JP2013239657A - Substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To acquire a reference position of a substrate transfer robot at an operation part.SOLUTION: A substrate processing apparatus comprises: a first substrate transfer chamber provided with a first substrate carrier for carrying a substrate under reduced pressure; a processing chamber which is connected to the first substrate transfer chamber, and includes a first substrate position detector and a first substrate loading part, and processes the substrate under reduced pressure; a spare chamber which is connected to the first substrate transfer chamber, and includes a second substrate position detector and a second substrate loading part, and which switches between reduced pressure and atmospheric pressure; a control part which arranges the substrate loaded on the first substrate carrier in the processing chamber, acquires from the first substrate position detector, a first reference position which serves as a reference when the first substrate carrier loads the substrate on the first substrate loading part, arranges the substrate loaded on the first substrate carrier in the spare chamber, and acquires from the second substrate position detector, a second reference position which serves as a reference when the first substrate carrier loads the substrate on the second substrate loading part; and an operation display part for accepting an instruction for acquiring first and second reference positions and displaying an acquisition state of the first and second reference positions.

Description

  The present invention relates to a substrate processing apparatus that processes a substrate such as a semiconductor wafer, for example, and relates to a technique for acquiring a reference position and detecting a positional deviation of the substrate when the substrate is transferred in the substrate processing apparatus.

  For example, as shown in FIG. 1, a plurality of load ports LP1 to LP3 on which cassettes CA1 to CA3, which are wafer storage containers, are respectively mounted, an atmospheric transfer chamber EFEM having an atmospheric robot AR for transferring a substrate in an atmospheric atmosphere, an atmospheric state A plurality of load lock chambers LM1 to LM2 capable of switching the vacuum state, a vacuum transfer chamber TM having a vacuum robot VR for transferring a substrate in a vacuum state, and a plurality of process chambers PM1 to PM4 which are substrate processing chambers for processing a substrate. There is a substrate processing apparatus that is arranged in order. FIG. 1 is a configuration example of a substrate processing apparatus, as viewed from above.

  In this substrate processing apparatus, a wafer W, which is a substrate to be processed, is transferred to the load lock chamber LM1 via the atmospheric transfer chamber EFEM from the cassette CA1 on the load port LP1 through the atmospheric transfer chamber EFEM, for example, by the atmospheric robot AR. It is placed on the buffer stage LS1 in the chamber LM1. Next, after the gate valve LD1 is closed and the load lock chamber LM1 is evacuated, the wafer W on the buffer stage LS1 is transferred from the load lock chamber LM1 to the process chamber PM1 from the load lock chamber LM1 through the vacuum transfer chamber TM by the vacuum robot VR. It is conveyed and mounted on the mounting table PS1 in the process chamber PM1. The wafer W processed in the process chamber PM1 is returned to the cassette CA1 on the load port LP1 in the reverse procedure.

  At this time, for example, the vacuum robot VR transfers the wafer W mounted on the buffer stage LS1 in the load lock chamber LM1 or the wafer W mounted on the mounting table PS1 in the process chamber PM1 to the vacuum robot VR. It is necessary to adjust the position of the arm VRA of the vacuum robot VR in advance so that it is supported at an appropriate position on the arm VRA that is the substrate support unit.

  In order to perform this position adjustment, a maintenance terminal called a teaching pendant (hereinafter referred to as a pendant) is connected to a robot controller which is a control unit of the vacuum robot VR, the vacuum robot VR is moved, and the position of the arm VRA of the vacuum robot VR is determined. Maintenance personnel visually adjust the position appropriately. Since the position of the arm VRA of the vacuum robot VR is represented by the encoder value of the motor of the vacuum robot VR, the encoder value at an appropriate position is acquired, that is, the reference position is acquired and stored in the memory in the robot controller. . During operation, the position of the vacuum robot VR is determined based on the reference position (encoder value) stored in the memory, and the wafer W is placed on the buffer stage LS1, for example, or picked up from the buffer stage LS1.

  For example, the reference position of the vacuum robot VR with respect to the load lock chamber LM1 is manually acquired by a maintenance staff according to the following procedure. First, the load lock chamber LM1 is set to the atmospheric atmosphere in the procedure 1, and the wafer W is taken out from the cassette CA1 on the load port LP1 using the atmospheric robot AR in the procedure 2 and transferred to the load lock chamber LM1. In step 3, the gate valve LD1 is closed and the load lock chamber LM1 is evacuated to a vacuum state. In step 4, the gate valve LGV1 is opened. In step 5, the wafer W in the load lock chamber LM1 is placed on the arm VRA of the vacuum robot VR. In step 6, the pendant connected to the vacuum robot VR is switched to the local mode. In step 7, the load lock chamber LM1 is calibrated using a pendant, that is, the maintenance person visually adjusts the position of the vacuum robot VR to obtain a reference position. In step 8, switch the pendant to remote mode. In step 9, the vacuum robot VR is initialized, that is, the vacuum robot VR is moved to the home position. At the home position, the swivel position faces the load lock chamber LM1 with the arm VRA retracted. In step 10, the gate valve LGV1 is closed.

  The reference position acquisition as described above is performed on the load lock chambers LM1 to LM2 and the process chambers PM1 to PM4 for the vacuum robot VR. Further, the atmospheric robot AR is performed on the load ports LP1 to LP3 and the load lock chambers LM1 to LM2, respectively, and the respective reference positions are acquired.

  Further, after the reference position is acquired, the plurality of wafers W are sequentially transferred to the process chambers PM1 to PM4, processed, and returned to the cassettes CA1 to CA3 on the load ports LP1 to LP3, for example, on the vacuum robot VR. The wafer support position shifts from an appropriate position, resulting in a position shift. When the positional deviation is detected, the maintenance staff connects the pendant to the vacuum robot VR and corrects the positional deviation by the pendant, that is, corrects the reference position.

  In the following Patent Document 1, in the setup process when starting the operation of the substrate processing apparatus in the substrate processing apparatus, the substrate transfer robot is used to take out the wafer from the cassette that is the wafer storage container and transfer it to the process chamber. Then, a conveyance test for returning to the cassette is performed. By performing such a transfer test, it is possible to confirm whether or not there is an obstacle to wafer transfer. Further, in Patent Document 2, in actual operation, a plurality of substrates are sequentially transferred to the process chamber, processed, and returned to the cassette, and the wafer support position on the substrate transfer robot for various reasons. Therefore, the positional deviation is detected by a sensor. When such a positional deviation is detected, the position is corrected and transport is performed.

However, in the conventional substrate processing apparatus, for example, the maintenance position is acquired by the maintenance personnel using the pendant in each of the plurality of process chambers, and the reference position data (adjustment data such as an encoder value) is obtained. ) Is stored in the memory in the substrate transfer robot controller, the operator cannot know at a glance whether or not the position of the substrate transfer robot in each process chamber is appropriate in the operation unit of the substrate processing apparatus. .
Further, the reference position cannot be obtained or corrected from the operation unit of the substrate processing apparatus, and it is necessary to use a pendant. Furthermore, since the pendant operation method is complicated, if the user does not know the operation method well, the pendant may not be operated properly and may be erroneously operated.

JP 2010-103486 A JP 2010-206139 A

  An object of the present invention is to enable an operator in the operation unit of the substrate processing apparatus to easily know whether or not the reference position of the substrate transfer robot in the process chamber or the like is appropriate, or to set the reference position of the substrate transfer robot. It is an object of the present invention to provide a substrate processing technique that can be easily obtained and modified.

A typical configuration of the substrate processing apparatus according to the present invention for solving the above-described problems is as follows. That is,
A first substrate transfer chamber comprising a first substrate transfer device for transferring a substrate in a reduced pressure state;
A first substrate position detector provided to be connected to the first substrate transfer chamber and configured to detect a substrate position; and a first substrate placement unit for placing a substrate; A processing chamber for processing the substrate placed on the part in a reduced pressure state;
A second substrate position detector provided to be connected to the first substrate transfer chamber and detecting a substrate position, and a second substrate placement unit for placing the substrate are provided, and a reduced pressure state and an atmospheric pressure state are provided. A switchable spare room,
A substrate placed on the first substrate transporter is placed in the processing chamber, and the first substrate transporter uses the first substrate position detector to place the substrate on the first substrate rest. A first reference position serving as a reference for placing the substrate is placed, a substrate placed on the first substrate transporter is placed in the spare chamber, and the second substrate position detector is used. A control unit that acquires a second reference position that serves as a reference when the first substrate transporter places a substrate on the second substrate platform;
An operation display unit that receives an acquisition instruction from the operator regarding the first reference position and the second reference position, and displays an acquisition status of the first reference position and the second reference position. A substrate processing apparatus configured as described above.

