JP2013197572A - Electronic component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting device that has a Z-axis drive arranged at a stationary portion so as to enable weight reduction of a movable portion of a pitch modification mechanism between nozzles.SOLUTION: The electronic component mounting device comprises: a fixed head 33 that is movable in a XY direction relative to a substrate 21; a first nozzle unit 35 that is supported by the fixed head and arranged to allow first adsorption nozzles 34A and 34B for adsorbing electronic components to move up and down; a second nozzle unit 37 that is supported by the fixed head to be movable in a direction of pitch modification between nozzles with respect to the first nozzle unit and arranged to allow second adsorption nozzles 36A and 36B for adsorbing the electronic components to move up and down; pitch modification means between nozzles (80 and 83) for relatively moving the second nozzle unit 2 to the first nozzle unit to modify pitches between nozzles; and first and second elevating drive means (45A, 45B, 47A, 47B, 64A,64B, 66A and 66B), arranged in the fixed head, for driving the first and second adsorption nozzles to move up and down.

Description

  The present invention relates to an electronic component mounting apparatus including a mounting head having a nozzle pitch variable mechanism.

  In an electronic component mounting apparatus for mounting an electronic component sucked by a suction nozzle on a circuit board, the mounting head movable in the X and Y directions includes two nozzle units holding the suction nozzle, and one nozzle unit is replaced with the other nozzle unit. As an electronic component mounting apparatus that can change the inter-nozzle pitch of the suction nozzles by relative movement with respect to the apparatus, for example, an apparatus described in Patent Document 1 is known.

  In the device described in Patent Document 1, a third movable member 31 that supports the suction nozzle 17 so as to be rotatable is supported on a second movable member 27 that is movable in the XY directions so that the suction nozzle 17 can be moved up and down in the Z-axis direction. Is moved up and down by a ball screw 34 driven by a motor 33 attached to the second movable member 27 and rotated by a motor 35 attached to the third movable member 27.

JP 2006-324395 A

  In the thing of patent document 1, since the drive part which moves a suction nozzle to a Z-axis direction is mounted in the 2nd movable member 27 which can move to an XY direction, the movable part of the pitch variable mechanism between nozzles is mounted. Increases weight. For this reason, there is a problem that the displacement of the tip of the suction nozzle becomes large unless it is greatly affected by the acceleration due to the movement of the movable part when the pitch between nozzles is changed and the moving speed is not slowed.

  In addition, since the weight of the movable part increases, it is necessary to increase the output of the motor that drives the movable part, which increases the motor size and accordingly increases the ball screw and the guide. There is a problem that the apparatus becomes large and expensive.

  The present invention has been made to solve the above-described problem, and provides an electronic component mounting apparatus in which a Z-axis drive unit is provided in a fixed unit so that the weight of the movable unit of the inter-nozzle pitch changing mechanism can be reduced. It is intended to do.

  In order to solve the above-mentioned problems, a feature of the invention according to claim 1 is that a substrate transfer device provided on a base for carrying in, carrying out and positioning of a substrate, and a component supply for supplying an electronic component mounted on the substrate In an electronic component mounting apparatus comprising: a device; and a component mounting device that adsorbs an electronic component supplied by the component supply device and mounts the electronic component on the substrate positioned and held by the substrate transfer device. The component mounting apparatus includes a mounting head that is relatively movable in the XY directions with respect to the substrate, and a first nozzle unit that is supported by the mounting head and that is provided with a first suction nozzle that sucks the electronic component so as to be movable up and down. A second suction nozzle that is supported by the mounting head so as to be movable in the direction of changing the pitch between the nozzles with respect to the first nozzle unit, and that is capable of moving up and down is provided. A nozzle unit, a nozzle-to-nozzle pitch changing means for moving the second nozzle unit relative to the first nozzle unit to change a nozzle-to-nozzle pitch, and the mounting head. 2 It has 1st and 2nd raising / lowering drive means which raises / lowers the adsorption nozzle.

  According to the configuration described above, since the mounting head is provided with the first and second lifting / lowering driving means for driving the first and second suction nozzles to lift / lower, the weight of the movable part that changes the nozzle pitch is reduced. As a result, the drive unit of the inter-nozzle pitch changing means can be reduced in size, and the inter-nozzle pitch can be changed quickly, and the component mounting operation can be performed efficiently.

  According to a second aspect of the present invention, in the first aspect, the first raising / lowering driving unit is connected to the first suction nozzle held up and down by the first nozzle unit, and the second The raising / lowering drive means is operatively connected to the second suction nozzle held so as to be movable up and down by the second nozzle unit while allowing movement of the second nozzle unit in the direction of changing the pitch between nozzles. That is.

  According to the configuration described above, the suction nozzle can be integrally moved up and down by the lifting drive means provided in the fixed portion while allowing the movement of the second nozzle unit.

  According to a third aspect of the present invention, in the second aspect of the present invention, the guide member having a guide groove extending in the direction of changing the nozzle pitch of the second nozzle unit is connected to the second lift driving means side. Further, a follower roller that can roll along the guide member is supported on the second suction nozzle side.

