JP2013254875A - Method for manufacturing electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component capable of suppressing the inclination of a bent lead.SOLUTION: First, an intermediate component provided with a package 11 and leads 31 to 37 is prepared. One end sides of the leads 31 to 37 are fixed to the package 11, the other end sides are arranged outside the package 11, and the other end sides include a straight part. Next, the straight parts of the leads of the intermediate component is bent by using a bending die. The bending die used for bending has partial contact shapes 61, 64, 66, 67 with which the leads 31, 34, 36, 37 are brought into contact when inclined to one side where the leads 31, 34, 36, 37 are inclined about the leads 31, 34, 36, 37 which exceed allowance to incline to the one side after bending when the bending is performed by using a bending die 60 having a reference shape with which the straight parts of the leads 31 to 37 are equally brought into contact in width direction.

Description

  The present invention relates to a method for manufacturing an electronic component, and more particularly to a technology for manufacturing an electronic component in which a lead protrudes from a package, and particularly to a technology for processing a lead.

  An electronic component with leads protruding from the package is manufactured by integrally molding the package body on a lead frame in which the leads are connected to a frame. The lead frame is manufactured by punching or etching. When a lead frame is manufactured by punching, deformation such as twisting of the lead tends to occur. In response to this, various countermeasures have been proposed (see, for example, Patent Documents 1 to 3).

JP-A-5-277578 JP-A-8-250636 Japanese Patent Laid-Open No. 11-220083

  When the width and interval of the leads are reduced, it becomes difficult to punch out both sides of the leads at the same time. In that case, as shown in the explanatory diagram of FIG. 15A, first, the lead frame material 110 is disposed between the lower die 120 and the stripper 130, and one side 112 a of the lead 112 is formed by the punch 140. Punch out. Next, as shown in the explanatory diagram of FIG. 15B, the lead frame material 110 is disposed between the lower die 122 and the stripper 132, and the other side 112 b of the lead 112 is punched with a punch 142.

  Thus, if both sides of the lead 112 are punched separately, a difference in work hardening is likely to occur between the vicinity of one punched surface of the lead 112 and the vicinity of the other punched surface.

  When the width of the lead is small relative to the thickness of the lead, for example, in the case of a brass lead, when the ratio of width to thickness (width / thickness) is less than 3/2, the difference in work hardening is large. The lead does not bend straight and tilts to one side.

  For example, as shown in the plan view of FIG. 16A and the side view of FIG. 16B, with the lead 112 facing the bending die 150, a bending punch (not shown) is pushed against the tip end side 112x of the lead 112. In the case of bending by contact, if there is no difference in work hardening between the punched surface vicinity 112s, 112t on both sides of the lead 112, as shown in the side view of FIG. Turn straight without escaping.

  However, if the work hardening in the vicinity of one punching surface 112s of the lead 112 is relatively small and the work hardening in the vicinity of the other punching surface 112t is relatively large, as shown in the side view of FIG. The leading end side 112x of the processed lead 112 is inclined so as to be biased toward the side with relatively small work hardening.

  If the lead after bending is tilted, the tip position of the lead is shifted. If the lead tip position is greatly displaced, the pitch of the terminals formed at the tip of the lead is disturbed or the terminals are separated from the mounting substrate, so that the reliability of electrical connection with the mounting substrate is lowered.

  In view of such circumstances, the present invention intends to provide a method of manufacturing an electronic component that can suppress the inclination of a lead after bending.

  In order to solve the above problems, the present invention provides a method of manufacturing an electronic component configured as follows.

  The electronic component includes a first step and a second step. In the first step, an intermediate part is prepared. The intermediate part includes a package and a lead. One end side of the lead is fixed to the package. The other end side of the lead is disposed outside the package. The leading end side of the lead includes a straight portion (that is, a portion extending straight in one direction). In the second step, a bending die is arranged on one side with respect to the straight portion of the lead of the intermediate part, and the bending die is placed on the base end side of the straight portion (that is, a portion relatively close to the package) The lead is bent by pressing a bending punch arranged on the other side with respect to the straight portion against the tip side of the straight portion (that is, a portion relatively far from the package) in a state of facing the straight portion). To do. In the bending die used in the second step, the base end side of the linear portion of the lead is perpendicular to the width direction (that is, a direction connecting the base end side and the distal end side of the linear portion, and the bending die). If the bending die has a reference shape that uniformly abuts in a direction parallel to the direction along the die), the leading end side of the linear portion exceeds the allowable value and tilts to one side after the second step. In the second step, the base end side of the linear portion of the lead has a one-sided shape in which the lead comes to abut against the one side.

