JP2013213248A - Spot plating device, and backup member for the spot plating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a spot plating device and a backup member for the spot plating device, capable of achieving stable high-quality spot plating in which a plating liquid does not stay while keeping adhesiveness and problems of "absence of plating" and "blur" are solved, in a spot plating of a long metal bar 3 obtained through punching in a predetermined shape, the shape of an electronic products such as a terminal and a connector; and to provide a backup member for the spot plating device.SOLUTION: Two or more backup members pressing and closely contacting at least a part 30 to be plated of a metal bar 3 to the outer peripheral part of a support drum 10 are disposed in parallel spacing from each other by a prescribed distance (W) in the width direction of the metal bar 3, and have a linear endless belt 41A composed by a belt rod 45 circulated while tightly wound around a plurality of support rollers. The linear endless belt 41A presses at least the part 30 to be plated of the metal bar 3 toward the outer peripheral part of the support drum 10.

Description

  The present invention relates to a spot plating apparatus for spot plating a noble metal on a long metal strip punched into a predetermined shape for manufacturing electronic parts such as terminals and connectors, and a backup member used in the spot plating apparatus. .

  Conventionally, long metal strips punched into a predetermined shape for manufacturing electronic parts such as terminals and connectors have been precious metal plated for the purpose of improving corrosion resistance, improving solderability, and preventing contact resistance deterioration. Applied. Gold is mainly used as a precious metal to be plated. However, since gold is expensive, spot plating for plating only on a necessary area of a portion to be plated is performed (for example, see Patent Document 1). ).

  FIG. 8 shows an example of a conventional spot plating apparatus 1A. In this example, the spot plating apparatus 1 </ b> A includes a resin support drum 10 and a plating solution ejection mechanism 20.

  The long metal strip 3 to be spot-plated is supplied from a supply-side device (not shown) to the resin-made support drum 10 and guided to the inlet-side guide roll 15a of the support drum 10 so as to support the drum. 10 is wound around a part of the outer peripheral portion of the support drum 10, and thereafter, is guided by the outlet side guide roll 15b of the support drum 10 and wound up by a winding side device (not shown).

  As shown in FIG. 3, the metal strip 3 is punched in two rows 30A1 and 30A2 in a symmetrical arrangement, for example, terminal-shaped members (parts to be plated) used as terminals of an electronic device. Two sets 30A and 30B are arranged vertically. Further, the carrier 3 (3a1, 3b1; 3a2, 3b2) is formed in the metal strip 3 at predetermined intervals along the longitudinal direction (longitudinal direction) of the metal strip 3 at both ends and the center in the vertical direction. As shown in FIG. 4, the carrier holes 3a1 and 3b1 engage with the protrusions 13 (13a1 and 13b1) provided on the outer peripheral surface of the support drum 10, respectively.

  In the above configuration, as shown in FIG. 8, the metal strip 3 conveyed along the outer periphery of the support drum 10 is fed from the plating solution ejection mechanism 20 through the plating hole 16 formed in the support drum 10. The metal strip 3 is spot-plated by supplying a plating solution.

  The plating hole 16 is a through hole provided in the surface of the support drum 10 so as to bring the plating solution into contact with the surface of the metal strip 3, and corresponds to the shape and size of the plating applied to the metal strip 3. ing.

  Further, as shown in FIG. 8, there is provided a pressing mechanism 40 including a backup belt 41 as a backup member stretched with a predetermined tension to press the metal strip 3 against the surface of the support drum. The metal strip 3 wound around the support drum 10 is pressed by the backup belt 41 from the outside direction, and as shown in FIG. 8, for example, in a close contact region where the central angle (θ) is about 45 degrees. It is comprised so that it may closely_contact | adhere to the outer peripheral surface of the support body drum 10. FIG. The belt 41 is made of a soft material such as vinyl chloride.

  Further, as described in Patent Document 1, in this example, as shown by a broken line in FIG. 8, the plating solution that has entered between the metal strip 3 and the belt 41 is placed on the belt 41 on the side in contact with the metal strip 3. In some cases, grooves 41a are provided in the width direction at a predetermined interval in order to escape. This is because if the plating solution enters between the metal strip 3 and the belt 41, the belt 41 easily slips, and the metal strip 3 is also displaced from the support drum 10 at that time, so that accurate plating cannot be performed. Therefore, the groove 41a is provided on the surface of the belt 41 that contacts the metal strip 3, and the plating solution that has entered between the grooves 41a is allowed to escape along the groove 41a to prevent the belt 41 from slipping.

JP 2006-283127 A

  However, according to the results of the inventor's research experiment, in the spot plating apparatus 1A having the above-described configuration shown in FIG. 8, the plating solution is used because the outer surface of the metal strip 3 is covered with the backup belt 41. The metal strip 3 could not be pulled out to the back side, and the plating solution stayed, so-called “plating omission” occurred.

  As described above, as described in Patent Document 1, the belt 41 on the side in contact with the metal strip 3 is moved in the width direction at a predetermined interval to release the plating solution that has entered between the metal strip 3 and the belt 41. In the configuration in which the groove 41a is provided, the “plating omission” cannot be significantly improved.

