JP2013208908A - Method of compression molding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform mold clamping by efficiently adjusting thicknesses of substrates 2 (2a, 2b) when carrying out the compression molding of the substrate 2 (insert member) with different thicknesses by using two molds 5 and 6 laminated above and below.SOLUTION: When carrying out the mold clamping of an upper mold and a lower mold of two molds 5 and 6 for compression molding in a mold opening/closing mechanism 13 of a mold opening/closing means 12, a thickness adjusting mechanism 14 of the mold opening/closing means 12 carries out mold clamping by adjusting thicknesses of the substrates 2 (2a, 2b) which are compression-molded with the upper allocated mold 5 for compression molding vertically lamination-allocated and the lower-allocated mold 6 for compression molding located below by exerting longitudinal elastic sliding to a slide body 32 by an elastic member 34 in a slide hole 33 formed in a bearing body 31 of a bearing 29 for rotatably supporting a rotating shaft 27 of a pinion 17 rotatably engaged with a gear between two racks 15 and 16.

Description

  The present invention relates to an improvement of a compression molding method in which a semiconductor chip mounted on a substrate is compression molded with a resin material.

Conventionally, a semiconductor chip mounted on a substrate is compression-molded with a resin material by a compression molding method, and this method is performed as follows.
That is, in a semiconductor chip compression molding die (upper mold and lower mold) mounted on a semiconductor chip compression molding apparatus, first, a substrate (insert member) mounted on a substrate set portion provided on the upper mold ) Is set with the semiconductor chip mounting surface facing downward, and a resin material (eg, granular resin material) is supplied into the cavity for compression molding provided in the lower mold and melted by heating. At the same time, the upper and lower molds are clamped.
At this time, the semiconductor chip mounted on the substrate is immersed in the heat-melted resin material in the lower mold cavity.
Next, the resin in the lower mold cavity is pressurized by moving up the cavity bottom surface member provided on the bottom surface of the lower mold cavity.
After the time required for curing has elapsed, the upper and lower molds are opened to compress the semiconductor chip mounted on the substrate in the resin mold corresponding to the shape of the lower mold cavity in the lower mold cavity (resin sealing And a molded product (molded substrate) composed of a resin molded body and a substrate can be obtained.

JP 2007-307766 A

By the way, when a semiconductor chip mounted on a substrate is compression molded using a semiconductor chip compression molding apparatus (semiconductor chip compression mold), it is required to improve the productivity of the molded product efficiently. Yes.
For this purpose, the semiconductor chip mounted on the substrate is compression-molded using a compression molding apparatus having a compression molding die having a configuration in which two (a plurality of) substrates are arranged in a plane on the die surface. Therefore, it has been studied to improve the productivity of molded products efficiently.
However, for example, when a substrate is supplied to a compression mold having a configuration in which two substrates are arranged in a plane, the entire compression molding apparatus becomes large, for example, the inload mechanism is increased in a plane.
In recent years, there is a limit to a flat installation space (occupied floor area) in a semiconductor-related production apparatus in a semiconductor production factory that requires a clean state in the production environment.
Further, when the production apparatus becomes large, the energy consumption of the apparatus itself and the factory maintenance energy due to the recent production environment cleanup are likely to increase, and the productivity per unit area of the factory becomes a big problem.
For this reason, it is an issue to efficiently reduce the installation space of the entire semiconductor chip compression molding apparatus.
Therefore, for example, when two substrates are compression molded, it is required to efficiently reduce the installation space of the semiconductor chip compression molding apparatus.

Further, in a compression mold having a configuration in which two substrates are arranged in a plane on the mold surface of the mold, when clamping with the minimum required clamping pressure, one substrate is minimized. Compared to the case where the mold is clamped by the mold clamping pressure, approximately twice the mold clamping force (energy) is required by simple calculation.
Therefore, when two substrates are arranged on the mold surface and clamped, the mold clamping force of the mold used for mold clamping is increased.
Therefore, when two substrates are compression-molded, there is a problem of efficiently reducing the clamping force of the semiconductor chip compression-molding die.

That is, the present invention stacks two semiconductor chip compression molding dies in a vertical direction in a semiconductor chip compression molding apparatus, so that the apparatus has a semiconductor chip compression molding mold, The present invention is provided with a semiconductor chip compression molding die that is disposed below to solve these problems.
Therefore, the present invention can reduce the installation space of the mold by the amount of arranging one substrate by simple calculation as compared with the compression molding die having two substrates arranged in a plane. The installation space for the compression molding apparatus (mold) can be efficiently reduced.
Further, the present invention is based on the assumption that the mold is clamped with the same mold clamping pressure, compared to the mold clamping force for clamping the mold for compression molding in which two substrates are arranged in a plane. Since the mold in which one substrate is arranged is arranged in the vertical direction, the mold in which one substrate is arranged can be clamped with a clamping force for clamping the mold. The mold clamping force can be efficiently reduced.
Note that the mold clamping force according to the present invention can be roughly expressed in terms of clamping (pressing) a substrate in the present invention (necessary (minimum) per substrate). In order to clamp the two substrates with the clamping pressure, two compression molding dies for compressing and molding the one substrate in a state where the two substrates are apparently arranged in one. The structure arrange | positioned piece by piece and an up-down direction will be used.

Further, in the present invention, by adopting a semiconductor chip compression molding apparatus (compression molding method) provided with a semiconductor chip compression molding mold disposed above and a semiconductor chip compression molding mold disposed below. There is a demand for efficient clamping of a semiconductor chip compression molding die disposed above and a semiconductor chip compression molding die disposed below.
In addition, when a substrate is supplied and clamped to each of two stacked metal molds arranged in an upper and lower arrangement provided in a semiconductor chip compression molding apparatus, substrates with different substrate thicknesses may be supplied.
In this case, a gap may be generated in one of the two molds, and the two molds may not be efficiently clamped, and the substrate may be clamped with excessive mold clamping pressure. The present invention solves this problem together.
Therefore, in the present invention, when substrates having different substrate thicknesses are used, it is required that a semiconductor chip compression molding apparatus (die) be efficiently clamped by adjusting the substrate thickness.

That is, an object of the present invention is to provide a compression molding method and a compression molding apparatus that can efficiently reduce the installation space of the entire compression molding apparatus.
Another object of the present invention is to provide a compression molding method capable of efficiently reducing the clamping force in a compression molding apparatus (mold).

  The present invention also provides a compression molding method capable of efficiently clamping two compression molding dies when two compression molding dies are stacked and arranged in a compression molding apparatus. It is intended to do.

  Further, in the present invention, when two compression molding dies are stacked and arranged in a semiconductor chip compression molding apparatus, when a substrate (insert member) having a different substrate thickness is used, An object of the present invention is to provide a compression molding method capable of efficiently adjusting two molds for compression molding provided in a compression molding apparatus in accordance with the thickness of a substrate (insert member) and clamping the mold. It is.

