JP2013254565A - Thin, light, and economical waterproof led light emitting plate - Google Patents

Thin, light, and economical waterproof led light emitting plate Download PDF

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JP2013254565A
JP2013254565A JP2012127619A JP2012127619A JP2013254565A JP 2013254565 A JP2013254565 A JP 2013254565A JP 2012127619 A JP2012127619 A JP 2012127619A JP 2012127619 A JP2012127619 A JP 2012127619A JP 2013254565 A JP2013254565 A JP 2013254565A
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module
waterproof
led
light
led module
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Kunji Mitoma
訓次 三苫
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I ENE PLANNING CO Ltd
I-ENE PLANNING CO Ltd
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I ENE PLANNING CO Ltd
I-ENE PLANNING CO Ltd
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  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

PROBLEM TO BE SOLVED: To solve a problem of an increase of the weight and production cost of a module on which LEDs and electrical components are soldered for waterproofness when used outdoors, since the entire module should be covered by transparent resin or the whole of a light emitting plate should be housed in a waterproof box because of difficult waterproof processing resulting from the module having unevenness, thus causing a large scale of equipment in either case.SOLUTION: An LED module is manufactured as thin as possible to enable lighting up. To attain waterproofness, the thin module is sealed tightly by a transparent film. The transparent film covering the module surface absorbs its thickness and expanded to adhere to the module. Waterproof processing can be carried out because of the expansion and adhesion. For the waterproofing of a wide area, waterproof processing can be performed module by module, and thereby there is no problem even if the module is installed on a widest possible area. As compared with the case that the entire module is housed in a waterproof case, an increases of its weight, size, and cost or the like can be suppressed largely.

Description

本発明は、LEDの防水機能を持たせる技術である。LEDモジュールを薄型にして、透明フイルムで密閉し、水分を遮断するものであり、LED等の電子部品を薄型に仕上げる事で軽量で低コストの防水を施す事が可能となる。   The present invention is a technique for providing a waterproof function of an LED. The LED module is made thin, sealed with a transparent film to block moisture, and light-weight and low-cost waterproofing can be performed by thinning the electronic parts such as LED.

LEDによる光源が普及してきたが、屋外使用には防水が必要である。LEDは他の光源に比べ小さな発光体を多数設置する必要があるため防水加工をする場合、全体を防水カバーで覆えば問題は解決するが、カバーの重量、厚さ、コスト高などの問題を解決する必要があった。LEDモジュールを直接透明フイルムで密封する事でこの問題を解決するもので、伸度のある透明フイルムの実現でこの防水方法が可能となった。   LED light sources have become widespread, but waterproofing is necessary for outdoor use. Since it is necessary to install a lot of light emitters that are smaller than other light sources, the problem can be solved by covering the whole with a waterproof cover, but problems such as the weight, thickness, and high cost of the cover. There was a need to resolve. This problem can be solved by directly sealing the LED module with a transparent film, and this waterproofing method can be realized by realizing a transparent film with elongation.

LEDモジュールのカバーに使用する透明フイルムは、LEDモジュールの厚さ5mm以内では充分追従する伸度のある透明フイルムを使用する。透明フイルムをLEDモジュールの上から圧着するとモジュールの平面及び厚さを含み全体を完全に密封する事が可能となる。   The transparent film used for the cover of the LED module is a transparent film with sufficient elongation to follow the thickness of the LED module within 5 mm. When the transparent film is pressure-bonded from above the LED module, it is possible to completely seal the whole including the plane and thickness of the module.

伸度のある透明フイルムは色々な種類がある、フッ素無延伸フイルム、アクリルフイルム、ポリカーボネイトフイルム、無延伸ポリエステルフイルム等がり、これらの片面に粘着加工を施してLEDモジュールの表面から圧着するとLEDモジュールの厚さを吸収して背面板に密着して防水機能を発揮する。   There are various types of stretchable transparent films such as fluorine unstretched film, acrylic film, polycarbonate film, unstretched polyester film, etc. Absorbs the thickness and adheres to the back plate to provide a waterproof function.

