliced to a desired thickness with a piano wire while applying cutting oil and cutting powder to the ingot block to obtain a large number of silicon wafers.
近年、半導体デバイスの高集積化に伴い要求チップ面積は大きくなり、そのためそのシリコンウエハーも大口径化してきている。シリコンウエハーの大口径化に伴い、インゴットブロックも当然のことながら大型化し、これを載置・固定するシリコンスライス台にも一層の強度および大型化が要求される。 In recent years, as the integration of semiconductor devices is increased, the required chip area is increased, and accordingly, the diameter of silicon wafers is increasing. As the silicon wafer diameter increases, the ingot block naturally increases in size, and a silicon slice base on which the ingot block is placed and fixed is required to have higher strength and size.
このような実情から、低コストで容易に製造することができ、インゴットブロックの大型化に対応可能な強度を有し、またインゴットブロックとの接着性にも優れたシリコンスライス台を成形することができる成形材料として、不飽和ポリエステル樹脂に対して特定の無機充填材を４０〜６０重量％配合してなるシリコンスライス台用の成形材料が提案されている（特許文献１）。 From this situation, it is possible to form a silicon slicing base that can be easily manufactured at low cost, has strength that can cope with the increase in size of the ingot block, and has excellent adhesion to the ingot block. As a molding material that can be formed, there has been proposed a molding material for a silicon slicing table obtained by blending 40 to 60% by weight of a specific inorganic filler with an unsaturated polyester resin (Patent Document 1).
不飽和ポリエステル樹脂の成形法としては、ＦＲＰ型に先ずゲルコートをスプレイ塗装して硬化加熱炉で一旦硬化させた後、熱硬化性樹脂と充填材等からなるコンパウンドをその型内に注入して再度硬化炉で硬化させる注型法、型内に熱硬化性樹脂と充填材等とからなるコンパウンドを注入して金型温度を上げて硬化させる注型法および予め熱硬化性樹脂、充填材等からなるコンパウンドを増粘させてＢＭＣ（バルクモールディングコンパウンド），ＳＭＣ（シートモールディングコンパウンド）とし、これを金型内で圧力をかけて加熱硬化させる方法に大別される。 As a molding method of the unsaturated polyester resin, first, a gel coat is spray-coated on the FRP mold, and once cured in a curing heating furnace, a compound composed of a thermosetting resin and a filler is injected into the mold and then again. From a casting method for curing in a curing furnace, a casting method for injecting a compound consisting of a thermosetting resin and a filler into the mold and curing by raising the mold temperature, and a thermosetting resin, a filler, etc. The compound is thickened to obtain BMC (bulk molding compound) and SMC (sheet molding compound), which are roughly classified into a method of heating and curing by applying pressure in a mold.
特許文献１に記載の成形材料は、上記課題を克服する点では評価できるが、注型法には適しているものの圧力をかけて加熱成形する方法、たとえば圧縮成形や射出成形等では成形しにくいという難点がある。 Although the molding material described in Patent Document 1 can be evaluated in terms of overcoming the above-mentioned problems, it is suitable for the casting method but is difficult to mold by a method of heat molding by applying pressure, for example, compression molding or injection molding. There is a difficulty.
本発明はこのような実情から圧力をかけて加熱成形する方法にも支障なく適用できるインゴットスライス台用組成物を提供することを課題とする。 This invention makes it a subject to provide the composition for ingot slice stands which can be applied to the method of heat-molding under pressure from such a situation without trouble.
本発明は、不飽和ポリエステル樹脂１００重量部に対し熱可塑性樹脂を１〜３０重量部添加したものに、無機充填材を全体量に対し６１〜８５重量％配合してなることを特徴とするインゴットスライス台用組成物、および同組成物を成形してなることを特徴とするインゴットスライス台を提供する。 The present invention is an ingot obtained by adding 61 to 85% by weight of an inorganic filler to the total amount in which 1 to 30 parts by weight of a thermoplastic resin is added to 100 parts by weight of an unsaturated polyester resin. There are provided a composition for a slicing table and an ingot slicing table characterized by molding the composition.
本発明によるインゴットスライス台用組成物は、さらにガラス繊維を、無機充填材の一部と置き換え、全体量に対し全体量に対し５〜３０重量％含むことが好ましい。 In the composition for an ingot slice table according to the present invention, it is preferable that glass fiber is further replaced with a part of the inorganic filler, and 5 to 30% by weight based on the total amount is included.
