JP2013215739A - Laser processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attain uniform processing at a predetermined depth without causing omission of processing.SOLUTION: A laser processing apparatus 1 is used to process a workpiece 109 by laser, and includes: a scanner 107 that irradiates the workpiece 109 with laser emitted from laser oscillators 100 and 101; and a controller 111 that scans the surface of the workpiece 109 by laser while controlling the scanner 107 and controls the processing of the workpiece 109. The controller creates processing data for processing a workpiece that are used by the controller 111, from drawing data concerning a drawing of the workpiece 109. In this case, the controller 111 creates the processing data on the basis of contour information as drawing data of a surface of the workpiece to be processed.

Description

  The present invention relates to a laser processing method, and more particularly to a laser processing method for processing a specified region to a predetermined depth using a laser.

  The printed circuit board requires processing such as lines, pads, and a ground plane as a pattern for forming a conductor of an electronic circuit.

  FIG. 1 is a diagram showing a configuration of a conventional laser processing apparatus. The laser processing apparatus 1 includes a first laser oscillator 100, a second laser oscillator 101, a mirror 102, an optical path switching unit 103, a beam shaper 104, an aperture 105, a collimator 106, a scanner 107, an Fθ lens 108, a table 110, and a control device 111. The workpiece 109 is mounted on the table 110 and laser processing is performed. At that time, from the control device 111, a first control signal 112 for controlling the laser oscillator 100, a second control signal 113 for controlling the second laser oscillator 101, a third control signal 114 for controlling the scanner 107, A fourth control signal 115 for controlling the collimator 106, a fifth control signal 116 for controlling the aperture 105, a sixth control signal 117 for controlling the beam shaper 104, and a seventh control for controlling optical path switching in the optical path switching unit 103 A signal 118 is output, and each part is controlled by each control signal 112-118.

  The first laser is for groove processing by CW or pulse, and the second laser is for processing a pad or ground plane by pulse. Here, the CW laser is used when processing a relatively thin line. The pulse laser is used when processing a wide surface. In the invention described in Patent Document 1, the laser pulse energy density, the beam speed, and the pulse time are carefully controlled, and can be uniformly processed to a predetermined depth. A CW (Continuous Wave Laser) laser is a laser that is continuously output with respect to time, and a pulse laser (Pulse Laser) is a laser that repeatedly outputs and stops (intermittently outputs).

  In particular, for example, a method described in Patent Document 1 is known as a surface processing method such as a ground plane of a printed circuit board. In FIGS. 4 and 5 of Patent Document 1, an example of processing a ground plane is described. The ground plane 44 shown in FIG. 4 of Patent Document 1 is processed by irradiating the substrate with the laser beam while moving the second laser beam or the printed board in two dimensions.

  As described above, in the invention described in Patent Document 1, it can be uniformly processed to a predetermined depth by carefully controlling the laser pulse energy density, beam speed, and pulse time, but there is a region where the printed circuit board is not irradiated, Eventually, the ground plane cannot be processed uniformly.

  FIG. 11 is a diagram showing an example of processing using a pulse laser having a top hat with an energy distribution that is conventionally performed. The pulse laser used for this processing has a constant oscillation cycle, and the interval at which the workpiece 109 is irradiated with the laser can be changed by the speed at which the scanner 107 is moved. Further, the processing depth also changes depending on the change of the scanning speed of the laser beam in the processing direction.

  If processing is performed with a pulse laser that irradiates the workpiece 109 such as a printed circuit board with a wide interval, the contour 400r of the ground plane 400 becomes uneven, or a region 400s that is not processed without being irradiated with the laser beam is generated. FIG. 11B is a sectional view taken along line I1-I1 in FIG. As can be seen from FIG. 11 (b), the portion where the processed portion of the pulse laser 401 does not overlap with the adjacent processed portion remains without being processed (region 400s), resulting in unevenness without making the depth uniform. Yes.

