JP2014014840A - Substrate processing method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deformation of a substrate by thermal diffusion in the substrate generated during laser irradiation on a substrate body rolled into a roll shape and to allow the substrate to effectively cope with subsequent conveyance by half-cut cutting/dividing.SOLUTION: It is adjusted: a relative moving speed of laser light moving to a substrate serially drawn from the rolled substrate body rolled into a roll shape; wavelength of the laser light; and pulse interval with a material of the substrate in order to realize processing of a substrate material of not so excellent absorption characteristics with small thermal effect by nonlinear effect caused by condensing light near a substrate surface with a processing head. Heat generation caused by laser irradiation during processing is reduced by using a laser light source of shortened pulse resulting in effective prevention of a glass substrate from deformation by heat generation during processing. A substrate subjected to half-cut processing is rolled into a roll shape again so as to allow the rolled substrate body subjected to half-cut processing to be subsequently and effectively conveyed.

Description

  The present invention relates to a substrate processing apparatus for processing a substrate such as a glass substrate or a semiconductor substrate of an FPD (Flat Panel Display) panel with a laser beam, and particularly, to process a substrate having a thickness of about 100 [μm] or less with high accuracy. It is related with the substrate processing apparatus and apparatus which can be performed.

  Manufacturing of glass substrates such as liquid crystal display devices used as display panels and cover glass for touch panels, color filter substrates, plasma display panel substrates, organic EL (ELECTRO LUMINESENCE) display panels, etc., the base glass substrate is the specified size. Done by cutting into. If defects such as scratches or foreign matter are present on the substrate due to fine cracks or cullet on the cut surface of the glass substrate, formation of a chromium film or the like and pattern transfer are not performed satisfactorily in the next step, causing defects. For this reason, a glass cutting method without defects is required. The thing of patent document 1 is known as what performs the cutting | disconnection or cutting process of a glass substrate which is such a brittle board | substrate, or a semiconductor substrate, and a scribe process by irradiation of a laser beam.

JP 2009-255346 A

  If the cullet or residue is reattached or the substrate is deformed due to thermal stress when the glass substrate is cut, the formation of a chromium film or the like and the transfer of the pattern are not performed well in the next step, which causes a defect. For this reason, the processing method which suppresses generation | occurrence | production of such a defect as much as possible, and can perform the cutting / cleaving (meaning both half cut and full cut in this specification) of the glass substrate which is a brittle substrate with high precision. Is required. When a thin glass substrate having a thickness of 100 [μm] or less is cut / cleaved (half cut or full cut) using the substrate processing apparatus described in Patent Document 1, heat absorption is simply performed by heating by laser irradiation of carbon dioxide gas or the like. Because of its high performance, thermal deformation and embrittlement of the glass substrate proceed to the peripheral part due to thermal diffusion to the periphery, and it has been difficult to obtain a good processing state.

  If the cullet or residue is reattached or the substrate is deformed due to thermal stress when the glass substrate is cut, the formation of a chromium film or the like and the transfer of the pattern are not performed well in the next step, which causes a defect. Therefore, there is a demand for a processing method that can suppress the occurrence of such defects as much as possible and can perform cutting / cleaving (in this specification, half-cutting) of a glass substrate that is a brittle substrate with high accuracy. . When a thin glass substrate having a thickness of 100 [μm] or less is cut / cleaved (half cut) using the substrate processing apparatus described in Patent Document 1, heating by laser irradiation such as carbon dioxide gas has high heat absorbability. Therefore, due to thermal diffusion to the periphery, thermal deformation and embrittlement of the glass substrate proceeded to the peripheral portion, and it was difficult to obtain a good half-cut processing state. For this purpose, half-cut cutting / cleaving is performed on a glass substrate which is a brittle substrate, and then cut into half-cuts / cleaved, then re-rolled, transported, and full-cut cut / cleaved elsewhere. It was difficult to perform the process.

  The present invention has been made in view of the above points, and prevents deformation of the substrate due to thermal diffusion in the substrate caused by laser irradiation on the roll-shaped substrate, and performs half-cut cutting / cleaving, and then It is an object of the present invention to provide a substrate processing method and apparatus that can cope with the conveyance of the substrate.

The first feature of the substrate processing method according to the present invention is that the substrate pulled out from the roll-shaped substrate wound in a roll shape is irradiated while moving the laser beam relatively, and the laser beam A substrate processing method for performing predetermined processing on a substrate surface by spraying a cooling medium in the vicinity of processing after movement, cooling a processing surface portion of the substrate, and generating stress effective for cleaving. The laser beam is irradiated to the substrate while moving the laser beam at a predetermined speed according to a predetermined line, and the heat generated by the laser beam irradiation is controlled by the wavelength of the laser beam and the pulse interval.
This is because the relative movement speed of the laser beam, the wavelength of the laser beam, and the pulse interval are matched to the substrate material, with respect to the substrate sequentially drawn from the rolled substrate body wound in a roll. The non-linear effect caused by condensing light near the substrate surface by the processing head enables processing with less thermal influence even for a substrate material with poor absorption characteristics. Heat generation due to laser irradiation during processing can be reduced by using a short-pulse laser light source, so that deformation of the glass substrate due to heat generation during processing can be effectively prevented. This is a non-linear optical effect by condensing short pulse laser light. Even a material with low absorption characteristics with respect to the laser wavelength is heated. As the heating further proceeds, the absorption increases and reaches the processing temperature. This is due to the phenomenon. By using a short pulse with a high peak value, the temperature rise is kept constant, machining is performed along the planned machining line, the amount of heat generated at the machining tip is suppressed, and heat diffusing heat is absorbed near the planned machining line. Depending on the air flow and the flow direction, the heat diffusion heat of the laser can be absorbed, and the substrate deformation due to the diffused heat can be prevented. Further, by winding the substrate subjected to the half-cut process in a roll shape again in this way, there is an effect that the roll-shaped substrate body can be transported satisfactorily thereafter.