LEDモジュールを背面板にネジ止めすると、自動的にアースされる。背面板はアルミ複合板3mmを中心に厚さを前後して使用条件に応じてそれらを用いる。アルミ複合板は発砲ポリプロピレンの両面に薄いアルミ板が張り付けられている。LEDモジュールをM3x5mmのタッピングネジで留めると、複合板の表面アルミ板を貫通して裏面のアルミ板に達した位置で止まり、仕上がり状態は安全である。表面のアルミ板の何処かで陰極につなぐと全てのLEDモジュールの陰極につなげる事が出来る。   When the LED module is screwed to the back plate, it is automatically grounded. The back plate is used in accordance with the conditions of use, with the thickness around a 3 mm aluminum composite plate. The aluminum composite plate has a thin aluminum plate attached to both sides of the foamed polypropylene. When the LED module is fastened with an M3 × 5 mm tapping screw, it stops at the position where it penetrates the front surface aluminum plate of the composite plate and reaches the back surface aluminum plate, and the finished state is safe. If it is connected to the cathode at somewhere on the aluminum plate on the surface, it can be connected to the cathode of all LED modules.

特開2000−113917号公報JP 2000-113917 A

LEDを屋外で使用する時防水が必要である、モジュール上にLED及び電子部品がハンダ付けされているが、それには凹凸があり防水加工が非常に難しい。この為モジュール全体を透明樹脂で覆うか、発光板全体を防水箱に収納するかであるが、両方とも設備が大がかりとなり、重量も増え、製造コストを押し上げる。   The LED and electronic components are soldered on the module, which requires waterproofing when the LED is used outdoors, but it is uneven and very difficult to waterproof. For this reason, the entire module is covered with a transparent resin or the entire light-emitting plate is housed in a waterproof box. However, both increase the equipment, increase the weight, and increase the manufacturing cost.

大型看板などへLEDを使用する時、広い面積の防水は非常に難しい、LED個々への防水は困難であり、必然的にある程度まとめて防水する必要がある。これらの防水はその始末方法も複雑であり、継ぎ目からの浸水などのトラブルになりやすい。   When an LED is used for a large signboard or the like, it is very difficult to waterproof a large area. It is difficult to waterproof an individual LED, and it is inevitably necessary to waterproof to some extent. These waterproofing methods are complicated in their cleaning methods, and are prone to troubles such as flooding from seams.

LEDを発光板の光源に使用する時、LEDの素子は小さく多地点に分散する必要がある。平面発光体には全体が均一になる必要があり、防水によりそれらの明るさが変化する事は許容されないのでその処置は精度の高い管理が必要である。   When an LED is used as a light source of a light emitting plate, the LED elements are small and need to be dispersed at multiple points. Flat light emitters need to be uniform as a whole, and their brightness is not allowed to change due to waterproofing, so that the treatment requires high-precision management.

LEDモジュールを出来るだけ薄く仕上げて点灯出来るようにする。薄いモジュールを透明フイルムで密封することにより防水処理を可能とする。例えば図2に示す通り全体を5mm厚以内に仕上げると、表面に貼る透明フイルムではその厚さを十分吸収して伸びて密着する。伸びて密着する事で完全な防水加工が出来る。   Finish the LED module as thin as possible so that it can be lit. A thin module is sealed with a transparent film to enable waterproofing. For example, as shown in FIG. 2, when the whole is finished within 5 mm thickness, the transparent film stuck on the surface absorbs the thickness sufficiently and stretches and adheres. It can be completely waterproofed by stretching and sticking.

広い面積への防水については、モジュール単位で防水が出来るので、モジュールがどこまで広く設置されても問題なく対応できる。防水のための新たな機材や設備は不要である。また、防水加工に使われる透明フイルムは重量も微々たるもので大きなコストアップにはならない。全体を防水ケースに収納する場合と比べて、重量、大きさ、コストは格段に抑える事ができる。   As for waterproofing over a large area, it can be waterproofed in units of modules, so it can be handled without problems no matter how wide the modules are installed. New equipment and equipment for waterproofing are not required. In addition, the transparent film used for waterproofing has a slight weight and does not increase the cost. Compared with the case where the whole is housed in a waterproof case, the weight, size, and cost can be significantly reduced.

