JP2013258075A - Light-emitting device and lighting fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To cope with both excellent heat radiation and a lower height regarding a lighting fixture for light-emitting a light-emitting body.SOLUTION: A light-emitting device 1 includes light-emitting bodies 2, a board 3 having the light-emitting bodies 2 on one surface 311 side, and a light-up circuit 4 having circuit components 41 for lighting up the light-emitting bodies 2. The light-up circuit 4 is arranged at the surrounding of the light-emitting bodies 2 while the light-up circuit 4 is fixed on one surface 321 side of the board 3. The board 3 has a step on at least one surface 311, 321 side between a light-emitting body arrangement section 31 for preparing the light-emitting bodies 2 and a circuit arrangement section 32 for preparing the light-up circuit. For example, one surface 311 of the light-emitting body arrangement section 31 is arranged by projecting rather than one surface 321 of the circuit arrangement section 32, and there is a height difference between the light-emitting body arrangement section 31 and the circuit arrangement section 32.

Description

  The present invention relates to a light emitting device and a lighting fixture that emit light from a light emitter.

  Conventionally, various light emitting devices that emit light from a light emitter have been developed and are commercially available (see, for example, Patent Document 1). In the light emitting device described in Patent Document 1, a circuit board on which lighting circuit components are mounted is arranged on the back side of an LED board on which light emitting diodes (hereinafter referred to as “LEDs”) are mounted.

JP 2010-129488 A

  However, since the conventional light-emitting device described in Patent Document 1 has a structure in which the lighting circuit portion (lighting circuit component, circuit board) is arranged on the back side of the LED board as described above, the thickness direction of the LED board However, there is a problem that the height of the light emitting device is increased. That is, the conventional light emitting device has a structure in which it is difficult to reduce the height of the entire device.

  Further, when the distance between the LED and the lighting circuit component is shortened, there is a problem that heat from the LED is transmitted to the lighting circuit component or heat from the lighting circuit component is transmitted to the LED.

  The present invention has been made in view of the above points, and an object of the present invention is to provide a light emitting device and a lighting fixture that can achieve both excellent heat dissipation and low profile.

  The light-emitting device of the present invention includes a light-emitting body, a substrate on which the light-emitting body is disposed on one side, and a lighting circuit unit including a circuit component for lighting the light-emitting body. The substrate is arranged around the light emitter in a state of being fixed on the one surface side of the substrate, and the substrate is disposed between the light emitter arrangement portion on which the light emitter is arranged and the circuit arrangement portion on which the lighting circuit portion is arranged. A step is formed at least on the one surface side.

  In this light emitting device, it is preferable that the substrate has a height difference between the light emitter arrangement portion and the circuit arrangement portion in the thickness direction.

  In this light emitting device, it is preferable that the substrate has a bottomed recess formed between the light emitter placement portion and the circuit placement portion.

  In this light emitting device, it is preferable to include a cover portion that covers the lighting circuit portion.

  In this light emitting device, it is preferable that the circuit component is mounted on the substrate.

  In the light emitting device, the light emitter preferably includes at least an LED element.

  The lighting fixture of this invention is equipped with the said light-emitting device and the fixture main body to which the said light-emitting device was attached.

  In the light emitting device and the lighting fixture of the present invention, the light emitter and the lighting circuit unit are arranged in a state of being fixed on the same surface of the substrate. Thereby, the light emitting device and the lighting fixture of the present invention have a lower height of the entire device in the thickness direction of the substrate as compared with the structure in which the light emitter and the lighting circuit portion are arranged in different surfaces. can do.

  Moreover, in the light-emitting device and lighting fixture of this invention, the level | step difference is formed between the light-emitting body arrangement | positioning part and the circuit arrangement | positioning part in the state by which the lighting circuit part was arrange | positioned around the light-emitting body. Thereby, since the light-emitting device and lighting fixture of this invention can lengthen the heat conduction path | route between a light-emitting body and a lighting circuit part compared with the case where the level | step difference is not formed, a light-emitting body and a lighting circuit Heat conduction with the part can be reduced.

  Therefore, according to the light emitting device and the lighting fixture of the present invention, both excellent heat dissipation and low profile can be achieved.

