JP2014018967A - Device and method for laminating sheet substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamination device and a method therefor, capable of stacking and laminating a plurality of sheet substrates substantially continuously and accurately without occurrence of problems of increase of running cost and dirt adhesion onto a product.SOLUTION: Concerning a device and a method for laminating sheet substrates, the device for stacking the sheet substrates and laminating the stacked substrates through heating roll press means has: upper and lower protection films having a contact with the upper surface and the lower surface of the substrates stacked at least on the position of the heating roll press means, and passing through the heating roll press means together with the stacked substrates; and belt means provided on the rear surface side of at least one protection film, and running so as to pass through the heating roll press means together with the protection films.

Description

  The present invention relates to an apparatus and a method for laminating and laminating a plurality of single-wafer substrates that enable efficient and continuous lamination and bonding.

  As means for laminating and laminating a plurality of single-wafer substrates with their positions aligned, means by a flat plate heating press is known, and it is conceivable to use means by a heating roll press. Among these, by means of a flat plate heating press, for example, as shown in FIG. 4, for example, carbon sheets 102 are laminated on both sides of an electrolyte membrane substrate 101 as a single-wafer substrate via a coating layer 103, and these layers are laminated. The sheet substrate is heated and pressed by a flat plate heating press 105 through upper and lower protective films 104 and bonded. However, such a flat plate heating press is not productive because it is easy to cause a gap 106 when laminating the single-wafer base material, and air is easily caught, and it is difficult to continuously laminate and bond them together. There is a problem.

  On the other hand, when a means using a heated roll press is used, since continuous lamination and bonding are possible, the problem of productivity can be improved. For example, as shown in FIG. 5, the lower protective film 111 that functions as the lower carrier sheet is unwound from the unwinding device 112 and wound by the winding device 113, and the upper protection that functions as the upper carrier sheet. The film 114 is unwound from the unwinding device 115 and taken up by the winding device 116. For example, the single-wafer base material 118 aligned and laminated on the lower protective film 111 by the laminating means 117 is stacked on the upper and lower protective films 111, A method is conceivable in which the sheet is sandwiched between 114 and conveyed through a heated roll press means 119 for bonding. However, in this method, the protective means 111 and 114 are the only means for transporting the laminated single-wafer base material 118. Therefore, depending on the pressurization and heating conditions in the heating roll press means 119, the protective films 111 and 114 have high pressure resistance and heat resistance. Therefore, the thickness of the protective films 111 and 114 must be increased. When the protective film becomes thicker, its unwinding roll diameter and take-up roll diameter become larger, the frequency of replacement increases, and the productivity decreases, and the protective film is usually disposable, so it is thick. If the protective film is used, the running cost is increased.

  Furthermore, a method of replacing at least one of the protective films 111 and 114 as described above with an endless belt having high heat resistance (for example, a stainless steel endless belt) is also conceivable. For example, as shown in FIG. 6, an endless belt 121 is disposed on the lower side, and for example, a single-wafer base material 123 that is aligned and laminated on the endless belt 121 by a laminating unit 122 is combined with the endless belt 121 and the upper protective film 124. It is possible to consider a method in which the paper is sandwiched between and conveyed through a roll heating press means 125 and bonded together. However, in this method, the laminated single-wafer base material 123 is directly brought into contact with the endless belt 121, and the endless belt 121 is circulated. Therefore, if any adhering matter or dirt occurs on the surface of the endless belt 121, the adhering matter or dirt The problem of redeposition to the workpiece (laminated sheet-fed base material 123) to be processed next occurs, which may affect the product.

  In relation to the background art as described above, although it is not the lamination and lamination of the single-wafer base material that is the subject of the present invention, Patent Document 1 discloses a method in which a membrane base material is directly heated and pressed together with a reinforcing film between endless belts. Is disclosed. However, in this method, since the membrane substrate is directly heated and pressed by the endless belt, there remains a problem of adhesion of adhered matter and dirt to the product as described above.

  In Patent Document 2, a catalyst film cut out to a predetermined size is bonded onto a support sheet, and the catalyst layer on the catalyst film on the support sheet is thermocompression bonded to the polymer electrolyte membrane that is continuously conveyed. A method is disclosed. However, in this method, it is difficult to align and stack the single-wafer base materials.

  Further, Patent Document 3 discloses a method of joining a substrate having a heating unit and a cooling unit, which is composed of a supporting substrate on which a catalyst layer or the like is supported and a substrate to be transferred, by heating and pressing while running. Has been. However, this method makes it difficult to align the single-wafer substrates.

