JP2013222898A - Dew condensation prevention structure of endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dew condensation prevention structure of an endoscope capable of preventing deposition of condensed moisture on an electronic component by an inexpensive, small and simple configuration.SOLUTION: A dew condensation prevention structure 80 of an endoscope 10 prevents deposition of condensed moisture on an electronic component 90 when dew condensation occurs in a space 75. The dew condensation prevention structure 80 includes: a dew condensation generating part 81, which is formed in a casing 71 and where dew condensation occurs prior to the electronic component 90 in the space 75; and a water absorbing member 83, which is arranged in the dew condensation generating part 81 and absorbs condensed moisture when dew condensation occurs in the dew condensation generating part 81.

Description

  The present invention relates to a dew condensation preventing structure for an endoscope that prevents moisture condensed from adhering to an electronic component disposed inside the endoscope.

  In general, it is essential that medical endoscopes be cleaned and sterilized in order to prevent infection. Examples of cleaning and sterilization include cleaning solutions and autoclaves.

  The interior of the endoscope is watertight during cleaning and sterilization. At the same time, it is necessary to ensure airtightness in the endoscope, but it is not easy to ensure airtightness reliably. For this reason, at the time of cleaning and sterilization, there is a risk that moisture may enter the endoscope. Since moisture is not released to the outside of the endoscope in a short time, when the endoscope is brought into a room having a high temperature, for example, indoors, the humidity inside the endoscope increases with time. In this state, when the endoscope is brought into a room where the temperature is low, condensation occurs inside the endoscope. This moisture and condensation corrode electronic parts such as a substrate and a solder joint provided in the endoscope. As a result, an electrical short circuit occurs.

  For this reason, for example, Patent Document 1 discloses a dew condensation prevention device that prevents moisture from adhering to a substrate or the like due to dew condensation. In the dew condensation prevention device, a heat transfer element and a water absorbing member are mounted inside a case portion where a substrate and the like are disposed. In order to generate condensation, the heat transfer element generates a temperature difference on both sides of the case portion, and the water absorbing member absorbs the generated condensation. As a result, the dew condensation prevention device prevents moisture from adhering to the substrate or the like.

JP 2009-267131 A

  In Patent Document 1, since the heat transfer element generates heat, a power supply device that supplies electric energy to the heat transfer element is required. When such a power supply device is disposed inside the endoscope, the endoscope becomes expensive and large, and the configuration of the endoscope becomes complicated.

  The present invention has been made in view of these circumstances, and provides an anti-condensation structure for an endoscope that can prevent moisture that has condensed with an inexpensive, small, and simple configuration from adhering to an electronic component. Objective.

  In order to achieve the object, the present invention has a case part and a space part in which electronic parts are arranged inside the case part, water-tightness is ensured with respect to the outside and substantially sealed, and the space part includes An anti-condensation structure for an endoscope that prevents dew condensation from adhering to the electronic component when dew condensation occurs. The dew condensation prevention structure is formed in the case portion and precedes the electronic component in the space portion. An endoscope comprising: a dew condensation generating part that generates dew condensation; and a water absorbing member that is disposed in the dew condensation generation part and absorbs moisture that is condensed when dew condensation occurs in the dew condensation generation part. Provides a dew condensation prevention structure.

  ADVANTAGE OF THE INVENTION According to this invention, the dew condensation prevention structure of the endoscope which can prevent the water | moisture content which condensed with the cheap, small and simple structure adheres to an electronic component can be provided.

FIG. 1 is a schematic configuration diagram of an endoscope according to the present invention. FIG. 2A is a schematic configuration diagram of a dew condensation prevention structure according to the first embodiment. 2B is a cross-sectional view of the dew condensation prevention structure taken along line 2B-2B shown in FIG. FIG. 2C is a cross-sectional view of the dew condensation prevention structure in a state where only the cylindrical water absorbing member is disposed without the dew condensation generation part. FIG. 3A is a schematic diagram of a dew condensation prevention structure according to the second embodiment. 3B is a cross-sectional view of the dew condensation prevention structure taken along line 3B-3B shown in FIG. 3A.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
[Constitution]
The first embodiment will be described with reference to FIGS. 1, 2A, 2B, and 2C.

[Endoscope 10]
As shown in FIG. 1, the endoscope 10 includes an elongated insertion portion 20 that is inserted into a body cavity of a patient, and an operation portion 60 that is connected to the proximal end portion of the insertion portion 20 and operates the endoscope 10. Have.