1 is a cross-sectional view of a light emitting device according to Embodiment 1. FIG. 1 is a front view of a light emitting device according to Embodiment 1. FIG. It is sectional drawing of the lighting fixture which concerns on Embodiment 1. FIG. It is sectional drawing which shows the other example of the lighting fixture which concerns on Embodiment 1. FIG. 6 is a cross-sectional view showing another example of the light emitting device according to Embodiment 1. FIG. 6 is a cross-sectional view showing another example of the light emitting device according to Embodiment 1. FIG. 6 is a cross-sectional view showing another example of the light emitting device according to Embodiment 1. FIG. 6 is a cross-sectional view of a light emitting device according to Embodiment 2. FIG. It is sectional drawing which shows the other example of the light-emitting device which concerns on Embodiment 2. FIG. It is sectional drawing which shows the other example of the light-emitting device which concerns on Embodiment 2. FIG. It is sectional drawing which shows the other example of the light-emitting device which concerns on Embodiment 2. FIG. It is sectional drawing of the light-emitting device which concerns on Embodiment 3. FIG. It is sectional drawing which shows the other example of the light-emitting device concerning Embodiment 3. It is sectional drawing which shows the other example of the light-emitting device concerning Embodiment 3. It is sectional drawing which shows the other example of the light-emitting device concerning Embodiment 3. It is sectional drawing which shows the other example of the light-emitting device concerning Embodiment 3. It is sectional drawing which shows the other example of the light-emitting device concerning Embodiment 3. It is sectional drawing which shows the other example of the light-emitting device concerning Embodiment 3. It is sectional drawing of the light-emitting device which concerns on Embodiment 4. FIG. It is sectional drawing which shows the other example of the light-emitting device concerning Embodiment 4.

  In the following first to fourth embodiments, the light emitting device 1 illustrated in FIG. 1 and the like has a structure in which the light emitter 2 and the lighting circuit unit 4 are disposed on the same surface (311 321) of the substrate 3. In such a light emitting device 1, a step is formed on the substrate 3 between the light emitter arrangement portion 31 where the light emitter 2 is arranged and the circuit arrangement portion 32 where the lighting circuit portion 4 is arranged. .

  As a level difference between the light emitter placement portion 31 and the circuit placement portion 32, for example, a difference in height between the light emitter placement portion 31 and the circuit placement portion 32, between the light emitter placement portion 31 and the circuit placement portion 32, or the like. There is a bottomed recess, or a combination of the height difference and the bottomed recess.

  Such a light emitting device 1 can reduce the height of the entire device in the thickness direction of the substrate 3 as compared with a structure in which the light emitter 2 and the lighting circuit portion 4 are arranged on different surfaces. Further, the light emitting device 1 can lengthen the heat conduction path between the light emitter 2 and the lighting circuit portion 4 as compared with the case where no step is formed between the light emitter 2 and the lighting circuit portion 4. Therefore, the heat conduction between the light emitter 2 and the lighting circuit unit 4 can be reduced.

  Each embodiment will be described below.

(Embodiment 1)
FIG. 2 shows a front view of the light emitting device 1 according to Embodiment 1, and FIG. 1 shows a cross-sectional view taken along line AA in FIG.

  As illustrated in FIG. 1, the light emitting device 1 according to the first embodiment includes a light emitter 2, a substrate 3 on which the light emitter 2 is mounted on the one surface 311 side, and a lighting circuit unit disposed on the one surface 321 side of the substrate 3. 4 and a cover portion 5 that covers the light emitter 2 and the lighting circuit portion 4. The light emitting device 1 also includes a first conductive wire 81 for electrically connecting an external power source (not shown) and the lighting circuit unit 4, and an electric connection between the lighting circuit unit 4 and the light emitter 2. And a second conductor 82 for connection. FIG. 1 shows an example in which a plurality of light emitters 2 are mounted on a substrate 3.

  Although not shown, the light emitter 2 includes an LED element, a translucent resin that increases light extraction efficiency from the LED element, and a phosphor that converts the wavelength of light from the LED element. The light emitter 2 may be an LED package in which an LED element and a phosphor are integrated.

  The LED element emits light such as ultraviolet, purple, blue, and green. This LED element is bonded and fixed (die-bonded) to the substrate 3 and is electrically connected to a wiring layer (not shown) of the substrate 3 by a conducting wire (not shown) such as a bonding wire.

  The translucent resin is, for example, silicone and is provided on the light emitting side of the LED element, and increases the light extraction efficiency from the LED element.

  The light emitter 2 may be a combination of red, green and blue LED elements. In addition to the LED element and the phosphor, the light emitter 2 may be a combination in which any one or more LED elements among purple, blue, green, yellow, orange, and red are added.

  The substrate 3 is formed of a ceramic substrate. This ceramic substrate is made of aluminum nitride, alumina, mullite, cordierite or the like. The substrate 3 is integrally provided with a light emitter arrangement part 31 on which the light emitter 2 is mounted and a circuit arrangement part 32 on which the lighting circuit part 4 is arranged, and is formed in a circular shape as shown in FIG. Yes. A central portion of the substrate 3 is a light emitter arrangement portion 31, and a peripheral portion of the light emitter arrangement portion 31 is a circuit arrangement portion 32.

  In the substrate 3, a step is formed between one surface 311 of the light emitter placement portion 31 and one surface 321 of the circuit placement portion 32. In the substrate 3 of the present embodiment, as shown in FIG. 1, one surface of the light emitter placement portion 31 (mounting surface of the light emitter 2) 311 is more than one surface of the circuit placement portion 32 (placement surface of the lighting circuit portion 4) 321. Projects to the light emission side. That is, the substrate 3 has a height difference (height h1) between the light emitter placement portion 31 and the circuit placement portion 32 in the thickness direction.