  According to the configuration described above, the guide member and the follower roller can smoothly move the second nozzle unit in the direction of changing the pitch between the nozzles, and the suction nozzle is moved by the lift drive means via the guide member and the follower roller. Can be moved up and down integrally.

1 is a schematic plan view of an electronic component mounting apparatus showing an embodiment of the present invention. It is a top view which shows the mounting head of the electronic component mounting apparatus which concerns on this Embodiment. It is a figure which shows the structure of a 1st nozzle unit. It is a figure which shows the structure of a 2nd nozzle unit. It is explanatory drawing which shows the pitch between nozzles of a 1st nozzle unit and a 2nd nozzle unit. It is the enlarged view to which the upper part of the 1st nozzle unit was expanded. It is the enlarged view to which the upper part of the 2nd nozzle unit was expanded. It is a figure which shows the pitch variable mechanism between nozzles. It is sectional drawing which shows the air distribution means between a 1st nozzle unit and a 2nd nozzle unit. It is a control block diagram which shows the control apparatus which controls an electronic component mounting apparatus. It is a figure which shows the application example which concerns on this Embodiment. It is a figure which shows another embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic plan view of an electronic component mounting apparatus 10, which includes a board transfer device 11, a tray-type component supply device 13, a feeder-type component supply device 14, and a component mounting device. 15 is provided.

  The substrate transport device 11 includes a belt conveyor 22 that is provided on the base 20 and transports the circuit board 21, transports the circuit board 21 along the belt conveyor 22, and carries it onto the substrate holding device 12. It is carried out from the holding device 12. Although not shown, the substrate holding device 12 includes a substrate support device that supports the circuit board 21 from below and a positioning and holding device that positions and holds the circuit board 21. In FIG. 1, the substrate transport direction is the X-axis direction, and the direction orthogonal to the substrate transport direction is the Y-axis direction.

  The tray-type component supply device 13 and the feeder-type component supply device 14 are provided on both sides of the substrate transfer device 11 so as to be separated from each other in the Y-axis direction. The tray-type component supply device 13 accommodates and supplies electronic components in a plurality of trays 23, and a large number of electronic components are arranged on the tray 23 in the XY directions. The tray-type component supply device 13 includes a carriage 24 as a supply device body, and the carriage 24 can be connected to and disconnected from the electronic component mounting apparatus 10.

  On the other hand, the feeder-type component supply device 14 accommodates and supplies electronic components in a plurality of feeders 25, and includes a carriage 26 as a feeder support table. The carriage 26 can be connected to the electronic component mounting apparatus 10. And it can be separated. The plurality of feeders 25 are detachably mounted on a feeder support table (cart) 26 in parallel in the X-axis direction.

  Although not shown in the drawings, each feeder 25 is provided with a reel, and a tape on which a large number of electronic components are accommodated in a single row is wound around the reel. The tape is fed by feeding means using a motor as a drive source, and electronic parts are sequentially supplied to the parts supply position.

  The component mounting device 15 is supported on an upper position of the base 20 of the electronic component mounting device 10 so as to be movable in the X-axis direction, and supported on the X-axis slide 31 so as to be movable in the Y-axis direction. A Y-axis slide 32 and a mounting head 33 provided on the Y-axis slide 32. As will be described later, the mounting head 33 is provided with a plurality of suction nozzles for sucking and holding electronic components. The X-axis slide 31 and the Y-axis slide 32 are moved by an X-axis motor 116 (see FIG. 10) and a Y-axis motor 117 (see FIG. 10), respectively, so that the mounting head 33 can be moved to any position in the XY plane. I have to.

  Next, a specific configuration of the mounting head 33 will be described with reference to FIGS. 2, 3, and 4. FIG. 2 is a plan view of the mounting head 33 as a whole as viewed from the lower surface, but is a schematic diagram mainly illustrating the planar arrangement relationship of each part.

  3 and 4, the mounting head 33 includes a first nozzle unit 35 having a plurality of (two in the embodiment) first suction nozzles 34A and 34B, and a plurality (two in the embodiment). A second nozzle unit 37 having second suction nozzles 36A and 36B.

  The first nozzle unit 35 is fixed to the head main body 38 of the mounting head 33, and the second nozzle unit 37 is supported by the head main body 38 of the mounting head 33 so as to be movable in the X direction. As shown in FIG. 5, the inter-nozzle pitch X1 between the first suction nozzles 34A and 34B and the second suction nozzles 36A and 36B can be freely changed between Xmin and Xmax. ing.

  In FIG. 3, upper fixing blocks 39 a and 39 b are fixed to the upper portion of the head main body 38 of the mounting head 33 on the first nozzle unit 35 side, and a lower fixing block 40 is fixed to the lower portion of the head main body 38. Yes. In the lower fixed block 40, a plurality (two) of first nozzle holding shafts 41A and 41B are held in parallel to the vertical axis while being separated by a predetermined distance Y1 in the Y-axis direction. The first nozzle holding shafts 41A and 41B are supported by the lower fixed block 40 so as to be movable in the Z-axis direction (vertical direction) and rotatable about the Z-axis. Splines are formed on the outer circumferences of the first nozzle holding shafts 41A and 41B, respectively.