  In FIG. 11C, reference numeral 410 denotes a ground plane of the drawing data, reference numeral 411 denotes a processing portion using a pulse laser, and reference numeral 412 denotes a scanning locus. In FIG. 11 (c), only three beam shapes of the pulse laser are shown, but these three laser beams are scanned in the scanning direction indicated by the arrow as in FIG. 11 (a). Further, the interval at which the pulse laser irradiates the workpiece 109 such as a printed circuit board is narrower than that in FIG. FIG. 11D is a cross-sectional view taken along the line I2-I2 of FIG. In this processing, it is desired that the depth is uniform regardless of the location. From FIG. 11D, it can be seen that the portion 410m that is not close to the contour 410r has a uniform depth, but the depth becomes shallower as it approaches the contour 410r. Further, it can be seen that both the corners 400c and 410c are not processed in both FIG. 11A and FIG.

  12 to 14 are flow charts showing a processing procedure of processing for a printed circuit board of a laser processing apparatus conventionally performed. This control procedure is executed by the CPU of the control device 111 shown in FIG.

  FIG. 12 shows a main routine. When the process is started, a machining data generation process is executed in step S101, and a machining command and a machining process are executed based on the machining data generated in step S102. FIG. 13 is a flowchart showing the processing content of the processing data generation processing in step S101. In the processed data generation process, first, a drawing data read process is executed in step S111. The drawing data is, for example, stored in advance as gerber data in the memory of the control unit of the laser processing apparatus before processing.

The drawing data is data related to the drawing of the printed circuit board circuit diagram, and the processing data is data (program) for the control device 111 to control the scanner 107 and the like. When processing according to the processing data, the processing result is the same as the image drawn by the drawing data. Data relating to drawing of drawing data includes line data, pad data, and plane data such as a ground plane as components.

The line data is composed of start point coordinates, end point coordinates, and line thickness data. The pad data is composed of center coordinates and diameter data. Surface data is composed of a collection of lines. When these lines overlap, they close and become a surface, and the outline of the surface is drawn. Therefore, the surface data of the drawing data is referred to as contour information. The line is a straight line or a curve.

A straight line is composed of start point coordinates and end point coordinates, and a curve is composed of start point coordinates, end point coordinates, a radius, and the like. The machining data includes a line machining command, a pad machining command, and a jump command. The line machining command includes a start point coordinate, an end point coordinate, a laser beam diameter, and laser on information. The pad processing command is composed of center coordinates, laser beam diameter and laser on information. The jump command is composed of start point coordinates, end point coordinates, and laser off information.

  Under such a premise, when drawing data is read in step S111, it is determined whether the read drawing data is line data (step S112) or pad data (step S114). If it is line data (step S112: Y), line processing data to be output to the first laser oscillator 100 is generated (step S113). If it is not line data (step S112: N), it is pad data. Is determined (step S114). If this determination is pad data (step S114: Y), pad processing data to be output to the second laser oscillator 101 is generated (step S115).

  If it is not pad data in the determination of step S114 (step S114: N), it is surface data such as a ground plane, and fill line processing data for processing with the second laser beam output from the second laser oscillator 101 is used. The drawing data is converted into (Step S116). The processing from step S112 to step S116 is repeated until the drawing data relating to the workpiece to be processed is completed (step S117), and the processing of steps S113, S115, and S116 is completed for all drawing data (step S117: Y). ), The processing data is stored in a nonvolatile memory of the control unit, for example.

  Furthermore, the conversion process of step S116 is a process of converting the surface data of the drawing data into the machining data of the line machining command or the jump command. That is, the laser 2 fill line processing data conversion process is a process in the case of surface data. This is because it is necessary to overlap lines to process the surface.

  FIG. 14 is a flowchart showing the processing command and processing contents of the processing in step S102. In the processing command and processing in step S102, the processing data stored in the non-volatile memory in step S118 is read (step S121), and the CPU processes the first laser oscillator 100 so that processing can be performed based on the read processing data. A command is output (step S122). As a result, laser processing is performed on the printed circuit board (work) by the first laser beam. Thereby, line processing is performed by the first laser beam.

  Next, a machining command process (step S124) is similarly performed on the second laser oscillator 101. Based on the machining command, the second laser oscillator 101 applies a second laser beam to the printed circuit board (workpiece). Then, laser processing is executed (step S125). Processing at this time is padding or painting. Thereafter, the laser processing command and the laser processing are repeated.

