JP2013207093A - Flexible printed wiring board and manufacturing method thereof - Google Patents

Flexible printed wiring board and manufacturing method thereof Download PDF

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JP2013207093A
JP2013207093A JP2012074647A JP2012074647A JP2013207093A JP 2013207093 A JP2013207093 A JP 2013207093A JP 2012074647 A JP2012074647 A JP 2012074647A JP 2012074647 A JP2012074647 A JP 2012074647A JP 2013207093 A JP2013207093 A JP 2013207093A
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opening
metal
exposed
flexible printed
wiring board
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Kunihiko Adachi
達 邦 彦 安
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Nippon Mektron KK
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Nippon Mektron KK
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Priority to JP2012074647A priority Critical patent/JP2013207093A/en
Priority to PCT/JP2012/076295 priority patent/WO2013145390A1/en
Priority to TW101143460A priority patent/TW201345372A/en
Publication of JP2013207093A publication Critical patent/JP2013207093A/en
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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  • Engineering & Computer Science (AREA)
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Abstract

PROBLEM TO BE SOLVED: To provide a flexible printed wiring board with excellent in heat dissipation.SOLUTION: A flexible printed wiring board 20 according to one embodiment comprises: a base film 2; a metal-clad laminate sheet 1 formed on a bottom face of the base film 2 having adhesive agent 3 therebetween and including a wiring pattern with land part 4a; a coverlay 5 including a cover film 5a, an adhesive layer 5b on a top face of the cover film 5a, and an opening 11 provided thereto, and adhered to a bottom face of the metal-clad laminate sheet 1 through the adhesive layer 5b so that a region including a component mounting region A is exposed from the opening 11; a metal reinforcement plate 6 adhered onto the metal-clad laminate sheet 1 exposed from the opening 11 with adhesive agent; a semiconductor chip 8 penetrating through the base film 2 in a thickness direction, mounted within an opening 12 from which a wiring pattern in the component mounting region A is exposed toward a bottom surface, and a connection terminal 8a thereof electrically connected through solder 10 to the land part 4a exposed from the opening 12.

Description

本発明は、フレキシブルプリント配線板およびその製造方法、さらに詳しくは、フレキシブルプリント配線板に搭載された半導体部品が発する熱を逃すための放熱構造を有するフレキシブルプリント配線板、及びその製造方法に関する。   The present invention relates to a flexible printed wiring board and a manufacturing method thereof, and more particularly to a flexible printed wiring board having a heat dissipation structure for releasing heat generated by a semiconductor component mounted on the flexible printed wiring board, and a manufacturing method thereof.

フレキシブルプリント配線板（ＦＰＣ）に搭載される半導体部品は、年々、小型化および高発熱密度化が進んでいる。ＦＰＣに実装された半導体部品の寿命や動作に影響を与えないように、半導体部品の発する熱を外部に逃す必要がある。放熱方法としては、プリント配線板に放熱板を設ける手法が知られている（特許文献１〜３）。   Semiconductor components mounted on flexible printed wiring boards (FPCs) are becoming smaller and higher in heat generation year by year. In order not to affect the life and operation of the semiconductor component mounted on the FPC, it is necessary to release heat generated by the semiconductor component to the outside. As a heat dissipation method, a method of providing a heat dissipation plate on a printed wiring board is known (Patent Documents 1 to 3).

特開２００４−１７９３０９号公報JP 2004-179309 A 特開平８−２６４９１０号公報JP-A-8-264910 特開平７−３０７５３３号公報JP-A-7-307533

図３は、従来の放熱板を備えたフレキシブルプリント配線板の一例を示す断面図である。図３に示すように、ポリイミド等からなるベースフィルム１０２と、その表面に接着剤１０３を介して形成された銅箔１０４とを有する片面銅張積層板１０１の上面に、半導体チップ１０８が搭載されている。より詳しくは、半導体チップ１０８の接続端子と、銅箔１０４を加工してなる配線パターンとがはんだ１１０を介して電気的に接続されている。   FIG. 3 is a cross-sectional view showing an example of a flexible printed wiring board provided with a conventional heat sink. As shown in FIG. 3, a semiconductor chip 108 is mounted on the upper surface of a single-sided copper-clad laminate 101 having a base film 102 made of polyimide or the like and a copper foil 104 formed on the surface thereof with an adhesive 103. ing. More specifically, the connection terminal of the semiconductor chip 108 and the wiring pattern formed by processing the copper foil 104 are electrically connected via the solder 110.