  The light emitter arrangement portion 31 of the present embodiment is formed in a tapered shape, and the side surface 312 spreads outward as it goes from the one surface 311 side to the bottom portion.

  Further, in the substrate 3 of the present embodiment, the contact position of the cover portion 5 with the first cover 6 and the second cover 7 is on one surface 321 of the circuit arrangement portion 32. That is, the contact position is at a position lower than the one surface 311 of the light emitter arrangement portion 31.

  The substrate 3 is formed so that the LED element mounting surface, that is, one surface 311 reflects light from the LED element with high efficiency. Specifically, it is preferable that the total light reflectance of light in a wavelength region of 380 nm to 780 nm (visible light region) at a thickness of 1 mm is 85% or more.

  The flatness of the other surfaces 313 and 322 of the substrate 3 is preferably 0.01 to 0.08. When the flatness of the other surfaces 313 and 322 of the substrate 3 exceeds 0.08, when the light emitting device 1 is attached to the instrument main body 91 (see FIG. 3), the space between the attachment surface of the instrument main body 91 and the substrate 3 Heat resistance occurs. For this reason, it becomes difficult to efficiently diffuse the heat generated in the LED element to the instrument main body 91. On the other hand, when the flatness of the other surfaces 313 and 322 of the substrate 3 is less than 0.01, the processing cost of the substrate 3 is significantly increased.

  The average surface roughness (Ra) of the substrate 3 is preferably 0.3 to 0.8. When the average surface roughness of the substrate 3 exceeds 0.8, the printability of a wiring layer (not shown) formed on the surface of the substrate 3 is deteriorated, and it becomes difficult to form a fine pitch wiring pattern. . On the other hand, when the average surface roughness of the substrate 3 is less than 0.3, since the bonding strength between the substrate 3 and the wiring layer is lowered, the wiring layer is easily peeled off from the substrate 3. It is desirable that the substrate 3 and the instrument main body 91 (see FIG. 3) are directly fixed so that no gap is generated. If the average surface roughness (Ra) and flatness of the joint surface between the substrate 3 and the instrument body 91 are not sufficiently ensured, a heat conduction member may be interposed between the substrate 3 and the instrument body 91. Good. Examples of the heat conducting member include grease.

  Moreover, it is preferable that the thermal emissivity of the board | substrate 3 is 0.9 or more from a viewpoint of improving heat dissipation. Similarly, from the viewpoint of improving heat dissipation, the thermal conductivity (25 ° C.) of the substrate 3 is preferably 19 W / m · K or more.

  The wiring layer (not shown) of the substrate 3 is, for example, a metal such as copper (Cu), silver (Ag), gold (Au), aluminum (Al), or a conductor material containing these as a main component. It is formed by printing, vapor deposition, etc.

  Further, in FIG. 1, as the difference (h1−h2) between the height h1 of the light emitter 2 and the height h2 of the circuit component 41 of the lighting circuit portion 4 increases, it is used by changing the cover portion 5 or the lens shape. It can be a light distribution according to the demand of the person.

  The lighting circuit unit 4 includes a plurality of circuit components 41, a circuit board 42 on which the plurality of circuit components 41 are mounted, and a plurality of pillars 43 that support the circuit board 42. The lighting circuit portion 4 is disposed on the one surface 321 side around the light emitter 2 in the substrate 3.

  The plurality of circuit components 41 constitute a lighting circuit for powering the light emitter 2 to light the light emitter 2.

  The circuit board 42 is formed of, for example, a ceramic substrate. This ceramic substrate is made of aluminum nitride, alumina, mullite, cordierite or the like. A plurality of circuit components 41 are mounted on both surfaces of the circuit board 42. Some of the circuit components 41 are provided on the other surface 422 side of the circuit board 42, and are fixed on one surface 421 of the circuit board 42 by passing a terminal through a through hole formed in the circuit board 42. The circuit component 41 may be provided only on either the one surface 421 side or the other surface 422 side of the circuit board 42. The circuit board 42 is formed in an annular shape as shown in FIG. The outer diameter of the circuit board 42 is smaller than the outer diameter of the board 3. Further, as shown in FIG. 1, the circuit board 42 is provided so that the light emitter arrangement portion 31 protruding from the circuit arrangement portion 32 penetrates the inside.

  The pillars 43 are members that support the circuit board 42 while being separated from the board 3, and are provided at a plurality of positions on the circuit board 42. The column 43 is fixed to the substrate 3 at one end and fixed to the circuit board 42 at the other end. An adhesive or the like is used for fixing the support 43 and the substrate 3. As a result, the circuit board 42 on which the plurality of circuit components 41 are mounted is fixed to the board 3 via the support columns 43. Further, the height h <b> 3 of the column 43 is set to a height at which the circuit component 41 does not contact the substrate 3. The circuit component 41 may be in contact with the substrate 3 with an insulating heat conduction sheet (not shown) interposed therebetween.