本発明で用いられる不飽和ポリエステル樹脂は、特に制限はなく、α，β−不飽和二塩基酸、多価アルコール、飽和多塩基酸等を重縮合反応させ、これをビニルモノマーに溶解したものである。α，β−不飽和二塩基酸はマレイン酸、フマル酸などであってよく、多価アルコールは、エチレングリコール、プロピレングリコール等の二価アルコールなどであってよく、飽和多塩基酸はフタル酸、イソフタル酸、テレフタル酸、無水フタル酸などであってよく、ビニルモノマーはスチレン、クロルスチレン、ジビニルベンゼン等であってよい。 The unsaturated polyester resin used in the present invention is not particularly limited, and is obtained by polycondensation reaction of α, β-unsaturated dibasic acid, polyhydric alcohol, saturated polybasic acid, etc., and dissolving this in a vinyl monomer. is there. The α, β-unsaturated dibasic acid may be maleic acid, fumaric acid and the like, the polyhydric alcohol may be a dihydric alcohol such as ethylene glycol and propylene glycol, and the saturated polybasic acid is phthalic acid, It may be isophthalic acid, terephthalic acid, phthalic anhydride, etc., and the vinyl monomer may be styrene, chlorostyrene, divinylbenzene or the like.
本発明で用いられる熱可塑性樹脂は、具体的にはポリ酢酸ビニル、ポリエチレン、ポリスチレン、ポリブタジエン、ポリメチルメタクリレート、ポリカプロラクトン、塩化ビニル／酢酸ビニル共重合体、飽和ポリエステル樹脂、飽和ポリエステル／ポリ塩化ビニル混合物及びメタクリレート単独重合体又は共重合体、ポリ酢酸ビニル系樹脂などが例示される。 Specifically, the thermoplastic resin used in the present invention is polyvinyl acetate, polyethylene, polystyrene, polybutadiene, polymethyl methacrylate, polycaprolactone, vinyl chloride / vinyl acetate copolymer, saturated polyester resin, saturated polyester / polyvinyl chloride. Examples thereof include a mixture, a methacrylate homopolymer or copolymer, and a polyvinyl acetate resin.
不飽和ポリエステル樹脂１００重量部に対し熱可塑性樹脂が１重量部未満であると低収縮作用が充分発揮されず、逆に不飽和ポリエステル樹脂１００重量部に対し熱可塑性樹脂が３０重量部を超えると、成形面の平滑性が損なわれやすくなってくる。したがって、熱可塑性樹脂の添加量は不飽和ポリエステル樹脂１００重量部に対し１〜３０重量部、好ましくは３〜２５重量部である。 When the thermoplastic resin is less than 1 part by weight with respect to 100 parts by weight of the unsaturated polyester resin, the low shrinkage effect is not sufficiently exhibited, and conversely, when the thermoplastic resin exceeds 30 parts by weight with respect to 100 parts by weight of the unsaturated polyester resin. The smoothness of the molding surface tends to be impaired. Therefore, the addition amount of the thermoplastic resin is 1 to 30 parts by weight, preferably 3 to 25 parts by weight with respect to 100 parts by weight of the unsaturated polyester resin.
本発明で用いられる無機充填材は、たとえば、ガラス粉、硅石粉、炭酸カルシウム、水酸化アルミニウム、硫酸バリウム、炭酸バリウム等の無機充填材や顔料、ミルドファイバー等の粉状物である。 The inorganic filler used in the present invention is, for example, an inorganic filler such as glass powder, meteorite powder, calcium carbonate, aluminum hydroxide, barium sulfate, or barium carbonate, or a powdered material such as a pigment or milled fiber.
無機充填材の配合量は、全体量に対し、６１〜８５重量％である。無機充填材の配合量が多くなるに従って、組成物が混練しにくくなって作業性が低下し、加えて、成形面のコーナー部にヒケ（光沢むら）やクラックが発生し易くなるが、これらは熱可塑性樹脂を配合することにより解消される。無機充填材の配合量の上限は８５重量％である。無機充填材の配合量が６１重量％未満であると、粘度が低下し注型には好都合であるが、成形されたインゴットスライス台の線膨張係数が大きくなってくる傾向にある。無機充填材の配合量の好ましい範囲は６５〜８０重量％である。 The compounding quantity of an inorganic filler is 61 to 85 weight% with respect to the whole quantity. As the blending amount of the inorganic filler increases, the composition becomes difficult to knead and the workability decreases, and in addition, sink marks (uneven gloss) and cracks are likely to occur at the corner of the molding surface. The problem is solved by adding a thermoplastic resin. The upper limit of the amount of the inorganic filler is 85% by weight. When the blending amount of the inorganic filler is less than 61% by weight, the viscosity is lowered and it is convenient for casting, but the linear expansion coefficient of the molded ingot slice base tends to increase. A preferable range of the blending amount of the inorganic filler is 65 to 80% by weight.
無機充填剤の一部をガラス繊維に置き換えると、その置換量が多くなるに従って、成形されたインゴットスライス台の線膨張係数が小さくなる上に強度が増す。無機充填剤とガラス繊維の合計中のガラス繊維の割合が大きくなりすぎると組成物が混練しにくくなって作業性が悪くなるので、ガラス繊維の割合は好ましくは５〜３０重量％、より好ましくは７〜２０重量％である。ガラス繊維の他、ビニロン繊維、カーボン等の繊維も使用することができる。 When a part of the inorganic filler is replaced with glass fiber, the linear expansion coefficient of the molded ingot slice base decreases and the strength increases as the replacement amount increases. If the ratio of the glass fiber in the total of the inorganic filler and the glass fiber becomes too large, the composition becomes difficult to knead and the workability deteriorates, so the ratio of the glass fiber is preferably 5 to 30% by weight, more preferably 7 to 20% by weight. In addition to glass fibers, fibers such as vinylon fibers and carbon can also be used.