  According to the above configuration, the reference position of the substrate transfer robot in the process chamber or the like can be easily obtained or corrected.

It is a block diagram of the substrate processing apparatus which concerns on embodiment of this invention. It is a block diagram of the control part of the substrate processing apparatus which concerns on embodiment of this invention. It is an example of a display of the operation display part of the substrate processing apparatus which concerns on embodiment of this invention. It is a processing sequence of the substrate processing apparatus at the time of reference position confirmation concerning the 1st example. It is a process sequence of the substrate processing apparatus at the time of the reference | standard position acquisition which concerns on 2nd Example.

(1) Configuration of Substrate Processing Apparatus Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the present embodiment, as an example, the substrate processing apparatus is configured as a semiconductor manufacturing apparatus that performs a processing step in a manufacturing method of a semiconductor device (IC: Integrated Circuit). In addition, the substrate processing apparatus according to the present embodiment is configured as a single-wafer apparatus that performs film forming processing such as CVD (Chemical Vapor Deposition) processing on one substrate in one processing chamber. FIG. 1 is a configuration diagram of a substrate processing apparatus according to an embodiment of the present invention, as viewed from above.

  The substrate processing apparatus shown in FIG. 1 has a vacuum side structure for handling a substrate (for example, a wafer W made of silicon or the like) in a reduced pressure state and an atmosphere side structure for handling the wafer W in an atmospheric pressure state. The configuration on the vacuum side mainly includes a vacuum transfer chamber TM, load lock chambers LM1 and LM2, and process chambers PM1 to PM4 for processing the wafer W. The configuration on the atmosphere side mainly includes an atmosphere transfer chamber EFEM and load ports LP1 to LP3. In the load ports LP1 to LP3, cassettes CA1 to CA3 as wafer carriers for storing the wafers W are transported and mounted from the outside of the substrate processing apparatus, and are transported to the outside of the substrate processing apparatus. With such a configuration, for example, an unprocessed wafer W is taken out from the cassette CA1 on the load port LP1, is loaded into the process chamber PM1 through the load lock chamber LM1, processed, and then the processed wafer W is processed. In the reverse procedure, the cassette CA1 on the load port LP1 is returned.

(Vacuum side configuration)
The vacuum transfer chamber TM is configured in a vacuum-tight structure that can withstand a negative pressure (reduced pressure) less than atmospheric pressure such as a vacuum state. In the present embodiment, the housing of the vacuum transfer chamber TM is formed in a box shape having a pentagonal shape in plan view and closed at both upper and lower ends. The load lock chambers LM1, LM2 and the process chambers PM1 to PM4 are arranged so as to surround the outer periphery of the vacuum transfer chamber TM.

  In the vacuum transfer chamber TM, for example, one vacuum robot VR (first substrate transfer machine) is provided as transfer means for transferring the wafer W in a reduced pressure state. The vacuum robot VR places the wafer W on two sets of substrate support arms (hereinafter referred to as “arms”) VRA, which are substrate placement units, so that the wafer W is placed between the load lock chambers LM1 and LM2 and the process chambers PM1 to PM4. Transport. The vacuum robot VR is configured to be able to move up and down while maintaining the airtightness of the vacuum transfer chamber TM. Further, the two sets of arms VRA are provided so as to be spaced apart in the vertical direction, can be expanded and contracted in the horizontal direction, and can be rotated and moved within the horizontal plane. In addition, a substrate presence / absence detection sensor (not shown) is installed in the vacuum transfer chamber TM in front of each of the load lock chambers LM1 and LM2 and the process chambers PM1 to PM4 to detect the presence of the wafer W on the arm VRA. It is configured to be able to.

Each of the process chambers PM1 to PM4 includes mounting tables (first substrate mounting units) PS1 to PS4 as substrate mounting units on which the wafers W are mounted. For example, the wafers W are processed one by one in a reduced pressure state. It is configured as a single wafer processing chamber. That is, each of the process chambers PM1 to PM4 functions as a processing chamber that gives added value to the wafer W, such as etching or ashing using plasma or the like, film formation by chemical reaction (CVD), or the like.
A plurality of substrate position detectors PK are installed in each chamber of the process chambers PM1 to PM4, and are configured to detect the horizontal and vertical positions and displacements of the wafer W in each chamber. The substrate position detector PK is configured by, for example, an infrared sensor, an ultrasonic sensor, or a camera.

  Further, the process chambers PM1 to PM4 are provided with various configurations according to their functions, for example, a gas introduction mechanism, an exhaust mechanism, a pressure adjustment mechanism, a temperature control mechanism, a plasma discharge mechanism (all not shown), and the like. These mechanisms are a pressure controller such as a mass flow controller (MFC) (not shown) that controls the flow rate of the processing gas supplied into the process chambers PM1 to PM4, and an auto pressure controller (APC) that controls the pressure in the process chambers PM1 to PM4. 15. Temperature controller (not shown) for controlling the temperature in the process chambers PM1 to PM4, valve digital I / O 19 for controlling on / off of supply of processing gas and exhaust valve, on / off of various switches (SW), etc. SW digital I / O 18 and the like are provided. Each of the above components is electrically connected to the process chamber controller 14. The configuration of the control unit 10 as an apparatus controller including the process chamber controller 14 will be described later.

  The process chambers PM1 to PM4 are connected to the vacuum transfer chamber TM by gate valves PGV1 to PGV4 as opening / closing valves, respectively. Therefore, by opening the gate valves PGV1 to PGV4, the wafer W can be transferred to the vacuum transfer chamber TM under reduced pressure. Further, by closing the gate valves PGV1 to PGV4, it is possible to perform various substrate processes on the wafer W while maintaining the pressure and the processing gas atmosphere in the process chambers PM1 to PM4.

The load lock chambers LM1 and LM2 function as spare chambers for loading the wafer W into the vacuum transfer chamber TM or as spare chambers for unloading the wafer W from the vacuum transfer chamber TM. In the load lock chambers LM1 and LM2, buffer stages (second substrate platforms) LS1 and LS2 as substrate platforms that temporarily support the wafer W when loading and unloading the wafers W are respectively provided. Is provided. The buffer stages LS1 and LS2 may each be configured as a multi-stage slot that holds a plurality of (for example, two) wafers W.
Further, a plurality of substrate position detectors LK are installed in each of the load lock chambers LM1 and LM2, and are configured to detect the horizontal and vertical positions and displacements of the wafer W in each chamber. . The substrate position detector LK is configured by, for example, an infrared sensor, an ultrasonic sensor, or a camera.

  The load lock chambers LM1 and LM2 are connected to the vacuum transfer chamber TM by gate valves LGV1 and LGV2 as opening / closing valves, respectively, and are connected to an atmospheric transfer chamber EFEM to be described later by gate valves LD1 and LD2 as opening / closing valves. Each is connected. Accordingly, by opening the gate valves LD1 and LD2 on the atmospheric transfer chamber EFEM while the gate valves LGV1 and LGV2 on the vacuum transfer chamber TM side are closed, the load lock chamber is maintained while maintaining the vacuum airtightness in the vacuum transfer chamber TM. It is possible to transfer the wafer W under atmospheric pressure between the LM1 and LM2 and the atmospheric transfer chamber EFEM.

Further, the load lock chambers LM1 and LM2 have a structure capable of withstanding a reduced pressure less than atmospheric pressure such as a vacuum state, and the inside thereof can be evacuated. Therefore, after the gate valves LD1 and LD2 on the atmosphere transfer chamber EFEM side are closed and the inside of the load lock chambers LM1 and LM2 is evacuated, the vacuum transfer chamber is opened by opening the gate valves LGV1 and LGV2 on the vacuum transfer chamber TM side. It is possible to transfer the wafer W under reduced pressure between the load lock chambers LM1, LM2 and the vacuum transfer chamber TM while maintaining the vacuum state in the TM.
Thus, the load lock chambers LM1 and LM2 are configured to be switchable between the atmospheric pressure state and the reduced pressure state.

