JP2013211695A - Imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imaging apparatus capable of having a low height while eliminating interference between an optical element and a bonding wire.SOLUTION: A support plate part 15b is disposed in a position overlapping with a wire W as seen in an optical axis orthogonal direction. Therefore, the support plate part 15b can be positioned nearer to an imaging element 11, thereby lowering a height. On the other hand, the support plate part 15b is disposed in the position not overlapping with a wire W as seen in an optical axis direction. Therefore, an interference between the support plate part 15b and the wire W can be effectively eliminated.

Description

  The present invention relates to a small image pickup apparatus using an image pickup element such as a CCD image sensor or a CMOS image sensor.

  In recent years, with the widespread use of mobile terminals equipped with solid-state imaging devices such as CCD (Charged Coupled Device) type image sensors or CMOS (Complementary Metal Oxide Semiconductor) type image sensors, higher quality images As a result, products equipped with an imaging device using a solid-state imaging device having a large number of pixels have been supplied to the market. On the other hand, in recent years, there has been a demand for an imaging device with a lower profile so as to be mounted on a thin mobile phone or smartphone. In an imaging apparatus with a lower profile, mounting a solid-state imaging element has become a problem.

  2. Description of the Related Art Conventionally, as a method for mounting a solid-state imaging element in an imaging apparatus, a method of performing wire bonding after die-attaching to a glass / epoxy substrate or the like is known. Here, a structure between the solid-state imaging device and the imaging lens in the imaging apparatus will be described.

  In an imaging device in which a solid-state imaging device is mounted on a substrate or an FPC (flexible printed circuit board) and the solid-state imaging device and the substrate or FPC are electrically connected by wire bonding, an imaging lens that forms a subject image, a solid-state imaging device, In the meantime, an optical filter that restricts a wavelength region (for example, an infrared region) for receiving light is usually disposed. The optical filter has a function of improving color reproduction in the output signal from the solid-state imaging device by not passing infrared light having a wavelength longer than that of visible light. Patent Documents 1 and 2 disclose a configuration in which such an optical filter is provided.

JP 2012-9920 A JP 2010-141123 A

  In the configuration of Patent Document 1, a large space is provided between the solid-state imaging device and the optical filter so as not to interfere with the bonding wire connecting the solid-state imaging device and the substrate or FPC. However, if the space between the solid-state imaging device and the optical filter is increased in this way, the height of the imaging device cannot be reduced.

  On the other hand, in the configuration of Patent Document 2, since the optical filter is placed on the frame-like member, the possibility that the optical filter interferes with the bonding wire is reduced, but the support portion of the frame-like member that supports the optical filter. Remains the possibility of interfering with the bonding wire. Therefore, when attempting to reduce the height in such a configuration, the support portion of the frame-shaped member must be moved away from the direction orthogonal to the optical axis so as not to interfere with the bonding wire, which is in proportion to the size of the solid-state imaging device. It becomes a large-sized imaging device.

  The present invention has been made in view of such problems, and an object of the present invention is to provide an imaging apparatus capable of realizing a low profile while avoiding interference between an optical element and a bonding wire.

An imaging apparatus according to claim 1 is provided.
A solid-state imaging device that converts an object image formed by the imaging lens into an electrical signal;
A plate-like optical element disposed between the imaging lens and the solid-state imaging element;
A frame member for supporting the optical element,
The solid-state imaging device is connected to a substrate so that signals can be transmitted by a plurality of wires,
The frame member is attached to the substrate, and has an opening that accommodates the optical element, and a support portion that protrudes from a part of the periphery of the opening toward the inside of the opening. The optical element is supported.

  According to the present invention, the frame member includes an opening that accommodates the optical element, and a support portion that protrudes from a part of the periphery of the opening toward the inside of the opening, and the optical portion is provided by the support portion. Since the element is supported, the support portion can be provided at a position that does not interfere with the wire.

  According to a second aspect of the present invention, in the invention of the first aspect, the support portion is provided at a position overlapping the wire when viewed in the direction perpendicular to the optical axis. The support portion is provided at a position that does not overlap the wire.

  According to the present invention, the support portion is provided at a position overlapping the wire when viewed in the direction perpendicular to the optical axis, so that the support portion can be brought closer to the solid-state image sensor side and the height can be reduced. I can plan. On the other hand, when viewed in the optical axis direction, the support portion is provided at a position that does not overlap the wire, so that interference between the support portion and the wire can be effectively avoided.

  According to a third aspect of the present invention, in the invention of the first or second aspect, the plurality of wires are connected to the center side in at least one of the four sides of the solid-state imaging device, and the support section Are provided at positions corresponding to the four corners of the solid-state imaging device.