The compression molding method according to the present invention for solving the technical problem is formed by stacking two compression molding dies in a vertical direction to compress and mold an insert member having a required thickness with a resin material. Upper and lower compression molding molds, upper and lower molds provided in each of the two compression molding molds, and upper fixing for fixing the upper upper mold. A plate, a lower fixed plate provided below the upper fixed plate, a required number of posts connecting the upper fixed plate and the lower fixed plate, an upper mold disposed above and an upper plate disposed below An intermediate plate provided in a state in which both of them are fixed between the mold and slidable up and down on the post, and a slide in which the lower mold of the lower arrangement is fixed and slidable up and down on the post On the plate and the compression mold A mold opening / closing means for closing the mold surface and the lower mold surface separately, and a lower side of the slide plate provided between the slide plate and the lower fixed plate and the two compression molding dies. A pressurizing mechanism for applying a required mold clamping pressure, an insert member set portion for supplying and setting an insert member provided on each of the mold surfaces of the upper mold, and the molds of the lower molds. Preparing a mold unit comprising compression molding cavities separately provided on the surface and heating means for heating the resin material supplied into the compression molding cavities;
A mold opening / closing mechanism of the mold opening / closing means is provided between one rack fixed to the post, the other rack fixed to a rack standing member standing on the slide plate, and the two racks described above. A pinion that is rotatably engaged with a gear, a rotating shaft provided on the pinion, a rotating mechanism that rotates the rotating shaft, a bearing that rotatably receives the rotating shaft, and the intermediate plate A pinion hanging member provided in a state where the bearing portion is provided at the lower end,
A thickness adjusting mechanism that adjusts the thickness of each insert member having a required thickness supplied to each of the upper-side compression molding die and the lower-side compression molding die on the mold opening / closing means. Providing and configuring; and
In the thickness adjusting mechanism of the mold opening / closing means, the main body of the bearing portion fixed to the pinion hanging member fixed to the other rack, the sliding hole formed in the bearing portion main body, and the inside of the sliding hole Providing a sliding body of a bearing portion that elastically slides up and down and rotatably receives the rotation shaft of the pinion, and an elastic member that elastically slides the sliding body up and down within the sliding hole; and
Supplying and setting each insert member having a required thickness to the set portion of the insert member provided in the upper die in each of the two compression molding dies; and
Supplying and heating a required amount of resin material separately into the compression molding cavities provided in the lower mold of each of the two compression molding molds; and
Clamping the upper mold and the lower mold in each of the two compression molding molds with a mold opening / closing mechanism of the mold opening / closing means;
When clamping each of the two compression molding dies, the sliding body is elastically moved up and down by the elastic member in the sliding hole of the bearing body by the thickness adjusting mechanism of the mold opening / closing means. A step of adjusting the thickness of the insert member that is compression-molded by the compression molding die of the upper arrangement and the compression molding mold of the lower arrangement by laminating and clamping in the vertical direction;
A step of compressing the insert member in the compression molding cavity by pressurizing a resin in the compression molding cavity in each of the two compression molding dies.

  Further, in the compression molding method according to the present invention for solving the technical problem, when each of the two compression molding molds is clamped, the lower mold in the compression molding mold arranged above is distanced. And a step of moving the lower die of the compression molding die arranged below at a distance of 2L.

Further, the compression molding method according to the present invention for solving the technical problem includes a step of coating a release film in a compression molding cavity in each of the two compression molding dies,
And a step of supplying and heating a resin material to each of the compression molding cavities coated with the release film.

  Further, the compression molding method according to the present invention for solving the technical problem includes a mold unit having the two compression molding dies, and an insert member and a resin material for each of the compression molding dies of the mold unit. And an outload unit for taking out and storing a molded product from each of the compression molds of the mold unit.

  Further, the compression molding method according to the present invention for solving the technical problem includes a step of detachably mounting the mold unit, the inload unit, and the outload unit with each other. It is characterized by that.

  In addition, the compression molding method according to the present invention for solving the technical problem includes a step of preparing a plurality of the mold units.

Further, the compression molding method according to the present invention for solving the technical problem includes a step of preparing a plurality of the mold units,
And a step of detachably mounting the other one of the mold units to one of the mold units.

Further, the compression molding method according to the present invention for solving the technical problem includes a step of providing an inloader mechanism for supplying an insert member and a resin material to each of the compression molding dies in the mold unit,
And a step of providing an outloader mechanism for taking out a molded product from each of the compression molding dies in the mold unit.

  Further, the compression molding method according to the present invention for solving the technical problem is to supply an insert member and a resin material to each of the compression molding dies in the mold unit, and the compression molding mold in the mold unit. It is characterized by comprising a step of providing a loader for taking out a molded product from each.

According to the present invention, a semiconductor chip compression molding apparatus (semiconductor chip compression molding method) is provided with a laminated mold mechanism part in which two semiconductor chip compression molding dies are arranged in a vertical direction. Therefore, it is possible to provide a compression molding method and a compression molding apparatus that can efficiently reduce the installation space of the entire compression molding apparatus as compared with a configuration in which two semiconductor chip compression molding dies are arranged in a plane. It has an excellent effect that it can be performed.
In addition, according to the present invention, as described above, in the semiconductor chip compression molding apparatus (semiconductor chip compression molding method), the lamination mold mechanism in which two semiconductor chip compression molding dies are stacked in the vertical direction. Since it can be configured by providing a portion, the mold clamping force in the compression molding apparatus (mold) can be efficiently reduced compared to a configuration in which two semiconductor chip compression molding dies are arranged in a plane. It is possible to provide an excellent effect that it is possible to provide a compression molding method.

In addition, the present invention comprises a semiconductor chip compression molding apparatus (semiconductor chip compression molding method) provided with a laminated mold mechanism part in which two semiconductor chip compression molding dies are arranged in a vertical direction. As a mold opening / closing means (mold opening / closing mechanism) for clamping each of the two compression molding dies, a rack / pinion mechanism including two racks and one pinion is provided.
Accordingly, there is provided a compression molding method capable of efficiently clamping two compression molding dies when two compression molding dies are stacked and arranged in a semiconductor chip compression molding apparatus. There is an excellent effect that it is possible.

  Further, according to the present invention, when two compression molding dies are stacked and arranged in a semiconductor chip compression molding apparatus, when a substrate (insert member) having a different substrate thickness is used, the semiconductor When a compression molding method can be provided, in which two compression molds provided in the compression molding apparatus can be efficiently adjusted and clamped in accordance with the thickness of the substrate (insert member). There is an excellent effect.

FIG. 1 is a schematic plan view schematically showing a semiconductor chip compression molding apparatus according to the present invention. FIG. 2 is a schematic front view schematically showing a laminated mold mechanism part that is a main part of a mold unit in the compression molding apparatus shown in FIG. 1, and includes two pieces arranged vertically in the laminated mold mechanism part described above. The mold open state of the die for compression molding of a semiconductor chip is shown. FIG. 3 is a schematic front view schematically showing a laminated mold mechanism (two semiconductor chip compression molds) in the apparatus corresponding to FIG. 2, and shows the mold clamping state of the mold described above. ing. FIG. 4 is an enlarged schematic front view schematically showing an enlarged main part of the mold shown in FIG. 3. FIG. 5 is an enlarged schematic longitudinal sectional view schematically showing an enlarged main part of the mold shown in FIG. 3.

First, the present invention will be described in detail with reference to the drawings.
FIG. 1 shows a semiconductor chip compression molding apparatus according to the present invention.
FIGS. 2 and 3 show the laminated mold mechanism (configuration in which a semiconductor chip compression molding die is arranged in the vertical direction) of the apparatus shown in FIG.
FIG. 4 shows mold opening / closing means (mold opening / closing mechanism) of the laminated mold mechanism shown in FIG.
FIG. 5 shows mold opening / closing means (thickness adjusting mechanism) of the laminated mold mechanism shown in FIG.