また、図３に示すように、半導体チップ１０８の搭載領域に開口部１１１が設けられたカバーレイ１０５が片面銅張積層板１０１の上に接着されている。このカバーレイ１０５は、ポリイミド等からなるカバーフィルム１０５ａと、その片面に形成された接着剤１０５ｂとを有する。また、アンダーフィル材１０９がカバーレイ１０５の開口部１１１に充填されている。   Further, as shown in FIG. 3, a coverlay 105 having an opening 111 provided in the mounting region of the semiconductor chip 108 is bonded onto the single-sided copper-clad laminate 101. The cover lay 105 includes a cover film 105a made of polyimide or the like, and an adhesive 105b formed on one surface thereof. An underfill material 109 is filled in the opening 111 of the cover lay 105.

また、図３に示すように、放熱板として機能する金属補強板１０６が、接着剤１０７を介して片面銅張積層板１０１の下面に接着されている。   Further, as shown in FIG. 3, a metal reinforcing plate 106 that functions as a heat radiating plate is bonded to the lower surface of the single-sided copper-clad laminate 101 via an adhesive 107.

上記のように、従来のフレキシブルプリント配線板１００では、金属補強板１０６と銅箔１０４との間に少なくともベースフィルム１０２が介在するため、銅箔１０４と金属補強板１０６との間の熱抵抗が大きくなり、半導体チップ１０８の放熱性を十分確保できないという課題がある。   As described above, in the conventional flexible printed wiring board 100, since at least the base film 102 is interposed between the metal reinforcing plate 106 and the copper foil 104, the thermal resistance between the copper foil 104 and the metal reinforcing plate 106 is low. There is a problem that the heat dissipation of the semiconductor chip 108 cannot be sufficiently secured.

本発明は、上記の技術的認識に基づいてなされたものであり、その目的は、放熱性に優れたフレキシブルプリント配線板を提供することである。   This invention is made | formed based on said technical recognition, The objective is to provide the flexible printed wiring board excellent in heat dissipation.

本発明の一態様によるフレキシブルプリント配線板は、
絶縁性を有するベースフィルムと、前記ベースフィルムの下面に直接あるいは接着剤を介して形成され、かつランド部を含む配線パターンとを有する金属張積層板と、
絶縁性を有するカバーフィルムと、前記カバーフィルムの上面に形成された接着剤層とを有し、かつ前記カバーフィルム及び前記接着剤層を厚さ方向に貫通する第１の開口部が設けられたカバーレイであって、部品搭載領域を含む領域が前記第１の開口部に露出するように、前記金属張積層板の下面に前記接着剤層を介して接着されたカバーレイと、
前記第１の開口部に露出した前記金属張積層板に接着剤を介して接着された金属補強板と、
前記ベースフィルムを厚さ方向に貫通し、前記部品搭載領域における前記配線パターンが底面に露出する第２の開口部内に搭載され、かつ、接続端子が前記第２の開口部に露出した前記ランド部とはんだを介して電気的に接続された半導体チップと、
を備えることを特徴とする。 The flexible printed wiring board according to one aspect of the present invention is
A metal-clad laminate having an insulating base film, and a wiring pattern formed on the lower surface of the base film directly or via an adhesive and including a land portion;
A first opening that includes an insulating cover film and an adhesive layer formed on the upper surface of the cover film and penetrates the cover film and the adhesive layer in a thickness direction is provided. A cover lay that is bonded to the lower surface of the metal-clad laminate via the adhesive layer so that a region including a component mounting region is exposed to the first opening,
A metal reinforcing plate bonded to the metal-clad laminate exposed in the first opening via an adhesive;
The land portion which penetrates the base film in the thickness direction, is mounted in a second opening portion where the wiring pattern in the component mounting region is exposed on the bottom surface, and the connection terminal is exposed in the second opening portion. And a semiconductor chip electrically connected via solder,
It is characterized by providing.