  Therefore, as shown in FIG. 9, in order to eliminate the slip between the metal strip 3 and the support drum 10, the backup belt 41 is arranged only in the carrier hole portions 3a2, 3b2 (see FIG. 3A) in the center. An attempt was made to press the support drum 10 and not cover the plated portion 30 (30A, 30B).

  In this method, the plating solution escapes to the back side of the metal strip 3, and there is no stagnation of the plating solution, and “plating omission” can be greatly improved. However, as shown in FIG. 10, the carrier hole region is held in close contact with the support drum 10, but the terminal shape portion 30 is lifted from the surface of the support drum as shown by the alternate long and short dash line, A space (v) is formed between the portion and the surface of the support drum.

  That is, in this configuration, only the carrier hole portion at the center is pressed against the support drum 10, so the plating solution escapes to the back side of the metal strip 3, but in the terminal-shaped portion 30 that is not pressed by the belt 41. Since the space portion (v) is formed between the terminal shape portion 30 and the support drum surface, the plating solution wraps around outside the predetermined region, and the terminal shape portion 30 is lifted from the support drum surface. It was found that “smear” occurred.

  Therefore, the object of the present invention is to spot plating in a long metal strip punched into a predetermined shape such as a terminal or connector of an electronic product, while maintaining the adhesion performance, the plating solution does not stay, An object of the present invention is to provide a spot plating apparatus and a backup member for a spot plating apparatus that can solve the problems of “missing plating” and “bleed” and enable stable and high quality spot plating.

The above object is achieved by the spot plating apparatus and the backup member for spot plating apparatus according to the present invention. In summary, according to the first aspect of the present invention, a long metal strip having a predetermined shape to be plated repeatedly formed in the longitudinal direction is wound along a part of the outer peripheral portion of the support drum, and By rotating and moving together with the support drum, a plating solution is supplied from the inside of the support drum to a predetermined plating area of the plated portion of the metal strip through a plating hole formed in the support drum. In the spot plating apparatus for spot plating in a predetermined plating area of the plated portion of the metal strip, in order to press and adhere at least the plated portion of the metal strip to the outer peripheral portion of the support drum, the support body A backup member wound around at least a part of the outer periphery of the metal strip wound around the drum and moving in the rotation direction of the support drum together with the metal strip;
A plurality of endless wires that are arranged in parallel to each other in the width direction of the metal strip and spaced apart from each other by a predetermined distance (W). Have a belt,
The linear belt presses at least the plated portion of the metal strip against the outer peripheral portion of the support drum;
A backup member for a spot plating apparatus is provided.

According to one embodiment of the first invention, the width of the belt wire along the width direction of the linear belt is Dw, and the thickness of the belt wire in the direction perpendicular to the width direction of the linear belt. The length of the metal strip in the width direction of the metal strip is H, and the plating hole diameter of the support drum is Dd.
The distance (W) between the belt wires and the length (H) of the plated portion are:
W <(1/2) · H
It is.

According to another embodiment of the first invention, the line width (Dw) of the belt wire and the hole diameter (Dd) of the plating hole are:
Dw <(1/2) · Dd
It is.

According to another embodiment of the first invention, the thickness (Dt) of the belt wire and the distance (W) between the belt wires are:
Dt <3 ・ W
It is.

According to another embodiment of the first invention, the distance (W) between the belt wires and the plating hole diameter (Dd) of the support drum are:
W <(1/2) · Dd
It is.

  According to another embodiment of the first invention, the belt wire is made of PEEK resin, polyester resin, fluororesin, acrylic resin, polypropylene resin, aramid resin, polyarylate resin, PBO resin, polyphenylene sulfide (PPS) resin. Or made of polyimide resin.

  According to another embodiment of the first aspect of the present invention, the length (H) of the metal strip in the width direction of the plated portion of the metal strip is 1 to 5 mm, and the plating hole diameter of the support drum ( Dd) is 0.5-2 mm.

According to the second aspect of the present invention, a long metal strip in which a predetermined-shaped plated portion is repeatedly formed in the long direction is wound along a part of the outer peripheral portion of the support drum, together with the support drum. The metal strip is rotated and moved, and a plating solution is supplied from the inside of the support drum to a predetermined plating area of the plated portion of the metal strip through a plating hole formed in the support drum. In a spot plating apparatus that performs spot plating on a predetermined plating area of a portion to be plated,
In order to press and adhere at least the plated portion of the metal strip to the outer peripheral portion of the support drum, it is wound around at least a part of the outer peripheral portion of the metal strip wound around the support drum, A backup member that moves in the rotational direction of the support drum together with the metal strip,
A spot plating apparatus is provided in which the backup member is a backup member having any one of the above configurations.

  According to an embodiment of the second aspect of the present invention, the support roller disposed at the entrance to and from the support drum of at least the linear belt among the plurality of support rollers that circulate and move by winding the linear belt. Are formed with guide grooves for separating the belt wires from each other by a predetermined distance (W).

  According to the present invention, in spot plating on a long metal strip punched into a predetermined shape such as a terminal or a connector of an electronic product, the plating solution does not stay while maintaining the adhesion performance. It solves the problem of “missing” and “bleeding” and enables stable and high quality spot plating.