  Note that the lighting circuit unit 4 may include a power supply circuit. In this case, the lighting circuit unit 4 can be connected to an external commercial power source to turn on the light emitter 2, and can easily supply power from the outside of the lighting fixture 9 (see FIG. 3).

  The cover unit 5 of the present embodiment is configured by a first cover 6 that covers the entire surface 311, 321 side of the substrate 3 and a second cover 7 that covers the lighting circuit unit 4.

  The first cover 6 is integrally provided with a top surface portion 61 formed in a disc shape (see FIG. 2) and a cylindrical side surface portion 62 provided to protrude downward from the periphery of the top surface portion 61. The bottomed cylinder is formed. The first cover 6 is fixed to the substrate 3 by an adhesive or screwing at the side surface portion 62 of the first cover 6 and the peripheral end of the substrate 3. The first cover 6 is formed of transparent or light diffusing glass, synthetic resin, or the like in which at least a portion where the light from the light emitter 2 is radiated is translucent. The first cover 6 of the present embodiment has a light diffusing action for diffusing light. Thereby, since the 1st cover 6 can diffuse the light from the light-emitting body 2, and can radiate | emit outside, color irregularity and graininess can be reduced. Note that the first cover 6 does not need to have a light diffusing action and may be transparent if the user does not care about uneven color or graininess.

  The first cover 6 may include a phosphor that converts the wavelength of light from the LED element.

  The first cover 6 may be a combination of a flat plate member and a cylindrical member. In this case, the flat plate member can be a translucent member, and the tubular member can be a non-translucent member.

  The second cover 7 includes an upper surface portion 71 formed in an annular shape (see FIG. 2), a cylindrical outer surface portion 72 projecting downward from the outer peripheral edge of the upper surface portion 71, and an inner surface of the upper surface portion 71. A cylindrical inner side surface portion 73 that protrudes downward from the peripheral edge is integrally provided. The second cover 7 is formed in a bottomed cylindrical shape. The inner side surface portion 73 is formed in a taper shape and narrows inward as it goes from the upper surface portion 71 side (upper side) to the distal end side (lower side). The second cover 7 is fixed to the substrate 3 by an adhesive or screwing at the tip of the outer surface portion 72, the peripheral end of the substrate 3, the tip of the inner surface portion 73, and a part of the substrate 3. The second cover 7 is provided with a light reflecting portion (high reflecting film) 74 at a portion where the light from the light emitter 2 reaches. Specifically, a light reflecting portion 74 is formed on the outer surface of the upper surface portion 71 and the inner side surface portion 73. Thereby, since the light from the light emitter 2 can be reflected by the light reflecting portion 74, it is possible to prevent the light from the light emitter 2 from being emitted to the inside of the second cover 7, that is, the lighting circuit portion 4 side. Can do.

  The first conducting wire 81 from the lighting circuit unit 4 is connected to an external power source (not shown) through a gap (not shown) formed between the substrate 3 and the cover unit 5 (first cover 6 and second cover 7). (Not shown). In addition, the second conductive wire 82 from the lighting circuit unit 4 is electrically connected to the light emitter 2 via a wiring layer (not shown) of the substrate 3. As a result, the lighting circuit unit 4 can receive power from the external power supply and power the light emitter 2 to light the light emitter 2.

  Note that the lighting circuit unit 4 is connected to the external power source by forming an electrode (not shown) for electrical connection with the external power source on one surface 321 of the substrate 3, and the first conductor 81 is connected to the lighting circuit unit 4. A method of wiring between the circuit board 3 and the substrate 3 may be used. In this case, the lighting circuit unit 4 and the external power source can be electrically connected via the wiring layer and the electrode of the substrate 3. Further, the electrode may be formed on the other surface 322 of the substrate 3. In this case, the lighting circuit unit 4 and the external power source can be electrically connected using a through electrode (not shown) connecting the one surface 321 and the other surface 322.

  The light emitting device 1 described above is used as a lighting fixture 9 by being attached to a fixture main body 91 as shown in FIG. The luminaire 9 is a housing / store luminaire such as a downlight. Note that the lighting fixture 9 is not limited to the above-described application, and may be an appliance suitable for other uses.

  The instrument main body 91 is made of, for example, metal, and as illustrated in FIG. 3A, a circular flat plate portion 911, a side surface portion 912 that protrudes downward from the periphery of the flat plate portion 911, and a side surface portion 912. And a distal end portion 913 provided so as to protrude outward from the distal end. The side surface portion 912 is formed in a tapered shape, and spreads outward as it goes from the flat plate portion 911 side to the tip end portion 913 side. The instrument main body 91 is fixed to the ceiling 93 by a ceiling fixing spring 94.