[Insertion section 20]
The insertion portion 20 has a distal end hard portion 21, a bending portion 23, and a flexible tube portion 25 from the distal end side of the insertion portion 20 toward the proximal end portion side of the insertion portion 20. The proximal end portion of the distal rigid portion 21 is connected to the distal end portion of the bending portion 23, and the proximal end portion of the bending portion 23 is connected to the distal end portion of the flexible tube portion 25.
The distal end hard portion 21 is the distal end portion of the insertion portion 20 and is hard and does not bend.
The bending portion 23 is bent in a desired direction such as up and down by an operation of a bending operation portion 65 described later. When the bending portion 23 is bent, the position and orientation of the distal end hard portion 21 change, illumination light (not shown) is illuminated on the observation object, and the observation object is captured in the observation field of view.
The flexible tube portion 25 has desired flexibility. Therefore, the flexible tube portion 25 is bent by an external force. The flexible tube portion 25 is a tubular member that extends from a main body portion 61 described later in the operation portion 60.

[Operation unit 60]
The operation unit 60 includes a main body 61 from which the flexible tube 25 extends, a gripping part 63 that is connected to the proximal end of the main body 61 and is gripped by an operator who operates the endoscope 10, and a grip And a universal cord 69 connected to the portion 63.

[Grip part 63]
The gripping part 63 has a bending operation part 65 for bending the bending part 23 and various buttons 67 for endoscopic photography.

[Universal code 69]
The universal cord 69 has a connection connector unit 70 that is connected to a video processor and a light source device (not shown).

[Connector unit 70]
As shown in FIG. 2A, the connection connector unit 70 is provided with a case portion 71 and an electronic component 90 such as various substrates and solder joint portions, and at least with respect to the outside. A water tightness is ensured, and the space 75 is further sealed.

  As shown in FIG. 2A, the case portion 71 includes a thin portion 71a having high heat dissipation by reducing the thickness, and a thick portion 71b having low heat dissipation by increasing the thickness as compared with the thin portion 71a. And is formed by. As shown in FIG. 2A and FIG. 2B, the case part 71 has the recessed part 71c formed for the thin part 71a. For example, the recess 71c is recessed from the inner peripheral surface of the case portion 71 toward the outer peripheral surface. As shown in FIGS. 2A and 2B, the thin-walled portion 71a and the recessed portion 71c are disposed along the longitudinal axis of the case portion 71 so as to face the electronic component 90, for example.

  As shown in FIGS. 2A and 2B, the space 75 is covered with the case portion 71 and formed by the case portion 71. The space 75 is secured for water tightness by, for example, an O-ring (not shown). The space part 75 shows the inside of the endoscope 10.

  As shown in FIG. 2A, the electronic component 90 is connected to the connection cable 91. The connection cable 91 passes through the universal cord 69, the grip part 63, the main body part 61, and the insertion part 20. The connection cable 91 is connected to an imaging unit (not shown) disposed on the distal end hard portion 21, for example.

[Dew condensation prevention structure 80 of endoscope 10]
As shown in FIGS. 2A and 2B, the endoscope 10 described above has the dew condensation of the endoscope 10 that prevents dew condensation from adhering to the electronic component 90 when dew condensation occurs in the space 75. A prevention structure 80 is provided. Such a dew condensation prevention structure 80 is disposed in the connection connector unit 70, for example.

  As shown in FIGS. 2A and 2B, the dew condensation prevention structure 80 is formed in the case portion 71, and a dew condensation generation portion 81 in which dew condensation occurs in the space 75 before the electronic component 90, and a dew condensation generation portion 81. And a water absorbing member 83 that absorbs moisture that is condensed when condensation occurs in the condensation generating portion 81.

[Condensation generator 81]
As shown in FIGS. 2A and 2B, the dew condensation generating part 81 is formed by, for example, the thinnest part 71a having the thinnest case part 71 and the highest heat dissipation. The dew generation part 81 should just be in contact with the space part 75. As described above, the heat dissipation of the dew condensation generating part 81 which is the thin part 71a is higher than the heat dissipation of the thick part 71b. Thereby, the dew condensation generating part 81 which is the thin part 71a is cooled before the thick part 71b. As a result, in the dew condensation generation part 81, dew condensation is promoted, and the dew condensation concentrates more than in the thick part 71b. At this time, condensation occurs in the condensation generation unit 81 before the electronic component 90. Thus, in the space portion 75, condensation is concentrated and promoted in the condensation generation portion 81. Such a dew generation part 81 is disposed in order to cause a difference in heat dissipation in the case part 71, and the dew condensation is generated, concentrated and promoted by the difference in heat dissipation.