  The head body 38 supports first ball screw shafts 44A and 44B rotatably in parallel with the first nozzle holding shafts 41A and 41B, and feed nuts 45A and 45B are respectively supported on the first ball screw shafts 44A and 44B. It is screwed. These feed nuts 45A and 45B are prevented from rotating with respect to the head main body 38 by a guide bar (not shown) so that the feed nuts 45A and 45B are rotated by rotation of the first ball screw shafts 44A and 44B. It is moved in the Z-axis direction (vertical direction).

  Support blocks 46A and 46B that support the upper ends of the first nozzle holding shafts 41A and 41B so as to be rotatable only are fixed to the feed nuts 45A and 45B, respectively, and are supported by movement of the feed nuts 45A and 45B in the Z-axis direction. The first nozzle holding shafts 41A and 41B are moved up and down integrally in the Z-axis direction via the blocks 46A and 46B.

  The head main body 38 is provided with first nozzle lifting motors 47A and 47B in parallel with the first ball screw shafts 44A and 44B, respectively. The drive gears 48A and 48B are connected to the motor shafts 47A1 and 47B1 of the first nozzle lifting motors 47A and 47B, respectively. The drive gears 48A and 48B are connected to one ends of the first ball screw shafts 44A and 44B. Meshed with the driven gears 49A and 49B.

  As a result, when the first nozzle lifting motors 47A and 47B installed in the head body 38 are driven, the first ball screw shafts 44A and 44B are rotated, together with the feed nuts 45A and 45B, the first nozzle holding shaft 41A, 41B is raised and lowered.

  The lower fixed block 40 rotatably supports driven gears 50A and 50B that are spline-engaged with the outer circumferences of the first nozzle holding shafts 41A and 41B, and these driven gears 50A and 50B are arranged in common. Is always meshed with the drive gear 51. The head main body 38 is provided with a first nozzle rotating motor 52 in parallel with the first nozzle holding shafts 41A and 41B. The drive gear 51 is connected to the motor shaft of the first nozzle rotating motor 52, whereby the first nozzle holding shafts 41 </ b> A and 41 </ b> B are rotated in opposite directions by the rotation of the first nozzle rotating motor 52.

  First suction nozzles 34A and 34B for sucking and holding electronic components are attached to the lower ends of the first nozzle holding shafts 41A and 41B, respectively. As shown in FIG. 6, air introduction holes 56A and 56B for introducing a negative pressure or a positive pressure into the first suction nozzles 34A and 34B are formed in the central portions of the first nozzle holding shafts 41A and 41B. The first nozzle holding shafts 41A and 41B are fitted with air introduction conduits 57A and 57B, respectively, so as to be slidable relative to each other, and the lower ends of these air introduction conduits 57A and 57B are opened in the air introduction holes 56A and 56B. Has been. The upper ends of the air introduction conduits 57A and 57B are integrally connected to the upper fixed block 39a.

  The upper fixed block 39a is formed with air supply passages 58A and 58B communicating with the air introduction conduits 57A and 57B. Although not shown, these air supply passages 58A and 58B are connected to the air supply source via respective switching valves. It is connected to the. Thus, air (negative pressure air or positive pressure air) can be supplied simultaneously or individually from the air supply source to the air supply paths 58A and 58B via the switching valve.

  The air supplied to the air supply paths 58A and 58B is introduced into the first suction nozzles 34A and 34B through the air introduction pipe lines 57A and 57B and the air introduction holes 56A and 56B, and is electronically transmitted by the first suction nozzles 34A and 34B. Parts can be picked up or released.

  On the other hand, as shown in FIG. 4, a pair of upper guide rails 75 are installed along the X-axis direction on the upper portion of the head main body 38 on the second nozzle unit 37 side, and a pair of upper guide rails 75 are disposed on the lower portion of the head main body 38. The lower guide rail 76 is installed along the X-axis direction. A pair of slide members 77 and 78 are guided and supported by the guide rails 75 and 76 so as to be movable in the X-axis direction. Upper movable blocks 61a and 61b and a lower movable block 62 are fixed to the slide members 77 and 78, respectively.

  In the lower movable block 62, a plurality (two) of second nozzle holding shafts (movable nozzle holding shafts) 63A and 63B are held in parallel with the first nozzle holding shafts 41A and 41B at a predetermined distance Y1 in the Y-axis direction. Has been. These second nozzle holding shafts 63A and 63B are separated from the first nozzle holding shafts 41A and 41B by a predetermined pitch X1 (see FIG. 5) in the X-axis direction, and the movable blocks 61a, 61b and 62 move in the X direction. Accordingly, the pitch between the first nozzle holding shafts 41A and 41B can be freely changed. The second nozzle holding shafts 63A and 63B are supported by the lower movable block 62 so as to be movable in the Z-axis direction (vertical direction) and rotatable around the Z-axis. Splines are formed on the outer circumferences of the second nozzle holding shafts 63A and 63B, respectively.

