JP2013201200A - Substrate processing method and substrate processing apparatus using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing method producing a substrate for evaluation which can be used for the evaluation in a wet process despite its hydrophobic nature.SOLUTION: Since a contamination material D is dispersed through a mist M1 of a process liquid, the contamination material D is fastened to the substrate W despite hydrophobic nature of the substrate W by evenly applying the mist M1 to an entire surface of the substrate W and drying the mist M1. Therefore, a substrate for evaluation which reproduces the adhesion of the contamination material D in a wet process can be produced despite the hydrophobic nature of the substrate W.

Description

  The present invention relates to a semiconductor wafer, a liquid crystal display substrate, a plasma display substrate, an organic EL substrate, an FED (Field Emission Display) substrate, an optical display substrate, a magnetic disk substrate, a magneto-optical disk substrate, and a photomask substrate. The present invention relates to a substrate processing method and apparatus for processing a substrate and a solar cell substrate (hereinafter simply referred to as a substrate), and more particularly to a technique for manufacturing a substrate for evaluation by attaching a contaminant to the substrate.

  Conventionally, as an apparatus of this type, a substrate processing provided with an aerosol generator that supplies air to a standard particle diluent and aerosolizes standard particles, and a particle adhesion tank in which a substrate can be placed inside the aerosol generator. There is an apparatus (for example, refer to Patent Document 1).

  This substrate processing apparatus generates a standard particle dilution liquid in an aerosol generator using pure water and a standard particle dispersion, and supplies the generated standard particle dilution liquid to a substrate accommodated therein. As a result, a standard contaminated substrate for surface inspection machine calibration and a standard contaminated substrate for cleaning device evaluation are created.

  Also, as this kind of method, a fine particle dispersion is prepared, a predetermined amount of this fine particle dispersion is taken out with a pipette, this fine particle dispersion is divided and arranged on the surface of the substrate with a pipette, and this substrate is heated. In some cases, a substrate for evaluation is produced by evaporating the solvent of the fine particle dispersion (for example, see Patent Document 2).

  In this method, fine particles adhere to the surface of the substrate in a non-uniform pattern, so that secondary contamination to which fine particles adhere due to an unexpected event can be determined by observing the pattern after cleaning. Therefore, it is possible to perform an appropriate evaluation of the cleaning apparatus or the like by performing processing using the prepared evaluation substrate.

JP 7-335515 A JP-A-9-266189

However, the conventional example having such a configuration has the following problems.
Semiconductor manufacturing is roughly divided into a dry process and a wet process, and the ratio is about 1: 1 at present. In these steps, there is a possibility that particles that cause a deterioration in device performance and a decrease in yield are attached. However, in the conventional apparatus, particles are attached to the substrate by aerosol to produce an evaluation substrate, so that only an evaluation substrate to which particles are attached in a dry state can be produced. Therefore, there is a problem that an evaluation substrate used for evaluation of the wet process cannot be manufactured.

  By the way, the surface of a board | substrate has the characteristic of the hydrophilic property (for example, organic films, such as a photoresist film) which a pure water wets easily and a hydrophobic property (for example, organic films, such as a photoresist film) which a pure water does not wet easily. When the surface of the substrate is hydrophilic, the processing liquid in which the contaminant is dispersed in pure water is supplied to the substrate, and the substrate is rotated and dried to substantially distribute the contaminant on the entire surface of the substrate. Can be uniform. Accordingly, if a processing solution having a low concentration of the contaminant is supplied to the substrate, the contaminant can be sparsely and evenly adhered to the entire surface. If a processing solution having a high concentration of the contaminant is supplied to the substrate, the contamination The substance can be adhered to the entire surface densely and evenly. However, when the surface of the substrate is hydrophobic, the treatment liquid cannot uniformly cover the entire surface of the substrate, and thus there is a problem that the contaminant cannot be uniformly adhered to the entire surface of the substrate. For this reason, in the wet type as described above, since the contaminants cannot be attached to the entire surface of the hydrophobic substrate, it is not possible to produce a wet process evaluation substrate with the hydrophobic substrate.

