JP2013532894A - オプトエレクトロニクス発光モジュール及び自動車用ヘッドライト - Google Patents
オプトエレクトロニクス発光モジュール及び自動車用ヘッドライト Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 claims abstract description 35
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 210000002105 tongue Anatomy 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 27
- 239000000919 ceramic Substances 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000011162 core material Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- -1 barium nitride Chemical class 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/02—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments
- B60Q1/04—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to illuminate the way ahead or to illuminate other areas of way or environments the devices being headlights
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/19—Attachment of light sources or lamp holders
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (14)
- オプトエレクトロニクス発光モジュール(1)において
完全に貫通している開口部(2)を備えている回路基板(3)と、
前記開口部(2)に取り付けられている支持体(4)と、
少なくとも一つのオプトエレクトロニクス半導体チップ(5)とを有しており、
前記回路基板(3)は前記発光モジュール(1)を外部の冷却体に機械的に固定するための少なくとも一つの固定装置(6)を含んでおり、
前記オプトエレクトロニクス半導体チップ(5)は、前記支持体(4)の支持体上面(40)に取り付けられており、且つ、前記支持体(4)を介して前記回路基板(3)と電気的に接続されており、
前記回路基板(3)は前記支持体(4)と機械的に固定されて接続されており、
前記回路基板(3)は機械的な力を前記支持体(4)に及ぼし、且つ、前記支持体(4)を前記外部の冷却体に押し付けるよう構成されており、
前記支持体(4)は支持体下面(45)を用いて前記外部の冷却体に平坦に載置されるよう構成されていることを特徴とする、オプトエレクトロニクス発光モジュール(1)。 - 前記支持体下面(45)及び回路基板下面(35)は平坦に形成されており、且つ相互に平行に配向されており、
前記支持体下面(45)は前記開口部(2)を貫通して、最大で100μmの長さ(L)だけ前記回路基板下面(35)よりも張り出している、請求項1に記載のオプトエレクトロニクス発光モジュール(1)。 - 前記回路基板(3)は、5N以上100N以下の機械的な力でもって、及び/又は、0.2MPa以上20MPa以下の平均圧力でもって、前記支持体(4)を前記外部の冷却体に押し付けるよう構成されている、請求項1又は2に記載のオプトエレクトロニクス発光モジュール(1)。
- 前記オプトエレクトロニクス発光モジュール(1)は少なくとも二つの固定舌片(7)を有しており、
前記固定舌片(7)は、前記回路基板(3)の回路基板上面(30)から延びており、前記開口部(2)を部分的に覆い、且つ、前記支持体上面(40)と機械的及び/又は電気的に接続されており、
前記固定舌片(7)は前記支持体(4)を前記外部の冷却体に押し付けるよう構成されている、請求項1乃至3のいずれか一項に記載のオプトエレクトロニクス発光モジュール(1)。 - 前記固定舌片(7)は前記回路基板(3)と一体的に形成されている、請求項4に記載のオプトエレクトロニクス発光モジュール(1)。
- 前記固定舌片(7)は弾性に変形可能な材料を有しているか、又は弾性に変形可能な材料から成るものであり、
前記固定舌片(7)は前記支持体上面(40)に対して垂直な方向において50kN/m以上5MN/m以下のばね定数を有している、請求項4又は5に記載のオプトエレクトロニクス発光モジュール(1)。 - 前記固定舌片(7)の内の少なくとも一つ又は全ての固定舌片(7)は前記半導体チップ(5)から電気的に絶縁されている、請求項4乃至6のいずれか一項に記載のオプトエレクトロニクス発光モジュール(1)。
- 前記回路基板(3)は水平方向において、前記支持体(4)に対して150μm以上750μm以下の平均間隔(d)を有している、請求項1乃至7のいずれか一項に記載のオプトエレクトロニクス発光モジュール(1)。
- 前記回路基板(3)は射出成形された回路支持体であり、水平方向において前記支持体(4)の周囲を形状結合により包囲している、請求項1乃至8のいずれか一項に記載のオプトエレクトロニクス発光モジュール(1)。
- 前記回路基板(3)の材料の熱膨張率は、前記支持体(4)の材料の熱膨張率とは最大で係数4異なる、請求項1乃至9のいずれか一項に記載のオプトエレクトロニクス発光モジュール(1)。
- 前記支持体(4)の材料は400Kの温度において、前記回路基板(3)を機械的に担持している材料よりも脆性である、請求項1乃至10のいずれか一項に記載のオプトエレクトロニクス発光モジュール(1)。
- 前記支持体(4)はセラミック又は半導体材料を有しているか、もしくは、セラミック又は半導体材料から成るものであり、