  The head body 38 rotatably supports second ball screw shafts 64A and 64B in parallel with the second nozzle holding shafts 63A and 63B. Feed nuts 65A and 65B are respectively connected to the second ball screw shafts 64A and 64B. It is screwed. These feed nuts 65A and 65B are prevented from rotating with respect to the head body 38 by a guide bar (not shown) so that the feed nuts 65A and 65B are rotated by rotation of the second ball screw shafts 64A and 64B. It is moved in the Z-axis direction.

  As shown in FIG. 7, guide members 96 </ b> A and 96 </ b> B having a U-shaped cross-section formed with guide groove portions 95 </ b> A and 95 </ b> B extending along the Y direction are fixed to the feed nuts 65 </ b> A and 65 </ b> B. Follower rollers 98A and 98B supported by the slide members 97A and 97B are engaged with the guide groove portions 95A and 95B of the guide members 96A and 96B so as to be able to roll in the X direction.

  The slide members 97A, 97B are prevented from rotating with respect to the movable blocks 61a, 61b, 62 by guide bars 99A, 99B (see FIG. 2) attached to the movable blocks 61a, 61b, 62. The upper ends of the second nozzle holding shafts 63A and 63B are supported on the slide members 97A and 97B so as to be rotatable only.

  As a result, the second nozzle unit 37 is allowed to move in the X direction while the feed nuts 65A and 65B are moved in the Z-axis direction so that the second nozzle holding shaft is moved via the guide members 96A and 96B and the slide members 97A and 97B. 63A and 63B can be moved up and down integrally in the Z-axis direction.

  The head main body 38 is provided with second nozzle lifting / lowering motors 66A and 66B in parallel with the second ball screw shafts 64A and 64B, respectively. Drive gears 68A and 68B are connected to the motor shafts of the second nozzle lifting and lowering motors 66A and 66B, respectively. These drive gears 68A and 68B are driven gears connected to one ends of the second ball screw shafts 64A and 64B. It is meshed with 69A and 69B. Accordingly, when the second ball screw shafts 64A and 64B are rotated by the second nozzle lifting / lowering motors 66A and 66B installed in the head main body 38, the second nozzle holding is held together with the feed nuts 65A and 65B screwed into the second ball screw shafts 64A and 64B. The shafts 63A and 63B are moved up and down integrally.

  The first and second nozzle holding shafts 41A, 44B, 63A are provided by the first and second nozzle raising / lowering motors 47A, 47B, 66A, 66B and the first and second ball screw shafts 44A, 44B, 64A, 64B. , 63B and the first and second suction nozzles 34A, 34B, 36A, 36B are configured to move up and down in the Z-axis direction.

  In this way, the lifting drive means (second ball screw shafts 64A, 64B and second nozzle lifting motors 66A, 66B) on the second nozzle head 37 side are separated from the second nozzle head 37, and the head main body is separated. Since the second nozzle unit 37 is fixedly installed at the position 38, the weight of the movable part moving in the X direction of the second nozzle unit 37 can be reduced.

  The lower movable block 62 rotatably supports driven gears 70A and 70B that are spline-engaged with the outer periphery of the second nozzle holding shafts 63A and 63B, respectively. The driven gears 70A and 70B are arranged in common. Is always meshed with the drive gear 71.

  The head main body 38 is provided with a second nozzle rotating motor 72 in parallel with the second nozzle holding shafts 63A and 63B. The drive gear 71 is connected to the motor shaft of the second nozzle rotating motor 72 so that the second nozzle holding shafts 63A and 63B are rotated in opposite directions by the rotation of the second nozzle rotating motor 72. It has become.

  Second suction nozzles 36A and 36B for sucking and holding electronic components are attached to the lower ends of the second nozzle holding shafts 63A and 63B, respectively. As shown in FIG. 7, air introduction holes 87A and 87B for introducing a negative pressure or a positive pressure into the second suction nozzles 36A and 36B are formed in the central portions of the second nozzle holding shafts 63A and 63B. The second nozzle holding shafts 63A and 63B are fitted with air introduction pipes 88A and 88B so as to be slidable relative to each other, and lower ends of the air introduction pipes 88A and 88B are opened in the air introduction holes 87A and 87B. Has been. The upper ends of the air introduction pipes 88A and 88B are integrally connected to the upper movable block 61b.

  Air supply paths 89A and 89B communicating with the air introduction pipes 88A and 88B are formed in the upper movable block 61b. Air is supplied to the air supply passages 89A and 89B via an air circulation means described later. These air supply paths 89A and 89B are connected to an air supply source via a switching valve (not shown). As a result, air (negative pressure air or positive pressure air) can be supplied simultaneously or individually from the air supply source to the air supply paths 58A and 58B via the switching valves.

  The air supplied to the air supply passages 89A and 89B is introduced into the second suction nozzles 36A and 36B via the air introduction pipes 88A and 88B and the air introduction holes 87A and 87B, and is electronically supplied by the second suction nozzles 36A and 36B. Parts can be picked up or released.