(About the configuration of semiconductor chip compression molding equipment)
That is, as shown in FIG. 1, in a semiconductor chip compression molding apparatus 1 according to the present invention, a mold unit A for compression molding (resin sealing molding) a substrate 2 (insert member) on which a semiconductor chip is mounted with a resin material. An inload unit B for supplying a mold 2 with a substrate 2 (substrate before molding) on which a semiconductor chip is mounted by an inload mechanism D (conveyance mechanism) and a resin material (for example, a granular resin material), and a mold An outload unit C for taking out and storing the molded product 3 (the substrate 2 and the resin molded body 35) compression-molded by the unit A by the outload mechanism E (conveying mechanism for the material before molding) is provided. .
In addition, a moving area F of the inload mechanism and a moving area G of the outload mechanism are provided on the apparatus front surface 1 a side of the molding apparatus 1.
Therefore, as shown in FIG. 1, first, the inload mechanism D supplies the substrate 2 and the resin material from the inload unit B to the mold unit A and compresses them into the molded product 3. The mechanism E is configured so that the molded product 3 can be taken out from the mold unit A and accommodated in the outload unit C.
Note that the inload unit B, the mold unit A, and the outload unit C are configured so as to be detachable from each other in a row by the unit connector H in this order.

(Mold unit configuration)
Further, as shown in FIG. 1, on the apparatus back surface 1b side of the mold unit A, a laminated mold mechanism unit 4 (a mold apparatus having a double layer structure) for compressing and molding a substrate 2 on which a semiconductor chip is mounted is provided. It is configured.
Therefore, the laminated mold mechanism section (laminated mold mechanism section) 4 is configured such that a molded product (molded substrate) 3 can be formed by compression molding a semiconductor chip mounted on the substrate 2. .

(About the structure of the laminated mold mechanism)
As shown in FIGS. 2 and 3, the lamination mold mechanism unit 4 is configured by being provided with two semiconductor chip compression molding dies (compression molding dies) stacked in the vertical direction. Yes.
That is, the laminated mold mechanism unit 4 includes a semiconductor chip compression molding die (compression molding die) 5 disposed above the mechanism unit and a semiconductor chip disposed below the mechanism unit. And a compression molding die 6 (compression molding die) 6 are provided.
In addition, the compression molding die 5 arranged at the top is provided with an upper die 5a and a lower die 5b opposite to the upper die 5a. An upper mold 6a and a lower mold 6b facing the upper mold 6a are provided.
Therefore, in each of the two molds 5 and 6 (upper and lower molds 5a and 5b and upper and lower molds 6a and 6b) stacked in the vertical direction in the multilayer mold mechanism unit 4, the substrate 2 on which the semiconductor chip is mounted is, for example, In addition, the molded product 3 can be formed by compression molding (for each mold) with a granular resin material (granular resin).
As will be described later, the upper mold set 5 and the lower mold 6 (upper and lower molds 5, 6) have an upper mold set 19 and a compression mold. And a lower mold cavity 21 for use.

In addition, the laminated mold mechanism unit 4 includes an upper fixed platen 7 and a lower fixed platen 8 provided below the upper fixed platen 7 and the required number of the upper fixed platen 7 and the lower fixed platen 8. The post (tie bar) 9 is fixed and configured (four posts in the figure).
Further, an intermediate plate (intermediate moving plate) 10 is provided between the upper fixed platen 7 and the lower fixed platen 8 so as to be slidable up and down with respect to the required number of posts 9.
Further, similarly to the intermediate plate 10, a slide plate (bottom moving plate) 11 is provided between the intermediate plate 0 and the lower fixed plate 8 so as to be slidable up and down with respect to the required number of posts 9. Has been.
Further, an upper mold 5a in the upper mold 5 is mounted on the lower surface side of the upper fixed platen 7 (in an immobile state).
Further, the lower plate 5b in the compression molding die 5 arranged on the upper side is provided on the upper surface side of the intermediate plate 10, and the compression molding die 6 arranged on the lower side of the intermediate plate 10 is arranged on the lower surface side. The upper die 6a is installed.
In addition, a lower die 6 b in a lowerly arranged die 6 is installed on the upper surface side of the lower fixed platen 8.
Moreover, it is comprised so that it can move up and down in the state which united the lower mold | type 5b of the upper arrangement | positioning, the intermediate | middle plate 10, and the upper mold | type 6a of the lower arrangement | positioning.
Further, the lower mold 6b and the slide plate 11 that are disposed below can be moved up and down in an integrated state.

That is, as shown in FIG. 2 and FIG. 3, in the laminated mold mechanism unit 4, as will be described later, in each of the upper compression molding die 5 and the lower compression molding die 6 (up and down arrangements). In the molds 5 and 6, the mold surface of the upper mold 5a and the mold surface of the lower mold 5b, and the mold surface of the upper mold 6a and the mold surface of the lower mold 6b are simultaneously opened and closed in conjunction with each other. A mold opening / closing means 12 is provided.
Accordingly, in the laminated mold mechanism unit 4, the mold plate opening / closing means 12 is used to move the intermediate plate 10 and the slide plate rate 11 upward separately, so that the mold surface of the upper mold 5 a By closing the mold surface of the lower mold 5b, the upper and lower molds 5a and 5b can be clamped (see FIGS. 2 and 3).
Further, at this time, the lower mold 6 is configured so that the upper and lower molds 6a and 6b can be clamped by closing the mold surface of the upper mold 6a and the mold surface of the lower mold 6b. ing.
In the example shown in the figure, the above-described mold opening / closing means 12 is separately installed on four and four posts 9.

The mold opening / closing means 12 includes a mold opening / closing mechanism 13 for opening and closing the mold surfaces of the upper molds 5a and 6a and the mold surfaces of the lower molds 5b and 6b in the upper and lower molds 5 and 6, as will be described later. And a thickness adjusting mechanism 14 having a floating structure for adjusting the thickness of the two substrates 2 (2a, 2b) sandwiched between the mold surfaces of the upper molds 5a, 6a and the mold surfaces of the lower molds 5b, 6b. It is provided and configured.
That is, as will be described later, the mold opening / closing mechanism 13 employs a rack and pinion mechanism, and two racks 15 and 16 and one pinion gear-engaged between the two racks 15 and 16 are used. 17 is provided.
Further, as will be described later, in the rack and pinion mechanism of the mold opening / closing mechanism 13, one rack 15 is fixed on the post 9 side, and the other rack 16 is mounted on the slide plate 11 side. The pinion 17 that is gear-engaged between two racks is installed on the intermediate plate 10 side (see FIG. 4).
Further, as will be described later, when the thicknesses of the substrates 2 supplied to the upper and lower molds 5 and 6 are different (for example, the thick substrate 2a and the thin substrate 2b shown in FIG. 5). ), By moving the intermediate plate 10 (including the lower die 5b and the upper die 6a) up and down elastically by the thickness adjusting mechanism 14, the substrate 2 (2a, 2b) in each of the upper and lower molds 5, 6 is provided. It is comprised so that the thickness of can be adjusted efficiently.
Therefore, as will be described later, in the mold opening / closing means 12 (mold opening / closing mechanism 13), by rotating the pinion 17, the pinion 17 (intermediate plate 10) is moved upward, and the other rack 16 (slide plate 11) is moved. By moving up, the mold surface of the upper mold 5a (6a) and the mold surface of the lower mold 5b (6b) can be closed and clamped in each of the upper and lower molds 5,6.
At this time, the pinion 17 (intermediate plate 10) moves up at a distance L, and the other rack 16 (slide plate 11) moves up at a distance 2L.
The moving distance of the other rack 16 (slide plate 11) is a distance L relative to the pinion 17.
At this time, the thickness of the substrate 2 (2a, 2b) can be efficiently adjusted by the thickness adjusting mechanism 14 in each of the upper and lower molds 5, 6 as will be described later.

