JP2013218304A - Image forming device and circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit board that realizes reliable contact connection to terminals or contact points of counterpart components, and further to provide an image forming device having the circuit board.SOLUTION: An image forming device comprises: a substrate main body; charging means; latent image forming means; and developing power supplying means. The substrate main body comprises: first and second accepting sections for individually accepting first and second positioning members of counterpart components positioned on a device main body or at predetermined positions of the device main body; and a third accepting section for accepting a guide mechanism included by at least one of the counterpart components. The charging means gives a predetermined potential to an image carrier on the basis of electric power supplied from the substrate main body. The latent image forming means forms a latent image on the image carrier. The developing power supplying means supplies predetermined electric power to developing means for visualizing the latent image held by the image carrier on the basis of the electric power supplied from the substrate main body.

Description

  The present invention relates to an image forming apparatus and a circuit board.

  There is an image forming apparatus in which a developer image visualized by supplying a developer (developer) to a latent image corresponding to image light is heated to fix the developer image to a sheet (thermal fixing).

  In order to heat-fix the developer image on the sheet, a lot of electric power is required. Further, in order to form a latent image, it is necessary to apply a voltage of several hundred volts to the photoconductor that holds the latent image. The latent image is prepared for four colors of three color component images according to subtractive color mixture and a black image for clearly outputting black.

  In order to form a latent image for four colors, for example, a high voltage transformer is used. In addition, a fixing device used for thermal fixing uses a circuit component including a contact that allows a large current capacity. In addition, according to the request | requirement which reduces a wiring material (electric wire) and a connector (connection member) today, the contact connection which contacts a contact and the terminal of a counterpart component or a contact directly is also used for the electrical connection of a contact.

JP 2002-158408 A

  Since the circuit board for holding the high-voltage transformer and circuit components is heavy, the burden on the operator during assembly work is not small. In particular, in the work of assembling the circuit board to the image forming apparatus or another board, due to the influence of weight, the burden when aligning the mounting position and the circuit board is large. Further, when assembling the circuit board, in addition to alignment, it is necessary to realize a reliable contact connection between the contact and the terminal or contact of the counterpart component.

  An object of the present invention is to provide a circuit board that realizes reliable assembly of a circuit board including contact connection and reliable contact connection between a contact and a terminal or contact of a counterpart component, and an image forming apparatus having the circuit board. It is.

  The image forming apparatus according to the embodiment includes a substrate body, a charging unit, a latent image forming unit, and a developing power source unit. The substrate main body includes an apparatus main body or first and second receiving portions for receiving first and second positioning members of a counterpart component located at a predetermined position of the apparatus main body, and at least one of the counterpart components. And a third receiving unit that receives a guide mechanism including the third receiving unit. The charging unit applies a predetermined potential to the image carrier based on the power supplied from the substrate body. The latent image forming unit forms a latent image on the image carrier. The developing power supply means supplies predetermined power to the developing means for visualizing the latent image held by the image carrier based on the power supplied from the substrate body.

1 illustrates an example of an image forming apparatus according to an embodiment. 1 illustrates an example (control block) of an image forming apparatus according to an embodiment. 1 illustrates an example (circuit board) of an image forming apparatus according to an embodiment. 1 illustrates an example (circuit board support unit) of an image forming apparatus according to an embodiment. 1 shows an example (positioning structure) of an image forming apparatus according to an embodiment. 1 illustrates an example (circuit board holding unit) of an image forming apparatus according to an embodiment. 1 shows an example (contact connection structure) of an image forming apparatus according to an embodiment. 1 shows an example (contact connection structure) of an image forming apparatus according to an embodiment.

  Hereinafter, embodiments will be described with reference to the drawings.

  An image forming apparatus (multi-function peripherals, MFP (hereinafter simply referred to as MFP)) 1 shown in FIG. 1 includes an image forming unit 3, an image reading unit 5, and a signal processing / operation control unit (circuit). Substrate portion) 7 at least. Note that an operation unit (display panel) 9 is located at a predetermined position of the MFP 1.

  The image forming unit 3 forms a visible image corresponding to the image data on a sheet that is paper or a resin sheet. The image data may be, for example, data generated by the image reading unit 5 or data from the outside. The data from the outside may be data supplied from a storage (portable) medium such as a semiconductor memory, or data supplied from a network supply source via the interface 71 (see FIG. 2).