A second feature of the substrate processing method according to the present invention is the substrate processing method according to the first feature, wherein the relative distance between the substrate surface and the processing head is determined based on the reflected light of the substrate surface. It is to move while following the surface of the substrate so as to be constant.
This is based on the reflected light from the substrate surface using a laser-type distance sensor (triangulation) with respect to the substrate sequentially drawn from the rolled substrate body wound in a roll shape. The distance to the surface is measured, and the distance is controlled to be constant according to the measured distance, and the focal position is moved from the glass surface to a predetermined depth so as to follow the surface shape of the glass substrate. It is what I did. By providing a coarse focus adjustment mechanism that adjusts the overall height based on the beam shape and a fine focus adjustment mechanism that finely moves the optical system that adjusts the processing portion (distance to the center of temperature rise). The height can be moved while following the surface of the substrate. By moving the height of the processing head while following the surface of the substrate, the distance from the heating temperature for growing the cut processing state to the cooling temperature at which the surrounding processing is not performed, that is, the processing depth and processing width are stabilized, Half-cut processing that prevents deformation of the substrate due to thermal diffusion within the substrate caused by laser irradiation can be performed on the rolled substrate wound in a roll shape.

  According to a third feature of the substrate processing method of the present invention, in the substrate processing method according to the first or second feature, the plano-convex lens means and the beam expander means provided on the laser beam path, The laser light is deformed into a circular beam of a prescribed size and the surface of the substrate is irradiated so that the optical axis of the laser light coincides with the planned processing line. This is done by making the optical axis of the laser beam, that is, the center of the Gaussian distribution match the planned processing line, thereby stabilizing the melting temperature of the processing tip, the width of the scribe line and the processing depth, and depending on the high temperature part. The temperature diffusion is minimized and stabilized.

  According to a fourth aspect of the substrate processing method of the present invention, in the substrate processing method according to the first, second, or third feature, a mixture of a cooling medium that is a liquid and a carrier gas is added to the surface of the substrate. By spraying an appropriate amount, the processing surface portion of the substrate is cooled to generate stress effective for cleaving and to remove processing gas and residues generated in the vicinity of the processing. This is because the cooling means sprays a mixture of a carrier gas such as compressed air and a cooling medium from a nozzle, etc., so that cleaving processing with reduced substrate deformation due to laser irradiation and cooling can be performed smoothly. is there. A gas is blown in the direction parallel to the optical axis movement direction of the laser beam, that is, near the processing by the laser beam, and the processing gas and residues generated during the processing are blown off. Since the processing residue generated at the time of processing becomes an obstacle to processing, it is possible to efficiently regulate the thermal deformation of the substrate and the unnecessary heat diffusion range by removing the processing residue. It should be noted that the processing residue can be efficiently blown off by blowing the gas to be blown along a processing planned (predicted cleaving) line that is parallel to the optical axis moving direction in the vicinity of the processing by the laser beam.

  According to a fifth aspect of the substrate processing method of the present invention, in the substrate processing method according to the first, second, third, or fourth feature, air is blown from an upper surface of a stage unit that conveys the substrate. In a state where the substrate is floated by balancing the suction and the apparent spring rigidity is increased, a gas jet is blown from the back side of the planned processing line of the substrate half-cut by a predetermined processing to fill the substrate fully. It is to cut. This is because the substrate is flattened and balanced by blowing out and sucking air before and after the cutting process, and the gas jet is flown in a state where the floating height and apparent spring rigidity are increased. By intensively spraying the half-cut back surface, a part of the substrate is expanded, internal stress is applied to this part, cracks are formed inside the glass along the planned processing line, and it grows The substrate is fully cut in a place where the stress is partially increased and the laser processing is less affected. Thus, by performing the full cut at a place different from the laser processing, there is an effect that the influence of the processing residue generated during the full cutting of the substrate on the laser processing can be minimized.

  The first feature of the substrate processing apparatus according to the present invention is that a predetermined processing is performed on the substrate by irradiating a laser beam onto the substrate surface drawn from the roll-shaped substrate wound in a roll shape. In the substrate processing apparatus, a laser that irradiates the substrate with the laser beam while moving the substrate at a predetermined speed according to a processing line of the substrate, and controls heat generated by the irradiation of the laser beam according to a wavelength and a pulse interval of the laser beam. The irradiation means is provided. This is an invention of a substrate processing apparatus that realizes the first feature of the substrate processing method.

  According to a second feature of the substrate processing apparatus of the present invention, in the substrate processing apparatus according to the first feature, the laser irradiating means includes the substrate surface, the processing head, and the like based on reflected light from the substrate surface. The relative distance between them is moved while following the surface of the substrate so as to be constant. This is an invention of a substrate processing apparatus that realizes the second feature of the substrate processing method.

  According to a third feature of the substrate processing apparatus of the present invention, in the substrate processing apparatus according to the first or second feature, the laser irradiation means includes a plano-convex lens means provided on the path of the laser light, and The beam expander means transforms the laser light into a circular beam of a prescribed size and irradiates the substrate surface so that the optical axis of the laser light matches the planned processing line. This is an invention of a substrate processing apparatus that realizes the third feature of the substrate processing method.

  According to a fourth aspect of the substrate processing apparatus of the present invention, in the substrate processing apparatus according to the first, second, or third feature, a mixture of a cooling medium that is a liquid and a carrier gas is added to the substrate surface. A cooling means is provided for cooling the processed surface portion of the substrate by spraying an appropriate amount, generating stress effective for cleaving, and removing processing gas and residues generated in the vicinity of the processing. This is an invention of a substrate processing apparatus that realizes the fourth feature of the substrate processing method.

  According to a fifth aspect of the substrate processing apparatus of the present invention, in the substrate processing apparatus according to the first, second, third, or fourth feature, air is blown from an upper surface of a stage unit that conveys the substrate. In a state where the substrate is floated by balancing the suction and the apparent spring rigidity is increased, a gas jet is blown from the back side of the planned processing line of the substrate half-cut by a predetermined processing to fill the substrate fully. The substrate cutting means for cutting is provided. This is an invention of a substrate processing apparatus that realizes the fifth feature of the substrate processing method.

  The panel manufacturing method according to the present invention is characterized by the substrate processing method according to the first, second, third, fourth, or fifth feature, or the first, second, third, fourth, or fourth feature. A display panel is manufactured using the substrate processing apparatus described in the fifth feature. In this method, a display panel is manufactured using any one of the substrate processing method and the substrate processing apparatus.

  According to the present invention, there is an effect that deformation of the substrate due to thermal diffusion in the substrate caused by laser irradiation can be prevented, half-cut cutting / cleaving can be performed, and subsequent conveyance can be handled well.