  Thereby, interference with the said support part and the said wire can be avoided effectively.

  According to a fourth aspect of the present invention, in the invention of the first or second aspect, the plurality of wires are connected to two sides of the four sides of the solid-state imaging device, and the support portion is The solid-state imaging device is provided at a position corresponding to two sides where the wire is not provided.

  Thereby, interference with the said support part and the said wire can be avoided effectively.

  ADVANTAGE OF THE INVENTION According to this invention, the imaging device which can implement | achieve a low profile can be provided, avoiding interference with an optical element and a bonding wire.

It is sectional drawing along the optical axis of the imaging device 10 concerning this Embodiment. It is the figure which cut | disconnected the structure of FIG. 1 by the II-II line | wire, and looked at the arrow direction. FIG. 3 is a perspective view of the frame member. It is a figure which shows the state equipped with the imaging device 10 in the smart phone 100 as a portable terminal or an imaging device. 3 is a control block diagram of the smartphone 100. FIG. It is a figure similar to FIG. 2 concerning another embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view along the optical axis of the imaging apparatus 10 according to the present embodiment. FIG. 2 is a view of the configuration of FIG. 1 taken along the line II-II and viewed in the direction of the arrow. FIG. 3 is a perspective view of the frame member. 1 to 3 are schematic views, and some dimensions are exaggerated.

  As shown in FIG. 1, the imaging device 10 causes a CMOS-type imaging device 11 as a solid-state imaging device including a photoelectric conversion unit (imaging surface) 11 a and the photoelectric conversion unit 11 a of the imaging device 11 to capture a subject image. The imaging lens 12, a lens barrel 13 that holds the imaging lens 12, an IR cut filter 14 that is a parallel-plate-shaped translucent substrate (optical element), and a frame member 15 that supports the IR cut filter 14.

  As shown in FIG. 1, the imaging element 11 mounted on the substrate 16 has a two-dimensional pixel (photoelectric conversion element) at the center of the light receiving side (upper surface in FIG. 1) on a parallel plate chip. The photoelectric conversion unit 11a is formed as an imaging surface, and a signal processing circuit (not shown) is formed around the photoelectric conversion unit 11a. Such a signal processing circuit includes a drive circuit unit that sequentially drives each pixel to obtain a signal charge, an A / D conversion unit that converts each signal charge into a digital signal, and a signal that forms an image signal output using the digital signal. It consists of a processing unit and the like.

  A plurality of pads (not shown) are arranged near the outer edge of the image sensor 11 on the light receiving side, and are connected to the substrate 16 by a plurality of bonding wires W. As shown by a dotted line in FIG. 2, the wire W is provided on the center side of the four sides 11 b, 11 c, 11 d, and 11 e of the image sensor 11. It is sufficient that the wire W is provided on at least one side.

  The image pickup device 11 converts the signal charge from the photoelectric conversion unit 11a into an image signal such as a digital YUV signal, and the like, and a control provided in an unillustrated external circuit (for example, a host device on which the image pickup device is mounted). Circuit). Further, it is also possible to receive a power supply and a clock signal for driving the image sensor 11 from an external circuit via the wire W. Here, Y is a luminance signal, U (= R−Y) is a color difference signal between red and the luminance signal, and V (= BY) is a color difference signal between blue and the luminance signal. Note that the image sensor is not limited to the above CMOS image sensor, and other devices such as a CCD may be used.

  In FIG. 1, an imaging lens 12 is provided inside a lens barrel 13. More specifically, the imaging lens 12 includes lenses L1 to L5 held by a holder 12a, and can be moved in the optical axis direction by an actuator in the lens barrel 13.

  The frame member 15 is attached to the substrate 16, supports the lens barrel 13, and accommodates and supports a rectangular plate-shaped IR cut filter 14. As shown in FIGS. 2 and 3, the frame member 15 has a rectangular opening 15a, and is provided with a support plate portion 15b so as to protrude from the lower corners of the four corners of the rectangular opening 15a to the inside of the opening. The inner dimension of the rectangular opening 15a is substantially equal to the outer dimension of the IR cut filter 14. Therefore, as shown in FIG. 3, when the IR cut filter 14 is inserted from above the frame member 15, the bottom surfaces of the four corners of the IR cut filter 14 are supported by the support plate 15b while being accommodated in the rectangular opening 15a. . In this state, the IR cut filter 14 can be fixed to the frame member 15 by applying an adhesive to the four sides (including the inclined surface TP) of the IR cut filter 14.