  The image reading unit 5 acquires characters and images of the reading object as light brightness and darkness, and generates image data corresponding to light and darkness.

  The image reading unit 5 includes at least a document table (document glass) 5a, an illumination device, and an image sensor. The image sensor converts illumination light output from the illumination device into reflected image light (image information) reflected by the document (reading target) supported by the document table 5a into an image signal. The image sensor is, for example, a CCD sensor or a complementary metal-oxide semiconductor (CMOS) sensor.

  The signal processing / operation control unit 7 converts the image signal generated by the image reading unit 5 into image data suitable for image formation by the image forming unit 3. As shown in an example in FIG. 2, the signal processing / operation control unit 7 performs, for example, character identification, contour correction, color tone correction (color conversion, RGB) for an output image (printout) on the image signal from the image sensor. → CMY, density), halftone (gradation), γ characteristic (input density value vs. output density), and the like are applied. The image signal and the image data are stored in a storage device (not shown) such as a hard disk drive (HDD) or a semiconductor memory that can be taken out from the MFP 1.

  The image forming unit 3 includes first to fourth monochrome image forming stations (visible image forming units) 30a, 30b, 30c and 30d, and first to fourth photosensitive drums (image carriers) 31a, 31b, 31c. And 31d, first to fourth charging devices 32a, 32b, 32c and 32d, first to fourth exposure devices 33a, 33b, 33c and 33d, and the like.

  The image forming unit 3 also includes an intermediate transfer belt (visible image holding (primary transfer) unit) 34, a sheet transfer device (secondary transfer unit) 35, and first to fourth waste toner collecting mechanisms 36a, 36b, and 36c. And 36d, an intermediate transfer belt cleaner 37, a waste toner collecting device 38, a fixing device 40, and the like.

  Each of the photosensitive drums 31a, 31b, 31c, and 31d holds, as a latent image, a change corresponding to the intensity of the image light of the potential held by itself. Each of the exposure apparatuses 33a, 33b, 33c and 33d includes, for example, an LED head (LED element array), and is an image obtained by converting image data from the image processing unit 73 of the signal processing / operation control unit 7 into light intensity. Output light. That is, the potentials of the photosensitive drums 31a, 31b, 31c, and 31d of the respective image forming stations 30a, 30b, 30c, and 30d change according to the intensity of the image light from the LED head, and the potential difference becomes a latent image (static image). Image).

  In this way, the individual image forming stations 30a, 30b, 30c, and 30d receive the latent images corresponding to the image light from the exposure devices 33a, 33b, 33c, and 33d, and the corresponding photosensitive drums 31a, 31b, 31c, and 31d. The image is visualized by a developing device for each color component, and the visualized image is moved (transferred) to the intermediate transfer belt 34.

  The individual image forming stations 30a, 30b, 30c, and 30d have colors of C (cyan), M (magenta, magenta), Y (yellow, yellow), and K (black, black), respectively. Form a visible image. The developing device supplies toner to the latent images held by the individual photosensitive drums 31a, 31b, 31c, and 31d and develops the toner. The transfer device moves the toner images (visible images) held by the individual photoconductive drums 31 a, 31 b, 31 c and 31 d to the intermediate transfer belt 34.

  Note that the arrangement (position) of each of the image forming stations 30a, 30b, 30c, and 30d, that is, the color order, is determined according to the image forming process and the characteristics of the toner.

  The intermediate transfer belt 34 holds and conveys toner images (visible images) formed by the individual stations 30a, 30b, 30c and 30d.

  The sheet transfer device 35 moves the toner image conveyed by the intermediate transfer belt 34 to a sheet (paper).

  The fixing device 40 fixes (fixes) the toner, that is, the toner image, which has been moved from the intermediate transfer belt 34 to the sheet by the sheet transfer device 35.

  The waste toner collecting mechanism 36 does not move from the photosensitive drum removed by the cleaner to the intermediate transfer belt 34 in the vicinity of the transfer device (primary transfer unit) of each of the stations 30a, 30b, 30c, and 30d (individual photosensitive drums). The remaining transfer toner (excess toner) remaining on the body drum is collected by the waste toner collecting device 38 so as to be collected (held).

  In the vicinity of the sheet transfer device (secondary transfer unit) 35, the intermediate transfer belt cleaner 37 removes untransferred (excess) toner remaining on the intermediate transfer belt 34 without moving from the intermediate transfer belt 34 to the sheet, as waste toner. The collection device 38 collects the data so that it can be collected (held).