  In the above method, by using a bending die having a one-piece contact shape, a force acts to bend the straight portion of the lead so as to incline to the opposite side to the one-piece contact side. Therefore, a lead that is inclined if it is a reference shape can be bent in a direction that cancels the inclination. That is, it is possible to correct the inclination of the lead after bending, which occurs in the case of the reference shape, with the one-piece shape, and to suppress the inclination of the lead after bending.

  Preferably, the piece-per-cut shape of the bending die is such that a protrusion protruding from the reference shape is added to the reference shape.

  In this case, the shape of one-sided contact can be easily determined by a method such as determining the height of the protrusion according to the inclination of the lead.

  Preferably, if the bending die has the reference shape, the bending die has the reference shape with respect to the lead in which the inclination of the front end side of the linear portion is within the allowable range after the second step. In the second step, the base end side of the linear portion of the lead has a uniform contact shape to which an auxiliary protrusion that makes contact in the width direction is added. The height of the auxiliary protrusion is not less than the minimum value of the height of the protrusion and not more than the maximum value of the height of the protrusion.

  In this case, since the lead whose inclination is within the allowable range is in contact with the auxiliary protrusion evenly in the width direction, it does not tilt even if it is bent. A lead whose inclination falls within the allowable range is in contact with an auxiliary protrusion having the same height as the protrusion with which the lead whose inclination exceeds the allowable value contacts. It is possible to suppress the variation in the tip position.

  Preferably, the straight portion of the lead is also included on the one end side of the lead.

  In this case, an intermediate part in which the linear portion of the lead is integrally formed with the package can be easily manufactured, and the manufacture of the electronic part is facilitated.

  In the electronic component manufactured by the method of the present invention, a concave portion whose surface is depressed more than the other leads may be formed on the lead where the protrusion strongly contacts when bent with a bending die having a one-piece shape. is there. Therefore, the present invention provides the following electronic components.

  The electronic component includes: (a) a package; and (b) a plurality of leads that are fixed to the package at one end and curved at the other end and disposed outside the package. At least one of the leads has a surface recessed from the other leads at a position offset in the width direction of the lead in at least one of the curved portion arranged outside the package and the vicinity thereof. A recess is formed.

  In a specific aspect, the leads have outer leads arranged on both sides of the package and outside the package. The length of the outer lead arranged on one side of the package is longer than the length of the outer lead arranged on the other side of the package. The concave portion is formed in at least one of the outer leads arranged on the one side of the package.

  That is, the longer the outer lead, the greater the displacement of the tip position due to the inclination after bending. When the lengths of the outer leads on both sides of the package are different, it is preferable to suppress the inclination after bending for at least the longer outer lead (that is, the outer lead arranged on one side of the package). In this case, a recess is formed in at least one of the longer outer leads.

  According to the present invention, the inclination of the lead after bending can be suppressed.

It is an external view of an electronic component. Example 1 It is sectional drawing of an electronic component. Example 1 It is a top view of an electronic component. Example 1 It is sectional drawing of an electronic component. Example 1 It is a top view which shows the manufacturing process of an electronic component. Example 1 It is a top view which shows the manufacturing process of an electronic component. Example 1 It is a top view which shows the manufacturing process of an electronic component. Example 1 It is explanatory drawing of the punching process of a lead frame. Example 1 It is explanatory drawing of a bending process. (Comparative Example 1) It is explanatory drawing of a bending process. (Comparative Example 1) It is explanatory drawing of a bending process. Example 1 It is explanatory drawing of a bending process. Example 1 It is a photograph of the lead after bending. Example 1 It is a photograph of the lead after bending. (Comparative Example 1) It is explanatory drawing of a punching process. (Example) It is explanatory drawing of a bending process. (Example)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  <Example 1> First, the structure of the electronic component 10 to be manufactured will be described with reference to FIGS. FIG. 1 is an external view of the electronic component 10. 2 is a cross-sectional view of the electronic component 10 cut along line AA in FIG. FIG. 3 is a plan view of the electronic component 10 with the lid member 14 removed. 4 is a cross-sectional view taken along line BB in FIG.

  As shown in FIG. 1, in the electronic component 10, the first lead 20 and the second lead 30 protrude from both sides of the package 11.