1 is a diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention. It is the bird's-eye view which looked at the process area part of FIG. 1 which performs a laser processing from diagonally upward. It is a figure which shows schematic structure of the optical system with a local cooling nozzle of FIG.1 and FIG.2, and is the figure which looked at this optical system with a local cooling nozzle from the X direction of FIG.1 and FIG.2. It is the side view which looked at the optical system with a local cooling nozzle of Drawing 3 from the Y direction. It is a figure which shows the movement state of the optical system with a local cooling nozzle which moves at the time of laser processing, and is the side view which looked at the optical system with a local cooling nozzle of FIG. 3 from the Y direction. It is a figure which shows the modification of an optical system with a local cooling nozzle. It is a figure which shows the concept of the process stabilization method of a board | substrate processing apparatus. It is a figure which shows schematic structure of the modification of the substrate processing apparatus which concerns on one embodiment of this invention. It is a figure which shows the modification of the optical system with a local cooling nozzle of FIG. It is a figure which shows the outline of the function which fully cuts the board | substrate half-cut, and is the side view which looked at a part of process area part of FIG. 1 or FIG. 8 from the X direction. It is a figure which shows the modification of the board | substrate processing apparatus carrying the function which fully cuts the half-cut board | substrate of FIG. It is a figure which shows schematic structure of another modification of the substrate processing apparatus which concerns on one embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention. This substrate processing apparatus sequentially pulls out a glass substrate from the end surface of a roll-shaped substrate body wound in a roll shape, performs laser light processing (glass substrate cutting processing) of a liquid crystal display manufacturing apparatus, and glass after processing The substrate is wound again as a rolled substrate. The rolled substrate body after the processing is transported to another processing place or the like, where full cut processing is performed.

  The laser processing station 101 performs cutting or cleaving (half-cut) processing and scribing on the glass substrate 1 drawn out from the end face of the roll-shaped substrate body 15. The laser processing station 101 includes a gripper unit 106, a gripper support driving unit 110, and a processing area unit 112. The gripper unit 106 holds air by suction on one side (the lower side of the glass substrate 1 in FIG. 1) along the conveying direction of the glass substrate 1 subjected to the alignment process. The gripper support driving unit 110 synchronizes the glass substrate 1 held by the gripper unit 106 with the laser light of the processing area unit 112 and moves the glass substrate 1 during laser processing. The glass substrate 1 is conveyed from an upstream process in a state of being cut into a mother glass size, and after being positioned by the glass end face, it is cut or cleaved to a specified size. In addition, although the ball screw, a linear motor, etc. are used for the gripper support drive part 110, these illustration is abbreviate | omitted. Although FIG. 1 shows a case where the gripper unit 106 and the gripper support driving unit 110 exist only on one side of the glass substrate 1, they are provided on both sides of the glass substrate 1 so as to adsorb both sides of the glass substrate 1. It may be.

  In synchronization with the movement of the glass substrate 1, the processing area unit 112 performs predetermined cutting or cleaving processing by irradiating the glass substrate 1 held by the gripper unit 106 and conveyed by air floating with laser light. In the figure, a state is shown in which the glass substrate 1 held by the gripper unit 106 is subjected to predetermined processing while being moved to the position of the glass substrate 1 indicated by a dotted line in a state of air floating.

  The processing here is performed as follows. The glass substrate 1 drawn from the end surface of the roll-shaped substrate body 15 conveyed from the apparatus serving as the previous processing stage is aligned at the laser processing station 101 by mechanical or image processing (not shown). . The glass substrate 1 that has been subjected to the alignment process with a predetermined one side as a reference is held by the gripper unit 106, and is moved as the glass substrate 1 by the air levitation stages 9 to 13 in the processing area unit 112, and is subjected to predetermined cutting or cutting. Processing is performed. When the laser processing for the glass substrate 1 held by the gripper unit 106 is completed, the glass substrate 1 held by the gripper unit 106 is wound again as a roll-shaped substrate body (processed roll-shaped substrate body) 16. Then, it is transported to the next processing device (full cut device or the like).

  Conventionally, processing is performed in a state where the entire back surface of the glass substrate 1 is supported by a sucked stage. Therefore, the thinner the substrate is, the closer the focus surface and the support stage surface are, and the processing beam is used to process the stage even during laser processing. As a result, the stage surface is swelled or line-shaped damaged, and there is a risk of causing poor adsorption over time. In this embodiment, in order to prevent this, the divided air levitation stages 9 to 13 installed in the processing area part are used, and a space is provided on the back side of the glass substrate 1, that is, a space below the laser processing area. I am doing so. In addition, the floating state is stabilized by blowing out air from the ejection holes of the air levitation stages 9 to 13 and sucking air into the suction holes, the air flow is controlled, and the flatness and posture of the glass substrate 1 at the time of levitation We are trying to stabilize. That is, the glass substrate 1 is levitated and restrained by an appropriate distribution of air ejection holes and air suction holes provided on the upper surfaces of the air levitation stages 9 to 13. In addition, since an air flow is generated in a gap portion formed between the air levitation stages 9 to 13, the posture of the glass substrate 1 can be kept stable. Further, in the processing area, the gap at the center portion traps excess laser light during processing and enables removal of processing residues by suction.

  The air levitation stages 9 to 13 can stabilize the floating state of the glass substrate 1 by blowing and sucking air. Moreover, since the processing area part 112 between the air levitation stages 9 to 13 forms a gap, the air flow can be controlled and the posture of the glass substrate 1 can be stabilized. In particular, when the thin and transparent glass substrate 1 is mounted on the stage support surface, the signal determination on the upper surface of the glass substrate 1 may be affected by the reflection signal from the suction stage, and stable focus may not be applied. In the case of the support method using the air levitation stages 9 to 13, the right and left or only one side is adsorbed and moved, and the back surface is supported by the air flow to become a space, so that there is no effect of disturbance affecting the focus signal.

  A laser head 20, a laser shutter 21, an attenuator 22, tracking mirrors 23 and 24, and an optical system 30 with a local cooling nozzle are provided above the processing area portion 112. Each of these components is provided on a base member (not shown), and the optical system 30 with a local cooling nozzle is controlled to move in the Z direction (vertical direction) by a moving member (not shown). ing. Laser light generated by the laser head 20 is introduced into the optical system 30 with a local cooling nozzle by a laser shutter 21, an attenuator 22, and tracking mirrors 23 and 24. The attenuator 22 is a power adjustment optical system that variably attenuates the laser light power. The laser shutter 21 shields the emission of laser light when the laser light is detached from the glass substrate 1. The tracking mirrors 23 and 24 guide the laser beam emitted from the laser head 20 to a predetermined position.