  The waste toner collecting device 38 collects the transfer residual toner collected by the waste toner collecting mechanism 36 and the transfer residual toner collected by the intermediate transfer belt cleaner 37.

  The image forming unit 3 also includes an automatic duplex unit (ADU) 41, at least one sheet cassette 42, a sheet feeding mechanism 43 attached to each sheet cassette, a transport mechanism 44, and an aligning mechanism 45. Note that a manual feed tray 46 and a paper feed mechanism 47 attached to the manual feed tray are positioned in front of the aligning mechanism 45. The sheet cassette 42 can be used in a plurality of stages.

  The sheet feeding mechanism 42 pulls out the sheet from the sheet cassette 42 at a predetermined timing corresponding to the image forming operation in each of the image forming stations 30a, 30b, 30c and 30d. The sheet from the paper cassette 42 moves (the sheet) to the transfer position where the conveyance mechanism 44 contacts the intermediate transfer belt 34 and the sheet transfer device 35. The timing at which the sheet moves to the transfer position (position where the intermediate transfer belt 34 and the sheet transfer device 35 are in contact) corresponds to the image forming operation of the aligning mechanism 45 in each of the image forming stations 30a, 30b, 30c and 30d. Set.

  The fixing device 40 heats the sheet and the toner electrostatically attached to the sheet, applies pressure, and fixes the toner to the sheet.

  The sheet holding the toner (toner image) fixed by the fixing device 40 is moved as an output image (printout) to a space between the image reading unit 5 and the image forming unit 3 or an ADU (automatic duplex unit) 41. To do.

  The ADU 41 reverses the front and back of the sheet so that the toner can move to the second surface which is the back of the first surface of the sheet having the toner image in close contact with the first surface. Move (position) to.

  An example of the signal processing / operation control unit 7 is shown in FIG. 2, but includes an image input unit (input interface) 71, an image processing unit 73, a modulation circuit (exposure signal generation unit) 75, a CPU (Central Processing Unit, a main control unit). ) 77, an image detection circuit (exposure timing detection unit) 79, and the like.

  The input interface 71 accepts image data supplied from an external device such as a personal computer (PC) or via a network.

  The image processing unit 73 performs predetermined processing on the image signal generated by the image reading unit 5 or the image data from the input interface 71 for character identification, contour correction, tone correction, γ characteristics, and the like.

  The exposure signal generation unit 75 converts the image data processed by the image processing unit 73 into a modulation signal (exposure signal) for use as exposure light by the first to fourth exposure apparatuses 33a, 33b, 33c, and 33d.

  A CPU (main control device) 77 controls processing of image data in the image processing unit 73.

  The image detection circuit (exposure timing detection unit) 79 detects the inclination (that can be managed as the exposure timing) of each color image formed in each of the image forming stations 30a, 30b, 30c, and 30d based on the output of the image sensor 39. To do.

  The signal processing / operation control unit 7 is also connected to a main control unit (MPU, Main Processing Unit) 101 that controls the overall operation of the MFP 1 including the image processing unit 73 (CPU 77), the image forming unit 3, and the image reading unit 5. A control signal is transferred between them, and an image reading operation, an image forming operation, and the like are controlled.

  The MPU 101 controls each unit (element) of the MFP 1 in accordance with a control input from a control panel (operation unit) 9 that receives an instruction (operation) input to the MFP 1.

  The MPU 101 also supplies a predetermined voltage to each element described below of the image forming unit 3, such as a high voltage transformer for a charging device. The MPU 101 includes, for example, charging power supply devices (high voltage units) 181a, 181b, 181c, and 181d that supply predetermined voltages and currents so that the individual charging devices 32a, 32b, 32c, and 32d output predetermined voltages. Control the output. In addition, the MPU 101 supplies a predetermined voltage and current so that each of the developing devices that develop (visualize) the latent images held by the individual photosensitive drums 31a, 31b, 31c, and 31d outputs a predetermined voltage. The output of the developing power supply device (developing bias unit / bias power supply) 183a, 183b, 183c and 183d is controlled.