(Composition on the atmosphere side)
On the other hand, as described above, the atmosphere side of the substrate processing apparatus is connected to an atmospheric transfer chamber EFEM (Equipment Front End Module) which is a front module connected to the load lock chambers LM1 and LM2, and an atmospheric transfer chamber EFEM. Load ports LP1 to LP3 are provided as storage container placement portions for placing cassettes CA1 to CA3 as storage containers each storing 25 wafers W for one lot.

  In the atmospheric transfer chamber EFEM, for example, one atmospheric robot AR (second substrate transfer machine) as a transfer means is provided. The atmospheric robot AR transfers the wafer W between the load lock chambers LM1, LM2 and the load ports LP1-LP3. Similarly to the vacuum robot VR, the atmospheric robot AR has two sets of arms ARA, which are substrate placement units. In addition, a substrate presence / absence detection sensor (not shown) is installed in the atmospheric transfer chamber EFEM and in front of each of the load lock chambers LM1 and LM2, and configured to detect the presence of the wafer W on the arm ARA. Yes.

  In the atmospheric transfer chamber EFEM, an aligner AU, which is an orientation flat aligning device for aligning the crystal orientation of the wafer W, is provided as a substrate position correcting device. When the wafer W is a notch type, a notch aligning device as a substrate position correcting device can be provided. The atmospheric transfer chamber EFEM is provided with a clean air unit (not shown) that supplies clean air into the atmospheric transfer chamber EFEM.

Each of the load ports LP1 to LP3 is configured to place cassettes CA1 to CA3 containing a plurality of substrates W on the load ports LP1 to LP3, respectively. In each of the cassettes CA1 to CA3, for example, 25 slots (not shown) serving as storage units for storing the wafers W are provided for one lot. When the cassettes CA1 to CA3 are placed, the load ports LP1 to LP3 are attached to the cassettes CA1 to CA3, and are configured to read and store a barcode or the like indicating a carrier ID for identifying the cassettes CA1 to CA3.
The substrate processing apparatus of the present embodiment has been described above. However, the number, configuration, and combination of each chamber are not limited to the above, and can be selected as appropriate.

(2) Configuration of Apparatus Controller Next, the control unit 10 as an apparatus controller that controls the substrate processing apparatus will be described mainly with reference to FIG. FIG. 2 is a configuration diagram of the control unit 10 of the substrate processing apparatus.
As shown in FIG. 2, the control unit 10 includes an operation unit controller 11, a transport system controller 13 as a control unit, and a process chamber controller 14 as another control unit via a switching hub 16. The communication network 31 is connected to each other. A host computer 40 is connected via a communication network 31 such as a LAN.

The control unit 10 is provided, for example, inside the substrate processing apparatus, and includes an operation unit controller 11, a transfer system controller 13, a process chamber controller 14, and the like, and is configured to control each unit of the substrate processing apparatus.
Each of the operation unit controller 11, the transfer system controller 13, and the process chamber controller 14 includes a CPU (Central Processing Unit) and storage units 11m, 13m, and 14m that store operation programs of the respective controllers as hardware configurations. Each CPU operates according to its operation program. Each of the storage units 11m, 13m, and 14m includes an EEPROM, a flash memory, a hard disk, and the like, and includes a storage medium that stores the operation program of the CPU.

  The control unit 10 may be provided outside the substrate processing apparatus instead of being provided in the substrate processing apparatus as described above. Further, the operation unit controller 11, the transfer system controller 13, and the process chamber controller 14 may be configured as a general general-purpose computer such as a personal computer (personal computer). In this case, each controller is configured by installing the program in a general-purpose computer using a computer-readable recording medium (flexible disk, CD-ROM, USB memory, magnetic tape, hard disk, DVD, etc.) storing various programs. can do.

  A means for supplying a program for executing the above-described processing can be arbitrarily selected. In addition to being supplied via a predetermined recording medium as described above, for example, it can be supplied via a communication line, a communication network, a communication system, or the like. In this case, for example, the program may be posted on a bulletin board (BBS) of a communication network, and this may be supplied by being superimposed on a carrier wave via the network. Then, the above-described processing can be executed by starting the program thus provided and executing it in the same manner as other application programs under the control of the OS (Operating System) of the substrate processing apparatus.

  The operation unit controller 11 is an interface with the operator together with the operation display unit 11s connected to the operation unit controller 11, and is configured to receive operations and instructions by the operator via the operation display unit 11s. Information such as an operation screen and various data as shown in FIG. 3 described later is displayed on the operation display unit 11s. Data displayed on the operation display unit 11 s is stored in the storage unit 11 m of the operation unit controller 11.

  The process chamber controller 14 and the transfer system controller 13 are connected via a signal line 32 such as DeviceNet to supply digital gas I / O 19 for controlling on / off of supply of processing gas and an exhaust valve, on / off of various switches (SW), etc. SW digital I / Os 18 for controlling the turn-off are connected to each other via the sequencer 17. Moreover, the memory | storage parts 14m and 13m which each store a process recipe, a conveyance recipe, and various programs are provided. The storage unit 13m of the transport system controller 13 stores the reference positions of the vacuum robot VR and the atmospheric robot AR, and the reference position data is transferred from the storage unit 13m to the storage unit 11m of the operation unit controller 11 and stored therein.

  The process chamber controller 14 is configured to control substrate processing in the process chambers PM1 to PM4. Specifically, a pressure controller 15 such as an auto pressure controller (APC) for controlling the pressure in the process chambers PM1 to PM4 is connected to the process chamber controller 14 through a signal line 32, for example. For example, the process chamber controller 14 generates control data (control instructions) for processing the wafer W based on the process recipe created or edited by the operator via the operation unit controller 11 and stored in the storage unit 14m. Outputs to the pressure controller 15, processing gas supply / exhaust valves, various switches, a mass flow controller, a temperature controller, etc., and controls substrate processing in the process chambers PM1 to PM4.

The transfer system controller 13 includes a robot controller that controls the vacuum robot VR and the atmospheric robot AR, and is configured to control transfer control of the wafer W and execution of work instructed by the operator. Specifically, the transport system controller 13 stores bar codes 1, 2, 3,... Indicating the carrier ID for identifying the cassettes CA1 to CA3 placed on the load ports LP1 to LP3. 20 and substrate position detectors LK and PK are connected through a signal line 32, for example.
The transfer system controller 13 generates control data (control instructions) for transferring the wafer W based on a transfer recipe created or edited by the operator via the operation unit controller 11 and stored in the storage unit 13m, for example. It outputs to the vacuum robot VR, the atmospheric robot AR, various valves, switches, etc., and carries the wafer W in the substrate processing apparatus.
The transfer system controller 13 controls the vacuum robot VR and the atmospheric robot AR based on the reference positions of the vacuum robot VR and the atmospheric robot AR stored in the storage unit 13m.

Further, the transfer system controller 13 acquires the reference positions of the vacuum robot VR and the atmospheric robot AR based on the substrate position information from the substrate position detectors LK and PK. Specifically, the transfer system controller 13 places the wafer W placed on the vacuum robot VR in the process chambers PM1 to PM4, and the vacuum robot VR uses the substrate position detector PK to place the wafer W on the placement tables PS1 to PS4. A reference position serving as a reference for placing the is acquired. Further, the transfer system controller 13 arranges the wafer W placed on the vacuum robot VR in the load lock chambers LM1 to LM2, and the vacuum robot VR is placed on the buffer stages LS1 to LS2 using the substrate position detector LK. A reference position serving as a reference for placing the is acquired. Further, the transfer system controller 13 arranges the wafer W placed on the atmospheric robot AR in the load lock chambers LM1 to LM2, and the atmospheric robot AR is placed on the buffer stages LS1 to LS2 using the substrate position detector LK. A reference position serving as a reference for placing the is acquired.
Further, when the transport system controller 13 acquires the reference position, the transport system controller 13 stores the reference position data in the storage unit 13 m of the transport system controller 13 and also transfers it to the storage unit 11 m of the operation unit controller 11.

