JP2013206538A - Circuit unit, manufacturing method of circuit unit, battery pack, and manufacturing method of battery pack - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lightweight circuit unit which achieves low costs and high space efficiency and a manufacturing method of the circuit unit, and to provide a battery pack and a manufacturing method of the battery pack.SOLUTION: A circuit unit 101 is attached to a battery unit that is an apparatus body and is electrically connected with the battery unit. The circuit unit 101 includes: a substrate body 1014 in which a circuit is formed; and a coating resin part 1015 coating at least both main surfaces of the substrate body 1014. Two through holes 101a, penetrating through the substrate body 1014 and the coating resin part 1015, are provided at the circuit unit 101. The through holes 101a function as attachment parts when the circuit unit 101 is attached to the battery unit.

Description

  The present invention relates to a circuit unit and a manufacturing method thereof, and a battery pack and a manufacturing method thereof.

  Many devices including a battery pack include a circuit unit as a part of the configuration. For example, in a battery pack, a circuit unit is inserted in a power distribution path between a battery unit composed of one or more unit cells and a connector provided for connection to an external device (Patent Document 1). . The configuration of the battery pack and the circuit unit according to the prior art will be described with reference to FIGS.

As shown in FIG. 6, in the battery pack according to the prior art, a circuit unit 901 is attached to a battery unit 900 having a plurality of unit cells 9000, and in this state, a case made of resin or the like is installed. It has a stored configuration.
In the example shown in FIG. 6, five sets of battery groups in which eight unit cells 9000 are connected in parallel by a lead plate 9001 are provided, and the battery groups are connected in series. The unit cell 9000 has a cylindrical external shape, and each unit cell 9000 is arranged with its cylinder axis aligned in the X-axis direction. Both ends of the unit cell 9000 connected to the lead plate 9001 are held by battery holders 9002 and 9003. The battery holders 9002 and 9003 are provided with screw holes 9003a (the screw holes of the battery holder 9002 are not shown) for attaching the circuit unit 901, and are connected to battery groups at both ends in the Y-axis direction. Connection terminals 9004 and 9005 are connected to the lead plate 9001, respectively.

  As shown in FIG. 7, the circuit unit 901 includes a substrate body 9014 accommodated in a substrate holder 9015. External terminals 9010 and 9011, lead wires 9012, and the like are attached to the substrate body 9014, and the substrate main body 9014 extends outward from the opening of the substrate holder 9015. The substrate holder 9015 is provided with ribs on the outer edge portion of the bottom wall 9015b so that the substrate body 9014 is separated from the inner surface of the bottom wall 9015b.

Further, a screw hole 9015a is provided in the outer surface portion of the bottom wall 9015b of the substrate holder 9015. These screw holes 9015a correspond to the screw holes 9003a of the battery holders 9002 and 9003.
Here, the substrate holder 9015 is usually formed using an injection molding method. Molds used in the injection molding method are expensive, and it is substantially difficult to prepare many molds and produce a large number of substrate holders 9015 at a time.

  Further, although not shown in FIGS. 6 and 7, the substrate holder 9015 is filled with potting resin in a state where the substrate body 9014 is accommodated, and covers both main surfaces on the front and back of the substrate body 9014. A resin portion is formed. This resin portion is formed for the purpose of preventing moisture from adhering to the circuit board during use of the device.

JP 2010-277795 A

However, as shown in FIG. 6, in the battery pack or the like according to the prior art, since the substrate body 9014 is mounted in the battery unit 900 in a state of being stored in the substrate holder 9015, the battery pack or the like is equivalent to the substrate holder 9015. Cost increases, weight increases, and useless space is required.
Further, as described above, the substrate holder 9015 is formed by using an injection molding method, but a mold for injection molding is expensive. Therefore, since the substrate holder 9015 is formed using a small number of molds, preparation for forming the next substrate holder 9015 is performed until the filling resin in the mold is solidified and one substrate holder 9015 is formed. I can't. For this reason, there is a problem from the viewpoint of production efficiency.

In the above description, the battery pack has been described as an example. However, the same problem may occur in a device including a board unit.
The present invention has been made in view of such problems, and an object thereof is to provide a circuit unit and a manufacturing method, a battery pack, and a manufacturing method thereof that are low-cost and lightweight and have high space efficiency. .

