JP2013229012A - Data carrier for metal patch and radio communication method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a data carrier for metal patch capable of being thinly and inexpensively manufactured, and a radio communication method.SOLUTION: A data carrier 10 for metal patch includes a substrate sheet 11, an electronic circuit provided on one surface of the substrate sheet 11 and having a circuit line 23 formed into a helix shape, and a resin layer 13 provided on the formation surface of the electronic circuit on the substrate sheet 11 and having magnetic powder. The resin layer 13 is provided on the one surface or the other surface of the substrate sheet 11, and is in a position where the resin layer overlaps at least in one turn between the outermost peripheral and the innermost peripheral of the circuit line 23 in a direction vertical to the one surface.

Description

  The present invention relates to a data carrier for metal sticking and a wireless communication method.

  In recent years, a radio frequency identification (RFID) system has become widespread. An RFID system reads and writes (reads / writes) information by transmitting and receiving radio waves between a data carrier attached to a person or an article and the data carrier by electromagnetic induction to access an internal memory of the data carrier. A reader / writer and an electronic computer that controls the reader / writer are provided. The data carrier is called an RFID tag (non-contact IC tag), a non-contact IC card, or the like according to its shape, size, etc. (hereinafter collectively referred to as an IC tag).

  In the RFID system, a non-contact type IC tag attached to a person or an article is held over an information acquisition device such as a reader / writer that emits electromagnetic waves, and is stored in an IC chip built in the IC tag. Information can be obtained from the data. The RFID system can be used for information management of location of people and goods, product distribution, history of processing processes, etc. because it can identify people and goods, write additional information, etc. by information communication using electromagnetic waves. . Therefore, the RFID system can be used for, for example, commuter pass of various transportation facilities, management of people in / out of a company building, etc., inventory management of goods, logistics management, etc. ing.

  When an IC tag is attached to a conductive member such as metal, an eddy current is generated in the metal of the object behind by an alternating magnetic field generated by transmission / reception electromagnetic waves emitted from a reader / writer. In many cases, this eddy current generates a magnetic flux in a direction that cancels the transmission / reception magnetic flux, which attenuates the transmission / reception magnetic flux and makes communication difficult.

  Therefore, when a non-contact type IC tag is attached to a member made of a conductive material such as metal, the following has been proposed as a method for suppressing the transmission / reception magnetic flux from being attenuated and communication becoming difficult. (For example, refer to Patent Documents 1 and 2). For example, Patent Document 1 discloses a technique in which a soft magnetic magnetic sheet is disposed between a non-contact type IC tag and a conductive member. Further, Patent Document 2 discloses a technique for suppressing generation of eddy currents that occur when metal magnetic flux enters by sealing with magnetic resin and passing transmission / reception magnetic flux therethrough.

JP 2008-150556 A JP 2008-201896 A

  However, when attaching a non-contact type IC tag to a member made of a conductive material such as metal, the methods described in Patent Documents 1 and 2 require an expensive magnetic sheet separately, and the thickness of the IC tag Becomes thick and expensive. Furthermore, since a magnetic sheet must be laminated on an existing IC tag, the number of manufacturing steps increases or new equipment is required. For this reason, it is difficult to manufacture the IC tag while suppressing the thickness and manufacturing cost of the method described in Patent Documents 1 and 2. Moreover, since a magnetic sheet etc. are laminated | stacked via the adhesive layer etc. which become an additional structure, the part to discard increases.

  The present invention has been made in view of the above problems, and an object thereof is to provide a data carrier for metal sticking and a wireless communication method that can be manufactured thinly and inexpensively.

  In order to solve the above-mentioned problems and achieve the object, a data carrier for sticking metal according to the present invention is a data carrier for sticking metal attached to a metal as an adherend, and includes a base sheet, the base An electronic circuit provided on one surface of the material sheet and having a circuit line formed in a spiral shape; and a resin layer containing magnetic powder, wherein the resin layer is the one on the base sheet. The circuit line is located at a position overlapping at least one turn between the outermost periphery and the innermost periphery of the circuit line in a direction perpendicular to the one surface.

  In the present invention, the area of the resin layer is smaller than the area of the base sheet, and the outer edge of the pattern of the resin layer is located outside the outer peripheral edge of the circuit line. The circuit line is more than a range surrounded by a position that is 1.7 times the shortest distance between the outermost outer edge of the circuit line and the innermost inner edge from the outermost outer edge of the circuit line. Preferably it is on the side.

  Further, in the present invention, the outer edge of the pattern of the resin layer is located outside the outermost edge of the circuit line from the outermost edge of the circuit line, and from the outermost edge of the circuit line, the circuit line It is preferable to be on the circuit line side from a range surrounded by a position separated by a distance of 1.25 times the shortest distance width between the outermost outer edge and the innermost inner edge.

  In the present invention, the outer edge of the pattern of the resin layer is located on the outer side of the circuit line with respect to the outermost edge of the circuit line, and the shortest distance width from the outermost edge of the circuit line. It is preferable to be on the circuit line side with respect to a range surrounded by a position separated by a distance of 0.4 times.

  In the present invention, the outer edge of the pattern of the resin layer is located on the inner side of the outermost edge of the circuit line, and the outermost outer edge of the circuit line has a width of 0.2 that is the shortest distance. It is preferable to be on the outer edge side of the outermost periphery of the circuit line, rather than a range surrounded by a position that is twice as far away.

In the present invention, the area of the resin layer is smaller than the area of the base sheet,
It is preferable that the outer edge of the resin layer pattern overlaps with the outermost outer edge of the circuit line in a direction perpendicular to the one surface.

  In the present invention, the resin layer pattern is annular, and an inner edge of the resin layer pattern is located outside the circuit line with respect to an innermost inner edge of the circuit line, and It is preferable to be on the circuit line side from a range surrounded by a position separated by 1.4 times the shortest distance width from an inner edge of the innermost circumference of the route.

  In the present invention, the inner edge of the pattern of the resin layer is located outside the innermost edge of the circuit line and outside the innermost edge of the circuit line, and from the innermost edge of the innermost circumference of the circuit line to the shortest It is preferable to be on the circuit line side from a range surrounded by a position separated by a distance of 1.25 times the distance width.

  In the present invention, the inner edge of the pattern of the resin layer is located outside the innermost edge of the circuit line and outside the innermost edge of the circuit line, and from the innermost edge of the innermost circumference of the circuit line to the shortest It is preferable to be on the circuit line side from a range surrounded by a position separated by a distance 0.4 times the distance width.

  In the present invention, the inner edge of the pattern of the resin layer is located on the inner side of the circuit line with respect to the innermost edge of the circuit line, and the innermost edge of the circuit line extends from the innermost edge of the circuit line. It is preferable to be on the inner edge side of the innermost circumference of the circuit line, rather than a range surrounded by a position separated by 0.15 times the distance width.

  In the present invention, the resin layer pattern is annular, and the inner edge of the resin layer pattern overlaps the innermost edge of the circuit line in a direction perpendicular to the one surface. It is preferable.

  In the present invention, the magnetic permeability when the magnetic powder is measured on a chlorinated polyethylene resin by preparing a sheet having a volume concentration of 50%, the real part permeability μ ′ at a frequency of 1 MHz is 8 or more. Is preferred.

  Moreover, in this invention, it is preferable that the outer edge of the said resin layer is a shape along the outer edge of the outermost periphery of the said circuit wire.

  Moreover, in this invention, it is preferable that the said resin layer is either an acrylic adhesive or a urethane resin.

  In addition, a wireless communication method according to the present invention is characterized in that wireless communication is performed with the above-described metal pasting data carrier and reader / writer.

  According to the present invention, the resin layer having the magnetic powder is formed on the electronic circuit by patterning along the circuit line, whereby the resin layer is efficiently formed on the electronic circuit, and an expensive magnetic sheet is separately provided. It is not necessary, and can be manufactured with existing equipment at low cost without increasing the number of constituent materials and processes, so that it can be manufactured thinly and at low cost.

FIG. 1 is a plan view schematically showing a data carrier for sticking metal according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is a plan view showing a state in which an IC chip is mounted by arranging jumper wires in the electronic circuit. FIG. 4 is a plan view of an electronic circuit showing a state where a resin layer is formed. FIG. 5 is a plan view of an electronic circuit showing a state in which a resin layer is formed in the data carrier for sticking metal according to the second embodiment of the present invention. 6 is a cross-sectional view taken along line BB in FIG. FIG. 7 is a plan view of an electronic circuit showing an electronic circuit formation surface in a state in which a resin layer is formed in the data carrier for sticking metal according to the third embodiment of the present invention. FIG. 8 is a plan view of an electronic circuit showing a surface opposite to an electronic circuit forming surface in a state where a resin layer is formed in a data carrier for sticking metal according to a third embodiment of the present invention. 9 is a cross-sectional view taken along the line CC of FIG.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a mode for carrying out a metal carrier data carrier and a wireless communication method according to the present invention (hereinafter referred to as an embodiment) will be described in detail with reference to the drawings. In addition, this invention is not limited by the following embodiment. In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

(Embodiment 1)
<Data carrier for metal sticking>
FIG. 1 is a plan view schematically showing a data carrier for attaching metal according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view taken along the line AA of FIG. As shown in FIG. 1 and FIG. 2, a data carrier 10 for attaching metal includes a base sheet 11, a non-contact data carrier element (IC inlet) 12 formed on one surface thereof, and an IC inlet 12 thereof. And a covering resin layer 13. The metal sticking data carrier 10 is a metal sticking IC tag which is formed on a so-called adhesive label and is used by sticking to a metal which is an adherend to be managed.

