JP2013239338A - Contact structure of electronic apparatus, and mobile electronic apparatus having contact structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an easy-to-assemble contact structure with an improved degree of freedom in design of an electronic apparatus.SOLUTION: A contact structure of an electronic apparatus 100 comprises: a first conductive material 130; a second conductive material 131; a substrate 120 arranged between the first conductive material 130 and the second conductive material 131; a first elastic member 140 arranged between a first plane of the substrate 120 and the first conductive material 130; and a second elastic member 141 arranged between a second plane on a rear side of the first plane and the second conductive material 131.

Description

  The present invention relates to a contact structure of an electronic device.

  In an electronic device, a spring contact is often used for electrical connection between a pattern on a substrate and a conductive material or the like attached to a housing of the electronic device. Although the spring contact is excellent in followability, a unilateral spring elastic force is always applied to the substrate or the casing.

  Therefore, by arranging a spring contact on the back of the spring contact, the possibility of contact failure can be reduced even if an instantaneous stress such as a drop in the balance of stress occurs. There are more methods than the past to balance the spring elastic force between the front and back by arranging them in the. This technique is found, for example, in a personal computer memory slot (the front and back contacts are the same line).

  Japanese Patent Application Laid-Open No. 11-74580 (Patent Document 1) discloses a “piezoelectric transformer device that improves the reliability of holding electrical contacts and preventing contact of piezoelectric transformer elements with spring-like lead terminals”. ing.

JP-A-11-74580

  According to the technique disclosed in Patent Document 1, the spring contact is mounted (attached) on the side of the substrate sandwiched therebetween. For this reason, the design freedom is restricted, and the processing is troublesome. Therefore, there is a need for a technique that is not easily restricted by design freedom and that can be easily processed.

  SUMMARY An advantage of some aspects of the invention is that it provides a contact structure for an electronic device that is less susceptible to design freedom. An object in another aspect is to provide a contact structure of an electronic device that can be easily processed. The objective in the other situation is to provide a portable electronic device having a contact structure that is less susceptible to design freedom. Still another object of the present invention is to provide a portable electronic device having a contact structure that facilitates processing.

  An electronic device contact structure according to an embodiment includes a first conductive material, a second conductive material, a substrate disposed between the first conductive material and the second conductive material, A first elastic member disposed between the first surface and the first conductive material; and a second elastic member disposed between the second surface on the back side of the first surface and the second conductive material. The elastic member is provided.

  Preferably, each of the first elastic member and the second elastic member has a protrusion. The first elastic member is disposed on the substrate so that the protrusion of the first elastic member is in contact with the first conductor. The second elastic member is disposed on the substrate so that the protruding portion of the second elastic member is in contact with the second conductor.

  Preferably, the first elastic member and the second elastic member are arranged at positions symmetrical with respect to the substrate.

  Preferably, the first conductive material is disposed so as to be in contact with the first surface of the casing of the electronic device. The second conductive material is disposed so as to contact the second surface of the housing of the electronic device.

  According to another embodiment, a portable electronic device including any of the above-described substrate contact structures is provided.

In one aspect, it becomes difficult to be restricted by the degree of freedom in designing the contact structure of the electronic device.
The above and other objects, features, aspects and advantages of the present invention will become apparent from the following detailed description of the present invention taken in conjunction with the accompanying drawings.

2 is a diagram illustrating a cross section of electronic device 100. FIG. It is a figure showing the state of displacement of substrate 120. It is a figure showing the contact structure where the elastic member is arrange | positioned only at one side of the board | substrate.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same parts are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated.

[Outline of contact structure]
With reference to FIG. 1, the contact structure of electronic device 100 according to the present embodiment will be described. FIG. 1 is a diagram showing a cross section of electronic device 100. The electronic device 100 is, for example, a mobile phone, a so-called smartphone, a tablet terminal, an electronic dictionary, a laptop computer, or other portable terminal.

  As illustrated in FIG. 1, the contact structure of the electronic device 100 includes a conductor 130, a conductor 131, a substrate 120 disposed between the conductor 130 and the conductor 131, and a first of the substrate 120. The elastic member 140 is disposed between the surface and the conductor 130, and the elastic member 141 is disposed between the second surface on the back side of the first surface and the conductor 131. The elastic members 140 and 141 are realized as springs, for example. The elastic members 140 and 141 may be any material having conductivity.

  In one aspect, the elastic member 140 and the elastic member 141 each have a protrusion. The elastic member 140 is disposed on the substrate 120 so that the protruding portion of the elastic member 140 is in contact with the conductor 130. The elastic member 141 is disposed on the substrate 120 such that the protruding portion of the elastic member 141 is in contact with the conductor 131.

  In one aspect, the elastic member 140 and the elastic member 141 are arranged in a line-symmetric position with respect to the substrate 120.

  In one aspect, the conductor 130 is disposed so as to be in contact with the first surface of the housing of the electronic device 100. The conductive material 131 is disposed so as to be in contact with the second surface of the casing of the electronic device 100.

  In the configuration shown in FIG. 1, the spring elastic force 150 by the elastic member 140 is generated from the substrate 120 toward the conductor 130. The spring elastic force 151 by the elastic member 141 is generated from the substrate 120 toward the conductor 131.