Therefore, the present invention is characterized by having the following configuration.
[1] Circuit unit A circuit unit according to the present invention is a circuit unit that is mounted on a device main body and is electrically connected to the device main body. And a coating resin portion covering at least both main surfaces. And in the circuit unit which concerns on this invention, the attachment part which concerns on mounting | wearing with an apparatus main body is provided in the coating resin part, It is characterized by the above-mentioned.

[2] Battery Pack The battery pack according to the present invention includes one or a plurality of unit cells, and is attached to the battery unit as a device main body and electrically connected to the battery unit. And a circuit unit. In the battery pack according to the present invention, the circuit unit according to the present invention is used as the circuit unit, and the circuit unit is directly attached to the battery unit using the attachment portion. And

[3] Manufacturing Method of Circuit Unit A manufacturing method of a circuit unit according to the present invention includes (a) a step of preparing a substrate body in which a circuit is configured, and (b) a substrate body made of a shallow dish-shaped coating tray. And (c) a step of injecting a coating resin material having fluidity into a coating tray in which the substrate body is accommodated, and (d) a coating resin portion that is cured when the coating resin material is cured. And a step of removing the coating resin portion in which the substrate main body is embedded from the coating tray. In the circuit unit manufacturing method according to the present invention, the coating resin portion covers at least both main surfaces of the substrate main body, and is provided with an attachment portion for mounting on the device main body.

[4] Method for Manufacturing Battery Pack A method for manufacturing a battery pack according to the present invention includes (e) a step of preparing a battery unit as a device body, including one or a plurality of unit cells, and (f) a battery unit. And mounting the circuit unit in an electrically connected state. And in the manufacturing method of the battery pack which concerns on this invention, the circuit unit manufactured through the manufacturing method of the circuit unit which concerns on the said invention is used as a circuit unit, (f) At the process of mounting a circuit unit, a circuit unit Is directly attached to the battery unit using the attachment portion.

[1] Circuit unit In the circuit unit according to the present invention, the coating resin portion is provided with an attachment portion for attachment to the apparatus main body. Therefore, it is necessary to use a substrate holder as in the circuit unit according to the above-described prior art. In addition, it is light and low in cost, and no useless space is required.
Therefore, the circuit unit according to the present invention is low cost and light weight and has high space efficiency.

In the circuit unit according to the present invention, for example, the following variation configuration can be adopted.
In the circuit unit according to the present invention, the substrate main body is provided with one or a plurality of through holes that pass through the front and back sides, and the coating resin portion is provided with an opening corresponding to the through holes provided in the substrate main body. Therefore, it is possible to adopt a configuration in which the opening functions as an attachment portion.

  In the circuit unit according to the present invention, one or a plurality of electronic components constituting the circuit are mounted on at least one main surface of the substrate body, and one or a plurality of leads are projected, and the coating resin portion Can also employ a configuration in which at least a part of one or more electronic components are covered, and one or more leads are covered in a state in which each tip portion is extended.

  In the circuit unit according to the present invention, in the coating resin portion, a streak-like rib is provided on the main surface opposite to the main surface on the side where the tip portions of the plurality of leads are extended. Can also be adopted. In other words, streaked ribs are provided on the bottom surface side of the coating resin portion (the main surface on the side opposite to the main surface on which the tip portions of the plurality of leads are extended). In other words, the groove corresponding to the mold used to form the coating resin portion was formed. Thereby, when the resin material is poured into the mold (coating tray) in forming the coating resin portion, the flow of the fluid resin material can be promoted. As described above, the through hole is formed in the substrate body, and the coating resin portion is also provided with an opening corresponding thereto, so that the flow of the fluid resin material is also improved.

[2] Battery pack In the battery pack according to the present invention, the circuit unit according to the present invention is used as the circuit unit, and the circuit unit is directly attached to the battery unit using the attachment portion. When mounting the circuit unit to the battery unit, there is no need to use a substrate holder.

Therefore, the battery pack according to the present invention is low cost and light weight and has high space efficiency.
In the battery pack according to the present invention, for example, the following variation configuration can be adopted.
In the battery pack according to the present invention, the battery unit has a battery holder for holding one or a plurality of unit cells, and the circuit unit is mounted on the battery holder. You can also.

[3] Method of Manufacturing Circuit Unit In the method of manufacturing a circuit unit according to the present invention, the coating resin portion formed through the step (d) is provided with a mounting portion for mounting on the device body. Unlike the circuit unit according to the above, it is not necessary to use a substrate holder for mounting on the apparatus main body, and it is possible to manufacture a circuit unit that is low in cost and light in weight and does not require useless space.