JP 2010-118237 A JP 2010-205676 A JP 2006-134611 A

  Therefore, in view of the current situation as described above, the object of the present invention is to laminate a plurality of single-wafer base materials substantially continuously and accurately, and to bond them together. An object of the present invention is to provide an apparatus and a method for laminating and laminating single-wafer substrates that can be realized without accompanying.

  In order to solve the above-mentioned problems, a laminating and laminating apparatus for sheet substrates according to the present invention is an apparatus for laminating sheet substrates, and laminating the laminated substrates through a heated roll press means, and at least the heating At the position of the roll press means, the upper and lower protective films that are in contact with the upper and lower surfaces of the laminated base material and pass through the heated roll press means together with the laminated base material, and the back side of at least one protective film Belt means that travels so as to pass through the heating roll press means together with the one protective film.

  In such a laminating and laminating apparatus for sheet substrates according to the present invention, a plurality of sheet substrates are aligned and laminated, and the laminated substrates are bonded to each other by passing through a heating roll press means. At the position of the heating roll press means, the laminated base material is passed in a state sandwiched between upper and lower protective films, but at the same time, it travels with a belt means provided on the back side of at least one of the protective films. That is, the laminated base material is passed through the heated roll press means in a state where the protective film and the belt means are used in combination. Since the single-wafer base material is laminated in a state of being aligned before reaching the heating roll press means, high-precision lamination can be easily performed. And since it is in the state laminated | stacked in order of the belt means from the heating roll side, the protective film, and the laminated base material in the position of a heating roll press means, a belt means does not contact the laminated base material directly. Even if deposits and dirt are generated on the belt means side, it is possible to avoid adversely affecting the product made of the single-wafer base material on which the laminate is laminated. In addition, since it is heated and roll-pressed via the belt means, it is not necessary to use a thick film for the protective film interposed between the belt means and the base material, and the unwinding roll diameter and the winding roll diameter of the protective film are eliminated. Problems such as being too large, frequency of replacement being increased, productivity being lowered, and an increase in running cost due to the use of a thick protective film are also solved. Furthermore, it is possible to align and laminate the base material on one protective film. The laminated base material is passed through the hot roll press means together with the protective film and belt means, enabling continuous hot roll press. Therefore, it is possible to perform substantially continuously from lamination to lamination of the single-wafer base materials.

  In the laminating and laminating apparatus for a single-wafer base material according to the present invention, it is preferable that the belt means is an endless belt means (endless belt means) that is circulated. As described above, since the influence on the product side from the belt means side is avoided, no problem occurs even if the belt means is circulated and repeatedly passed through the heating roll press means. The material of the belt means is not particularly limited. However, since the material is repeatedly passed through the heated roll press means, a material having high heat resistance and high durability is preferable. For example, a stainless steel belt is exemplified.

  Moreover, it is preferable that an unwinding means for unwinding the protective film at an upstream position in the traveling direction and a winding means for winding the protective film at the downstream side are provided for at least one of the upper and lower protective films. . Since the protective film is in direct contact with the single-wafer substrate, it is basically used in a disposable form. Therefore, by providing such unwinding means and winding means, productivity is improved.

  Moreover, it is preferable that the position alignment means of the laminated | stacked sheet | seat base materials is provided in the position before the said heating roll press means. As the alignment means, for example, means for detecting the position of the edge of the laminated base material with a camera can be used. The position for alignment is not particularly limited as long as it is a position before passing through the heating roll press means, and for example, a position on the protective film positioned on the upstream side of the heating roll press means can be exemplified. By performing such alignment, the stacking accuracy of the substrates, and thus the stacking and bonding accuracy of the substrates in the product after bonding are improved.

  Moreover, it is also possible to adopt a structure in which a wrinkle removing means for removing wrinkles of the protective film is provided at least at a position before passing through the heating roll press means with respect to at least one of the upper and lower protective films. . If such a wrinkle removing means is provided, even if wrinkles occur on the upstream side, it becomes possible to eliminate the wrinkles, and when the wrinkles remain, the wrinkles are stretched or deformed The possibility of occurrence of misalignment of the laminated base material due to the removal can be removed, and the realization of highly accurate lamination and bonding can be more reliably ensured. As the wrinkle removing means, for example, a well-known expander roll or crowning roll, or a widening roll that imparts a speed component toward the outside in the width direction to both side edge portions of the film can be applied.