  Note that the drawing data of the drawing data reading process in step S111 is, for example, Gerber data. The processing data in step S118 is generated from the drawing data, and a processing command and processing are performed based on the processing data. Gerber data is data representing numerical values for the position, size, line thickness, etc. of holes, which is information for automating the production of printed circuit boards, and is standardized as CAD output data for printed circuit boards.

When laser processing is performed by the first laser oscillator 100 in step S123 and laser processing is performed by the second laser oscillator 101 in step S125, the seventh control signal 112 is transmitted from the first control signal 112 from the CPU of the control device 111. The control signal 118 outputs a predetermined signal.

In the flowcharts shown in FIGS. 12 to 14, the contour remains the same as that of the laser beam, and the contour as shown in FIG. 11A or 11C is not processed.

International Publication No. WO20100067042A1

  As described above, the ground plane cannot be processed to a uniform depth by the technique described in Patent Document 1 or the technique that has been implemented conventionally.

  Therefore, a problem to be solved by the present invention is to enable a ground plane to be uniformly processed at a predetermined depth without causing processing leakage.

  In order to solve the above-mentioned problems, in order to solve the above-mentioned problems, the first means is a laser irradiation means for irradiating a workpiece with a laser emitted from a laser oscillator; A laser comprising: control means for scanning and controlling machining of the workpiece; and machining data generating means for generating machining data for machining the workpiece used by the control means from drawing data relating to drawing of the workpiece. In the processing apparatus, the processing data generating means generates processing data along a contour at a distance half the inside of the size of the laser beam used for processing from the contour based on the contour information of the surface, and the processing The data is two pieces of processing data generated for one surface, the first processing data along the contour based on the contour information of the surface, and the contour information of the surface. A laser processing method characterized by comprising the a preset distance away an inner containing 0 from the contour of the surface of the surface and the second processing data to fill the entire surface inside based on.

  Further preferably, the second means is the laser processing method, wherein the first laser beam based on the first processing data is a CW laser, and the second laser beam based on the second processing data. Is a laser processing method characterized by being a pulse laser.

  According to the present invention, by processing the ground plane based on the generated processing data, the ground plane can be processed uniformly at a predetermined depth without causing processing leakage.

It is a figure which shows the structure of the laser processing apparatus implemented conventionally. It is a characteristic view which shows the example of the output of the laser oscillator of a CW laser and a pulse laser. It is a figure which compares and shows the processing state of a pulse laser and a CW laser, and shows a state when processing a line by a pulse laser. It is a figure which compares and shows the processing state of a pulse laser and a CW laser, and shows a state when processing a line by a CW laser. It is a flowchart which shows the process sequence of the processing process of the laser processing apparatus which concerns on embodiment of this invention. It is a flowchart which shows the processing content of the contour line process data generation process in FIG. It is explanatory drawing which shows the process example 1 in embodiment of this invention. It is explanatory drawing which shows the example 2 of a process in embodiment of this invention. It is explanatory drawing which shows the process example 3 in embodiment of this invention. It is explanatory drawing which shows the process example 4 in embodiment of this invention. It is explanatory drawing which shows the process example 5 in embodiment of this invention. It is a figure which shows the example of a process by the pulse laser of the energy distribution currently implemented by the top hat. The main routine is shown by the flowchart which shows the process sequence of the processing process with respect to the printed circuit board currently implemented. The flowchart which shows the process sequence of the process process with respect to the printed circuit board currently implemented conventionally shows the process content of a process data generation process. It is a flowchart which shows the process sequence of the process process with respect to the printed circuit board currently implemented, and shows the process content of a process command and a process process.

  As described above, there are CW lasers that are continuously output with respect to time and pulse lasers that repeatedly output and stop as described above. FIG. 2 is a characteristic diagram showing an example of outputs of laser oscillators of a CW laser and a pulse laser. The seventh control signal 118 for switching the optical path in FIG. 1 selects either the output of the first laser oscillator or the output of the second laser oscillator and outputs it to the beam shaper 104. The beam shaper 104 in FIG. 1 can switch the input spatial energy of the Gaussian distribution to a top hat. The shape of the laser beam can be switched by the aperture 105. The aperture 105 has a circular or cross-shaped hole, and the shape of the laser beam is changed by selecting the type of the hole.