  In the first embodiment, the distance that the resin layer 13 protrudes outside the outermost outer edge of the electronic circuit 21 is defined as the distance X from the outermost outer edge, and the innermost edge of the electronic circuit 21 is located on the inner side. The protruding distance is defined as a distance Y from the innermost inner periphery, and the shortest distance Z between the outermost outer periphery and the innermost inner edge of the circuit line 23 is defined as the shortest distance Z.

(Substrate sheet)
The base sheet 11 functions as a support that holds the IC inlet 12. The base material sheet 11 is not particularly limited as long as it has a function as a support capable of stably holding the IC inlet 12, and may be transparent or opaque. The base material sheet 11 is preferably paper such as fine paper, impregnated paper, glassine paper, coated paper, non-woven fabric, synthetic resin film or sheet. The resin material constituting the synthetic resin film or sheet is not particularly limited. For example, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyester such as polyethylene terephthalate and polyethylene naphthalate, polyvinyl acetate, polybutene, polyacrylic acid, Polymethacrylic acid, polyacrylic acid ester, polymethacrylic acid ester, polyvinyl alcohol, polyvinyl formal, polyvinyl butyral, polyacrylonitrile, polyimide, polycarbonate, polyamide, ethylene-vinyl acetate copolymer, ethylene-acrylic acid ester copolymer, polyvinyl Acetal, ethyl cellulose, cellulose triacetate, hydroxypropyl cellulose, acrylonitrile-butadiene-styrene copolymer, etc. Mention may be made of a variety of resin.

  The base sheet 11 may be uniaxially stretched or biaxially stretched. The base sheet 11 may be a single layer or a multilayer of two or more layers of the same type or different types. The base sheet 11 is preferably water resistant. If it is water resistant, it will not break even if it gets wet. The base sheet 11 is preferably concealed in order to make it difficult to visually recognize the electronic circuit. If the base sheet 11 is not concealable, a concealable sheet is pasted on the surface of the base sheet 11. It is preferable to combine them.

  Although the thickness of the base material sheet 11 is not specifically limited, What is necessary is just 3 micrometers-500 micrometers, Preferably they are 5 micrometers-200 micrometers, More preferably, they are 25 micrometers-125 micrometers. When the thickness of the base sheet 11 is less than 3 μm, the mechanical strength (tensile, tearing, rupture, etc.) as a support is insufficient, or the base sheet 11 is thin and has no stiffness. May be inferior in handling property. Moreover, when the thickness of the base material sheet 11 exceeds 500 μm, there is too much stiffness, which is not preferable from the viewpoints of handling properties and miniaturization and thinning of the data carrier 10 for attaching a metal.

  In order to increase the adhesive force between the base material sheet 11 and the resin layer 13 to be laminated, the surface of the base material sheet 11 may be surface-treated. Examples of the surface treatment method include corona discharge treatment, chemical treatment, and resin coating.

(IC inlet)
The IC inlet 12 includes an electronic circuit 21 and an IC chip 22. In the first embodiment, the IC inlet 12 includes the electronic circuit 21 and the IC chip 22, but in addition to these, other electronic components such as a battery, a capacitor, a resistor, an inductor, a diode, Sensors (temperature, humidity, magnetism, light, etc.) or connection lines can also be included.

(Electronic circuit)
As shown in FIG. 3, the electronic circuit 21 includes a circuit line 23, terminal portions 24 and 25 connected to the circuit line 23, and terminal portions arranged at intervals from the terminal portions 24 and 25. 26, 27, a lead wire 28 for connecting the terminal portions 26, 27, a jumper wire 29 for connecting the terminal portion 24 and the terminal portion 27, and an insulating layer 30 for insulating the circuit line 23 and the jumper wire 29. .

  The circuit line 23 is provided on one surface of the base sheet 11 and is formed in a spiral shape. In Embodiments 1, 2, and 3 described below, this is also referred to as a helical ring circuit line.

  The terminal part 24 and the terminal part 27 are connected by a jumper wire 29. The terminal portion 24 is connected to the innermost end of the circuit line 23 and is a jumper terminal portion for connecting one end of the jumper wire 29. The terminal portion 25 is connected to the outermost end of the circuit line 23 and is an IC chip mounting terminal portion for mounting one end of the IC chip 22. The terminal portion 26 is a terminal that forms an IC chip mounting terminal portion together with the terminal portion 25 and is not connected to the circuit line 23. The terminal portion 27 is a jumper terminal portion that is provided on the outermost side of the circuit line 23 and connects one end of the jumper wire 29.

  The circuit wire 23, the terminal portions 24, 25, 26, 27 and the lead wire 28 are made of a conductive material. Examples of the conductive material include metals such as metal wires, metal foils, vapor deposition films, and thin films formed by sputtering. As the metal, an alloy in which two or more kinds of metals such as gold, silver, nickel, copper, and aluminum are combined can be used. In addition, as other conductive materials, conductive paste or conductive ink in which metal particles such as gold, silver, nickel, and copper are dispersed in a binder or solvent can be used.

  The average particle diameter of the metal particles is preferably 0.001 μm to 15 μm, particularly preferably 0.001 μm to 10 μm. Examples of the binder include polyester resin, polyurethane resin, epoxy resin, phenol resin, and the like.

  Solvents include alcohols such as hexanol, heptanol, octanol and cyclohexanol, long-chain alkanes such as hexane, heptane, octane and trimethylpentane, cyclic alkanes such as cyclohexane and cycloheptane, and aromatics such as benzene, toluene, xylene and trimethylbenzene. Group hydrocarbons, acetone, water and the like can be exemplified. These solvents may be used alone, or two or more kinds may be selected and used as a mixed solvent.

  An insulating layer 30 is provided on the upper surface portion of the spiral annular circuit line 23 between the terminal portion 24 and the terminal portion 27. By providing the jumper wire 29 on the surface of the insulating layer 30, the terminal portion 24 and the terminal portion 27 can be connected by the jumper wire 29 without contacting the spiral annular circuit wire 23.

  As a conductive material for forming the jumper wire 29, a conductive paste such as a silver paste or a conductive ink can be used. A method of forming the jumper wire 29 is to form an insulating layer 30 by printing an insulating ink in a band shape by screen printing or the like on the upper surface portion of the spiral annular circuit wire 23 between the terminal portion 24 and the terminal portion 27 and drying it. Thereafter, a conductive paste is printed on the insulating layer 30 in a line shape by screen printing or the like, dried to form a jumper wire 29, and the terminal portion 24 and the terminal portion 27 are connected to each other. . As the conductive paste, the conductive paste exemplified as the conductive material can be used. Examples of the insulating ink include energy ray curable ink such as ultraviolet curable ink mainly composed of acrylic resin or urethane resin.

  The jumper wire 29 is not particularly limited as long as the terminal portions 24 and 27 can be electrically connected to each other. For example, a rectangular linear shape as shown in FIG. 1 or a shape obtained by bending the rectangle at a right angle may be used. Further, the thickness of the jumper wire 29 is preferably 1 μm to 100 μm, particularly preferably 3 μm to 50 μm. When the thickness of the jumper wire 29 is less than 1 μm, the coating film strength is insufficient, cracking may occur, and conduction may be cut off. Moreover, when the thickness of the jumper wire 29 exceeds 100 μm, it takes a long time in the film-forming drying process, and it is not preferable from the viewpoint of thinning.

  As the insulating layer 30, an insulating resin such as an acrylic resin, a urethane resin, or an acrylic urethane resin can be used. The insulating layer 30 can be formed by a screen printing method so as to cover the upper surface of the circuit line 23 between the terminal portion 24 and the terminal portion 27. The insulating layer 30 only needs to have a thickness that allows the circuit line 23 and the upper surface of the insulating layer 30 to be electrically insulated, and is not particularly limited, but is preferably 1 μm to 100 μm, and particularly preferably 3 μm to 50 μm. When the thickness of the insulating layer 30 is less than 1 μm, cissing may occur when an insulating resin is applied to form a film, which may cause a portion that cannot be insulated. On the other hand, when the thickness of the insulating layer 30 exceeds 100 μm, a long time is required in the drying / curing process of film formation, and it is not preferable from the viewpoint of thinning.

  As a method for forming the circuit wire 23, the terminal portions 24, 25, 26, 27, the lead wire 28, and the like on the base sheet 11, various methods for producing an ordinary electronic circuit are used. As various methods for manufacturing an ordinary electronic circuit, for example, a method of manufacturing by a screen printing method using a conductive paste or a conductive ink, a metal foil is bonded to the base sheet 11 with an adhesive, and a screen printing method is used. After a resist pattern having a shape such as the circuit wire 23, the terminal portions 24, 25, 26, 27 and the lead wire 28 is printed by the above, the metal foil is etched to process the circuit wire 23, the terminal portions 24, 25, 26, 27. In addition, a method of forming the circuit wire 23, the terminal portions 24, 25, 26, 27, and the lead wire 28 by removing the metal foil in portions other than the lead wire 28 and washing the resist may be used. The etching process can be performed by a process similar to a normal etching process. Further, the circuit line 23, the terminal portions 24, 25, 26, 27, the lead wires 28, and the like are formed on the surface of the base sheet 11 by using a conductive paste or conductive ink, a gravure method, a flexo method, an ink jet method, or the like It can also be carried out by adhering to the shape of the circuit wire 23, the terminal portions 24, 25, 26, 27, the lead wire 28 and the like by means of printing, coating, etc.