  FIG. 2 is a bird's-eye view of the processing area portion of FIG. 1 that performs laser processing as viewed obliquely from above. The local cooling nozzle-equipped optical system 30 guides the introduced laser beam onto a planned processing line on the glass substrate 1. The substrate plate thickness measuring unit 50 adjusts the initial height at the time of cutting by measuring the thickness of the glass substrate 1. The laser beam from the laser head 20 is scanned along the planned processing line with the end of the glass substrate 1 as a starting point, and half-cut cutting or cleaving is executed. As shown in FIG. 2, the local cooling nozzle-equipped optical system 30 is provided so as to cover the upper side of the gap between the opposed portions of the air levitation stages 9 to 13. The local cooling nozzle-equipped optical system 30 includes a moving optical system that moves in accordance with the movement of the laser light in the X direction.

  FIG. 3 is a diagram showing a schematic configuration of the optical system with a local cooling nozzle in FIGS. 1 and 2, and is a view of the optical system with a local cooling nozzle as viewed from the X direction in FIGS. 1 and 2. 4 is a side view of the optical system with a local cooling nozzle in FIG. 3 as viewed from the Y direction. FIG. 5 is a diagram showing a moving state of the optical system with a local cooling nozzle that moves during laser processing, and is also a side view of the optical system with a local cooling nozzle in FIG. 3 viewed from the Y direction. 3, 4, and 5, the casing of the optical system 30 with the local cooling nozzle is indicated by a dotted line. In FIG. 3, the air levitation stages 9 and 13 are omitted. The glass substrate 1 drawn out from the end face of the roll-shaped substrate body 15 reads the thickness change by the substrate plate thickness measuring unit 50 on the upstream side, and feeds back an approximate AF fluctuation value to the optical system height by the read value. . The substrate is adsorbed by the substrate adsorbing gripper portion 106 provided on either one of the left and right sides, but by adding a groove to the adsorbing pattern on the upper surface, the adsorption surface can be prevented from being laser processed. Half-cut processing is performed on the glass substrate 1 in a state of being levitated by the air levitation stages 9 to 13. The substrate suction gripper portions 106 may be provided on both the left and right sides of the glass substrate 1.

  The optical system 30 with a local cooling nozzle includes a beam expander 31, a processing head 32, a plano-convex lens (condensing lens) 33, and a local cooling nozzle 36. The beam expander 31, the processing head 32, and the plano-convex lens (condensing lens) 33 move in the X direction on the optical system 30 with a local cooling nozzle in accordance with the movement of the tracking mirror 24. The beam expander 31 expands the laser light emitted from the laser head 20 and incident from the tracking mirror 24 into an elliptical beam spot shape along the moving direction, and a plano-convex lens (collector) in the processing head 32. Optical lens) 33 is introduced. A plano-convex lens (condensing lens) 33 in the processing head 32 forms an image of the enlarged laser beam on the glass substrate 1.

  A laser type distance sensor 37 is attached to the processing head 32, and the processing head 32 is controlled to move up and down so that the initial focus of the plano-convex lens (condensing lens) 33 is focused on the surface of the glass substrate 1. . The laser type distance sensor 37 includes a detection light irradiation laser and an autofocus photodiode, and receives reflected light reflected from the surface of the glass substrate 1 among the light irradiated from the detection light irradiation laser. The distance between the lower end of the processing head 32 and the surface of the glass substrate 1, that is, the height of the processing head 32 is measured according to the amount of reflected light. That is, the substrate processing apparatus measures a distance between the glass substrate 1 and the processing head 32, that is, a change in height, using a laser distance sensor 37 installed beside the processing head 32 for laser cutting. The distance between the glass substrate 1 and the laser cutting head 32 is adjusted to the optimum height according to the height data, and a brittle substrate such as the glass substrate 1 or a plastic resin is half-cut or full-cut. It is comprised so that it may perform.

  In the processing area part 112, the height change of the glass substrate 1 is measured by the laser type distance sensor 37 installed beside the processing head 32, and the glass substrate 1, the processing head 32, and the like are measured based on the measured height data. The glass substrate 1 is cut while adjusting the distance to an optimum height. That is, in this embodiment, the height variation of the glass substrate 1 at the processing start portion is measured by the laser distance sensor 37 installed beside the processing head 32, and the processing width by the processing beam is determined based on this measurement result. The focus position is optimized.

  In the substrate processing apparatus according to this embodiment, when the surface of the glass substrate 1 is not completely flat, that is, by being pulled out from the roll-shaped substrate body 15, there are fluctuations such as waviness on the upper surface of the glass substrate 1, The height range of the processing head 32 is appropriately determined according to the focal depth of the optical system 30 with the local cooling nozzle, and the distance between the surface of the glass substrate 1 and the detection optical system is set to be optimum. At the time of laser processing, the focus position can be adjusted and the position to the cooling nozzle can be adjusted according to the monitoring result of the processing beam. Similarly to the time when processing is started, the deformation data may be used to move to a processable height while following the upper surface deformation of the glass substrate 1. By following the deformation of the upper surface of the glass substrate 1 in advance, it is not necessary to measure the height distance as the machining beam moves. However, when the flatness of the surface of the glass substrate 1 is changed by processing, it is preferable to always measure the height distance as the processing beam moves. Further, by measuring the laser spot diameter, it is possible to measure the height distance, and it is possible to reduce the time fluctuation to the cooling position during processing and to prevent the processing head from contacting.

  Note that the focus adjustment in this case may be vertically controlled by the entire processing head 32, or only the plano-convex lens (condensing lens) 33 may be vertically controlled. By making the plano-convex lens (condensing lens) 33 operable independently, it is possible to satisfactorily follow the partial deformation of the glass substrate 1. In addition, when there is little partial deformation | transformation of the glass substrate 1, only the structure which operates the whole process head 32 may be sufficient. The local cooling nozzle 36 is attached to the side surface of the processing head 32 and diffuses and blows a cooling gas (refrigerant) such as air or nitrogen to a processing position by laser light. The local cooling nozzle 36 mixes a cooling medium that is a liquid and a carrier gas, and sprays an appropriate amount so as to cool the processed surface portion of the glass substrate 1 and generate stress effective for cutting or cleaving. It has become. Note that a low temperature gas may be ejected and sprayed in an appropriate amount. Processing residues can be efficiently removed by such gas spraying.