  The size of the laser beam applied to the workpiece 109 such as a printed circuit board can be changed by the collimator 115. When the outputs from the laser oscillators 100 and 101 are constant, the energy density per unit area increases when the size of the laser beam applied to the workpiece 109 is reduced.

  When processing with a laser beam, the scanner 107 is used when changing the irradiation position of the laser beam onto the workpiece 109 such as a printed board or when processing a line. When the moving speed of the scanner 107 is changed, the moving time of the irradiated beam position or the speed of processing the line can be changed.

  3A and 3B are diagrams showing a comparison of processing states of a pulse laser and a CW laser. FIG. 3A shows a state when a line is processed by a pulse laser, and FIG. 3B shows a state when a line is processed by a CW laser. Respectively. In both cases, laser beams having the same circular shape and the same radius are compared, and the outputs per unit time are the same. In FIG. 3A (a), the black point is the processing start position, and the tip of the arrow is the processing end position. FIG. 3A (b) is a cross-sectional view taken along line X1 in FIG. 3A (a) in the direction of progress of processing with a Gaussian laser beam. FIG. 3A (c) is a cross-sectional view taken along line X1 in the direction of progress of processing with a laser beam having a top hat distribution. FIG. 3A (d) is a cross-sectional view cut in a direction perpendicular to the traveling direction in processing with a laser beam having a Gaussian distribution. FIG. 3A (e) is a cross-sectional view cut in a direction perpendicular to the traveling direction in the processing of the laser beam by the top hat distribution. FIG. 3A (f) is a cross-sectional view taken along line X2 in FIG. 3A (a) in the direction of progress of processing with a Gaussian laser beam. X1 is the center of the width of the line to be processed. X2 is a position shifted from the center of the line width. The depth of FIG. 3A (f) is uneven.

  FIG. 3B (a) shows a state where a line is processed by a CW laser, and FIG. 3B (b) shows a cutting direction along FIG. 3B (a) in FIG. 3B (a) along the direction of processing by a Gaussian laser beam in FIG. 3B (a). FIG. FIG. 3B (c) is a cross-sectional view taken along line X3 in the direction of progress of processing with a laser beam having a top hat distribution. FIG. 3B (c) is slightly shallower than FIG. 3B (b). FIG. 3B (d) is a cross-sectional view cut in a direction perpendicular to the traveling direction in processing with a Gaussian-distributed laser beam. FIG. 3B (e) is a cross-sectional view cut in a direction perpendicular to the advancing direction in processing by a laser beam with a top hat distribution. The CW laser has a constant depth except for the start and end of processing.

  In the present embodiment, for example, the laser 1 indicates a CW laser, and the laser 2 indicates a pulse laser. The CW laser is used when processing a relatively thin line, and the pulse laser is used when processing a wide surface. Further, as can be seen from the processing examples described later, the diameter of the laser beam is CW laser <pulse laser.

In the laser processing apparatus 1 according to the present embodiment, the conditions for processing a workpiece such as a printed board with a laser beam are as follows:
1) The size of the laser beam applied to the workpiece is smaller than the surface to be processed.
2) When processing a surface such as a ground plane on a work 109 such as a printed circuit board with a laser beam, the surface is processed so that there is no leakage of lines or points.
3) When machining a surface, if it protrudes from the contour of the surface, it may come into contact with a line or pad adjacent to the surface, so it does not protrude from the contour of the surface.
It is.

  On the other hand, when processing a workpiece with a laser beam, there are the following features.