  The present invention has been made in view of such circumstances, and provides a substrate processing method and apparatus capable of producing an evaluation substrate that can be used for evaluation of a wet process even if it is a hydrophobic substrate. The purpose is to do.

In order to achieve such an object, the present invention has the following configuration.
That is, according to the first aspect of the present invention, in the substrate processing method for attaching the contaminant to the hydrophobic substrate, the mist of the processing liquid is supplied to the entire surface of the hydrophobic substrate, thereby the hydrophobic substrate. A coating process in which a contaminant is applied to the entire surface of the substrate, and a drying process in which the mist of the processing solution supplied to the entire surface of the hydrophobic substrate is dried to adhere the contaminant to the entire surface of the hydrophobic substrate. It is characterized by having.

  [Operation / Effect] According to the first aspect of the present invention, the contaminant is applied to the entire surface of the hydrophobic substrate in the coating process, and the contaminant is attached to the entire surface of the hydrophobic substrate in the drying process. Let In the coating process, since the contaminant is attached through the mist of the treatment liquid, the mist can be evenly applied to the entire surface of the substrate even if it is a hydrophobic substrate. Therefore, even if the substrate is hydrophobic, an evaluation substrate that reproduces the adhesion of contaminants in the wet process can be produced.

  In the present invention, it is preferable that in the coating process, a mist of a processing solution containing a contaminant is supplied to the entire surface of the hydrophobic substrate.

  Since the mist of the treatment liquid containing the contaminant is supplied, the contaminant can be applied with a single supply. Further, since the contamination substance is attached by the treatment liquid containing the contamination substance, a state very close to the contamination in the wet process can be reproduced.

  Further, in the present invention, the coating process includes a mist supply process for supplying a mist of a processing solution over the entire surface of the hydrophobic substrate, and a spraying process for spraying a contaminant to the upper side of the hydrophobic substrate. (Claim 3).

  By supplying the mist of only the processing liquid in the mist supply process and spraying the pollutant upward in the spraying process, the pollutant can be taken into the mist of the processing liquid on the hydrophobic surface. Thus, the contaminant can be applied on the hydrophobic surface of the substrate.

  According to a fourth aspect of the present invention, there is provided a substrate processing apparatus for attaching a contaminant to a hydrophobic substrate, a mounting table for mounting the hydrophobic substrate, and a hydrophobic device mounted on the mounting table. Supply means for applying a contaminant to the entire surface of the hydrophobic substrate by supplying a mist of the processing solution to the entire surface of the hydrophobic substrate, and a processing liquid applied to the entire surface of the hydrophobic substrate by the coating means. Drying means for drying and attaching a contaminant to the entire surface of the hydrophobic substrate.

  [Operation / Effect] According to the invention described in claim 4, the mist of the processing liquid is supplied to the entire surface of the hydrophobic substrate mounted on the mounting table by the applying means, and the processing is applied by the drying means. The solution can be dried to allow contaminants to adhere to the entire surface of the hydrophobic substrate. Since the contaminant is attached by the application means through the mist of the treatment liquid, the mist can be applied evenly over the entire surface of the hydrophobic substrate. Therefore, even if the substrate is hydrophobic, an evaluation substrate that reproduces the adhesion of contaminants in the wet process can be produced.

  In the present invention, it is preferable that the application means is a contamination-containing processing solution mist forming means for supplying a mist of a treatment solution containing a contamination material over the entire surface of the hydrophobic substrate.

  Since the mist of the processing liquid containing the pollutant is supplied by the pollutant-containing processing liquid mist generating means, the pollutant can be applied with a single supply.

  In the present invention, the coating means includes a processing liquid mist forming means for supplying a mist of the processing liquid to the entire surface of the hydrophobic substrate, and a spraying means for spraying a contaminant to the upper side of the hydrophobic substrate. (Claim 6).