In addition, between the slide plate 11 and the lower fixed platen 8, when the molds 5 and 6 arranged upward and downward by the mold opening / closing means 12 are clamped (when the laminated mold mechanism part 4 is clamped), they are arranged vertically. A pressurizing mechanism 18 (up / down pressurizing mechanism for the slide plate) for pressurizing the dies 5 and 6 with a required mold clamping pressure (required mold clamping force) is provided.
Therefore, in the laminated mold mechanism unit 4 (upper and lower molds 5 and 6), the mold surfaces of the upper and lower molds 5 and 6 are respectively closed by the mold opening / closing means 12 (mold opening and closing mechanism 13). In addition to mold clamping, the pressurizing mechanism 18 is configured to pressurize each of the upper and lower molds 5 and 6 separately with a required mold clamping pressure (mold clamping force).
Further, the slide plate 11 can be moved up and down supplementarily by the pressurizing mechanism 18 when the upper and lower molds 5 and 6 are clamped by the mold opening / closing means 12 (mold opening / closing mechanism 13). Yes.
Therefore, the mold opening / closing means 12 (the mold opening / closing mechanism 13) and the pressurizing mechanism 18 are configured so that the upper and lower molds 5, 6 can be clamped with a required mold clamping pressure. .

(About the effect of mold lamination in the lamination mold mechanism)
In other words, according to the present invention, the laminated mold mechanism unit in which the semiconductor chip compression molding apparatus 1 (mold unit A) according to the present invention has two semiconductor chip compression molding dies 5 and 6 stacked in the vertical direction. 4 can be provided.
For this reason, the semiconductor chip compression molding apparatus 1 according to the present invention is substantially 1 in comparison with a semiconductor chip compression molding apparatus provided with a semiconductor chip compression molding die in which two substrates are arranged in a plane. The semiconductor chip compression molding apparatus 1 is provided with a semiconductor chip compression molding die in which a plurality of substrates are arranged in a plane.
Therefore, according to the present invention, in the semiconductor chip compression molding apparatus 1 according to the present invention, the installation space of the entire apparatus can be efficiently reduced.
In addition, in the semiconductor chip compression molding apparatus 1 according to the present invention, a configuration in which two semiconductor chip compression molding dies 5 and 6 are stacked is adopted, whereby a semiconductor chip in which two substrates are arranged in a plane. Compared to the semiconductor chip compression molding apparatus provided with the above-mentioned compression molding mold, the semiconductor chip compression molding mold (apparatus 1) in which one substrate is arranged in a plane is required to have a required clamping pressure. The mold will be clamped.
Therefore, according to the present invention, the mold clamping force in the semiconductor chip compression molding apparatus 1 (molds 5 and 6) according to the present invention can be efficiently reduced.

(Regarding the structure of compression molding molds arranged above and below)
In addition, the compression molding die 5 arranged above and the compression molding die 6 arranged below the laminated mold mechanism part 4 in the present invention will be described.
Each of the above-described compression molding mold 5 arranged in the upper direction and the compression molding mold 6 arranged in the lower direction (each of the molds 5 and 6 arranged in the vertical direction) are formed in the same mold configuration.

That is, as shown in FIG. 2 and FIG. 3, the substrate 2 on which the semiconductor chip is mounted is placed on the upper mold surface of the compression molding mold (compression molding mold) 5 disposed above, and the semiconductor chip mounting surface side is disposed on the upper mold surface. A substrate set part 19 (insert member set part) of the upper mold 5a to be supplied in a downward direction, and a suction hole 20 (substrate suction means) as a substrate fixing means for fixing the substrate 2 (2a, 2b) to the substrate set part 19 ) Is provided.
As shown in FIGS. 2 and 3, the compression molding cavity 21 of the lower mold 5 b having a cavity opening portion opened upward is formed on the lower mold 5 b of the upper mold 5 for compression molding. A cavity bottom member 22 for resin pressurization provided on the bottom surface of the lower mold cavity 21 is provided.
Although not shown in the figure, the compression molding die 5 arranged above is provided with a heating means for heating the die 5 to a required temperature.

That is, the inloader mechanism D supplies and sets the substrate 2 on which the semiconductor chip is mounted on the substrate setting portion 19 of the upper mold 5a, and forcibly sucks and discharges air from the suction holes 20 provided on the mold surface of the upper mold 5a. By doing so, the substrate 2 can be sucked and fixed to the substrate setting portion 19.
Further, the inloader mechanism D is configured so that a required amount of resin material (granular resin) can be supplied into the lower mold cavity 21 and melted by heating.
Accordingly, the semiconductor chip mounted on the substrate 2 supplied and set to the upper mold substrate set portion 19 is heated and melted in the lower mold cavity 21 by clamping the compression molding mold 5 (upper and lower molds 5 a) disposed above. The resin is soaked in the resin material and a required resin pressure can be applied to the resin in the lower cavity 21 by the cavity bottom member 22.
For this reason, the molded product 30 is formed with the compression molding die 5 arranged above by compression molding (resin sealing molding) of the semiconductor chip in the resin molding 35 corresponding to the shape of the cavity 21 in the lower mold cavity 21. The resin molded body 35 and the substrate 2 can be formed.

Further, in the compression molding die 6 (compression molding die) arranged at the lower side, similarly to the compression molding die 5 arranged at the upper side, the substrate set part 19 provided on the upper die 6a and the compression provided on the lower die 6b. A molding cavity 21, a cavity bottom member 22, and a heating means (not shown) are provided.
Therefore, in the compression molding die 6 arranged below, the substrate 2 is mounted in the resin molding 35 corresponding to the shape of the cavity 21 in the lower mold cavity 21, similarly to the compression molding die 5 arranged above. The molded product 3 (the resin molded body 35 and the substrate 2) can be formed by compression molding (resin sealing molding) of the semiconductor chip.

(About the configuration of the inloader mechanism)
As shown in FIG. 2, the inloader mechanism D includes, for example, an upper inload unit 23, a lower inload unit 24 provided below the upper inload unit 23, an upper inload unit 23, and a lower inload unit 24. And an in-load connecting portion 25 for connecting the two.
In addition, as shown in FIG. 1, the inloader mechanism D is configured to reciprocate between the inload unit B and the mold unit A in the movement region F of the inloader mechanism.
Further, in the inload unit B, the substrate 2 and the resin material (granular resin) can be separately attached (or placed) to the upper inload portion 23 and the lower inload portion 24, respectively. It is configured to be able to.
That is, first, in the inload unit B, the substrate 2 and the resin material are separately set on the upper inload unit 23 and the lower inload unit 24 in the inloader machine D, and the inloader mechanism D is connected to the inloader unit D. The moving area F of the mechanism can be moved from the inload unit B side to the mold unit A side.
Next, in the laminated mold mechanism part 4 in the mold unit A, the upper inload part 23 can be made to enter between the upperly arranged molds 5 (upper and lower molds 5a and 5b).
At this time, the lower inload portion 24 can be made to enter between the molds 6 (upper and lower molds 6a and 6b) disposed below.
Therefore, in the upper mold 5, the upper inload portion 23 can supply and set the substrate 2 to the substrate setting portion 19 of the upper die 5 a and supply the resin material into the cavity 21 of the lower die 5 b. .
Further, at this time, in the lower mold 6, the lower inload portion 24 supplies and sets the substrate 2 to the substrate setting portion 19 of the upper die 6 a and supplies the resin material into the cavity 21 of the lower die 6 b. be able to.