  The operation unit 9 includes a display unit 9a. The display unit 9a displays the state of each unit of the MFP 1 by a display (user interface) known as a character string or a symbol (pictogram, pictogram / icon, icon), for example. The display unit 9 a also functions as a touch panel, and displays the above-described display and the like according to the instruction (control) input from the user, the display of the received input, and the control of the MPU 101.

  The signal processing / operation control unit 7 also includes a ROM (Read Only Memory) 111, a RAM (Random Access Memory) 113, an NVM (Non-volatile Memory) 115, A page memory (work memory) 117 used for image processing in the image processing unit 73, an I / O port 119 for inputting output from sensors of each unit to the MPU 101, and the like are included.

  The MPU 101 is connected to a motor driver 121 that controls the rotation of arbitrary motors 131, 134,. The motor 131 drives, for example, the first to fourth image forming stations 30a, 30b, 30c and 30d, the intermediate transfer belt 34, and the like. The motor 134 drives elements between a cassette related to sheet conveyance and the fixing device 40 (ADU 41), such as a sheet feeding mechanism 42, a conveyance mechanism 44, an aligning mechanism 45, and a sheet transfer device 35. Note that the fixing device 40 is independently driven by, for example, a motor 139.

  The MPU 101 is also connected to a heater control device 123 that drives a heater that sets the temperature of the fixing device 40.

  FIG. 3 shows a developing power supply device (developing bias unit) 183a for supplying predetermined voltages and currents to developing devices that develop (visualize) latent images held on the photosensitive drums 31a, 31b, 31c and 31d, for example. 183b, 183c and 183d, and a circuit board including high voltage units 181a, 181b, 181c and 182d for supplying a predetermined voltage and current to the charging devices 32a, 32b, 32c and 32d for charging the photosensitive drum to a predetermined potential, etc. The main part of is shown.

  The circuit board 201 includes a power feeding jumper, a connection terminal, or a power feeding member 211 that is fixed in advance by soldering or the like. The power feeding jumper, the connection terminal, or the power feeding member 211 enables electrical conduction by contact connection that contacts the counterpart device or terminal at a predetermined pressure.

  The circuit board 201 also holds an electronic component fixed to the circuit board 201 such as a resistor, a capacitor, or a transistor (fixed in advance by soldering or the like).

  The circuit board 201 further includes a high-voltage unit (181a-d) or a connection end 281a-281d connected to the contact (connection end) of the charging devices 32a, 32b, 32c and 32d schematically shown in FIG. The developing power supply device (183a to 183d) connected to the developing device or its connection ends 282a, 282b, 282c and 282d are held. The high-voltage unit (181) or its connection ends 281a to 281d, the developing power supply device (183a to d) or its connection ends 282a, 282b, 282c, and 282d are integrated with the circuit board 201 by soldering or the like.

  Further, the circuit board 201 has guide holes (positioning holes) 201A and 201B for positioning with the counterpart guide pins (positioning bosses) held by the MFP 1 main body, auxiliary parts for connection or another circuit board, or the like. And 201C.

  The individual guide holes 201A, 201B, and 201C have different shapes (diameters or diagonal lengths and the number thereof) and lengths, and the MFP 1 main body or auxiliary components for connection or another circuit board (hereinafter referred to as counterpart components). ) And the circuit board 201 are prevented from being mistaken in attachment position and direction. Note that the number of guide holes (and guide pins) may be four or more.

  The circuit board 201 can also easily position the positional relationship between the board support portion 1a and the circuit board 201 using the movement in the gravitational direction due to its own weight (of the circuit board 201), as shown in FIG. It has a possible mounting guide 202. In addition, the board | substrate support part 1a is located in the predetermined position of the other party component electrically connected by the contact connection by contact. The mounting guide 202 facilitates temporary fixing (temporary positioning) using the self-weight of the circuit board 201 along the board support portion 1a at the time of attaching the circuit board 201 to a predetermined position of the counterpart component.

  In other words, by positioning the mounting guide 202 on the substrate support portion 1a, the weight of the circuit board 201 acts in the direction of gravity, thereby realizing temporary fixing to the substrate support portion 1a. By this temporary fixing, it is possible to prevent the weight of the circuit board 201 from affecting the positioning operation (of the circuit board 201), and workability can be improved.