  With the above configuration, the control unit 10 executes the process recipe stored in the storage unit 14m of the process chamber controller 14 based on, for example, an operator instruction from the operation display unit 11s. Control is performed so that the flow rate of the processing gas supplied to the process chambers PM1 to PM4, the pressure in the process chambers PM1 to PM4, the temperature of the wafer W in the process chambers PM1 to PM4, and the like become predetermined values. Further, the control unit 10 uses the atmospheric robot AR and the vacuum robot VR according to the transfer recipe when executing the process recipe, and based on the reference position stored in the storage unit 13m of the transfer system controller 13, the load port LP1. The wafer W is transferred between the cassettes CA1 to CA3 on the LP3, the aligner AU, the load lock chambers LM1 to LM2, and the process chambers PM1 to PM4.

(3) Substrate Processing Step Next, a substrate processing step using the substrate processing apparatus having the above configuration will be described. This substrate processing step is performed as one step of a semiconductor manufacturing process for manufacturing a semiconductor device, for example. In this substrate processing step, the control unit 10 controls each component of the substrate processing apparatus.
First, for example, a cassette CA1 containing 25 unprocessed wafers is transferred to the substrate processing apparatus by the in-process transfer apparatus. As shown in FIG. 1, the cassette CA1 that has been transported is delivered from the in-process transport device and placed on the load port LP1, for example.
The cassette CA1 placed on the load port LP1 is authenticated by reading the ID (for example, a barcode) of the cassette CA1 by an ID reader (not shown). Thereafter, the cap of the cassette CA1 is removed, and the atmospheric robot AR installed in the atmospheric transfer chamber EFEM picks up one wafer W from the cassette CA1 and places it on the aligner AU.

The aligner AU moves the mounted wafer W in the vertical and horizontal directions and the circumferential direction on the horizontal plane to adjust the notch position and the like of the wafer W. After the position adjustment of the wafer W is completed by the aligner AU, the atmospheric robot AR picks up the wafer W on the aligner AU.
Next, the gate valve LD1 is opened, and the atmospheric robot AR loads the wafer W into the load lock chamber LM1 in the atmospheric pressure state and transfers it onto the buffer stage LS1 in the load lock chamber LM1. During the transfer operation, the gate valve LGV1 on the vacuum transfer chamber TM side is closed, and the negative pressure in the vacuum transfer chamber TM is maintained.

When the transfer of the wafer W to the buffer stage LS1 is completed, the gate valve LD1 is closed, and the load lock chamber LM1 is evacuated to a negative pressure by an evacuation device (not shown). When the load lock chamber LM1 is depressurized to a preset pressure value, the gate valve LGV1 is opened, and the vacuum robot VR in the vacuum transfer chamber TM picks up the wafer W from the buffer stage LS1, and the atmospheric transfer chamber TM. Carry in.
Thereafter, the gate valve LGV1 is closed, the gate valve PGV1 of the process chamber PM1 is opened, and the vacuum robot VR carries the wafer W into the process chamber PM1. After the gate valve PGV1 is closed, a processing gas is supplied from a gas supply device (not shown) into the process chamber PM1, and a desired process is performed on the wafer W.

After the processing is completed in the process chamber PM1, the gate valves PGV1 and LGV1 are opened, and the vacuum robot VR loads the wafer W unloaded from the process chamber PM1 into the load lock chamber LM1 and places it on the buffer stage LS1. .
Then, the gate valve LGV1 is closed and cooling of the processed wafer W in the load lock chamber LM1 is started, and at the same time, an inert gas supply device (not shown) connected to the load lock chamber LM1 is inactivated. Gas is introduced, and the pressure in the load lock chamber LM1 is returned to atmospheric pressure.

  In the load lock chamber LM1, when a preset cooling time has elapsed and the pressure in the load lock chamber LM1 is returned to the atmospheric pressure, the gate valve LD1 is opened. Subsequently, after the atmospheric robot AR in the atmospheric transfer chamber EFEM picks up the processed wafer W from the buffer stage LS1 and carries it out to the atmospheric transfer chamber EFEM, the gate valve LD1 is closed. Thereafter, the atmospheric robot AR stores the processed wafer W in the cassette CA1.

  The desired process is performed on all the wafers in the cassette CA1 by the above-described process. When all the 25 processed wafers are stored in the cassette CA1, the cap of the cassette CA1 is closed. The closed cassette CA1 is transported from the top of the load port LP1 to the next process by the in-process transport apparatus. By repeating the above operation, 25 wafers are sequentially processed in cassette units.

(4) Method for Confirming and Obtaining Reference Position of Substrate Transporter Next, a method for confirming and obtaining a reference position of a substrate transporter in the substrate processing apparatus of the present embodiment will be described as a first example and a second example, respectively. Will be described with reference to FIGS. FIG. 3 is a display example of the operation display unit of the substrate processing apparatus according to the present embodiment. FIG. 4 is a processing sequence of the substrate processing apparatus when checking the reference position according to the first embodiment. FIG. 5 is a processing sequence of the substrate processing apparatus when acquiring the reference position according to the second embodiment. The reference position confirmation process according to the first embodiment and the reference position acquisition process according to the second embodiment are normally executed as one of the setup processes of the substrate processing apparatus.

As shown in FIG. 3, the operation display section 11s displays the status (state) of each module, that is, the chamber (chamber) on which the wafer W is placed, and the calibration state of the arm of the substrate transfer robot. . The calibration state indicates a reference position acquisition situation or a reference position confirmation situation, and indicates whether or not the reference position has been acquired and whether or not the acquired reference position is appropriate.
Although not shown in FIG. 3, a plan view and a vertical sectional view of the substrate processing apparatus as shown in FIG. 1 are displayed on the operation display unit 11s, and wafers in each chamber (chamber) are displayed. The position of W can be detected and displayed by the substrate position detector LK or PK.

Here, the reference position refers to, for example, the vacuum robot VR that supports the wafer W in the load lock chambers LM1 to LM2 and the process chambers PM1 to PM4, and places the wafer W on the buffer stages LS1 to LS2 and the mounting tables PS1 to PS4. The horizontal position of the vacuum robot VR when placed, the circumferential position on the horizontal plane, and the vertical position, and the vacuum robot VR is placed in the load lock chambers LM1 to LM2 and the process chambers PM1 to PM4. These are the horizontal position of the vacuum robot VR when picking up and supporting the mounted wafer W, the circumferential position on the horizontal plane, and the vertical position.
Specifically, the reference position is determined by, for example, the arm VRA of the vacuum robot VR supporting the wafer W entering the load lock chambers LM1 to LM2 and the process chambers PM1 to PM4 in the horizontal direction and then descending in the vertical direction. When the wafer W is mounted on the buffer stages LS1 to LS2 or the mounting tables PS1 to PS4, the horizontal direction, the circumferential direction, and the vertical direction of the arm VRA of the vacuum robot VR when the moving direction is changed from the horizontal direction to the vertical direction. Including a first position in the direction. The reference position is that the arm VRA of the empty vacuum robot VR that does not support the wafer W enters the load lock chambers LM1 to LM2 and the process chambers PM1 to PM4 in the horizontal direction, and then rises in the vertical direction. When picking up the wafer W on the buffer stages LS1 to LS2 and the mounting tables PS1 to PS4, the horizontal direction, the circumferential direction and the vertical direction of the arm VRA of the vacuum robot VR when the moving direction is changed from the horizontal direction to the vertical direction. Including a second position in the direction.

  Also, as shown in FIG. 3, the operation display unit 11s is provided with an “execute” button for receiving a reference position confirmation process or a reference position acquisition process start command from the operator. When the position acquisition process is designated and the “execute” button is pressed, the designated reference position confirmation process or reference position acquisition process is started.

  The example of FIG. 3 displays the calibration state of the arm of the vacuum robot VR having two upper and lower arms. In this example, it is displayed that the statuses of the load lock chambers LM1 and LM2 and the process chambers PM1 and PM2 are both “idle”, that is, the wafer W is not being processed. Therefore, it is displayed that the calibration state of the upper arm of the vacuum robot VR is “invalid” and the calibration state of the lower arm is “valid”, and the upper part of the vacuum robot VR is displayed for the load lock chamber LM2. It is displayed that the calibration state of the arm is “invalid” and the calibration state of the lower arm is “executing”. “Invalid” for the calibration status indicates that an appropriate reference position has not been acquired, “Valid” indicates that an appropriate reference position has been acquired, and “In progress” indicates that a reference position has been acquired. Indicates that it is inside.