  The pulse laser emitted from the laser head 20 has a processed part due to the nonlinear effect by focusing even if the absorption characteristic of the substance due to the wavelength is poor, and if this processed part is formed, the refractive index and the absorption characteristic are increased. The half cut line processing by the laser beam becomes possible. By optimizing the pulse interval and repetition frequency of the processing laser, heat generation during processing is limited to the vicinity of the half-cut line. Thereby, the diffusion heat by the heat_generation | fever at the time of the process by a laser beam is controlled, and the deformation | transformation of the glass substrate 1 by the heat to diffuse is prevented. When a thin glass substrate 1 having a thickness of 100 [μm] or less is fully cut by laser beam processing, thermal deformation and embrittlement of the glass substrate 1 are caused by thermal diffusion to the periphery only by heating and cooling by laser beam irradiation. Since it also proceeds to the periphery, good processing could not be obtained. Therefore, in this embodiment, even at wavelengths with poor absorption characteristics, the pulse interval of the short pulse laser and the repetition frequency are matched to control the heat generation during substrate processing, and the heat to diffuse is controlled only near the half-cut line. This prevents deformation of the glass substrate 1 due to thermal diffusion during processing.

  FIG. 6 is a diagram showing a modification of the optical system with a local cooling nozzle. The optical system according to this modification is newly provided with a laser diode 40, a collimator lens 41, a projection mask pattern 42, a projection quarter-wave plate (λ / 4 wavelength plate) in addition to the optical systems shown in FIGS. ) 43, a position adjusting means including a quarter-wave plate 44 for processing laser, polarizing beam splitters 45 and 46, stray light plates 47 and 48, and a CCD camera 49. In FIG. 6, since the same code | symbol is attached | subjected to the thing of the same structure as FIG. 3, the description is abbreviate | omitted.

  The laser beam that is emitted from the laser diode 40 includes a collimator lens 41, a projection mask pattern 42, a projection quarter-wave plate 43, a processing laser quarter-wave plate 44, polarizing beam splitters 45 and 46, The surface of the glass substrate 1 is irradiated through a plano-convex lens (condensing lens) 33 of the processing head 32. The laser beam reflected by the surface of the glass substrate 1 again passes through the plano-convex lens (condensing lens) 33 in the processing head 32 and is returned to parallel light, and passes through the polarization beam splitter 46 and the polarization beam splitter 45. The light enters the CCD camera 49. Since the reflected light passes through the processing laser quarter-wave plate 44 twice, the phase is shifted by λ / 2, so that it does not return to the processing light source side (the direction of the tracking mirror 24). Since the transparent glass also reflects 4 to 10% depending on the wavelength, the reflected light can be used with sufficient intensity if the laser light has a high power density.

  An imaging lens is disposed on the front surface of the CCD camera 49 in order to form a projected image of the glass substrate 1. The combination of the projection quarter-wave plate (λ / 4 wavelength plate) 43, the processing laser quarter-wave plate 44, and the polarization beam splitters 45 and 46 depends on the intensity of the laser beam. A half mirror or the like can also be used. Since the reflected light reflected from the surface of the glass substrate 1 passes through the projection quarter-wave plate 43 and the processing laser quarter-wave plate 44 twice, the phase is shifted by λ / 2 as described above. It does not return to the processing light source side. The stray light plates 47 and 48 prevent the light transmitted through the polarization beam splitters 45 and 46 from affecting others.

  6 has a structure in which the machining head 32 can be driven in the vertical direction (Z direction) by a drive system such as a motor. As the processing head 32 moves up and down by the drive system, the diameter of the laser beam changes on the surface of the glass substrate 1, and the position where the diameter is minimized is set as the imaging position. In the conventional cutting of the glass substrate 1 by laser light, the glass substrate 1 is fixed on the table by suction or the like, and the stage is moved in the X and Y directions to cut a predetermined position. Even if the glass substrate 1 is fixed, a minute deformation due to conveyance may remain, so the distance to the surface of the glass substrate 1 is measured by a laser distance sensor 37 (triangulation type). The focal position is moved from the surface of the glass substrate 1 to a predetermined depth according to the minutely deformed shape of the glass substrate 1 to accurately follow the surface shape.

  On the other hand, since the beam shape for laser processing is circular, the glass processing surface temperature of the heating part may be different and unstable because there is undulation of the glass surface where the projected beam shape is focused. . For this reason, the position adjustment means of FIG. 6 is used to measure the shape of the irradiated and reflected beam with the CCD camera 49, and to adjust the overall height, and a focal coarse adjustment mechanism and an optical system for adjusting the processing portion. A fine focus adjustment mechanism for fine movement stabilizes the processing depth and position and stabilizes the depth of the high temperature portion. That is, a CCD camera 49 that monitors the reflected image on the laser optical axis by previously obtaining the optimum processing conditions based on the relationship between the power of the laser light source and the spot area (diameter) of the laser light, the thickness of the glass substrate, and the glass material. The optimal distance is calculated from the beam size projected on the glass substrate 1 and adjusted to the height that can be processed by coarse movement (the focus position is adjusted), and the distance between the maximum surface temperature position and the cooling position Cutting of the glass substrate 1 is realized. Monitor the beam shape during processing, adjust the height of the entire optical system so that the entire beam becomes the specified size, and from the ratio of the beam diameter to the entire screen size, the average position of the specific height relative to the cooling part, Good processing can be performed by adjusting the height of the optical component so as to stabilize the distance.

As a light source used for laser processing, a YAG laser, an Nd: YVO ₄ laser (second harmonic, third harmonic) or a titanium sapphire laser having a low heat absorption rate for glass is used. That is, the origin of the moving mechanism for moving the processing head 32 up and down is set in a direction away from the glass substrate 1 (upward), and moved from the top to the bottom, thereby constantly monitoring the image from the CCD camera 49 and specifying the beam. It is possible to control the focus position at a specific location by providing a window at the ratio location and measuring its width. Further, when the focus is lost, it is possible to prevent contact with the glass substrate 1 by always moving the focus in the direction of the origin. Using this function, the glass substrate can be automatically moved to a focus position with a specific depth fixed.

  In the modification of FIG. 6, the entire processing head 32 serving as a cutting optical head can be driven in the vertical direction using a driving means such as a motor, and the beam size on the surface of the glass substrate 1 changes according to the vertical movement. The position where the beam diameter is minimized is the in-focus position. The back surface of the glass substrate 1 is supported by the air levitation of the air levitation stages 9 to 13. The deviation of the beam diameter projected on the surface of the glass substrate 1 from the reference is adjusted according to the height calculation. By moving, the distance from the glass substrate 1 can be made substantially the same height. Further, by providing an image processing window on the screen of the CCD camera 49, the distance to the cooling position can be made constant from a specific ratio position of the beam, and an optical system and a cooling system that provide stable cutting conditions can be constructed. it can.

