JP2013200412A - Substrate for display device and method of manufacturing substrate for display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal display panel 10, a TFT substrate 12, and a color filter substrate 13 capable of improving the yields in a manufacture process.SOLUTION: A metal pattern 11 formed on an external surface of at least one of the TFT substrate 12 and the color filter substrate 13, and an infrared spectrophotometer, are used to perform measurement of contaminants on the metal pattern 11, and on the basis of the measurement results, the presence or absence of contamination on the substrate surface is determined.

Description

  The present invention relates to a display device substrate and a display panel that can detect contaminants with an infrared spectrophotometer, a contaminant detection method using the display device substrate, and a contaminant detected by the detection method. The present invention relates to a method for manufacturing a substrate for a display device, including a step of removing the.

  In the manufacturing process of a substrate for a display device or a display panel, contaminants are present on the substrate for some reason at various stages of the manufacturing process using the substrate, such as a substrate transport process or a process of forming a predetermined film on the substrate. May stick.

  For example, the majority of substrate transport in the manufacturing process of display device substrates and display panels is automated, and robot arms are often used, and grease or oil is applied to the control unit. In many cases, for some reason, grease, oil, or the like is scattered from the control unit, and these often adhere as a contaminant to a wide range on the substrate.

  Usually, when transferring a substrate between manufacturing processes, a cleaning operation for removing contaminants is performed.

  In such a cleaning operation, a cleaning liquid or the like is generally used. However, Patent Document 1 discloses a method for reliably removing contaminants on a substrate without using a cleaning liquid.

  FIG. 17 is a diagram for explaining a method of reliably removing contaminants on a substrate without using the cleaning liquid described in Patent Document 1.

  As shown in the drawing, after the contaminants on the surface of the substrate 400 are pressed against the surface of the substrate 400 with a tape 403 whose lower surface is the adhesive surface 402 existing below the peripheral surface of the contact roller 401, the tape It is described that the contaminant on the surface of the substrate 400 can be surely removed by peeling off the adhesive surface 402 of the substrate 403 from the surface of the substrate 400.

Japanese Patent Laid-Open No. 10-197853 (published July 31, 1998)

  However, the cleaning operation using the above-described cleaning liquid and the method described in Patent Document 1 for removing contaminants on the surface of the substrate 400 using the tape 403 whose lower surface is the adhesive surface 402 are also used for the treatment. Depending on the time and number of treatments, it is difficult to completely remove all contaminants.

  In some cases, contaminants newly adhere to the surface of the substrate after the cleaning operation.

  As described above, when contaminants that have not been completely removed or newly adhered contaminants remain attached to the surface of the substrate and the substrate is transferred to the next manufacturing process, the contaminants are removed. It can be a cause (core) and cause problems such as product defects in the next manufacturing process. For example, when a polarizing plate is attached on the surface of a substrate to which a contaminant is attached, the adhesive strength may partially decrease at a location where the contaminant exists, and the polarizing plate may be peeled off.

  For this reason, it is necessary to prevent contaminants from being transferred to the next manufacturing process while remaining on the surface of the substrate.

  Therefore, if it is a contaminant that can be visually confirmed, it can be detected and removed by visual inspection. However, such visual confirmation varies due to individual differences among workers. There is no clear standard for determining the presence or absence of. Therefore, depending on individual differences among workers, there is a risk that contaminants may be transferred to the next manufacturing process while remaining on the surface of the substrate.

  On the other hand, there is no known method for easily confirming whether fine contaminants of a level that cannot be visually confirmed are reliably removed on the substrate.

  Therefore, there is a problem that the yield cannot be improved in the manufacturing process because the conventional method cannot prevent or suppress the contaminant from being transferred to the next manufacturing process while being adhered on the surface of the substrate. It was.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a display device substrate and a method for detecting contaminants on the display device substrate, which can improve the yield in the manufacturing process. To do.

  In order to solve the above problems, the display device substrate of the present invention is an insulating substrate for a display device in which a laminated film is provided on one surface that is in contact with a display medium that transmits or emits light. The substrate is characterized in that a plurality of fine metal patterns are formed on the other surface of the insulating substrate, which is the surface opposite to the one surface of the insulating substrate.

  According to the above configuration, since a plurality of fine metal patterns are formed on the other surface of the insulating substrate, the presence or absence of absorption of a predetermined wave number in the infrared light reflected by the metal patterns is determined by infrared spectroscopy. By detecting with a photometer, it is possible to determine the presence or absence of contaminants on the surface of the metal pattern.

  That is, by using the metal pattern, it is possible to confirm the contamination state of the other surface of the insulating substrate in a short time in a non-destructive and non-contact manner.

  Accordingly, since it is possible to prevent or suppress the contaminant from being transferred to the next manufacturing process while being attached on the surface of the substrate, it is possible to realize a display device substrate that can improve the yield in the manufacturing process. it can.

  In the display device substrate of the present invention, the plurality of fine metal patterns are preferably formed of a material containing at least one selected from tartar, molybdenum, titanium, copper, and aluminum.

  According to the said structure, since the said several fine metal pattern is formed with the material which has a high infrared reflectance, the contamination state by an infrared spectrophotometer can be confirmed with a higher sensitivity.

  In the substrate for a display device of the present invention, it is preferable that the plurality of fine metal patterns are formed smaller than a regular square shape having a side of 50 μm in a plan view.

  According to the above configuration, since the plurality of fine metal patterns are formed with a size or less that affects the display quality, even if a display device is manufactured using such a display device substrate, the display quality is high. Will not drop.

  In the display device substrate of the present invention, the insulating substrate is preferably a flexible substrate.