  As shown in FIGS. 2 to 4, the package 11 includes a main body 12, a lid member 14, a sensor element 16 that detects inclination, and an IC element 18 such as an ASIC that processes a signal from the sensor element 16. ing. The main body 12 has a box shape having a recess 12p. The lid member 14 is bonded and fixed to the upper surface of the main body 12 and seals the concave portion 12p of the main body. The sensor element 16 and the IC element 18 are fixed to the bottom surface 12 a of the recess 12 p of the main body 12 with an adhesive 15. The adhesive 15 is preferably made of a silicone-based or fluorine-based material that remains flexible even after curing.

  In order to relieve external stress, the sensor element 16 and the IC element 18 are desirably surrounded by a potting material 13 made of, for example, a silicone-based or fluorine-based material that has flexibility even after curing.

  The first and second leads 20 and 30 have shapes in which base end pieces 20a and 30a and front end pieces 20c and 30c are connected to both ends of the intermediate pieces 20b and 30b in a substantially S shape. The base end pieces 20 a and 30 a penetrate the side wall of the main body 12. One end portions 20x and 30x of the base end pieces 20a and 30a are exposed in the recess 12p of the main body 12, and the other end portions of the base end pieces 20a and 30a are exposed to the outside of the main body 12. One end portions 20 x and 30 x of the base end pieces 20 a and 30 a are terminals, and are connected to the terminals of the IC element 18 through the wires 17. The tip pieces 20 c and 30 c are terminals connected to the mounting substrate 2.

  The base end pieces 20a and 30a of the first and second leads 20 and 30 have substantially the same length. The tip pieces 20c and 30c of the first and second leads 20 and 30 have substantially the same length. The intermediate piece 30 b of the second lead 30 is longer than the intermediate piece 20 b of the first lead 20. Therefore, as shown in FIG. 1, the electronic component 10 is mounted on the mounting substrate 2 in a state where the main body 12 of the package 11 of the electronic component 10 is inclined by the angle θ with respect to the mounting substrate 2.

  When a product in which the mounting substrate 2 on which the electronic component 10 is mounted is used, the mounting substrate 2 is inclined at an angle θ from the horizontal as shown in FIG. At this time, the direction 16z of the detection axis of the sensor element 16 becomes a vertical direction as indicated by an arrow 16z, and the sensor element 16 can detect the inclination with high accuracy.

  The first and second leads 20 and 30 are formed by punching a plate material made of a soft material such as a brass material and then bending it.

  Next, the manufacturing process of the electronic component 10 will be described with reference to FIGS.

  First, the outline of the manufacturing process will be described with reference to the main part plan views of FIGS.

  A lead frame 40 is formed as shown in FIG. 5B by punching the strip-shaped lead frame material 41 shown in FIG. 5A at a predetermined pitch. The lead frame 40 is formed with leads 20 and 30, auxiliary leads 46 and 47, and suspension leads 48 and 49 inside frame portions 42 and 44 connected in a rectangular shape.

  Next, as shown in FIG. 6C, the resin main body 12 is integrally formed by insert molding. The ends 20k, 30k, 48k, 49k of the leads 20, 30 and the suspension leads 48, 49 shown in FIG.

  Next, as shown in FIG. 6D, the sensor element 16 and the IC element 18 are fixed in the main body 12 and wired by wire bonding. Further, the connecting portions between the leads 20 and 30 and the frame portion 42, the auxiliary leads 46 and 47, and cutting are removed.

  Next, as shown in FIG. 6 (e), the lid member 14 is bonded and fixed to the main body 12, and the leads 20 and 30 are bent. At this time, after bending the distal end side of the outer lead that is disposed outside the package 11 and extends straight out of the leads 20 and 30, that is, the distal end pieces 20c and 30c, the proximal end side, that is, the intermediate piece 20b and Even if 30b is bent, it may be bent in the reverse order.

  Next, as shown in FIG. 7 (f), the suspension leads 48 and 49 are cut, and the individual pieces of the electronic component 10 from which the leads 20 and 30 protrude are taken out from the main body 12.

  Next, lead punching will be described with reference to FIG. FIG. 8 is an explanatory view schematically showing a section cut in the width direction (vertical direction in FIGS. 5 to 7).