  The mounting guide 202 has a shape in a state viewed from a direction orthogonal to the board surface of the circuit board 201 (a direction parallel to the direction in which the board support portion 1a extends). It has a shape such as a polygon defined in the reverse direction or a combination of a plurality of straight lines obtained by cutting the polygon at an arbitrary position. The mounting guide 202 may also be a curve in which the approximate center of the curved portion of the arc is defined in the direction opposite to the direction of gravity or a combination thereof, or an ellipse and an ellipse cut at an arbitrary position.

  As shown in FIG. 5, each positioning boss (guide pin) has a different length so as to be fitted into the corresponding guide holes 201A, 201B and 201C in a predetermined order. In the example shown in FIG. 5, the length of the positioning boss 11A corresponding to the guide hole 201A is the longest, and the length becomes shorter in the order of the positioning boss 11B corresponding to the guide hole 201B and the positioning boss 11C corresponding to the guide hole 201C. Are combined. Further, the outer diameters of the positioning bosses are different.

  In the example shown in FIG. 5, first, the positioning boss 11A comes into contact with the guide hole 201A of the circuit board 201 and is fitted to the guide hole 201A. Subsequently, the positioning boss 11B comes into contact with the guide hole 201B of the circuit board 201 and engages with the guide hole 201B. Note that the circuit board 201 is temporarily fixed by the mounting guide 202 shown in FIG. 4 by moving in the direction of gravity along the board support portion 1a, so that the operator can align the guide hole with the positioning boss. Can focus.

When the circuit board 201 is further pressed (moved) to the counterpart component side, the positioning boss 11C comes into contact with the guide hole 201C and is fitted into the guide hole 201C.

  That is, the circuit board 201 contacts the positioning bosses 11A, 11B, and 11C in order according to the length of each positioning boss 11A, 11B, and 11C. Accordingly, it is possible to prevent the position of the contact of the counterpart component to be electrically connected, for example, the spring part α and the spring part β, from being displaced by the contact connection that contacts the circuit board 201. As a result, the power feeding jumper, the connection terminal, or the power feeding member 211 held by the circuit board 201 and the spring part α and the spring part β are in contact with each other in a correctly positioned state. Thereby, the screw position for fixation also becomes a predetermined position, and the assembly efficiency is improved.

  Each positioning boss 11A, 11B, and 11C is located at a position where a predetermined position of the tip portion passes through the guide holes 201A, 201B, and 201C as shown in FIGS. 6 (a) and 6 (b). A lock portion (support mechanism) 11-1 extending in the surface direction of 201 is provided. The lock portion 11-1 has a moving section between the elastic portion 11-3 and the circuit board 201 that have a predetermined spread from the distal end portion 11-2 toward the lock portion 11-1, that is, the elastic portion 11-3 has the guide hole 201 (A The slit part 11-4 which reduces the outer diameter (in the state which exhibited the expansion | swelling) of the elastic part 11-3 during passing through (C).

  That is, the circuit board 201 positioned in the lock portion 11-1 is disengaged (connected) between the positioning bosses 11A, 11B, and 11C and the corresponding guide holes 201 (A to C) (released state). ) Is deterred. As a result, the circuit board 201 remains at a predetermined position of each positioning boss 11A, 11B, and 11C. Therefore, even when a force in a direction away from the counterpart component is applied to the circuit board 201, the circuit board 201 is located at a predetermined position. In addition, the lock part 11-1 extends the elastic part 11-3 by inserting the elastic part 11-3 to the slit part 11-4, for example, by inserting a cylindrical member to the vicinity of the lock part 11-1. This can be eliminated, and the workability is not lowered when the circuit board 201 is replaced.

  7 (a), 7 (b), and 8 show the spring part, which is a contact point of the counterpart component that is in contact with the circuit board, and the power feeding jumper, the connection terminal, or the power feeding member held by the circuit board. An example of the structure of the guide mechanism and the receiving part on the circuit board side which contact-connects is shown. Hereinafter, the spring portion α is shown as a representative.

  The guide mechanism α-1 adjacent to the spring portion α includes a rectangular main body α-11 defined by two diagonal lines shorter than the inner diameter of the spring portion α and an introduction portion α-12 extending from the main body portion α-11. Have. The guide mechanism α-1 is located at a predetermined position of the counterpart component at a position substantially equal to the base of the spring portion α. The receiving portion 203 of the circuit board 201 is a rectangular opening that is slightly larger than the main body portion α-11 of the guide mechanism α-1. Note that the long side direction of the rectangular opening is parallel to the direction in which the power feeding jumper 211 extends, and a reliable contact connection between the spring portion α and the power feeding jumper 211 is ensured.