(First embodiment)
Next, a method for confirming the reference position of the substrate transfer machine according to the first embodiment will be described with reference to FIG. 4, taking the vacuum robot VR as an example. This operation is controlled by the transport system controller 13 of the control unit 10.
As shown in FIG. 4, for example, the wafer W is taken out from the cassette CA1 on the load port LP1 by the atmospheric robot AR, transferred to the load lock chamber LM1, and placed on the buffer stage LS1 in the load lock chamber LM1 (see FIG. 4). Step S1). Subsequently, the gate valves LD1 and LD2 are closed, and the load lock chambers LM1 and LM2 are evacuated, that is, evacuated (step S2). Next, the wafer W on the buffer stage LS1 is picked up and supported by the upper arm VRA of the vacuum robot VR based on preset reference position data (step S3). At this time, the transport system controller 13 moves the upper arm VRA of the vacuum robot VR to the reference position based on the reference position data in the storage unit 13m.

  Next, the position of the wafer W supported by the upper arm VRA of the vacuum robot VR is measured by a plurality of substrate position detectors LK provided in the load lock chamber LM1, and the reference of the vacuum robot VR with respect to the load lock chamber LM1. The transport system controller 13 determines whether the position is OK, that is, whether the position is an appropriate position within the allowable range from the optimum position (step S4). If it is an appropriate position (Yes in step S4), the transport system controller 13 transmits information indicating “valid” to the operation unit controller 11, and the information indicating “valid” is stored in the operation unit controller 11. “Valid” is displayed in the calibration state of the load lock chamber LM1 stored in the storage unit 11m and displayed on the operation display unit 11s (step S5). If it is not OK (No in step S4), the transfer system controller 13 transmits information indicating “invalid” to the operation unit controller 11, and the information indicating “invalid” is stored in the storage unit of the operation unit controller 11. "Invalid" is displayed in the calibration state of the load lock chamber LM1 stored in 11m and displayed on the operation display unit 11s (step S6).

  Next, it is determined whether or not the above-described reference position confirmation processing of the vacuum robot VR has been performed for all the load lock chambers (for example, LM1 to LM2) (step S7), and the reference positions for all the load lock chambers LM are determined. If the confirmation process has not been completed (No in step S7), the upper arm VRA of the vacuum robot VR that supports the wafer W is at a reference position set in advance with respect to the next load lock chamber (for example, LM2). Arranged (step S8). Subsequently, returning to step S4, the position of the wafer W supported by the upper arm VRA of the vacuum robot VR is measured by the substrate position detector LK provided in the load lock chamber LM2, and the vacuum robot for the load lock chamber LM2 is measured. It is determined whether or not the VR reference position is an appropriate position. If the reference position is OK (Yes in step S4), the information indicating “valid” is transmitted to the operation unit controller 11, stored in the storage unit 11m, and displayed on the operation display unit 11s as described above. “Valid” is displayed in the calibration state of the load lock chamber LM2 that has been performed (step S5), and if it is not OK (No in step S4), information indicating “invalid” is transmitted to the operation unit controller 11. “Invalid” is displayed in the calibration state of the load lock chamber LM2 stored in the storage unit 11m and displayed on the operation display unit 11s (step S6).

  When the reference position confirmation processing for all the load lock chambers LM1 to LM2 is completed (Yes in step S7), the gate valves PGV1 to PGV4 are opened, and the wafer W supported by the vacuum robot VR enters the process chamber PM1. It is carried in and placed at a reference position set in advance with respect to the process chamber PM1 (step S9).

  Subsequently, the position of the wafer W supported by the upper arm VRA of the vacuum robot VR is measured by a plurality of substrate position detectors PK provided in the process chamber PM1, and the reference position of the vacuum robot VR with respect to the process chamber PM1 is determined. It is determined whether or not the position is appropriate (step S10). When the reference position is an appropriate position (Yes in step S10), the transport system controller 13 transmits information indicating “valid” to the operation unit controller 11, and the information indicating “valid” is the operation unit. “Valid” is displayed in the calibration state of the process chamber PM1 stored in the storage unit 11m of the controller 11 and displayed on the operation display unit 11s (step S11). If it is not OK (No in step S10), “invalid” "Is transmitted to the operation unit controller 11 and stored in the storage unit 11m, and" invalid "is displayed in the calibration state of the process chamber PM1 displayed on the operation display unit 11s (step S12).

  Next, it is determined whether or not the above-described reference position confirmation processing of the vacuum robot VR is performed for all process chambers (for example, PM1 to PM4) (step S13), and the reference positions for all the process chambers PM1 to PM4 are determined. If the confirmation process has not been completed (No in step S13), the vacuum robot VR supporting the wafer W is arranged at a reference position set in advance for the next process chamber (for example, PM2) (step S13). S14). Subsequently, the process returns to step S10, and the position of the wafer W supported by the upper arm VRA of the vacuum robot VR is measured by the substrate position detector PK provided in the process chamber PM2, and the vacuum robot VR with respect to the process chamber PM2 is measured. It is determined whether or not the reference position is an appropriate position. In this manner, the reference position confirmation processing of the vacuum robot VR in the process chambers PM2 to PM4 is performed in the same manner as the reference position confirmation processing of the vacuum robot VR with respect to the process chamber PM1.

  When the reference position confirmation processing for all the process chambers PM1 to PM4 is completed (Yes in step S13), the wafer W supported by the vacuum robot VR is loaded into the load lock chamber LM1, and is stored in the load lock chamber LM1. It is placed on the buffer stage LS1 (step S15). Subsequently, the gate valve LGV1 is closed, and the inside of the load lock chamber LM1 is vented, that is, the atmospheric pressure state is set (step S16). Subsequently, the gate valve LD1 is opened, and the wafer W on the buffer stage LS1 is transferred to the cassette CA1 on the load port LP1 by the atmospheric robot AR (step S17).

Similarly to the reference position confirmation process using the upper arm, the reference position confirmation process can be performed on the lower arm of the vacuum robot VR by the above steps S1 to S17. In addition, when performing the reference position confirmation process of a lower arm following an upper arm, after performing said step S1-S14 with an upper arm, you may make it perform said step S3-S17 with a lower arm.
Alternatively, steps S1 to S17 may be performed with the wafer W supported by both the upper arm and the lower arm. In this case, for one load lock chamber or process chamber, for example, the upper arm reference position confirmation processing is performed on the load lock chamber LM1, and then the lower arm reference position confirmation processing is performed. Of course, the lower arm reference position confirmation process may be performed first. By doing so, the reference position confirmation process can be shortened.

(Second embodiment)
Next, a method for obtaining the reference position of the substrate transfer machine according to the second embodiment will be described with reference to FIG. 5, taking the vacuum robot VR as an example. This operation is controlled by the transport system controller 13 of the control unit 10.
As shown in FIG. 5, for example, the wafer W is taken out from the cassette CA1 on the load port LP1 by the atmospheric robot AR, transferred to the load lock chamber LM1, and placed on the buffer stage LS1 in the load lock chamber LM1 (see FIG. 5). Step S21). The gate valves LD1 and LD2 are closed, and the load lock chambers LM1 and LM2 are evacuated, that is, evacuated (step S22). Next, the wafer W on the buffer stage LS1 is picked up and supported by the upper arm VRA of the vacuum robot VR (step S23).

  Next, the wafer W supported by the upper arm VRA of the vacuum robot VR is moved while the position is measured by the substrate position detector LK provided in the load lock chamber LM1, and the appropriateness of the vacuum robot VR with respect to the load lock chamber LM1. Moved to position. Whether or not the position is appropriate is determined by the transport system controller 13 based on position information from the substrate position detector LK. The movement of the wafer W to an appropriate position is automatically performed by the control unit 10 as described above, but the position of the wafer W in the load lock chamber LM1 is displayed on the operation display unit 11s, and the operator displays the operation display unit 11s. The wafer W can be manually operated while visually confirming the position of the wafer W. When moved to the proper position, the encoder value of the motor of the vacuum robot VR at that position is acquired as the reference position of the vacuum robot VR relative to the load lock chamber LM1 (step S24). At this time, the transfer system controller 13 transmits information indicating that the reference position of the vacuum robot VR with respect to the load lock chamber LM1 has been acquired, that is, information indicating that the reference position is “valid” to the operation unit controller 11. Information indicating “valid” is stored in the storage unit 11m of the operation unit controller 11, and “valid” is displayed in the calibration state of the load lock chamber LM1 displayed on the operation display unit 11s.