  As a manufacturing method using a resist such as the circuit wire 23 and the terminal portions 24, 25, 26, 27, and the lead wire 28, specifically, on the copper foil surface of a laminate film obtained by bonding a copper foil and a polyethylene terephthalate film. Then, after printing a resist pattern for forming a helical ring circuit line, etc., the copper foil part is etched to remove unnecessary copper foil part, and the circuit line 23 and terminal parts 24, 25, 26, 27, lead wire The method of forming 28 etc. is mentioned.

  The thickness of the conductive material forming the circuit line 23 and the terminal portions 24, 25, 26, 27, the lead wire 28, etc. is preferably 1 μm to 100 μm, and particularly preferably 3 μm to 50 μm. When the thickness of the conductive material is less than 1 μm, the mechanical strength may be insufficient or the handling properties in the manufacturing process may be inferior. On the other hand, when the thickness of the conductive material exceeds 100 μm, it is stiff and unfavorable in handling properties, and is not preferable from the viewpoint of weight reduction and thinning.

  The terminal portion 25 and the terminal portion 26 are connected by the IC chip 22. Examples of the method of connecting the IC chip 22 include a method of connecting the surface of the terminal portion 25 and the terminal portion 26 by a flip chip bonding method through an anisotropic conductive film or an anisotropic conductive paste. In the flip chip bonding method, stud bumps are provided on the electrode portions of the IC chip 22, and the IC chip 22 is formed on the anisotropic conductive film or anisotropic conductive paste coated on the surfaces of the terminal portions 25 and 26. In this method, the surface with the stud bumps is pressed, the stud bumps enter into the anisotropic conductive film or anisotropic conductive paste, and the terminal portion 25 and the terminal portion 26 are electrically connected to the IC chip 22. Thus, by connecting the IC chip 22 to the terminal portion 25 and the terminal portion 26, the IC chip 22 is connected to the electronic circuit 21, and the IC inlet 12 is created.

  In addition, the terminal part 24 and the terminal part 27 do not connect the top of the spiral annular circuit line 23 with the jumper wire 29, and lead the terminal part 24 and the terminal part 27 to the back surface of the base material sheet 11 through a through hole. The route 23 may be connected.

  Examples of the shape of the electronic circuit include those shown in FIG. In FIG. 3, a circuit line 23 made of a single conductive material is arranged in a quadruple spiral ring from the outer periphery to the inside of the rectangular base sheet 11 at predetermined intervals, and functions as an antenna. A circuit is formed. The electronic circuit may be arranged in a quadruple helical ring as shown in FIG. 3, but may be a single to triple helical ring, or may be a five or more helical ring. Further, the shape of the electronic circuit may not be a rectangular spiral ring as shown in FIG. 3. For example, the spiral shape of a polygonal spiral ring other than a rectangle, a circular spiral ring, an elliptical shape, an indefinite shape, or the like may be used. Any shape may be sufficient.

  In the first embodiment, the IC chip 22 is provided outside the spiral circuit line 23 of the electronic circuit, but may be provided inside the electronic circuit of the spiral circuit line 23. You may provide in the middle of the electronic circuit of the helical circuit line 23. FIG. When the IC chip 22 is provided inside the spiral ring of the electronic circuit, the terminal portion 24 may be provided outside, and the terminal portion 25 and the terminal portion 26 may be provided inside.

  In the above description, an example in which a pair of counter electrodes are formed has been described. However, the present invention is not limited to this, and a large number of counter electrodes are formed and these electrodes are connected to each part of the planar coil circuit unit. The inductance of the coil may be arbitrarily selected, or the jumper wire 29 may be formed on the opposite surface of the base sheet 11 through the through hole formed in the base sheet 11. Electronic circuits may be formed on both sides of the base sheet 11.

(Resin layer)
The resin layer 13 is provided on the electronic circuit formation surface on the base material sheet 11, covers the base material sheet 11 and the IC inlet 12 formed on one surface of the base material sheet 11, and includes magnetic powder. . The resin layer 13 is provided at least between the outermost periphery and the innermost periphery of the circuit line 23 on the base sheet 11.

  As the resin layer 13, the insulating resin or the adhesive exemplified in the insulating layer 30 can be used. When using an adhesive for the resin layer 13, it is formed using an organic solvent-soluble adhesive, an organic solvent-dispersed adhesive, a water-dispersed adhesive, a water-soluble adhesive, or the like. Examples of the adhesive used for the resin layer 13 include a natural rubber-based adhesive, a synthetic rubber-based adhesive, an acrylic resin-based adhesive, a polyester resin-based adhesive, a polyvinyl ether resin-based adhesive, a urethane resin-based adhesive, Examples include silicone resin-based pressure-sensitive adhesives. Specific examples of the synthetic rubber pressure-sensitive adhesive include styrene-butadiene rubber, polyisobutylene rubber, isobutylene-isoprene rubber, isoprene rubber, styrene-isoprene block copolymer, styrene-butadiene block copolymer, styrene-ethylene-butylene block. Examples thereof include copolymers and ethylene-vinyl acetate thermoplastic elastomers. Specific examples of the acrylic resin-based adhesive include acrylic acid, methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, acrylonitrile Homopolymers or copolymers such as The polyester resin-based adhesive is a copolymer of a polyhydric alcohol and a polybasic acid. Examples of the polyhydric alcohol include ethylene glycol, propylene glycol, and butanediol. Polybasic acids include terephthalic acid and adipic acid. And maleic acid. Specific examples of the polyvinyl ether resin pressure-sensitive adhesive include polyvinyl ether and polyvinyl isobutyl ether. Specific examples of the silicone resin-based pressure-sensitive adhesive include dimethylpolysiloxane. These pressure-sensitive adhesives can be used alone or in combination of two or more.

  Moreover, the resin layer 13 can be blended with a colorant such as a tackifier, a softener, an anti-aging agent, a flame retardant, a filler, a dye or a pigment, if necessary. Examples of the tackifier include rosin resin, terpene phenol resin, terpene resin, aromatic hydrocarbon-modified terpene resin, petroleum resin, coumarone / indene resin, styrene resin, phenol resin, xylene resin and the like. Examples of the softener include process oil, liquid rubber, and plasticizer. Examples of the flame retardant include halogen-based, phosphorus-based, hydrated metal-based, nitrogen-based and the like. Examples of the filler include silica, talc, clay, calcium carbonate and the like.

  The thickness of the resin layer 13 is not particularly limited, but may be usually 1 μm to 250 μm, and preferably 3 μm to 150 μm. When the thickness of the resin layer 13 is less than 1 μm, repelling may occur when the resin is applied to form a film. On the other hand, when the thickness of the resin layer 13 exceeds 250 μm, it takes a long time to apply and dry the resin, or the resin protrudes from the end face, which is not preferable from the viewpoint of thinning.

  The resin layer 13 in Embodiment 1 includes a double-sided tape type in which an adhesive is laminated on both sides of a sheet-like intermediate substrate. As an intermediate base material, it can select from what was mentioned as the base material sheet 11, and as an adhesive laminated | stacked on both sides of an intermediate base material, the adhesive illustrated above can be used.

  Moreover, the resin layer 13 contains magnetic powder. The magnetic powder contained in the resin layer 13 is preferably 20 wt% or more and 95 wt% or less, and particularly preferably 30 wt% or more and 90 wt% or less in terms of solid content with respect to the resin layer 13. If the magnetic powder has a solid content with respect to the resin layer 13 and exceeds 95 wt%, the magnetic powder may be too much to be formed on the resin layer 13. If the magnetic powder has a solid content with respect to the resin layer 13 and is less than 20 wt%, the magnetic powder contained in the resin layer 13 is too small to obtain the required permeability, and the data carrier 10 cannot communicate. There is sex.

  The magnetic permeability of the magnetic powder is, for example, the magnetic permeability when the magnetic powder is measured by making a 50% volume concentration sheet of chlorinated polyethylene resin, and the real part permeability μ ′ at a frequency of 1 MHz is 8 The above is preferable. The real part permeability μ ′ in the present specification was measured with an impedance / material analyzer (product number E4991A) manufactured by Agilent Technologies, using a sheet in which various magnetic powders were blended with chlorinated polyethylene resin in a volume concentration of 50%. The value. The real part permeability μ ′ is preferably 8 or more, more preferably 30 or more, and particularly preferably 40 or more. If the real part permeability μ ′ is less than 8, communication may not be possible when it is attached to a metal.