  According to the said structure, since the said insulating substrate in the board | substrate for display apparatuses has flexibility, it can be used suitably at the time of preparation of a flexible display apparatus.

  In the display device substrate of the present invention, the uppermost layer of the laminated film is preferably a metal film.

  According to the above configuration, in the display device substrate, the uppermost layer of the laminated film formed on the one surface that is the surface opposite to the other surface on which the plurality of fine metal patterns are formed, Since it is formed of a metal film, the presence or absence of contaminants on the surface of the metal film is detected by detecting the presence or absence of absorption of a predetermined wave number in the infrared light reflected by the metal film with an infrared spectrophotometer. Judgment can be made.

  Therefore, it is possible to confirm the contamination state on both surfaces of the display device substrate.

  In the display panel of the present invention, the display medium is a liquid crystal layer, and the liquid crystal layer is sandwiched between a first substrate and a second substrate, and the first substrate and the second substrate. At least one of them may be the display device substrate.

  According to the above configuration, since the plurality of fine metal patterns are formed on at least one of both surfaces of the display panel having the liquid crystal layer, it is possible to check the contamination state of the surface of the display panel. it can.

  Accordingly, it is possible to prevent the contaminants from being transferred to the next manufacturing process, for example, a polarizing plate attaching step or the like, while being adhered to the surface of the display panel.

  In the display panel of the present invention, the layer in contact with the liquid crystal layer of any one of the first substrate and the second substrate is a laminated film including a light shielding layer, and the first substrate and the second substrate It is preferable that the plurality of fine metal patterns formed on at least one side of the substrate and the light shielding layer are provided so as to overlap in a plan view.

  According to the above configuration, since the plurality of fine metal patterns and the light shielding layer are provided so as to overlap in plan view, it is possible to more surely suppress deterioration in display quality due to the plurality of fine metal patterns. be able to.

  In the display panel of the present invention, the layer in contact with the liquid crystal layer of the second substrate is a laminated film including a metal wiring layer, and the plurality of fine metal patterns are formed on the second substrate. The metal wiring layer and the plurality of fine metal patterns are preferably formed of the same material.

  According to the above configuration, since the metal wiring layer and the plurality of fine metal patterns formed on the second substrate which are the same substrate are formed of the same material, the metal wiring layer and the plurality of metal patterns are formed. Therefore, even if the plurality of fine metal pattern forming steps are added, it is possible to suppress an increase in the manufacturing unit price.

  In the display panel of the present invention, the display medium is an organic light emitting layer, a laminated film is provided on one surface that is in contact with the organic light emitting layer, and the plurality of fine metal patterns are disposed on the other surface. The display device substrate may be provided.

  According to the said structure, the contamination state of the surface of the said display panel can be confirmed also in the display panel provided with the organic light emitting layer.

  Accordingly, it is possible to prevent the contaminants from being transferred to the next manufacturing process, for example, a touch panel bonding process or a touch panel forming process while being attached to the surface of the display panel.

  In the display panel of the present invention, the laminated film provided on one surface that is in contact with the organic light emitting layer includes a light shielding layer, and the plurality of fine metal patterns and the light shielding layer are planarly viewed. Are preferably provided so as to overlap each other.

  According to the above configuration, even in the display panel provided with the organic light emitting layer, the plurality of fine metal patterns and the light shielding layer are provided so as to overlap in a plan view. The deterioration of display quality due to the pattern can be more reliably suppressed.

  In the display panel of the present invention, the laminated film provided on the one surface that is in contact with the organic light emitting layer includes a metal wiring layer, and the metal wiring layer and the plurality of fine metals are included. The pattern is preferably formed of the same material.

  According to the above configuration, since the metal wiring layer and the plurality of fine metal patterns can be formed using the same apparatus, even if a process for forming the plurality of fine metal patterns is added, the manufacturing is performed. An increase in unit price can be suppressed.

  In order to solve the above problems, a method for detecting a contaminant on a substrate for a display device according to the present invention detects a contaminant on a substrate for a display device in which a metal pattern is formed on one surface or both surfaces of an insulating substrate. A method for determining the presence or absence of contaminants on the surface of the metal pattern by detecting the presence or absence of absorption of a predetermined wave number in the infrared light reflected by the metal pattern with an infrared spectrophotometer. It is characterized by.

  According to the above method, the presence or absence of contaminants on the surface of the metal pattern is determined by detecting the presence or absence of absorption of a predetermined wave number in the infrared light reflected by the metal pattern with an infrared spectrophotometer. Therefore, the presence or absence of contaminants on the surface of the metal pattern can be confirmed in a short time in a non-destructive and non-contact manner.

  Therefore, by using the above method for detecting a contaminant on a substrate for a display device, it is possible to prevent or suppress the contaminant from being transferred to the next manufacturing process while being adhered on the surface of the substrate. Yield can be improved in the process.

  In the method for detecting a contaminant on a substrate for a display device of the present invention, the infrared spectrophotometer is preferably a Fourier transform infrared spectrophotometer.

  According to the above method, it is possible to detect the presence or absence of contaminants on the display device substrate with high accuracy.

  In the method for detecting a contaminant on a substrate for a display device according to the present invention, when determining the presence or absence of a contaminant on the surface of the metal pattern, it is polarized toward the metal pattern and Infrared light having an incident angle of 70 to 85 degrees with respect to the normal direction is preferably irradiated.

  According to the above method, even when the shape of the contaminant is thin in the thickness direction of the metal pattern, the presence or absence of the contaminant on the display device substrate can be detected with high accuracy.