It is a perspective view which shows schematic structure of one Example of the spot plating apparatus which concerns on this invention, and the backup member for spot plating apparatuses. It is a longitudinal cross-sectional view of a spot plating apparatus. FIG. 3A is a plan view of an embodiment of the metal strip, and FIG. 3B is an enlarged view of a portion to be plated of the metal strip. It is a perspective view of one Example of a support body drum. It is a figure explaining the relationship between the plating hole of a support body drum, the to-be-plated part of a metal strip, and the opening part of a backup belt. It is a figure explaining the structure of a backup belt. It is a figure explaining the structure of a support roller. It is a perspective view which shows schematic structure of the conventional spot plating apparatus. It is a perspective view which shows schematic structure of the conventional spot plating apparatus. It is a figure for demonstrating the problem of the conventional spot plating apparatus.

  Hereinafter, the spot plating apparatus according to the present invention will be described in more detail with reference to the drawings.

Example 1
1 and 2 show a schematic overall configuration of an embodiment of a spot plating apparatus 1 according to the present invention. In the present embodiment, as shown in FIG. 3, the spot plating apparatus 1 has a predetermined position (plating area) 31 m of the metal strip 3 formed by repeatedly punching the plated portion 30 having a predetermined shape in the longitudinal direction. , 32m, and 33m will be described as an apparatus that performs gold plating, for example, but is not limited thereto.

(Overall configuration of plating equipment)
Referring to FIGS. 1 and 2, the spot plating apparatus 1 of the present embodiment is similar to the conventional apparatus in that a support drum 10, a plating solution ejection mechanism 20, a plating tank 5 in which a plating solution is stored, It has.

  The long metal strip 3 to be spot plated is supplied from a supply side device (not shown) to the support drum 10 and guided to the inlet side guide roll 15a of the support drum 10 so as to be the outer periphery of the support drum 10. It is wound around at least a part of the section, and is then guided by the outlet side guide roll 15 b of the support drum 10 and wound around the winding side device 130.

  The metal strip 3 is an elongated strip-shaped long metal member whose surface is subjected to spot plating, and is formed of a metal material such as a copper alloy or stainless steel. Usually, the metal strip 3 is a strip having a width of 10.0 to 50.0 mm perpendicular to the longitudinal (longitudinal) direction and a thickness of 0.1 to 0.5 mm.

  As shown in FIGS. 3A and 3B, the metal strip 3 used in this embodiment has two rows 30A1 due to the symmetrical arrangement of terminal-shaped members (parts to be plated) 30 used as terminals of an electronic device, for example. , 30A2 are repeatedly punched along the longitudinal direction of the metal strip 3, and in this embodiment, two sets 30A and 30B are arranged on the top and bottom. The metal strip 3 is provided with carrier holes 3 (3a1, 3a2; 3b1, 3b2) at a predetermined interval P along the longitudinal direction of the metal strip 3, and in this embodiment, the carrier holes 3a1, 3b1 engages with protrusions (hereinafter referred to as “guide pins”) 13 (13a1, 13b1) provided at predetermined intervals P on the outer peripheral surface of the support drum 10 shown in FIG. The carrier holes 3a2, 3b2 are holes used when the metal strip 3 is press-formed.

  In the present embodiment, as shown in FIG. 3B, the portion to be plated 30 is a U-shaped terminal piece 31, 32 and a protruding piece protruding from the connecting portion 33 a of the terminal piece 31, 32. 33. The plating area of the portion 30 to be plated is the terminal pieces 31 and 32 shown hatched in FIG. 3B and the outer tip portions 31m, 32m, and 33m of the protruding piece 33. These end plating portions constitute a lead portion and a contact portion when they are used as electronic component terminals.

  In this embodiment, the specific dimensions are as follows: the maximum length L1 of the portion 30 to be plated in the longitudinal direction of the metal strip 3 is 2 to 20 mm, the length L2 of the terminal pieces 31 and 32 is approximately 1 to 18 mm, The width direction length H of the plating part 30 was 1-5 mm. However, the dimension is not limited to this dimension, and it may be a portion to be plated 30 having a smaller dimension, for example, approximately one tenth of the above dimension.

  The metal strip 3 is connected to an electrode (not shown) to serve as a cathode.

(Support drum)
As described above, the support drum 10 is wound and supported while the metal strip 3 is in close contact with the outer periphery thereof. The material for the support drum 10 is required to have low thermal expansion, corrosion resistance, electrical insulation, moderate strength, and light weight. As the material of the support drum 10, a resin such as PPS can be used.

  As can be understood with reference to FIGS. 1 and 2, the support drum 10 has a cylindrical outer peripheral surface and is provided with a bearing portion 12 at the center. Further, flanges 11 are formed on both side edges of the outer periphery of the support drum 10.

  The support drum 10 is rotatably supported with respect to the plating apparatus main body 100 by fitting the bearing portion 12 to a support shaft 101 fixed to the plating apparatus main body 100.

  As shown in FIG. 4, the support drum 10 has a plurality of guide pins 13 (13 a 1, 13 b 1) along the circumferential direction on the outer peripheral surface, and a plurality of plating holes in two rows in the circumferential direction. 16 (16a1, 16b1, 16c1, 16a2, 16b2, 16c2) are provided. The guide pins 13 are formed at both sides in the width direction of the support drum 10 at a predetermined interval P along the circumferential direction, and are fitted into carrier holes 3 (3a1, 3b1) provided in the metal strip 3. Then, the metal strip 3 is accurately fixed at a predetermined position on the surface of the support drum, and the support drum 10 is rotated by winding the metal strip 3 by the winding side device 130.