  Examples of magnetic powders include sendust and ferrite. Fe-Ni-Cr-Si alloys, Fe-Ni alloys, Fe-Si alloys, Fe-Co alloys, Fe-Al alloys, etc. Among them, an Fe—Al-based alloy is preferable. Examples of the Fe—Al alloy include an Fe—Al alloy, an Fe—Al—Cr alloy, and an Fe—Al—Si alloy. Magnetic powders may be used alone or in combination of two or more. The coercive force of the magnetic powder used in Embodiment 1 is preferably 600 A / m or less, and more preferably 400 A / m or less. If it exceeds 600 A / m, the communication performance may not be exhibited when it is attached to a metal. The coercive force is a value measured using an automatic measurement coercivity meter (trade name “K-HC1000”, manufactured by Tohoku Special Steel Co., Ltd.).

  The average particle size of the magnetic powder is preferably 0.1 μm to 200 μm, more preferably 1 μm to 100 μm. If the average particle diameter of the magnetic powder is within the above range, the magnetic powder can be included in the resin layer 13 in a state having high dispersibility. The average particle diameter of the magnetic powder is a value measured with a laser measuring machine (trade name: “HELOS”) manufactured by Sympatec.

  It is preferable that magnetic powders having different particle sizes are used in combination. Thereby, the gap between large magnetic powders can be filled with small magnetic powders. For example, it is preferable to use those having a plurality of particle sizes such as three types of 5 μm to 15 μm, 20 μm to 30 μm, and 50 μm to 100 μm.

  The shape of the magnetic powder is not particularly limited, and examples thereof include a spherical shape, a cubic shape, a flat shape, a cylindrical shape, a conical shape, and a needle shape. Among them, from the viewpoint of obtaining the necessary real part permeability μ ′ with a high real part permeability in a small amount, the shape of the magnetic powder is preferably a flat shape, a cylindrical shape, a conical shape, and a needle shape, and among them, a high aspect ratio ( (Length / thickness) is more preferable.

  As a method of forming the resin layer 13 on the surface of the base sheet 11 on which the electronic circuit 21 is provided, for example, the base sheet 11, the IC chip 22, the circuit wire 23, the terminal portion 24 and the terminal portion 27, and a jumper wire 29 so that the entire surface of the circuit line 23 is covered not only between the terminal portions 24 and 27 but also when the insulating layer 30 under the jumper wire 29 is formed. (See FIG. 4), there is a method of applying an insulating resin containing magnetic powder together. In addition, after applying an adhesive containing magnetic powder to the release agent layer surface of the release sheet to form the resin layer 13, the base sheet 11, the circuit wire 23, the terminal portion 24 and the terminal portion 27, the IC chip 22, and the jumper There is a method in which the resin layer 13 is formed by being bonded to the surface so as to cover the line 29 or the like. The resin layer 13 may be laminated on the opposite surface of the base material sheet 11 on which the electronic circuit 21 is provided. In this case, in order to protect the electronic circuit 21, it is preferable that a protective sheet described later is provided so as to cover the electronic circuit 21.

  The method for forming the resin of the resin layer 13 is not particularly limited, and as a printing method, an existing printing method such as a screen method, a gravure method, a flexo method, or an ink jet method can be used. For example, an air knife coater, a blade coater, a bar coater, a gravure coater, a roll coater, a curtain coater, a die coater, a knife coater, a screen coater, a Meyer bar coater, a kiss coater, or the like can be used.

  As described above, the resin layer 13 is provided so as to overlap at least one turn of the circuit line 23 between the outermost periphery and the innermost periphery of the circuit line 23 on the base sheet 11. The resin layer 13 is provided on the surface of the substrate sheet 11 on the circuit line 23 side. And the resin layer 13 exists in the position which overlaps at least 1 turn between the outermost periphery and the innermost periphery of the circuit wire 23 in the direction perpendicular | vertical with respect to one surface of the base material sheet 11. FIG. The outer edge 13OUT of the resin layer 13 preferably has a shape along the outermost outer edge of the circuit line 23. For this reason, the resin layer 13 is formed by patterning on the base material sheet 11 along the circuit lines 23, jumper wires 29, and the like, and the resin layer 13 is efficiently formed on the base material sheet 11. Moreover, since the resin layer 13 contains magnetic powder, it is not necessary to attach an expensive magnetic sheet or the like separately. Therefore, it is possible to reduce the material discarded when the resin layer 13 is formed. Therefore, since the data carrier 10 for attaching a metal is provided with the resin layer 13 on the base material sheet 11, it is not necessary to laminate a magnetic sheet or the like via an adhesive layer or the like which is an additional structure as in the past. It can be manufactured with existing equipment at low cost without requiring a magnetic sheet and without increasing the number of constituent materials and processes.

  Further, the resin layer 13 is provided so as to protrude from one or both of the outer side of the outermost outer periphery of the circuit line 23 on the base sheet 11 and the inner side of the innermost edge of the circuit line 23. It is preferable. FIG. 4 is a plan view of the electronic circuit 21 showing a state in which the resin layer 13 is formed. In FIG. 4, the portions where the resin layer 13 is formed are indicated by hatching. As shown in FIG. 4, in addition to the base material sheet 11, the resin layer 13 is provided so as to protrude from both the outermost outer edge of the circuit line 23 and the innermost inner edge. It has been. When the shortest distance Z between the outermost outer edge and the innermost inner edge of the circuit line 23 is the shortest distance Z, the resin layer 13 protrudes outside the electronic circuit 21 by the distance X from the outermost outer edge, The inside of the electronic circuit 21 protrudes by the distance Y from the innermost inner periphery. For this reason, the width W that is the shortest distance between the outer edge 13OUT and the inner edge 13IN of the resin layer 13 is equal to or greater than the shortest distance Z.

  In the first embodiment, the “shortest distance between the outermost outer edge and the innermost inner edge” serving as a reference for the distance from which the resin layer 13 protrudes is the outermost outer periphery formed in a spiral shape as described above. This is the shortest distance Z of the distances between an arbitrary point on the outer edge of the circuit line 23 and the inner edge of the innermost circuit line 23.

  When the resin layer 13 protrudes outside the electronic circuit 21, the distance X from the outermost outer edge of the circuit line 23 to the outer edge 13OUT of the resin layer 13 with respect to the shortest distance Z is relative to the reference shortest distance Z. The percentage occupied can be calculated as (X / Z) × 100%. The percentage of the distance X with respect to the reference shortest distance Z is preferably 0% or more, more preferably 10% or more, further preferably 15% or more, and particularly preferably 20% or more. When the distance X is positive, the resin layer 13 protrudes from the outermost peripheral edge of the circuit line 23 by the distance X.

  Since the area of the resin layer 13 is smaller than the area of the base sheet 11, the outer edge 13 OUT of the pattern of the resin layer 13 is a position outside the circuit line 23 than the outermost outer edge of the circuit line 23, It is more preferable for the stability of communication with the reader / writer to be inside the range surrounded by a position separated by 1.7 times the shortest distance Z from the outermost edge of the circuit line 23. In addition, the outer edge 13OUT of the pattern of the resin layer 13 is located outside the outermost edge of the circuit line 23 on the outer side of the circuit line 23, and is 1.25 of the shortest distance Z from the outermost edge of the circuit line 23. It may be inside the range surrounded by the position separated by a double distance. Further, the outer edge 13OUT of the pattern of the resin layer 13 is located outside the outermost edge of the circuit line 23 and outside the circuit line 23, and is 0.4, the shortest distance Z from the outermost edge of the circuit line 23. It may be inside the range surrounded by the position separated by a double distance. Then, the outer edge 13OUT of the pattern of the resin layer 13 may be at a position overlapping the outermost outer edge of the circuit line 23 in a direction perpendicular to one surface of the base sheet 11. Further, the outer edge 13OUT of the pattern of the resin layer 13 is located on the inner side of the circuit line 23 with respect to the outermost edge of the circuit line 23, and is 0.2 at the shortest distance Z from the outermost edge of the circuit line 23. It may be outside the range surrounded by the position separated by a double distance.

  When the resin layer 13 protrudes to the inside of the electronic circuit 21, the distance Y from the innermost inner periphery of the circuit line 23 to the inner edge 13IN of the resin layer 13 with respect to the shortest distance Z is relative to the reference shortest distance Z. Can be calculated by (Y / Z) × 100%. The percentage of the distance Y with respect to the reference shortest distance Z is preferably 0% or more, more preferably 10% or more, still more preferably 15% or more, and particularly preferably 20% or more. When the distance Y is positive, the resin layer 13 protrudes from the outermost edge of the circuit line 23 by the distance Y from the outermost edge.

  The pattern of the resin layer 13 is annular, and the inner edge 13IN of the pattern of the resin layer 13 is located on the outer side of the circuit line 23 relative to the innermost edge of the circuit line 23, and the innermost periphery of the circuit line 23 It is more preferable for the stability of communication with the reader / writer to be on the circuit line 23 side than the range surrounded by the position that is 1.4 times the shortest distance Z from the inner edge. Further, the inner edge 13IN of the pattern of the resin layer 13 is located outside the innermost edge of the circuit line 23 from the innermost edge of the circuit line 23, and is 1 at the shortest distance Z from the innermost edge of the circuit line 23. It may be closer to the circuit line 23 than the range surrounded by a position 25 times away. The inner edge 13IN of the pattern of the resin layer 13 is located on the outer side of the innermost edge of the circuit line 23 from the innermost edge of the circuit line 23, and is 0.4 of the shortest distance Z from the innermost edge of the innermost periphery of the circuit line 23. It may be on the inner side of the circuit line 23 side than the range surrounded by the position separated by a double distance. Further, the inner edge 13IN of the pattern of the resin layer 13 may be at a position overlapping the innermost inner edge of the circuit line 23 in a direction perpendicular to one surface of the base sheet 11.