  The instrument main body 91 is a member obtained by polishing an Al die-cast product so that a contact surface with the substrate 3, at least immediately below the light emitter 2 has high reflectivity in the flat plate portion 911. A highly reflective film may be formed on the surface of the instrument main body 91. Examples of the highly reflective film include inorganic metals such as silver (Ag) and aluminum (Al), and organic substances such as barium sulfate.

  The flat plate portion 911 of the instrument main body 91 and the light emitting device 1 are fixed with screws 92. A screw hole (attachment hole) 11 through which a screw 92 is inserted is formed on the outside of the first cover 6 in the substrate 3 of the light emitting device 1. The flat plate portion 911 is formed with a screw groove that is screwed with the screw 92. Note that the above fixing may be performed with a bolt and a nut. In addition, the light emitting device 1 is provided with a base, the appliance main body 91 is provided with a socket-like support portion, the base is inserted into the support portion, and is screwed or fitted (bayonet, hook claws, etc.) 91 and the light emitting device 1 may be fixed.

  The instrument body 91 may have a shape as shown in FIG. The instrument main body 91 in FIG. 3B is provided with a circular flat plate portion 914, a side surface portion 915 that protrudes upward from the periphery of the flat plate portion 914, and an outward protrusion from the tip of the side surface portion 915. And a leading end portion 916. The side surface portion 915 spreads outward as it goes from the flat plate portion 914 side to the distal end portion 916 side, and further spreads outward from the middle. The instrument main body 91 in FIG. 3B has a flat shape and a lower height than the instrument main body 91 in FIG.

  Moreover, as another example of the lighting fixture 9 of this embodiment, there is a structure further including a heat sink 95 as shown in FIGS. The heat sink 95 is provided on the instrument main body 91. In the lighting fixture 9 of FIG. 4, when the light emitting device 1 is attached to the fixture main body 91, the substrate 3 of the light emitting device 1 is in direct contact with the heat sink 95, so that heat can be easily released from the substrate 3.

  Next, another example of the light emitting device 1 according to this embodiment will be described. The light emitting device 1a of FIG. 5 does not include the second cover 7 as the cover unit 5, but includes only the first cover 6. In FIG. 5, a portion where the screw hole 11 (see FIG. 1) is formed is omitted. The same applies to FIGS. 6 and 7 described later.

  The first cover 6 of FIG. 5 includes a cylindrical protruding portion 63 provided integrally with the upper surface portion 61 and the side surface portion 62 so as to protrude downward from the central portion 611 of the upper surface portion 61. The upper surface portion 61 and the side surface portion 62 are the same as the first cover 6 of FIG. The first cover 6 is fixed to the substrate 3 so that the light emitter 2 is accommodated in a region surrounded by the protrusion 63. The tip of the protrusion 63 is in contact with the side surface 312.

  A light reflecting portion (high reflecting film) 64 is formed on the inner surface of the first cover 6 at a portion covering the lighting circuit portion 4. That is, the light reflecting portion 64 is formed on a part of the inner surface of the upper surface portion 61, the inner surface of the side surface portion 62, and the outer surface of the protruding portion 63. Thereby, the light from the light emitter 2 can be reflected by the light reflecting portion 64.

  In the light-emitting device 1a of FIG. 5, in the 1st cover 6, the site | part 65 above the light-emitting body 2 plays the role as a lens. Therefore, the number of members can be reduced as compared with the case where a lens is provided separately from the first cover 6.

  6 and 7, a plurality of circuit components 41 are directly mounted on the substrate 3 without the support 43.

  The light emitter arrangement portion 31 of the substrate 3 in FIG. 6 is not formed in a tapered shape, and the outer diameter of the side surface 312 is the same from the one surface 311 side to the bottom.

  In the substrate 3 of FIG. 7, the other surface 313 of the light emitter placement portion 31 protrudes from the other surface 322 of the circuit placement portion 32. That is, a step is formed between the other surface 313 of the light emitter placement portion 31 and the other surface 322 of the circuit placement portion 32.

  In the light emitting devices 1, 1 a to 1 c of the present embodiment described above, the light emitter 2 and the lighting circuit unit 4 are arranged in a state of being fixed on the same surface (311, 321) of the substrate 3. As a result, the light emitting devices 1 and 1a to 1c of the present embodiment have the entire device in the thickness direction of the substrate 3 as compared with the structure in which the light emitter and the lighting circuit unit are arranged in different states. The height can be lowered.

  In the light emitting device 1c of FIG. 7, when the circuit component 41 is arranged on the other surface 322 side of the circuit arrangement portion 32, the circuit component 41 is connected to the other surface 313 of the light emitter arrangement portion 31 and the circuit arrangement portion 32. It will be arranged in a space formed between the other surface 322. Thereby, the circuit component 41 does not easily protrude from the other surface 313 of the light emitter placement portion 31, and the light emitting device 1 c (substrate 3) can be easily connected to the instrument main body 91 (see FIG. 3).