LEDモジュールをネジ止めするアルミ複合板は発泡樹脂の両面にアルミ薄板が貼ってあり、軽くて曲げやそりに強い構造となっている。アルミ複合板にLEDモジュールをネジ止めすると自動的にアースされる。この事はLEDモジュールに配線する時、陽極のみ配線すればよい。従って、配線は1本で済み透明フイルムで防水する時密着性が良く防水機能が発揮する。   The aluminum composite plate for screwing the LED module has a thin aluminum plate on both sides of the foamed resin, and is light and resistant to bending and warping. When the LED module is screwed to the aluminum composite plate, it is automatically grounded. This means that only the anode needs to be wired when wiring to the LED module. Therefore, only one wire is required, and when waterproofing with a transparent film, the adhesion is good and the waterproof function is exhibited.

LEDモジュールを背面板に取り付けて配線する時、配線はモジュールの下方に下ろす、即ち配線は上向きとなる。この状態でモジュールと配線を透明フイルムで密封すると、上部からの水は侵入せず防水が出来る。配線部の防水をより強固にするには、配線周囲にシリコン樹脂などを塗布する事により強固な防水が実現する。   When the LED module is attached to the back plate and wired, the wiring is lowered below the module, that is, the wiring is upward. If the module and the wiring are sealed with a transparent film in this state, the water from the top does not enter and can be waterproofed. In order to further strengthen the waterproofing of the wiring portion, a strong waterproofing is realized by applying a silicone resin or the like around the wiring.

平面発光体が大量に必要な場合、LEDモジュール単位で防水する事に代わり発光版全体をフイルムラミネートして防水しても良い。この場合は、広い透明フイルムをラミネーターなどの機器を使って大量に貼り合わせする事でコストダウンを実現する。   When a large amount of flat light emitters are required, the entire light emitting plate may be film laminated to be waterproofed instead of waterproofing in units of LED modules. In this case, the cost can be reduced by laminating a large amount of transparent film using a device such as a laminator.

LEDモジュール単位で防水した場合の防水性能は下記の表1に示すとおり防水性能IPX6級相当である。面発光体を垂直に立てて放出ノズルよりあらゆる方向から水を散布する試験では規程の時間を経過しても点灯に支障はない。
As shown in Table 1 below, the waterproof performance when the LED module is waterproof is equivalent to the waterproof performance IPX6 class. In the test in which the surface light emitter is set up vertically and water is sprayed from all directions from the discharge nozzle, there is no problem in lighting even if the specified time has elapsed.

LEDによる発光板の防水には、発光板全体を防水ケースに入れる方法が主流である。収納ケースは設備が大掛かりになり製造コストを押し上げる。その為防水仕様については高コストとなりその普及を妨げていた。LEDモジュール単位の防水により特別な収納ケースは不要となり、製造コストを抑えその普及を促すもの思われる。   In order to waterproof the light emitting plate by the LED, a method of placing the entire light emitting plate in a waterproof case is the mainstream. The storage case requires a large amount of equipment and increases manufacturing costs. For this reason, waterproofing was expensive and hindered its spread. It is considered that a special storage case is not required due to the waterproofing of the LED module unit, and the manufacturing cost is suppressed and the spread is promoted.

図1は、面発光体の正面図FIG. 1 is a front view of a surface light emitter. 図2は、面発光体の断面図2 is a cross-sectional view of a surface light emitter. 図3は、面発光体の光拡散板を取り除いた正面図FIG. 3 is a front view of the surface light emitter with the light diffusion plate removed. 図4は、LEDモジュールとその表面へフイルムを貼った正面図Fig. 4 is a front view of the LED module and a film attached to the surface. 図5は、LEDモジュールとその上面へフイルムを貼った断面図Fig. 5 is a cross-sectional view of the LED module and film on the top surface

面発光体を形成する時、LEDを任意の間隔で分散して均一な光の面を作る必要がある。LEDモジュール(2)の光の量(ルーメン)が同じの時、LEDモジュールの間隔と光拡散板までの高さにより表2の通り明るさの差が出てくる。製作コストを抑えるには、必要な明るさに合わせて可能な限り高くしてLEDモジュールを少なく取付けるのが望ましい。
When forming a surface light emitter, it is necessary to disperse the LEDs at arbitrary intervals to create a uniform light surface. When the amount of light (lumen) of the LED module (2) is the same, a difference in brightness appears as shown in Table 2 depending on the distance between the LED modules and the height to the light diffusion plate. In order to reduce the manufacturing cost, it is desirable to install as few LED modules as possible according to the required brightness.