  As shown in FIG. 5B, if the elongated leads 20 and 30 are arranged in parallel with each other at a narrow interval, both sides of each lead 20 and 30 cannot be punched simultaneously. Therefore, as shown in FIG. 8, punching is performed in a plurality of times.

  First, the unprocessed lead frame material 41 shown in FIG. 8A is sandwiched between the lower die 80 and the stripper 70 as shown in FIG. 8B, and the frame portion 44 and the first lead 31 are sandwiched. And a space 51 between the fourth lead 34 and the fifth lead 35 is punched out.

  Next, as shown in FIG. 8C, the lead frame material 41 a is sandwiched between the lower die 82 and the stripper 72, the first lead 31 and the second lead 32 52, and the fifth one. Between the lead 35 and the sixth lead 36 is punched out. At this time, in the portion 91 for pressing the second lead 32 and the portion 92 for pressing the fifth lead 35 having a narrow width, the pressure for pressing the lead frame material 41 is set higher than the other portions.

  Next, as shown in FIG. 8D, the lead frame material 41 b is sandwiched between the lower die 84 and the stripper 74, the second lead 32 and the third lead 33 54, and the sixth The space between the lead 36 and the seventh lead 37 is punched out. At this time, the pressure is increased for the portion 93 for pressing the second lead 33 and the portion 94 for pressing the sixth lead 36, which are narrow in width, like the portions 91 and 92 described above.

  Next, as shown in FIG. 8E, the lead frame material 41c is sandwiched between the lower die 86 and the stripper 76, the third lead 33 and the fourth lead 34 56, and the seventh lead Between the lead 37 and the frame portion 44 is punched out. At this time, the pressure is similarly increased for the portion 94 for pressing the fourth lead 34 and the portion 97 for pressing the seventh lead 37.

  As described above, the lead frame material 41d punched and processed in a plurality of times can make the deformation of the leads 31 to 37 after the punching work within the allowable range. That is, the respective leads 31 to 37 after the punching process extend in parallel and straight.

  Next, lead bending will be described with reference to FIGS.

  The leads 31 to 37 punched as shown in FIG. 8 have a difference in work hardening near the punched surfaces on both sides. As described above, a lead having a large difference in work hardening is inclined to a side where work hardening is small when bending is performed (see FIG. 16C). Therefore, when the leads 31 to 37 are bent using the bending die 60 as in Comparative Example 1 shown in FIGS. 9 and 10, some of the leads 31, 34, 36, and 37 are inclined.

  9 and 10 are explanatory diagrams for explaining the bending process of the lead of Comparative Example 1. FIG. FIG. 9 shows a state before bending, and FIG. 10 shows a state after bending. FIG. 9A and FIG. 10A are plan views. FIG. 9B and FIG. 10B are side views.

  As shown in FIG. 9, the bending die 60 is disposed below the leads 31 to 37, and the facing surface 60 s of the bending die 60 is the base end side 38 of the leads 31 to 37 (that is, a portion relatively close to the package 11). ), The stripper 69 disposed above the leads 31 to 37 is lowered, the leads 31 to 37 are pressed, the bending punch 68 is lowered, and the leading end side 39 of the leads 31 to 37 (i.e., The tip side 39 of the leads 31 to 37 is bent downward by pressing against a portion relatively far from the package 11.

  At this time, the leads 31 to 37 abut against the facing surface 60s of the bending die 60 evenly in the width direction (left and right direction in FIG. 9). That is, the bending die 60 has a reference shape in which the leads 31 to 37 are in contact with each other evenly in the width direction.

  By bending, as shown in FIG. 10, the tip side 39 of some of the leads 31, 34, 36, 37 is inclined with respect to the center line indicated by the chain line. The tip side 39 of the other leads 32, 33, 35 is substantially straight with the inclination with respect to the center line within the allowable range.

  The tip positions of the inclined leads 31, 34, 36, and 37 are shifted in the directions indicated by the arrows 31t, 34s, 36s, and 37s in FIG. 8 (e). The longer the arrows 31t, 34s, 36s, and 37s, the greater the inclination of the leads 31, 34, 36, and 37, and the greater the displacement of the tip position.

  In order to correct the inclination of the leads 31, 34, 36, and 37 after such bending, in the first embodiment, bending is performed as shown in FIGS. 11 and 12. The longer the intermediate piece, the larger the deviation of the lead tip position, so the inclination of at least the second lead 30 is corrected.