  In the light emitting devices 1, 1 a to 1 c of the present embodiment, a step is formed between the light emitter placement portion 31 and the circuit placement portion 32 in a state where the lighting circuit portion 4 is disposed around the light emitter 2. ing. That is, in the light emitting devices 1, 1 a to 1 c of the present embodiment, there is a height difference (height h 1) between the light emitter placement portion 31 and the circuit placement portion 32 in the thickness direction of the substrate 3. Accordingly, the light emitting devices 1 and 1a to 1c of the present embodiment are lighted with the light emitter 2 as compared with the case where the step is not formed, that is, when the light emitter arrangement portion 31 and the circuit arrangement portion 32 are flush with each other. The heat conduction path between the circuit portion 4 can be lengthened. As a result, heat conduction between the light emitter 2 and the lighting circuit unit 4 can be reduced.

  Therefore, according to the light emitting devices 1 and 1a to 1c of the present embodiment, both excellent heat dissipation and low profile can be achieved.

  Further, according to the light emitting devices 1, 1 a to 1 c of the present embodiment, when the second cover 7 covering the lighting circuit unit 4 is attached, the height difference between the light emitter arrangement unit 31 and the circuit arrangement unit 32 is used. Thus, the second cover 7 can be easily positioned.

(Embodiment 2)
The light emitting device 1d according to the second embodiment is implemented in that a groove (bottom recessed portion) 33 is formed between the light emitter arrangement portion 31 and the circuit arrangement portion 32 of the substrate 3, as shown in FIG. It is different from the light emitting device 1 according to the first embodiment (see FIG. 1). In addition, about the component similar to the light-emitting device 1 of Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted. Moreover, in FIG. 8, the part in which the screw hole 11 (refer FIG. 1) was formed is abbreviate | omitted. The same applies to FIGS. 9 to 11 described later.

  The groove 33 of the present embodiment is formed in an annular shape between the light emitter placement portion 31 and the circuit placement portion 32. The groove 33 is formed such that the sum of the depth a1 and the width a2 from the one surface 321 side of the substrate 3 is larger than the distance a3 from the bottom of the groove 33 to the other surface 322. Thereby, the heat path from the light emitter 2 to the lighting circuit portion 4 can be made longer than the distance from the light emitter 2 to the other surfaces 313 and 322.

  Further, the second cover 7 of the present embodiment is fixed so that the tip of the inner side surface portion 73 fits into the groove 33. In addition, description is abbreviate | omitted about the function similar to the 2nd cover 7 (refer FIG. 1) of Embodiment 1. FIG.

  As another example of the light emitting device 1d according to the present embodiment, there is a structure shown in FIGS. In the light emitting devices 1e to 1g of FIGS. 9 to 11, an intermediate portion 34 in which a plurality of grooves 341 and 342 are formed is provided between the light emitter placement portion 31 and the circuit placement portion 32. The intermediate portion 34 has a so-called bellows structure in which grooves 341 from one surface 343 and grooves 342 from the other surface 344 are alternately formed.

  In the light emitting devices 1d to 1g of the present embodiment described above, the bottomed recesses (grooves 33, 341, and 342) are formed between the light emitter placement portion 31 and the circuit placement portion 32. As a result, the light emitting devices 1d to 1g of the present embodiment have the light emitter 2, the lighting circuit portion 4, The heat conduction path between the two can be lengthened. As a result, heat conduction between the light emitter 2 and the lighting circuit unit 4 can be reduced.

  Furthermore, the light emitting device 1e in FIG. 9 employs the intermediate portion 34 having the bellows structure, thereby further extending the heat conduction path from the light emitter 2 to the lighting circuit portion 4 as compared with the light emitting device 1d in FIG. Can do.

  In addition, since the light emitting devices 1d to 1g of the present embodiment are formed with a bottomed recess between the light emitter placement portion 31 and the circuit placement portion 32, the light emitter placement portion and the circuit placement portion are separated from each other. The strength of the substrate 3 can be maintained as compared with the case where a through hole is formed therebetween.

  Furthermore, according to the light emitting devices 1d to 1g of the present embodiment, when the second cover 7 that covers the lighting circuit unit 4 is attached, the second cover 7 can be easily positioned using the bottomed recess of the substrate 3. Can be done.

(Embodiment 3)
As shown in FIG. 12, the light emitting device 1 h according to the third embodiment is the light emitting device according to the second embodiment in that the one surface 311 of the light emitter arrangement portion 31 and the one surface 321 of the circuit arrangement portion 32 are the same height. This is different from 1d (see FIG. 8). In addition, about the component similar to the light-emitting device 1d of Embodiment 2, the same code | symbol is attached | subjected and description is abbreviate | omitted. In FIG. 12, a portion where the screw hole 11 (see FIG. 1) is formed is omitted. The same applies to FIGS. 13 to 18 described later.