(About the structure of the outloader mechanism)
Although not shown, the outloader mechanism E includes, for example, an upper outload unit, a lower outload unit provided below the upper outload unit, and an upper outload unit (similar to the inloader mechanism D). An outload connecting portion that connects the load portion and the lower outload portion is provided.
Further, as shown in FIG. 1, the outloader mechanism E is configured to reciprocate between the outload unit C and the mold unit A in the movement region G of the outloader mechanism.
Further, the outload unit C is configured so that the molded product 3 can be taken out and accommodated separately from each of the upper and lower outload portions.
That is, first, in the laminated mold mechanism part 4 in the mold unit A, the upper outload part is inserted between the upper and lower upper and lower molds 5a and 5b, and the molded product 3 is engaged (attached from the mold surface of the lower mold 5b). ) Can be taken out.
At this time, the molded product 3 can be taken out (engaged) from the mold surface of the lower mold 6b by allowing the lower outload portion to enter between the upper and lower molds 6a and 6b disposed below.
Next, the outloader mechanism E can be moved from the mold unit A side to the outload unit C side in the movement region G of the outloader mechanism.
Therefore, next, in the outload unit C, the molded product 3 can be taken out from each of the upper and lower outload portions of the outloader mechanism E and accommodated.

(About the structure of the mold opening and closing means)
Further, as described above, the mold opening / closing means 12 is clamped separately by the mold opening / closing mechanism 13 for opening and closing the upper and lower molds 5 and 6 and the upper and lower molds 5 and 6 (clamping). And a thickness adjusting mechanism 14 that adjusts the thickness in accordance with the thickness of the substrate 2.
Therefore, by using the mold opening / closing means 12, the upper and lower molds 5 and 6 are clamped separately by the mold opening and closing mechanism 13, and are held between the upper and lower molds 5 and 6 by the thickness adjusting mechanism 14. The thickness of the substrate 2 can be adjusted individually.

(About mold opening / closing mechanism in mold opening / closing means)
That is, as shown in FIGS. 4 and 5, in the mold opening / closing mechanism 13 of the mold opening / closing means 12, the rack 15 is fixed in a vertical direction at a required portion of the post 9 between the intermediate plate 10 and the slide plate 11. (One rack) is provided.
The mold opening / closing mechanism 13 is configured such that a rack 16 (the other rack) is provided in a state of being fixed in a vertical direction at a required portion of a rack erecting member 26 erected on the slide plate 11 (in a vertical state). ing.
Further, a pinion 17 is provided between the two racks 15 and 16 so as to be engaged with the two racks 15 and 16 by gears.
In the mold opening / closing mechanism 13, the pinion 17 is provided with a rotating shaft 27, and the rotating shaft 27 is provided with a rotating mechanism 28 such as a motor.
Accordingly, the pinion 17 can be rotated in the forward direction or the reverse direction by the rotation mechanism 28 via the rotation shaft 27.
Further, a bearing portion 29 (including a thickness adjusting mechanism 14 described later) having a floating structure that rotatably receives the rotating shaft 27 is provided between the pinion 17 and the rotating mechanism 28.
In the mold opening / closing mechanism 13, a pinion hanging member 30 is provided in a state of hanging from the intermediate plate 10, and a bearing 29 having a pinion 17 (rotating shaft 27) rotatably provided at the lower end of the pinion hanging member 30. It is fixed and configured.

Next, the opening / closing operation of the mold opening / closing mechanism 13 (rack / pinion mechanism) will be described with reference to FIGS. 2, 3, 4, and 5.
First, a case where the upper and lower molds 5 and 6 are clamped will be described.
That is, in the example shown in FIG. 4, the forward direction is counterclockwise (opposite to the clockwise direction) in the drawing, and the pinion is relative to the rack (post-fixed rack) 15 fixed to the post 9. The (intermediate plate hanging pinion) 17 is moved up in a rotated state.
For this reason, it is comprised so that the pinion 17, the pinion drooping member 30, and the intermediate | middle plate 10 can be moved up (it pushes up) integrally (refer FIG. 5).
At this time, the rack (slide plate standing rack) 16 fixed to the rack standing member 26 (slide plate 11) is moved up (pulled up) by the pinion 17 that rotates in the forward direction and moves up. Can do.
Therefore, the rack erecting member 26, the slide plate erecting rack 16, and the slide plate 11 can be integrally moved up.
In the example shown in FIG. 4, the reverse direction is clockwise (clockwise) toward the drawing, and the pinion 17 is rotated downward with respect to the post fixing rack 15. .
For this reason, it is comprised so that the pinion 17, the pinion hanging member 30, and the intermediate | middle plate 10 can be moved down integrally.
At this time, the rack (slide plate standing rack) 16 fixed to the rack standing member 26 (slide plate 11) can be moved downward by the pinion 17 rotating in the reverse direction and moving downward.
Therefore, the rack erecting member 26, the slide plate erecting rack 16, and the slide plate 11 can be integrally moved downward.
That is, by rotating the pinion 17 in the forward and reverse directions by the rotation mechanism 28 (rotation shaft 27) in the mold opening / closing mechanism 13, the intermediate plate 10 and the slide plate 11 can be simultaneously moved up and down in conjunction with each other. It is configured.
Therefore, the upper and lower molds 5 and 6 are configured so that the mold surfaces of the upper molds 5a and 6a and the mold surfaces of the lower molds 5b and 6b can be closed separately.

(Movement distance by mold opening / closing mechanism)
Next, the movement distance (stroke) of the intermediate plate 10 and the movement distance (stroke) of the slide plate 11 by the mold opening / closing mechanism 13 employing the rack and pinion mechanism will be described (see FIG. 3).
That is, for example, when the pinion 17 rotates at the distance L (in arc conversion distance) in the forward direction (in the required time), the pinion 17 rotating at this arc (distance) L is the post-fixed rack. 15 is moved up by a distance L.
For this reason, the mold surface of the lower mold 5b mounted on the intermediate plate 10 fixed to the pinion 17 via the pinion hanging member 30 moves upward at a distance L.
At this time, the rack 16 fixed to the rack erecting member 26 is moved up by a distance L relative to the position of the pinion 17.
In other words, the mold surface of the lower mold 6 b installed on the slide plate 11 is moved up by the distance L relative to the pinion 17.
Therefore, the rack 16 fixed to the rack erecting member 26 has substantially the distance L that the pinion moves up the post fixed rack and the distance L that the rack 16 itself moves relative to the pinion 17. Will move up at a distance of 2L.
For this reason, when the intermediate plate 10 (pinion 17) is moved up by a distance L, the slide plate 11 (rack 16) is moved up by a distance 2L.
At this time, as a matter of course, the mold surface of the lower mold 5b in the upper mold 5 can be moved up by the distance L, and the mold surface of the lower mold 6b in the lower mold 6 can be moved to the distance. It can be moved up by 2L.
When the upper and lower molds 5 and 6 are individually opened by the mold opening / closing mechanism 13, the intermediate plate 10 (pinion 17) is moved downward by a distance L in the same manner as the mold clamping configuration described above. At this time, the slide plate 11 (rack 16) moves downward at a distance of 2L.