1) When processing a line using a scanner with a constant output of the CW laser oscillator and a constant laser beam diameter to irradiate a workpiece such as a printed circuit board, the faster the line is processed, the deeper the processing depth. It becomes shallower.
2) When a line is processed at a constant speed using a scanner with a constant output from the CW laser oscillator, the processing depth becomes shallower as the diameter of the laser beam irradiated onto the printed circuit board is increased.
3) When processing with a constant output from the pulse laser oscillator and a constant diameter of the laser beam applied to the printed circuit board, the faster the scanner is moved, the wider the processing interval.
4) When the output from the pulse laser oscillator is constant and is moved at a constant speed using a scanner, the processing depth becomes shallower as the diameter of the laser beam irradiated onto the printed circuit board is increased.
The processing is executed in consideration of this characteristic and the above conditions.

  4 and 5 are flowcharts showing a processing procedure of processing of the laser processing apparatus according to the embodiment of the present invention. Note that the same processes as those in the flowchart shown in FIG. 13 described above are denoted by the same reference numerals, and redundant description will be omitted as appropriate. In FIG. 4, in the processing data generation process, it is determined whether the data is line data or pad data in steps S112 and S113. If the surface is not line data or pad data but a surface such as a ground plane (steps S112: N, S113: N) The filled line machining data conversion process (described as “laser 2 filled line machining data conversion” in the figure) output to the second laser oscillator 101 in step S116a is executed, and the contour line in step S116b In each data generation process (described as “laser 1 contour processing data generation” in the figure), contour processing data to be output to the first laser oscillator 100 is generated. Then, the process proceeds to step S117. The contour line indicates the expected end of processing.

  FIG. 5 is a flowchart showing details of the contour line machining data generation process of the first laser oscillator 100. In this processing procedure, a ground plane inside / outside determination process (step S201) and a contour inner line data generation process (step S202) are executed, and it is determined whether or not the generated contour inner line data matches the start point coordinates of the data. (Step S203). Since the contour of the ground plane is closed, the start point and end point of the contour inner line data have the same coordinates.

  6-10 is explanatory drawing which shows the example of a process in embodiment of this invention.

[Processing example 1]
FIG. 6 is a diagram showing a processing example 1. In the figure, reference numeral 500 is a ground plane of drawing data, reference numeral 501 is a filled laser beam, reference numeral 502 is a laser beam for processing a contour, reference numeral 501t is a locus of a filled laser beam, and reference numeral 502t is a laser beam for processing a contour. , Reference numeral 502d is an interval width between the contour 500r of the ground plane 500 and the locus 502t of the contour laser beam 502, and reference numeral 501p is an interval width between the locus 501t of the filled laser beam.

  The data of the locus 501t of the filled laser beam 501 is generated in the laser 2 filled line processing data conversion process for the second laser oscillator 101 in step S116a. The locus 501t of the filled laser beam 501 is divided into a plurality of parts as shown in FIG. The starting point of processing is indicated by a black circle and the end point of processing is indicated by an arrow, and all processing is performed in one direction indicated by the arrow.

  The locus 502t of the contour laser beam 502 is along the contour, and the distance 502d between the drawing data and the ground plane 500 is always constant. The locus 502t of the contour laser beam 502 is generated by the contour line machining data generation process for the first laser oscillator 100 in step S116b. An interval width 501p between traces 501t of the filled laser beam 501 is a predetermined width so as to be a predetermined depth, and is uniform everywhere. The interval width 501p between the traces 501t of the filled laser beam 501 is deeper as the output of the laser oscillator is constant. In the case of this processing example 1, the filled laser beam 501 is a pulse laser, and the contour laser beam 502 is a CW laser.

  Since the contour laser beam 502 has a circular shape, the interval width 502 d is equal to the radius of the contour laser beam 502. In addition, the shape of the corner portion 500c of the ground plane 500 is equal to a quarter of the circle of the contour laser beam 502, and the locus of the contour laser beam 502 is a one-stroke drawing with the same start point and end point. As a result, no processing residue occurs in the corner portion 500c of the ground plane 500. Further, the interval width 501p is set such that a plurality of interval widths 501p between the traces 501t of the filled laser beam 501 fall within the radius of the filled laser beam 501. Thereby, in the present processing example 1, processing of the ground plane 500 does not occur due to processing of the filled laser beam 501 and processing of the contour laser beam 502.