  The plating hole 16 of the support drum 10 is a through hole provided in the surface of the support drum 10 in order to bring the plating solution into contact with the surface of the metal strip 3, and is shown in FIGS. As shown, it corresponds to the shape and size of the plating areas 31m (31m1, 31m2), 32m (32m1, 32m2), 33m (33m1, 33m2) of the terminal-shaped member (the portion to be plated) 30 of the metal strip 3. .

  That is, in this embodiment, as shown in FIGS. 4 and 5, the plating hole 16 has two through holes 16c (16c1, 16c2) in the circumferential direction of the support drum 10 in accordance with the shape of the terminal. A set of six through holes including four circular through holes 16a (16a1, 16a2) and 16b (16b1, 16b2) formed on the downstream side in the rotation direction of the support drum 10 from the through holes 16c. The holes 16a1 to 16c1 and 16a2 to 16c2 correspond to the plating areas 31m, 32m, and 33m of the terminal-shaped portion 30 of the metal strip 3, that is, the plating areas 31m (31m1, 31m2), 32m (32m1, 32m2), and 33m. Corresponding to (33m1, 33m2), the support drum 10 is repeatedly formed at predetermined intervals in the circumferential direction.

  As shown in FIGS. 3A, 3 </ b> B, and 5, the two circular through holes 16 c <b> 1 and 16 c <b> 2 are formed by the respective sets of through holes 16 a <b> 1 to 16 c <b> 1 and 16 a <b> 2 to 16 c <b> 2 formed in the support drum 10. Corresponding to the end plating portions 33m1, 33m2 of the terminal-shaped portion 30 of the first row and the second row 30A1, 30A2, and the other four circular through holes 16a1, 16b1, and 16a2, 16b2, The two end plating portions 31m1 and 32m1 in the row 30A1 and the two end plating portions 31m2 and 32m2 in the second row 30A2 correspond to the two. Therefore, the end plating portions 33m1 and 33m2 of the terminal shape portions of the first row and the second row 30A1 and 30A2 are plated with the plating solution ejected from the two circular through holes 16c1 and 16c2, and the other four circular penetration holes are plated. With the plating solution ejected from the holes 16a1, 16b1, 16a2, and 16b2, the two end plating portions 31m1 and 32m1 in the first row and the two end plating portions 31m2 and 32m2 in the second row are plated. become. The hole diameter (Dd) of the plating hole 16 of the support drum 10 is changed in accordance with the sizes of the plated portions 31m, 32m, and 33m of the metal strip 3, but in this embodiment, 0.2 to 1.0 mm. It was said. However, it is not limited to this.

(Plating solution ejection mechanism)
Next, the plating solution ejection mechanism 20 will be described with reference to FIGS.

  According to the present embodiment, the plating solution ejection mechanism 20 is disposed inside the support drum 10. The plating solution ejection mechanism 20 ejects the plating solution toward the outer peripheral wall surface of the support drum 10, brings the plating solution into contact with the surface of the metal strip 3 through the plating hole 16 of the support drum 10, and was ejected. It serves as an electrode that supplies current to the plating solution.

  In the plating solution ejection mechanism 20, as schematically shown in FIG. 1, the plating solution is supplied from a supply pipe 22 to a plating solution ejection tank 21 that is a semicircular box. As shown in FIG. 2, the plating solution is supplied from an ejection port (nozzle) 24 formed in a semicircular injection plate 23 of the plating solution ejection tank 21 facing the support drum 10, that is, inside the support drum 10. Is sprayed through the plating hole 16 of the support drum 10 to the spot portions (plating areas) 31m (31m1, 31m2), 32m (32m1, 32m2), 33m (33m1, 33m2) of the plated portion 30 of the metal strip 3. The The injection plate 23 is made of a conductive metal material and functions as an electrode (anode).

(Pressing mechanism)
The spot plating apparatus 1 has a pressing mechanism 40. The pressing mechanism 40 includes a backup member 41 that presses the metal strip 3 wound around a part of the outer peripheral portion of the support drum 10 from the outside and presses the metal strip 3 against the support drum 10. . In this embodiment, the backup member 41 is a belt-like backup stretched with a predetermined tension so as to press against at least a part of the circumferential portion of the metal strip 3 wound around the support drum 10. The member, that is, the backup belt 41 (41A1, 41B, 41A2) is used. Thereby, the metal strip 3 is brought into close contact with the support drum 10. The region where the metal strip 3 is in close contact with the support drum 10 is about 45 degrees at the central angle (θ) of the support drum 10. Moreover, a plating solution is sprayed with respect to this contact | adherence area | region. The backup belt 41 will be further described later.