(About the thickness adjustment mechanism of the mold opening and closing means)
Further, as described above, the bearing portion 29 is provided with the thickness adjusting mechanism 14 having a floating structure.
That is, the thickness adjusting mechanism 14 includes a bearing portion main body 31 provided in a bearing portion 29 provided at the lower end of the pinion drooping member 30, a bearing portion sliding body (slider) 32 that receives the rotating shaft 27, and a sliding body. And a sliding hole 33 of the bearing portion main body for sliding the elastic member 32 up and down elastically.
Further, in the main body sliding hole 33, an elastic member 34 such as a compression spring that elastically slides the sliding body 32 up and down is provided separately on the upper side and the lower side of the sliding body 32.
Therefore, the sliding body 32 can be elastically slid up and down by the elastic member 34 in the main body sliding hole 33.
The sliding body 32 including the pinion 17 and the rotating shaft 27 can be elastically slid up and down (floating) by the elastic member 34 in the sliding hole 33 in the bearing body 31. .
That is, when the mold opening / closing mechanism 13 of the opening / closing means 12 supplies and sets two substrates 2 (2a, 2b) having different substrate thicknesses to the upper and lower molds 5, 6 respectively, and clamps the mold. In addition, two substrates 2 having different thicknesses corresponding to the thicknesses of the two substrates having different thicknesses (so-called thick and thin substrates) by the thickness adjusting mechanism 14 (elastic member 34). (2a, 2b) can be efficiently held between the mold surfaces separately (see FIG. 5).
Therefore, by using the thickness adjusting mechanism 14 (elastic member 34), the distances (intervals) between the mold surfaces can be adjusted efficiently for each of the two substrates 2 (2a, 2b) having different thicknesses. Can do.
For this reason, when the upper and lower molds 5 and 6 are clamped in the laminated mold mechanism 4, the mold surface (lower mold surface) and the substrate 2 (semiconductor chip mounting surface) are respectively provided in the upper and lower molds 5 and 6. It is possible to efficiently prevent a gap from being generated.
Further, when the upper and lower molds 5 and 6 are clamped, it is possible to efficiently prevent an excessive mold clamping pressure from being applied to the substrate 2 in each of the upper and lower molds 5 and 6.

(Regarding substrate thickness adjustment by the thickness adjustment mechanism)
Next, with reference to FIG. 5, the thickness adjusting operation of the substrate by the thickness adjusting mechanism 14 (elastic member 34) will be described.
In FIG. 5, the substrate 2a (2) having a large substrate thickness is clamped in the upper mold 5 and the substrate 2b (2) having a small substrate thickness is mold in the lower mold 6. The state to fasten is illustrated.

That is, as shown in FIG. 5, when the laminated mold mechanism 4 is clamped, the upper fixed platen 7 including the upper mold 5a disposed above, the post 9, and the post-side rack 15 are in a fixed state. Yes, a post-side group will be formed.
Further, at the time of mold clamping of the laminated mold mechanism part 4, the main body of the bearing part 29 having the intermediate plate 10 including the upper mold 5 b and the upper mold 6 a disposed below, the pinion hanging member 30, and the sliding hole 33. Thus, the intermediate plate side group is formed.
Further, at the time of mold clamping of the laminated mold mechanism unit 4, the slide plate 1 including the lower mold 6 b disposed below, the rack standing member 26, the slide plate side rack 16, the pinion 17, the rotating shaft 27 (the rotating mechanism) 28), the sliding body 32 is in a fixed state, and the slide plate side group is formed.
Accordingly, the elastic member 34 of the thickness adjusting mechanism 14 is configured so that the intermediate plate side group can be elastically moved up and down between the post side group and the slide plate side group.
For this reason, by adjusting the thickness of the substrate 2 (2a, 2b) by the thickness adjusting mechanism 14, the space between the mold surface of the upper mold 5a of the post side group and the mold surface of the lower mold 5b of the intermediate plate group. Alternatively, two substrates 2 (2a and 2b) having different substrate thicknesses can be efficiently and individually provided between the upper mold surface of the intermediate plate side group and the lower mold surface of the slide plate side group. It is comprised so that it can clamp and clamp.
In other words, when the upper and lower molds 5 and 6 in the laminated mold mechanism 4 are clamped, the post-side group is adjusted when the mold clamping is adjusted in accordance with the thickness of the substrate 2 (2a, 2b). (Rack 15) and slide plate side group (rack 16) are fixed via pinion 17 (sliding body 32 including rotating shaft 27), and are between the post side group and slide plate side group. The intermediate plate side group can be adjusted while being elastically moved up and down by the elastic member 34 (in an elastically buffered state).

(When clamping a thick substrate and a thin substrate)
Further, referring to FIG. 5, the thick substrate 2a is supplied to the upper die 5 (the substrate setting portion 19 of the upper die 5a), and the lower die 6 (the upper die 6a is set on the substrate). The case where the thin substrate 2b is supplied to the part 19) will be described in detail.
That is, when the upper and lower molds 5 and 6 in the laminated mold mechanism unit 4 are clamped, as described above, the pinion 17 (intermediate plate 10) that rotates forward is rotated by rotating the pinion 17 in the forward direction. The side rack 15 is moved up by the distance L, and the slide plate side rack 16 (slide plate 11) is moved up by the distance L by the rotation up-and-moving pinion 17. In each of 6, the mold surfaces can be closed and clamped at a uniform mold clamping speed.
That is, first, in the upper mold 5, the thick substrate 2 a supplied and set to the substrate setting portion 19 of the upper mold 5 a is sandwiched between the upper and lower molds 5 a and 5 b.
At this time, in the mold 6 disposed below, there is a gap between the lower surface (semiconductor chip mounting surface) of the thin substrate 2b supplied to the substrate setting portion 19 of the upper mold 6a and the mold surface of the lower mold 6b. Will do.
Further, by rotating the pinion 17 in the forward direction, the lower thickness of the mold 6 is thinly supplied and set to the substrate setting portion 19 of the upper mold 6a between the upper and lower molds 6a and 6b. The substrate 2b is sandwiched.
At this time, even if the slide plate 11 further moves up with respect to the slide plate 11 (the mold surface of the lower mold 6b in the lower arrangement) and the intermediate plate 10 (the mold surface of the lower mold 5b in the upper arrangement), the slide plate 11 Therefore, the sliding body 32 is elastically moved against the elastic member 34 in the sliding hole 33 of the main body, so that the sliding body 32 is moved by the elastic member 34 (thickness adjusting mechanism 14). Can be elastically buffered.
Therefore, the thickness adjustment mechanism 14 (elastic member 34) can efficiently adjust the thickness corresponding to the thick substrate 2a and the thin substrate 2b.

