JP2014016205A - Vertical probe, manufacturing method of vertical probe, and attachment method of vertical probe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vertical probe that prevents damage to vertical probes to be arranged or already arranged when attached to a probe attachment body, and improve accuracy of a leading edge position thereof.SOLUTION: A vertical probe of the present invention includes: a vertical probe body that has a contact leading edge contacting an electrode of a test body at a leading edge of a linear leading edge part, and is attached to a probe attachment body; and a tab that is removably connected with the vertical probe body, and functions as a knob. The tab has an artificial contact leading edge that is formed at a position on an extension of a straight line of the leading edge part, and is artificially used as the contact leading edge in position control and attitude control using a photographed image.

Description

  The present invention relates to a vertical probe, a method for manufacturing a vertical probe, and a method for mounting a vertical probe. For example, a probe card or an interposer substrate (hereinafter, a combination of a probe card and an interposer substrate used for a current test of a semiconductor wafer on which a semiconductor integrated circuit is formed). It can be applied to a vertical probe applied to a probe mounting body), a manufacturing method thereof, and a mounting method to a probe mounting body.

  A large number of integrated circuits formed on a semiconductor wafer are subjected to an energization test to determine whether or not they have performance according to specifications before being cut from the semiconductor wafer. A large number of integrated circuits on one semiconductor wafer can be tested simultaneously at one time, or can be tested in multiple times. Some probe cards and interposer substrates used in this type of current test have a plurality of vertical probes arranged in parallel.

  A probe mounting body such as a probe card or an interposer substrate includes one or more plate members having a plurality of probe receiving portions such as through holes (for example, plate members are provided above and below, or a plate member is provided only on the upper side). The plurality of vertical probes are arranged so as to be attached to the probe receiving portion of the plate member.

  For example, a plurality of vertical probes to be mounted on the probe receivers in the same row are integrally formed, and a group of vertical probes formed by the integrated molding are simultaneously mounted on the corresponding probe receivers (some of the conventional techniques do not have Some have released the integration later), and it has also been proposed to improve the workability of mounting (see Patent Document 1 and Patent Document 2).

Special table 2008-530580 gazette JP-A-1-287484

  By the way, even if each vertical probe is fine, the vertical probe group formed by integral molding is a larger member than the vertical probe.

  Therefore, when trying to arrange a vertical probe group formed by integral molding on a probe mounting body with a probe receiving portion having a narrow pitch, or when a vertical probe group formed by integral molding on an interposer substrate corresponding to an area array is used. When trying to place each vertical probe with high precision, depending on the handling of the vertical probe group, there is a risk of damaging the vertical probe to be placed. Or the accuracy of the tip position may be deteriorated.

  In order to avoid such inconvenience, it is preferable to handle and arrange the vertical probes one by one. However, it is not easy to handle a fine vertical probe, whether it is automated or manual placement, so it can be removed at one end of the vertical probe prior to placement. It is also conceivable that a vertical probe is arranged on the probe mounting body with a tab (stagnation) provided, and the tab is removed after the arrangement.

  The above vertical probe (or vertical probe group) placement operation confirms the tip position of the vertical probe (or vertical probe group) based on the imaging signal from the surveillance camera in order to improve the positional accuracy. While being executed. However, when a tab is provided at one end of the vertical probe, the tab interferes with imaging, and the tip position of the vertical probe cannot be confirmed accurately.

  Therefore, when placing the vertical probe on the probe mounting body, the vertical probe to be placed or the already placed vertical probe is not damaged, and the tip position of the placed vertical probe is not affected. There is a demand for a vertical probe and a method for attaching the vertical probe that can improve accuracy. In addition, a method for manufacturing a vertical probe that can manufacture such a vertical probe is desired.

  In order to solve the above-mentioned problems, a vertical probe according to a first aspect of the present invention is (1) a main body attached to a probe mounting body having a contact tip in contact with an electrode of a device under test at the tip of a linear tip. A vertical probe main body, and (2) a tab that is removably connected to the vertical probe main body, and (3) the tab is on the straight extension of the tip. The position has a pseudo contact tip that is simulated as the contact tip in position control and posture control using a captured image.