In step (d), since the coating tray is removed, there is no obstacle in eliminating low cost, light weight and useless space.
In the method for manufacturing a circuit unit according to the present invention, for example, the following variation method can be adopted.
In the circuit unit manufacturing method according to the present invention, the substrate body is provided with one or a plurality of through-holes that are inserted through the front and back sides, and the coating resin portion has openings at locations corresponding to the through-holes provided in the substrate body. It is also possible to employ a method in which the opening portion functions as an attachment portion.

  In the circuit unit manufacturing method according to the present invention, in step (b), after the substrate body is stored in the coating tray, the floating prevention member that presses the substrate body from the opening side of the coating tray to the bottom side of the coating tray. In step (d), the coating resin portion in which the substrate body is embedded is removed from the coating tray and the float prevention member is also removed.

  In the method of manufacturing a circuit unit according to the present invention, in each of the coating tray and the anti-floating member, a convex portion is formed on one side and a concave portion that receives the convex portion is formed on the other side at a position corresponding to the through hole of the substrate body. In the step (c), it is also possible to adopt a method in which an opening is formed in the coating resin portion by engaging the convex portion and the concave portion.

In the method for manufacturing a circuit unit according to the present invention, a method of using a vacuum molded product tray as the coating tray can be employed. Thereby, it is not necessary to use an expensive metal mold like the substrate holder according to the prior art, and the manufacturing cost can be further reduced.
In the method for manufacturing a circuit unit according to the present invention, a configuration in which a streak-like groove is provided on the inner bottom surface of the coating tray can also be adopted. Thereby, as above-mentioned, when a fluid resin material is poured, the wraparound can be made favorable. In addition, the resin material can be circulated favorably by forming a through hole in the substrate body.

  In the method for manufacturing a circuit unit according to the present invention, a method of removing the coating resin portion from the coating tray and then discarding the coating tray can be employed. By doing in this way, it can wait for formation of a coating resin part with one coating saucer, and can raise production efficiency compared with the case where other coating resin parts are formed. In particular, in the method of manufacturing a circuit unit according to the present invention, when a vacuum molded product is used as the coating tray, the cost can be reduced as compared with the case where an injection molded product is used. Even if it is discarded without being used, there is no significant increase in cost.

[4] Battery Pack Manufacturing Method In the battery pack manufacturing method according to the present invention, the circuit unit manufactured through the circuit unit manufacturing method according to the present invention is used as the circuit unit. There is no need to use a substrate holder when mounting the circuit unit, and in the step (f), the circuit unit can be directly mounted on the battery unit using the mounting portion.

Therefore, in the battery pack manufacturing method according to the present invention, it is possible to manufacture a battery pack that is low-cost and lightweight and does not require useless space.
In the method for manufacturing a battery pack according to the present invention, for example, the following variation method may be employed.
In the method for manufacturing a battery pack according to the present invention, in step (e), a battery unit having a battery holder for holding one or more unit cells is prepared, and in step (f), a circuit is provided. A method of attaching the unit to the battery holder can also be adopted.

It is a schematic perspective view which shows the external appearance structure of the battery pack 1 which concerns on embodiment of this invention. 1 is a schematic perspective developed view showing a configuration of a core pack 10 included in a battery pack 1. FIG. 2 is a schematic perspective view showing an external configuration of a coating substrate 101 included in the configuration of the core pack 10. FIG. 6 is a schematic perspective development view showing a part of the manufacturing process of the coating substrate 101. FIG. (A), (b) is a model perspective view which shows a part of manufacturing process of the coating substrate 101. FIG. It is a model perspective developed view which shows the structure of the core pack which concerns on a prior art. 3 is a schematic perspective developed view showing the configuration of a circuit unit 910. FIG.

Below, the form for implementing this invention is demonstrated using drawing. In addition, the specific example shown below is an example used for easily explaining the configuration of the present invention and the operations and effects produced from the configuration, and the present invention is not limited to the components essential to the invention. The following specific examples are not limited at all.
[Embodiment]
1. External Configuration of Battery Pack 1 As shown in FIG. 1, the battery pack 1 according to the present embodiment has an outer case constituted by cases 11 and 12, and a handle is provided on one end side of the case 11 for handling by a user. ing. A part of the connector 13 is exposed at the end of the battery pack 1 opposite to the handle.

The user handles the battery pack 1 using a handle and attaches the battery pack 1 to a device (for example, a power-assisted bicycle) in the direction of arrow A.
2. Configuration of Core Pack 10 As shown in FIG. 2, the core pack 10 which is a component of the battery pack 1 is configured by a combination of a battery unit 100 and a coating substrate 101 as a circuit unit.