[Processing example 2]
FIG. 7 is a diagram showing a processing example 2. In FIG. 7A, reference numeral 510 denotes a ground plane of drawing data, reference numeral 511 denotes a solid laser beam, reference numeral 512 denotes a contour laser beam, reference numeral 511t denotes a locus of the solid laser beam 511, and reference numeral 512t denotes a contour laser beam. 512, reference numeral 511d is the interval width between the contour 510r of the ground plane 510 and the locus 511t of the filled laser beam 511, and reference numeral 512d is the interval between the contour 510r of the ground plane 510 and the locus 512t of the contour laser beam 512. Width. Reference numeral 511p denotes the interval width between the traces 511t of the filled laser beam 511.

  An interval width 511p of the locus 511t of the filled laser beam 511 is a predetermined width so as to be a predetermined depth, and is uniform everywhere. The smaller the gap width 511p between the traces 511t of the filled laser beam 511, the deeper the machining is performed. In the present processing example 2, processing is performed with a locus 511t different from the locus 501t of the filled laser beam 501 in FIG. 6 (processing example 1). Since the locus 501t in the processing example 1 has a larger number of divisions of the locus of the laser beam 511 to be filled than the locus 511t in the processing example 2, the number of times the laser beam is not irradiated increases, and the distance not irradiated with the laser beam is longer. When the laser beam is not irradiated, the scanner is stopped and moved to the next processing coordinate each time. If the processing conditions such as the scanner moving speed during processing are the same, the distance of the portion not irradiated with the laser beam Is shorter and the smaller the number is, the shorter the machining time is.

  Therefore, when the areas of the ground planes of the processing example 2 and the processing example 1 are the same, the processing example 2 shown in FIG. 7 has a shorter processing time than the processing example 1 shown in FIG. In the case of the processing example 2, as in the processing example 1, the relationship between the filled laser beam 511 and the interval width 511p and the radius of the contour laser beam 512 are set. As a result, the processing of the filled laser beam 501 and the processing of the contour laser beam 512 do not cause processing leakage of the ground plane 510 including the corner portion 511c. The filled laser beam 511 is a pulse laser, and the contour laser beam 512 is a CW laser.

  Since the locus 511t of the filled laser beam 511 moves and moves both in the vertical direction and the horizontal direction in the drawing, the interval of the laser beam pulse depending on the period and the moving speed when machining with the filled laser beam 511 is determined by the filled laser beam. If the value is equal to or close to the interval width 511p between the trajectories 511t of the beam 511, the ground plane 510 can be processed uniformly both in the vertical direction and in the horizontal direction.

  FIG. 7B is a cross-sectional view of the ground plane 510 taken along line I3-I3 in FIG. It can be seen that the portion of the ground plane 510 close to the contour 510r has a non-uniform processing depth eliminated to a three-step staircase shape as compared with FIG.

[Processing example 3]
FIG. 8 is a diagram illustrating a third working example. Processing example 3 is an example of processing along a contour with a plurality of laser beams having different sizes. In FIG. 8A, reference numeral 520 is a ground plane of drawing data, reference numeral 521 is a solid laser beam, reference numeral 522 is a contour laser beam (1), reference numeral 523 is a contour laser beam (2), and reference numeral 521t is black. The laser beam 521 has a locus 522t is the locus of the contour laser beam (1) 522, the locus 523t is the locus of the contour laser beam (2) 523, and the symbol 521d is the contour 520r of the ground plane 520 and the filled laser beam 521. 522d is the interval width between the contour 520r of the ground plane 520 and the contour laser beam (1) 522t, and 523d is the laser of the contour of the ground plane 520 and the contour laser 521t. Spacing width of the beam (2) 523 to the locus 523t, reference numeral 521p The spacing width between the trajectory 521t of the laser beam 521 of fill.

