JP2013237151A5 - - Google Patents
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- JP2013237151A5 JP2013237151A5 JP2013158223A JP2013158223A JP2013237151A5 JP 2013237151 A5 JP2013237151 A5 JP 2013237151A5 JP 2013158223 A JP2013158223 A JP 2013158223A JP 2013158223 A JP2013158223 A JP 2013158223A JP 2013237151 A5 JP2013237151 A5 JP 2013237151A5
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- JP
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- Prior art keywords
- conditioner
- jig
- attached
- parts
- polishing pad
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Description
上記目的を達成するために、本発明の研磨パッドのコンディショナーは、一方に研磨パッドの表面粗さの維持および目詰まりを除去するためのコンディショナー部が設けられ、他方にシリンダーが設けられ、その間に加圧センサーが一体的に設けられた複数のコンディショナー本体部と、前記シリンダーを稼動して、前記複数のコンディショナー本体部の複数のコンディショナー部の一部又は全部に対し圧力を加える加圧手段と、前記加圧センサーからのセンサー信号に基づいて前記加圧手段を制御する制御手段と、を有し、前記コンディショナー本体部は、柱状に構成され、前記複数のコンディショナー本体部が、板状のコンディショナー冶具の2つの主面のうち研磨機に取り付けられる側の主面とは反対側の主面に取り付けられ、前記コンディショナー冶具に前記複数のコンディショナー本体部が取り付けられる方向は、前記コンディショナー部がいずれも同じ向きに露出する方向であり、前記コンディショナー冶具が、該コンディショナー冶具の中心軸線まわりに回転可能に研磨機に取り付けられることを特徴とする。 In order to achieve the above object, the conditioner for the polishing pad of the present invention is provided with a conditioner part for maintaining the surface roughness of the polishing pad and removing clogging on one side, and a cylinder on the other side. A plurality of conditioner body portions integrally provided with a pressure sensor; and a pressurizing unit that operates the cylinder and applies pressure to a part or all of the plurality of conditioner portions of the plurality of conditioner body portions; Control means for controlling the pressurizing means based on a sensor signal from the pressure sensor, wherein the conditioner main body portion is formed in a columnar shape, and the plurality of conditioner main body portions are plate-like conditioner jigs. Are attached to the main surface opposite to the main surface of the two main surfaces attached to the polishing machine, Direction in which the plurality of conditioner main body is attached to the conditioners jig is the direction the conditioner portion is exposed in the same direction both the conditioner jig, the rotatable grinding machine around the central axis of the conditioning jig It is attached.
Claims (3)
前記シリンダーを稼動して、前記複数のコンディショナー本体部の複数のコンディショナー部の一部又は全部に対し圧力を加える加圧手段と、
前記加圧センサーからのセンサー信号に基づいて前記加圧手段を制御する制御手段と、を有し、
前記コンディショナー本体部は、柱状に構成され、
前記複数のコンディショナー本体部が、板状のコンディショナー冶具の2つの主面のうち研磨機に取り付けられる側の主面とは反対側の主面に取り付けられ、
前記コンディショナー冶具に前記複数のコンディショナー本体部が取り付けられる方向は、前記コンディショナー部がいずれも同じ向きに露出する方向であり、
前記コンディショナー冶具が、該コンディショナー冶具の中心軸線まわりに回転可能に研磨機に取り付けられることを特徴とする研磨パッドのコンディショナー。 A conditioner part for maintaining the surface roughness of the polishing pad and removing clogging is provided on one side, a cylinder is provided on the other side, and a plurality of conditioner body parts integrally provided with a pressure sensor therebetween,
Pressurizing means for operating the cylinder and applying pressure to a part or all of the plurality of conditioner portions of the plurality of conditioner main body portions;
Control means for controlling the pressurization means based on a sensor signal from the pressurization sensor,
The conditioner body is configured in a columnar shape,
The plurality of conditioner body parts are attached to the main surface opposite to the main surface on the side attached to the polishing machine among the two main surfaces of the plate-like conditioner jig,
The direction in which the plurality of conditioner body parts are attached to the conditioner jig is a direction in which the conditioner parts are all exposed in the same direction,
A conditioner for a polishing pad , wherein the conditioner jig is attached to a polishing machine so as to be rotatable about a central axis of the conditioner jig .