設置スペースが狭くて高く出来ない時は、LEDモジュールの間隔を狭くする。しかし、使用するLEDモジュールが多くなり製作原価が上がり経済活動と逆行する。また、光の量も増えて必要以上の明るさとなる。明るさを抑え使用電力を抑えるには通電量を制御する対策が必要となるが、原価アップは避けられず表2に基づく適正な高さが望ましい。   If the installation space is too small to be high, narrow the interval between the LED modules. However, the number of LED modules to be used increases and the manufacturing cost increases, which is contrary to economic activity. In addition, the amount of light increases and the brightness becomes higher than necessary. Although measures to control the amount of energization are necessary to reduce the brightness and power consumption, an increase in cost is inevitable and an appropriate height based on Table 2 is desirable.

設置したLEDモジュールに防水を施す時、図5に示す通りLEDモジュールを背面板(3)のアルミ複合板等にネジ止めして、配線をした後、透明フイルム(6)を貼りつける。透明フイルム貼りには専用の道具を使い、しわの発生を抑えて密着するように貼る。面発行体が垂直であれば、水分は上から下に流れるので、下部に位置する配線部分から水の侵入は無く防水機能を持つ表示板が出来る   When waterproofing the installed LED module, as shown in FIG. 5, the LED module is screwed to an aluminum composite plate or the like of the back plate (3) and wired, and then a transparent film (6) is attached. A special tool is used to paste the transparent film, and the sticking is done to prevent wrinkling. If the surface issuer is vertical, moisture flows from top to bottom, so there is no water intrusion from the wiring part located at the bottom, and a waterproof display board can be made.

LEDモジュールをたて・よこ同じ間隔で配置して背面板(3)にネジ止めする。背面板はアルミ複合版等の金属で出来ており、ネジ止めする事でアースの機能をもつ。LEDモジュールは表面の明るさに合わせて間隔を決めるか設置出来るスペースに合わせて決める。LEDモジュールをネジ止めしたら、陽極のみ配線することでLEDを点灯させる。使う目的によっては陽極と陰極を反対にして背面板から陽極、リード線を陰極にして使用しても構わない。   Place the LED modules vertically and horizontally at the same interval, and screw them to the back plate (3). The back plate is made of metal such as aluminum composite plate, and has the function of grounding by screwing. The LED module is determined according to the surface brightness or according to the space where it can be installed. Once the LED module is screwed, the LED is lit by wiring only the anode. Depending on the purpose of use, the anode and cathode may be reversed and the back plate may be used as the anode and the lead wire as the cathode.

陽極(5)のみ配線する事で配線は簡素化する、表面に貼る透明フイルムの接点も少なくなり、防水性能も向上する。簡素化した陽極配線から電流が流れてLEDを通過して背面板に流れ込みLEDが点灯する。発光箱の表面に設置された光拡散板(4)で照度が平均化され均一な発光板(1)が実現可能となる。   Wiring only the anode (5) simplifies the wiring, reduces the number of contacts on the transparent film to be attached to the surface, and improves the waterproof performance. A current flows from the simplified anode wiring, passes through the LED, flows into the back plate, and LED lights up. Illuminance is averaged by the light diffusing plate (4) installed on the surface of the luminous box, and a uniform luminous plate (1) can be realized.