  11 and 12 are explanatory views for explaining the bending process of the lead according to the first embodiment. FIG. 11 shows a state before bending, and FIG. 12 shows a state after bending. FIG. 11A and FIG. 12A are plan views. FIG.11 (b) and FIG.12 (b) are side views.

  As shown in FIGS. 11 and 12, bending is performed in a state where the protrusions 61, 64, 66, and 67 are formed on the facing surface 60 s of the bending die 60.

  The protrusions 61, 64, 66, and 67 are formed so as to be offset toward the side where the leads 31, 34, 36, and 37 are inclined in the region where the leads 31, 34, 36, and 37 are opposed. That is, as shown in FIG. 10B, the leads 34, 36, and 37 that are inclined so that the tip positions are shifted to the left are within the region where the leads 34, 36, and 37 are opposed, as shown in FIGS. The protrusions 64, 66, and 67 are formed at positions shifted to the left in FIG. As shown in FIG. 10B, the lead 31 tilted so that the tip position is shifted to the right, as shown in FIG. 11 and FIG. Form.

  Note that the protrusions only need to be offset in the region where the leads face each other, and even if the protrusion overlaps the center line, it is only required to be offset to one side.

  The height of the protrusions 61, 64, 66, and 67 is increased as the inclination of the leads 31, 34, 36, and 37 is increased. In other words, assuming that H1 <H2 <H3, the height of the protrusion 64 for the lead 34 having the smallest inclination is set to the lowest H1. The height of the protrusions 61 and 66 for the leads 31 and 36 having a medium inclination is set to a medium H2. The height of the protrusion 67 for the lead 37 having the largest inclination is assumed to be the highest H3.

  The bending die 60 on which the protrusions 61, 64, 66, and 67 are formed has a one-sided shape in which the leads 31, 34, 36, and 37 are in contact with each other toward the inclined side. If the height of the protrusion is determined in accordance with the inclination of the lead, the shape of one piece can be easily determined.

  In a state where the bending die 60 is disposed below the leads 31 to 37 and the facing surface 60s of the bending die 60 is in contact with the proximal end side 38 of the leads 31 to 37 (that is, a portion relatively close to the package 11), The bending punch 68 arranged on the upper side of the leads 31 to 37 is lowered and pressed against the distal end side 39 of the leads 31 to 37 (that is, a portion relatively far from the package 11), thereby leading the distal end side of the leads 31 to 37. 39 is bent downward.

  At this time, since the positions where the leads 31, 34, 36, and 37 abut against the protrusions 61, 64, 66, and 67 are offset in the width direction, the leads 31, 34, 36, and 37 are opposite to the abutting side. The force which tries to bend so that it may incline to the side acts. Therefore, the leads 31, 34, 36, and 37 can be bent in a direction that cancels the inclination caused by the difference in work hardening. Thereby, the inclination of the leads 31, 34, 36, 37 can be corrected, and the inclination of the leads 31, 34, 36, 37 after bending can be suppressed.

  At the time of bending, the protrusions 61, 64, 66, and 67 are in strong contact with the leads 31, 34, 36, and 37. For this reason, due to the contact with the protrusions 61, 64, 66, 67, the leads 31, 34, 36, 37 may be formed with recesses whose surface is recessed compared to the other leads. Since the recess is formed corresponding to the protrusions 61, 64, 66, and 67, the lead 31, 34, 36, and 37 are in contact with the base end piece 30a by contact with the protrusions 61, 64, 66, and 67. At least one of the curved portion of the intermediate piece 30b and the vicinity thereof is formed at a position offset in the width direction of the leads 31, 34, 36, and 37. Since at least the second lead 30 is bent by providing a protrusion on the bending die, when a recess is formed by the protrusion, a recess is formed in at least one of the second leads 30.

  The height at which the leads 32, 33, and 35 where the tilt after bending is not a problem is lower than the leads 31, 34, 36, and 37 that are in contact with the protrusions 61, 64, 66, and 67 as they are. . Due to this difference in contact height, variations in springback occur, and variations in the tip positions of the leads 31 to 37 become large.

  Therefore, it is preferable to provide auxiliary projections 62, 63, 65 on the bending die 60 for the leads 32, 33, 35 in which the inclination after bending is not a problem. The auxiliary protrusions 62, 63, 65 are formed so that the leads 32, 33, 35 abut in the width direction in the region where the leads 32, 33, 35 of the facing surface 60s of the bending die 60 face each other. In this case, the auxiliary protrusions 62, 63, 65 are preferably formed so that the leads 32, 33, 35 are in contact with the entire width direction.