本発明の一態様によるフレキシブルプリント配線板の製造方法は、
絶縁性を有するベースフィルムと、前記ベースフィルムの上面に直接あるいは接着剤を介して形成された金属箔とを有する金属張積層板の前記金属箔を、ランド部を有する配線パターンに加工する工程と、
絶縁性を有するカバーフィルムと、前記カバーフィルムの片面に形成された接着剤層とを有し、かつ前記カバーフィルム及び前記接着剤層を厚さ方向に貫通する第１の開口部が設けられたカバーレイを、部品搭載領域を含む領域が前記第１の開口部に露出するように、前記金属張積層板の上面に前記接着剤層を介して接着する工程と、
金属補強板を前記第１の開口部に露出した前記金属張積層板に接着剤を介して接着する工程と、
前記部品搭載領域における前記ベースフィルムを除去して、底面に前記ランド部が露出した第２の開口部を形成する工程と、
前記第２の開口部内に半導体チップを搭載し、前記ランド部と前記半導体チップの接続端子とをはんだを介して電気的に接続する搭載工程と、
を備えることを特徴とする。 A method for producing a flexible printed wiring board according to an aspect of the present invention includes:
Processing the metal foil of the metal-clad laminate having a base film having insulating properties and a metal foil formed directly or via an adhesive on the upper surface of the base film into a wiring pattern having a land portion; ,
A first opening that includes an insulating cover film and an adhesive layer formed on one side of the cover film and penetrates the cover film and the adhesive layer in a thickness direction is provided. Bonding the coverlay to the upper surface of the metal-clad laminate via the adhesive layer such that a region including a component mounting region is exposed in the first opening;
Bonding a metal reinforcing plate to the metal-clad laminate exposed in the first opening via an adhesive;
Removing the base film in the component mounting region to form a second opening in which the land portion is exposed on the bottom surface;
A mounting step of mounting a semiconductor chip in the second opening, and electrically connecting the land portion and a connection terminal of the semiconductor chip via solder;
It is characterized by providing.

上記構成のフレキシブルプリント配線板では、放熱板として機能する金属補強板と配線パターンとの間には、金属補強板を金属張積層板に接着するための接着剤しか介在しない。このため、両者の間の熱抵抗を低減させることができ、半導体チップが発した熱を金属補強板から効率良く放熱することができる。   In the flexible printed wiring board configured as described above, only an adhesive for bonding the metal reinforcing plate to the metal-clad laminate is interposed between the metal reinforcing plate functioning as a heat sink and the wiring pattern. For this reason, the thermal resistance between both can be reduced, and the heat generated by the semiconductor chip can be efficiently radiated from the metal reinforcing plate.

よって、本発明によれば、放熱性に優れたフレキシブルプリント配線板を提供することができる。   Therefore, according to this invention, the flexible printed wiring board excellent in heat dissipation can be provided.

本発明の一実施形態によるフレキシブルプリント配線板の断面図である。It is sectional drawing of the flexible printed wiring board by one Embodiment of this invention. 本発明の一実施形態によるフレキシブルプリント配線板の製造方法を説明するための工程断面図である。It is process sectional drawing for demonstrating the manufacturing method of the flexible printed wiring board by one Embodiment of this invention. 図２Ａに続く、本発明の一実施形態によるフレキシブルプリント配線板の製造方法を説明するための工程断面図である。It is process sectional drawing for demonstrating the manufacturing method of the flexible printed wiring board by one Embodiment of this invention following FIG. 2A. 従来のフレキシブルプリント配線板の一例の断面図である。It is sectional drawing of an example of the conventional flexible printed wiring board.

以下、図面を参照しながら、本発明の実施形態について説明する。なお、各図において同等の機能を有する構成要素には同一の符号を付し、同一符号の構成要素の詳しい説明は繰り返さない。また、図面は模式的なものであり、実施形態に係る特徴部分を中心に示すものであり、厚みと平面寸法との関係、各層の厚みの比率等は現実のものとは異なる。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, the component which has an equivalent function is attached | subjected the same code | symbol, and detailed description of the component of the same code | symbol is not repeated. Further, the drawings are schematic and show mainly the characteristic portions according to the embodiment, and the relationship between the thickness and the planar dimension, the ratio of the thickness of each layer, and the like are different from the actual ones.

（フレキシブルプリント配線板）
本発明の一実施形態によるフレキシブルプリント配線板の構成について説明する。図１は本発明の一実施形態によるフレキシブルプリント配線板の断面図を示している。 (Flexible printed wiring board)
A configuration of a flexible printed wiring board according to an embodiment of the present invention will be described. FIG. 1 shows a cross-sectional view of a flexible printed wiring board according to an embodiment of the present invention.