  In the case of the processing example 3, the shape of the contour laser beam (2) 523 is circular, and the interval width 523d between the contour 520r of the ground plane 520 and the locus 523t of the contour laser beam (2) 523 is the contour laser beam ( The radius may be equal to or not equal to the radius of 2), but is always constant. The shape of the contour laser beam (1) 522 is circular, and the interval width 522d between the contour 520r of the ground plane 520 and the locus 522t of the contour laser beam (1) 522 is the width of the contour laser beam (1) 522. It may or may not be equal to the radius, but is always constant. Either or both of the interval widths 523d and 522d may be half the diameter of the laser beam. Further, the interval widths 522d and 523d may be adjusted so that the depth of the portion near the contour 520r of the ground plane 520 becomes uniform. In the case of the processing example 3 as well, since the dimensional relationship is set as described above, the processing of the filled laser beam 521 and the processing of the contour laser beam (1) 522 and the contour laser beam (2) 523 are performed. No processing leakage occurs in the ground plane 520. The filled laser beam 521 is a pulse laser, and the contour laser beam (1) 522 and the contour laser beam (2) 523 are CW lasers. The number of trajectories along the contour 520r of the ground plane 520 may be one or plural.

  FIG. 8B is a cross-sectional view of the ground plane 520 taken along line I4-I4 in FIG. The ground plane 520 includes arcs at four corners (corner portions 520c), and the beam diameters are controlled (set) so that the diameters of the contour laser beam (1) 522 and laser beam (2) 523 are smaller than the diameter of the arc. ing. In this processing example 3, it can be seen that the processing depth in the portion near the contour 520r is more uniformly eliminated as compared with FIG. 7B. In the figure, the surface is still slightly uneven, but the unevenness is further eliminated by adjusting the size of the contour laser beam (1) 522 and laser beam (2) 523 or the energy (intensity) of the laser beam. It should be noted that the depth of the machining can be made more uniform because the plurality of tracks 522t and 523t along the contour 520r of the ground plane 520 can be finely adjusted in depth.

[Processing example 4]
FIG. 9 is a diagram showing a processing example 4. In FIG. 9A, reference numeral 560 is a ground plane of drawing data, reference numeral 561 is a filled laser beam, reference numeral 562 is a contour laser beam, reference numeral 561t is a locus of a filled laser beam 561, and reference numeral 562t is a contour laser beam. A trajectory 562, reference numeral 561d is an interval width between the contour 560r of the ground plane 560 and the outermost trajectory of the trajectory 561t of the filled laser beam 561, and a reference numeral 562d is an interval between the contour 560r of the ground plane 560 and the contour laser beam 561. The interval width between the locus 561t and the width of reference numeral 562p is the interval width between the locus 561t of the filled laser beam 561. The width of the gap width 562p is smaller than the diameter of the filled laser beam 561 by a predetermined value, and 562d and 561d are always a constant size from the contour 560r of the ground plane 560. In the processing example 4 as well, there is no processing leakage of the ground plane 560 due to the processing of the filled laser beam 561 and the processing of the contour laser beam 562 and the contour laser beam 562. The laser beam 561 is a pulse laser, and the laser beam 562 is a CW laser.

  FIG. 9B is a cross-sectional view of the ground plane 560 taken along line I5-I5. As can be seen from the figure, the processing depth of the ground plane 560 is still slightly uneven, but the size and energy of the filling laser beam and the contour laser beam, and the contour 560r of the ground plane 560 and the filling depth. When the distance 561d between the laser beam locus 561t is adjusted, the unevenness is further eliminated.

[Processing example 5]
FIG. 10 is a diagram illustrating a fifth processing example. In FIG. 10, reference numeral 580 is a ground plane of drawing data, reference numeral 581 is a filled laser beam, reference numeral 582 is a contour laser beam, reference numerals 581t1 and 581t2 are traces of the filled laser beam 581, reference numerals 582t1 and 582t2 are contours. The reference numeral 581d is the distance between the contour 580r of the ground plane 580 and the filled laser beam 581, and the reference numeral 582d is the contour 580r of the ground plane 580 and the trace 582t of the contour laser beam 582. The reference interval 581p is the interval between the traces 581t of the filled laser beam 581. As shown in FIG. 10, the ground plane 580 has a large notch 583, and the notch 583 divides the ground plane 580 into two parts 580A and 580B, and the locus 582t of the contoured laser beam 582 is also generated accordingly. It is divided into 582t1 and 582t2. The locus of the filled laser beam 581 is also divided into 581t1 and 581t2.

