JP2014013652A - Socket device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket device which can ensure the fixing between a socket body and a substrate and protect a substrate contact spring with a simple and small-sized structure.SOLUTION: A socket device 11 comprises a socket body 21 which is to be inserted into a substrate opening 23 formed on a printed wiring board 15 and to which a wedge bulb 13 is mounted; a flange 79 which is provided on the socket body 21 and which abuts on a substrate surface side 27 of the printed wiring board 15; substrate fixing protrusions 85 which are inserted to notches 25 formed on the substrate opening 23 at both ends in a diameter direction; bus bars 19 which are stored in the socket body 21 and conducting to lead wires 37 exposed on wedge bases 35; substrate contact springs 59 contacting a conductive face formed on a substrate rear side 29 with the socket body 21 being rotated against the printed wiring board 15; and bus bar storage grooves 39 formed on the substrate fixing protrusions 85 for storing the substrate contacting springs 59.

Description

  The present invention relates to a socket device suitable for use in mounting a lamp of a dieless mold such as a wedge bulb.

  A socket device to which a capless mold lamp such as a wedge bulb is mounted has a lamp mounting hole on the upper side of a bottomed cylindrical socket body made of an electrically insulating synthetic resin or rubber, and the outer periphery of the socket body. A flange portion projecting substantially uniformly from the wall is formed. Then, a lamp having a sealing portion (insertion portion) formed in the lamp mounting hole directly or via a metal plate connecting member (bus bar) is mounted, so that the lamp is held and electrically connected. (For example, refer patent document 1).

Such a socket device will be described with reference to FIGS.
As shown in FIG. 9, a lamp mounting hole 505 is formed in the socket body 503 of the socket device 501. A flange portion 507 is provided on the outer peripheral wall of the socket body 503, and the flange portion 507 has a protruding portion 509. The protruding portion 509 is formed along the outer peripheral wall of the socket body 503 and is cut and raised in the axial direction of the socket body 503 to have elasticity. A board portion 513 of a connection member (board contact spring) 511 is mounted in the lamp mounting hole 505. As shown in FIG. 9 and FIG. 10, the conductive terminal piece 515 is continuously formed on the board portion 513 and bent, and the conductive terminal piece 515 extends out of the socket body 503. A lampless lamp (wedge bulb) 519 having a lead wire 517 is mounted in the lamp mounting hole 505 and is held by the connection member 511.

  As shown in FIG. 11, the wiring board 521 is formed with a socket mounting hole (substrate opening) 523 having a substantially circular shape that is the same as the transverse section of the socket body 503, and a concave portion is formed on the opposite side of the socket mounting hole 523. A place 525 is formed. Further, a wiring conductor 527 is disposed on the surface around the socket mounting hole 523.

  The socket device 501 is attached to the socket mounting hole 523 in the wiring board 521 by gripping the knob portion 529 on the lower side of the socket main body 503 and from the back side of the wiring board 521 to the socket mounting hole 523 and the top of the mouthless lamp 519. And the recess 525 and the locking projection side of the socket main body 503 are aligned and entered. With this approach, the top of the dieless lamp 519 passes through the socket mounting hole 523 and is pushed in until the flange portion 507 contacts the back surface of the wiring board 521. When the contact is made, the socket body 503 is rotated to the right. The part 507 and the locking projection 531 are fixed with the wiring board 521 interposed therebetween.

  At this time, the projecting portion 509 that is cut and raised upward with respect to the flange portion 507 strongly presses against the back surface of the wiring substrate 521 and cooperates with the locking projection portion 531 to pinch the wiring substrate 521 so that the socket The device 501 is firmly fixed. At the same time, the conductive terminal piece 515 imparted with elasticity in the downward direction (flange portion 507) direction of the connection member 511 is repelled, and the contact portion 533 is strongly pressed against the wiring conductor 527 so that a reliable electrical connection is made.