  According to a second aspect of the present invention, there is provided a vertical probe main body which is a main body attached to a probe mounting body having a contact tip that makes contact with an electrode of a device under test at the tip of a linear tip, and is removed from the vertical probe main body. And a tab that functions as a stagnation, and the tab is imitated as the contact tip in position control and posture control using a captured image at a position on a straight extension of the tip. A vertical probe manufacturing method for manufacturing a vertical probe having a pseudo contact tip, wherein the contact tip and the pseudo contact tip are simultaneously formed in the same thin film forming step. .

  According to a third aspect of the present invention, there is provided a vertical probe body having a contact tip in contact with an electrode of a device under test at the tip of a linear tip portion, and a scab that is removably connected to the vertical probe body. A vertical probe mounting method for mounting a vertical probe having a pseudo contact tip similar to the contact tip at a position on a straight line extension of the tip portion to a probe mounting body. (1) While performing the position control and / or the posture control based on the position of the pseudo contact tip in the captured image from the upper imaging camera in a state where the vertical probe body and the tab are coupled, A vertical probe body is attached to the probe attachment body, and (2) the tab is then detached from the vertical probe body attached to the probe attachment body. To.

  According to the present invention, when a vertical probe is arranged on a probe mounting body, the arranged vertical probe is not damaged without damaging the vertical probe to be arranged or the already arranged vertical probe. It is possible to provide a vertical probe and a method for attaching the vertical probe that can improve the accuracy of the tip position of the probe. According to another aspect of the present invention, a method of manufacturing a vertical probe that can manufacture such a vertical probe can be provided.

It is a schematic perspective view which shows the vertical type probe of embodiment immediately after manufacture. It is a fragmentary perspective view which expands and shows the contact front-end | tip of FIG. It is a perspective view which shows the vertical type probe main body from which the tab was isolate | separated. It is a fragmentary perspective view which expands and shows the pseudo | simulation contact front-end | tip of FIG. It is process drawing (the 1) which shows the manufacture procedure of the vertical probe of embodiment. It is process drawing (the 2) which shows the manufacture procedure of the vertical probe of embodiment. It is a schematic perspective view which shows an example of the probe attachment body to which the vertical probe (vertical probe main body) of embodiment is attached. It is the top view and sectional drawing which show the probe board | substrate in FIG. It is a fragmentary perspective view which expands and shows the modification of a pseudo contact tip part.

(A) Main Embodiments Hereinafter, an embodiment of a vertical probe, a method for manufacturing a vertical probe, and a method for attaching a vertical probe according to the present invention will be described with reference to the drawings.

  FIG. 1 shows a vertical probe 1 of an embodiment immediately after being manufactured. FIG. 1 (A) shows a state of being attached to a base (silicon (Si) wafer) at the time of manufacturing, which will be described later, and FIG. 1 (B) is after being separated from the base at the time of manufacturing, which will be described later. Indicates the state.

  In FIG. 1, the vertical probe 1 mainly includes a vertical probe body 10 and a tab 20, and the vertical probe body 10 and the tab 20 are integrally formed to form the vertical probe 1.

  The vertical probe body 10 is a part that is attached to a probe attachment body (see FIG. 6) and functions as a probe. The vertical probe main body 10 is formed with a substantially linear tip portion 11, a substantially arcuate main body portion 12, and a substantially linear attachment portion 13 in this order. The straight tip portion 11 and the attachment portion 13 extend on the same straight line in a state where no external force is applied to the vertical probe body 10.

  The tip portion 11 has a contact tip 11A shown in an enlarged view in FIG. 2, which contacts an electrode of a flat test piece (not shown) (for example, a semiconductor wafer on which an integrated circuit is formed).

  The main body portion 12 has an arcuate shape, so that it exerts an elastic force when the contact tip 11A comes into contact with an electrode (not shown) to ensure contact.

  The attachment portion 13 penetrates the through hole of the probe attachment body and is attached to the probe attachment body. The attachment portion 13 has solder 13A for welding inside the through hole at the time of attachment.

  The tab 20 includes a tab main body 21, a connecting portion 22, a base separating portion 23, and a pseudo contact tip portion 24.