  By making the suction pad of the gripper portion 106 that sucks the vicinity of the edge of the glass substrate 1 into a substrate, the substrate can be processed so that the suction surface does not fall on the expected processing line when cutting a large number of substrate sizes. It is possible to reduce the damage to the suction pad of the gripper unit 106. Also, if the beam width in the focused state is registered in advance as the overall size, it is possible to determine whether there is an abnormality in the cutting optical head or stage by associating the determination of whether it is in the imaging state with the position of the vertically moving stage of the cutting optical head. Can be used to determine As a glass cutting method, by providing a rotation mechanism for aligning the direction of the processing head 32 (cutting optical head), it is possible to detect and correct a deviation from the processing scheduled line. Further, a mechanism capable of rotating the plano-convex lens (condensing lens) 33 in any direction is provided, and the direction of the laser light (beam) can be corrected based on the screen of the CCD camera 49 so as to be a predetermined direction. You may do it. The gripper portion 106 can be prevented from deformation during processing by contacting the glass substrate 1 at a specified height, and the height thereof can be adjusted, so that many materials and plate thicknesses of the glass substrate 1 can be adjusted. Can be easily accommodated.

  The configuration in FIG. 6 is an example, and laser beams may be put in parallel on the coaxial optical path to create a laser processing beam shape on the glass substrate 1. It is possible to use a plano-convex lens (condensing lens) for beam shaping and change the processing width and processing depth arbitrarily by changing the focal length of each plano-convex lens (condensing lens) and the distance between the brittle substrate. Good. The shape of the beam being processed is monitored, and the overall height of the optical system 30 is adjusted so that the entire beam has a specified size. Good cutting or cleaving can be performed by adjusting the height of the optical component so that the jetting distance is stabilized with respect to the cooling position of the average position of the specific position from the ratio of the entire beam.

  FIG. 7 is a diagram showing the concept of the processing stabilization method of the substrate processing apparatus. FIG. 7A shows an example of an observation screen of the CCD camera 49 of FIG. 6, and FIG. 7B is a diagram showing the concept of the beam shape in the depth direction of the glass substrate and the laser beam. In FIG. 7A, the upper small circle 49a is the spot of the laser beam at the processing time, and the lower dotted circle 49b is the spot area irradiated with the laser beam at the previous processing time. The laser beam can be irradiated intermittently on the pulse, and the moving speed of the processing head 32 and the laser transmission frequency are adjusted, so that the small circle 49a and the dotted circle 49b overlap each other under certain conditions. Processing. Thereby, the processing temperature inside the glass substrate 1 can be stabilized. Furthermore, by overlapping the laser beams, there is an effect of reducing the thermal influence and stabilizing the cut or cleaved portion. Although not shown in the figure, a cylindrical lens is used for an elliptical or slit beam, so that one of the X and Y directions can be set to an optimum width. By optimizing, the same effect can be obtained.

  Further, since the laser beam that has passed through the plano-convex lens (condensing lens) 33 is focused, it is known that the spot size changes according to the height direction. That is, as shown in FIG. 7B, the diameter of the laser light that has passed through the plano-convex lens (condensing lens) 33 gradually changes in proportion to its height. And it comes to focus on the focal point position in the glass substrate 1. That is, the height of the machining head 32 is adjusted so that the diameter at the in-focus position (focus plane) is minimized. Note that the diameter of the laser beam gradually increases as it goes downward from the in-focus position. Therefore, the spot diameter of the laser beam on the surface of the glass substrate 1 is detected, and the focal spot position (focusing surface) of the plano-convex lens (condensing lens) 33 is determined based on the spot diameter at the time of focusing at the registered lens magnification. ) Is controlled to be a predetermined position in the glass substrate 1.

  As shown in FIG. 7A, the height of the processing head 32 relative to the glass substrate 1 is indirectly detected based on the spot diameter of the laser beam on the observation screen of the CCD camera 49, and the processing head 32 detects the glass substrate 1. Can be prevented from touching. Further, by monitoring the diameter of the laser beam during processing, the focus position can be adjusted and the jet position of the cooling nozzle can be adjusted. Similarly to the time of starting processing, the deformation data can be used to move to a processable height according to the deformation of the upper surface of the substrate. This eliminates the need to measure the height distance associated with the movement, and by measuring the laser spot diameter, it is possible to reduce the time variation to the cooling position during processing and to prevent contact of the processing head.

  FIG. 8 is a diagram showing a schematic configuration of a modified example of the substrate processing apparatus according to one embodiment of the present invention. In FIG. 8, the same components as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted. The substrate processing apparatus in FIG. 8 is different from that in FIG. 1 in that a ride guide fiber 27 is used to introduce laser light from the attenuator 22 to the optical system 30 with a local cooling nozzle. The ride guide fiber 27 includes an incident collimating lens and an outgoing collimating lens. By using the ride guide fiber 27, laser light can be easily introduced into the moving optical system 30 with the local cooling nozzle.

  FIG. 9 is a diagram showing a modification of the optical system with a local cooling nozzle in FIG. In FIG. 9, the same components as those in FIG. 3 are denoted by the same reference numerals, and the description thereof is omitted. The optical system with a local cooling nozzle in FIG. 9 is different from that in FIG. 3 in that a gas flow method is employed that prevents the processing hindrance caused by cooling around the processing portion during processing and residual picking generated during processing. The blow nozzles 81 and 82 are provided on both lower sides of the processing head 32, pass through the processing head 32 from the upper part of the processing head 32 above the condenser lens 33, and glass from the lower opening of the processing head 32. A flow of airflow that flows toward the substrate 1 is created. By this air flow, removal of processing residues, cooling of the temperature around the processing, and contamination due to sublimation gas adhering to the condenser lens 33 are prevented, and residues rising in the direction of the condenser lens 33 are removed. Yes. Further, regarding the temperature fluctuation caused by the laser of the condensing lens 33, the condensing distance is stabilized by adjusting the gas temperature at a constant temperature.