  The resin layer 13 is formed on the base sheet 11 so as to protrude from the outside of the outermost outer edge of the circuit wire 23 and the inner side of the innermost inner edge of the circuit line 23 within the above range. Then, the resin layer 13 can be efficiently formed on the electronic circuit 21 by forming the pattern along the circuit line 23. Moreover, since the resin layer 13 contains magnetic powder, it is not necessary to attach an expensive magnetic sheet or the like separately, so that the material to be discarded can be reduced. Therefore, it is not necessary to laminate a magnetic sheet or the like via an adhesive layer or the like that is an additional structure as in the prior art, so a magnetic sheet is not necessary, and it is inexpensive without increasing the number of constituent materials and processes. It can be manufactured with existing equipment.

(Peeling material)
The release material 31 is stuck to the upper surface of the resin layer 13 so as to be peeled off. As the peeling material 31, the thing similar to the base material sheet 11 can be used, For example, papers, such as a quality paper, an impregnation paper, a glassine paper, a coated paper, a nonwoven fabric, a synthetic resin film, or a sheet | seat etc. are mentioned. A material obtained by subjecting the bonding surface of the release material 31 with the resin layer 13 to a resin layer 13 as a base material, if necessary, can be used. In this case, examples of the release treatment include a method of applying a release agent made of a silicone resin, a long chain alkyl resin, a fluorine resin, a butadiene resin, an isoprene resin, and the like to form a release agent layer.

  The thickness of the release agent layer is not particularly limited, and is preferably 0.01 μm to 5 μm, more preferably 0.1 μm to 3 μm. When the thickness of the release agent layer is less than 0.01 μm, the release performance may be insufficient or it may be difficult to obtain a uniform coating film. Moreover, when the thickness of the release agent layer exceeds 5 μm, it takes a long time in the drying process of the film formation, or the coating film has viscoelasticity and the release performance is lost, and conversely, it has adhesiveness. There is a case.

  As a method for applying the release agent, for example, an air knife coater, blade coater, bar coater, gravure coater, roll coater, curtain coater, die coater, knife coater, screen coater, Meyer bar coater, kiss coater, etc. are dried. A method is mentioned.

  The release material 31 is laminated by bonding the release material 31 to the surface of the resin layer 13. In addition, you may provide another resin layer in the surface of the base material sheet 11 in which the peeling material 31 is not laminated | stacked. As this resin layer, the same resin layer as that described above can be used. Further, the release material 31 may be laminated on the surface of the resin layer.

  Further, a protective sheet may be provided on the opposite surface of the base material sheet 11 on which the resin layer 13 is laminated. The protective sheet should just protect the surface of IC inlet, and the same thing as the base material sheet 11 is mentioned. Specifically, for example, polyethylene resins, polypropylene resins, polyolefin resins such as polymethyl-1-pentene / ethylene / cycloolefin copolymer, ethylene-vinyl acetate copolymer, polyethylene terephthalate, polyethylene naphthalate, poly Examples thereof include sheets made of various resins such as polyester resins such as butylene terephthalate, and various paper materials such as polyethylene laminated paper, polypropylene laminated paper, clay coated paper, resin coated paper, glassine paper, and fine paper.

  The thickness of the protective sheet is not particularly limited, but is preferably 100 μm or less.

(Embodiment 2)
FIG. 5 is a plan view of an electronic circuit showing a state in which a resin layer is formed in the data carrier for sticking metal according to the second embodiment of the present invention. 6 is a cross-sectional view taken along line BB in FIG. Note that the same components as those described in the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.

  As shown in FIG. 5, the resin layer 13 of the data carrier 10A for attaching a metal according to the second embodiment has a part of the circuit line 23 between the outermost periphery and the innermost periphery of the circuit line 23 on the base sheet 11. At least provided to be covered. The resin layer 13 is provided on the surface of the substrate sheet 11 on the circuit line 23 side. And the resin layer 13 exists in the position which overlaps at least 1 turn between the outermost periphery of the circuit wire 23 in the direction perpendicular | vertical to the surface at the side of the circuit line 23 of the base material sheet 11, and in FIG. The case where the resin layer 13 is in a position overlapping two turns between the outermost periphery and the innermost periphery of the circuit line 23 is shown. For example, the resin layer 13 does not cover the outermost circuit line 23 and the innermost circuit line 23 but covers the circuit line sandwiched between the outermost circuit line 23 and the innermost circuit line 23. It is patterned in a ring. The outer edge 13OUT of the resin layer 13 preferably has a shape along the outermost outer edge of the circuit line 23. For this reason, the resin layer 13 is formed by patterning on the base material sheet 11 along the circuit lines 23, jumper wires 29, and the like, and the resin layer 13 is efficiently formed on the base material sheet 11. Moreover, since the resin layer 13 contains magnetic powder, it is not necessary to attach an expensive magnetic sheet or the like separately. Therefore, the metal carrier for data sticking 10A can reduce the material to be discarded that occurs when the resin layer 13 is formed. Therefore, since the data carrier 10 for attaching a metal is provided with the resin layer 13 on the base material sheet 11, it is not necessary to laminate a magnetic sheet or the like via an adhesive layer or the like which is an additional structure as in the past. It can be manufactured with existing equipment at low cost without requiring a magnetic sheet and without increasing the number of constituent materials and processes.

  The resin layer 13 has an outer edge 13OUT of the resin layer 13 on the inner side of the circuit line 23 with respect to an outermost outer edge of the circuit line 23 on the base sheet 11. In addition, the resin layer 13 is preferably provided with the inner edge 13IN of the resin layer 13 inside the circuit line 23 rather than the innermost inner edge of the circuit line 23. As shown in FIG. 5, the resin layer 13 has the shortest distance between the outer edge 13OUT and the inner edge 13IN of the resin layer 13, where the shortest distance Z is the shortest distance between the outermost outer edge of the circuit line 23 and the innermost inner edge. The width W, which is the distance, is smaller than the shortest distance Z. For this reason, the outer edge 13OUT of the resin layer 13 is located away from the outermost outer edge of the circuit line 23 by the distance −X. Thus, when the distance X is negative, the circuit line 23 is exposed by the distance X from the outermost edge of the circuit line 23 to the innermost side. Further, the inner edge 13IN of the resin layer 13 is at a position separated from the innermost inner edge of the circuit line 23 by a distance −Y. As described above, when the distance Y is negative, the circuit line 23 is exposed from the outermost edge of the circuit line 23 to the outermost side by the distance Y.

  The resin layer 13 is based on the shortest distance Z, and the percentage of the distance −X from the outermost outer edge of the circuit line 23 to the outer edge 13OUT of the resin layer 13 with respect to the reference shortest distance Z is (−X / Z) × 100%. The percentage that the distance -X occupies with respect to the reference shortest distance Z is preferably -15% or more and 0% or less. And since the area of the resin layer 13 is smaller than the area of the base material sheet 11, the outer edge 13OUT of the pattern of the resin layer 13 is a position inside the circuit line 23 from the outermost outer edge of the circuit line 23. Thus, the communication with the reader / writer is located on the outer edge side of the outermost periphery of the circuit line 23 rather than the range surrounded by the position 0.2 times the shortest distance Z from the outer edge of the outermost periphery of the circuit line 23. It is more preferable for stability.

  The resin layer 13 is based on the shortest distance Z, and the percentage of the distance −Y from the innermost inner edge of the circuit line 23 to the inner edge 13IN of the resin layer 13 with respect to the reference shortest distance Z is (−Y / Z) × 100%. The percentage of the distance −Y with respect to the reference shortest distance Z is preferably −15% or more and 0% or less. The inner edge 13IN of the pattern of the resin layer 13 is located on the inner side of the circuit line with respect to the innermost inner edge of the circuit line, and has a shortest distance Z from the innermost inner edge of the circuit line 23. It is more preferable for the stability of communication with the reader / writer to be on the inner edge side of the innermost circumference of the circuit line 23 than the range surrounded by the position separated by a distance of 0.15 times.

  The resin layer 13 is formed on the base sheet 11 within the above range, and is patterned on the electronic circuit 21 along the circuit line 23, so that the resin layer 13 is efficiently formed on the electronic circuit 21. can do. Moreover, since the resin layer 13 contains magnetic powder, it is not necessary to attach an expensive magnetic sheet or the like separately, so that the material to be discarded can be reduced. Therefore, it is not necessary to laminate a magnetic sheet or the like via an adhesive layer or the like that is an additional structure as in the prior art, so a magnetic sheet is not necessary, and it is inexpensive without increasing the number of constituent materials and processes. It can be manufactured with existing equipment.