  By supplying the mist of only the treatment liquid with the application means and spreading the contamination substance upward with the application means, the contamination substance can be taken into the mist of the treatment liquid on the hydrophobic surface. Thus, the contaminant can be applied on the hydrophobic surface of the substrate.

  In the present invention, it is preferable to further include a chamber surrounding the mounting table.

  Since the chamber can prevent substances other than contaminants from being mixed in, the evaluation substrate can be accurately manufactured.

  In the present invention, it is preferable that the drying means is a heating means attached to the mounting table.

  Since the entire substrate is heated by the heating means, the mist on the hydrophobic surface can be dried in a short time, and the production time of the evaluation substrate can be shortened.

  According to the substrate processing method of the present invention, the contaminant is applied to the entire surface of the hydrophobic substrate in the coating process, and the contaminant is attached to the entire surface of the hydrophobic substrate in the drying process. In the coating process, since the contaminant is attached through the mist of the treatment liquid, the mist can be evenly applied to the entire surface of the substrate even if it is a hydrophobic substrate. Therefore, even if the substrate is hydrophobic, an evaluation substrate that reproduces the adhesion of contaminants in the wet process can be produced.

It is a schematic structure figure showing the whole substrate processing device concerning an example. (A)-(c) is the schematic diagram which showed the process concerning the preparation method 1 of the board | substrate for evaluation. (A)-(d) is the schematic diagram which showed the process concerning the preparation method 2 of the board | substrate for evaluation.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic configuration diagram illustrating an entire substrate processing apparatus according to an embodiment.

  The substrate processing apparatus according to this embodiment includes a mounting table 1. On the mounting table 1, the substrate W to be processed is mounted in a horizontal posture. The substrate W here has an upper surface having hydrophobic characteristics. Examples of the hydrophobic film include bare silicon and organic films such as a photoresist film.

  The mounting table 1 has a diameter substantially the same as the outer diameter of the substrate W, and is provided with a heater 3 and a cooler 5 inside. The heater 3 heats the substrate W placed on the placement table 1, and the cooler 5 cools the substrate W placed on the placement table 1.

  The heater 3 corresponds to “drying means” and “heating means” in the present invention.

  The chamber 7 is provided so as to surround the entire mounting table 1. An electric motor 9 is provided at the bottom of the chamber 7. The electric motor 9 is arranged vertically with the rotary shaft 11 directed in the vertical direction. The rotating shaft 11 has a tip portion connected to the center of the bottom surface of the mounting table 1. When the electric motor 9 is operated, the mounting table 1 is rotated in the horizontal plane around the vertical axis.

  The drainage port 13 is formed at one part of the bottom surface of the chamber 7. The drainage port 13 communicates the inside and the outside of the chamber 7. One end of a drainage pipe 15 is connected to the drainage port 13 and the other end is connected to a recovery facility (not shown). The drainage pipe 15 is provided with an on-off valve 17. When the on-off valve 17 is opened, the processing liquid stored at the bottom of the chamber 7 is discharged.

  The exhaust port 19 is formed at a portion of the bottom surface of the chamber 7. One end side of the exhaust pipe 21 is connected to the exhaust port 19, and the other end side is connected to the decompression pump 23. The exhaust pipe 21 is provided with an open / close valve 25. When the on-off valve 25 is opened and the decompression pump 23 is operated, the inside of the chamber 7 can be decompressed.

  The mist forming nozzle 27 and the spray nozzle 29 are provided on the ceiling surface of the chamber 7 corresponding to the upper side at the rotation center of the mounting table 1. The mist nozzle 27 is connected to one end of the processing liquid supply pipe 31 in communication. The other end of the processing liquid supply pipe 31 is connected to a solvent supply source. The flow rate adjusting valve 33 is provided in the processing liquid supply pipe 31 and adjusts the flow rate of the solvent flowing through the processing liquid supply / drain pipe 31. One end side of the branch pipe 35 is connected in communication between the flow rate adjusting valve 33 and the mist nozzle 27. The other end side of the branch pipe 35 is inserted into the storage tank 37. Further, the branch pipe 35 is provided with a flow rate adjusting valve 39 and a pressure pump 41.