  Moreover, in the lamination | stacking bonding apparatus of the single-wafer base material which concerns on this invention, the lower side protective film which contacts the lower surface of the said laminated base material takes the form comprised by the film for base material formation of the lowest layer. Is also possible. In the present invention, basically, a single-wafer substrate that has been cut into a predetermined size is laminated and pasted together. By adopting the above-described form, for example, a protective film is marked as an index of a predetermined size. Then, the protective film is used as a protective film that also serves as a film for forming a single-wafer base material, and after laminating and bonding the other single-wafer base materials, by cutting along the above-mentioned marking, the target laminated laminated sheet It is also possible to obtain a leaf-based product.

  Moreover, it is possible to take a form in which at least one layer of the laminated base materials is a dimensional instability base material. In the present invention, the material and form of the single-wafer base material to be laminated and bonded are not particularly limited, but there are cases in which it is required to laminate and bond the dimensional instability base materials that are relatively difficult to handle. For example, there are cases where lamination and bonding of an electrolyte membrane substrate as shown in FIG. 4 or a carbon sheet provided with a coating layer is required. Even in such a case, in the present invention, for example, high-precision lamination is possible on one protective film, and the laminated base material is sandwiched between upper and lower protective films, and at least Since one protective film can be roll-heated pressed as instructed by the belt means, processing is possible under the condition that the dimensions and shape of the base material are maintained in a predetermined state, and the target product form is easily and reliably performed. Can be obtained.

  Further, the field of application of the laminating and laminating apparatus for single-wafer substrates according to the present invention is not particularly limited, but the present invention is suitable when, for example, the above-mentioned laminated and bonded substrates are made of electrode members for fuel cells. is there. In this fuel cell electrode member, as shown in FIG. 4 described above, it is often required to laminate and laminate dimensionally unstable substrates, but the present invention is suitable for such applications. .

  The present invention relates to a step of laminating the single-wafer substrates by aligning the positions, sandwiching the laminated substrates with a protective film from above and below, and protecting them via belt means provided on the back side of at least one protective film A transporting process for transporting the film together with the film, a bonding process for heating and pressing the stacked base material to be transported through the upper and lower protective films, and a product removing process for peeling the upper and lower protective films from the stacked and bonded base materials. The present invention also provides a method for laminating and laminating single-wafer substrates, characterized by comprising:

  As described above, according to the present invention, a plurality of single-wafer substrates can be laminated and bonded substantially continuously and accurately, and the laminated substrates are heated particularly in a state where the protective film and the belt means are used in combination. By passing through the roll press means, the laminated base materials can be bonded efficiently with excellent productivity at a low running cost and without causing the problem of dirt adhesion to the product.

It is a schematic block diagram of the lamination | stacking bonding apparatus of the sheet | seat base material which concerns on one embodiment of this invention. It is a schematic block diagram of the lamination | stacking bonding apparatus of the single wafer base material which concerns on another embodiment of this invention. It is a schematic block diagram of the lamination | stacking bonding apparatus of the single wafer base material which concerns on another embodiment of this invention. It is a schematic block diagram of the lamination | stacking bonding apparatus of the sheet | seat base material by a flat plate heating press. It is a schematic block diagram of the lamination | stacking bonding apparatus of the sheet | seat base material in the case of using only a protective film. It is a schematic block diagram of the lamination | stacking bonding apparatus of the sheet | seat base material at the time of using the endless belt which contacts a base material directly.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 shows an apparatus for laminating and laminating single-wafer substrates according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes the entire sheet laminating and laminating apparatus, for example, an example applied when laminating and bonding a carbon sheet and an electrolyte membrane substrate as an electrode member for a fuel cell. ing. In FIG. 1, 2 is a lower carbon sheet having a coating layer on the upper surface side as a single wafer substrate to be laminated, 3 is an electrolyte membrane substrate (dimensionally unstable substrate) as a laminated single wafer substrate, Reference numeral 4 denotes an upper carbon sheet having a coating layer on the lower surface side as a single-wafer substrate to be laminated, and 5 denotes a substrate on which these single-wafer substrates are laminated. That is, the case where it laminates | stacks sequentially with the form equivalent to having shown in FIG. 4 is illustrated.

  The sheet laminating and laminating apparatus 1 is unwound from the unwinding device 9 and the lower protective film 8 functioning as a lower carrier sheet unwound from the unwinding device 6 and wound up by the winding device 7. And an upper protective film 11 functioning as an upper carrier sheet wound up by the winding device 10. The upper and lower protective films 8, 11 are passed through a heating roll press means 12.