  As shown in FIG. 8, a support bracket 79 is fixed to the head main body 38, and a third ball screw shaft 80 is supported on the support bracket 79 so as to be rotatable around an axis parallel to the X direction. A feed nut 81 is screwed onto the third ball screw shaft 80, and the feed nut 81 is prevented from rotating only in the X direction by a guide bar (not shown). Is moved in the X direction by the rotation of. The feed nut 81 is integrally connected to the lower movable block 62 via a connecting block 82.

  A pitch changing motor 83 is attached to the support bracket 79 in parallel with the third ball screw shaft 80. A drive gear 85 is connected to the motor shaft 83 a of the pitch changing motor 83, and the drive gear 85 is meshed with a driven gear 86 connected to one end of the third ball screw shaft 80. Thus, when the third ball screw shaft 80 is rotated by the pitch changing motor 83, the second nozzle unit 37 is moved along the lower guide rail 76 via the lower movable block 62 together with the feed nut 81 screwed into the third nut. Are moved in the X direction.

  The pitch changing motor 83, the third ball screw shaft 80, and the like constitute an inter-nozzle pitch changing means, and the inter-nozzle pitch changing means and the second nozzle unit 37 are used for the first nozzle unit 35. Thus, a nozzle pitch variable mechanism that can change the nozzle pitch is configured. The movable part of the inter-nozzle pitch variable mechanism is the second nozzle unit 37 excluding the above-described lifting drive means (second nozzle lifting motors 66A and 66B and second ball screw shafts 64A and 64B). Consists of.

  Between the upper movable block 61b and the upper fixed block 39b fixed to the head main body 38, the fixed block 39b side to the movable block 61b side, that is, the first nozzle unit 35 side to the second nozzle unit 37. Air circulation means 90 for circulating air is provided on the side. As shown in FIGS. 2 and 9, the air circulation means 90 includes a pair of air supply paths 91A and 91B formed in the upper fixed block 39b and a pair of air introduction paths 92A and 92B formed in the upper movable block 61b. And a pair of air pipes 93A and 93B for connecting the air supply paths 91A and 91B and the air introduction paths 92A and 92B, respectively.

  The pair of air supply passages 91A and 91B are connected to an air supply source via communication passages 100A and 100B (100B is not shown) and each switching valve, and each switching valve and communication passages 100A and 100B are connected from the air supply source. Thus, negative pressure air or positive pressure air is supplied to the air supply paths 91A and 91B simultaneously or individually.

  The pair of air supply paths 91A and 91B are spaced apart from each other by a predetermined distance in the Y direction, extend in the X direction, have one end opened toward the upper movable block 61b, and fitting bushes 94A and 94B are fixed to the open ends. ing. The pair of air introduction paths 92A and 92B are formed with a predetermined distance in the Y direction, and the base ends of the pair of air pipes 93A and 93B are fixed to each one end. The pair of air ducts 93A and 93B are fitted to the fitting bushes 94A and 94B so as to be slidable in the X direction, respectively, and the air supply passages 91A and 91B are connected regardless of the movement of the second nozzle unit 37 in the X direction. The supplied air can be introduced into the air introduction paths 92A and 92B without using a flexible air hose.

  As described above, since the conventional air hose is not used as the air circulation means 90, the suction nozzles 34A and 34B of the first nozzle unit 35 and the nozzles of the suction nozzles 36A and 36B of the second nozzle unit 37 are used. Even if the second nozzle unit 37 is moved in the X direction by the pitch changing motor 83 in order to change the interval pitch, the suction nozzle 36A, The tip position of 36B is not displaced.

  Further, between the upper fixed block 39b and the upper movable block 61b, as shown in FIG. 2, a compression spring 101 as an urging means is disposed around the guide bar 102 along the X direction. The compression spring 101 urges the first nozzle unit 35 in the direction in which the second nozzle unit 37 is separated from the first nozzle unit 35, and play between the third ball screw shaft 80 and the feed nut 81 screwed to the third ball screw shaft 80 ( Even if there is a gap, the variation in the stop position of the second nozzle unit 37 is reduced, and the reproducibility of the pitch between nozzles can be ensured.

  Accordingly, even if the second nozzle unit 37 is moved by a predetermined amount by the pitch changing motor 83 in order to change the nozzle pitch, the second screw unit 37 is not affected by the play between the ball screw shaft 80 and the feed nut 81 or the like. The variation in the stop position of the nozzle unit 37 can be reduced. As a result, the reproducibility of the nozzle pitch can be ensured, and the positioning accuracy of the suction nozzles 36A and 36B can be improved.

  As shown in FIG. 1, a board imaging device 97 composed of a CCD camera is provided on the Y-axis slide 32, and the board imaging device 97 is placed on a circuit board 21 positioned at a predetermined position of the component mounting device 15. An image of a substrate position reference mark and a substrate ID mark (not shown) provided in FIG. 2 is imaged to obtain substrate position reference information and substrate ID information. Based on the board position reference information acquired by the board imaging device 97, the mounting head 33 is corrected in position in the X and Y directions with respect to the circuit board 21, and the mounting operation of the electronic component is controlled based on the board ID information. It is supposed to be.