JP 2005-243510 A

  However, in the socket device 501 described above, after the socket body 503 is assembled to the wiring board 521, the conductive terminal piece 515 is not completely covered with the locking projection 531 but exposed, so that the socket body 503 is exposed. When other members interfere, the conductive terminal piece 515 may be permanently deformed. If the structure for fixing the socket body 503, the structure for preventing deformation of the conductive terminal piece 515, and the structure for protecting the conductive terminal piece 515 are provided in an overlapping manner, the structure of the socket device 501 becomes complicated, and the socket device 501 is enlarged. There is a problem to do.

  The present invention has been made in view of the above situation, and an object of the present invention is to provide a socket device that can realize secure fixing between a socket body and a substrate and protection of a substrate contact spring with a simple and small structure.

The above object of the present invention is achieved by the following configuration.
(1) A socket body that is fitted with an insertion part of a mouthless mold lamp and is inserted into a board opening formed in the board, and a flange part that is provided in the socket body and abuts against the front side board surface of the board, A board fixing projection provided in the socket body and inserted into a notch formed in both end diameter directions of the board opening, and a lead wire stored in the socket body and exposed to the insertion part. A bus bar formed on the bus bar, a board contact spring formed on the back side board surface of the board by rotating the socket body with respect to the board, and a board fixing convex part. A socket device, comprising: a bus bar storage groove formed and accommodating the substrate contact spring.

  According to the socket device having the above configuration (1), when the socket body inserted into the substrate opening is rotated with respect to the substrate, the substrate fixing convex portion arranged corresponding to the notch portion is the back side substrate surface of the substrate. Is rotated along. When the board fixing convex part is separated from the notch part, the board is sandwiched from the front and back by the board fixing convex part and the flange part, and the socket body is fixed to the board. At this time, the board contact spring of the bus bar is deformed in a range protruding from the bus bar storage groove, and further deformation is avoided by immersing the bus bar storage groove. Moreover, since the part which protrudes from a bus-bar storage groove is contacted with the electrically conductive surface formed in the back side board | substrate surface of a board | substrate, most parts will be in the state covered with the board | substrate and the bus-bar storage groove. This prevents the deformation of the substrate contact spring due to interference of other members after the substrate is assembled.

(2) The socket device having the above configuration (1), wherein the bus bar storage groove is formed with a bus bar over-displacement preventing surface for restricting excessive displacement of the substrate contact spring. .

  According to the socket device having the configuration (2), when the socket main body is attached to the board opening of the board, if the board contact spring of the bus bar tends to be excessively displaced in the bus bar storage groove, Further displacement is restricted. As a result, permanent deformation of the substrate contact spring due to excessive displacement of the substrate contact spring does not occur in the bus bar storage groove.

  According to the socket device of the present invention, the board fixing convex part formed on the socket body can realize secure fixing between the socket body and the board and protection of the board contact spring with a simple and small structure.

  The present invention has been briefly described above. Further, the details of the present invention will be further clarified by reading through a mode for carrying out the invention described below (hereinafter referred to as “embodiment”) with reference to the accompanying drawings. .

1 is an exploded perspective view showing a socket device according to an embodiment of the present invention together with a substrate. It is a perspective view of the bus bar shown in FIG. It is a perspective view of the socket main body shown in FIG. (A) is assembly procedure explanatory drawing before insertion of a socket apparatus, (b) is the assembly procedure explanatory drawing which looked at (a) from the lower side. (A) is assembly procedure explanatory drawing in the middle of rotation of a socket apparatus, (b) is the assembly procedure explanatory drawing which looked at (a) from the lower side. (A) is the side view before rotation of a socket apparatus, (b) is the principal part enlarged view of the bus bar. (A) is an assembly procedure explanatory diagram after completion of the substrate assembly of the socket device, (b) is an assembly procedure explanatory diagram when (a) is viewed from below. (A) is the side view after completion of rotation of a socket apparatus, (b) is the principal part enlarged view of the bus bar. It is front sectional drawing of the conventional socket apparatus before a lamp mounting | wearing. FIG. 10 is a perspective view of the connection member shown in FIG. 9. It is a top view which shows a part of wiring board with which the conventional socket apparatus is mounted | worn. (A) is front sectional drawing which shows a part of wiring board with which the conventional socket apparatus was mounted | worn, (b) is the side sectional drawing.