  The tab main body 21 is a main body portion that functions as a sag that has a generally flat plate shape. The tab body 21 has a plurality of through-holes 21A for appropriately removing elements at desired locations in the first wet etching (FIG. 6G described later) in the manufacturing process of the vertical probe 1. Have. After the vertical probe 1 is formed, these through holes 21A have finished their functions.

  The connecting portion 22 connects the vertical probe main body 10 and the tab 20 so that they can be easily separated. 1 includes a pair of claw pieces 22A and 22B extending downward from the tab body 21 and extending in opposite directions, and the claw of the pair of claw pieces 22A and 22B is vertical. It is connected to the upper part of the left and right side surfaces of the distal end portion 11 of the mold probe main body 10. By such a coupling method, the contact tip 11A in the tip portion 11 is positioned in the space formed by the pair of claw pieces 22A and 22B, and the contact tip 11A is protected in a situation where the tab 20 is not separated. Has been made. In addition, the connecting portion 22 can be easily connected by applying an external force along the normal direction of the tab main body 21 to the upper side of the tab main body 21 in a state in which the position change of the vertical probe main body 10 is suppressed. Can be released. FIG. 3 shows the vertical probe body 10 with the tabs 20 separated.

  The separation facilitating unit 23 is a part that facilitates separating the vertical probe 1 from the base during manufacture. The separation facilitating portion 23 communicates a disk-like remaining portion 23A located in a circular through-hole 21B provided substantially at the center of the tab body 21, and the remaining portion 23A to the side surface around the through-hole 21B. It consists of a single bridge portion 23B and a connecting layer portion 23C (see FIG. 5G) that is provided on the base side of the remaining portion 23A and connects the base and the remaining portion 23A. By cutting the bridge portion 23B of the separation facilitating portion 23, the vertical probe 1 can be separated from the base.

  The pseudo contact tip 24 is provided with a pseudo contact tip 24A shown in an enlarged manner in FIG. 4 that provides a position reference instead of the contact tip 11A when the tabbed vertical probe 1 is attached to the probe mounting body. . The straight line passing through the contact tip 11A and the pseudo contact tip 24A is the same as the straight line extending from the tip portion 11 of the vertical probe body 10. The pseudo contact tip 24A has the same shape and material as the contact tip 11A. In the portion other than the pseudo contact tip 24A in the pseudo contact tip 24, the portion of the captured image obtained by imaging the pseudo contact tip 24A from above and the portion of the image obtained by imaging the contact tip 11A from above appear in the same manner. It has a shape.

  Next, a manufacturing process (manufacturing method) of the vertical probe 1 of the above-described embodiment will be described. 5 and 6 are process diagrams showing the manufacturing procedure of the vertical probe 1. 5A to 5E and FIGS. 6F to 6J are not strict sectional views (or side views), but clearly show elements that are formed or removed at each step. It is a schematic sectional drawing describing the manufacture procedure from a viewpoint of making it. Therefore, for example, the bow-shaped main body portion 12 is also described as being linear like the distal end portion 11 and the attachment portion 13, and for example, the through holes 21A and 21B of the tab main body 21 are not specified.

  As shown in FIG. 5A, a silicon crystal substrate whose surface is mirror-finished by etching is prepared as a base 30.

  Prior to growing a sacrificial layer of, for example, copper (Cu) on the silicon crystal substrate 30, an adhesion layer 31 such as chromium-palladium (CrPd) is formed by, for example, a sputtering method in order to promote the growth of copper. Then, copper is deposited on the adhesive layer 31 by, for example, a sputtering method, and the sacrificial layer 32 is formed. FIG. 5B shows a state where the adhesive layer 31 and the sacrificial layer 32 are stacked on the base 30. A connection layer portion 23 </ b> C and a pedestal portion 34 described later are formed from the sacrificial layer 32.