  On the base 20, a component imaging device 98 composed of a CCD camera is provided between the component supply devices 13 and 14 and the component mounting device 15. The component imaging device 98 images the electronic components sucked by the suction nozzles 34A, 34B, 36A, and 36B of the mounting head 33 while moving from the component supply devices 13 and 14 onto the circuit board 21, and the suction nozzle 34A, The electronic component sucked by 34B, 36A, and 36B, the misalignment of the electronic component with respect to the center of the sucking nozzles 34A, 34B, 36A, and 36B, and the like are detected. And the angle of the suction nozzles 34 </ b> A, 34 </ b> B, 36 </ b> A, 36 </ b> B are corrected so that the electronic component can be accurately mounted at a predetermined coordinate position on the circuit board 21.

  As shown in FIG. 10, the electronic component mounting apparatus 10 includes a control device 110. The control device 110 includes a CPU 111, a ROM 112, a RAM 113 and a bus 114 for connecting them, and an input / output interface 115 is connected to the bus 114. The input / output interface 115 includes an X-axis motor 116 and a Y-axis motor 117 that move the mounting head 33 in the X-axis and Y-axis directions, and first and second nozzle holding shafts 41A, 41B, 63A, and 63B in the Z-axis direction. Nozzle rotating motor (Z-axis motor) 47A, 47B, 66A, 66B, and first and second nozzle holding shafts 41A, 41B, 63A, 63B that move around the Z-axis line Motors 52 and 72 and a control unit 118 for controlling the pitch changing motor 83 for changing the pitch between nozzles are connected. The input / output interface 115 is connected to an image processing device 119 that performs image processing on image data picked up by the board image pickup device 97 and the component image pickup device 98.

  The current inter-nozzle pitch is stored in the RAM 113 of the control device 110, and when the inter-nozzle pitch change command is issued from the CPU 111, the pitch change motor according to the difference between the target value of the inter-nozzle pitch and the current value. 83 is forward / reversely controlled to change to a desired pitch between nozzles.

  Next, the operation of the electronic component mounting apparatus 10 in the above embodiment will be described. First, the inter-nozzle pitch is changed so as to match the pitch interval between adjacent feeders 25 of the feeder-type component supply device 14 or the pitch interval between two electronic components adjacent to each other in the X direction of the tray-type component supply device 13. The operation will be described.

  When changing the pitch between nozzles, the pitch changing motor 83 is driven by a predetermined amount based on a pitch changing command from the control device 110, and the feed nut 81 is moved in the X direction by the third ball screw shaft 80. The lower movable block 62 is moved in the X direction along the lower guide rail 76 via the connecting member 82. As a result, the second nozzle unit 37 is moved by a predetermined amount in the X direction with respect to the first nozzle unit 35, and the pitch between the nozzles of the first nozzle unit 35 and the second nozzle unit 37 is changed to a desired pitch. Is done.

  Next, the operation of picking up electronic components from the component supply apparatuses 13 and 14 and mounting them on the circuit board 21 while changing the pitch between nozzles will be described.

  In the present embodiment, since the first and second suction nozzles 34A, 34B, 36A, 36B separated in the X direction are provided, for example, the two feeders 25 adjacent to each other in the feeder-type component supply device 14 Electronic components respectively supplied to the component supply positions can be simultaneously sucked by two suction nozzles (first suction nozzle 34A and second suction nozzle 36A), and these electronic components can be simultaneously mounted on the circuit board 21. .

  Alternatively, two electronic components adjacent to each other in the X direction on the tray-type component supply device 13 can be simultaneously sucked by the first and second suction nozzles 34 </ b> A and 36 </ b> A, and these electronic components can be simultaneously mounted on the circuit board 21.

  Furthermore, when two rows of electronic components adjacent to each other in the Y direction on the tray-type component supply device 13 coincide with the interval between the first suction nozzles 34A and 34B (second suction nozzles 36A and 36B) in the Y direction. The four suction nozzles (first and second suction nozzles 34A, 34B, 36A, 36B) simultaneously suck four electronic components on the tray 23, and these electronic components can be mounted on the circuit board 21 simultaneously. it can.

  In the following, electronic components are picked up simultaneously from the two feeders 25 of the feeder-type component supply device 14 by two suction nozzles (first and second suction nozzles 34A, 36A) set at a predetermined nozzle pitch. An example of mounting on the circuit board 21 will be described.

  Based on a mounting command from the control device 110, the substrate transfer device 11 is driven, the circuit board 21 is transferred to a predetermined position, and is positioned and held by the substrate holding device 12. Next, when the X-axis motor 116 and the Y-axis motor 117 are driven, the X-axis slide 31 and the Y-axis slide 32 are moved in the X-axis direction and the Y-axis direction, and the mounting head 33 is moved to the feeder-type component supply device 14. It is moved to a predetermined position.