  In the battery pack 1 according to the present embodiment, in the battery unit 100, five sets of battery groups in which eight unit cells 1000 are connected in parallel by the lead plate 1001 are provided, and the battery groups are connected in series. The unit cell 1000 has a cylindrical external shape, and each unit cell 1000 is arranged with the cylinder axis aligned in the X-axis direction. Both ends of the unit cell 1000 connected to the lead plate 1001 are held by battery holders 1002 and 1003. The battery holders 1002 and 1003 are provided with screw holes 1003a (not shown for the screw holes of the battery holder 1002) for attaching the circuit unit 101, and are connected to the battery groups at both ends in the Y-axis direction. Connection terminals 1004 and 1005 are connected to the lead plate 1001.

  As shown in FIG. 3, the circuit unit 101 includes a substrate main body 1014 and a coating resin portion 1015 provided so as to cover at least both main surfaces of the substrate main body 1014 as main components. Lead wires 1012 and 1013 and connection terminals 1010 and 1011 are connected to the substrate body 1014, and a part of the coating resin portion 1015 extends upward from the upper surface in the Z-axis direction.

  Further, in the circuit unit 101, a through hole 101a is formed at a position corresponding to the screw hole 1003a of the battery holders 1002 and 1003 of the battery unit 100. The through-hole 101a is provided so that not only the coating resin portion 1015 but also the substrate body 1014 embedded therein can be inserted. The coating resin portion 1015 plays a role of suppressing moisture intrusion into the substrate main body 1014 and mitigating the impact on the substrate main body 1014 from the outside.

  As shown in FIG. 3, the coating resin portion 1015 is provided with streak-like ribs 1015 a extending in the Y-axis direction on the lower surface in the Z-axis direction. This is formed by a streak-like groove 500e formed on an inner bottom surface 500c of a coating tray 500 described later, and is a coating resin material having fluidity in combination with a through hole 101a formed in the substrate body 1014. It is effective to improve the wraparound.

The coating resin portion 1015 is made of, for example, a silicone resin material, an epoxy resin material, or a urethane resin material.
Returning to FIG. 2, the circuit unit 101 is attached to the battery unit 100 by first inserting the circuit unit 101 on the upper side in the Z-axis direction of the battery unit 100, and then tightening the screw into the screw hole 1003 a through the through hole 101 a. This is done by connecting the connection terminals 1004 and 1005 to the connection terminals 1010 and 1011. In the present embodiment, when the circuit unit 101 is attached to the battery unit 100, the substrate holder 9015 is not used as in the above-described conventional technique, and the substrate body 1014 and the potting resin portion 1015 in the circuit unit 101 are perforated. The mounting is performed directly using the through hole 101a.

3. Effect In the battery pack 1 according to the present embodiment, in the configuration of the core pack 10, the circuit unit 101 is configured by the substrate body 1014 and the coating resin portion 1015 that covers the substrate body 1014, and the substrate holder 9015 as in the above prior art. Is not used. Then, a through hole 101 a formed in the substrate body 1014 and the coating resin portion 1015 is used as an attachment portion of the circuit unit 101 to the battery unit 100.

  Therefore, the battery pack 1 according to the present embodiment can reduce the number of parts by the amount that the substrate holder 9015 is omitted, and the manufacturing cost can be kept low. In particular, in the prior art, an injection molded product may be used as the substrate holder 9015, and it is necessary to use an expensive mold for its manufacture. On the other hand, in this embodiment, since the substrate holder 9015 that needs to be manufactured using such an expensive mold is not used, it is particularly effective in reducing the cost.

Also in this embodiment, since the substrate main body 1014 is covered with the coating resin portion 1015, it is possible to sufficiently prevent moisture from entering the substrate main body 1014 and reduce external impact.
4). Manufacturing Method As shown in FIG. 4, an electronic component (not shown) according to the present embodiment and connection terminals 1010 and 1011 are mounted, and a substrate body 1014 to which lead wires 1012 and 1013 are connected is prepared. In the substrate body 1014, a through hole 1014a is formed in advance at a location where the through hole 101a is to be formed.

  Next, the substrate body 1014 is placed inside the coating tray 500 with the side on which the lead wires 1012 and 1013 are selected facing upward in the Z-axis direction. Although not shown in detail, ribs are provided on the inner bottom surface 500 c of the coating tray 500, and a part of the main surface on the lower side in the Z-axis direction of the substrate body 1014 is inside the coating tray 500. It is in a state of floating from the bottom surface 500c.