ハンドリングしやすい組成物の粘度を得るために、増粘剤も使用可能である。使用できる増粘剤は二価金属の酸化部物、ニ価金属の水酸化物、ジイソシアネートおよびアジリジン等である
上記組成物のプレス成形は一般的な成形条件下で常法に従って行い得る。
Thickeners can also be used to obtain a composition viscosity that is easy to handle. Thickeners that can be used are divalent metal oxides, divalent metal hydroxides, diisocyanates, aziridines and the like. Press molding of the above composition can be carried out in accordance with conventional methods under general molding conditions.
本発明の樹脂組成物を硬化させる硬化剤は、パーオキシエステル類、パーオキシケタール類、ジアルキルパーオキサイド類、ハイドロパーオキサイド類およびパーオキシカーボネート類等の有機過酸化物が単独または複数の組み合わせで使用される。 Curing agents for curing the resin composition of the present invention may be organic peroxides such as peroxyesters, peroxyketals, dialkyl peroxides, hydroperoxides, and peroxycarbonates, alone or in combination. used.
本発明による組成物はさらに離型剤、消泡剤、顔料、紫外線吸収剤等の添加剤を含んでいてもよい。 The composition according to the present invention may further contain additives such as a release agent, an antifoaming agent, a pigment, and an ultraviolet absorber.
請求項１の組成物を用いて、線膨張係数が小さいインゴットスライス台をプレス成形で支障なく得ることができる。請求項２の組成物を用いて、線膨張係数が小さい上に強度が大きいインゴットスライス台をプレス成形で支障なく得ることができる。 By using the composition of claim 1, an ingot slice base having a small linear expansion coefficient can be obtained without problems by press molding. By using the composition of claim 2, an ingot slice base having a small linear expansion coefficient and a high strength can be obtained without any trouble by press molding.
次に本発明を下記の実験結果に基づいて具体的に説明する。 Next, the present invention will be specifically described based on the following experimental results.
実施例
不飽和ポリエステル樹脂に、熱可塑性樹脂、無機充填剤、ガラス線維、硬化剤、増粘剤、離型剤をそれぞれ表１に示す割合で配合し、成形材料をいくつか作製した。
Example A thermoplastic resin, an inorganic filler, glass fiber, a curing agent, a thickener, and a release agent were blended with the unsaturated polyester resin in the proportions shown in Table 1 to prepare several molding materials.
これらの成形材料を下記の条件でプレス成形し、インゴットスライス台を得た。これらの成形品について外観を観察し線膨張係数を測定した。これらの結果を表１に併せて示す。
不飽和ポリエステル樹脂： 「リゴラックＭ−５８８」（昭和電工株製）
低収縮剤： 「リゴラックＭ−５５８５」（昭和電工社製）
硬化剤： 「カヤブチルＢ」（化薬アクゾ社製）
増粘剤： 「キョ−ワマグ＃４０」（協和化学工業製）
離型剤： 「エフコ・ケムＺＮＳ」（ADEKA社製）
水酸化アルミニウム： 「CW-325LV」（住友化学社製）
ガラス繊維： 「ＣＳ３Ｅ−２２７Ｓ」（日東紡績社製）
上記測定結果から明らかなように、本発明による組成物はプレス成形にも支障なく適用でき、コーナー部のヒケおよびクラックがなくかつ線膨張係数が小さいインゴットスライス台を得ることができる。
Unsaturated polyester resin: “Rigolac M-588” (manufactured by Showa Denko KK)
Low shrinkage agent: “Rigolac M-5585” (manufactured by Showa Denko)
Hardener: “Kayabutyl B” (manufactured by Kayaku Akzo)
Thickener: “Kyowamag # 40” (Kyowa Chemical Industry)
Mold release agent: “Efco Chem ZNS” (made by ADEKA)
Aluminum hydroxide: “CW-325LV” (manufactured by Sumitomo Chemical)
Glass fiber: “CS3E-227S” (manufactured by Nittobo)
As is clear from the above measurement results, the composition according to the present invention can be applied to press molding without any trouble, and an ingot slice base having no sink marks and cracks at the corners and having a small linear expansion coefficient can be obtained.
Claims (3)
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2018104585A (en) * | 2016-12-27 | 2018-07-05 | 昭和電工株式会社 | Ingot slice table, method for manufacturing ingot slice table and resin composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2018104585A (en) * | 2016-12-27 | 2018-07-05 | 昭和電工株式会社 | Ingot slice table, method for manufacturing ingot slice table and resin composition |
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