The storage tank 37 stores a processing liquid containing a contaminant. The treatment liquid is preliminarily mixed with a contaminant having a predetermined concentration in a solvent. In addition, as for the pollutant, the type of the pollutant and the particle diameter are determined according to the purpose of use of the evaluation substrate. Examples of the pollutant include polystyrene called PSL (Polystyren Latex), and fine particles of silicon oxide (SiO ₂ ) and silicon nitride (SiN). In particular, since PSL is widely used as standard particles, it is easily available and suitable. Examples of the solvent for the treatment liquid include pure water and organic solvents. Examples of the organic solvent include isopropyl alcohol (IPA) and hydrofluoroether (HFE). Considering the efficiency at the time of drying, an organic solvent is preferable to pure water, and one having a high vapor pressure is preferable. The solvent supply source described above supplies the solvent of the processing liquid described above.

  The mist nozzle 27 described above sprays the processing liquid containing the contaminants supplied from the storage tank 37 at a predetermined flow rate into the chamber 7. Alternatively, only the solvent can be sprayed into the chamber 7. The mist forming nozzle 27 mists the processing liquid and the solvent containing the contaminants by spraying means such as a two-fluid nozzle, a one-fluid nozzle, or a nebulizer, and supplies the mist into the chamber 7. Incidentally, the mist of the processing liquid by the mist generating nozzle 27 is, for example, in the micro order, and the contaminant is about several tens of nanometers.

  The mist nozzle 27 corresponds to the “coating means”, the “treatment liquid mist making means” and the “contaminant-containing treatment liquid mist making means” in the present invention.

  The spray nozzle 27 described above is connected to one end of the carrier pipe 43 in communication. A dry nitrogen gas supply source is connected to the other end side of the carrier pipe 43. The flow rate adjusting valve 45 adjusts the flow rate of the dry nitrogen gas from the dry nitrogen gas supply source. A first pollutant substance tank 47 and a second pollutant substance tank 49 are communicated between the flow regulating valve 45 and the spray nozzle 27. The first pollutant tank 47 includes a flow rate adjusting valve 51, and the second pollutant tank 49 includes a flow rate adjusting valve 53. The first pollutant tank 47 stores, for example, a pollutant having a small particle diameter as described above, and the second pollutant tank 49 stores the first pollutant tank 49. The pollutant with a particle size larger than the pollutant is stored.

  The spray nozzle 27 corresponds to the “spreading means” in the present invention.

  By opening the flow rate adjusting valve 45 and opening the flow rate adjusting valve 51 or the flow rate adjusting valve 53, a pollutant having a desired particle diameter can be supplied into the chamber 7 from the spray nozzle 27 together with the dry nitrogen gas.

  Here, an example of manufacturing a substrate for evaluation in a wet process will be described using the substrate processing apparatus having the above-described configuration.

  <Production Method 1>

  Please refer to FIG. FIGS. 2A to 2C are schematic views showing a processing process according to the evaluation substrate manufacturing method 1.

  First, the hydrophobic substrate W is carried into the chamber 7 and placed on the mounting table 1 with the hydrophobic surface as the upper surface. Then, with the on-off valve 17 closed, the on-off valve 25 is opened and the decompression pump 23 is operated. As a result, the inside of the chamber 7 is decompressed, and excess particles and the like are discharged from the chamber 7. When the internal pressure of the chamber 7 reaches a predetermined pressure, the open / close valve 25 is closed and the decompression pump 23 is stopped. Next, with the flow rate adjustment valve 33 closed, the flow rate adjustment valve 39 is opened and the pressure feed pump 41 is operated. As a result, the processing liquid containing the contaminant is supplied from the mist nozzle 27 into the chamber 7 by the mist M1 (FIG. 2A).

  The above process corresponds to the “coating process” in the present invention.