Embodiments according to the present invention will be described below with reference to the drawings.
As shown in FIG. 1, a socket device 11 according to the present embodiment is provided with a wedge bulb (a dieless lamp) 13, and a socket 17 attached to a printed wiring board (substrate) 15 together with the attached wedge bulb 13. As a main component. The socket 17 includes a pair of bus bars 19 and a socket body 21. The socket device 11 is rotated and attached after the lower end portion is inserted into the board opening 23 formed in the printed wiring board 15. In the present embodiment, the socket device 11 is described with the insertion direction side as the lower side and the opposite side as the upper side.

  The printed wiring board 15 is formed with a pair of cutout portions 25 that cut out the board openings 23 in both end diameter directions. In the printed wiring board 15, the side on which the socket device 11 is inserted becomes the front side board surface 27 and the opposite side becomes the back side board surface 29 (see FIG. 4). On the back side substrate surface 29, a pair of arc-shaped conductive surfaces 31 (see FIG. 4) are formed along the periphery of the opening with the substrate opening 23 in between. The member to which the socket device 11 is attached is not limited to the printed wiring board 15 and may be an adherend provided with other conductive members.

  The wedge bulb 13 includes a glass bulb 33, a wedge base (insertion portion) 35 having a rectangular cross section integrally provided at the lower portion of the glass bulb 33, a filament (not shown) enclosed in the glass bulb 33, and the filament. And two lead wires 37 supported at both ends thereof. The two lead wires 37 pass through the wedge base 35 in an airtight manner and are drawn outward from the lower end surface of the wedge base 35 and are bent in opposite directions.

  As shown in FIG. 2, the pair of bus bars 19 are formed in the same shape. The bus bar 19 is formed using a thin metal plate material having conductivity and elasticity such as phosphor bronze for spring and stainless steel that serves both for holding the wedge valve 13 and supplying power to the wedge valve 13. The bus bar 19 is placed in point symmetry by being stored in the socket body 21 and is electrically connected to each of the pair of lead wires 37 exposed to the wedge base 35. The bus bars 19 are respectively stored in a pair of bus bar housing recesses 87 (see FIG. 3) described later formed in the socket main body 21. The bus bar 19 has a bus bar main body 45 whose horizontal sectional view is U-shaped by a pair of side wall pieces 41 and a connection piece 43 connecting them. The bus bar 19 is mounted in the bus bar housing recess 87 with the lower end side of the bus bar body 45 being the insertion tip side.

  The connection piece 43 is formed with a locking claw 47 which is formed with a free end as a free end and projecting obliquely upward. The locking claw 47 is formed inside the bus bar housing recess 87 and is not shown. Locked to the step. The bus bar 19 is attached to the socket body 21 with the locking claw 47 being locked to the locking stepped portion so that the bus bar 19 is prevented from being detached from the bus bar housing recess 87.

  A valve contact spring 53 is connected to the upper end side of the pair of side wall pieces 41, and the valve contact spring 53 is formed by continuously forming a lead contact portion 55 and a receiving inclined surface 57 from the side wall piece 41 side. The lead contact portion 55 is formed closer than the distance between the pair of side wall pieces 41. The receiving inclined surface 57 has a free end on the upper end side, and has an inclination that gradually separates upward. Therefore, the valve contact spring 53 formed on each of the pair of side wall pieces 41 faces the upper side of the side wall piece 41 and is once bent by the lead contact portion 55 in a direction in which the valve contact springs 53 approach each other. The shape is open in the direction of separation. A wedge base 35 is inserted between the valve contact springs 53. The receiving inclined surface 57 smoothly guides the receiving when the wedge base 35 is inserted. In the wedge base 35 inserted between the valve contact springs 53, the lead wire 37 exposed on the side surface is brought into contact with the lead contact portion 55.