  As shown in FIG. 1, in this embodiment, the pressing mechanism 40 is located in the same horizontal plane as the support drum 10 and is a plurality of support rollers disposed at predetermined positions closer to the support drum 10 side, that is, First roller sets 42a and 42a and second roller sets 42b and 42b disposed on the opposite side of the support drum 10 at a predetermined distance from the first roller sets 42a and 42a are provided. The backup belt 41 is attached by winding first and second roller sets 42a, 42a; 42b, 42b. The first roller sets 42a and 42a are arranged such that the rollers 42a and 42a are located on both sides of the support drum 10, and can move in the horizontal direction while being separated from and in contact with the support drum 10. It is said. When the metal strip 3 is wound around and attached to the support drum 10, the first roller sets 42 a and 42 a move to the left in FIG. 1 to separate the backup belt 41 from the support drum 10, and the metal strip 3 When pressing 3 to the surface of the support drum, it moves to the right in FIG. In order to adjust the tension of the backup belt 41, a pulley 43 that can move in the horizontal and horizontal directions in FIG. 1 is provided.

(Backup material)
Next, the backup belt 41 as a backup member that characterizes the present invention will be described.

  In this embodiment, as shown in FIGS. 1 and 6, the backup belt 41 has at least a predetermined shape portion of the metal strip 3, that is, in order to closely adhere the portion to be plated 30 to the outer peripheral surface of the support drum 10. An endless linear belt 41A (41A1, 41A2) that presses the plated portion 30 of the metal strip 3 against the outer peripheral portion of the support drum 10, and the central portion in the width direction of the metal strip 3 where the plated portion 30 is not formed The endless belt belt 41B that presses the carrier hole portions 3a2, 3b2 (see FIG. 3) against the outer peripheral portion of the support drum 10. Of course, the backup belt 41 is entirely constituted by the linear belt 41A, and the belt-like belt 41B may not be used.

  In this embodiment, as described above, the backup belt 41 is stretched and wound around the plurality of support rollers 42a and 42b, the pulley 43, and the like. In particular, in this embodiment, each of the linear belts 41A (41A1, 41A2) is wound around at least a part of the outer periphery of the support drum 10 and rotates together with the support drum 10, as shown in FIG. The two rows of plated portions 30 (30A, 30B) of the metal strip 3 are pressed against the surface of the support drum.

  The linear belt 41A (41A1, 41A2) of the backup belt 41 that characterizes the present invention will be described. Since the linear belts 41A1 and 41A2 have the same configuration, the linear belts 41A are collectively referred to as the linear belt 41A unless they need to be distinguished from each other. Since the belt-like belt 41B has the same configuration as the conventional one, a detailed description thereof is omitted here.

  Referring also to FIGS. 5A and 5B, the linear belt 41A separates a plurality of endless wires, that is, the belt wire 45 by a predetermined distance (W) in the width direction of the metal strip. Are arranged in parallel with each other and are wound around a plurality of support rollers so as to circulate. Accordingly, an opening 46 is formed between the belt wires. The size (gap width W) of the opening 46 may be constant, or may be a different gap width (W) appropriately adjusted according to the shape and dimensions of the portion 30 to be plated. As will be described in detail later, the gap width (W) is set to a preferable value depending on the size and shape of the plating hole and the belt wire 45, but the minimum width is usually 0.2 due to manufacturing problems. About 0.5 mm.

  As shown in FIGS. 5B and 5C, the cross-sectional shape of each belt wire 45 can be an elliptical shape, a rectangular shape, a circular shape, or the like.

  In the present specification, as described above, the space between the belt wires along the width direction of the linear belt 41A is referred to as an inter-wire opening 46, and the dimension of the opening 46, that is, each belt wire. The interval between them is called the width (W) of the opening 46. Further, as shown in FIGS. 5B and 5C, the dimension of the belt wire 45 along the width direction of the linear belt 41A is orthogonal to the width (Dw) of the wire belt and the width direction of the linear belt 41A. The dimension of the belt wire 45 in the direction to be referred to is the wire thickness (Dt).

  According to the present invention, the linear belt 41A, that is, each belt wire 45, has sufficient flexibility and flexibility to press the metal strip 3 against the cylindrical surface of the support drum 10 so as to be in close contact therewith. It is produced with the wire which is. Further, when the linear belt 41A is wound around the support drum 10 and rotated together with the support drum, the adjacent belt wires 45, 45 are shown in FIGS. 5 (a), 5 (b), and 6, respectively. Thus, an opening 46 as a plating solution escape hole is formed corresponding to the plating hole 16 formed in the support drum 10.

  Therefore, it is important that each belt wire 45 in the linear belt 41 </ b> A does not shift in the width direction of the linear belt 41 while being wound around the support drum 10. Accordingly, in the present embodiment, among the plurality of support rollers that circulate and move while the backup belt 41 is stretched and wound around, at least the support roller 42a disposed at the entrance / exit of the linear belt 41A with respect to the support drum 10 is shown in FIG. As shown in the figure, it is preferable to form a guide groove 42g for separating the belt wires 45 of the linear belt 41A at a predetermined distance. Of course, as shown in FIG. 1, a guide groove may be similarly provided in the support roller 42b and the like.

  In the present embodiment, in the region of the support roller 42 a around which the linear belts 41 </ b> A <b> 1 and 41 </ b> A <b> 2 are wound, the concave groove 42 g having a dimension corresponding to the cross section of the belt wire 45 is formed. Of course, the region where the belt-like belt 41B is wound is formed in the wide guide groove 42h having the belt-like belt width.