  Then, the mist M1 of the processing liquid containing the contaminant is attached to the entire upper surface of the hydrophobic substrate W (FIG. 2B). The mist M1 contains a contaminant D. Note that it is preferable that the treatment liquid containing the contaminant is supplied in such an amount that mist is not collected on the hydrophobic surface of the substrate W. This is because, since the upper surface of the substrate W is hydrophobic, if a large amount of mist M1 is supplied, the neighboring mist M1 is combined to form a large lump and becomes unstable on the hydrophobic surface and may move. .

  Next, the heater 3 of the mounting table 1 is heated to heat the substrate W together with the mounting table 1. As a result, only the solvent of the mist M1 of the treatment liquid containing the contaminant D is evaporated. Therefore, only the contaminant D in the mist M1 adheres to the hydrophobic substrate W (FIG. 2 (c)). If necessary, the substrate 5 is cooled to a predetermined temperature by the cooler 5.

  The above process corresponds to the “drying process” in the present invention.

  Thereafter, the decompression of the chamber 7 is released, and the hydrophobic substrate W having the contaminant D attached on the entire surface is carried out of the chamber 7.

  <Production Method 2>

  Please refer to FIG. FIGS. 3A to 3D are schematic views showing a processing process according to the evaluation substrate manufacturing method 2.

  First, a hydrophobic substrate W is carried into the chamber 7 and placed on the mounting table 1. Then, the inside of the chamber 7 is decompressed to discharge excess particles and the like. When the pressure in the chamber 7 reaches a predetermined pressure, the decompression pump 23 is stopped. Next, the flow rate adjustment valve 33 is opened while the flow rate adjustment valve 39 is closed. Thereby, only the solvent (treatment liquid) is supplied to the inside of the chamber 7 from the mist nozzle 27 by the mist M2 (FIG. 3A).

  Then, the mist M2 only of the solvent (treatment liquid) adheres to the entire upper surface of the hydrophobic substrate W (FIG. 3B). It is preferable that the mist M2 is not supplied in a large amount in the same manner as in the production method 1 described above.

  Next, the on-off valve 51 is opened and, for example, the flow rate adjusting valve 45 is opened. Thereby, the contaminant D is sprayed into the chamber 7 from the spray nozzle 29 together with the dry nitrogen gas (FIG. 3C). As a result, the contaminant D is taken into the mist M2 on the upper surface of the substrate W.

  The above two processes correspond to the “coating process” in the present invention, and the process in FIG. 3C corresponds to the “dispersing process” in the present invention.

  Next, the heater 3 of the mounting table 1 is heated to heat the substrate W together with the mounting table 1. As a result, only the solvent of the mist M2 of the treatment liquid containing the contaminant D is evaporated. Therefore, the contaminant D in the mist M2 adheres to the hydrophobic substrate W (FIG. 3C).

  The above process corresponds to the “drying process” in the present invention.

  Thereafter, the decompression of the chamber 7 is released, and the hydrophobic substrate W having the contaminant D attached on the entire surface is carried out of the chamber 7.

  According to the method of the present embodiment, the contaminant D is attached via the mists M1 and M2 of the processing solution. Therefore, even if the substrate is a hydrophobic substrate W, the mists M1 and M2 are evenly applied over the entire surface of the substrate W. Can do. Therefore, even for the hydrophobic substrate W, it is possible to produce an evaluation substrate that reproduces the adhesion of contaminants in the wet process.

  In addition, since the manufacturing method 1 supplies the substrate W with the mist M1 of the processing liquid containing the contaminant D, the contaminant D can be applied to the substrate W at a time. In addition, since the contaminant D is attached by the treatment liquid containing the contaminant D, a state extremely close to contamination in the wet process can be reproduced.

  Also, in the preparation method 2, the mist M2 containing only the processing liquid is supplied, and the contaminant D is sprayed over the substrate W, so that the contaminant D is taken into the mist M2 of the processing liquid on the hydrophobic surface. be able to. Therefore, the contaminant D can be applied on the hydrophobic surface of the substrate.