  The blow nozzle 83 allows gas to flow on the surface of the glass substrate 1 near the processing, thereby cooling the surface of the glass substrate 1 around the processing portion and removing processing gas and residues generated at the processing tip. The suction duct 84 sucks the processing gas and residues removed from the surface of the glass substrate 1 by the blow nozzle 83 and discharges them to the outside. The suction ducts 85 and 86 are installed on both sides of the glass substrate 1 and in a gap between the air levitation stage 11 and the air levitation stages 10 and 12. The suction ducts 85 and 86 suck the entire residue moving on the upper surface of the glass substrate 1, thereby preventing the residue from being accumulated near the processing portion of the substrate processing apparatus. Although the blow nozzles 81 and 82 and the blow nozzle 83 are provided separately, when the distance between the processing head 32 and the condenser lens 33 and the glass substrate 1 is small, the blow nozzles 81 and 82 function as the blow nozzle 83. Can also be shared. The suction ducts 85 and 86 may be provided over the entire gap between the air levitation stage 11 and the air levitation stages 10 and 12, or when the substrate processing apparatus half-cuts the glass substrate 1, It may be provided on both sides of the air levitation stages 9 to 13. In this way, a predetermined interval is provided between each of the air levitation stages 9 to 13, a space is formed under the processing area 112, and suction ducts 85 and 86 are disposed therein, thereby processing residues. Can be efficiently removed by suction. A plurality of configurations using such suction ducts 85 and 86 may be configured in accordance with the number of processing heads in order to reduce tact time. Further, the configuration using the blow nozzles 81 and 82 can create a flow of airflow in the condenser lens 33, and removes processing residues, cools the processing ambient temperature, and generates sublimation gas during processing of the condenser lens 33. Dirt due to adhesion can be efficiently prevented.

  FIG. 10 is a diagram illustrating an outline of a function of full-cutting a half-cut substrate, and is a side view of a part of the processing area portion viewed from the X direction. The laser beam from the laser head 20 of the substrate processing apparatus is scanned along the planned processing line to form a half-cut scribe line 1a. FIG. 10A shows a state where the half-cut scribe line 1a is positioned between the air levitation stages 12 and 13 in the processing area. Since the glass substrate 1 is floated by the air levitation stages 12 and 13 and is sandwiched between the air levitation stages 12 and 13, the glass substrate 1 is constrained with a high spring constant. The air ejection part 60 includes a nozzle that blows an air jet against the half cut line of the upper glass substrate 1 from the lower side of the gap between the air levitation stages 12 and 13. In this board | substrate processing apparatus, the air ejection part 60 sprays an air jet from the back surface of the glass substrate 1 with respect to the location where the scribe line 1a by which the half cut process existed. When the air jet part 60 blows the air jet, a part of the corresponding part of the glass substrate 1 swells upward, and internal stress is applied to this part, and along the scribe line 1a of the part to be cut, inside the glass substrate 1 When the crack is formed and grows, the glass substrate 1 is cut along the scribe line 1a. In addition, the air ejection part 60 is installed below the gap between the air levitation stages 12 and 13, and it moves in the X direction. In addition, a plurality of air ejection portions 60 may be arranged in the X direction below the gap between the air levitation stages 12 and 13, or the plurality of air ejection portions 60 may be configured to move in the X direction. Good.

  FIG. 11 is a diagram showing a modification of the substrate processing apparatus equipped with a function of full-cutting the half-cut substrate of FIG. FIG. 11 shows an outline of the deformed portion corresponding to FIG. In FIG. 11, the same components as those in FIG. 3 are denoted by the same reference numerals, and the description thereof is omitted. The substrate processing apparatus of FIG. 11 is different from that of FIG. 3 in that an air jet part 60 that blows an air jet against the upper glass substrate 1 from the lower side of the gap between the air levitation stages 12 and 13 and the divided glass. It is a point provided with the conveyance robot 70 which carries out the board | substrate 1c in the glass storage pallet 75. FIG. The air ejection part 60 sprays an air jet from the back surface of the glass substrate 1 to the location where the scribe line 1a subjected to the half cut process exists, and divides the glass substrate 1 as the glass substrate 1c. The divided glass substrate 1c is moved in the Y direction on the air levitation stages 12 and 13 by the gripper unit 106 so as not to be broken, and is transported directly below the transport robot 70. The transfer robot 70 holds the glass substrate 1 c by suction suction means and carries it out into the glass storage pallet 75. The substrate processing apparatus of FIG. 11 continuously executes such an operation, and sequentially stores glass substrates 1c of a predetermined size in the glass storage pallet 75. Note that a suction duct as shown in FIG. 9 may be disposed in the gap between the air levitation stages 12 and 13 to efficiently discharge dust generated when the glass substrate is cut. Note that a blow nozzle 83 and a suction duct 84 as shown in FIG. 9 may be provided on the upper part of the air ejection part 60 to absorb the residue generated at the time of cutting and discharge it to the outside. Further, a suction duct as shown in FIG. 9 may be provided on the upper surface side of the glass substrate 1 so as to be associated with the air ejection portion 60, so that residues generated at the time of division may be sucked and discharged to the outside. Further, a processing device that fully cuts the processed roll-shaped substrate body 16 by disposing the processed roll-shaped substrate body 16 in place of the roll-shaped substrate body 15 and omitting the air levitation stage 11 and its upper optical system. Can be configured.

  FIG. 12 is a diagram showing a schematic configuration of another modified example of the substrate processing apparatus according to one embodiment of the present invention. In FIG. 12, the same components as those in FIG. The substrate processing apparatus in FIG. 12 differs from that in FIG. 1 in that the air levitation stage 11 in FIG. 1 is omitted, and the laser beam passes through the division between the air levitation stages 10 and 12, and processing is performed at that division. It is the point which comprises. Another difference is that the air levitation stages before and after the air levitation stages 10 and 12 are constituted by three divided air stages. The glass substrate 1 is floated and restrained by the air jets and the distribution of the suction holes on the upper surfaces of the air levitation stages 10 and 12, but the air flow is also generated in the central gap portion that becomes the division. The attitude of the glass substrate 1 can be kept stable. In addition, since the air levitation stage outside the air levitation stages 10 and 12 is also divided, the air flow can be effectively generated from the respective divided spaces, and the processing residue and the like can be efficiently discharged. There is. Similarly, in the substrate processing apparatus of FIG. 8, processing may be performed at a break of the air levitation stage.