  On the upper end side of the connection piece 43, a substrate contact spring 59 is formed so as to be bent in a direction substantially orthogonal to the connection piece 43. The substrate contact spring 59 includes a neck plate portion 61 connected to the connection piece 43 and a contact flat plate portion 63 that is bent at a substantially right angle with respect to the neck plate portion 61. A substrate contact indent 65 protruding in a dome shape is formed on the upper surface side of the contact flat plate portion 63. The substrate contact spring 59 is formed to be elastically deformed so that the contact portion of the substrate contact indent 65 can be displaced downward. The board contact spring 59 contacts the conductive surface 31 formed on the back side board surface 29 via the board contact indent 65 when the socket body 21 is rotated with respect to the printed wiring board 15.

  On the contact flat plate portion 63 of the substrate contact spring 59, a substrate expansion surface 67 is formed to extend. In the present embodiment, the contact flat plate portion 63 is formed in a substantially square shape, and the substrate wide surface 67 extends from one side portion thereof. The board wide surface 67 faces the board notch edge 69 (see FIG. 6) of the notch 25 in the printed wiring board 15 and is formed with an inclination that gradually separates from the back side board surface 29 in the direction of rotation. That is, the inclination is downward toward the tip in the extending direction. The substrate wide surface 67 may be an inclined plane as in the present embodiment or a curved convex surface.

In the pair of side wall pieces 41 of the bus bar 19, a slit 73 is formed between the valve contact spring 53 and the connection piece 43 in the downward direction from the upper edge. The slit 73 facilitates elastic deformation of each of the valve contact spring 53 and the substrate contact spring 59 and suppresses mutual interference of deformation.
Further, on the upper edge of the bus bar main body 45 between the slit 73 and the connecting piece 43, a push margin 75 is formed when the bus bar is assembled. When the bus bar 19 is mounted on the socket main body 21, the bus bar assembling push margin 75 is inserted by being pressed by a mounting jig (not shown). Thereby, deformation | transformation at the time of the assembly | attachment of the valve contact spring 53 and the board | substrate contact spring 59 is prevented.

  As shown in FIG. 3, the socket body 21 is integrally formed of, for example, a synthetic resin material that is an insulating member. The socket body 21 is fitted with the wedge valve 13 and is inserted into the board opening 23. A box-shaped base accommodating portion 77 having an open top is formed on the lower end side of the bottomed cylindrical socket main body 21, and the wedge base 35 is accommodated inside the base accommodating portion 77. In the socket main body 21, the base accommodating portion 77 is the leading end side of insertion into the substrate opening 23. A pair of arc-shaped flanges 79 are formed on the upper open end side of the base accommodating portion 77 with the open space interposed therebetween. A gap space between the pair of flanges 79 becomes a glass bulb accommodating portion 81 in which a lower portion of the glass bulb 33 is accommodated. Therefore, in the socket body 21, the wedge base 35 is accommodated in the base accommodating portion 77, and the lower portion of the glass bulb 33 is accommodated in the glass bulb accommodating portion 81. A substrate contact seat surface 83 is formed on the lower surface side of the flange 79, and the substrate contact seat surface 83 contacts the front substrate surface 27 at the periphery of the substrate opening 23.

  On the upper side of the base accommodating portion 77, a pair of substrate fixing convex portions 85 are formed so as to protrude outward in the radial direction between a pair of flange portions 79 arranged on the circumference. The substrate fixing convex portion 85 is inserted into the cutout portion 25 when the base accommodating portion 77 is inserted into the substrate opening 23. The board fixing protrusion 85 is formed to be spaced downward from the board contact seating surface 83 of the flange 79 by the thickness of the printed wiring board 15. That is, the printed wiring board 15 is sandwiched between the separated portions. Between the base accommodating portion 77 and the substrate fixing convex portion 85, a bus bar accommodating concave portion 87 that opens upward is formed. The board fixing convex portion 85 is formed with a bus bar storage groove 39 that opens upward. In the bus bar 19, the bus bar main body 45 is housed in the bus bar housing recess 87, and the contact flat plate portion 63 of the substrate contact spring 59 is disposed in the bus bar housing groove 39.