前記支持体(4)の厚さ(D)は200μm以上1mm以下である、請求項1乃至11のいずれか一項に記載のオプトエレクトロニクス発光モジュール(1)。 - 前記支持体下面(45)は最大で10μmの平均粗さを有している、請求項1乃至12のいずれか一項に記載のオプトエレクトロニクス発光モジュール(1)。
- 請求項1乃至13のいずれか一項に記載されている、少なくとも一つのオプトエレクトロニクス発光モジュール(1)と、少なくとも一つの冷却体(8)とを備えており、前記発光モジュール(1)は冷却体上面(80)に固定されていることを特徴とする、自動車用ヘッドライト。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010033093A DE102010033093A1 (de) | 2010-08-02 | 2010-08-02 | Optoelektronisches Leuchtmodul und Kfz-Schweinwerfer |
DE102010033093.0 | 2010-08-02 | ||
PCT/EP2011/060646 WO2012016759A1 (de) | 2010-08-02 | 2011-06-24 | Optoelektronisches leuchtmodul und kfz-scheinwerfer |
Publications (1)
Publication Number | Publication Date |
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JP2013532894A true JP2013532894A (ja) | 2013-08-19 |
Family
ID=44545661
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Application Number | Title | Priority Date | Filing Date |
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JP2013522159A Pending JP2013532894A (ja) | 2010-08-02 | 2011-06-24 | オプトエレクトロニクス発光モジュール及び自動車用ヘッドライト |
Country Status (7)
Country | Link |
---|---|
US (1) | US9046258B2 (ja) |
EP (1) | EP2601439B1 (ja) |
JP (1) | JP2013532894A (ja) |
KR (1) | KR20130086211A (ja) |
CN (1) | CN103026133A (ja) |
DE (1) | DE102010033093A1 (ja) |
WO (1) | WO2012016759A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015513770A (ja) * | 2012-03-05 | 2015-05-14 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクスモジュールおよびオプトエレクトロニクスモジュールの製造方法 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102010033093A1 (de) | 2010-08-02 | 2012-02-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Leuchtmodul und Kfz-Schweinwerfer |
DE102011084365A1 (de) * | 2011-10-12 | 2013-04-18 | Osram Gmbh | LED-Modul mit einem Kühlkörper |
DE202015104797U1 (de) | 2015-09-10 | 2016-12-14 | Turck Holding Gmbh | LED-Modul |
DE102015117936A1 (de) * | 2015-10-21 | 2017-04-27 | Osram Opto Semiconductors Gmbh | Optoelektronische Leuchtvorrichtung |
AT518266B1 (de) * | 2016-02-24 | 2017-09-15 | Zkw Group Gmbh | Halterungsvorrichtung für ein elektronisches Bauteil |
FR3078382B1 (fr) * | 2018-02-27 | 2020-10-02 | Valeo Vision | Module lumineux pour un vehicule automobile ayant au moins une source lumineuse deportee par rapport a un circuit d’alimentation |
US10707144B2 (en) | 2018-09-10 | 2020-07-07 | Raytheon Company | Thermal boundary control |
DE102018009292A1 (de) * | 2018-11-26 | 2020-05-28 | Harting Ag | Elektrooptische Baugruppe mit Wärmeabführung sowie Verfahren zur Herstellung einer solchen Baugruppe |
CN112888148A (zh) * | 2021-01-12 | 2021-06-01 | 宁化宽信科技服务有限公司 | 一种印刷电路板 |
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US6582100B1 (en) * | 2000-08-09 | 2003-06-24 | Relume Corporation | LED mounting system |