  In this state, the first and second nozzle raising / lowering motors 47A and 66A are driven, and the first and second ball screw shafts 44A and 64A are rotated. By rotation of the first and second ball screw shafts 44A and 64A, the feed nuts 45A and 65A are lowered in the Z-axis direction, and the first and second nozzle holding shafts 41A and 63A are integrally formed with the feed nuts 45A and 65A. Be lowered.

  When the first and second nozzle holding shafts 41A and 63A are lowered to a predetermined position, negative pressure air is supplied from the air supply source to the first and second nozzle holding shafts 41A and 63A by switching a switching valve (not shown). Thus, the two electronic components supplied to each component supply position of the adjacent feeder 25 are simultaneously sucked by the first and second suction nozzles 34A, 36A.

  That is, by switching the switching valve, negative pressure air is supplied to the first nozzle holding shaft 41A side via the air supply paths 58A and 58B, and the air circulation means 90 is supplied to the second nozzle holding shaft 63A side. The negative pressure air is supplied via the air supply passages 89A and 89B, and the electronic components supplied to the component supply positions of the adjacent feeders 25 are simultaneously sucked by the first and second suction nozzles 34A and 36A.

  When the electronic component is picked up by the first and second suction nozzles 34A and 36A, the first and second ball lift shafts 44A and 64A are driven in reverse by the first and second nozzle lifting / lowering motors 47A and 66A to feed the electronic parts. The first and second nozzle holding shafts 41A and 63A together with the nuts 45A and 65A are raised in the Z-axis direction.

  Next, the mounting head 33 is moved by a predetermined amount in the Y direction, and the other first and second suction nozzles 34 </ b> B and 36 </ b> B are positioned on each component supply position of the feeder 25. In this state, in the same manner as described above, the two electronic components supplied to the component supply positions by the first and second suction nozzles 34B and 36B are simultaneously sucked.

  Thereafter, the mounting head 33 is moved to a predetermined coordinate position on the circuit board 21 by the movement of the X-axis slider 31 and the Y-axis slider 32, but at a position passing over the component imaging device 98 in the middle thereof. By imaging the electronic components sucked by the suction nozzles 34A, 36A and 34B, 36B by the component imaging device 98, the displacement amount of the electronic components with respect to the suction nozzles 34A, 36A, 34B, 36B and the suction posture of the electronic components can be determined. recognize. Based on the recognition result, the amount of movement of the mounting head 33 in the X and Y directions is corrected, and the nozzle rotation motors 52 and 72 are driven to rotate the suction nozzles 34A, 34B, 36A, and 36B, thereby shifting the amount of electronic component displacement. Correct the suction posture of electronic parts.

  In this case, since the two suction nozzles 34A, 34B, 36A, and 36B are rotated simultaneously by the nozzle rotation motors 52 and 72, the suction posture of the electronic component is mounted on the circuit board 21. In this case, it is corrected individually.

  Subsequently, the pitch changing motor 83 is controlled according to the mounting interval of the two electronic components on the circuit board 21, and the pitch between the nozzles of the first nozzle unit 35 and the second nozzle unit 37 is determined. Changed to pitch. In this manner, when the mounting head 33 is moved onto the circuit board 21, the suction nozzles 34A, 36A together with the first and second nozzle holding shafts 41A, 63A are moved by the first and second nozzle lifting motors 47A, 66A. Is lowered again in the Z-axis direction, and two electronic components are simultaneously mounted at predetermined positions on the circuit board 21.

  Next, the mounting head 33 is moved in the X and Y directions, the pitch between nozzles is changed as necessary, and the two electronic components sucked by the suction nozzles 34B and 36B are simultaneously mounted at predetermined positions on the circuit board 21.

  FIG. 11 shows an application of the inter-nozzle pitch changing mechanism to image processing of electronic components sucked by the suction nozzles 34A, 34B, 36A, and 36B. That is, as shown in FIG. 11A, when the pitch between the nozzles of the first nozzle unit 35 and the second nozzle unit 37 when adsorbing the electronic components P1 to P4 is as large as X1a, all the electronic components P1 to P4 cannot be stored in the predetermined area Z1, and image processing cannot be performed at once.

  In such a case, after the electronic components P1 to P4 are sucked by the first and second suction nozzles 34A, 34B, 36A, and 36B, the nozzle pitch is reduced to X1b as shown in FIG. 11B. As a result, all the electronic components P1 to P4 are accommodated in the region Z1, and image processing can be performed collectively. As a result, the efficiency of the component mounting work can be improved.

  FIG. 12 shows another embodiment of the present invention. In the embodiment described above, the mounting head 33 includes two suction nozzles 34A, 34B, 36A, and 36B, respectively. The example in which the first and second nozzle units 35 and 37 are provided so that the pitch between nozzles can be changed has been described. However, in the embodiment shown in FIG. The first and second nozzle units 135 and 137 having two rotary heads 141 and 142 are provided so that the pitch between nozzles can be changed.

  On the circumferences of the first and second rotary heads 141 and 142, nozzle holding shafts (not shown) that hold a large number of suction nozzles 134 and 136 are respectively provided so as to be movable up and down.