  The coating tray 500 is provided with two protrusions 500d protruding from the inner bottom surface 500c so as to be inserted through the through holes 1014a formed in the substrate body 1014. Furthermore, a part 500b of the peripheral wall of the coating tray 500 is divided with respect to the other part 500a, and a part thereof is bent at the line L. Further, the coating tray 500 according to the present embodiment is a vacuum molded product, and has an advantage that the molding die is cheaper than the case where the coating tray 500 is an injection molded product like the substrate holder according to the prior art. .

The inner bottom surface 500c of the coating tray 500 is formed with a streak-like groove 500e extending in the Y-axis direction. As described above, the groove portion 500e is effective for satisfactorily wrapping the coating resin material around the entire periphery including the front and back of the substrate body 1014 when the coating resin material is poured into the coating tray 500.
Next, the substrate floating prevention member 501 is attached so as to hold the substrate main body 1014 from the upper side in the Z-axis direction in a state where the substrate main body 1014 is stored. The substrate floating prevention member 501 is a plate member having a rectangular planar shape, and is provided with a concave portion 501a with an edge rising at a position corresponding to the through hole 1014a of the substrate body 1014. The recessed edge 501 a is configured such that the edge of the raised edge is pressed against the upper main surface of the substrate body 1014 in the Z-axis direction.

  Next, as shown in FIG. 5A, a coating resin material for forming the coating resin portion 1015 is injected into the coating tray 500 in which the substrate body 1014 is accommodated. Here, the coating resin material is a so-called potting resin material, and for example, a silicone resin material, an epoxy resin material, a urethane resin material, or the like can be used.

As shown in FIG. 5A, the coating resin material is injected such that part of the connection terminals 1010 and 1011 and part of the lead wires 1012 and 1013 extend from the upper surface thereof.
Next, as shown in FIG. 5B, after the coating resin material is cured and the coating resin portion 1015 is formed, a part 500b of the coating tray 500 is bent with respect to the other part 500a to complete the circuit. The unit 101 is removed from the coating tray 500.

  Here, the coating tray 500 after the circuit unit 101 is removed may be used again for the next production, but can also be discarded. In particular, in this embodiment, a vacuum molded product is used as the coating tray 500, and its production cost is lower than that of a conventional injection molded product. For this reason, even if the coating tray 500 is not used again, the cost is not greatly increased. Further, compared with the case of reusing, it is not necessary to wait for the completion of molding and reuse the coating tray 500, so that high production efficiency can be realized.

The subsequent steps are not shown, but as shown in FIG. 2, the circuit unit 101 is attached to the battery unit 100, and then the connector 13 is attached as shown in FIG. By storing these core packs 10 in the cases 11 and 12, the battery pack 1 is completed.
[Other matters]
In the above embodiment, the circuit unit 101 is attached to the battery unit 100 with two through holes 101a that allow screws to be inserted into the battery unit 100. However, the shape of the attachment unit is limited to this. Not receive. For example, a configuration in which one or a plurality of hook-shaped protrusions are provided in the coating resin portion 1015 of the circuit unit 101 and engagement holes that engage with the battery holders 1002 and 1003 of the battery unit 100 are provided. Can also be adopted.

Further, the number of attachment portions provided in the circuit unit 101 is not necessarily two, and may be one, for example, or three or more.
In the above embodiment, the coating resin portion 1015 is formed so as to cover the entire side including the side of the substrate body 1014. However, from the viewpoint of ensuring electrical insulation, What is necessary is just to coat | cover both main surfaces.

In the above embodiment, the planar shape of the substrate body 1014 is rectangular, but the planar shape of the substrate body is not limited to this. For example, it may be a square, a polygon, or a circle or an ellipse.
Further, in the above embodiment, the circuit unit 101 having the coating resin portion 1015 is described as a part of the configuration of the battery pack 1, and the characteristics in the configuration surface and the operation surface are described. About the structure of the circuit unit which concerns on a form, it is possible to apply also to apparatuses other than a battery pack. For example, application to a circuit unit included in a power tool or a circuit unit included in a vehicle such as an automobile is also possible.

  Moreover, in the said embodiment, although the vacuum molded product was used as the coating saucer 500, in this invention, it does not exclude employ | adopting the coating saucer formed using the other method. For example, a coating tray made of an injection molded product can be used. However, from the viewpoint of cost, it is advantageous to use the coating tray 500 made of a vacuum-molded product, so that a large increase in cost is not caused even if the coating tray 500 is not reused for the next production. There is an effect that.