  In the ground plane 580 having such a shape, the contour laser beam 582 is one or plural (single in the drawing), the output of the second laser oscillator 101 of the filled laser beam 581, and the first of the contour laser beam 582. Between the outermost locus 581m and the contour 580r of the ground plane 580 in the output of the laser oscillator 100, the size of the filled laser beam 581, the size of the contour laser beam 582, and the locus 581t of the filled laser beam 581 An interval width 581d, an interval width 582d between the respective traces 582t1 and 582t2 of the contour laser beam 582t and the outline 580r of the ground plane 580, an interval width 581p between the traces of the filled laser beam, and a speed of moving the laser beam ( Scanning speed), filled laser beam is pulsed For over The pulsed laser pulse period, by adjusting the energy density of the laser beam at a predetermined depth, it can be uniformly processed.

  In the processing examples 1 to 5, the fill laser may be CW. When painting by this method, it takes time, but it is possible to process a surface with less unevenness.

  In this embodiment, the workpiece in the claims is denoted by reference numeral 109, the laser processing apparatus is denoted by reference numeral 1, the laser irradiation means is denoted by the scanner 107, the control means is denoted by the control apparatus 111, and the machining data generation means is denoted by the control apparatus 111. The contour information is composed of a collection of lines (line data), and is the surface data indicating the contour of the surface that is closed when connected, and the contour of the surface is the first in the contour 500r, 510r, 520r, 560r, 580r, Is processed by the laser 1 contour processing data generated in step S116b, and the size of the laser beam according to the first processing data is the contour laser beams 502, 512, 562, and the contour laser beam (1) 522. , The size of the laser beam (2) 523, two or more machining data generated for one surface is the contour laser beam (1) 522. In the processing data of the laser beam (2) 523, the distance set in advance is the interval widths 502d, 512d, 521d, 522d, 523d, 561d, 562d, and 582d, and the second processing data for filling the entire surface is generated in step S116a. In the laser 2 fill line processing data, the first laser beam is the laser beam 502, 512, 522, 523, 562 for processing the contour, and the second laser beam is the fill laser beam 501, 511, 521, 561. 581 corresponds to the depth of the part 410m from the workpiece surface.

  Furthermore, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention, and all the technical matters included in the technical idea described in the claims are all included. The subject of the present invention. The above embodiments and processing examples show preferred examples, but those skilled in the art will realize various alternatives, modifications, variations, and improvements from the contents disclosed in this specification. These are included in the technical scope described in the appended claims.

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 107 Scanner 109 Work 111 Control apparatus 500r, 510r, 520r, 560r, 580r Contour 501, 511, 521, 561, 581 Filled laser beam 502, 512, 522, 523, 562 Contour laser beam

Claims (3)

Laser irradiation means for irradiating the workpiece with the laser emitted from the laser oscillator;
Control means for controlling the laser irradiation means to perform laser scanning on the surface of the work and for controlling the processing of the work;
Machining data generating means for generating machining data for machining the workpiece used by the control means from drawing data relating to drawing of the workpiece;
A laser processing method in a laser processing apparatus comprising:
The processing data generating means generates processing data along a contour at a distance inside the half of the size of the laser beam used for processing from the contour based on the contour information of the surface,
The machining data is two machining data generated for one surface,
Based on the first machining data along the contour based on the contour information of the surface and the position inside the surface based on the contour information of the surface and away from a preset distance including 0 from the contour of the surface A laser processing method comprising: second processing data for filling the entire inner surface. The laser processing method according to claim 1,
The laser processing method, wherein the first laser beam based on the first processing data is a CW laser, and the second laser beam based on the second processing data is a pulse laser. The laser processing method according to claim 1,
The control means further includes
The distance between the trajectories of the second laser beam, the size of the first laser beam, the size of the second laser beam, the energy density of the first laser beam, and the energy density of the second laser beam Adjusting at least one of the scanning speed of the first laser beam, the scanning speed of the second laser beam, and the pulse laser pulse period of the second laser beam to make the processing depth uniform. A laser processing method for processing.