図１に示すように、本実施形態によるフレキシブルプリント配線板２０は、金属張積層板１と、金属張積層板１の下面に接着されたカバーレイ５と、カバーレイ５の開口部１１に露出した金属張積層板１に接着された金属補強板（放熱板）６と、金属張積層板１の開口部１２内に搭載された半導体チップ８と、開口部１２内に充填されたアンダーフィル材９を備えている。   As shown in FIG. 1, the flexible printed wiring board 20 according to the present embodiment is exposed to the metal-clad laminate 1, the cover lay 5 bonded to the lower surface of the metal-clad laminate 1, and the opening 11 of the cover lay 5. The metal reinforcing plate (heat radiating plate) 6 bonded to the metal-clad laminate 1, the semiconductor chip 8 mounted in the opening 12 of the metal-clad laminate 1, and the underfill material filled in the opening 12 9 is provided.

次に、フレキシブルプリント配線板２０の各構成要素について詳しく説明する。   Next, each component of the flexible printed wiring board 20 will be described in detail.

金属張積層板１は、絶縁性を有するベースフィルム２と、ベースフィルム２の下面に接着剤３を介して形成され、かつランド部４ａを含む配線パターンとを有する。配線パターンは、銅箔などの金属箔４をパターニングして形成されたものである。なお、ランド部４ａを含む配線パターンは、ベースフィルム２の上に接着剤３を介さず直接形成されていてもよい。また、ベースフィルム２は、ポリイミド、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）など、ＦＰＣのベース材として一般的に用いられる材料を適用可能である。   The metal-clad laminate 1 has an insulating base film 2 and a wiring pattern formed on the lower surface of the base film 2 via an adhesive 3 and including a land portion 4a. The wiring pattern is formed by patterning a metal foil 4 such as a copper foil. In addition, the wiring pattern including the land portion 4a may be directly formed on the base film 2 without the adhesive 3 interposed therebetween. The base film 2 may be made of a material generally used as a base material for FPC, such as polyimide, polyethylene terephthalate (PET), and polyethylene naphthalate (PEN).

カバーレイ５は、絶縁性を有するカバーフィルム５ａと、このカバーフィルム５ａの上面に形成された接着剤層５ｂとを有する。このカバーレイ５には、カバーフィルム５ａ及び接着剤層５ｂを厚さ方向に貫通する開口部１１が設けられている。なお、カバーフィルム５ａは、ポリイミド、ポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）などの材料を適用可能である。   The coverlay 5 includes an insulating cover film 5a and an adhesive layer 5b formed on the upper surface of the cover film 5a. The cover lay 5 is provided with an opening 11 that penetrates the cover film 5a and the adhesive layer 5b in the thickness direction. In addition, materials, such as a polyimide, a polyethylene terephthalate (PET), a polyethylene naphthalate (PEN), are applicable for the cover film 5a.

図１に示すように、カバーレイ５は、部品搭載領域を含む領域が開口部１１に露出するように、金属張積層板１の下面に接着剤層５ｂを介して接着されている。ここで、部品搭載領域は、半導体チップ８が搭載される領域をいう。   As shown in FIG. 1, the coverlay 5 is bonded to the lower surface of the metal-clad laminate 1 via an adhesive layer 5 b so that a region including a component mounting region is exposed to the opening 11. Here, the component mounting area refers to an area where the semiconductor chip 8 is mounted.

金属補強板６は、アルミニウム板や銅板など熱伝導性に優れた金属からなり、開口部１１に露出した金属張積層板１に接着剤７を介して接着されている。なお、接着剤７は、熱伝導性を良くするため、セラミック等のフィラーを多く含有する接着剤であってもよい。   The metal reinforcing plate 6 is made of a metal having excellent thermal conductivity, such as an aluminum plate or a copper plate, and is bonded to the metal-clad laminate 1 exposed in the opening 11 via an adhesive 7. The adhesive 7 may be an adhesive containing a large amount of filler such as ceramic in order to improve thermal conductivity.