  In the infrared spectrophotometer in the method for detecting a contaminant on a substrate for a display device of the present invention, an irradiation area of infrared light irradiated toward the metal pattern can be adjusted, and the infrared light is reflected by the metal pattern. An optical system capable of adjusting the irradiation area of the reflected light, and the reflected light detector, and the reflected light reflected by the metal pattern on the entire element provided in the reflected light detector. It is preferable that the optical system is adjusted so that is irradiated.

  According to the above method, even when the size of the contaminant is small, the presence or absence of the contaminant on the display device substrate can be detected with high accuracy.

In the method for detecting a contaminant on a substrate for a display device according to the present invention, the predetermined wave number is preferably within a range of 650 cm ^{−1 to} 4000 cm ⁻¹ .

  According to the above method, since the wave number range corresponds to the wave number range in which specific absorption spectra of various substances appear, the presence or absence of a wide variety of contaminants can be detected.

  In the method for detecting a contaminant on a substrate for a display device of the present invention, when the contaminant on the surface of the metal pattern contains an organic substance, an absorption band derived from OH stretching vibration, derived from CH stretching vibration. Absorption band derived from C = O stretching vibration, absorption band derived from inter-carbon stretching vibration of benzene ring, absorption band derived from C—H bending vibration, and absorption band derived from C—O stretching vibration However, when there is at least one, it is preferable to determine that a contaminant exists on the metal pattern.

  According to the above method, it is possible to narrow down the target of the type of pollutant and detect the presence or absence of the pollutant more efficiently.

  In the method for detecting a contaminant on a display device substrate according to the present invention, the stage control unit moves the display device substrate on the stage, and the infrared light reflected by the metal pattern at a plurality of locations in the metal pattern. It is preferable to detect the presence or absence of light absorption.

  According to the above method, the presence or absence of contaminants can be more efficiently detected in a wide area of the display device substrate.

  In the method for manufacturing a display device substrate of the present invention, it is preferable to include a step of removing the detected contaminants with an adhesive member by the method for detecting contaminants on the display device substrate.

  According to the above method, since only the region where the contaminant is detected needs to be processed using the adhesive member, there is no need to perform the cleaning operation on the entire display device substrate, and thus the display device substrate is more efficiently processed. Can be manufactured.

  As described above, the display device substrate of the present invention has a plurality of fine metal patterns formed on the other surface of the insulating substrate, which is the surface opposite to the one surface of the insulating substrate. It is the composition which is.

  In addition, as described above, the method for detecting a contaminant on a substrate for a display device according to the present invention detects, by an infrared spectrophotometer, the presence or absence of absorption of a predetermined wave number in infrared light reflected by the metal pattern. This is a method for determining the presence or absence of contaminants on the surface of the metal pattern.

  Therefore, it is possible to realize a display device substrate and a method for detecting contaminants on the display device substrate, which can improve the yield in the manufacturing process.

It is sectional drawing of the liquid crystal display panel of one embodiment of this invention. It is a top view of the liquid crystal display panel of one embodiment of this invention. It is the top view to which a part of liquid crystal display panel of one embodiment of this invention was expanded. (A) is a top view of the metal pattern with which the liquid crystal display panel of one embodiment of this invention was equipped, (b) is a side view of a metal pattern. It is a schematic diagram of the contamination measuring apparatus used in one embodiment of the present invention. (A) is a plan view of a liquid crystal display panel free from pollutants, (b) is a schematic view showing a state of measuring a liquid crystal display panel free from pollutants, It is a figure which shows the spectrum data as a background obtained by measuring on the surface of the metal pattern which does not exist. (A) is a plan view of a liquid crystal display panel with a pollutant, (b) is a schematic diagram showing how a liquid crystal display panel with a pollutant is measured, It is a figure which shows the spectrum data obtained by measuring on the surface of a certain metal pattern. It is a flowchart which shows the manufacturing method of the liquid crystal display panel of one embodiment of this invention. It is a figure which shows the modification of the liquid crystal display panel of one embodiment of this invention. It is a figure which shows the other modification of the liquid crystal display panel of one embodiment of this invention. It is a figure which shows the further another modification of the liquid crystal display panel of one embodiment of this invention. It is a figure which shows the further another modification of the liquid crystal display panel of one embodiment of this invention. It is a schematic diagram of the contamination measuring apparatus used in other one Embodiment of this invention. It is the schematic diagram showing a mode that infrared rays entered and radiate | emitted on the metal pattern surface in the contamination measuring apparatus shown in FIG. It is explanatory drawing explaining the parallel polarized light in the contamination measuring apparatus shown in FIG. It is a schematic diagram of the contamination measuring apparatus used in further another embodiment of this invention. It is a figure for demonstrating the method of removing the contaminant described in patent document 1. FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in this embodiment are merely one embodiment, and the scope of the present invention should not be construed as being limited thereto.

  In the following embodiments, a color filter substrate and a TFT substrate (active matrix substrate) will be described as examples of the display device substrate, and a liquid crystal display panel will be described as an example of the display panel. However, the present invention is not limited to this, and the display device substrate may be, for example, an organic EL active matrix substrate, and the display panel may be an organic EL display panel.

[Embodiment 1]
(Basic configuration of the liquid crystal display panel 10)
FIG. 1 is a cross-sectional view of a liquid crystal display panel 10 according to the present embodiment. FIG. 2 is a plan view of the liquid crystal display panel 10 as viewed from the display surface side. FIG. 3 is an enlarged plan view of a part of the liquid crystal display panel 10. 4A is a plan view of the metal pattern 11, and FIG. 4B is a side view of the metal pattern 11.

  As shown in FIG. 1, in the liquid crystal display panel 10, a TFT substrate 12 and a color filter substrate 13 are bonded together with a sealing sealant 18, and a liquid crystal layer 14 is interposed between the substrates 11 and 12. Is sandwiched.