A bus bar over-displacement prevention surface 89 is formed inside the bus bar storage groove 39. The bus bar overdisplacement prevention surface 89 restricts excessive displacement of the substrate contact spring 59. The bus bar over-displacement preventing surface 89 includes a displacement preventing inner wall surface 91, a displacement preventing bottom surface 93, and a displacement preventing concave surface 95. In the bus bar 19 in which the bus bar main body 45 is housed in the bus bar housing recess 87, the neck plate portion 61 rises from the bus bar housing recess 87, and the contact flat plate portion 63 is disposed above the displacement prevention bottom surface 93 of the bus bar housing groove 39.
A substrate holding surface 97 is formed on the substrate fixing convex portion 85 on the opposite side to the assembly rotation direction (clockwise direction in FIG. 3) across the bus bar storage groove 39. The substrate holding surface 97 is inserted into the notch 25 together with the substrate fixing convex portion 85. The substrate fixing convex portion 85 is brought into contact with the back side substrate surface 29 through the substrate holding surface 97.
In the bus bar 19, when the bus bar main body 45 is accommodated in the bus bar accommodating recess 87, the contact flat plate portion 63 is disposed on substantially the same plane as the substrate holding surface 97, and the substrate contact indent 65 is higher than the substrate holding surface 97. It arrange | positions in a position (refer FIG. 6). That is, the difference in height between the substrate contact indent 65 and the substrate holding surface 97 becomes the indent displacement amount S. Thus, the board contact spring 59 is formed on the bus bar 19 so as to be higher than the board holding surface 97, and is formed on the back side board surface 29 by rotating the socket body 21 with respect to the printed wiring board 15. It contacts the conductive surface 31 being elastically biased.

  A board wide socket surface 99 is formed on the board fixing convex portion 85 on the opposite side of the board holding surface 97 across the bus bar storage groove 39. The board wide socket surface 99 is formed lower than the board holding surface 97 and has an inclination that gradually separates from the back side board surface 29 in the assembly rotation direction. Therefore, the board wide surface 67 inclined downward from the contact flat plate portion 63 is disposed on the upper end side of the board wide socket surface 99.

  The board contact spring 59 is elastically deformed by pressing the board wide surface 67 against the board notch edge 69 of the printed wiring board 15 when the socket device 11 is assembled. That is, the substrate contact spring 59 is elastically deformed in the direction in which the substrate contact indent 65 is pushed down by the conductive surface 31. The board contact spring 59 is also elastically deformed due to frictional rotation or the like when the socket device 11 is detached from the printed wiring board 15. Due to these deformations, the contact plate 59 and the board expansion surface 67 of the board contact spring 59 are displaced in the bus bar storage groove 39. When the amount of displacement becomes a certain amount or more, permanent deformation remains in the substrate contact spring 59. Therefore, before the displacement amount becomes a certain amount or more, the substrate contact spring 59 is contacted with the displacement preventing inner wall surface 91, the displacement preventing bottom surface 93, and the displacement preventing concave surface 95 so that the contact flat plate portion 63 and the substrate expanding surface 67 are more than that. The displacement is restricted. That is, the socket device 11 of the present embodiment is configured so that excessive displacement (over displacement) of the substrate contact spring 59 is prevented.

As described above, the socket body 21 is formed with a pair of flange portions 79 in the circumferential direction around the attached wedge valve 13, and the substrate fixing convex portion 85 is provided between the circumferential flange portions. It has been. Further, a closing body 101 is formed so as to protrude outward in the radial direction between each of the pair of substrate fixing convex portions 85 and the flange portion 79 located on the opposite side to the assembly rotation direction. The closing body 101 has a substrate contact seat surface 103 on the same plane as the substrate contact seat surface 83 of the flange 79, and a stopper rib 105 extending along the axial direction of the socket body 21 on the assembly rotation direction side. Projected.
When the socket main body 21 is inserted into the board opening 23, the stopper rib 105 is inserted into the notch 25 together with the board fixing projection 85. When the socket body 21 is rotated in the assembling rotation direction, the board fixing convex portion 85 is moved from the cutout portion 25 and the cutout portion 25 is opened. When the socket main body 21 is rotated to a predetermined assembly rotation position and the stopper rib 105 contacts the opening edge of the notch 25, the closing body 101 is arranged above the notch 25 and covers the notch 25. ing.