半導体チップ８は、ベースフィルム２及び接着剤３を厚さ方向に貫通するように金属張積層板１に形成された開口部１２内に搭載されている。開口部１２の底面には、部品搭載領域における配線パターン（ランド部４ａを含む。）が露出している。図１に示すように、半導体チップ８の接続端子８ａは、開口部１２に露出したランド部４ａとはんだ１０を介して電気的に接続されている。半導体チップ８は、例えば、ハードディスクドライブ（ＨＤＤ）のプリアンプやＬＥＤ等の発光素子などである。   The semiconductor chip 8 is mounted in an opening 12 formed in the metal-clad laminate 1 so as to penetrate the base film 2 and the adhesive 3 in the thickness direction. On the bottom surface of the opening 12, the wiring pattern (including the land 4a) in the component mounting area is exposed. As shown in FIG. 1, the connection terminal 8 a of the semiconductor chip 8 is electrically connected to the land 4 a exposed in the opening 12 via the solder 10. The semiconductor chip 8 is, for example, a hard disk drive (HDD) preamplifier or a light emitting element such as an LED.

アンダーフィル材９は、接続端子８ａとランド部４ａとの接続部分を保護するため、当該接続部分を埋設するように開口部１２に充填されている。なお、このアンダーフィル材９は、半導体チップ８によっては必ずしも必要ではない。例えば、半導体チップ８がＬＥＤチップの場合、アンダーフィル材９は必須ではない。   The underfill material 9 is filled in the opening 12 so as to bury the connection portion in order to protect the connection portion between the connection terminal 8a and the land portion 4a. The underfill material 9 is not always necessary depending on the semiconductor chip 8. For example, when the semiconductor chip 8 is an LED chip, the underfill material 9 is not essential.

上記構成のフレキシブルプリント配線板２０では、図１に示すように、放熱板として機能する金属補強板６と配線パターンを構成する金属箔４との間には、接着剤７しか介在しない。このため、半導体チップ８が発した熱を金属補強板６から効率良く放熱することができる。よって、本実施形態によれば、放熱性に優れたフレキシブルプリント配線板を提供することができる。   In the flexible printed wiring board 20 having the above configuration, as shown in FIG. 1, only the adhesive 7 is interposed between the metal reinforcing plate 6 functioning as a heat sink and the metal foil 4 constituting the wiring pattern. For this reason, the heat generated by the semiconductor chip 8 can be efficiently radiated from the metal reinforcing plate 6. Therefore, according to this embodiment, a flexible printed wiring board excellent in heat dissipation can be provided.

（フレキシブルプリント配線板の製造方法）
次に、前述のフレキシブルプリント配線板２０の製造方法について、図２Ａ、図２Ｂおよび図１を参照しつつ説明する。図２Ａ及び図２Ｂは、フレキシブルプリント配線板２０の製造方法を説明するための工程断面図を示している。 (Method for manufacturing flexible printed wiring board)
Next, a method for manufacturing the above-described flexible printed wiring board 20 will be described with reference to FIGS. 2A, 2B, and 1. FIG. 2A and 2B are process cross-sectional views for explaining a method for manufacturing the flexible printed wiring board 20.

（１）図２Ａ（１）に示すように、絶縁性を有するベースフィルム２と、ベースフィルム２の上面に接着剤３を介して形成された金属箔４とを有する金属張積層板１を用意する。なお、金属箔４がベースフィルム２の上面に直接形成された金属張積層板を用いてもよい。金属箔４は、例えば銅箔であるが、他の金属（銀など）からなる薄膜でもよい。ベースフィルム２の厚みは、例えば１２．５〜２５μｍである。接着剤３の厚みは、例えば１０〜１８μｍである。 (1) As shown in FIG. 2A (1), a metal-clad laminate 1 having an insulating base film 2 and a metal foil 4 formed on the upper surface of the base film 2 via an adhesive 3 is prepared. To do. A metal-clad laminate in which the metal foil 4 is directly formed on the upper surface of the base film 2 may be used. The metal foil 4 is, for example, a copper foil, but may be a thin film made of another metal (such as silver). The thickness of the base film 2 is 12.5-25 micrometers, for example. The thickness of the adhesive 3 is, for example, 10 to 18 μm.

（２）次に、図２Ａ（２）に示すように、金属張積層板１の金属箔４を、ランド部４ａを有する配線パターン４ｂに加工する。この金属箔４の加工は、サブトラクティブ法など公知のパターン形成技術を適用することが可能である。 (2) Next, as shown in FIG. 2A (2), the metal foil 4 of the metal-clad laminate 1 is processed into a wiring pattern 4b having land portions 4a. A known pattern forming technique such as a subtractive method can be applied to the processing of the metal foil 4.