  Next, it is determined whether or not the above-described reference position acquisition processing of the vacuum robot VR has been performed for all load lock chambers (for example, LM1 and LM2) (step S25), and reference position acquisition for all load lock chambers is performed. If the process has not been completed (No in step S25), the wafer W supported by the upper arm VRA of the vacuum robot VR is transferred into the next load lock chamber (for example, LM2) (step S26). Subsequently, returning to step S24, the position of the wafer W supported by the upper arm VRA of the vacuum robot VR is moved while the position is measured by the substrate position detector LK provided in the load lock chamber LM2, and the wafer W is moved. The supported vacuum robot VR is moved to an appropriate position of the vacuum robot VR with respect to the load lock chamber LM2. When moved to the proper position, the encoder value of the motor of the vacuum robot VR is acquired as the reference position of the vacuum robot VR with respect to the load lock chamber LM2 (step S24). At this time, the transfer system controller 13 transmits information indicating that the reference position of the vacuum robot VR with respect to the load lock chamber LM2 is “valid” to the operation unit controller 11, and the information indicating that it is “valid” “Valid” is displayed in the calibration state of the load lock chamber LM2 stored in the storage unit 11m of the controller 11 and displayed on the operation display unit 11s.

  When the reference position acquisition processing for all the load lock chambers LM1 to LM2 is completed (Yes in step S25), the gate valves PGV1 to PGV4 are opened, and the wafer W supported by the vacuum robot VR enters the process chamber PM1. It is carried in (step S27). Subsequently, the position is measured while being measured by the substrate position detector PK provided in the process chamber PM1, and is moved to an appropriate position of the vacuum robot VR with respect to the process chamber PM1. When moved to the proper position, the encoder value of the motor of the vacuum robot VR is acquired as the reference position of the vacuum robot VR with respect to the process chamber PM1 (step S28). At this time, the transfer system controller 13 transmits information indicating that the reference position of the vacuum robot VR with respect to the process chamber PM1 has been acquired, that is, information indicating that the reference position is “valid” to the operation unit controller 11, and the “ Information indicating “valid” is stored in the storage unit 11m of the operation unit controller 11, and “valid” is displayed in the calibration state of the process chamber PM1 displayed on the operation display unit 11s.

  Next, it is determined whether or not the above-described reference position acquisition processing of the vacuum robot VR has been performed for all the process chambers (for example, PM1 to PM4) (step S29), and the reference positions for all the process chambers PM1 to PM4 are determined. If the acquisition process has not been completed (No in step S29), the wafer W supported by the upper arm VRA of the vacuum robot VR is transferred into the next process chamber (for example, PM2) (step S30). Subsequently, returning to step S28, the position of the wafer W supported by the upper arm VRA of the vacuum robot VR is moved while the position is measured by the substrate position detector PK provided in the process chamber PM2, and the wafer W is supported. The vacuum robot VR is moved to an appropriate position with respect to the process chamber PM2. When moved to the proper position, the encoder value of the motor of the vacuum robot VR is acquired as the reference position of the vacuum robot VR with respect to the process chamber PM2 (step S28). At this time, the transfer system controller 13 transmits information indicating that the reference position of the vacuum robot VR with respect to the process chamber PM2 is “valid” to the operation unit controller 11, and the information indicating that “valid” is the operation unit controller 11 is displayed in the calibration state of the process chamber PM2 stored in the storage unit 11m and displayed on the operation display unit 11s. Thus, the reference position acquisition process of the vacuum robot VR for the process chambers PM2 to PM4 is performed in the same manner as the reference position acquisition process of the vacuum robot VR for the process chamber PM1.

  When the reference position acquisition processing for all the process chambers PM1 to PM4 is completed (Yes in step S29), the wafer W supported by the vacuum robot VR is loaded into the load lock chamber LM1, and is stored in the load lock chamber LM1. It is placed on the buffer stage LS1 (step S31). Subsequently, the gate valve LGV1 is closed, and the inside of the load lock chamber LM1 is vented, that is, the atmospheric pressure state is set (step S32). Subsequently, the gate valve LD1 is opened, and the wafer W on the buffer stage LS1 is transferred to the cassette CA1 on the load port LP1 by the atmospheric robot AR (step S33).

Similarly to the reference position acquisition process using the upper arm, the reference position acquisition process can be performed on the lower arm of the vacuum robot VR by the steps S21 to S33. In addition, when performing the reference position acquisition process of a lower arm following an upper arm, after performing said step S21-S30 with an upper arm, you may make it perform said step S23-S33 with a lower arm.
Further, steps S21 to S30 may be performed in a state where the wafer W is supported by both the upper arm and the lower arm. In this case, for one load lock chamber or process chamber, for example, the upper arm reference position acquisition processing is performed on the load lock chamber LM1, and then the lower arm reference position acquisition processing is performed. Of course, the lower arm reference position acquisition process may be performed first.

According to the embodiment described above, at least the following effects (1) to (5) can be obtained.
(1) Even if the pendant (maintenance terminal) is not connected to a robot controller that is a control unit of a vacuum robot or an atmospheric robot, an operator can perform reference position confirmation processing and reference position acquisition via the operation display unit of the substrate processing apparatus. Processing can be performed. Further, even an operator who is not familiar with the pendant operation method can easily perform the reference position confirmation process and the reference position acquisition process, and the setup time of the substrate processing apparatus can be shortened.
(2) Since the reference position confirmation status and the reference position acquisition status for each load lock chamber and each process chamber are displayed in a list on the operation display unit of the substrate processing apparatus, the operator can check the reference position confirmation status and the reference position acquisition status. It can be confirmed at a glance, and unnecessary reference position confirmation processing and reference position acquisition processing are not required.
(3) Using the pendant, instead of performing the reference position confirmation process and the reference position acquisition process for each of the load lock chambers and process chambers one by one, the reference is automatically and continuously performed for a plurality of load lock chambers and process chambers. Since the position confirmation process and the reference position acquisition process can be performed, the setup time of the substrate processing apparatus can be shortened.
(4) By performing the reference position confirmation process before starting the processing of the product substrate, it can be confirmed that the reference position at that time is an appropriate position with a margin, so that the substrate can be simply transported. Compared with the method of checking (in this method, it is unknown whether the reference position has a margin), it is possible to suppress the occurrence of substrate transport errors during product substrate processing.
(5) For each chamber (chamber), reference position acquisition processing (or reference position confirmation processing) of one arm (for example, upper arm) of a plurality of arms is performed, and then the reference position of the other arm (for example, lower arm) In the case where the acquisition process is performed, the reference position acquisition process (or reference position confirmation process) of one arm is sequentially performed on the plurality of chambers (chambers), and then the plurality of chambers (chambers) are processed. Compared to the case where the reference position acquisition process (or reference position confirmation process) of the other arm is sequentially performed, the reference position acquisition process (or reference position confirmation process) time can be shortened.

It goes without saying that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.
In the above embodiment, the reference position confirmation method and the reference position acquisition method for the vacuum robot have been described. However, the reference position confirmation and the reference position acquisition can be performed for the atmospheric robot in the same manner as the vacuum robot. Also, when using a substrate transfer robot other than the vacuum robot or the atmospheric robot, the same reference position confirmation and reference position acquisition can be performed. In the embodiment, the reference position confirmation and the reference position acquisition are performed using the wafer W in the cassette CA1, but the wafer W in another cassette CA2 or CA3 may be used. In the above embodiment, the case where there are three load ports, two load lock chambers, and four process chambers has been described. However, the present invention is not limited to these numbers.

  In the embodiment, the arm reference position acquisition process (or reference position confirmation process) is performed for all the chambers (chambers) constituting the substrate processing apparatus. It is also possible to designate one or more) and perform the reference position acquisition process (or reference position confirmation process) for only the designated room. In this way, when there are many rooms where the reference position is “invalid” such as when starting up the substrate processing apparatus, the reference position acquisition process (or reference position confirmation process) is automatically performed for all the rooms. When there are few rooms where the reference position is “invalid”, such as during maintenance after the substrate processing apparatus is in operation, it is possible to specify a specific room and perform reference position acquisition processing (or reference position confirmation processing). The setup time of the substrate processing apparatus can be shortened.