  Next, as shown in FIG. 5C, sacrificial pedestals 33A and 33B for forming the contact tip 11A and the pseudo contact tip 24A are formed. In order to make the surrounding structure of the contact tip 11A and the pseudo contact tip 24A the same, the sacrifice pedestals 33A and 33B have the same structure. The formation method of the sacrificial pedestals 33A and 33B is arbitrary, but for example, the following method using photolithography can be applied. After applying a photoresist material on the sacrificial layer 32 to form a photoresist layer, the photoresist layer is selectively exposed using a pattern mask, and further developed to form an opening in the photoresist layer. The sacrificial pedestals 33A and 33B are formed by filling the openings with copper, and finally the remaining photoresist layer is removed. The upper surfaces of the sacrificial pedestals 33A and 33B may be polished.

  Next, as shown in FIG. 5D, a contact tip 11A and a pseudo contact tip 24A having a predetermined shape are formed using the sacrifice pedestals 33A and 33B. As a material of the contact tip 11A and the pseudo contact tip 24A, a hard metal or alloy (for example, rhodium (Rh)) excellent in wear resistance can be applied. Although the method for forming the contact tip 11A and the pseudo contact tip 24A is also arbitrary, for example, a method using photolithography can be applied. The upper surfaces of the contact tip 11A and the pseudo contact tip 24A may be polished.

  After that, as shown in FIG. 5E, a high-toughness material (for example, an alloy having a spring property such as nickel boron (NiB)), which is the majority of the vertical probe main body 10 and the tab 20, is used. And selectively laminating (for example, depositing) according to the shape of the tab 20. The method of laminating the probe material is arbitrary, but for example, an electroplating method using a resist mask can be applied. When the probe material is stacked, various through holes, a space around the contact tip 11A, and the like are also formed. The laminated probe material is polished as shown in FIG. 6F to have a predetermined film thickness.

  Next, as shown in FIG. 6G, a wet etching process using an etchant is performed to remove the sacrificial layer 32 and the sacrificial pedestals 33A and 33B. By this wet etching process, the sacrificial layer 32 and the sacrificial pedestals 33A and 33B made of a different material (copper) are removed. The portion that becomes the tab 20 has a through hole 21A, and the portion that becomes the vertical probe main body 10 is thin, so that most of the sacrifice layer 32 and the sacrifice pedestals 33A and 33B are removed by wet etching. However, the portion of the sacrificial layer 32 below the remaining portion 23A in the circular separation facilitating portion 23 having a large diameter remains even after the wet etching process, and becomes the connecting layer portion 23C. Also, the portion of the sacrificial layer 32 in the vicinity of the solder 13A of the attachment portion 13 in the vertical probe body 10 remains using a jig or the like that becomes a wall that inhibits the etching solution erosion, and the solder 13A adheres. It becomes the base part 34 which enables it to be stabilized. The vertical probe 1 is subjected to heat treatment in a state where it is supported on the base 30 at two locations of the connecting layer portion 23 </ b> C and the pedestal portion 34, and the strength of the vertical probe 1 is increased. Although the warping force is generated in the vertical probe 1 by the heat treatment, the warping can be prevented by supporting at two places.

  Next, as shown in FIG. 6 (H), solder 13A made of, for example, tin (Sn) is attached to a predetermined position, and thereafter, as shown in FIG. 6 (I), a pedestal portion 34 below the solder 13A. Are removed by wet etching. Even after the removal, the connecting layer portion 23C that ensures the connection with the base 30 is left.

  Finally, the bridge portion 23B (see FIG. 1) of the separation facilitating portion 23 is cut using a tool such as a cutter knife, or the bridge portion 23B is bent and cut, as shown in FIG. 6 (J). The vertical probe 1 is separated from the base side.

  Next, a method for attaching the vertical probe 1 of the embodiment will be described.

  FIG. 7 is a schematic perspective view showing an example of a probe attachment body such as a probe card or an interposer substrate.

  In FIG. 7, a probe mounting body 40 includes a wiring board 41, a probe board 42 disposed below the wiring board 41, and a plurality of vertical types attached to the probe board 42 so as to extend downward from the probe board 42. A probe main body 10. The vertical probe body 10 is a portion excluding the tab 20 of the vertical probe 1 of the above-described embodiment.

  The wiring substrate 41 includes a plurality of conductive joints 43 provided on the lower surface, a number of internal wirings 44 electrically connected to the joint 43 at one end, and a number of connection parts 45 provided on the top surface. With.