  A plurality of fine metal patterns 11 are provided on the surface of the TFT substrate 12 that is in contact with the liquid crystal layer 14. On the surface of the TFT substrate 12 that is in contact with the liquid crystal layer 14, wiring 17 a and electrodes ( A pixel electrode) 17b, a TFT 19, and the like are provided.

  On the other hand, a plurality of fine metal patterns 11 are provided on the surface of the color filter substrate 13 opposite to the surface in contact with the liquid crystal layer 14, and the black matrix is provided on the surface of the color filter substrate 13 in contact with the liquid crystal layer 14. 15 and a color filter layer 16 are provided.

  As shown in FIGS. 1 and 2, the metal pattern 11 measures contaminants on the surface of the TFT substrate 12 and the color filter substrate 13 on the side opposite to the liquid crystal layer 14 by an infrared spectrophotometer. Is provided to do. Then, the metal patterns 11 are equally arranged on the entire surface of the TFT substrate 12 and the color filter substrate 13 at equal intervals in the vertical and horizontal directions.

  As shown in FIG. 3, the metal pattern 11 overlaps the black matrix 15 formed in a lattice shape on the surface of the color filter substrate 13 in contact with the liquid crystal layer 14 in plan view. Is provided.

  In the present embodiment, the metal pattern 11 and the black matrix 15 are provided so as to partially overlap in plan view. However, the present invention is not limited to this, and the metal pattern 11 and the black matrix 15 are It is preferable to form them so as to completely overlap.

  According to the said structure, the fall of the display quality by the some fine metal pattern 11 can be suppressed more reliably.

  In the present embodiment, the case where the black matrix 15 is formed on the color filter substrate 13 side is described. However, like the COA (Color Filter On Array) structure, the black matrix 15 is formed on the TFT substrate 12. It may be provided on the side.

  The plurality of fine metal patterns 11 are preferably formed of a material containing at least one selected from tartar, molybdenum, titanium, copper, and aluminum.

  According to the said structure, since the several fine metal pattern 11 is formed with the material which has a high infrared reflectance, the contamination state by an infrared spectrophotometer can be confirmed with a higher sensitivity.

  As shown in FIG. 4, in the present embodiment, the metal pattern 11 is formed in a rectangular parallelepiped shape having a vertical width and a horizontal width of 50 μm and a film thickness of 100 nm.

  As shown in FIG. 4A, the metal pattern 11 is formed in a regular square shape having a side of 50 μm in plan view.

  Considering the influence on display quality, the size of the metal pattern 11 is preferably smaller than a regular square shape having a side of 50 μm, but the shape is not particularly limited.

  As shown in FIG. 4B, in the present embodiment, the metal pattern 11 and the wiring 17a provided on the TFT substrate 12 are formed of the same material. The film thickness is 100 nm, which is the same film thickness as the wiring 17a, but is not limited to this.

  The insulating substrate material for the TFT substrate 12 and the color filter substrate 13 can be glass or the like, but is not limited to this, and a flexible substrate such as plastic can also be used.

  Such a flexible substrate can be suitably used for manufacturing a flexible display device.

  The black matrix 15 is a light shielding layer made of a chromium film or a resin material containing carbon black.

  The color filter layer 16 is formed between the lattices of the black matrix 15 and includes, for example, a red color filter, a green color filter, and a blue color filter. If necessary, other color filters may be added as appropriate. For example, a yellow color filter may be added.

(Contaminant detection method using infrared spectrophotometer)
Hereinafter, a method for detecting contaminants on the TFT substrate 12, the color filter substrate 13, and the substrate of the liquid crystal display panel 10 including these substrates will be described.

  FIG. 5 is a schematic diagram of a contaminant detection apparatus 100 used for detection of contaminants on the TFT substrate 12, the color filter substrate 13, and the substrate of the liquid crystal display panel 10 including these substrates 12 and 13.

  FIG. 6A is a plan view of the liquid crystal display panel 10 when there is no contaminant on the surface thereof. FIG. 6B is a diagram illustrating a state in which the contaminant detection apparatus 100 performs measurement using the liquid crystal display panel 10 illustrated in FIG. (C) of FIG. 6 is a figure which shows the spectrum data as a background obtained by measuring on the surface of the metal pattern 11 without a contaminant.

  On the other hand, FIG. 7A is a plan view of the liquid crystal display panel 10 when there is a contaminant on its surface. FIG. 7B is a diagram illustrating a state where the contaminant detection apparatus 100 performs measurement using the liquid crystal display panel 10 illustrated in FIG. FIG. 7C is a diagram showing spectral data obtained by measuring the surface of the metal pattern 11 in which contaminants are present.

  The method for detecting contaminants using an infrared spectrophotometer uses a TFT substrate 12, a color filter substrate 13, and a liquid crystal display panel 10 including these substrates, each having a metal pattern 11, and a contamination including an infrared spectrophotometer. In this method, the substance detection apparatus 100 detects a contaminant on the surface of the metal pattern 11 and determines the presence or absence of the contaminant based on the result.

  In the present embodiment, a Fourier transform infrared spectrophotometer (FT-IR) 110 is used as the infrared spectrophotometer in order to increase the detection accuracy. However, the present invention is not limited to this. For example, A dispersion type infrared spectrophotometer or the like can also be used.

  As shown in FIG. 5, the contaminant detection apparatus 100 preliminarily stores spectral data of a Fourier transform infrared spectrophotometer (FT-IR) 110 and at least one substance included in the liquid crystal display panel 10. Constituent substance storage means 120 to be stored, constituent substance discriminating means 130 for discriminating whether or not the measurement result coincides with the spectrum data stored in the constituent substance storage means 120, and based on the measurement results, A determination unit 140 for determining the presence or absence of detection, a stage 150 on which the liquid crystal display panel 10 can be installed, and a stage control unit 160 for moving the stage 150 on which the liquid crystal display panel 10 is installed are provided.