  In the substrate 3 of this embodiment, an annular recess 323 is formed on the other surface 322 side of the circuit arrangement portion 32. A part of the circuit component 41 is accommodated in the recess 323. The depth d <b> 1 of the recess 323 is designed so that the circuit component 41 accommodated in the recess 323 does not come out of the recess 323. Note that a description of functions similar to those of the substrate 3 (see FIG. 8) of the second embodiment will be omitted.

  In the lighting circuit portion 4 of the present embodiment, a plurality of circuit components 41 are not formed on the substrate 3 via the support columns 43 but directly on the substrate 3. In the light emitting device 1h of FIG. 12, the circuit component 41 is mounted on both sides, but it may be mounted on one side.

  In the second cover 7 of the present embodiment, the tip of the inner side surface portion 73 is fixed by the one surface 311 of the light emitter placement portion 31. In the second cover 7, a region including the lighting circuit unit 4 is filled with an insulating resin 44. Note that a description of the same functions as those of the second cover 7 (see FIG. 8) of the second embodiment will be omitted.

  FIG. 13 shows another example of the light emitting device 1h according to the present embodiment. In the light emitting device 1 i of FIG. 13, the substrate 3 includes a side surface portion 35 that protrudes in the vertical direction from the peripheral edge of the circuit arrangement portion 32 and is integrally provided with the light emitter arrangement portion 31, the circuit arrangement portion 32, and the intermediate portion 34. Yes.

  The side surface portion 35 is formed in a cylindrical shape, a fitting portion 351 that fits the first cover 6 is formed at the upper end, and a fitting portion 352 that fits the second cover 7a described later is formed at the lower end. Is formed.

  The first cover 6 in FIG. 13 does not include the side surface portion 62 but includes the upper surface portion 61 and the protruding portion 63 integrally. The first cover 6 is fixed to the substrate 3 by fitting the peripheral end of the upper surface portion 61 to the fitting portion 351 of the side surface portion 35. Thereby, the board | substrate 3 and the 1st cover 6 can be made easy to connect.

  Further, the light emitting device 1i of FIG. 13 further includes a second cover 7a for covering not only the second cover 7 but also the circuit component 41 disposed on the other surface 322 side of the substrate 3 as the cover unit 5. I have. The second cover 7a is formed in an annular shape. The second cover 7a is fixed to the substrate 3 by fitting the outer peripheral end thereof to the fitting portion 352 of the side surface portion 35 and the inner peripheral end of the second cover 7a to the fitting portion 345 of the intermediate portion 34. Yes. Thereby, the board | substrate 3 and the 2nd cover 7a can be made easy to connect. The space between the second cover 7a and the other surface 322 of the circuit arrangement portion 32 may be filled with resin, or may be filled with resin without providing the second cover 7a. Good.

  As another example of the light emitting device 1h according to the present embodiment, there is a structure shown in FIGS. In the light emitting devices 1j to 1l of FIGS. 14 to 16, the one surface 311 of the light emitter placement portion 31 and the one surface 321 of the circuit placement portion 32 are the same height, and the light emitter placement portion 31 and the circuit placement portion 32 In this structure, a groove 33 is formed between the two.

  17 and 18 show another structure of the light emitting device 1h according to the present embodiment. In the light emitting devices 1m and 1n of FIGS. 17 and 18, an intermediate portion 34 having a bellows structure is provided between the light emitter arrangement portion 31 and the circuit arrangement portion 32. In the intermediate portion 34, grooves 341 from one surface 343 and grooves 342 from the other surface 344 are alternately formed.

  In the light emitting devices 1h to 1n of the present embodiment described above, bottomed recesses (grooves 33, 341, 342) are formed between the light emitter placement portion 31 and the circuit placement portion 32, as in the second embodiment. ing. Thereby, the light-emitting devices 1h to 1n of the present embodiment have the light-emitting body 2, the lighting circuit section 4, and the light-emitting body 2 compared to the case where the bottomed recess is not formed between the light-emitting body arrangement section 31 and the circuit arrangement section 32. The heat conduction path between the two can be lengthened. As a result, heat conduction between the light emitter 2 and the lighting circuit unit 4 can be reduced.

  Furthermore, the light emitting device 1i in FIG. 13 employs the intermediate portion 34 having the bellows structure, thereby further extending the heat conduction path from the light emitter 2 to the lighting circuit portion 4 as compared with the light emitting device 1h in FIG. Can do.

(Embodiment 4)
The light emitting device 1o according to the fourth embodiment is different from the light emitting device 1 according to the first embodiment (see FIG. 1) in that the light emitter arrangement portion 31 is recessed from the circuit arrangement portion 32 as shown in FIG. To do. In addition, about the component similar to the light-emitting device 1 of Embodiment 1, the same code | symbol is attached | subjected and description is abbreviate | omitted. In FIG. 19, a portion where the screw hole 11 (see FIG. 1) is formed is omitted. The same applies to FIG. 20 described later.

  In the substrate 3 of the present embodiment, the light emitter arrangement portion 31 is formed in a tapered shape, and the side surface 312 narrows inward as it goes from the one surface 321 side to the one surface 311 side.