Next, the operation of the socket device 11 having the above configuration will be described with reference to FIGS.
In order to attach the socket device 11 to the printed wiring board 15, a pair of bus bars 19 is first attached to the socket body 21. The bus bar 19 is mounted on the bus bar housing recess 87 (see FIG. 3) of the socket body 21 by pressing the bus bar assembly push margin 75 (see FIG. 2) with a mounting jig. In the bus bar 19 mounted in the bus bar housing recess 87, the gap between the valve contact springs 53 is opened upward, and the substrate contact indent 65 of the contact flat plate portion 63 is disposed on the bus bar storage groove 39.

  The wedge valve 13 is attached to the socket 17 to which the bus bar 19 is attached. In the wedge valve 13, the wedge base 35 is inserted into the gap between the valve contact springs 53 of the respective bus bars 19. The wedge valve 13 is electrically connected to the bus bar 19 when the lead wire 37 of the wedge base 35 contacts the lead contact portion 55.

  As shown in FIG. 4, the socket device 11 to which the wedge valve 13 is attached has the board fixing projection 85 aligned with the notch 25, and the socket body 21 is the board perpendicular to the printed wiring board 15. It is inserted into the opening 23. As shown in FIG. 5, the socket device 11 inserted into the substrate opening 23 is restricted from being inserted by the flange portion 79 abutting against the front substrate surface 27. At this time, as shown in FIG. 6, the substrate contact indent 65 of the contact flat plate portion 63 is arranged at a position higher than the substrate holding surface 97. Further, a part of the board wide surface 67 connected to the contact flat plate part 63 protrudes to a position higher than the board wide socket surface 99 of the board fixing convex part 85.

  The socket device 11 whose insertion is restricted at the insertion end position by the flange portion 79 coming into contact with the front-side board surface 27 is rotated in the assembly rotation direction (in the direction of the arrow in FIG. 5A). When the socket device 11 is rotated in the assembling rotation direction, the board notch edge 69 (see FIG. 6) is connected to the board wide socket surface 99, the board wide surface 67, the contact flat plate portion 63, the board contact indent 65, and the board holding surface 97. Contact in this order.

  As shown in FIG. 7, the socket device 11 is rotated approximately 90 °, so that the stopper rib 105 comes into contact with the opening edge of the notch 25 and the assembly is completed. In the socket device 11 that has been assembled, the closing body 101 is disposed above the notch 25. In this rotation process, when the substrate notch edge 69 contacts the substrate expansion surface 67, the contact flat plate portion 63 of the substrate contact spring 59 is pushed downward by the printed wiring board 15 and is received in the bus bar storage groove 39. As shown in FIG. 8, the substrate contact spring 59 in which the contact flat plate portion 63 is pushed downward generates an upward repulsive force and gives a contact load between the substrate contact indent 65 and the conductive surface 31.

  Thus, the board contact spring 59 that contacts the conductive surface 31 and fits in the bus bar storage groove 39 is covered with the board fixing convex portion 85 and the printed wiring board 15. Further, even if external force is applied to the socket device 11 from other members and the board contact spring 59 is deformed before being inserted into the printed wiring board 15, the board contact that tends to be displaced excessively in the bus bar storage groove 39. The displacement of the spring 59 is restricted by the bus bar over-displacement preventing surface 89, and over-displacement is prevented.