[Water absorbing member 83]
The water absorbing member 83 as shown in FIG. 2A and FIG. 2B absorbs the condensed moisture generated in the condensation generating portion 81, thereby preventing the condensed moisture from adhering to the electronic component 90 and the like. The water absorbing member 83 has a capacity that can sufficiently absorb the condensed moisture when, for example, condensation occurs in the space 75, and prevents the absorbed moisture from overflowing. The water absorbing member 83 is disposed in the recess 71c and is in close contact with the thin portion 71a. The water absorbing member 83 is disposed in a space portion 75 showing the inside of the endoscope 10 in a state where water tightness is ensured. The water absorbing member 83 is formed of, for example, silica gel or ultrafine fibers.

[Action]
When the endoscope 10 is brought into a room having a high temperature, for example, indoors in a state where moisture has entered the space 75, the humidity of the space 75 increases with time. In this state, when the endoscope 10 is brought into the room at a low temperature, for example, condensation occurs in the space 75.

  In the present embodiment, the case portion 71 is formed by the thin portion 71a and the thick portion 71b, so that the heat dissipation of the thin portion 71a indicating a part of the case portion 71 is the heat dissipation of the thick portion 71b indicating the other portion. Higher than sex. For this reason, the thin part 71a is cooled before the thick part 71b. As a result, dew condensation concentrates on the dew generation part 81 which is the thin part 71a.

  As shown in FIG. 2C, when the case part 71 has only the thin part 71a or the thick part 71b, that is, when the thickness of the case part 71 is uniform, all the case parts 71 are formed of the same material. If it is, the heat dissipation in the case portion 71 is uniform. If dew condensation occurs in the space 75 in this state, there is a possibility that the dew condensation will adhere to the electronic component 90 before the inner peripheral surface of the case portion 71. In this state, even if the cylindrical water absorbing member 83 is disposed on the inner peripheral surface of the case portion 71, the water absorbing member 83 may not be able to absorb moisture.

  However, in the present embodiment, condensation is generated in the condensation generation unit 81 before the electronic component 90 in the space 75 by the condensation generation unit 81 that is the thin portion 71 a, and the condensed moisture is thin before the electronic component 90. It adheres to the dew generation part 81 which is the part 71a.

  And the water absorption member 83 arrange | positioned at the condensation generation | occurrence | production part 81 absorbs the water | moisture content which condensed. The capacity of the water absorbing member 83 is adjusted in accordance with the amount of water generated by condensation, so that the water absorbing member 83 prevents water from overflowing from the water absorbing member 83.

  Thereby, even if dew condensation occurs in the space 75, the dew condensation water is prevented from adhering to the electronic component 90.

[effect]
As described above, in this embodiment, condensation is not generated by external energy such as electricity, but is generated due to the difference in heat dissipation of the case portion 71. For this reason, in this embodiment, the generator which generate | occur | produces energy like a power supply device can be made unnecessary. Moreover, in this embodiment, in order to produce the difference in heat dissipation, only the thin part 71a is formed in the case part 71. Therefore, in this embodiment, it is possible to prevent the condensed moisture from adhering to the electronic component 90 with a low cost, small size, and simple configuration.

  In this embodiment, the electronic component 90 can be prevented from corroding due to condensation, an electrical short circuit can be prevented, and the electronic component 90 can be prevented from deteriorating.

  Further, in the present embodiment, a difference in heat dissipation is caused in the case portion 71 due to a difference in thickness of the case portion 71, and the condensed moisture adheres to the electronic component 90 with a low cost, small size, and simple configuration. Can be prevented.

  Moreover, in this embodiment, it can concentrate on the part which dew condensation is desired by the arrangement | positioning position of the dew condensation generation part 81. FIG. Thereby, in this embodiment, the freedom degree of design of the connection connector unit 70 can be improved. The arrangement position, size, and shape of the dew condensation generating part 81 are not particularly limited.

  Further, in the present embodiment, the dew generation part 81 is formed by the thinnest part 71 a having the thinnest and highest heat dissipation of the case part 71, and the water absorbing member 83 is disposed in the dew condensation generation part 81. Thereby, in the present embodiment, it is possible to reliably prevent the condensed moisture from adhering to the electronic component 90.