  Moreover, it is also possible to use together with the reference position acquisition process (or reference position confirmation process) for a specific room performed using a pendant. In this way, when there are many rooms where the reference position is “invalid” such as when starting up the substrate processing apparatus, the reference position acquisition process (or reference position confirmation process) is automatically performed for all the rooms. When there are few rooms where the reference position is “invalid”, such as during maintenance after the substrate processing apparatus is in operation, the reference position acquisition process (or reference position confirmation process) can be performed using a pendant. Setup time can be shortened.

  The present invention can be applied not only to a semiconductor manufacturing apparatus but also to an apparatus for processing a glass substrate, such as an LCD manufacturing apparatus, and other substrate processing apparatuses. The processing content of the substrate processing includes not only film forming processing for forming CVD, PVD, ALD, epitaxial growth film, oxide film, nitride film, metal-containing film, etc., but also annealing processing, oxidation processing, diffusion processing, etching processing, exposure processing Lithography, coating treatment, mold treatment, development treatment, dicing treatment, wire bonding treatment, inspection treatment, etc.

The present specification includes at least the following configurations. That is,
The first configuration is
A first substrate transfer chamber comprising a first substrate transfer device for transferring a substrate in a reduced pressure state;
A first substrate position detector provided to be connected to the first substrate transfer chamber and configured to detect a substrate position; and a first substrate placement unit for placing a substrate; A processing chamber for processing the substrate placed on the part in a reduced pressure state;
A second substrate position detector provided to be connected to the first substrate transfer chamber and detecting a substrate position, and a second substrate placement unit for placing the substrate are provided, and a reduced pressure state and an atmospheric pressure state are provided. A switchable spare room,
A substrate placed on the first substrate transporter is placed in the processing chamber, and the first substrate transporter uses the first substrate position detector to place the substrate on the first substrate rest. A first reference position serving as a reference for placing the substrate is placed, a substrate placed on the first substrate transporter is placed in the spare chamber, and the second substrate position detector is used. A control unit that acquires a second reference position that serves as a reference when the first substrate transporter places a substrate on the second substrate platform;
An operation display unit that receives an acquisition instruction from the operator regarding the first reference position and the second reference position, and displays an acquisition status of the first reference position and the second reference position. A substrate processing apparatus configured as described above.

The second configuration is the substrate processing apparatus in the first configuration,
Furthermore, a second substrate transfer chamber provided with a second substrate transfer machine that is connected to the preliminary chamber and transfers the substrate in an atmospheric pressure state,
The control unit further includes:
A substrate placed on the second substrate transporter is placed in the spare room, and the second substrate transporter uses the second substrate position detector to place the substrate on the second substrate platform. To obtain a third reference position serving as a reference when placing
The operation display unit further includes:
A substrate processing apparatus configured to receive an acquisition instruction from an operator regarding the third reference position and to display an acquisition status of the third reference position.

The third configuration is a substrate processing apparatus in the first configuration or the second configuration,
The first substrate transfer machine includes two sets of substrate support arms,
The controller is
A substrate processing apparatus configured to acquire the second reference position for each of the two sets of substrate support arms after acquiring the first reference position for each of the two sets of substrate support arms.

The fourth configuration is the substrate processing apparatus in the second configuration,
Furthermore, a load port is provided that is connected to the second substrate transfer chamber and places a storage container that stores a plurality of substrates.
The controller is
The second substrate transporter takes out the substrate from the storage container placed on the load port and places the substrate on the second substrate platform, and then the first substrate transporter performs the second A substrate processing apparatus configured to acquire the first reference position and the second reference position after supporting the substrate placed on the substrate placement unit.

The fifth configuration is the substrate processing apparatus in the fourth configuration,
The controller is
A substrate processing apparatus configured to obtain the third reference position after the second substrate transporter has taken out the substrate from the storage container and before placing the substrate on the second substrate platform.

The sixth configuration is
A first substrate transfer chamber comprising a first substrate transfer device for transferring a substrate in a reduced pressure state;
A first substrate position detector provided to be connected to the first substrate transfer chamber and detecting a substrate position and a first substrate platform, and placed on the first substrate platform. A processing chamber for processing the substrate under reduced pressure;
A spare which is provided in connection with the first substrate transfer chamber and includes a second substrate position detector for detecting the substrate position and a second substrate platform, and is capable of switching between a reduced pressure state and an atmospheric pressure state. Room,
An operation display unit that receives instructions from an operator and displays various types of information, and a control method for a substrate processing apparatus,
A first reference position serving as a reference when the first substrate transporter places a substrate on the first substrate platform, and the first substrate transporter serves as the second substrate platform. Receiving an instruction from an operator for obtaining a second reference position serving as a reference when placing the substrate on the operation display unit;
Placing the substrate placed on the first substrate transporter in the processing chamber and obtaining the first reference position using the first substrate position detector;
Placing the substrate placed on the first substrate transporter in the preliminary chamber and obtaining the second reference position using the second substrate position detector;
Displaying the acquired acquisition status of the first reference position and the second reference position on the operation display unit;
A method for controlling a substrate processing apparatus configured to include:

The seventh configuration is
A first substrate transfer chamber comprising a first substrate transfer device for transferring a substrate in a reduced pressure state;
A first substrate position detector provided to be connected to the first substrate transfer chamber and detecting a substrate position and a first substrate platform, and placed on the first substrate platform. A processing chamber for processing the substrate under reduced pressure;
A spare which is provided in connection with the first substrate transfer chamber and includes a second substrate position detector for detecting the substrate position and a second substrate platform, and is capable of switching between a reduced pressure state and an atmospheric pressure state. Room,
An operation display unit that receives instructions from an operator and displays various types of information, and a control program for a substrate processing apparatus,
A first reference position serving as a reference when the first substrate transporter places a substrate on the first substrate platform, and the first substrate transporter serves as the second substrate platform. Receiving an instruction from an operator for obtaining a second reference position serving as a reference when placing the substrate on the operation display unit;
Placing the substrate placed on the first substrate transporter in the processing chamber and obtaining the first reference position using the first substrate position detector;
Placing the substrate placed on the first substrate transporter in the preliminary chamber and obtaining the second reference position using the second substrate position detector;
Displaying the acquired acquisition status of the first reference position and the second reference position on the operation display unit;
A control program for a substrate processing apparatus configured to include:

The eighth configuration is
A first substrate transfer chamber comprising a first substrate transfer device for transferring a substrate in a reduced pressure state;
A first substrate position detector provided to be connected to the first substrate transfer chamber and detecting a substrate position and a first substrate platform, and placed on the first substrate platform. A processing chamber for processing the substrate under reduced pressure;
A spare which is provided in connection with the first substrate transfer chamber and includes a second substrate position detector for detecting the substrate position and a second substrate platform, and is capable of switching between a reduced pressure state and an atmospheric pressure state. Room,
An operation display unit that receives instructions from an operator and displays various types of information, and a method for manufacturing a semiconductor device using a substrate processing apparatus,
A first reference position serving as a reference when the first substrate transporter places a substrate on the first substrate platform, and the first substrate transporter serves as the second substrate platform. Receiving an instruction from an operator for obtaining a second reference position serving as a reference when placing the substrate on the operation display unit;
Placing the substrate placed on the first substrate transporter in the processing chamber and obtaining the first reference position using the first substrate position detector;
Placing the substrate placed on the first substrate transporter in the preliminary chamber and obtaining the second reference position using the second substrate position detector;
Displaying the acquired acquisition status of the first reference position and the second reference position on the operation display unit;
The first substrate transporter supports the substrate placed on the second substrate platform based on the acquired second reference position, and then based on the acquired first reference position. Placing the substrate on the first substrate platform;
A processing step of processing the substrate placed on the first substrate placement unit in a reduced pressure state;
Acquired after the substrate mounted on the first substrate platform processed in the processing step is supported by the first substrate transporter based on the acquired first reference position. Placing on the second substrate platform based on a second reference position;
A method of manufacturing a semiconductor device configured to include:

The ninth configuration is
A first substrate transfer chamber comprising a first substrate transfer device for transferring a substrate in a reduced pressure state;
A first substrate position detector provided to be connected to the first substrate transfer chamber and detecting a substrate position and a first substrate platform, and placed on the first substrate platform. A processing chamber for processing the substrate under reduced pressure;
A spare chamber that is connected to the first substrate transfer chamber, includes a second substrate position detector for detecting the substrate position, and a second substrate platform, and is capable of switching between a reduced pressure state and an atmospheric pressure state. When,
A substrate placed on the first substrate transporter is placed in the processing chamber based on a first reference position set in advance, and the first reference position is detected using the first substrate position detector. Is determined to be appropriate, and a substrate placed on the first substrate transporter is placed in the spare room based on a preset second reference position, and the second substrate A control unit that determines whether or not the second reference position is appropriate using a position detector;
A confirmation instruction from an operator regarding whether or not the first reference position and the second reference position are appropriate is accepted, and the first reference position and the second reference position are appropriate. A substrate processing apparatus configured to include an operation display unit that displays a confirmation status of whether or not.