  According to the present embodiment, as shown in FIG. 1, the support plate portion 15 b is provided at a position overlapping the wire W when viewed in the direction orthogonal to the optical axis. It can be moved to the side to reduce the height. On the other hand, as shown in FIG. 2, since the support plate portion 15b is provided at a position that does not overlap the wire W when viewed in the optical axis direction, interference between the support plate portion 15b and the wire W is effectively avoided. it can. In addition, an adhesive agent can be effectively stopped | fastened by making a part of periphery of the rectangular opening 15a into the inclined surface TP.

  The operation of the imaging device 10 described above will be described. FIG. 4 shows a state in which the imaging device 10 is installed in a mobile terminal or a smartphone 100 as an imaging device. FIG. 5 is a control block diagram of the smartphone 100.

  In the imaging device 10, for example, the object-side end surface of the lens barrel 13 is provided on the back surface of the smartphone 100 (see FIG. 4B), and is disposed at a position corresponding to the lower side of the liquid crystal display unit.

  The imaging device 10 is connected to the control unit 101 of the smartphone 100 via an external connection terminal (an arrow in FIG. 5), and outputs an image signal such as a luminance signal or a color difference signal to the control unit 101 side.

  On the other hand, as shown in FIG. 4, the smartphone 100 performs overall control of each unit, and a control unit (CPU) 101 that executes a program corresponding to each process, a switch such as a power source, a number, and the like using a touch pad. An input unit 60 for inputting instructions, and a display unit 65 for displaying captured images and the like in addition to predetermined data on a liquid crystal panel (however, the touch panel 70 serves as both the liquid crystal panel of the display unit and the touch pad of the input unit) And a wireless communication unit 80 for realizing various information communications with an external server, and a storage unit (ROM) storing necessary data such as a system program, various processing programs, and a terminal ID of the smartphone 100 91, various processing programs and data executed by the control unit 101, processing data, or an image obtained by the imaging device 10. And a temporary storage unit used as a work area for storing data and the like temporarily (RAM) and a 92.

  The smartphone 100 operates by operating the input key unit 60, performs an autofocus operation by driving the imaging lens 12 by an actuator, and touches the icon 71 or the like displayed on the touch panel 70 to operate the imaging device 10. Imaging. Since the light beam imaged on the photoelectric conversion unit 11a through the imaging lens 12 passes through the IR cut filter 14, the infrared light component is thereby cut off and a high-quality image can be obtained. The image signal input from the imaging device 10 is stored in the storage unit 92 or displayed on the touch panel 70 by the control system of the smartphone 100, and further transmitted to the outside as video information via the wireless communication unit 80. Is done.

  FIG. 6 is a view similar to FIG. 2 according to another embodiment. In the present embodiment, the image sensor 11 connects the wire W only to the two opposite sides 11b and 11d, and the frame member 15 ′ has two sides 11c and 11e where the image sensor 11 does not connect the wire W. The support plate portion 15b protrudes from the two sides of the opening 15a corresponding to the inside of the opening. Therefore, interference between the wire W and the support plate portion 15b does not occur.

DESCRIPTION OF SYMBOLS 10 Image pick-up device 11 Image pick-up element 11a Photoelectric conversion part 11b-11e Side 12 Imaging lens 12a Holder 13 Lens tube 14 IR cut filter 15 Frame member 15a Rectangular opening 15b Support plate part 16 Substrate 60 Input key part 65 Display part 70 Touch panel 71 Icon 80 Wireless communication unit 92 Storage unit 100 Smartphone 101 Control units L1 to L5 Lens W Wire

Claims (4)

A solid-state imaging device that converts an object image formed by the imaging lens into an electrical signal;
A plate-like optical element disposed between the imaging lens and the solid-state imaging element;
A frame member for supporting the optical element,
The solid-state imaging device is connected to a substrate so that signals can be transmitted by a plurality of wires,
The frame member is attached to the substrate, and has an opening that accommodates the optical element, and a support portion that protrudes from a part of the periphery of the opening toward the inside of the opening. An imaging apparatus, wherein the optical element is supported.   When viewed in the optical axis orthogonal direction, the support portion is provided at a position overlapping the wire, but when viewed in the optical axis direction, the support portion is provided at a position not overlapping the wire. The imaging apparatus according to claim 1.   The plurality of wires are connected to the center side in at least one of the four sides of the solid-state image sensor, and the support portions are provided at positions corresponding to the four corners of the solid-state image sensor. The imaging apparatus according to claim 1 or 2.   The plurality of wires are connected to two sides of the four sides of the solid-state imaging device, and the support portion is provided at a position corresponding to two sides of the solid-state imaging device where the wires are not provided. The imaging apparatus according to claim 1, wherein the imaging apparatus is provided.

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