(Embodiment 3)
FIG. 7 is a plan view of an electronic circuit showing an electronic circuit formation surface in a state in which a resin layer is formed in the data carrier for sticking metal according to the third embodiment of the present invention. FIG. 8 is a plan view of an electronic circuit showing a surface opposite to an electronic circuit forming surface in a state where a resin layer is formed in a data carrier for sticking metal according to a third embodiment of the present invention. 9 is a cross-sectional view taken along the line CC of FIG. Note that the same components as those described in the above-described embodiment are denoted by the same reference numerals, and redundant description is omitted.

  In the first and second embodiments, the resin layer 13 is provided on the electronic circuit formation surface on the base sheet 11. In the data carrier 10B for attaching metal according to the third embodiment, the resin layer 13 is provided on the surface (opposite surface) opposite to the electronic circuit forming surface on the base sheet 11.

  As shown in FIG. 7, the resin layer 13 is not covered with the circuit line 23 on the base sheet 11. And as shown in FIG. 8, the resin layer 13 is provided in the surface (other surface) on the opposite side of the electronic circuit formation surface on the base material sheet 11. As shown in FIG. The resin layer 13 is in a position where at least one turn of the circuit line 23 overlaps between the outermost periphery and the innermost periphery of the circuit line 23 in a direction perpendicular to one surface of the base sheet 11. The outer edge 13OUT of the resin layer 13 preferably has a shape along the outermost outer edge of the circuit line 23. The resin layer 13 is formed by patterning on the surface (the other surface) opposite to the electronic circuit formation surface on the base sheet 11 so as to follow the circuit line 23, the jumper line 29, and the like. It is efficiently formed on the material sheet 11. Moreover, since the resin layer 13 contains magnetic powder, it is not necessary to attach an expensive magnetic sheet or the like separately. Therefore, it is possible to reduce the material discarded when the resin layer 13 is formed. Therefore, since the data carrier 10B for metal sticking includes the resin layer 13 on the base sheet 11, it is not necessary to laminate a magnetic sheet or the like via an adhesive layer or the like that is an additional configuration as in the past. It can be manufactured with existing equipment at low cost without requiring a magnetic sheet and without increasing the number of constituent materials and processes.

  As shown in FIG. 9, when the resin layer 13 protrudes outside the electronic circuit 21 in a direction perpendicular to one surface of the base sheet 11, the outermost periphery of the circuit line 23 with the shortest distance Z as a reference. The percentage of the distance X from the outer edge to the outer edge 13OUT of the resin layer 13 with respect to the reference shortest distance Z can be calculated as (X / Z) × 100%. The percentage of the distance X with respect to the reference shortest distance Z is preferably 0% or more, more preferably 10% or more, further preferably 15% or more, and particularly preferably 20% or more. When the distance X is positive, the resin layer 13 protrudes from the outermost peripheral edge of the circuit line 23 by the distance X.

  Since the area of the resin layer 13 is smaller than the area of the base sheet 11, the outer edge 13 OUT of the pattern of the resin layer 13 is a position outside the circuit line 23 than the outermost outer edge of the circuit line 23, It is more preferable for the stability of communication with the reader / writer to be inside the range surrounded by a position separated by 1.7 times the shortest distance Z from the outermost edge of the circuit line 23. In addition, the outer edge 13OUT of the pattern of the resin layer 13 is located outside the outermost edge of the circuit line 23 on the outer side of the circuit line 23, and is 1.25 of the shortest distance Z from the outermost edge of the circuit line 23. It may be inside the range surrounded by the position separated by a double distance. Further, the outer edge 13OUT of the pattern of the resin layer 13 is located outside the outermost edge of the circuit line 23 and outside the circuit line 23, and is 0.4, the shortest distance Z from the outermost edge of the circuit line 23. It may be inside the range surrounded by the position separated by a double distance. Then, the outer edge 13OUT of the pattern of the resin layer 13 may be at a position overlapping the outermost outer edge of the circuit line 23 in a direction perpendicular to one surface of the base sheet 11.

  When the resin layer 13 protrudes inside the electronic circuit 21 when viewed in a direction perpendicular to one surface of the base sheet 11, the resin layer 13 starts from the innermost edge of the circuit line 23 with the shortest distance Z as a reference. The percentage of the distance Y to the inner edge 13IN of the 13 with respect to the reference shortest distance Z can be calculated as (Y / Z) × 100%. The percentage of the distance Y with respect to the reference shortest distance Z is preferably 0% or more, more preferably 10% or more, still more preferably 15% or more, and particularly preferably 20% or more. When the distance Y is positive, the resin layer 13 protrudes from the outermost edge of the circuit line 23 by the distance Y from the outermost edge.

  The pattern of the resin layer 13 is annular, and the inner edge 13IN of the pattern of the resin layer 13 is located on the outer side of the circuit line 23 relative to the innermost edge of the circuit line 23, and the innermost periphery of the circuit line 23 It is more preferable for the stability of communication with the reader / writer to be on the circuit line 23 side than the range surrounded by the position that is 1.4 times the shortest distance Z from the inner edge. Further, the inner edge 13IN of the pattern of the resin layer 13 is located outside the innermost edge of the circuit line 23 from the innermost edge of the circuit line 23, and is 1 at the shortest distance Z from the innermost edge of the circuit line 23. It may be closer to the circuit line 23 than the range surrounded by a position 25 times away. The inner edge 13IN of the pattern of the resin layer 13 is located on the outer side of the innermost edge of the circuit line 23 from the innermost edge of the circuit line 23, and is 0.4 of the shortest distance Z from the innermost edge of the innermost periphery of the circuit line 23. It may be on the inner side of the circuit line 23 side than the range surrounded by the position separated by a double distance. Further, the inner edge 13IN of the pattern of the resin layer 13 may be at a position overlapping the innermost inner edge of the circuit line 23 in a direction perpendicular to one surface of the base sheet 11.

  Moreover, the outer edge 13OUT of the resin layer 13 may be inside the circuit line 23 rather than the outermost outer periphery of the circuit line 23 on the base material sheet 11 in the resin layer 13. In addition, the resin layer 13 may have the inner edge 13IN of the resin layer 13 provided inside the circuit line 23 relative to the innermost inner edge of the circuit line 23. In this case, the resin layer 13 shown in FIG. 9 has the shortest distance between the outer edge 13OUT and the inner edge 13IN of the resin layer 13 when the shortest distance Z between the outermost outer edge and the innermost inner edge of the circuit line 23 is the shortest distance Z. The width W, which is the distance, is smaller than the shortest distance Z. For this reason, the outer edge 13OUT of the resin layer 13 is located away from the outermost outer edge of the circuit line 23 by the distance −X. When the distance X is negative in this way, there is a portion where the circuit line 23 does not overlap the resin layer 13 by the distance X from the outermost edge of the circuit line 23 to the innermost side. Further, the inner edge 13IN of the resin layer 13 is at a position separated from the innermost inner edge of the circuit line 23 by a distance −Y. When the distance Y is negative, there is a portion where the circuit line 23 does not overlap the resin layer 13 by the distance Y from the outermost peripheral edge of the circuit line 23 to the outermost peripheral side.

  The resin layer 13 according to the third embodiment may be provided on both the electronic circuit forming surface on the base sheet 11 and the opposite surface in combination with the resin layer 13 according to the first or second embodiment.

<Wireless communication method>
Next, a wireless communication method using the data carrier 10, 10A or 10B for metal sticking will be described. When using the data carrier for metal sticking 10, 10A or 10B, first, the release material 31 is peeled off from the adhesive layer which is the resin layer 13, and the data carrier for metal sticking to the metal adherend which is the data management object. 10, 10A or 10B is attached as an IC tag. When the adherend circulates in this state, the data carrier 10, 10A or 10B for metal sticking and the reader / writer perform wireless communication. The resonance frequency of radio waves transmitted / received between the data carrier for metal sticking 10, 10A or 10B and the reader / writer is 13.56 MHz, for example, 13.56 MHz ± 7 kHz, 13.56 MHz ± 150 kHz, 13.56 MHz ± 450 kHz, etc. It is said. The reader / writer reads information on the IC chip 22 provided in the data carrier 10, 10A, or 10B for attaching metal. The read information is referred to and managed by the reader / writer. Thereby, the role regarding the information of this IC tag is completed.

  As described above, the data carrier 10, 10 </ b> A, or 10 </ b> B for attaching the metal has the resin layer 13 or the resin on the surface where the circuit line 23 of the electronic circuit 21, the terminal portions 24, 25, 26, 27, the IC chip 22, and the like are provided. It is obtained by laminating the release material 31 laminated via the layer 13. The resin layer 13 is provided at least between the outermost and innermost circumferences of the circuit lines 23 on the base sheet 11 and is formed on the base sheet 11 by patterning along the circuit lines 23 and the like. The material discarded when the resin layer 13 is formed can be reduced. Further, the data carrier 10, 10 </ b> A, or 10 </ b> B for attaching metal does not require a magnetic sheet on the base sheet 11. Therefore, the data carrier 10, 10A, or 10B for metal sticking can be manufactured with existing equipment at low cost without increasing the number of constituent materials and processes. Therefore, the data carrier 10 for attaching a metal is manufactured at a low cost without increasing the thickness of the IC tag. Further, the data carrier 10, 10A or 10B for sticking metal performs stable wireless communication with the reader / writer even when it is attached as a non-contact type IC tag to a member made of a conductive material such as metal, and the reader / writer Can read stably.