[Changes in contact structure]
With reference to FIG. 2, the change of the contact structure of the electronic device 100 will be described. FIG. 2 is a diagram illustrating a state of displacement of the substrate 120.

  In state (A), electronic device 100 is in a steady state. The steady state is a state in which no impact or other disturbance is applied to the electronic device 100, for example. At this time, the substrate 120 is held at a predetermined position by the spring elastic forces 150 and 151 of the elastic members 140 and 141. Further, the protrusions of the elastic members 140 and 141 are in contact with the conductors 130 and 131, respectively. When an impact is applied to the electronic device 100 from this state, the substrate is temporarily displaced. Therefore, the interval between the substrate 120 and the conductor 130 or the interval between the substrate 120 and the conductor 131 changes.

  For example, as shown in the state (B), the position of the substrate 120 may change toward the housing 110. As a result of this displacement, the distance between the substrate 120 and the conductive material 130 temporarily increases. As a result, the magnitudes of the spring elastic force 250 and the spring elastic force 251 are different. Since the elastic member 140 is disposed between the substrate 120 and the conductive material 130, the elastic member 140 extends toward the conductive material 130 as the distance increases. As a result, even in the state (B), conduction between the conductor 130 and the substrate 120 is maintained.

  Thereafter, as shown in the state (C), when the spring elastic force 150 and the spring elastic force 151 are balanced, the substrate 120 returns to a steady state. As a result, conduction between the substrate 120 and the conductors 130 and 131 is maintained from the state (A) to the state (C).

  With reference to FIG. 3, the contact structure of electronic device 300 in another aspect will be described. FIG. 3 is a diagram showing a contact structure in which the elastic member is disposed only on one side of the substrate.

  In the electronic device 300, one surface of the substrate 120 is in contact with the housing 111. The elastic member 141 is disposed on the other surface.

  As shown in the state (A), when the electronic device 300 is in a steady state, the protruding portion of the elastic member 141 is in contact with the conductor 131. Therefore, in the steady state, the conduction of the electronic device 300 is maintained.

  After that, as shown in the state (B), when some impact is applied to the electronic device 300, the relative positional relationship between the casing 110 and the casing 111 is temporarily changed, so that the elastic member 141 and the conductor 131 are changed. A gap 310 may occur between the two. As a result, the contact point is temporarily disconnected, so that the electrical device 300 is interrupted and normal operation may be hindered.

  On the other hand, according to electronic device 100 according to the present embodiment, as shown in FIG. 1 or FIG. 2, substrate 120 is maintained so as to be sandwiched between two elastic members 140 and 141, and conductive material 130. , 131 is maintained. The elastic members 140 and 141 are attached to the substrate 120. According to such a structure, the electronic device 100 can continue to operate normally even when it receives an impact.

  Further, as shown in FIG. 1, the configuration in which the elastic members 140 and 141 are attached to the substrate 120 relaxes restrictions on the housing using the contact structure, and thus the degree of freedom in designing the electronic device 100 using the configuration. Can be raised. More specifically, in the contact structure, in order for the conductors 130 and 131, the substrate 120, and the elastic members 140 and 141 to have a spring property on the conductor side, the thickness of the conductor is determined to some extent. In addition, it is necessary to make the conductive material thin. However, according to the configuration of electronic apparatus 100 according to the present embodiment, since it is not related to the thickness of the conductive material, it can be applied to a configuration using a thick conductive material such as a cavity insert sheet metal from thin copper foil. In other words, as long as the material has conductivity, it is not necessary to form the sheet metal to form the contact point with the elastic members 140 and 141.

  Further, as a merit of mounting the spring contact on the substrate side, the cost can be reduced. In other words, compared to the processing cost of installing a spring-like member on the conductive material, mounting of the spring contact on the substrate can be implemented by a machine, so that the processing cost can be expected to be reduced.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  100, 300 Electronic equipment, 110, 111 housing, 120 substrate, 130, 131 conductor, 140, 141 elastic member, 150, 151, 250, 251 Spring elastic force, 310 gap.

Claims (5)

Electronic device contact structure,
A first conductor;
A second conductor,
A substrate disposed between the first conductor and the second conductor;
A first elastic member disposed between the first surface of the substrate and the first conductive material;
A contact structure for an electronic device, comprising: a second elastic member disposed between a second surface on the back side of the first surface and the second conductive material. The first elastic member and the second elastic member each have a protrusion,
The first elastic member is disposed on the substrate such that the protrusion of the first elastic member is in contact with the first conductor.
2. The electronic device contact structure according to claim 1, wherein the second elastic member is disposed on the substrate such that a protruding portion of the second elastic member is in contact with the second conductive material.   3. The electronic device contact structure according to claim 1, wherein the first elastic member and the second elastic member are arranged in a line-symmetrical position with respect to the substrate. The first conductive material is disposed so as to contact the first surface of the housing of the electronic device,
The electronic device contact structure according to claim 1, wherein the second conductive material is disposed so as to be in contact with a second surface of the casing of the electronic device.   The portable electronic device containing the contact structure in any one of Claims 1-4.

Images