  As shown in FIG. 8, the introduction portion α-12 of the guide mechanism α-1 converts, for example, a rectangular cross section of the main body portion α-11 into an elliptical cone shape (conical frustum). The elliptical conical shape is an example, and the main body portion α-11 such as a wedge shape in which the thickness of two sides of the rectangular shape is gradually reduced, or a frustum shape in which the area of the rectangular cross section is continuously reduced, etc. Any shape having a smaller cross-sectional area than the cross-sectional area can be used.

  The circuit board 201 moves to a predetermined position of the counterpart component according to the length of each positioning boss 11A, 11B, and 11C, so that the receiving part 203 on the circuit board 201 side receives the introduction part α-12. When the circuit board 201 side further moves, the main body part α-11 of the guide mechanism α-1 is positioned in the receiving part 203 on the circuit board 201 side. As a result, the guide mechanism α-1 guides the spring portion α so that the power supply jumper, the connection terminal, or the power supply member 211 is contact-connected with certainty. That is, the guide mechanism α-1 and the receiving portion 203 on the circuit board 201 side can prevent the spring portion α from coming into contact with the power feeding jumper, the connection terminal, or the power feeding member 211 in a state where the spring portion α is fluctuated, tilted, or deformed, for example.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... MFP (image forming apparatus), 1a ... Board | substrate support part, 3 ... Image forming part, 7 ... Control (signal processing / operation control) part, 9 ... Operation part, 9a ... Display part, 11A, 11B, and 11C ... Guide Pins (positioning bosses), 30a, 30b, 30c and 30d ... monochrome image forming stations (visible image forming units), 31a, 31b, 31c and 31d ... image carriers (photosensitive drums), 33a, 33b, 33c and 33d ... Exposure device (LED head) 34 ... Intermediate transfer belt 35 ... Sheet transfer device 40 ... Fixing device 39 ... Image sensor 41 ... Automatic duplex unit 45 ... Aligning mechanism 75 ... Modulation circuit 77 ... CPU , 79 ... Image detection circuit, 101 ... MPU (main control unit), 181a, 181b, 181c and 181d ... Charging power supply unit (high voltage unit), 183a, 18 b, 183c and 183d ... developing power supply device (developing bias unit / bias power supply), 201 ... circuit board, 201A, 201B and 201C ... guide hole (positioning hole), 202 ... mounting guide, 203 ... receiving portion, 211 ... feeding Jumpers, connection terminals, power supply members, 281a, 281b, 281c and 281d... Connection ends (for high voltage units), 282a, 282b, 282c and 282d... Connection ends (for development power supply devices).

Claims (5)

A first and a second receiving part for receiving the first and second positioning members of the apparatus main body or a counterpart component located at a predetermined position of the apparatus main body, respectively;
A third receiving unit for receiving a guide mechanism included in at least one of the counterpart parts;
A substrate body comprising:
Charging means for applying a predetermined potential to the image carrier based on electric power supplied from the substrate body;
Latent image forming means for forming a latent image on the image carrier;
A developing power supply means for supplying predetermined power to a developing means for visualizing a latent image held by the image carrier based on power supplied from the substrate body;
An image forming apparatus comprising:   The image forming apparatus according to claim 1, wherein the first and second receiving units receive the first and second positioning members of the counterpart component in an order in which each length defines.   In order to prevent the weight of the circuit board from affecting the positioning operation of the circuit board, the board body is configured to be the device body or the board support portion of the counterpart component located at a predetermined position of the device body and the board body. The image forming apparatus according to claim 1, further comprising a guide unit that sets a positional relationship with the substrate body.   The third receiving portion is a rectangular opening that is long in a direction in which a power supply jumper positioned in parallel with the main body of the counterpart component extends in the substrate main body, and the introduction portion of the guide mechanism of the counterpart component The image forming apparatus according to claim 1, wherein the image forming apparatus receives and subsequently receives the main body of the guide mechanism. A first and a second receiving part for receiving the first and second positioning members of the apparatus main body or a counterpart component located at a predetermined position of the apparatus main body, respectively;
A third receiving unit for receiving a guide mechanism included in at least one of the counterpart parts;
A circuit board that supplies predetermined power to the image forming apparatus according to claim 1.

Images