  As described above, the opening 46 formed between the belt wires in the linear belts 41A1 and 41A2 allows the plating solution sprayed from the plating hole 16 to the metal strip 3 to escape from the support drum 10 to the outside. It is a plating hole (opening) continuous in the longitudinal direction of the metal strip 3 to be taken out and corresponds to the position and size of the plating hole 16 formed in the support drum 10. It corresponds to the position and shape of the plating areas 31m (31m1, 31m2), 32m (32m1, 32m2), and 33m (33m1, 33m2) of the terminal-shaped member (part to be plated) 30 to be applied.

  Thus, by using the linear belt 41A (41A1, 41A2) composed of the flexible belt wire 45 as a backup member, the portion to be plated 30 of the metal strip 3 is pressed against the surface of the support drum. In addition, the backup belt 41 is formed with plating solution holes (openings) 46 corresponding to the plating holes 16 a, 16 b, 16 c of the support drum 10. Therefore, the plating solution sprayed from the support drum 10 side to the metal strip 3 is made outward through the plating solution hole (opening) 46 formed in the linear belt 41A, that is, in contact with the metal strip 3. It can escape to the belt outer surface side which is not done in the jetting direction.

  Therefore, according to the present invention, the plating solution is to be plated 30 of the metal strip 3 due to poor adhesion between the metal strip predetermined shape portion (plated portion) 30 and the surface of the support drum, which is a conventional problem. It is possible to avoid the problem of sneaking into areas other than the plating area and causing so-called “bleeding”. Furthermore, the problem of “plating omission (no plating)” caused by the retention of the plating solution caused by the plating solution not coming out of the belt 41 pressing the metal strip 3 is prevented. Can do.

  In the present invention, in particular, preferred embodiments of the width (W) of the opening 46 between the belt wires of the linear belt 41A, the width (Dw) of the belt wire 45, and the thickness (Dt) of the belt wire 45 of the backup belt 41 in the present invention. Will be described in detail later.

  The backup belt 41 is to which the plating solution adheres and is required to have acid resistance and softness (flexibility, flexibility). For example, the minimum dimension of the width (Dw) of the belt wire 45 and the thickness (Dt) of the belt wire 45 is about 10 μm from the viewpoint of manufacturing, strength, and the like, and accordingly, Dw = 0. 01 to 0.6 mm, preferably 0.1 to 0.5 mm, Dt = 0.01 to 0.6 mm, preferably 0.1 to 0.5 mm, and a synthetic resin material can be used. it can. Examples of the resin material include PEEK (polyether ether ketone) resin, polyester resin, fluorine resin, acrylic resin, polypropylene resin, aramid resin, polyarylate resin, PBO resin, polyphenylene sulfide (PPS) resin, polyimide resin, and the like. .

  Next, in the present invention, in particular, the width (W) of the opening 46 between the wires of the linear belt 41A, the width (Dw) of the belt wire 45, and the thickness (Dt) of the belt wire 45 of the backup belt 41 A preferable aspect with the opening size (hole diameter Dd) of the plating hole 16 will be described.

  The inventor conducted many experiments using the plating apparatus described below, and the width (W) of the opening 46 between the wires of the linear belt 41A, the width (Dw) of the belt wire 45, and the belt wire 45. The relationship between the thickness (Dt) of the metal and the opening size (hole diameter Dd) of the plating hole 16 was examined. The experimental results are shown in Table 1.

The conclusions obtained from the experimental results are summarized as follows.
(Condition 1) The width (W) of the wire-to-wire opening 46 of the linear belt 41A is less than ½ of the width direction length (H) of the plated portion 30 of the metal strip 3 (that is, W <( 1/2) · H). When the width (W) of the opening 46 between the wire rods of the linear belt 41A is 1/2 or more of the width direction length (H) of the plated portion 30 of the metal strip 3, there is no effect of pressing, and bleeding is likely to occur. Become.
(Condition 2) The line width (Dw) of the belt wire 45 is set to be less than 1/2 of the hole diameter (Dd) of the plating hole 16 (that is, Dw <(1/2) · Dd). When the line width (Dw) of the belt wire 45 is ½ or more of the hole diameter (Dd) of the plating hole 16, the plating hole 16 is blocked, and bleeding and plating loss are likely to occur.
(Condition 3) The thickness (Dt) of the belt wire 45 is less than three times the width (W) of the opening 46 between the wires of the linear belt 41A (that is, Dt <3 · W). When the thickness (Dt) of the belt wire 45 is three times or more the width (W) of the opening 46 between the wires of the linear belt 41A, the plating solution stays and bleeding is likely to occur.
(Condition 4) The width (W) of the opening 46 between the wires of the linear belt 41A is set to be less than ½ of the hole diameter (Dd) of the plating hole 16 (that is, W <(1/2) · Dd). When the width (W) of the wire-to-wire opening 46 of the linear belt 41A is 1/2 or more of the hole diameter (Dd) of the plating hole 16, there is no pressing effect, and bleeding tends to occur.

(Description of operation of plating equipment)
First, the operation mode and specifications of the plating apparatus 1 used in this experiment will be described.