  According to this embodiment, since a large number of electronic components can be simultaneously sucked by the large number of suction nozzles 134 and 136 provided on the circumferences of the rotary heads 141 and 142, the mounting work of the electronic components can be efficiently performed. Will be able to do.

  According to the above-described embodiment, the nozzle raising / lowering motors 66A and 66B and the ball screw shafts 64A and 64B for raising and lowering the suction nozzles 36A and 36B of the second nozzle unit 37 are provided on the head main body 38 of the mounting head 33. Since it is fixedly supported, the weight of the movable part that changes the pitch between nozzles can be reduced, the nozzle lifting motors 66A and 66B can be downsized, and the pitch between nozzles can be changed quickly. It is possible to perform the component mounting work efficiently.

  According to the present embodiment described above, the follower rollers 98A and 98B of the slide members 97A and 97B on the second nozzle holding shafts 63A and 63B are moved by the movement of the second nozzle unit 37 in the X direction to guide the guide member 96A. , 96B can roll along the guide groove portions 95A, 95B. Thereby, it is possible to smoothly move the second nozzle unit 37 in the direction of changing the pitch between the nozzles with respect to the driving means for moving up and down the second suction nozzles 36A and 36B (nozzle lifting motors 66A and 66B, etc.). Moreover, the second suction nozzles 36A and 36B can be lifted and lowered by the lift driving means at any position of the moving position.

  In the above-described embodiment, an example in which two suction nozzles 34A, 34B, 36A, and 36B are provided in each of the first and second nozzle units 35 and 37 has been described. Each of them may be provided with one suction nozzle, or may be provided with three or more suction nozzles.

  In the above-described embodiment, the example in which the second nozzle unit 37 can change the nozzle pitch in the X direction in the conveyance direction of the circuit board 21 with respect to the first nozzle unit 35 has been described. The nozzle-to-nozzle pitch changing direction of the two nozzle units 37 may be the Y direction orthogonal to the conveyance direction of the circuit board 21.

  In the above-described embodiment, the example in which one of the first and second nozzle units 35 and 37 is fixed and the other is movable is described. However, each nozzle unit 35 and 37 is movable. Good.

  In the above-described embodiment, an example in which two electronic components are simultaneously sucked and simultaneously mounted on the circuit board 21 by the suction nozzles 34A and 36A or the suction nozzles 34B and 36B has been described. 36A (34B, 36B) are sequentially operated to pick up electronic components one by one and can be mounted on the circuit board 21 one by one.

  Furthermore, in the above-described embodiment, the example in which the pitch in the Y direction of the plurality of suction nozzles 34A, 34B, 36A, and 36B provided in the nozzle units 35 and 37 is described. You may enable it to change to the direction orthogonal to the pitch change direction between nozzles.

  As described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention described in the claims.

DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting apparatus, 11 ... Board conveyance apparatus, 13, 14 ... Component supply apparatus, 15 ... Component mounting apparatus, 23 ... Tray, 25 ... Feeder, 33 ... Mounting head, 35 ... First nozzle unit, 37 ... Second nozzle unit 34A, 34B, 36A, 36B ... Suction head, 45A, 45B, 47A, 47B, 64A, 64B, 66A, 66B ... Elevating drive means (ball screw shaft, nozzle elevating motor), 80, 83 ... Inter-nozzle pitch changing means (ball screw shaft, pitch changing motor), 90 ... Air flow means, 93A, 93B ... Air pipes, 95A, 95B ... Guide groove, 96A, 96B ... Guide members, 98A, 98B ... Follower roller.

Claims (3)

A substrate transport device that is provided on the base and carries in, out, and positions the substrate, a component supply device that supplies electronic components to be mounted on the substrate, and an electronic component supplied by the component supply device In an electronic component mounting apparatus comprising: a component mounting device that mounts an electronic component on the substrate that is positioned and held by the substrate transfer device;
The component mounting device is:
A mounting head capable of moving relative to the substrate in the XY directions;
A first nozzle unit supported by the mounting head and provided with a first suction nozzle for sucking the electronic component so as to be movable up and down;
A second nozzle unit that is supported by the mounting head so as to be movable in the direction of changing the nozzle pitch with respect to the first nozzle unit, and is provided with a second suction nozzle that sucks the electronic component so as to be movable up and down;
An inter-nozzle pitch changing means for moving the second nozzle unit relative to the first nozzle unit and changing an inter-nozzle pitch;
First and second raising / lowering drive means provided on the mounting head and driving the first and second suction nozzles to move up and down;
An electronic component mounting apparatus.   2. The first raising / lowering driving means is connected to the first suction nozzle held up and down by the first nozzle unit, and the second raising / lowering driving means is connected to the second nozzle. An electronic component mounting apparatus that is operatively coupled to the second suction nozzle held by the unit so as to be movable up and down, allowing movement of the second nozzle unit in the direction of changing the pitch between nozzles.   3. The guide member having a guide groove extending in the direction of changing the pitch between nozzles of the second nozzle unit is connected to the second lifting drive means side, and the second suction nozzle side is connected to the second suction nozzle side. An electronic component mounting apparatus in which a follower roller capable of rolling along the guide member is supported.

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