  Further, an annular recess 323 is formed on the other surface 322 side of the circuit arrangement portion 32. A part of the circuit component 41 is accommodated in the recess 323. The depth d <b> 1 of the recess 323 is designed so that the circuit component 41 accommodated in the recess 323 does not come out of the recess 323.

  As another example of the light emitting device 1o according to the present embodiment, there is a structure shown in FIG. The light emitting device 1p of FIG. 20 includes an intermediate portion 34 having a bellows structure between the light emitter placement portion 31 and the circuit placement portion 32 in a state where the light emitter placement portion 31 is recessed from the circuit placement portion 32. . In the intermediate portion 34, grooves 341 from one surface 343 and grooves 342 from the other surface 344 are alternately formed.

  In the light emitting devices 1o and 1p of the present embodiment described above, the light emitter 2 and the lighting circuit unit 4 are fixed on the same surface (311 and 321) of the substrate 3 as in the light emitting device 1 of the first embodiment. Is arranged in. As a result, the light emitting devices 1o and 1p of the present embodiment have a height of the entire device in the thickness direction of the substrate 3 as compared with the structure in which the light emitter and the lighting circuit portion are arranged on different surfaces. Can be lowered.

  Further, in the light emitting devices 1o and 1p of the present embodiment, the light emitter arrangement portion 31 and the circuit arrangement portion are arranged in a state where the lighting circuit portion 4 is arranged around the light emitter 2 as in the light emitting device 1 of the first embodiment. A step is formed between the first and second members. Thereby, the light-emitting device 1o, 1p of this embodiment can lengthen the heat conduction path | route between the light-emitting body 2 and the lighting circuit part 4 compared with the case where the level | step difference is not formed. As a result, heat conduction between the light emitter 2 and the lighting circuit unit 4 can be reduced.

  Furthermore, the light emitting device 1p of FIG. 20 employs the intermediate portion 34 having the bellows structure, thereby further extending the heat conduction path from the light emitter 2 to the lighting circuit portion 4 as compared with the light emitting device 1o of FIG. Can do.

  Therefore, according to the light emitting devices 1o and 1p of the present embodiment, it is possible to achieve both excellent heat dissipation and a low profile, similar to the light emitting device 1 of the first embodiment.

  In addition, the light-emitting device 1a-1p of each embodiment can be attached to the fixture main body 91 shown in FIG. Fixing of the flat plate portion 911 of the instrument main body 91 and the light emitting devices 1a to 1p may be performed by inserting the screw 92 into the screw hole 11, or may be performed by a bolt and a nut. Moreover, a base is provided in the light emitting devices 1a to 1p, a support part is provided in the instrument main body 91, the base is inserted into the support part, and the instrument main body 91 and the light emitting apparatuses 1a to 1p are fixed by screwing. May be. Moreover, either the concave member or the convex member is formed on the instrument main body 91 and the light emitting devices 1a to 1p, and when these members are fitted to each other, the instrument main body 91 and the light emitting devices 1a to 1p are locked. It may be fixed by, for example.

  Further, the electrical connection between the instrument main body 91 and the light emitting devices 1, 1 a to 1 p may be performed by deriving a feed line from the light emitting devices 1, 1 a to 1 p and connecting it to the instrument main body 91, You may carry out by providing electric power supply terminals, such as a pin, in the light-emitting devices 1 and 1a-1p, and connecting with the instrument main body 91. FIG.

1, 1a-1p Light-emitting device 2 Light-emitting body 3 Substrate 31 Light-emitting body arrangement | positioning part 311 One surface 32 Circuit arrangement | positioning part 321 One surface 33 Groove | channel (bottom recessed part)
341 groove (recessed bottom)
342 groove (recessed bottom)
4 lighting circuit part 5 cover part 9 lighting fixture 91 fixture body

Claims (7)

A light emitter;
A substrate on which the light emitter is disposed on one side;
A lighting circuit unit including a circuit component for lighting the light emitter,
The lighting circuit unit is disposed around the light emitter in a state of being fixed on the one surface side of the substrate,
In the light emitting device, the substrate has a step formed at least on the one surface side between a light emitter arrangement portion on which the light emitter is arranged and a circuit arrangement portion on which the lighting circuit portion is arranged.   The light emitting device according to claim 1, wherein the substrate has a difference in height between the light emitter arrangement portion and the circuit arrangement portion in a thickness direction.   The light emitting device according to claim 1, wherein the substrate has a bottomed recess formed between the light emitter placement portion and the circuit placement portion.   The light-emitting device according to claim 1, further comprising a cover portion that covers the lighting circuit portion.   The light emitting device according to claim 1, wherein the circuit component is mounted on the substrate.   The light emitting device according to claim 1, wherein the light emitter includes at least an LED element. The light emitting device according to any one of claims 1 to 6,
A lighting fixture comprising: a fixture main body to which the light emitting device is attached.

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