LEDモジュールを背面板(3)にネジ止め(7)して、陽極配線(5)をする。配線後LEDモジュール(2)よりやや大きめの透明フイルム(6)を貼りつける。透明フイルムには粘着加工が施されており、LEDモジュール全体と、それよりやや大きめに貼りついて水の浸入を防ぎ防水となる。透明フイルムは伸縮性のある無延伸フイルム等を用いLEDモジュールの厚さ5mm以内には追従して密着し防水機能を発揮する。   The LED module is screwed (7) to the back plate (3), and anode wiring (5) is made. A transparent film (6) slightly larger than the LED module (2) is attached after wiring. Adhesive processing is applied to the transparent film, and it adheres to the LED module as a whole and slightly larger than that to prevent water from entering and waterproof. The transparent film uses a stretchable non-stretched film or the like, and follows and adheres within the thickness of the LED module within 5 mm to exert a waterproof function.

LEDの用途は益々広がっていく。屋外や水分の多い所での使用については防水が必要である。発光部全体を封入する場合は、収納箱が大きくなり設備にも高コストとなる。LEDモジュール部のみにフイルム密封する方法はコストの低減と薄型化、軽量化が実現出来る。薄く軽い防水処理は照明機器や表示光源にその用途は無限に広がる。   The applications of LEDs are expanding. Waterproofing is required for use outdoors or in places with high moisture. When enclosing the whole light emission part, a storage box becomes large and it becomes a high cost also to an installation. The method of sealing the film only to the LED module part can realize cost reduction, thickness reduction, and weight reduction. Thin and light waterproofing can be used for lighting devices and display light sources infinitely.

1 反発光部
2 LEDモジュール
3 背面板
4 光拡散板
5 陽極配線
6 透明フイルム
7 ネジ止め
8 リード線
9 LED
DESCRIPTION OF SYMBOLS 1 Anti-light-emitting part 2 LED module 3 Back plate 4 Light diffusing plate 5 Anode wiring 6 Transparent film 7 Screwing 8 Lead wire 9 LED

Claims (3)

防水性のある面発光体を構成する時、LEDモジュールを金属製平板上に配置してネジ止めし、配線後LEDモジュールに透明フイルムを貼りつけることで防水性を持たせた発光箱を作り、発光箱の表面に光拡散板を配置し、均一な明るさを表示出来るようにした防水LED発光板。   When constructing a waterproof surface light emitter, the LED module is placed on a metal flat plate and screwed, and after wiring, a transparent film is attached to the LED module to create a waterproof light emitting box, A waterproof LED light-emitting plate with a light diffusing plate on the surface of the light-emitting box so that uniform brightness can be displayed. LEDモジュールは、プリント基板上にLEDと電子部品を取り付けたもので、LEDモジュールの厚さを5mm以内にして、透明フイルムを貼りつけた時LEDモジュールの凹凸を吸収すると同時にLEDモジュール周囲の背面板に密着させることで水の浸入を防ぐ、前記請求項1記載の防水LED発光板。   An LED module is an LED and electronic components mounted on a printed circuit board. The LED module has a thickness of 5 mm or less and absorbs unevenness of the LED module when a transparent film is applied. The waterproof LED light-emitting plate according to claim 1, wherein the waterproof LED light-emitting plate prevents infiltration of water by being in close contact with the LED. LEDモジュールを金属製背面板にネジ止めするとネジ部分がアースとなり、LEDモジュールには陽極のみ配線することで点灯させる事が出来、単線配線により透明フイルムを貼った時水の浸入をより防止することを可能とした、前記請求項1記載の防水LED発光板。

When the LED module is screwed to the metal back plate, the screw part is grounded, and the LED module can be lit by wiring only the anode, and the infiltration of water is more prevented when a transparent film is applied with a single wire wiring. The waterproof LED light-emitting plate according to claim 1, wherein

JP2012127619A 2012-06-05 2012-06-05 Thin, light, and economical waterproof led light emitting plate Pending JP2013254565A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017016955A (en) * 2015-07-03 2017-01-19 かがつう株式会社 Led lighting fixture
WO2024014569A1 (en) * 2022-07-12 2024-01-18 엘지전자 주식회사 Display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017016955A (en) * 2015-07-03 2017-01-19 かがつう株式会社 Led lighting fixture
WO2024014569A1 (en) * 2022-07-12 2024-01-18 엘지전자 주식회사 Display device

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