  Therefore, the data carrier 10, 10 </ b> A or 10 </ b> B for attaching metal can be used effectively by attaching it as a data carrier (responder) to the metal surface as an adherend. For example, it can be used as a label for sticking to the surface of physical distribution goods, or it can be attached to the surface of metal cards, home appliances, electronic computers, etc., and used as a commuter pass for various transportation facilities, or an entrance / exit management card for various institutions or companies Can be used as

  In the present embodiment, the case where the data carrier for metal sticking 10, 10A or 10B is a data carrier having an IC chip has been described, but the present invention is not limited to this, and the data carrier for metal sticking 10, 10A. Alternatively, 10B can be similarly applied to the case of a resonance type antitheft tag that does not have an IC chip. The anti-theft tag is a closed circuit consisting only of a metal circuit that does not have an IC chip, and resonates with a radio wave from a reader / writer to return a reflected wave, and whether or not it exists The tag etc. which can be judged can be mentioned.

(Example)
Next, the present invention will be specifically described with reference to examples. However, the present invention is not limited by these examples.

[Example 1]
(Production of IC tag)
Screen printing method on the copper foil surface of a copper foil laminated sheet (trade name “Nikaflex F-10T50C-1”, manufactured by Nikkan Kogyo Co., Ltd.) obtained by bonding a copper foil (thickness 35 μm) and a polyethylene terephthalate sheet (thickness 50 μm). Thus, a resist pattern was printed in the shape of the circuit line 23, the terminal portions 24, 25, 26, 27 and the lead wire 28 as shown in FIG. This was etched to remove an unnecessary copper foil portion, and an integrated wiring pattern as shown in FIG. 3 was manufactured to produce a rectangular electronic circuit. The circuit line 23 had a line width of 130 μm, a line spacing of 120 μm, and a winding number of 14 turns. Further, the length of the rectangular spiral ring circuit line in the long side direction was 22.5 mm, and the length in the short side direction was 16 mm.

  The terminal portion 24 was connected at the end of the innermost circuit line 23, and the terminal portion 25 was connected at the end of the outermost circuit line 23.

  Next, an insulating resist ink (trade name “FR-100G-35”, manufactured by Toyobo Co., Ltd.) is printed between the terminal portion 24 and the terminal portion 27 by a screen method to cover the spiral annular circuit line 23 and dry. The insulating layer 30 was formed. Further, a silver paste (trade name “DW250L-1”, manufactured by Toyobo Co., Ltd.) is printed between the terminal portion 24 and the terminal portion 27 by a screen method and dried to form a jumper wire 29. And the terminal portion 27 are connected by a jumper wire 29 to form an electronic circuit 21.

  An RFID-IC chip (manufactured by NXP, trade name “I-CODE SLI”) was mounted on the created electronic circuit. For the mounting, a flip chip mounting machine (trade name “FB30T-M” manufactured by Kyushu Matsushita Co., Ltd.) was used. An anisotropic conductive adhesive (manufactured by Kyocera Chemical Co., Ltd., trade name “TAP0402E”) was used as a bonding material, and a rectangular IC chip mounting electronic circuit (IC inlet) was created.

  Next, a magnetic powder made of an Fe-Al alloy having a real part permeability μ ′ of 40 and a coercive force of 400 A / m is applied to an adhesive (trade name “PA-T1”, manufactured by Lintec Corporation) using an acrylic resin. The body was contained in a solid content of 71.4 wt%, converted into a resin, and formed into a resin layer 13 having a thickness of 50 μm. 20.1% of the resin layer 13 protrudes outside the outer edge of the outermost line when the shortest distance between the outermost outer edge and the innermost inner edge of the circuit line 23 of the electronic circuit 21 is used as a reference. It was cut into a size that did not protrude from the inner edge of the film, and was pasted on the electronic circuit 21. Thereafter, the resin layer 13 was bonded to the surface of the IC inlet on which the created IC chip mounting electronic circuit was formed. Thereafter, an acrylic pressure-sensitive adhesive layer (trade name “PA-T1”, manufactured by Lintec Corporation) that does not contain a polyethylene terephthalate film having a thickness of 25 mm and a magnetic powder having a thickness of 25 μm is formed in this order on the resin layer 13. Affixed to the surface, an IC tag was created. Twenty-two IC tags were created. The outer shape of the IC tag was 30 mm in the long side direction and 20 mm in the short side direction. The Fe—Al alloy used in the magnetic powder has a flat shape, and has an average particle diameter of 75 μm, 25 μm, 10 μm, and three types of particles.

  The IC tag thus obtained was affixed to a stainless steel plate (SUS304, manufactured by Partec Co.), and the communication distance read using a reader / writer (reading device) and an antenna was evaluated. The reader / writer used the trade name “TR3-C202” (weak type) manufactured by Takaya, and the antenna used the trade name “TR3-A401” manufactured by Takaya.

  Regarding the communication distance of the communication test, an IC tag is affixed to the center of the stainless steel plate, the IC tag and the center of each reader / writer are brought into contact with each other, and then the reader / writer is gradually separated from each other in parallel. The average value of the maximum intervals for detecting (number of tests 22) was defined as the communication distance. Regarding the evaluation of the communication test of the IC tag, the case where the reader / writer detects the IC tag is indicated by ◯, and the case where it is not detected is indicated by ×.

(Examples 2 and 3)
An IC tag is obtained in the same manner as in Example 1 except that the resin layer 13 in which the distance X from the outermost outer edge of the resin layer 13 from the outermost outer edge of the circuit line 23 is changed as shown in Table 1 is used. 22 sheets were made.

(Examples 4 and 5)
As shown in Table 1, except that the outer edge of the resin layer 13 is the same as the outermost edge of the circuit line 23 so as not to protrude and the size of the outer edge of the circuit line 23 protrudes to the inner side. In the same manner as in Example 1, 22 IC tags were prepared for each.

(Examples 6 to 9)
Example 1 except that the outer edge of the resin layer 13 protrudes outside the outermost outer edge of the circuit line 23 and protrudes inward from the innermost inner edge of the circuit line 23 as shown in Table 1. In the same manner as in No. 1, 22 IC tags were prepared for each.

(Comparative Example 1)
Twenty-two IC tags were produced in the same manner as in Example 1 except that the resin layer 13 did not contain magnetic powder.

(Example 10)
The electronic circuit is circular, the line width of the circuit line 23 is 100 μm, the distance between the lines is 120 μm, the number of turns is 19 turns, and the diameter of the circular spiral ring circuit line is 17 mm. Except that the outer edge of the resin layer 13 protrudes outward from the outermost edge of the circuit line 23 and is the same size as the inner edge of the innermost periphery of the circuit line 23, it is the same size as the first embodiment. Thus, 22 IC tags were prepared.

(Example 11)
The electronic circuit has the same circular shape as in Example 10, the outer edge of the resin layer 13 is the same as the outermost edge of the circuit line 23 so as not to protrude, and the inner edge of the innermost line of the circuit line 23 as shown in Table 1 Each of the 22 IC tags was prepared in the same manner as in Example 1 except that the size protruded inward.

(Examples 12 and 13)
The electronic circuit has a circular shape similar to that of the tenth embodiment, and the outer edge of the resin layer 13 protrudes outside the outermost edge of the outermost periphery of the circuit line 23 as shown in Table 1, and the inner edge of the innermost periphery of the circuit line 23. Twenty-two IC tags were produced in the same manner as in Example 1 except that the size protruded to the inside.

(Comparative Example 2)
Twenty-two IC tags were produced in the same manner as in Example 1 except that the electronic circuit was circular as in Example 10 and the resin layer 13 did not contain magnetic powder.

(Example 14)
As shown in Table 1, the outer edge of the resin layer 13 is made the same as the outermost edge of the circuit line 23 so as not to protrude, and the inner edge of the resin layer 13 is made the same as the innermost edge of the circuit line 23. The resin layer 13 is made of urethane resin (trade name “Dyferamin MAU-8288A”, manufactured by Dainichi Seika Co., Ltd.), Fe-Al having a real part permeability μ ′ of 40 and a coercive force of 400 A / m. Twenty-two IC tags were prepared in the same manner as in Example 1, except that 55 wt% of the magnetic powder, which is an alloy, was contained in a solid content, converted into a resin, and formed into a film with a thickness of 50 μm.

(Examples 15 and 16)
As shown in Table 1, the outer edge of the resin layer 13 is sized to protrude outward from the outermost outer edge of the circuit line 23, or the inner edge of the resin layer 13 protrudes from the innermost inner edge of the circuit line 23. Except for the size, 22 IC tags were produced in the same manner as in Example 14.

(Comparative Example 3)
As shown in Table 1, the length in the long side direction and the length in the short side direction of the rectangular spiral ring circuit line are the same as those in Examples 14 to 16, and the resin layer 13 does not contain magnetic powder. Produced 22 IC tags in the same manner as in Example 14.

(Example 17)
A rectangular electronic circuit was created. As shown in Table 1, the line width of the circuit line 23 is 150 μm, the line spacing is 150 μm, the number of turns is 9 turns, and the length of the rectangular spiral annular circuit line is 47 mm, which is short. The length in the side direction is 17 mm, and the outer edge of the resin layer 13 protrudes outside the outermost edge of the circuit line 23, and the inner edge of the resin layer 13 protrudes inside the innermost edge of the circuit line 23. 22 IC tags were prepared in the same manner as in Example 1 except that the size and the material of the resin layer 13 were the same as in Example 14.