  The laminated base material 5 is conveyed while being sandwiched between the upper and lower protective films 8 and 11, and is passed through the heating roll press means 12, but the back surface side of the lower protective film 8 (that is, laminated). Belt means 13 is provided on the side opposite to the side where the substrate 5 is held, and is moved so as to pass through the heating roll press means 12 together with the lower protective film 8. In this embodiment, reference numeral 13 denotes an endless belt (endless belt means) that is made of a heat-resistant material and is circulated.

  Moreover, in this embodiment, the scooping means 14 which removes the wrinkles of the lower protective film 8 is provided on the upstream side of the position where the lower protective film 8 and the belt means 13 are overlapped. As described above, for example, an expander roll, a crowning roll, and a widening roll can be applied to the wrinkle removing means 14.

  At a position before passing through the heating roll press means 12, an alignment stacking means 15 between the sheet substrates is provided. In this embodiment, the alignment stacking means 15 detects the edge of the substrate with the lower carbon sheet transfer robot 16 that transfers the lower carbon sheet 2 in a predetermined posture onto the lower protective film 8 and the camera 17. The electrolyte membrane substrate transfer robot 18 for laminating the electrolyte membrane substrate 3 on the lower carbon sheet 2 while performing alignment, and the electrolyte membrane substrate while detecting the edge of the substrate with the camera 19 and performing alignment The upper carbon sheet transfer robot 20 is configured to stack the upper carbon sheet 4 on the material 3. By these series of transfer robots 16, 18, and 20, the plurality of single-wafer substrates 2, 3, and 4 are substantially continuously aligned and stacked.

  The aligned and laminated base material 5 is conveyed while being sandwiched between the upper and lower protective films 8 and 11 and is continuously passed through the heating roll press means 12. At this time, the lower protective film 8 is used. The belt means 13 provided on the back side of the sheet is also passed through the heating roll press means 12 in a state of being used together with the lower protective film 8. In the heating roll press means 12, the laminated base material 5 is heated and pressed through the upper protective film 11, the lower protective film 8 and the belt means 13. The belt means 13 to be circulated does not directly contact the laminated base material 5, and even if deposits and dirt are generated on the belt means 13 side, the product 21 made of a single-wafer base material in which they are laminated and bonded together. Will not be adversely affected. Further, since the film is heated and roll-pressed via the belt means 13, a thick film is applied to the protective film (in particular, the lower protective film 8 in this embodiment) interposed between the belt means 13 and the base material. There is no need to use a problem when using a thick protective film, that is, the unwinding roll diameter or the winding roll diameter of the protective film becomes too large, the replacement frequency increases, or the productivity decreases. In addition, there is no problem of increase in running cost.

  In the present embodiment, the product 21 made of the laminated sheet-fed base material travels with the lower protective film 8, and then is transferred onto the subsequent belt 22, and stored there by the product transfer robot 23. It is transferred to the place or the next process place. As described above, in the present embodiment, it is possible to perform the processes from lamination to lamination of the single-wafer substrates to bonding and product removal substantially continuously and efficiently with excellent productivity.

  In FIG. 2, the lamination | stacking bonding apparatus 31 of the single wafer base material which concerns on another embodiment of this invention is shown. In this embodiment, compared to the embodiment shown in FIG. 1, the upper surface of the upper protective film 11 (that is, the surface side opposite to the side where the laminated base material 5 is held) is also on the upper side. The belt means 32 is provided so as to pass through the heating roll press means 12 together with the protective film 11. The belt means 32 is also made of a heat-resistant material and is configured as an endless belt (endless belt means) that circulates. Since other configurations are substantially the same as those of the embodiment shown in FIG. 1, the same reference numerals as those shown in FIG.

  In the embodiment configured as described above, the belt means 32 is further provided on the upper side as compared with the embodiment shown in FIG. 1, and the belt means 13 and 32 are used in combination with the upper and lower protective films 8 and 11. Then, the heated roll press means 12 is passed in the combined state. Therefore, in the heating roll press means 12, the laminated base material 5 is heated and pressurized through the upper protective film 11 and the belt means 32 and through the lower protective film 8 and the belt means 13. The Since the belt means 13 and 32 to be circulated do not directly contact the laminated base material 5, even if deposits and dirt are generated on the belt means 13 and 32 side, the belt means 13 and 32 are made of a single-wafer base material in which they are laminated and bonded together. The product 21 is not adversely affected. In addition, since it is heated and roll-pressed through the belt means 13 and 32, it is not necessary to use a thick film for both the protective films 8 and 11 interposed between the belt means 13 and 32 and the base material. Problems when using, i.e., unwinding roll diameter and take-up roll diameter of the protective film are too large, replacement frequency is increased, productivity is reduced, and running cost is increased. It is surely solved.