(About the configuration of the inload unit)
For example, as shown in FIG. 1, the inload unit B includes a substrate supply mechanism portion J and a resin material supply mechanism portion K.
Further, for example, as shown in FIG. 1, the substrate supply mechanism section J includes an inload mechanism in which a substrate loading section (stocker) 81 and a substrate 2 from the substrate loading section 81 are aligned in a required direction. D (upper inload unit 23, lower inload unit 24) and a substrate alignment unit 82 to be supplied and set are provided.
Therefore, the substrate 2 from the substrate loading unit 81 is aligned in a required direction by the substrate alignment unit 82, and the aligned substrate 2 is aligned with the upper inload unit 23 and the lower inload unit 24 in the inload mechanism D. In addition, it is configured so that it can be separately mounted and set.
Further, for example, as shown in FIG. 1, the resin material supply mechanism K includes a resin material loading unit 83 for loading a resin material (for example, granular resin), and a resin material ( And a resin material distribution section 84 for distributing and distributing the granular resin) to the inload mechanism D (upper inload section 23, lower inload section 24).
Accordingly, the granular resin from the resin material loading unit 83 is flattened and distributed (for example, to a resin container) by the resin material distribution unit 84, and the upper inload unit 23 and the lower inload in the inload mechanism D are distributed. A required amount of the planarizing resin material can be separately mounted on the portion 24.

(About the configuration of the outload unit)
For example, as shown in FIG. 1, the outload unit (molded product housing mechanism) C has a molded product on which the molded product 3 of the outload mechanism E (upper and lower outload units) is placed. The mounting portion 85 and a molded product storage portion 86 (stocker) for storing the molded product 3 from the molded product mounting portion are provided.
Accordingly, the molded product 3 placed on the molded product placing portion 85 from the outload mechanism E (upper and lower outload portions) can be accommodated in the molded product containing portion 86. ing.

(About the semiconductor chip compression molding method in the present invention)
That is, as shown in FIG. 1, the inload unit B sets the substrate 2 and a resin material (for example, granular resin) to the inload mechanism D, and the inloader mechanism D is moved from the inload unit B side to the mold unit. The inside of the moving area F of the inload mechanism is moved to the A side.
Next, as shown in FIG. 2, by causing the upper inload part 23 of the inload mechanism D to enter between the upper and lower molds 5a, 5b of the upper mold 5 in the laminated mold mechanism part 4 of the mold unit A, The substrate 2 on which the semiconductor chip is mounted is supplied to the substrate setting portion 19 of the upper mold 5a, and a required amount of the flattened granule resin is supplied into the lower mold cavity 21 to melt by heating.
Similarly to the upper mold 5, the lower inload part 24 of the inload mechanism D is inserted between the upper and lower molds 6 a and 6 b of the lower mold 6 so that the substrate setting part of the upper mold 6 a is inserted. A substrate 2 having a semiconductor chip mounted thereon is supplied to 19, and a required amount of flattened granular resin is supplied into the lower mold cavity 21 to be melted by heating.

Next, the inload mechanism D can be withdrawn, and the mold opening / closing means 12 (the mold opening / closing mechanism 13) and the pressurizing mechanism 18 can be used for each of the upper and lower molds 5 and 6 in the laminated mold mechanism unit 4. Clamping is performed to close the mold surfaces of the molds 5 and 6 (both upper and lower molds 5a, 5b, 6a, and 6b) separately.
At this time, each of the upper and lower molds 5 and 6 can be clamped separately by the pressurizing mechanism 18 with a required mold clamping pressure.
At this time, the thickness adjusting mechanism 14 in the mold opening / closing means 12 is made to correspond to the thickness of each substrate 2 (2a, 2b) supplied to each of the upper and lower molds 5, 6 and the intermediate plate. The substrate 2 (2a, 2b) is sandwiched between the mold surfaces of the upper and lower molds 5, 6 while the 10 side is elastically moved up and down (elastically buffered), and the mold is efficiently clamped. Can do.
At this time, the semiconductor chip mounted on the substrate 2 can be immersed in the heat-melted resin material in the lower mold cavity 21 in each of the upper and lower molds 5 and 6.
At this time, in each of the upper and lower molds 5 and 6, the resin in the lower mold cavity 21 can be pressurized with the required resin pressure by the cavity bottom surface member (22).
After the time required for curing has elapsed, each of the upper and lower molds 5 and 6 is opened separately to correspond to the shape of the lower mold cavity 21 in each of the upper and lower molds 5 and 6. The molded product 3 can be obtained by compression-molding the semiconductor chips mounted on the substrate 2 in the resin molding 35.

Next, the molded product 3 is taken out from the mold surface of the lower mold 5b by causing the upper outload portion of the outload mechanism E to enter between the upper and lower molds 5a and 5b of the upper mold 5. .
Similarly to the upper mold 5, the lower outload portion of the outload mechanism E is inserted between the upper and lower molds 6a and 6b of the lower mold 6 to form the lower mold 6b from the mold surface. Product 3 will be taken out.
Next, the outloader mechanism E is withdrawn to move the movement region G of the outloader mechanism from the mold unit A to the outload unit C, and the molded product 3 can be accommodated in the outload unit C.

(About the effect of this invention)
That is, according to the present invention, it is possible to form the semiconductor chip compression molding apparatus 1 including the laminated mold mechanism portion 4 in which the two semiconductor chip compression molds 5 and 6 are stacked in the vertical direction.
Accordingly, the installation space of the entire semiconductor chip compression molding apparatus according to the present invention can be efficiently reduced as compared with a semiconductor chip compression molding apparatus in which two semiconductor chip compression molding dies are arranged in a plane. .
Further, in the semiconductor chip compression molding apparatus 1 according to the present invention, a configuration in which two semiconductor chip compression molding dies 5 and 6 are stacked is adopted, whereby two semiconductor chip compression molding dies are obtained. The clamping force in the semiconductor chip compression molding apparatus 1 (molds 5 and 6) can be efficiently reduced as compared with the semiconductor chip compression molding apparatus (mold) arranged in a plane.

According to the present invention, when two compression molding dies 5 and 6 are stacked in the vertical direction in the compression molding apparatus, two mold opening / closing means 12 using a rack and pinion mechanism are used. The upper and lower compression molding dies 5 and 6 can be efficiently clamped.
In addition, when the compression molding die 5 (intermediate plate 10) arranged above is moved up by a distance L and clamped, the compression molding die 6 (slide plate 11) arranged below is moved up by a distance 2L. It can be moved and clamped.
In addition, the relative distance with reference to the intermediate plate 10 in the compression molding die 6 disposed below is L.
Further, according to the present invention, when the substrates 2 (2a, 2b) having different substrate thicknesses are used, the semiconductor chip compression molding apparatus 1 (molds 5, 6) is adapted to the thickness of the substrate 2. It can be efficiently adjusted and clamped.

  The present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as needed within a range not departing from the gist of the present invention.

In the above-described embodiment, a release film that covers (adsorbs) the lower mold cavity 21 for compression molding may be used.
For example, in the above-described embodiment, the flattened granule resin is supplied into the lower mold cavity 21 covered with the release film, heated and melted, and the semiconductor chip mounted on the substrate can be compression molded.
In the case where the release film is covered in the lower mold cavity 21, a configuration in which an intermediate mold is installed between the upper and lower molds and the release film is sandwiched between the lower mold and the intermediate mold can be used.

  Although the rack and pinion mechanism is employed as the mold opening / closing means 12 (mold opening / closing mechanism 13) in the above-described embodiment, for example, a link mechanism, a winding transmission mechanism, and a hydraulic transmission mechanism can be employed.

  Further, in the above-described embodiment, the configuration in which the inload unit B, the mold unit A, and the outload unit C are detachably installed in this order is illustrated, but the three types of units A, B, and C are arbitrary. In this order, they can be detachably installed in a row.