The tenth configuration is
A first substrate transfer chamber comprising a first substrate transfer device for transferring a substrate in a reduced pressure state;
A first substrate position detector provided to be connected to the first substrate transfer chamber and detecting a substrate position and a first substrate platform, and placed on the first substrate platform. A processing chamber for processing the substrate under reduced pressure;
A spare which is provided in connection with the first substrate transfer chamber and includes a second substrate position detector for detecting the substrate position and a second substrate platform, and is capable of switching between a reduced pressure state and an atmospheric pressure state. Room,
An operation display unit that receives instructions from an operator and displays various types of information, and a control method for a substrate processing apparatus,
A first reference position serving as a reference when the first substrate transporter places a substrate on the first substrate platform, and the first substrate transporter serves as the second substrate platform. Receiving an instruction from an operator for confirming whether or not the second reference position serving as a reference for placing the substrate on the substrate is appropriate;
A substrate placed on the first substrate transporter is placed in the processing chamber based on a first reference position set in advance, and the first reference position is detected using the first substrate position detector. Determining whether is appropriate,
A substrate placed on the first substrate transporter is placed in the spare room based on a preset second reference position, and the second reference position is detected using the second substrate position detector. Determining whether is appropriate,
Displaying on the operation display unit a confirmation status as to whether or not the first reference position and the second reference position are appropriate;
A method for controlling a substrate processing apparatus configured to include:

The eleventh configuration is
A first substrate transfer chamber comprising a first substrate transfer device for transferring a substrate in a reduced pressure state;
A first substrate position detector provided to be connected to the first substrate transfer chamber and detecting a substrate position and a first substrate platform, and placed on the first substrate platform. A processing chamber for processing the substrate under reduced pressure;
A spare which is provided in connection with the first substrate transfer chamber and includes a second substrate position detector for detecting the substrate position and a second substrate platform, and is capable of switching between a reduced pressure state and an atmospheric pressure state. Room,
An operation display unit that receives instructions from an operator and displays various information, and a control program for a substrate processing apparatus,
A first reference position serving as a reference when the first substrate transporter places a substrate on the first substrate platform, and the first substrate transporter serves as the second substrate platform. Receiving an instruction from an operator for confirming whether or not the second reference position serving as a reference for placing the substrate on the substrate is appropriate;
A substrate placed on the first substrate transporter is placed in the processing chamber based on a first reference position set in advance, and the first reference position is detected using the first substrate position detector. Determining whether is appropriate,
A substrate placed on the first substrate transporter is placed in the spare room based on a preset second reference position, and the second reference position is detected using the second substrate position detector. Determining whether is appropriate,
Displaying on the operation display unit a confirmation status as to whether or not the first reference position and the second reference position are appropriate;
A control program for a substrate processing apparatus configured to include:

The twelfth configuration is
A first substrate transfer chamber comprising a first substrate transfer device for transferring a substrate in a reduced pressure state;
A first substrate position detector provided to be connected to the first substrate transfer chamber and detecting a substrate position and a first substrate platform, and placed on the first substrate platform. A processing chamber for processing the substrate under reduced pressure;
A spare which is provided in connection with the first substrate transfer chamber and includes a second substrate position detector for detecting the substrate position and a second substrate platform, and is capable of switching between a reduced pressure state and an atmospheric pressure state. Room,
An operation display unit that receives instructions from an operator and displays various types of information, and a method for manufacturing a semiconductor device using a substrate processing apparatus,
A first reference position serving as a reference when the first substrate transporter places a substrate on the first substrate platform, and the first substrate transporter serves as the second substrate platform. Receiving an instruction from an operator for confirming whether or not the second reference position serving as a reference for placing the substrate on the substrate is appropriate;
A substrate placed on the first substrate transporter is placed in the processing chamber based on a first reference position set in advance, and the first reference position is detected using the first substrate position detector. Determining whether is appropriate,
A substrate placed on the first substrate transporter is placed in the spare room based on a preset second reference position, and the second reference position is detected using the second substrate position detector. Determining whether is appropriate,
When the first reference position and the second reference position are appropriate,
After the first substrate transporter supports the substrate placed on the second substrate platform based on the second reference position, the first substrate based on the first reference position. Placing the substrate on the placement unit;
A processing step of processing the substrate placed on the first substrate placement unit in a reduced pressure state;
After the first substrate transporter supports the substrate placed on the first substrate platform processed in the processing step based on the first reference position, the second reference position Placing on the second substrate platform based on:
A method of manufacturing a semiconductor device configured to include:

  DESCRIPTION OF SYMBOLS 10 ... Control part (controller), 11 ... Operation part controller, 11s ... Operation display part, 11m ... Memory | storage part, 13 ... Conveyance system controller, 13m ... Memory | storage part, 14 ... Process chamber controller, 14m ... Memory | storage part, 15 ... Pressure Controller, 16 ... Switching hub, 17 ... Sequencer, 18 ... SW digital I / O, 19 ... Valve digital I / O, 20 ... Storage unit, 21 ... GEM, 31 ... Network, 32 ... Signal line, 40 ... Upper host, AU ... aligner, AR ... atmospheric robot (second substrate transfer machine), ARA ... arm of atmospheric robot, EFEM ... atmospheric transfer chamber (second substrate transfer chamber), CA1 to CA3 ... cassette (storage container), LD1, LD2 ... Gate valve, LGV1, LGV2 ... Gate valve, LK ... Substrate position detector (second substrate position detector), LM , LM2 ... load lock chamber (preliminary chamber), LP1 to LP3 ... load port (storage container placement section), LS1, LS2 ... buffer stage (second substrate placement section), P ... pendant, PG1 to PG4 ... gate Valve, PK ... Substrate position detector (first substrate position detector), PM1 to PM4 ... Process chamber (processing chamber), PS1-PS4 ... Placement table (first substrate placement portion), TM ... Vacuum transfer chamber (First substrate transfer chamber), VR ... vacuum robot (first substrate transfer machine), VRA ... arm of vacuum robot, W ... wafer.

Claims (1)

A first substrate transfer chamber comprising a first substrate transfer device for transferring a substrate in a reduced pressure state;
A first substrate position detector provided to be connected to the first substrate transfer chamber and configured to detect a substrate position; and a first substrate placement unit for placing a substrate; A processing chamber for processing the substrate placed on the part in a reduced pressure state;
A second substrate position detector provided to be connected to the first substrate transfer chamber and detecting a substrate position, and a second substrate placement unit for placing the substrate are provided, and a reduced pressure state and an atmospheric pressure state are provided. A switchable spare room,
A substrate placed on the first substrate transporter is placed in the processing chamber, and the first substrate transporter uses the first substrate position detector to place the substrate on the first substrate rest. A first reference position serving as a reference for placing the substrate is placed, a substrate placed on the first substrate transporter is placed in the spare chamber, and the second substrate position detector is used. A control unit that acquires a second reference position that serves as a reference when the first substrate transporter places a substrate on the second substrate platform;
An operation display unit that receives an acquisition instruction from the operator regarding the first reference position and the second reference position, and displays an acquisition status of the first reference position and the second reference position. A substrate processing apparatus configured as described above.

Images