  Further, according to the apparatus of this embodiment, the mists M1 and M2 of the processing liquid are supplied to the entire surface of the hydrophobic substrate W placed on the mounting table 1, and the applied processing liquid is dried by the heater 3. The contaminant D can be adhered to the entire surface of the hydrophobic substrate W. Since the contaminant D is attached through the mists M1 and M2 of the processing liquid, the mists M1 and M2 can be evenly applied to the entire surface of the substrate W even if the substrate is a hydrophobic substrate W. Therefore, even for the hydrophobic substrate W, it is possible to produce an evaluation substrate that reproduces the adhesion of contaminants in the wet process.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In the above-described embodiment, drying by the heater 3 is performed. However, for example, when the treatment liquid has a high vapor pressure, the inside of the chamber 7 is further depressurized by the decompression pump 23 so as to be dried. May be. Alternatively, drying may be performed by rotating the electric motor 9 at a low speed.

  (2) In the embodiment described above, the mounting table 1 is configured to be rotatable, but the electric motor 9 may be omitted if drying is not performed by rotation.

  (3) In the above-described embodiment, the mounting table 1 is surrounded by the chamber 7. However, if the environment is a clean environment and no substances other than the contamination substance D are mixed in from the surroundings, the chamber 7 is omitted. Also good.

  (4) In the above-described embodiment, mist is supplied at room temperature, but the substrate W may be cooled by the cooler 5, for example. Thereby, adhesion of the mist supplied into the chamber 7 to the substrate W can be promoted.

  (5) In the above-described embodiment, the device configuration is compatible with both the manufacturing method 1 and the manufacturing method 2, but when only one is implemented, the other configuration can be omitted.

W ... Substrate 1 ... Mounting table 3 ... Heater 5 ... Cooler 3 ... Heater 7 ... Chamber 27 ... Mist nozzle 29 ... Spray nozzle M1, M2 ... Mist D ... Contaminant

Claims (8)

In a substrate processing method in which a contaminant is attached to a hydrophobic substrate,
A process of applying a contaminant to the entire surface of the hydrophobic substrate by supplying a mist of the treatment liquid to the entire surface of the hydrophobic substrate;
A drying process in which the mist of the processing solution supplied to the entire surface of the hydrophobic substrate is dried, and a contaminant is adhered to the entire surface of the hydrophobic substrate;
A substrate processing method characterized by comprising: The substrate processing method according to claim 1,
In the coating process, a mist of a processing solution containing a contaminant is supplied to the entire surface of the hydrophobic substrate. The substrate processing method according to claim 1,
The coating process includes a mist supply process for supplying a mist of a processing solution over the entire surface of a hydrophobic substrate, and a spraying process for spraying a contaminant to the upper side of the hydrophobic substrate. Substrate processing method. In a substrate processing apparatus that attaches a contaminant to a hydrophobic substrate,
A mounting table for mounting a hydrophobic substrate;
An application means for applying a contaminant to the entire surface of the hydrophobic substrate by supplying a mist of the treatment liquid to the entire surface of the hydrophobic substrate placed on the mounting table;
Drying means for drying the treatment liquid applied to the entire surface of the hydrophobic substrate by the applying means, and attaching a contaminant to the entire surface of the hydrophobic substrate;
A substrate processing apparatus comprising: The substrate processing apparatus according to claim 4,
The substrate processing apparatus, wherein the coating means is a contaminant-containing treatment liquid mist forming means for supplying a mist of a treatment liquid containing a contaminant to the entire surface of a hydrophobic substrate. The substrate processing apparatus according to claim 4,
The coating means includes a treatment liquid mist forming means for supplying a mist of the treatment liquid to the entire surface of the hydrophobic substrate, and a spraying means for spraying a contaminant to the upper side of the hydrophobic substrate. Substrate processing apparatus. The substrate processing apparatus according to any one of claims 4 to 6,
A substrate processing apparatus, further comprising a chamber surrounding the mounting table. The substrate processing apparatus according to any one of claims 4 to 7,
The substrate processing apparatus, wherein the drying means is a heating means attached to a mounting table.

Images