(Example 18)
As shown in Table 1, the outer edge of the resin layer 13 is made the same as the outermost edge of the circuit line 23 so as not to protrude, and the inner edge of the resin layer 13 is made the same as the innermost edge of the circuit line 23. Twenty-two IC tags were produced in the same manner as in Example 17 except that the size did not protrude.

(Example 19)
As shown in Table 1, the outer edge of the resin layer 13 is the same as the outermost edge of the circuit line 23 so as not to protrude, and the inner edge of the resin layer 13 is located inside the innermost edge of the circuit line 23. Twenty-two IC tags were produced in the same manner as in Example 17 except that the size was set so as to protrude.

(Example 20)
As shown in Table 1, the outer edge of the resin layer 13 is sized so that the circuit line 23 is exposed from the outermost outer edge of the circuit line 23 to the innermost peripheral side, and the inner edge of the resin layer 13 is the innermost periphery of the circuit line 23. Twenty-two IC tags were produced in the same manner as in Example 17 except that the circuit line 23 was exposed to the outermost peripheral side from the inner edge.

(Example 21)
As shown in Table 1, an IC tag was obtained in the same manner as in Example 18 except that the resin layer 13 was provided on the surface (back surface) opposite to the surface on which the electronic circuit 21 of copper foil was formed. 22 sheets were prepared for each.

(Comparative Example 4)
As shown in Table 1, the length in the long side direction and the length in the short side direction of the rectangular spiral annular circuit line are the same as in Example 17 to Example 21, and the resin layer 13 does not contain magnetic powder. Produced 22 IC tags in the same manner as in Example 17.

(Example 22)
The circuit line 23 has a line width of 200 μm, a line spacing of 380 μm, a number of turns of 7 turns, a rectangular spiral circuit line having a long side length of 61 mm, and a short side length of 32 mm, and as shown in Table 1, the outer edge of the resin layer 13 is the same as the outermost edge of the circuit line 23 so as not to protrude, and the inner edge of the resin layer 13 is set to the innermost edge of the circuit line 23. Twenty-two IC tags were prepared in the same manner as in Example 1 except that the sizes were the same and did not protrude and the material of the resin layer 13 was the same as in Example 14.

(Comparative Example 5)
As shown in Table 1, the length in the long side direction and the length in the short side direction of the rectangular spiral annular circuit line are the same as in Example 21, and the resin layer 13 does not contain magnetic powder. In the same manner as in No. 21, 22 IC tags were created.

  Examples 1-22, circuit shape of electronic circuit of Comparative Examples 1-5, presence / absence of magnetic powder in resin layer 13, placement surface of resin layer 13 on copper foil, distance X from outer edge of outermost periphery, Table 1 shows the distance Y from the inner edge of the innermost circumference and the test results.

  As shown in Table 1, the resin layer 13 extends between at least the outermost periphery and the innermost periphery of the electronic circuit 21 along the electronic circuit 21 regardless of whether the shape of the circuit line of the electronic circuit is rectangular or circular. When it was formed to be provided, it could be read (see Examples 1 to 21). On the other hand, when the magnetic powder was not contained in the resin layer 13, the reader / writer could not detect the IC tag (see Comparative Examples 1 to 5). Even if the resin layer 13 protrudes from one or both of the outermost outer edge of the circuit line 23 and the innermost inner edge of the circuit line 23, the resin layer 13 extends along the electronic circuit 21 along the electronic circuit 21. It was possible to read even though the outer edge of the outer periphery of the circuit board 23 and the inner edge of the innermost periphery of the circuit line 23 protrude from one or both of them (see Examples 1 to 13, 15 to 17, and 19). . Therefore, the resin layer 13 is formed so as to overlap at least one turn between the outermost periphery and the innermost periphery of the electronic circuit 21 along the electronic circuit 21, so that the reader / writer can attach the IC tag. Can be detected.

  As described above, if the data carrier for sticking metal according to the present invention is used, even when a non-contact type IC tag is attached to a member made of a conductive material such as metal, a magnetic sheet is not required, and the number of constituent materials and processes Therefore, it can be manufactured thinly and inexpensively, and can be used effectively as a data carrier used by being attached to metal.

10, 10A, 10B Data carrier for attaching metal 11 Base material sheet 12 Non-contact data carrier element (IC inlet)
13 Resin layer 21 Electronic circuit 22 IC chip 23 Circuit line 24, 25, 26, 27 Terminal portion 28 Lead wire 29 Jumper wire 30 Insulating layer 31 Release material X Distance from outermost outer edge Y Distance from innermost inner edge Z Shortest distance

Claims (15)

A data carrier for attaching metal to a metal as an adherend,
A base sheet;
An electronic circuit provided on one surface of the base sheet and having a circuit line formed in a spiral shape;
A resin layer containing magnetic powder, and
The resin layer is provided on the one surface or the other surface on the base sheet, and at least one between the outermost periphery and the innermost periphery of the circuit line in a direction perpendicular to the one surface. A data carrier for affixing metal, characterized by being in a position overlapping the turn. In claim 1,
The area of the resin layer is smaller than the area of the base sheet,
The outer edge of the pattern of the resin layer is located on the outer side of the circuit line with respect to the outermost edge of the circuit line, and from the outermost edge of the circuit line to the outermost edge of the circuit line and the outermost edge. A data carrier for attaching a metal, wherein the data carrier is located on the circuit line side of a range surrounded by a position separated by 1.7 times the shortest distance from the inner edge of the inner circumference. In claim 2,
The outer edge of the pattern of the resin layer is located outside the outermost periphery of the circuit line and outside the circuit line, and from the outermost periphery of the circuit line to the outermost periphery of the circuit line. A metal carrier for attaching a metal, wherein the data carrier is located on a side closer to the circuit line than a range surrounded by a position separated by a distance of 1.25 times the shortest distance from the inner edge of the innermost circumference. In claim 3,
The outer edge of the pattern of the resin layer is located on the outer side of the outermost peripheral edge of the circuit line, and is 0.4 times the shortest distance width from the outermost peripheral edge of the circuit line. A data carrier for affixing a metal, wherein the data carrier is located on the circuit line side with respect to a range surrounded by a position separated by a distance. In claim 1,
The outer edge of the pattern of the resin layer is a position inside the outer edge of the outermost periphery of the circuit line, and is a position away from the outer edge of the outermost periphery of the circuit line by 0.2 times the shortest distance width. A data carrier for sticking metal, wherein the data carrier is located on the outer peripheral side of the outermost periphery of the circuit line rather than a range surrounded by. In claim 1,
The area of the resin layer is smaller than the area of the base sheet,
A metal sticking data carrier, wherein an outer edge of the pattern of the resin layer is in a position overlapping with an outermost outer edge of the circuit line in a direction perpendicular to the one surface. In any one of Claim 2 to 6,
The resin layer pattern is annular,
The inner edge of the pattern of the resin layer is located on the outer side of the innermost circumference of the circuit line, and is 1.4 times the shortest distance width from the innermost edge of the innermost circumference of the circuit line. A data carrier for sticking metal, characterized in that it is on the circuit line side with respect to a range surrounded by a position separated by a double distance. In claim 7,
The inner edge of the pattern of the resin layer is located on the outer side of the innermost circumference of the circuit line, and is 1.25 of the shortest distance width from the innermost edge of the innermost circumference of the circuit line. A data carrier for sticking metal, characterized in that it is on the circuit line side with respect to a range surrounded by a position separated by a double distance. In claim 8,
The inner edge of the pattern of the resin layer is located on the outer side of the innermost circumference of the circuit line, and is 0.4 times the shortest distance width from the innermost edge of the innermost circumference of the circuit line. A data carrier for sticking metal, characterized in that it is on the circuit line side with respect to a range surrounded by a position separated by a double distance. In claim 7,
The inner edge of the pattern of the resin layer is located on the inner side of the circuit line with respect to the innermost inner edge of the circuit line, and is 0.15 of the shortest distance width from the innermost inner edge of the circuit line. A data carrier for attaching a metal, wherein the data carrier is located on the inner edge side of the innermost circumference of the circuit line from a range surrounded by a position separated by a double distance. In any one of Claim 2 to 6,
The resin layer pattern is annular,
The metal sticking data carrier characterized in that an inner edge of the pattern of the resin layer is in a position overlapping with an innermost inner edge of the circuit line in a direction perpendicular to the one surface. In any one of Claims 1-11,
The magnetic permeability when the magnetic powder is measured by making a 50% volume concentration sheet in chlorinated polyethylene resin, and the real part permeability μ ′ at a frequency of 1 MHz is 8 or more. For data carrier. In any one of Claims 1-12,
An outer edge of the resin layer has a shape along an outermost edge of the outermost periphery of the circuit line. In any one of Claims 1-13,
The data carrier for metal sticking, wherein the resin layer is either an acrylic adhesive or a urethane resin.   A wireless communication method, wherein wireless communication is performed between the metal sticking data carrier according to any one of claims 1 to 14 and a reader / writer.

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