  In FIG. 1, the first roller sets 42a and 42a in the first and second roller sets 42a and 42a; 42b and 42b to which the backup belt 41 of the pressing mechanism 40 is attached are moved in the left direction. Next, the elongated metal strip 3 is wound around the support drum 10 by fitting the carrier holes 3a1, 3b1 to the guide pins 13a1, 13b1 provided on the drum body 13 via the guide rollers 15a, 15b. The end of 3 is locked to the winding side device 130. At this time, the metal strip 3 is wound by adjusting so that the plating portions 31m, 32m, and 33m of the metal strip 3 coincide with the positions of the plating holes 16a, 16b, and 16c formed in the support drum 10.

  Then, the first roller sets 42a, 42a are moved in the right direction, the backup belt 41 is wound around the support drum 10, and the metal strip 3 is pressed from the outside direction by the backup belt 41, and the surface of the support drum 10 is Adhere closely. At this time, as shown in FIG. 5 (a), the opening (plating hole) 46 of the linear belt 41A (41A1, 41A2) of the backup belt 41 is provided with the plating portions 31m, 32m, 33m of the metal strip 3 and the support. The body drum 10 is wound so as to coincide with the positions of the plating holes 16a, 16b, and 16c.

  Therefore, according to the plating apparatus 1 configured as described above, when the support drum 10 and the backup belt 41 are rotationally driven by the movement of the metal strip 3, the plating holes 16a, 16b, 16c of the support drum 10 and the metal are always driven. As shown in FIG. 5A, the plating portions 31m, 32m, and 33m of the strip 3 and the opening portion (plating hole) 46 of the backup belt 41 coincide with each other.

  As described above, when the winding of the metal strip 3 and the backup belt 41 around the support drum 10 is completed, the plating solution is supplied to the plating solution tank 21 through the supply pipe 22, and the plating solution is supplied from the opening 24 of the injection plate 21. Erupt vigorously. Then, current is passed with the injection plate 21 as a positive and the metal strip 3 as a negative. Since the sprayed plating solution is always in contact with the metal strip 3 at this time, current flows through the plating solution, and metal ions in the plating solution adhere to the surface of the metal strip 3 from the plating hole 16 to perform plating. It is. The ejected plating solution escapes from the plating solution hole (belt wire opening) 46 of the backup belt 41 to the outside, falls into the plating tank 5 and is again supplied by a supply pump (not shown). It is sent to the ejection tank 21.

  The metal strip 3 is sequentially wound and collected by a winding side device 130 driven by a motor (not shown). The support drum 10 and the backup belt 41 are also rotated through the metal strip 3 by driving the winding side device 130. Therefore, the winding speed of the metal strip 3 is such that the plating is completed while the metal strip 3 is in contact with the surface of the drum body 13.

The spot plating conditions in the plating treatment using the apparatus of this experimental example performed to obtain the results of Table 1 were as follows.
Support drum (10) Material: PPS Diameter: 300mm
Diameter (Dd) of plating hole (16a, 16b, 16c): As shown in Table 1. Metal strip (3) Material: C5240R (phosphor bronze) Width: 20.8mm Thickness: 0.12mm
・ Linear belt (41A)
Material of belt wire (45): as described in Table 1 Width (W) of opening (46), wire width (Dw), wire thickness (Dt): as described in Table 1. Liquid volume 50L
・ Temperature 60 ℃
・ Flow rate 20 ~ 100L / min
・ Current 0.3-2.0A
・ L / S (metal feed rate) 2.5-15 m / min
・ Au (gold plating solution) concentration 8g / L

Consideration of Experimental Results Experimental Examples 1 to 13 are experimental examples configured according to the present invention, and at least the occurrence of no plating is avoided. Experimental Examples 14 to 17 were comparative examples, and bleeding and no plating occurred. That means

(1) From Experimental Examples 1 to 13, it can be understood that the occurrence of bleeding and non-plating can be avoided by satisfying the above-described condition 1 corresponding to the size (H) of the portion 30 to be plated.
In Experimental Example 5, the condition 1 is satisfied, but the condition 2 is not satisfied, and when the size (H) of the portion to be plated 30 is a small size (1 mm), bleeding and no plating are performed. Indicates that there is an occurrence.

(2) In Experimental Examples 7 and 8, the size (H) of the portion to be plated 30 is relatively large (2 mm) and satisfies Condition 1, but does not satisfy Conditions 2 and 4, It shows that bleeding and no plating occur.
In Experimental Example 10, the size (H) of the portion to be plated 30 is relatively large (2 mm) and large (5 mm) and satisfies the condition 1, but does not satisfy the conditions 2 and 3, and is blurred. Indicates that there is an occurrence.

(3) By satisfying all of the above-mentioned conditions 1 to 4 from Experimental Examples 1, 2, 12, and 13, no bleeding or non-plating occurs regardless of the size (H) of the portion 30 to be plated. I understand that.

As mentioned above, according to the present invention,
(Condition 1) The width (W) of the opening 46 between the wire rods of the linear belt 41A is less than ½ of the width direction length (H) of the plated portion 30 of the metal strip.
(Condition 2) The line width (Dw) of the belt wire 45 is set to be less than ½ of the hole diameter (Dd) of the plating hole 16.
(Condition 3) The thickness (Dt) of the belt wire 45 is less than three times the width (W) of the inter-wire opening 46 of the linear belt 41A.
(Condition 4) The width (W) of the wire-to-wire opening 46 of the linear belt 41A is less than ½ of the hole diameter (Dd) of the plating hole 16.
Among these conditions, it is particularly important to satisfy Condition 1. As a result, “plating omission” is eliminated, and “bleeding” is reduced, and stable spot plating can be performed.