モータによって前記機械ネジ手段を回転させ、前記複数のコンディショナー本体部の複数のコンディショナー部の一部又は全部に対し圧力を加える加圧手段と、
前記加圧センサーからのセンサー信号に基づいて前記加圧手段の前記モータを制御する制御手段と、を有し、
前記コンディショナー本体部は、柱状に構成され、
前記複数のコンディショナー本体部が、板状のコンディショナー冶具の2つの主面のうち研磨機に取り付けられる側の主面とは反対側の主面に取り付けられ、
前記コンディショナー冶具に前記複数のコンディショナー本体部が取り付けられる方向は、前記コンディショナー部がいずれも同じ向きに露出する方向であり、
前記コンディショナー冶具が、該コンディショナー冶具の中心軸線まわりに回転可能に研磨機に取り付けられることを特徴とする研磨パッドのコンディショナー。 A plurality of conditioner main body portions that are provided with a conditioner portion for maintaining the surface roughness of the polishing pad and removing clogging on one side, and provided with mechanical screw means on the other side, and a pressure sensor integrally provided therebetween. When,
Pressurizing means for rotating the mechanical screw means by a motor and applying pressure to a part or all of the plurality of conditioner parts of the plurality of conditioner body parts;
Control means for controlling the motor of the pressure means based on a sensor signal from the pressure sensor,
The conditioner body is configured in a columnar shape,
The plurality of conditioner body parts are attached to the main surface opposite to the main surface on the side attached to the polishing machine among the two main surfaces of the plate-like conditioner jig,
The direction in which the plurality of conditioner body parts are attached to the conditioner jig is a direction in which the conditioner parts are all exposed in the same direction,
A conditioner for a polishing pad , wherein the conditioner jig is attached to a polishing machine so as to be rotatable about a central axis of the conditioner jig .
前記電磁コイル手段を励磁して、前記複数のコンディショナー本体部の複数のコンディショナー部の一部又は全部に対し圧力を加える加圧手段と、
前記加圧センサーからのセンサー信号に基づいて前記加圧手段を制御する制御手段と、を有し、
前記コンディショナー本体部は、柱状に構成され、
前記複数のコンディショナー本体部が、板状のコンディショナー冶具の2つの主面のうち研磨機に取り付けられる側の主面とは反対側の主面に取り付けられ、
前記コンディショナー冶具に前記複数のコンディショナー本体部が取り付けられる方向は、前記コンディショナー部がいずれも同じ向きに露出する方向であり、
前記コンディショナー冶具が、該コンディショナー冶具の中心軸線まわりに回転可能に研磨機に取り付けられることを特徴とする研磨パッドのコンディショナー。 A plurality of conditioner main body portions that are provided with a conditioner portion for maintaining the surface roughness of the polishing pad and removing clogging on one side, and provided with electromagnetic coil means on the other side, and a pressure sensor integrally provided therebetween. When,
Pressurizing means for exciting the electromagnetic coil means and applying pressure to a part or all of the plurality of conditioner portions of the plurality of conditioner body portions;
Control means for controlling the pressurization means based on a sensor signal from the pressurization sensor,
The conditioner body is configured in a columnar shape,
The plurality of conditioner body parts are attached to the main surface opposite to the main surface on the side attached to the polishing machine among the two main surfaces of the plate-like conditioner jig,
The direction in which the plurality of conditioner body parts are attached to the conditioner jig is a direction in which the conditioner parts are all exposed in the same direction,
A conditioner for a polishing pad , wherein the conditioner jig is attached to a polishing machine so as to be rotatable about a central axis of the conditioner jig .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013158223A JP5554440B2 (en) | 2013-07-30 | 2013-07-30 | Polishing pad conditioner |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013158223A JP5554440B2 (en) | 2013-07-30 | 2013-07-30 | Polishing pad conditioner |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008255748A Division JP5335350B2 (en) | 2008-09-30 | 2008-09-30 | Polishing pad conditioner |
Publications (3)
Publication Number | Publication Date |
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JP2013237151A JP2013237151A (en) | 2013-11-28 |
JP2013237151A5 true JP2013237151A5 (en) | 2014-01-16 |
JP5554440B2 JP5554440B2 (en) | 2014-07-23 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013158223A Active JP5554440B2 (en) | 2013-07-30 | 2013-07-30 | Polishing pad conditioner |
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JP (1) | JP5554440B2 (en) |
Families Citing this family (1)
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CN110253147A (en) * | 2019-06-19 | 2019-09-20 | 浙江工业大学 | A kind of laser assisted hydration processing polished method |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10128653A (en) * | 1996-10-28 | 1998-05-19 | Sony Corp | Device and method for polishing wafer |
JPH11333697A (en) * | 1998-05-28 | 1999-12-07 | Nkk Corp | Dresser system for cmp device |
US6086460A (en) * | 1998-11-09 | 2000-07-11 | Lam Research Corporation | Method and apparatus for conditioning a polishing pad used in chemical mechanical planarization |
JP2000246619A (en) * | 1999-02-25 | 2000-09-12 | Nikon Corp | Machining tool and machining method |
JP2000263418A (en) * | 1999-03-15 | 2000-09-26 | Hitachi Ltd | Polishing method and polishing device |
JP2001079752A (en) * | 1999-09-08 | 2001-03-27 | Hitachi Ltd | Chemical machine polishing device and method for manufacturing semiconductor integrated circuit device using it |
US20050282745A1 (en) * | 2001-08-28 | 2005-12-22 | Siler-Khodr Theresa M | Non-mammalian GnRH analogs and uses thereof in regulation of fertility and pregnancy |
JP2008023674A (en) * | 2006-07-24 | 2008-02-07 | Nikon Corp | Dressing device adjustment method, dressing device and polishing device |
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2013
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