  By moving the stage 150 on which the liquid crystal display panel 10 is installed, it is possible to detect contaminants at a plurality of locations on the liquid crystal display panel 10, and more efficiently in the wide area of the liquid crystal display panel 10. The presence or absence can be detected.

  5 shows a case where the presence or absence of contaminants in the liquid crystal display panel 10 is detected. However, as will be described later, if the metal pattern 11 is provided, the TFT substrate 12 or the color filter substrate 13 is used. Similarly, it is possible to detect the presence or absence of contaminants.

  As shown in FIG. 5, the Fourier transform infrared spectrophotometer (FT-IR) 110 includes an FT-IR main body 111 including a light source (not shown) that emits infrared light, and an FT-IR main body 111. And an A / D converter 112 connected to the A / D converter 112 and a spectrum measuring means 113 connected to the A / D converter 112.

  Infrared light emitted from a light source (not shown) provided in the FT-IR main body 111 passes through an aperture (not shown) provided in the FT-IR main body 111, and then the irradiation area (target area). ) Is narrowed and irradiated toward the metal pattern 11.

  The infrared light is reflected by the metal pattern 11, passes through an aperture (not shown) provided in the FT-IR body 111 again, removes diffracted light, and then provided in the FT-IR body 111. The image is projected on the light receiving surface of a detection unit (not shown).

  In the case where a contaminant is attached on the metal pattern 11, since the infrared light passes through the contaminant, a part of the wavelength of the infrared light is specifically absorbed.

  In the present embodiment, MCT (mercury-cadmium-tellurium) is used as the material of the detection unit (detector), and the element size of the detection unit (detector) is 250 × 250 μm. The material and size of the detector (detector) are not limited to this.

Moreover, although the resolution at the time of measurement is 4 cm ⁻¹ and the number of integration is 64, it may be set as appropriate according to the measurement conditions and the required accuracy.

  The light source uses a dual masking method in which a masking size is adjusted while viewing a visible image through a microscope and a measurement area is determined, but the present invention is not limited to this. Further, the intensity of the infrared light emitted from the light source is confirmed by an interferogram, and is preferably 5v or more.

  In the present embodiment, the beam diameter (primary element) of the light exit of the infrared light is 7 to 8 mm, the cassegrain is 32 times, and the masking size is 46 × 46 μm (red The size of the element of the detector (detector) 250 × 250 μm is covered by the external light irradiation area), and this is the reason why the surface of the metal pattern 11 is set to a size in the vicinity of 50 × 50 μm in this embodiment. It is.

  That is, in the method for detecting contaminants using the infrared spectrophotometer used in the present embodiment, the infrared light reflected by the metal pattern 11 over the entire size of the element of the detector (detector) 250 × 250 μm. It is preferable that the optical system (aperture, beam diameter of the light exit port of infrared light, cassegrain, size of the metal pattern 11) is adjusted so that the reflected light is irradiated. However, the present invention is not limited to this. Absent.

  According to the above method, even when the size of the contaminant is small, the presence or absence of the contaminant on the display device substrate can be detected with high accuracy.

  The infrared light data projected on the light receiving surface of the element of the detector (detector) is converted from an analog signal to a digital signal by the A / D converter 112 and input to the spectrum measuring means 113. Then, the spectrum measuring means 113 converts it into spectrum data (measurement result) based on the data converted into a digital signal.

  The constituent material storage unit 120 stores in advance spectrum data of at least one material included in the liquid crystal display panel 10, for example. That is, it is a configuration for determining whether or not the peak is derived from a sealing material or an adhesive layer that has been applied in advance, and to distinguish between contaminants and substances constituting the liquid crystal display panel 10.

  The substance discriminating unit 130 discriminates whether or not the spectrum data (measurement result) converted by the spectrum measuring unit 113 matches the spectrum data (comparison data) stored in the constituent substance storage unit 120. For example, it is a configuration for determining whether the peak is derived from a sealing material or an adhesive layer that has been applied in advance, and to distinguish between contaminants and substances that constitute the liquid crystal display panel 10.

  The determination unit 140 is configured to determine whether or not a contaminant is detected, and is configured to determine whether a contaminant is attached based on the spectrum data (measurement result) converted by the spectrum measurement unit 113. That is, the determination unit 140 determines whether it is noise or a peak derived from a contaminant based on a preset S / N ratio standard, and determines whether or not a contaminant is detected.

  As shown in FIGS. 6A and 6B, the metal pattern 11 is measured in advance when there is no contaminant as the background measurement, the background is set, and the data to be measured is It is desirable to be able to correct it. By doing so, air (for example, carbon dioxide) or the surface of the metal pattern 11 existing between the FT-IR body 111 and the surface of the metal pattern 11 as in the spectrum data (background) shown in FIG. Infrared absorption due to the above can be 0-based.

  Then, as shown in FIGS. 7 (a) and 7 (b), when a case where contaminants are attached on the surface of the metal pattern 11 is measured, it is shown in FIG. 7 (c). As described above, spectral data (measurement result) showing an infrared absorption pattern of only the contaminant is obtained.

Further, when the pollutant is made of an organic substance such as an organic compound or an organometallic compound, each organic substance has a wave number in the mid-infrared wavelength region (wavelength 2.5 to 15 μm) within the range of 4000 cm ^{−1 to} 650 cm ^−1. An intrinsic infrared absorption pattern is shown. Therefore, the measurement range of the Fourier transform infrared spectrophotometer (FT-IR) 110 may be in a range of wavenumber ^{4000cm -1 ~650cm} -1.