  The probe substrate 42 is made of, for example, a rectangular planar shape using an electrically insulating material such as ceramic, and as shown in FIGS. 8A and 8B, a plurality of through-holes opened on the upper surface and the lower surface. 46 in the central region and through holes 47 at the four corners. Each through-hole 46 has a circular cross section, for example, for receiving the attachment portion 13 of the vertical probe body 10. Each through-hole 47 allows a positioning pin to be attached while positioning the wiring board 41 and the probe board 42.

  For example, all the vertical probe bodies 10 are attached to the probe board 42 that is not joined to the wiring board 41, and then the wiring board 41 and the probe board 42 are joined to complete the probe mounting body. Hereinafter, a method for attaching the vertical probe main body 10 to the probe substrate 42 will be briefly described. The attachment of the vertical probe body 10 to the probe substrate 42 may be automated or may be a manual method using an operator's tweezers or the like. The mold probe body 10 is repeatedly attached.

  When the vertical probe body 10 is mounted, the probe substrate 42 is placed on a reference table (not shown) in the direction opposite to the vertical direction in FIG. 1, and the vertical probe body 10 (the mounting portion 13) is mounted from above. Is done.

  The tab 20 in the vertical probe 1 to be attached while the vertical probe main body 10 and the tab 20 are connected is gripped from the lateral direction by a gripping tool (not shown). At this time, the pseudo contact tip 24A located at the upper part of the tab 20 is visible from above. In other words, when the vertical probe main body 10 is attached to the probe substrate 42 and captured by the upper imaging camera, the tab 20 is gripped by the gripping tool so that the pseudo contact tip 24A is included in the captured image.

  As described above, the contact tip 11A and the pseudo contact tip 24A are located on a straight line extending from the tip portion 11 and the attachment portion 13 of the vertical probe main body 10, and therefore the pseudo contact tip 24A imaged from above is taken. The position of the contact tip 11A is the same in the left-right direction and the front-rear direction (however, although the position in the up-down direction is different, the captured image is an image in which the up-down direction is projected, so there is almost no problem. Absent). Since the pseudo contact tip 24A is made of the same material as the contact tip 11A and has a similar shape, the captured image portion of the pseudo contact tip 24A can be regarded as the captured image portion of the contact tip 11A from this point as well. (For example, it is possible to use an existing image processing program as it is or with a slight modification).

  While confirming the positions of the pseudo contact tip 24 </ b> A in the captured image in the left-right direction and the front-rear direction, the mounting portion 13 of the vertical probe main body 10 is opposed to the through-hole 46 to be passed therethrough, and the mounting portion 13 is passed through the through-hole 46. . After the penetration, the gripping tool is released and the posture of the vertical probe 1 at the time of release is confirmed by a captured image from above. Also at this time, it is confirmed whether the positions of the pseudo contact tip 24A in the left-right direction and the front-rear direction are appropriate. Further, the linearity of the upper side of the tab 20 provided with the pseudo contact tip 24A is confirmed. The gripping tool grips the tab 20, corrects the posture while moving and rotating the tab 20, and in that state, melts and solidifies the solder 13 </ b> A provided in the mounting portion 13, and mounts it in the through hole 46. The mounting of the part 13 is ensured.

  Thereafter, with the tip 11 of the vertical probe body 10 held by a gripping tool (not shown) so as not to move, the tab 20 gripped by another gripping tool is rotated around the vicinity of the claws of the claw pieces 22A and 22B. By moving, the tab 20 is cut off from the vertical probe body 10 and removed. At this time, the contact tip 11A can be imaged by the imaging camera, and the final position of the contact tip 11A is confirmed or corrected based on the captured image.

  The plurality of attached vertical probe bodies 10 are aligned so that the bulging directions of the arcuate main body 13 are aligned, for example.

  According to the above embodiment, since the method of attaching one vertical probe to the probe substrate is applied, compared to the method of attaching a member in which a plurality of members are integrated, a vertical probe to be attached or an already attached probe is attached. It is possible to significantly reduce the damage to the vertical probe.

  Although a method of attaching one vertical probe to the probe substrate is applied, it is attached using a tab connected to the vertical probe main body, so that attachment work and the like can be facilitated. .