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
ATE474443T1 (de) * | 2003-02-07 | 2010-07-15 | Panasonic Corp | Beleuchtungseinrichtung, einen sockel verwendend, um ein flaches led-modul auf einen kühlkörper zu montieren |
JP2008016362A (ja) * | 2006-07-07 | 2008-01-24 | Koito Mfg Co Ltd | 発光モジュール及び車輌用灯具 |
DE202006017583U1 (de) | 2006-11-17 | 2008-03-27 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Beleuchtungsvorrichtung |
JP4582087B2 (ja) | 2006-12-18 | 2010-11-17 | 市光工業株式会社 | 発光ダイオードの固定構造 |
JP2008186796A (ja) * | 2007-01-31 | 2008-08-14 | Ichikoh Ind Ltd | 発光ダイオードの固定構造 |
JP2008235118A (ja) * | 2007-03-22 | 2008-10-02 | Stanley Electric Co Ltd | 照明装置およびその製造方法 |
DE102007049310A1 (de) * | 2007-10-15 | 2009-04-16 | Automotive Lighting Reutlingen Gmbh | Leuchtmodul für einen Scheinwerfer oder eine Leuchte eines Kraftfahrzeugs |
DE102008031262A1 (de) * | 2008-07-02 | 2010-01-07 | Osram Gesellschaft mit beschränkter Haftung | Beleuchtungseinheit für Fahrzeugscheinwerfer und Fahrzeugscheinwerfer |
JP2010073428A (ja) * | 2008-09-17 | 2010-04-02 | Ichikoh Ind Ltd | 車両用灯具 |
US8602593B2 (en) * | 2009-10-15 | 2013-12-10 | Cree, Inc. | Lamp assemblies and methods of making the same |
DE102010033093A1 (de) | 2010-08-02 | 2012-02-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Leuchtmodul und Kfz-Schweinwerfer |
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2010
- 2010-08-02 DE DE102010033093A patent/DE102010033093A1/de not_active Withdrawn
-
2011
- 2011-06-24 US US13/695,966 patent/US9046258B2/en not_active Expired - Fee Related
- 2011-06-24 JP JP2013522159A patent/JP2013532894A/ja active Pending
- 2011-06-24 EP EP11728256.6A patent/EP2601439B1/de not_active Not-in-force
- 2011-06-24 KR KR1020137005277A patent/KR20130086211A/ko not_active Application Discontinuation
- 2011-06-24 WO PCT/EP2011/060646 patent/WO2012016759A1/de active Application Filing
- 2011-06-24 CN CN2011800379826A patent/CN103026133A/zh active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015513770A (ja) * | 2012-03-05 | 2015-05-14 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクスモジュールおよびオプトエレクトロニクスモジュールの製造方法 |
US9773951B2 (en) | 2012-03-05 | 2017-09-26 | Osram Opto Semiconductors Gmbh | Optoelectronic module and a process for the production of an optoelectronic module |
Also Published As
Publication number | Publication date |
---|---|
DE102010033093A1 (de) | 2012-02-02 |
EP2601439B1 (de) | 2017-05-10 |
US9046258B2 (en) | 2015-06-02 |
CN103026133A (zh) | 2013-04-03 |
KR20130086211A (ko) | 2013-07-31 |
EP2601439A1 (de) | 2013-06-12 |
WO2012016759A1 (de) | 2012-02-09 |
US20130100691A1 (en) | 2013-04-25 |
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