  The height H0 of the auxiliary protrusions 62, 63, 65 is, for example, the same as the height H1 of the lowest protrusion 64 among the protrusions 61, 64, 66, 67. That is, H0 = H1.

  When the auxiliary protrusions 62, 63, 65 are provided, the leads 32, 33, 35 that contact the auxiliary protrusions 62, 63, 65 and the leads 31, 34, 36, 37 that contact the protrusions 61, 64, 66, 67 are formed. The difference in springback can be reduced, and variations in the tip positions of the leads 31 to 37 can be reduced.

  If the height H0 of the auxiliary protrusions 62, 63, 65 is between the minimum value H1 and the maximum value H3 of the heights of the protrusions 61, 64, 66, 67, that is, if H1 ≦ H0 ≦ H3, the auxiliary The range of variation in springback of the leads 32, 33, and 35 forming the protrusions 62, 63, and 65 is within the range of variation in springback of the leads 31, 34, 36, and 37 that provide the projections 61, 64, 66, and 67. Therefore, the variation in the springback of the leads 31 to 37 can be minimized.

  <Manufacturing Example> Hereinafter, a manufacturing example of the electronic component 10 will be described.

  A lead frame material 41 having a thickness of 0.2 mm obtained by plating Ni / Au on brass is punched into seven first and second leads 20 each having a pitch of 0.65 mm and a width of 0.3 mm. A lead frame 40 having 30 formed thereon was produced. The punching process was performed in the order shown in FIG. The main body 12 was integrally formed by insert molding using a synthetic resin material such as polyphenylene sulfide resin (PPS), and then the first and second leads 20 and 30 cut from the lead frame 40 were bent.

  The length of the intermediate piece 30 b of the second lead 30 is about 0.5 mm, which is longer than the intermediate piece 20 b of the first lead 20. The longer the intermediate piece, the greater the deviation of the lead tip position. Therefore, a protrusion and an auxiliary protrusion were formed on the bending die used for bending the second lead 30.

  In Production Example 1, as shown in FIGS. 11 and 12, the opposed surface 60 s of the bending die 60 used for bending the second lead 30 is brought into contact with ½ of the width of the leads 31, 34, 36, and 37. The second lead 30 was bent in a state in which the protrusions 61, 64, 66, and 67 to be formed and the auxiliary protrusions 62, 63, and 65 that contact the entire widths of the leads 32, 33, and 35 were formed. In Production Example 2, only the protrusions 61, 64, 66, and 67 are formed on the facing surface 60s of the bending die 60 and the auxiliary protrusions 62, 63, and 65 are not formed, and the second lead 30 is bent. Went. As Comparative Example 1, the second lead 30 was bent in a state where the protrusions 61, 64, 66, 67 and the auxiliary protrusions 62, 63, 65 were not formed on the facing surface 60 s of the bending die 60.

  The opposing surfaces 60s of the cemented carbide bending die 60 were subjected to electric discharge machining to form 0.3 mm × 0.2 mm rectangular projections 61, 64, 66, 67 and auxiliary projections 62, 63, 65. The protrusions 61, 64, 66, and 67 are formed so that the short sides of the protrusions 61, 64, 66, and 67 overlap the center line of the region where the leads 31, 34, 36, and 37 are opposed. The auxiliary protrusions 62, 63, 65 were formed so as to be disposed in the entire width direction of the region where the leads 32, 33, 35 face each other. The height H0 of the auxiliary projections 62, 63, 65 for the leads 32, 33, 35 and the height H1 of the projection 64 for the leads 34 are 0.019 mm, and the height H2 of the projections 61, 66 for the leads 31, 36 Was 0.022 mm, and the height H3 of the protrusion 67 for the lead 37 was 0.025 mm.

  FIG. 13 shows a photograph of the second lead 30 after bending in Production Example 1. FIG. 14 shows a photograph of the second lead 30 after bending in the comparative example. From FIGS. 13 and 14, it can be seen that the manufacturing example 1 has a smaller inclination of the second lead 30 after the bending than the comparative example 1.