For example, in the case where the contaminant is a compound having a hydroxyl group, infrared light having a relatively strong intensity derived from OH stretching vibration in an absorption band derived from OH stretching vibration (wave number: 3400 cm ^{−1 to} 3100 cm ⁻¹ ). Absorption peak is shown. This infrared light absorption peak shows a peak at a wave number unique to each organic substance.

As a specific example, contaminants, and the substance A of the absorption peak derived from O-H stretching vibration 3250cm ^-1, absorption peaks derived from the O-H stretching vibration is either a substance B of 3160Cm ^-1 In the case where there is a possibility, if the absorption peak derived from the OH stretching vibration of the pollutant is 3250 cm ⁻¹ , the pollutant is highly likely to be the substance A or the substance derived from the substance A, and the substance B Or it turns out that possibility that it is a substance derived from the substance B is low.

In addition, similarly to the absorption band derived from OH stretching vibration, the absorption band derived from C—H stretching vibration (wave number 2900 cm ^{−1 to} 2800 cm ⁻¹ ), absorption derived from C═O stretching vibration. Band (wave number 1800 cm ^{−1 to} 1700 cm ⁻¹ ), absorption band derived from inter-carbon stretching vibration of benzene ring (wave number 1600 cm ⁻¹ vicinity (wave number 1630 cm ^{−1 to} 1570 cm ⁻¹ ), wave number 1500 cm ⁻¹ vicinity (wave number 1530 cm ^{− 1 to} 1470 cm ⁻¹ )), absorption band derived from C—H bending vibration (wave number around 1400 cm ⁻¹ (wave number 1450 cm ^{−1 to} 1350 cm ⁻¹ )), absorption band derived from C—O stretching vibration (wave number 1200 cm) ^-1 vicinity (wavenumber ^{1250cm -1 ~1150cm} -1)), the absorption band derived from Si-O stretching vibration (wavenumber ^{1100 cm} -1 to 1 50cm ^-1) and the like are known.

  The determination of the presence or absence of the contaminant in the determination unit 140 may be performed based on the data of the at least one absorption band in the spectrum data (measurement result).

(Manufacturing method of the liquid crystal display panel 10)
Hereinafter, an example of a manufacturing method of the liquid crystal display panel 10 and an example of use of the contaminant detection device 100 in the manufacturing process will be described. FIG. 8 is a flowchart showing a method for manufacturing the liquid crystal display panel 10.

  First, the metal pattern 11 is formed on the surface of the insulating substrate (first substrate) constituting the TFT substrate 12 by using a photolithography method or the like (step S51). Next, the insulating substrate (first substrate) is turned over, and a predetermined film for forming the wiring 17a, the electrode (pixel electrode) 17b, the TFT 19 and the like is formed on the surface opposite to the surface on which the metal pattern 11 is formed. Form (step S52).

  Then, an alignment film made of polyimide (PI) or the like is applied on the entire surface of the substrate and baked (step S53).

  Then, the sealing sealing material 18 is drawn on the end portion of the substrate (step S54), and the liquid crystal is dropped inside the drawn sealing sealing material 18 (step S55).

  In this embodiment mode, a liquid crystal dropping (ODF) method is used, but the present invention is not limited to this, and a vacuum injection method may be used.

  On the other hand, on the color filter substrate 13 side, first, the metal pattern 11 is formed on the surface of the insulating substrate (second substrate) constituting the color filter substrate 13 by using a photolithography method or the like (step S56). Next, the insulating substrate (second substrate) is turned over, and a predetermined film for forming the black matrix 15, the color filter layer 16, and the like is formed on the surface opposite to the surface on which the metal pattern 11 is formed ( Step S57).

  Then, an alignment film made of polyimide (PI) or the like is applied to the entire surface of the substrate and baked (step S58).

  Then, the TFT substrate 12 obtained in step S55 and the color filter substrate 13 obtained in step S58 are bonded together, and UV irradiation is performed (step S59). And it wash | cleans (step S60) and performs a contamination state determination (step S61).

  In the contamination state determination, the presence or absence of contamination is determined using the detection method of the contaminant by the infrared spectrophotometer as described above.

  If there is a contaminant, it is re-cleaned by an appropriate method (step S62) and the contamination is measured again or transferred to the next step. Moreover, when there is no contamination, it conveys to the next process as it is.

  As the re-cleaning method, it is preferable to remove the detected contaminants with an adhesive member as described in Patent Document 1.

  According to the above method, since only the region where the contaminant is detected needs to be processed using the adhesive member, there is no need to perform the cleaning operation on the entire substrate, and thus the liquid crystal display panel 10 is manufactured more efficiently. be able to.

  Hereinafter, an example of forming a metal pattern will be described with reference to FIGS.

(Modification 1)
FIG. 9 is a plan view of a liquid crystal display panel 20 which is a modification of the present embodiment.

  As shown in the figure, in this modification, a large number of metal patterns 21 are arranged on the upper right side of the TFT substrate 22 or the color filter substrate 23 provided in the liquid crystal display panel 20. This is because the metal pattern that can be suitably used when there is a tendency for contaminants to easily adhere to the upper right region or when various problems occur when contaminants adhere to the upper right region. It is a formation example.

(Modification 2)
FIG. 10 is a plan view of a liquid crystal display panel 30 which is another modification of the present embodiment.

  As shown in the figure, in this modification, a large number of metal patterns 31 are arranged on the left end side of the TFT substrate 32 or the color filter substrate 33 provided in the liquid crystal display panel 30. This is because the metal pattern that can be suitably used when the contaminant tends to adhere to the left end region or when various problems occur when the contaminant adheres to the left end region. It is a formation example.