  The present invention is useful for realizing various devices including a battery pack and a circuit unit that are lightweight and low in cost.

1. Battery pack 10. Core pack 11,12. Case 13. Connector 100. Battery unit 101. Circuit unit 500. Coating pan 501. Substrate floating prevention member 1000. Unit cell 1001. Lead plates 1002, 1003. Battery holder 1004, 1005, 1010, 1011. Connection terminals 1012 and 1013. Lead wire 1014. Substrate 1015. Coating resin part

Claims (15)

A circuit unit that is mounted on a device body and electrically connected to the device body,
A substrate body comprising a circuit;
A coating resin portion covering at least both main surfaces of the substrate body;
Have
The circuit unit, wherein the coating resin portion is provided with an attachment portion for mounting to the device main body. The substrate body is provided with one or more through-holes that pass through the front and back sides,
The coating resin portion is provided with an opening corresponding to the through hole provided in the substrate body,
The circuit unit according to claim 1, wherein the opening functions as the attachment portion. At least one main surface of the substrate body is mounted with one or more electronic components constituting the circuit, and one or more leads are provided to protrude.
The coating resin portion covers at least a part of the one or more electronic components, and covers the one or more leads in a state in which each tip portion is extended. The circuit unit according to claim 1 or 2. The streaky rib is provided in the coating resin portion on the main surface opposite to the main surface on which the tip portions of the plurality of leads are extended. The circuit unit described in 1. A battery unit including one or a plurality of unit cells as a device main body;
A circuit unit mounted on the battery unit and electrically connected to the battery unit;
Have
The circuit unit according to any one of claims 1 to 4 is used as the circuit unit,
The circuit unit is directly attached to the battery unit using the attachment portion. The battery unit has a battery holder for holding the one or more unit cells,
The battery pack according to claim 5, wherein the circuit unit is attached to the battery holder. A step of preparing a substrate body comprising a circuit;
Storing the substrate body in a shallow dish-shaped coating tray;
Injecting a coating resin material having fluidity into the coating tray in a state where the substrate body is housed,
After the coating resin material is cured and a coating resin portion is formed, removing the coating resin portion in which the substrate body is embedded from the coating tray,
Have
The coating resin portion covers at least both main surfaces of the substrate main body, and is provided with an attachment portion for attachment to the device main body. The substrate body is provided with one or a plurality of through holes through which the front and back are inserted,
In the coating resin portion, an opening is provided at a location corresponding to a through hole provided in the substrate body,
The method for manufacturing a circuit unit according to claim 7, wherein the opening functions as the attachment portion. In the storing step, after the substrate main body is stored in the coating tray, a floating preventing member that presses the substrate main body from the opening side of the coating tray to the bottom side of the coating tray is mounted,
The method of manufacturing a circuit unit according to claim 8, wherein, in the removing step, the coating resin portion in which the substrate body is embedded is removed from the coating tray, and the floating prevention member is also removed. In the coating tray and the anti-floating member, a convex portion is formed on one side, and a concave portion that receives the convex portion is formed on the other side, at a location corresponding to the through hole of the substrate body.
The method for manufacturing a circuit unit according to claim 9, wherein, in the step of injecting the coating material, the opening is formed in the coating resin portion by engaging the convex portion and the concave portion. . The method for manufacturing a circuit unit according to any one of claims 7 to 10, wherein a tray of a vacuum molded product is used as the coating tray. The method for manufacturing a circuit unit according to any one of claims 7 to 11, wherein a streak-like groove is provided on an inner bottom surface of the coating tray. The method for manufacturing a circuit unit according to any one of claims 7 to 12, wherein the coating tray is discarded after the coating resin portion is removed from the coating tray. Comprising one or a plurality of unit cells, and preparing a battery unit as a device body;
Mounting the circuit unit in a state of being electrically connected to the battery unit;
Have
As the circuit unit, using the circuit unit manufactured through the manufacturing method according to any one of claims 7 to 13,
In the step of attaching the circuit unit, the circuit unit is directly attached to the battery unit using the attachment portion. In the step of preparing the battery unit, preparing the battery unit having a battery holder for holding the one or more unit cells,
The method for manufacturing a battery pack according to claim 14, wherein, in the step of mounting the circuit unit, the circuit unit is mounted on the battery holder.

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