  Furthermore, in accordance with the size (H) of the portion 30 to be plated, by satisfying the above conditions 1 to 4 in combination with the above conditions 2 to 4, the “plating omission” is eliminated, and “smear” is It is possible to reduce and to perform stable spot plating.

  In the above embodiment, the metal strip 3 is described as being subjected to gold plating, but it is naturally possible to carry out similarly to gold plating, silver plating, nickel plating, tin plating and the like.

  Further, the spot plating apparatus 1 of the present embodiment is configured such that the rotating shaft 101 of the support drum 10 is arranged vertically, but the spot plating apparatus is arranged so that the rotating shaft 101 is horizontal. You can also. The spot plating apparatus having such a configuration can also exhibit the same operational effects as in the case of the above embodiment.

DESCRIPTION OF SYMBOLS 1 Spot plating apparatus 3 Metal strip 3a1, 3a2, 3b1, 3b2 Carrier hole 10 Support drum 13 (13a1, 13b1) Protrusion part (guide pin)
16 (16a, 16b, 16c) Through hole (plating hole)
20 Plating Solution Ejecting Mechanism 21 Injection Plate 30 Predetermined Shape Member (Plating Part)
31m, 32m, 33m Plating area 41 Backup belt (backup member)
41A (41A1, 41A2) Linear belt 41B Belt belt 45 Belt wire 46 Opening (plating solution hole)
DESCRIPTION OF SYMBOLS 100 Main body 101 Rotation support shaft 130 Winding side device

Claims (9)

A long metal strip having a predetermined shape to be plated repeatedly formed in the longitudinal direction is wound around a part of the outer peripheral portion of the support drum and rotated together with the support drum, and the metal strip is covered. A plating solution is supplied from the inside of the support drum to a predetermined plating area of the metal strip to a predetermined plating area of the metal strip by supplying a plating solution from the inside of the support drum through a plating hole formed in the support drum. In a spot plating apparatus for spot plating, in order to press and adhere at least the portion to be plated of the metal strip to the outer peripheral portion of the support drum, the outer periphery of the metal strip wound around the support drum A backup member wound around at least a part and moving in the rotational direction of the support drum together with the metal strip,
A plurality of endless wires that are arranged in parallel to each other in the width direction of the metal strip and spaced apart from each other by a predetermined distance (W). Have a belt,
The linear belt presses at least the plated portion of the metal strip against the outer peripheral portion of the support drum;
A backup member for a spot plating apparatus. The width of the belt wire along the width direction of the linear belt is Dw, the thickness of the belt wire in the direction orthogonal to the width direction of the linear belt is Dt, and the plated portion of the metal strip When the length in the width direction of the metal strip is H and the plating hole diameter of the support drum is Dd,
The distance (W) between the belt wires and the length (H) of the plated portion are:
W <(1/2) · H
The backup member for a spot plating apparatus according to claim 1, wherein the backup member is a backup member. The wire width (Dw) of the belt wire and the hole diameter (Dd) of the plating hole are:
Dw <(1/2) · Dd
The backup member for a spot plating apparatus according to claim 2, wherein the backup member is a backup member. The thickness (Dt) of the belt wire and the distance (W) between the belt wires are:
Dt <3 ・ W
The backup member for a spot plating apparatus according to claim 2 or 3, wherein the backup member is a backup member. The distance (W) between the belt wires and the plating hole diameter (Dd) of the support drum are:
W <(1/2) · Dd
The backup member for a spot plating apparatus according to any one of claims 2 to 4, wherein the backup member is a spot plating apparatus.   The belt wire is made of PEEK resin, polyester resin, fluororesin, acrylic resin, polypropylene resin, aramid resin, polyarylate resin, PBO resin, polyphenylene sulfide (PPS) resin, or polyimide resin. The backup member for a spot plating apparatus according to any one of claims 1 to 5.   The length (H) of the metal strip in the width direction of the plated portion of the metal strip is 1 to 5 mm, and the plating hole diameter (Dd) of the support drum is 0.5 to 2 mm. The backup member for a spot plating apparatus according to any one of claims 2 to 6. A long metal strip having a predetermined shape to be plated repeatedly formed in the longitudinal direction is wound around a part of the outer peripheral portion of the support drum and rotated together with the support drum, and the metal strip is covered. A plating solution is supplied from the inside of the support drum to a predetermined plating area of the metal strip to a predetermined plating area of the metal strip by supplying a plating solution from the inside of the support drum through a plating hole formed in the support drum. In spot plating equipment for spot plating,
In order to press and adhere at least the plated portion of the metal strip to the outer peripheral portion of the support drum, it is wound around at least a part of the outer peripheral portion of the metal strip wound around the support drum, A backup member that moves in the rotational direction of the support drum together with the metal strip,
The said backup member is a backup member as described in any one of Claims 1-7, The spot plating apparatus characterized by the above-mentioned.   The support roller disposed at least at the entrance / exit of the linear belt to the support drum among the plurality of support rollers that circulate and move while the linear belt is stretched and wound around each belt wire of the linear belt. The spot plating apparatus according to claim 8, wherein a guide groove is formed to be separated by a distance (W).

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