(Modification 3)
FIG. 11 is a plan view of a liquid crystal display panel 40 which is still another modification of the present embodiment.

  As shown in the figure, in this modification, a large number of metal patterns 41 are arranged in the center of the TFT substrate 42 or the color filter substrate 43 provided in the liquid crystal display panel 40. This is an example of forming a metal pattern that can be suitably used when there is a tendency for contaminants to adhere to the central region, or when various problems occur when contaminants are attached to the central region. It is.

(Modification 4)
FIG. 12 is a cross-sectional view of a liquid crystal display panel 50 which is still another modification of the present embodiment.

  As shown in the drawing, in this modification, the metal pattern 51 is formed only on one substrate.

  As described above, the arrangement position of the metal pattern is not particularly limited, and can be appropriately arranged according to the use of the liquid crystal display panel to be manufactured, the state of the production line, and the like, and may be randomly arranged. Further, as in the fourth modification, the metal pattern may be formed only on one substrate in consideration of an increase in the manufacturing unit cost due to the addition of the manufacturing process.

[Embodiment 2]
Next, Embodiment 2 of the present invention will be described as follows with reference to FIGS. All configurations, methods, and operations not described below are the same as those in the first embodiment. The present embodiment is different from the first embodiment in that the incident angle of infrared light applied to the liquid crystal display panel is increased (for example, an incident angle of 70 to 85 degrees). Thereby, the effect that the intensity | strength of a spectrum can be improved and a measurement sensitivity can be improved is acquired.

  The contamination detection method using the infrared spectrophotometer used in the present embodiment is a contamination measuring apparatus 200 including a Fourier transform infrared spectrophotometer (FT-IR) 210 that can emit infrared light having a large incident angle. Thus, the contaminant on the surface of the metal pattern 11 is measured, and the presence or absence of the contaminant is determined based on the measurement result.

  FIG. 13 is a schematic diagram of a contamination measuring apparatus 200 used in the contaminant detection method of the present embodiment.

  FIG. 14 is a schematic diagram showing how the emitted infrared light is incident and reflected on the surface of the metal pattern 11.

  FIG. 15 is a diagram for explaining parallel polarized light.

  As shown in FIG. 13, the contamination measuring apparatus 200 includes a Fourier transform infrared spectrophotometer (FT-IR) 210, a constituent substance storage means 220, a constituent substance discrimination means 230, a judgment means 240, A stage 250 and stage control means 260 are provided.

  Further, the Fourier transform infrared spectrophotometer (FT-IR) 210 includes an FT-IR main body 211, an A / D converter 212, a spectrum measuring means 213, which can be measured using a RAS method (Reflection Absorption Spectroscopy). .

  By using this RAS method, it is possible to detect even when a very thin contaminant of about several tens of millimeters, for example, a remaining alignment film, is present on the metal pattern 11.

  The RAS method is a method in which infrared light is incident on a metal surface and a change in light that has been partially absorbed and reflected is examined, as in the reflection measurement method of a Fourier transform infrared spectrophotometer. However, the RAS method uses deflected light as infrared light.

  In the present embodiment, as shown in FIG. 14, infrared light (parallel polarized light) having an incident angle of 85 degrees with respect to the normal to the surface of the metal pattern 11 is emitted from the FT-IR main body 211. Thereby, compared with the case where the incident angle of infrared light is small as in the case of the first embodiment, the distance that the infrared light passes through the pollutant becomes longer, so that the spectral intensity can be increased. Is obtained.

  Further, as shown in FIG. 15, by emitting parallel polarized light having a large incident angle with respect to the metal pattern 11, a normal line of the metal pattern 11 is obtained from a change in phase of light incident on the metal pattern 11 and reflected light. A large standing wave (electric vector) is generated in the direction. Thereby, the interaction between the molecule and the electric field is increased, and the spectral intensity can be improved.

[Embodiment 3]
Next, Embodiment 3 of the present invention will be described with reference to FIG. Note that the configurations, methods, and operations not described below are all the same as those in the first embodiment.

  In the present embodiment, the TFT 17 is used to measure whether or not any contaminants are attached to the surface opposite to the surface on which the metal pattern 11 is formed, using the wiring 17a provided on the TFT substrate 12. This is different from Embodiment 1 in which it is measured whether or not a contaminant is attached after the substrate 12 and the color filter substrate 13 are bonded together.

  FIG. 16 is a diagram for explaining a method of measuring whether or not any contaminants are attached to the surface opposite to the surface on which the metal pattern 11 is formed, using the wiring 17a provided on the TFT substrate 12. FIG.

  Thus, by using the wiring 17a provided on the TFT substrate 12, the contaminant is detected by the infrared spectrophotometer, so that the contaminant does not adhere to the wiring 17a after the wiring 17a is formed. Can be measured.

  In the present embodiment, the wiring 17a provided on the TFT substrate 12 has been described as an example. However, the present invention is not limited to this, and infrared light provided on the TFT substrate 12 or the color filter substrate 13 is used. Similarly, it is possible to measure whether or not a contaminant is attached on the film that reflects infrared light by using the reflecting film.

  The same applies to not only a liquid crystal display substrate but also an organic EL active matrix substrate.

  Although illustration is omitted, in an active matrix substrate for organic EL, a laminated film is provided on one surface that is in contact with the organic light emitting layer, and a metal pattern is provided on the other surface.

  Since the laminated film includes a metal wiring layer that reflects infrared light, it can be used to measure whether or not a contaminant is attached.

  Also in the active matrix substrate for organic EL, the laminated film preferably includes a light shielding layer, and the metal pattern and the light shielding layer are preferably provided so as to overlap in plan view.