In the inload unit B, the substrate supply mechanism J can be unitized as a substrate supply unit, and the resin material supply mechanism K can be unitized as a resin material supply unit.
In this case, the substrate supply unit (J), the resin material supply unit (K), the outload unit C, and the mold unit A can be detachably mounted in a line in any order.

Further, in the above-described embodiment, the configuration in which the substrate 2 and the resin material are simultaneously transported to the multilayer mold mechanism portion 4 by the inload mechanism D (conveyance mechanism) is illustrated. However, in the above-described embodiment, the multilayer mold mechanism portion 4 is illustrated. Further, it is possible to adopt a configuration in which the substrate 2 and the resin material are separately transported by a dedicated transport mechanism (loader).
In the above-described embodiment, the conveyance of the pre-molding substrate 2 to the lamination mold mechanism unit 4 and the removal of the molded product 3 from the lamination mold mechanism unit 4 can be performed by the same conveyance mechanism (loader). .

In the above-described embodiment, a plurality of required mold units can be detachably installed in a row between the inload unit and the outload unit.
In addition, the inload unit B and the outload unit C are detachably installed in a row in any order on one side in a configuration in which the required plurality of mold units A are detachably installed in a row. Can be configured.
Therefore, as described above, by adopting a configuration in which a plurality of required mold units A are detachably installed in a row, the productivity of a molded product (product) that is compression-molded by the mold unit A can be efficiently improved. Can be improved.

  In the above-described embodiments, a liquid resin material or a powder resin material can be used instead of the granular resin material.

DESCRIPTION OF SYMBOLS 1 Semiconductor chip compression molding apparatus 1a Front side of apparatus 1b Rear side of apparatus 2 Substrate (substrate before molding)
2a Thick substrate 2b Thin substrate 3 Molded product (molded substrate)
Reference Signs List 4 Laminated mold mechanism 5 Upper compression mold 5a Upper mold 5b Lower mold 6 Lower compression mold 6a Upper mold 6b Lower mold 7 Upper fixed plate 8 Lower fixed plate 9 Post 10 Intermediate plate 11 Slide Plate 12 Mold opening / closing means 13 Mold opening / closing mechanism 14 Thickness adjustment mechanism 15 Rack (post side)
16 racks (slide plate side)
DESCRIPTION OF SYMBOLS 17 Pinion 18 Pressing mechanism 19 Substrate setting part 20 Suction hole 21 Cavity 22 Cavity bottom face member 23 Upper inload part 24 Lower inload part 25 Inload connection part 26 Rack standing member 27 Rotating shaft 28 Rotating mechanism 28 Bearing part 30 Pinion Suspended member 31 Bearing body 32 Sliding body 33 Sliding hole 34 Elastic member 35 Resin molded body 81 Substrate loading portion 82 Substrate alignment portion 83 Resin material loading portion 84 Resin material distribution portion 85 Molded product placement portion 86 Molded product storage section A Mold unit B Inload unit C Outload unit D Inload mechanism E Outload mechanism F Inload mechanism movement area G Outload mechanism movement area H Unit connector J Substrate supply mechanism K Resin material supply mechanism

Claims (9)

Two compression molding molds for compression molding an insert member having a required thickness with a resin material, an upper compression molding mold formed by laminating in a vertical direction and a lower compression molding mold; An upper die and a lower die provided in each of the two compression molding dies, an upper fixing plate for fixing the upper die placed above, a lower fixing plate provided at a position below the upper fixing plate, A required number of posts connecting the upper fixed platen and the lower fixed platen are provided between the upper die placed above and the upper die arranged below, and the upper and lower plates are fixed on the post. An intermediate plate provided slidably, a slide plate provided with the lower die arranged in the lower position and slidable up and down on the post, and an upper die surface provided in each of the compression molding dies Mold opening and closing means for closing the mold surface of the lower mold separately A pressurizing mechanism provided between the slide plate and the lower fixed plate and applying a required mold clamping pressure to the two compression molds from below the slide plate, and each of the mold surfaces of the upper mold A set portion of an insert member for supplying and setting an insert member having a required thickness, a compression molding cavity provided on each mold surface of each lower mold, and a supply into the compression molding cavity A step of preparing a mold unit including a heating means for heating the resin material,
A mold opening / closing mechanism of the mold opening / closing means is provided between one rack fixed to the post, the other rack fixed to a rack standing member standing on the slide plate, and the two racks described above. A pinion that is rotatably engaged with a gear, a rotating shaft provided on the pinion, a rotating mechanism that rotates the rotating shaft, a bearing that rotatably receives the rotating shaft, and the intermediate plate A pinion hanging member provided in a state where the bearing portion is provided at the lower end,
A thickness adjusting mechanism that adjusts the thickness of each insert member having a required thickness supplied to each of the upper-side compression molding die and the lower-side compression molding die on the mold opening / closing means. Providing and configuring; and
In the thickness adjusting mechanism of the mold opening / closing means, the main body of the bearing portion fixed to the pinion hanging member fixed to the other rack, the sliding hole formed in the bearing portion main body, and the inside of the sliding hole Providing a sliding body of a bearing portion that elastically slides up and down and rotatably receives the rotation shaft of the pinion, and an elastic member that elastically slides the sliding body up and down within the sliding hole; and
Supplying and setting each insert member having a required thickness to the set portion of the insert member provided in the upper die in each of the two compression molding dies; and
Supplying and heating a required amount of resin material separately into the compression molding cavities provided in the lower mold of each of the two compression molding molds; and
Clamping the upper mold and the lower mold in each of the two compression molding molds with a mold opening / closing mechanism of the mold opening / closing means;
When clamping each of the two compression molding dies, the sliding body is elastically moved up and down by the elastic member in the sliding hole of the bearing body by the thickness adjusting mechanism of the mold opening / closing means. A step of adjusting the thickness of the insert member that is compression-molded by the compression molding die of the upper arrangement and the compression molding mold of the lower arrangement by laminating and clamping in the vertical direction;
A compression molding method comprising: a step of compressing the insert member in the compression molding cavity by pressurizing a resin in the compression molding cavity in each of the two compression molding dies. .   When each of the two compression molding dies is clamped, the lower mold in the upper compression molding mold is moved by a distance L, and the lower mold in the lower compression molding mold is moved. The compression molding method according to claim 1, further comprising a step of moving at a distance of 2L. Coating a release film in a compression molding cavity in each of the two compression molding molds;
The compression molding method according to claim 1, further comprising a step of supplying a resin material to each of the compression molding cavities coated with the release film and heating.   From each of the mold unit having the two compression molding dies, an inload unit for supplying an insert member and a resin material to each of the compression molding dies of the mold unit, and the compression molding die of the mold unit The compression molding method according to claim 1, further comprising a step of providing an outload unit for taking out and storing the molded product.   The compression molding method according to claim 4, further comprising a step of detachably mounting the mold unit, the inload unit, and the outload unit to each other.   The compression molding method according to claim 1, further comprising a step of preparing a plurality of the mold units. Preparing a plurality of the mold units;
The compression molding method according to claim 1, further comprising a step of detachably mounting another one of the mold units with respect to one of the mold units. Providing an inloader mechanism for supplying an insert member and a resin material to each of the compression molds in the mold unit;
The compression molding method according to claim 1, further comprising a step of providing an outloader mechanism for taking out a molded product from each of the compression molds in the mold unit.   The method further comprises the step of providing a loader for supplying an insert member and a resin material to each of the compression molds in the mold unit and taking out a molded product from each of the compression molds in the mold unit. 2. The compression molding method according to 1.

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