  Even if the tab is provided with a pseudo contact tip having the same shape as the contact tip in contact with the contact tip that contacts the electrode of the device under test, the pseudo contact in the captured image Since the mounting position and orientation of the vertical probe body can be controlled according to the position of the tip, etc., the vertical probe body can be mounted so that the position of the contact tip is highly accurate.

(B) Other Embodiments In the above-described embodiment, the pseudo contact tip 24 has the shape shown in FIG. 4, but the pseudo contact tip 24 has a shape that takes into account the influence of illumination for imaging. May be. FIGS. 9A to 9C each show a modification of the pseudo contact tip 24. In the modification shown in FIG. 9A, the angle formed by the left and right wall surfaces defining the concave portion provided with the pseudo contact tip 24A and the upper surface is an obtuse angle, unlike the case of FIG. In the modification shown in FIG. 9B, the width of the concave portion provided with the pseudo contact tip 24A is made wider than that of FIG. 4, and the portion provided with the pseudo contact tip 24A is also formed on the vertical probe body 10. Similar to the tip portion 11, it is a rod shape. In the modification shown in FIG. 9C, the width of the concave portion provided with the pseudo contact tip 24A is made wider than that in FIG. 4, and the pseudo contact tip 24A is positioned at the apex of the mountain shape provided in the concave portion. It is a thing.

  In the above embodiment, the pseudo contact tip 24A is provided at a position lower than the upper surface of the tab 20. However, the pseudo contact tip 24A may be formed so as to protrude from the upper surface of the tab 20.

  In the above embodiment, the tab 20 has a rectangular outer shape, but may have other shapes such as a circle, an ellipse, and a triangle.

  In the above embodiment, the vertical probe body has the shape shown in FIG. 3, but the shape of the vertical probe body is not limited to this. For example, the ratio of the length in the vertical direction of the tip portion 11, the main body portion 12, and the attachment portion 13 may be different from that in FIG. Moreover, the front-end | tip part 11 and the attaching part 13 may not be on the same straight line, but may exist on two different parallel straight lines. The main body 12 that contributes to the application of the contact pressure is not limited to an arcuate shape.

1 ... vertical probe,
DESCRIPTION OF SYMBOLS 10 ... Vertical type probe main body, 11 ... Tip part, 11A ... Contact tip, 12 ... Main part, 13 ... Mounting part,
20 ... Tab, 21 ... Tab body, 22 ... Connecting portion, 23 ... Base separation portion, 24 ... Pseudo contact tip, 24A ... Pseudo contact tip,
40 ... probe mounting body, 41 ... wiring board, 42 ... probe board.

Claims (3)

A vertical probe main body which is a main body attached to the probe mounting body, having a contact tip that contacts the electrode of the device under test at the tip of the linear tip portion;
A tab functioning as a stubborn removably connected to the vertical probe body;
The vertical probe according to claim 1, wherein the tab has a pseudo-contact tip that is simulated as the contact tip in position control or posture control using a captured image at a position on a straight line extension of the tip. A vertical probe body, which is a main body attached to the probe mounting body, having a contact tip that makes contact with the electrode of the device under test at the tip of the linear tip, and a removably connected to the vertical probe body. A vertical type that has a pseudo-contact tip that is simulated as the contact tip in position control and posture control using a captured image at a position on a straight line extension of the tip portion. A method of manufacturing a vertical probe for manufacturing a probe,
A method of manufacturing a vertical probe, wherein the contact tip and the pseudo contact tip are formed simultaneously in the same thin film forming step. A vertical probe body having a contact tip in contact with the electrode of the device under test at the tip of the linear tip portion, and a tab functioning as a stub that is removably connected to the vertical probe body, and A vertical probe mounting method for mounting a vertical probe having a pseudo contact tip similar to the contact tip at a position on a linear extension of the tip portion to a probe mounting body,
While the vertical probe body and the tab are connected, the vertical probe body is controlled while performing position control and / or posture control based on the position of the pseudo contact tip in the captured image from the upper imaging camera. Is attached to the probe mounting body,
Thereafter, the tab is detached from the vertical probe main body attached to the probe attachment body.

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