  The metal wiring layer that reflects infrared light and the metal pattern are preferably formed of the same material.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and the present invention can be obtained by appropriately combining technical means disclosed in different embodiments. Embodiments are also included in the technical scope of the present invention.

  The present invention can be suitably used in a display device substrate, a display device, and a manufacturing process thereof.

10, 20, 30, 40, 50 Liquid crystal display panel (display panel)
11, 21, 31, 41, 51 Metal pattern 12, 22, 32, 42, 52 TFT substrate (substrate for display device)
13, 23, 33, 43, 53 Color filter substrate (substrate for display device)
14 Liquid crystal layer (display medium)
15 Black matrix (shading layer)
16 Color filter layer 17a Wiring 17b Electrode (pixel electrode)
18 Sealing sealant 19 TFT
100, 200 Contamination measuring device 110, 210 Fourier transform infrared spectrophotometer (FT-IR)
120, 220 Constituent substance storage means 130, 230 Constituent substance discrimination means 140, 240 Determination means 150, 250 Stage 160, 260 Stage control means

Claims (19)

In the insulating substrate, a substrate for a display device in which a laminated film is provided on one surface which is a side in contact with a display medium that transmits or emits light,
A substrate for a display device, wherein a plurality of fine metal patterns are formed on a surface on the other side of the insulating substrate, which is a surface opposite to a surface on one side of the insulating substrate.   2. The display device according to claim 1, wherein the plurality of fine metal patterns are formed of a material including at least one selected from tartar, molybdenum, titanium, copper, and aluminum. substrate.   3. The display device substrate according to claim 1, wherein the plurality of fine metal patterns are formed smaller than a regular square shape having a side of 50 μm in a plan view.   The display device substrate according to claim 1, wherein the insulating substrate is a flexible substrate.   5. The display device substrate according to claim 1, wherein the uppermost layer of the laminated film is a metal film. The display medium is a liquid crystal layer,
The liquid crystal layer is sandwiched between a first substrate and a second substrate,
5. The display panel according to claim 1, wherein at least one of the first substrate and the second substrate is the display device substrate according to claim 1. The layer in contact with the liquid crystal layer of either the first substrate or the second substrate is a laminated film including a light shielding layer,
The plurality of fine metal patterns formed on at least one of the first substrate and the second substrate and the light shielding layer are provided so as to overlap in a plan view. 6. The display panel according to 6. The layer in contact with the liquid crystal layer of the second substrate is a laminated film including a metal wiring layer,
The plurality of fine metal patterns are formed on the second substrate,
The display panel according to claim 7, wherein the metal wiring layer and the plurality of fine metal patterns are formed of the same material. The display medium is an organic light emitting layer,
The display according to any one of claims 1 to 5, wherein a laminated film is provided on one surface which is in contact with the organic light emitting layer, and the plurality of fine metal patterns are provided on the other surface. A display panel comprising a device substrate. The laminated film provided on the one surface that is in contact with the organic light emitting layer includes a light shielding layer,
The display panel according to claim 9, wherein the plurality of fine metal patterns and the light shielding layer are provided so as to overlap in a plan view. The laminated film provided on the one surface that is in contact with the organic light emitting layer includes a metal wiring layer,
The display panel according to claim 10, wherein the metal wiring layer and the plurality of fine metal patterns are formed of the same material. A method for detecting contaminants on a display device substrate in which a metal pattern is formed on one side or both sides of an insulating substrate,
A display characterized in that the presence or absence of contaminants on the surface of the metal pattern is determined by detecting the presence or absence of absorption of a predetermined wave number in the infrared light reflected by the metal pattern with an infrared spectrophotometer. A method for detecting contaminants on a substrate for an apparatus.   The method for detecting a contaminant on a display device substrate according to claim 12, wherein the infrared spectrophotometer is a Fourier transform infrared spectrophotometer.   When determining the presence or absence of contaminants on the surface of the metal pattern, it is polarized toward the metal pattern and has an incident angle of 70 to 85 degrees with respect to the normal direction of the metal pattern. 14. The method for detecting a contaminant on a substrate for a display device according to claim 12, wherein certain infrared light is irradiated. In the infrared spectrophotometer, an optical system capable of adjusting an irradiation area of infrared light irradiated toward the metal pattern and adjusting an irradiation area of reflected light reflected by the metal pattern; and A reflected light detector, and
15. The optical system according to claim 12, wherein the entire optical element provided in the reflected light detector is irradiated with the reflected light reflected by the metal pattern. 2. A method for detecting a contaminant on a substrate for a display device according to item 1. The method for detecting a contaminant on a display device substrate according to any one of claims 12 to 15, wherein the predetermined wave number is in a range of 650 cm ^{-1 to} 4000 cm ^-1 .   When the contaminant on the surface of the metal pattern contains an organic substance, an absorption band derived from OH stretching vibration, an absorption band derived from C—H stretching vibration, an absorption band derived from C═O stretching vibration, When there is at least one absorption band derived from intercarbon stretching vibration of benzene ring, absorption band derived from C—H bending vibration and absorption band derived from C—O stretching vibration, a contaminant on the metal pattern The method for detecting a contaminant on a display device substrate according to any one of claims 12 to 16, wherein it is determined that the substrate exists.   The stage control unit moves the display device substrate on the stage, and detects the presence or absence of absorption of infrared light reflected by the metal pattern at a plurality of locations in the metal pattern. 18. The method for detecting a contaminant on a display device substrate according to any one of items 17 to 17.   A method for detecting a contaminant on a substrate for a display device according to any one of claims 12 to 18, comprising a step of removing the detected contaminant with an adhesive member. Production method.

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