  As described above, in the socket device 11 of the present embodiment, when the socket body 21 inserted into the board opening 23 is rotated with respect to the printed wiring board 15, the board fixing convex part arranged corresponding to the notch part 25. 85 is rotated along the back substrate surface 29 of the printed wiring board 15. The printed circuit board 15 is sandwiched from the front and back by the printed circuit board fixing convex portion 85 and the flange portion 79, and the socket body 21 is fixed to the printed wiring substrate 15. At this time, the board contact spring 59 of the bus bar 19 is deformed in a range protruding upward from the bus bar storage groove 39, and further deformation is avoided by immersing into the bus bar storage groove 39. Further, since the portion of the board contact spring 59 that protrudes upward from the bus bar storage groove 39 is in contact with the conductive surface 31 formed on the back side board surface 29, most of the part is formed by the printed wiring board 15 and the bus bar storage groove 39. It will be covered. This prevents deformation of the substrate contact spring 59 due to interference of other members after the substrate is assembled.

  Further, if the substrate contact spring 59 is to be excessively displaced in the bus bar storage groove 39, the substrate contact spring 59 hits the bus bar over displacement prevention surface 89 and further displacement is restricted. As a result, permanent deformation of the substrate contact spring 59 due to excessive displacement of the substrate contact spring 59 does not occur in the bus bar storage groove 39.

  Further, when the socket body 21 is inserted into the substrate opening 23, the substrate holding surface 97 is inserted into the cutout portion 25 and is disposed on the substantially same surface as the back side substrate surface 29. At this time, the bus bar 19 stored in the socket body 21 is arranged at a position where the board contact indent 65 of the board contact spring 59 is higher than the board holding surface 97. When the socket body 21 is rotated with respect to the printed wiring board 15, the board wide surface 67 provided on the board contact spring 59 hits the board notch edge 69. Further, when the socket body 21 is rotated, the board expansion surface 67 that has received the reaction force from the substrate notch edge 69 is moved in a lowering direction (a direction away from the front-side substrate surface 27). The spring 59 is elastically deformed in the direction in which the substrate contact indent 65 becomes lower. When the socket body 21 reaches a predetermined rotational position, the substrate contact indent 65 is elastically brought into contact with the conductive surface 31 of the back side substrate surface 29 by the elastic restoring force of the substrate contact spring 59. As a result, the substrate contact spring 59 is prevented from being directly caught by the substrate notch edge 69 and permanently deformed, and a large contact pressure is obtained by arranging the substrate contact indent 65 higher than the substrate holding surface 97. It becomes like this.

  Therefore, according to the socket device 11 according to the present embodiment, the board fixing convex portion 85 formed on the socket body 21 can securely fix the socket body 21 and the printed wiring board 15 and protect the board contact spring 59. It can be realized with a simple and compact structure.

  Note that the socket device of the present invention is not limited to the above-described embodiment, and can be appropriately modified and improved. In addition, the material, shape, dimensions, number, arrangement location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

11 ... Socket device 13 ... Wedge bulb (without mold lamp)
15 ... Printed circuit board (board)
DESCRIPTION OF SYMBOLS 19 ... Bus bar 21 ... Socket main body 23 ... Board | substrate opening 25 ... Notch part 27 ... Front side board | substrate surface 29 ... Back side board | substrate surface 31 ... Conductive surface 35 ... Wedge base (insertion part)
37 ... Lead wire 39 ... Bus bar storage groove 59 ... Substrate contact spring 79 ... Hang part 85 ... Substrate fixing convex part 89 ... Bus bar over-displacement prevention surface

Claims (2)

A socket body to which an insertion portion of a mouthless mold lamp is attached and is inserted into a substrate opening formed on the substrate,
A flange provided on the socket body and in contact with the front substrate surface of the substrate;
A board-fixing convex part that is provided in the socket body and is inserted into a notch formed in both end diameter directions of the board opening;
A bus bar which is stored in the socket body and is connected to a lead wire which is exposed to the insertion portion;
A board contact spring formed on the bus bar and contacting a conductive surface formed on a back side board surface of the board by rotating the socket body with respect to the board;
A bus bar storage groove formed on the substrate fixing convex portion and accommodating the substrate contact spring;
A socket device comprising:   2. The socket device according to claim 1, wherein a bus bar over-displacement preventing surface for restricting excessive displacement of the substrate contact spring is formed in the bus bar storage groove.

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