（３）次に、図２Ａ（３）に示すように、部品搭載領域Ａを含む領域が開口部１１に露出するように、カバーレイ５を、金属張積層板１の上面に接着剤層５ｂを介して接着する。なお、カバーレイ５は、前述のように、絶縁性を有するカバーフィルム５ａと、カバーフィルム５ａの片面に形成された接着剤層５ｂとを有する。カバーフィルム５ａの厚みは、例えば１２．５〜２５μｍである。接着剤層５ｂの厚みは、配線パターン４ｂを充填するために若干厚めであり、例えば１５〜３６μｍである。 (3) Next, as shown in FIG. 2A (3), the cover lay 5 is placed on the upper surface of the metal-clad laminate 1 so that the region including the component mounting region A is exposed to the opening 11. Glue through. In addition, the coverlay 5 has the cover film 5a which has insulation as mentioned above, and the adhesive bond layer 5b formed in the single side | surface of the cover film 5a. The thickness of the cover film 5a is, for example, 12.5 to 25 μm. The thickness of the adhesive layer 5b is slightly thick to fill the wiring pattern 4b, for example, 15 to 36 μm.

（４）次に、図２Ｂ（４）に示すように、金属補強板６を開口部１１に露出した金属張積層板１に接着剤７を介して接着する。 (4) Next, as shown in FIG. 2B (4), the metal reinforcing plate 6 is bonded to the metal-clad laminate 1 exposed in the opening 11 via an adhesive 7.

（５）次に、部品搭載領域Ａにおけるベースフィルム２及び接着剤３を除去して、底面にランド部４ａが露出した開口部１２を形成する。なお、本工程の開口部１２の形成は、例えば、図２Ｂ（５）に示すように、金属補強板６が接着された金属張積層板６を上下反転させ、金属張積層板６の上面にレーザ光を照射して行う。あるいは、ポリイミドエッチングなどのケミカルエッチングにより、開口部１２を形成してもよい。 (5) Next, the base film 2 and the adhesive 3 in the component mounting area A are removed to form the opening 12 where the land portion 4a is exposed on the bottom surface. 2B (5), for example, the metal-clad laminate 6 to which the metal reinforcing plate 6 is bonded is turned upside down so that the opening 12 is formed on the upper surface of the metal-clad laminate 6 as shown in FIG. This is performed by irradiating with laser light. Alternatively, the opening 12 may be formed by chemical etching such as polyimide etching.

（６）次に、図１に示すように、開口部１２内に半導体チップ８を搭載し、ランド部４ａと半導体チップ８の接続端子８ａとをはんだ１０を介して電気的に接続する（フリップチップ実装）。 (6) Next, as shown in FIG. 1, the semiconductor chip 8 is mounted in the opening 12, and the land 4a and the connection terminal 8a of the semiconductor chip 8 are electrically connected via the solder 10 (flip Chip mounting).

（７）次に、接続端子８ａとランド部４ａとの接続部分を埋設するように、開口部１２にアンダーフィル材９を充填する。なお、本工程は、半導体チップ８の種別に応じて適宜行うもので、必須の工程ではない。 (7) Next, the underfill material 9 is filled into the opening 12 so as to embed a connection portion between the connection terminal 8a and the land portion 4a. In addition, this process is appropriately performed according to the type of the semiconductor chip 8, and is not an essential process.

上記の工程を経て、図１に示すフレキシブルプリント配線板２０を作製することができる。本実施形態によるフレキシブルプリント配線板２０では、カバーフィルムが従来のベースフィルムに相当し、ベースフィルムが従来のカバーフィルムに相当すると捉えることも可能である。   Through the above steps, the flexible printed wiring board 20 shown in FIG. 1 can be produced. In the flexible printed wiring board 20 according to the present embodiment, it can also be understood that the cover film corresponds to a conventional base film, and the base film corresponds to a conventional cover film.

本実施形態によれば、配線パターン４ｂと金属補強板６との間の絶縁フィルムをなくすことができるため、両者の間の熱抵抗を低減させ、放熱性を向上させることができる。   According to this embodiment, since the insulating film between the wiring pattern 4b and the metal reinforcement board 6 can be eliminated, the thermal resistance between the two can be reduced and the heat dissipation can be improved.