  Further, in the present embodiment, the space portion 75 is secured to be watertight, the dew condensation generating portion 81 is formed by the thin portion 71a, and the water absorbing member 83 is disposed in the space portion 75, so that the dew condensation preventing structure 80 is not removed. The endoscope 10 can be cleaned and sterilized. Further, the water absorbing member 83 is disposed in the space 75 where watertightness is ensured. For this reason, the water absorbing member 83 does not absorb moisture or the like outside the endoscope 10 and can absorb only moisture condensed in the space 75.

  Further, in the present embodiment, by disposing the water absorbing member 83 in the dew condensation generating portion 81, it is possible to absorb moisture that has been dewed reliably, easily and without waste. Further, in the present embodiment, the moisture condensed by the water absorbing member 83 can be reliably absorbed, and the condensed moisture can be prevented from adhering to the electronic component 90. In the present embodiment, by adjusting the capacity of the water absorbing member 83, it is possible to prevent the absorbed water from overflowing from the water absorbing member 83.

  In the present embodiment, the dew condensation prevention structure 80 is disposed in the connection connector unit 70, but it is not necessary to limit to this. The dew condensation prevention structure 80 may be disposed in the unit of the endoscope 10 having the case portion 71 and the space portion 75. In this case, this unit indicates, for example, the distal end hard portion 21, the operation portion, the grip portion 63, and the like, and the space portion 75 indicates the inside thereof. As described above, the dew condensation prevention structure 80 may be disposed in the endoscope 10.

[Second Embodiment]
[Constitution]
Only the configuration different from the configuration of the first embodiment will be described below with reference to FIGS. 3A and 3B.

[Case portion 71]
As shown in FIGS. 3A and 3B, the case portion 71 is formed of a member 73a having a high thermal conductivity and high heat dissipation, and a member 73b having a low thermal conductivity and low heat dissipation. The member 73a having high thermal conductivity and high heat dissipation and the member 73b having low thermal conductivity and low heat dissipation are, for example, separate bodies, and are formed of materials having different thermal conductivities, for example. The member 73a having high heat conductivity and high heat dissipation and the member 73b having low heat conductivity and low heat dissipation are connected in the circumferential direction and the longitudinal direction of the case portion 71.

[Condensation generator 81]
As shown in FIGS. 3A and 3B, the dew generation part 81 is formed, for example, on a member 73a having the highest thermal conductivity and the highest heat dissipation.

[effect]
In the present embodiment, the same effect as in the first embodiment can be obtained. Moreover, in this embodiment, the difference in heat dissipation is caused in the case part 71 by the difference in thermal conductivity, and the heat dissipation can be further improved by the thermal conductivity, so that dew condensation can be generated reliably.

  In the present embodiment, condensation is generated due to the difference in thermal conductivity. For this reason, in the present embodiment, unlike the first embodiment, the thickness of the case portion 71 can be made uniform. Therefore, in this embodiment, the strength of the case portion 71 can be improved.

  Such an embodiment can be combined with the first embodiment.

  The present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment.

  DESCRIPTION OF SYMBOLS 10 ... Endoscope, 70 ... Connection connector unit, 71 ... Case part, 71a ... Thin part, 71b ... Thick part, 75 ... Space part, 80 ... Condensation prevention structure, 81 ... Condensation generation part, 83 ... Water absorption member, 90: Electronic component.

Claims (4)

A case portion and an electronic component disposed inside the case portion, having a space portion that is watertight and substantially sealed against the outside, and when condensation occurs in the space portion, An anti-condensation structure for an endoscope that prevents moisture from adhering to the electronic component,
A dew condensation generating part formed in the case part, wherein dew condensation occurs before the electronic component in the space part;
A water-absorbing member that is disposed in the dew condensation generation part and absorbs moisture that is condensed when dew condensation occurs in the dew condensation generation part;
An anti-condensation structure for an endoscope, comprising: The case part is formed by a thin part having high heat dissipation by reducing the thickness, and a thick part having low heat dissipation by increasing the thickness compared to the thin part,
The dew condensation prevention structure for an endoscope according to claim 1, wherein the dew condensation generation part is formed by the thin part. The case portion is formed by a member having high thermal conductivity and high heat dissipation and a member having low thermal conductivity and low heat dissipation,
The dew condensation prevention structure for an endoscope according to claim 1 or 2, wherein the dew condensation generating part is formed on a member having high thermal conductivity and high heat dissipation.   The dew condensation prevention structure for an endoscope according to any one of claims 1 to 3, wherein the structure is disposed in a connection connector unit of the endoscope.

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