  In FIG. 3, the lamination | stacking bonding apparatus 41 of the single wafer base material which concerns on another embodiment of this invention is shown. In this embodiment, compared with the embodiment shown in FIG. 1, the rear-circulation belt 22 and the product transfer robot 23 are not provided. Such a circulating belt 22 and a product transfer robot 23 may be provided as necessary. In addition, the product take-out unit is not limited to the circulating belt 22 and the product transfer robot 23, and any means can be provided. Since other configurations are substantially the same as those of the embodiment shown in FIG. 1, the same reference numerals as those shown in FIG.

  In addition, each said embodiment illustrates the lamination | stacking bonding apparatus of the single wafer base material which concerns on this invention, and this invention is not limited to said each embodiment. For example, in the present invention, in addition to the form using a base material that is preliminarily cut into a predetermined size as a single-wafer base material to be laminated, as described above, for example, the lower protective film that contacts the lower surface of the laminated base material, It is also possible to take the form comprised by the film for lowermost sheet substrate forming. That is, the protective film is used as a protective film that is also used as a single-wafer base material forming film, and after laminating and bonding other single-wafer base materials, the laminate is laminated as a target final form by cutting to a predetermined dimension. It is also possible to obtain a single-wafer substrate product.

  The present invention can be applied to the lamination and lamination of all single-wafer substrates, and is particularly suitable for the lamination and lamination of dimensional instability substrates, especially for the production of fuel cell electrode members.

DESCRIPTION OF SYMBOLS 1, 31, 41 Lamination | stacking laminating apparatus 2 of sheet | seat base material 2 Lower carbon sheet 3 as sheet | seat base material 4 Electrolyte membrane base material 4 as sheet | seat base material Upper carbon sheet 5 as sheet | seat base material Laminated base material 6, 9 Unwinding apparatus 7 DESCRIPTION OF SYMBOLS 10 Winding device 8 Lower protective film 11 Upper protective film 12 Heating roll press means 13, 32 Belt means 14 Scrape means 15 Positioning lamination means 16 Lower carbon sheet transfer robot 17, 19 Camera 18 Electrolyte membrane base Material transfer robot 20 Carbon sheet transfer robot 21 Product 22 Loop belt 23 Product transfer robot

Claims (9)

  A device for laminating single-wafer substrates, and laminating the laminated substrates through a heated roll press means, at least at the position of the heated roll press means, contacting the upper and lower surfaces of the laminated substrates, The upper and lower protective films that are passed through the heated roll press means together with the laminated base material and the back side of at least one protective film are provided so as to pass through the heated roll press means together with the one protective film. And a sheet laminating and laminating apparatus comprising: a belt means for forming a single-wafer substrate.   The laminating and laminating apparatus for sheet substrates according to claim 1, wherein the belt means comprises endless belt means.   The at least one protective film of the upper and lower protective films is provided with unwinding means for unwinding the protective film at an upstream position in the traveling direction and winding means for unwinding at the downstream side. 2. A laminating and laminating apparatus for sheet substrates according to 2.   The lamination | stacking bonding apparatus of the sheet | seat base material in any one of Claims 1-3 with which the position alignment means of the sheet | seat base materials laminated | stacked is provided in the position before the said heating roll press means.   The at least one protective film of the said upper and lower protective films WHEREIN: The scooping means which removes the wrinkles of this protective film is provided in the position before the said heating roll press means passage at least. A laminating and laminating device for sheet substrates according to any one of the above.   The lamination | stacking bonding apparatus of the single-wafer base material in any one of Claims 1-5 by which the lower side protective film which contacts the lower surface of the said laminated | stacked base material is comprised by the film for lowermost sheet material forming. .   The lamination | stacking bonding apparatus of the sheet | seat base material in any one of Claims 1-6 in which at least one layer of the said laminated | stacked base material consists of a dimensionally unstable base material.   The lamination | stacking bonding apparatus of the sheet | seat base material in any one of Claims 1-7 which the said base material laminated | stacked and bonded consists of an electrode member for fuel cells.   The process of laminating by aligning the positions of the single-wafer substrates, sandwiching the laminated substrates from above and below with a protective film, and transporting with the protective film via belt means provided on the back side of at least one protective film A conveying step, a laminating step in which the laminated base material to be conveyed is heated and pressed through the upper and lower protective films, and a product removing step in which the upper and lower protective films are peeled off from the laminated and laminated base materials. A method for laminating and bonding single-wafer substrates, characterized in that:

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