上記の記載に基づいて、当業者であれば、本発明の追加の効果や種々の変形を想到できるかもしれないが、本発明の態様は、上述した実施形態に限定されるものではない。特許請求の範囲に規定された内容及びその均等物から導き出される本発明の概念的な思想と趣旨を逸脱しない範囲で種々の追加、変更及び部分的削除が可能である。   Based on the above description, those skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the above-described embodiments. Various additions, modifications, and partial deletions can be made without departing from the concept and spirit of the present invention derived from the contents defined in the claims and equivalents thereof.

１ 金属張積層板
２ ベースフィルム
３ 接着剤
４ 金属箔
４ａ ランド部
４ｂ 配線パターン
５ カバーレイ
５ａ カバーフィルム
５ｂ 接着剤
６ 金属補強板（放熱板）
７ 接着剤
８ 半導体チップ
８ａ 接続端子
９ アンダーフィル材
１０ はんだ
１１，１２ 開口部
２０ フレキシブルプリント配線板
１００ フレキシブルプリント配線板
１０１ 片面銅張積層板
１０２ ベースフィルム
１０３ 接着剤
１０４ 銅箔
１０５ カバーレイ
１０５ａ カバーフィルム
１０５ｂ 接着剤
１０６ 金属補強板（放熱板）
１０７ 接着剤
１０８ 半導体チップ
１０９ アンダーフィル材
１１０ はんだ
１１１ 開口部
Ａ 部品搭載領域 DESCRIPTION OF SYMBOLS 1 Metal-clad laminated board 2 Base film 3 Adhesive 4 Metal foil 4a Land part 4b Wiring pattern 5 Cover lay 5a Cover film 5b Adhesive 6 Metal reinforcement board (heat sink)
7 Adhesive 8 Semiconductor chip 8a Connection terminal 9 Underfill material 10 Solder 11, 12 Opening 20 Flexible printed wiring board 100 Flexible printed wiring board 101 Single-sided copper clad laminate 102 Base film 103 Adhesive 104 Copper foil 105 Cover lay 105a Cover Film 105b Adhesive 106 Metal reinforcing plate (heat sink)
107 Adhesive 108 Semiconductor Chip 109 Underfill Material 110 Solder 111 Opening A Component Mounting Area

Claims (5)