For each of the four samples of Production Example 1, Production Example 2 and Comparative Example 1, the coordinates of the normal direction of the centers of the tip pieces 30c of the seven second leads 30, that is, the terminals contact the mounting substrate. The position in the direction of separation was measured. The difference (R) between the maximum value (MAX) and the minimum value (MIN) of the measured value is the magnitude of the variation in the tip position. The results of measuring the variation in the tip position of the second lead 30 are shown in the following Tables 1 to 3. The unit of the measured value is mm.

  In Production Example 2 in Table 2 in which only the protrusions are formed on the bending die, the variation in the tip position is large. On the other hand, in the manufacturing example 1 of Table 1 to which the auxiliary protrusion is added, the variation in the tip position is as small as the comparative example 1 of Table 3. From this, it can be seen that the variation in the tip position is suppressed by the addition of the auxiliary protrusion.

  <Summary> As described above, by forming the protrusion on the bending die, the inclination of the lead after bending can be suppressed.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, the shape and position of the protrusions are not limited to the examples. It is also possible to make the upper surface of the projection curved or tilted or to provide unevenness. A plurality of protrusions may be formed for one lead.

  Alternatively, the contact shape may be formed by forming a recess such as a groove in a region where the lead faces.

  The present invention can be widely applied not only to the inclination of the lead due to the difference in work hardening but also to the case where the inclination of the lead occurs if the bending die is a reference shape.

DESCRIPTION OF SYMBOLS 10 Electronic component 11 Package 11 Unexamined-Japanese-Patent No. 12 Main body 12a Bottom surface 12p Concavity 13 Potting material 14 Lid member 15 Adhesive 16 Sensor element 17 Wire 18 IC element 20 First lead 20a Base piece 20b Intermediate piece 20c Tip piece 20x End part 30 Second lead 30a Base end piece 30b Intermediate piece 30c End piece 30x End portion 31-37 Lead 38 Base end side 39 Front end side 40 Lead frame material 42, 44 Frame portion 46, 47 Auxiliary lead 48, 49 Suspended lead 60 Bending die 60s Opposite (per side shape)
60s facing surface (reference shape)
61 Protrusion (shape per piece)
62,63 Auxiliary protrusion (Equal contact shape)
64 protrusions (per-piece shape)
65 Auxiliary protrusion (Equal contact shape)
66,67 Protrusion (shape per piece)
68 Bending dies 69, 70, 72, 74, 76 Strippers 80, 82, 84, 86 Dies

Claims (6)

Package,
One end side is fixed to the package, the other end side is disposed outside the package, and the leading end side includes a straight portion,
A first step of preparing an intermediate part comprising:
A bending punch disposed on the other side with respect to the linear portion in a state where a bending die is disposed on one side with respect to the linear portion of the lead of the intermediate part, and the bending die is opposed to the proximal end side of the linear portion. A second step of bending the straight portion of the lead by pressing against the tip side of the straight portion;
With
The bending die used in the second step is
If the bending die has a reference shape in which the base end side of the straight portion of the lead is uniformly contacted in the width direction, the lead end of the straight portion exceeds the allowable value and tilts to one side after the second step. about,
The method of manufacturing an electronic component according to claim 2, wherein in the second step, the base end side of the linear portion of the lead has a one-sided shape in which the lead side is biased toward the one side.   2. The method of manufacturing an electronic component according to claim 1, wherein the one-piece shape of the bending die is obtained by adding a protrusion protruding from the reference shape to the reference shape. The bending die is
If the bending die has the reference shape, after the second step, the leading end side inclination of the linear portion is within the allowable value range,
The reference shape has a uniform contact shape in which auxiliary projections are added in which the base end side of the linear portion of the lead is uniformly contacted in the width direction in the second step,
3. The method of manufacturing an electronic component according to claim 2, wherein the height of the auxiliary protrusion is not less than the minimum value of the height of the protrusion and not more than the maximum value of the height of the protrusion.   4. The method of manufacturing an electronic component according to claim 1, wherein the straight portion of the lead is also included on the one end side of the lead. 5. Package,
A plurality of leads having one end fixed to the package and the other end curved and arranged outside the package;
With
At least one of the leads has a surface recessed from the other leads at a position offset in the width direction of the lead in at least one of the curved portion arranged outside the package and the vicinity thereof. An electronic component characterized in that a concave portion is formed. The lead has outer leads disposed on the outside of the package on both sides of the package;
The outer lead arranged on one side of the package is longer than the outer lead arranged on the other side of the package,
6. The electronic component according to claim 5, wherein the recess is formed in at least one of the outer leads arranged on the one side of the package.