  An example of the operation of the substrate processing apparatus according to this embodiment will be described. First, the glass substrate 1 drawn out from the end surface of the roll-shaped substrate body 15 wound in a roll shape is conveyed onto the air levitation stages 9 to 10 with at least one side adsorbed by the gripper unit 106. Immediately before the glass substrate 1 is transported to the processing position, the initial height of the processing head 32 is corrected based on the thickness of the glass substrate 1 measured by the substrate plate thickness measuring unit 50. After changing the height of the processing head 32 according to the thickness of the glass substrate 1, the glass substrate 1 is moved in the Y direction. The laser type distance sensor 37 is moved in a right angle direction (X direction) with respect to the glass substrate moving in the Y direction, and the displacement of the glass substrate 1 on the processing line is measured. By measuring the entire transition of the glass substrate 1, it is possible to minimize a portion where autofocus is impossible. After the measurement of displacement is completed, the glass substrate 1 is moved to a predetermined processing position between the air levitation stages 10 and 12. Further, the displacement of the glass substrate 1 at the time of processing is measured by the above-described position adjusting means, the height of the processing head 32 is set to the optimum condition, and the focus is adjusted to a predetermined height with respect to the surface of the glass substrate 1. To. Further, the position adjusting means adjusts the height of the processing head 32 so that the beam state of the laser light becomes a predetermined size, thereby giving laser light at a short interval and half-cutting the glass substrate 1. Furthermore, the processing state of the glass substrate 1 can be stabilized by monitoring the beam projection pattern of the irradiation laser light by the position adjusting means. In the case of an extremely thin glass substrate 1, when the half-cut cutting or cleaving process is completed, the processed glass substrate 1 is wound again as a processed roll-shaped substrate body 16 and conveyed to another processing place or the like. As shown in FIGS. 10 and 11, the glass substrate 1 is divided by the air jet flow from the air ejection portion 60, and then moved in the Y direction by the gripper portion 106 so that the glass substrate 1 is not damaged. The glass substrate 1 divided as shown in FIG. 5 may be carried out into the glass storage pallet 75 using the transfer robot 70 or the like. Since the gripper section 106 adsorbs the end portion in a state where the glass substrate 1 is floated by the air levitation stage 12, it can be carried out without applying extra stress to the divided glass substrate 1. In addition, when the process is cut into full cuts from the processed roll substrate 16 in the next process, it is also possible to transfer the leading portion of the glass substrate 1 and transport the cut glass substrate 1 with the same configuration. Is possible.

1, 1c ... glass substrate,
9-13 ... Air levitation stage,
101 ... Laser processing station,
106 ... gripper part,
110 ... gripper support drive unit,
112 ... processing area part,
15 ... Roll-shaped substrate body 16 ... Processed roll-shaped substrate body 1a ... Scribe line,
20 ... Laser head,
21 ... Laser shutter,
22 ... Attenuator,
23, 24 ... Tracking mirror,
27 ... Ride guide fiber,
30 ... Optical system with local cooling nozzle,
31 ... Beam expander,
32. Processing head,
33 ... Plano-convex lens (condenser lens),
36 ... Local cooling nozzle,
37 ... Laser distance sensor,
40 ... Laser diode,
41 ... Collimator lens,
42 ... projection mask pattern,
43 ... a quarter-wave plate for projection,
44... Quarter wave plate for processing laser,
45, 46 ... Polarizing beam splitter,
47, 48 ... stray light plate,
49 ... CCD camera,
50: Substrate plate thickness measuring section,
60 ... Air ejection part,
70 ... transfer robot,
75 ... Glass storage pallet,
81, 82, 83 ... blow nozzles,
84, 85, 86 ... suction duct

Claims (11)

The substrate drawn out from the roll substrate wound in a roll is irradiated while moving the laser beam relatively, and a cooling medium is blown near the processing after the movement of the laser beam. A substrate processing method for performing predetermined processing on a substrate surface by cooling a processing surface portion and generating stress effective for cleaving,
A substrate that irradiates the substrate while moving the laser beam at a predetermined speed according to a processing line of the substrate, and controls heat generated by the irradiation of the laser beam by a wavelength and a pulse interval of the laser beam. Inspection method.   The substrate processing method according to claim 1, wherein the substrate is moved while following the surface of the substrate so that a relative distance between the substrate surface and the processing head is constant based on reflected light of the substrate surface. A substrate processing method.   3. The substrate processing method according to claim 1, wherein the laser beam is deformed into a circular beam having a predetermined size by the plano-convex lens unit and the beam expander unit provided on the laser beam path, and the processing schedule is set. Irradiating the surface of the substrate so that the optical axis of the laser beam coincides with a line.   4. The substrate processing method according to claim 1, wherein the processing surface portion of the substrate is cooled by spraying an appropriate amount of a mixture of a cooling medium that is a liquid and a carrier gas to the surface of the substrate, and effective for cleaving. A substrate processing method characterized by generating a stress and removing a processing gas and residue generated in the vicinity of the processing.   5. The substrate processing method according to claim 1, wherein the apparent spring rigidity is increased by balancing the blow-out and suction of air from the upper surface of the stage means for transporting the substrate to float the substrate. In this state, the substrate is fully cut by blowing a gas jet from the back side of the planned processing line of the substrate half-cut by predetermined processing. In a substrate processing apparatus for performing predetermined processing on the substrate by irradiating a laser beam to the substrate surface drawn out from the roll-shaped substrate body wound in a roll shape,
Laser irradiation means is provided for irradiating the substrate with the laser beam while moving the substrate at a predetermined speed according to a processing line of the substrate, and controlling the heat generated by the irradiation of the laser beam by the wavelength of the laser beam and the pulse interval A substrate processing apparatus.   The substrate processing apparatus according to claim 6, wherein the laser irradiation unit is arranged on the surface of the substrate so that a relative distance between the substrate surface and the processing head is constant based on reflected light from the substrate surface. A substrate processing apparatus that moves while copying.   8. The substrate processing apparatus according to claim 6, wherein the laser irradiation means converts the laser light into a circular beam of a prescribed size by a plano-convex lens means and a beam expander means provided on the laser light path. A substrate processing apparatus that irradiates the surface of the substrate so that the optical axis of the laser beam coincides with the planned processing line while being deformed.   9. The substrate processing apparatus according to claim 6, 7, or 8, wherein the processing surface portion of the substrate is cooled and cleaved by spraying an appropriate amount of a mixture of a liquid cooling medium and a carrier gas onto the substrate surface. A substrate processing apparatus comprising a cooling means for generating effective stress and removing processing gas and residues generated near the processing.   10. The substrate processing apparatus according to claim 6, 7, 8, or 9, wherein the apparent spring rigidity is increased by floating the substrate by balancing air blowing and suction from the upper surface of the stage means for transporting the substrate. A substrate processing apparatus comprising: a substrate cutting unit that blows a gas jet from the back side of the planned processing line of the substrate that has been half-cut by predetermined processing in a state of being cut.   A display panel is manufactured using the substrate processing method according to claim 1, 2, 3, 4, or 5, or the substrate processing apparatus according to claim 6, 7, 8, 9, or 10. Substrate processing equipment.

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