絶縁性を有するベースフィルムと、前記ベースフィルムの下面に直接あるいは接着剤を介して形成され、かつランド部を含む配線パターンとを有する金属張積層板と、
絶縁性を有するカバーフィルムと、前記カバーフィルムの上面に形成された接着剤層とを有し、かつ前記カバーフィルム及び前記接着剤層を厚さ方向に貫通する第１の開口部が設けられたカバーレイであって、部品搭載領域を含む領域が前記第１の開口部に露出するように、前記金属張積層板の下面に前記接着剤層を介して接着されたカバーレイと、
前記第１の開口部に露出した前記金属張積層板に接着剤を介して接着された金属補強板と、
前記ベースフィルムを厚さ方向に貫通し、前記部品搭載領域における前記配線パターンが底面に露出する第２の開口部内に搭載され、かつ、接続端子が前記第２の開口部に露出した前記ランド部とはんだを介して電気的に接続された半導体チップと、
を備えることを特徴とするフレキシブルプリント配線板。 A metal-clad laminate having an insulating base film, and a wiring pattern formed on the lower surface of the base film directly or via an adhesive and including a land portion;
A first opening that includes an insulating cover film and an adhesive layer formed on the upper surface of the cover film and penetrates the cover film and the adhesive layer in a thickness direction is provided. A cover lay that is bonded to the lower surface of the metal-clad laminate via the adhesive layer so that a region including a component mounting region is exposed to the first opening,
A metal reinforcing plate bonded to the metal-clad laminate exposed in the first opening via an adhesive;
The land portion that penetrates the base film in the thickness direction, is mounted in a second opening portion where the wiring pattern in the component mounting region is exposed on the bottom surface, and the connection terminal is exposed in the second opening portion. And a semiconductor chip electrically connected via solder,
A flexible printed wiring board comprising: 前記接続端子と前記ランド部との接続部分を埋設するように、前記第２の開口部内に充填されたアンダーフィル材をさらに備えることを特徴とする請求項１に記載のフレキシブルプリント配線板。   The flexible printed wiring board according to claim 1, further comprising an underfill material filled in the second opening so as to embed a connection portion between the connection terminal and the land portion. 絶縁性を有するベースフィルムと、前記ベースフィルムの上面に直接あるいは接着剤を介して形成された金属箔とを有する金属張積層板の前記金属箔を、ランド部を有する配線パターンに加工する工程と、
絶縁性を有するカバーフィルムと、前記カバーフィルムの片面に形成された接着剤層とを有し、かつ前記カバーフィルム及び前記接着剤層を厚さ方向に貫通する第１の開口部が設けられたカバーレイを、部品搭載領域を含む領域が前記第１の開口部に露出するように、前記金属張積層板の上面に前記接着剤層を介して接着する工程と、
金属補強板を前記第１の開口部に露出した前記金属張積層板に接着剤を介して接着する工程と、
前記部品搭載領域における前記ベースフィルムを除去して、底面に前記ランド部が露出した第２の開口部を形成する工程と、
前記第２の開口部内に半導体チップを搭載し、前記ランド部と前記半導体チップの接続端子とをはんだを介して電気的に接続する搭載工程と、
を備えることを特徴とするフレキシブルプリント配線板の製造方法。 Processing the metal foil of the metal-clad laminate having a base film having insulating properties and a metal foil formed directly or via an adhesive on the upper surface of the base film into a wiring pattern having a land portion; ,
A first opening that includes an insulating cover film and an adhesive layer formed on one side of the cover film and penetrates the cover film and the adhesive layer in a thickness direction is provided. Bonding the coverlay to the upper surface of the metal-clad laminate via the adhesive layer such that a region including a component mounting region is exposed in the first opening;
Bonding a metal reinforcing plate to the metal-clad laminate exposed in the first opening via an adhesive;
Removing the base film in the component mounting region to form a second opening in which the land portion is exposed on the bottom surface;
A mounting step of mounting a semiconductor chip in the second opening, and electrically connecting the land portion and a connection terminal of the semiconductor chip via solder;
The manufacturing method of the flexible printed wiring board characterized by the above-mentioned. 前記搭載工程の後、前記接続端子と前記ランド部との接続部分を埋設するように、前記第２の開口部にアンダーフィル材を充填する工程をさらに備えることを特徴とする請求項３に記載のフレキシブルプリント配線板の製造方法。   4. The method according to claim 3, further comprising a step of filling the second opening with an underfill material so as to embed a connection portion between the connection terminal and the land portion after the mounting step. Manufacturing method of flexible printed wiring board. 前記第２の開口部は、レーザ加工またはケミカルエッチングにより形成することを特徴とする請求項３又は４に記載のフレキシブルプリント配線板の製造方法。   The method for manufacturing a flexible printed wiring board according to claim 3, wherein the second opening is formed by laser processing or chemical etching.
JP2012074647A 2012-03-28 2012-03-28 Flexible printed wiring board and manufacturing method thereof Pending JP2013207093A (en)

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PCT/JP2012/076295 WO2013145390A1 (en) 2012-03-28 2012-10-11 Flexible printed circuit board and fabrication process for same
TW101143460A TW201345372A (en) 2012-03-28 2012-11-21 Flexible printed circuit board and fabrication process for same

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015142053A (en) * 2014-01-29 2015-08-03 住友電気工業株式会社 Method of manufacturing electronic part
KR101915678B1 (en) * 2016-12-23 2018-11-06 한화첨단소재 주식회사 Elctromagnetic interference shielding film, elctromagnetic interference shielding laminated body comprising the same, and method for prepareing the same

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CN115580990A (en) * 2022-10-26 2023-01-06 武汉元禄光电技术有限公司 Rapid FPC (Flexible printed Circuit) production process by all-dry process

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JP3898077B2 (en) * 2001-11-13 2007-03-28 株式会社フジクラ Manufacturing method of flexible printed wiring board
JP3878527B2 (en) * 2002-08-20 2007-02-07 住友電工プリントサーキット株式会社 Printed board
JP2006179606A (en) * 2004-12-21 2006-07-06 Nitto Denko Corp Wiring circuit board
JP5096782B2 (en) * 2007-04-19 2012-12-12 ルネサスエレクトロニクス株式会社 Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015142053A (en) * 2014-01-29 2015-08-03 住友電気工業株式会社 Method of manufacturing electronic part
KR101915678B1 (en) * 2016-12-23 2018-11-06 한화첨단소재 주식회사 Elctromagnetic interference shielding film, elctromagnetic interference shielding laminated body comprising the same, and method for prepareing the same

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