JP2013196734A - Optical pickup device and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical pickup device capable of properly correcting the optical path of a laser beam emitted from a light emission element arranged with a mounting error.SOLUTION: Between a laser device for emitting laser light and a PDIC, a DOE 40 for inclining a traveling direction of a first laser beam is arranged in a state of being hold by a holder 64. Since the holder 64 is arranged in a state of being movable inside a housing 50, an optical pickup device can properly correct the optical path of the first laser beam by directly advancing or rotating the holder 64 along the optical path.

Description

  The present invention relates to an optical pickup device and a manufacturing method thereof, and more particularly to an optical pickup device including a plurality of light emitting elements that emit laser light and a manufacturing method thereof.

  In an optical pickup device corresponding to a plurality of optical recording media, various contrivances have been made for the purpose of miniaturization / lightening, for example, an objective lens having compatibility with lasers of a large number of wavelengths is adopted. ing. Some optical pickup devices of this type employ a laser device in which laser diodes (light emitting elements) having a plurality of wavelengths are packaged.

  In this way, by storing laser diodes of a plurality of wavelengths in a single laser device, the number of parts of the optical pickup device can be reduced and the cost can be reduced (see, for example, Patent Document 1).

JP 2002-163837 A

  However, when a plurality of light emitting elements are accommodated in the laser device, the distance between the light emitting sources provided in the individual light emitting elements becomes non-uniform due to a mounting error that occurs when the light emitting elements are mounted. . Generally, the error in the process of mounting the light emitting element is about ± 10 μm. If an error occurs in the distance between the light emitting sources within this range, this error has a great adverse effect on the optical pickup device.

  In particular, a light emitting element that emits BD laser light has a substrate material different from that of a light emitting element that generates DVD laser light or CD laser light. Therefore, in an optical pickup device applied to these media, at least a light emitting element for BD and a light emitting element for DVD and CD are required. Therefore, if the mounting error at the time of mounting the light emitting element is not absorbed by some measures, there is a possibility that the performance of writing and reading information on the medium is deteriorated.

  The present invention has been made in view of the above-described problems. A main object of the present invention is to provide an optical pickup device and a method for manufacturing the same, which can appropriately correct the optical path of laser light emitted from light emitting elements arranged with mounting errors.

  The optical pickup device of the present invention includes a housing, a first light emitting element that emits the first laser light from the first light emitting source, and the second laser light and the third laser light having different wavelengths from the first laser light. A laser device having a second light-emitting element and a second light-emitting element that radiates from the third light-emitting source, a first light-receiving region that receives the first laser light and the second laser light, and the third laser light. A light receiving element having a second light receiving region; and a first light receiving element disposed between the laser device and the light receiving element so that the first laser light is irradiated to the first light receiving region of the light receiving element. An optical correction element for tilting the traveling direction of the laser light and a holder for holding the optical correction element are provided, and the holder is housed in the housing in a movable state by being pressed by an elastic member. It is characterized in.

  The method of manufacturing an optical pickup device according to the present invention includes: a first light emitting element that emits a first laser beam from a first emission source; and a second laser beam and a third laser beam that are different in wavelength from the first laser beam. A laser device having a second light-emitting element and a second light-emitting element that emits light from the third light-emitting source, a first light-receiving region that receives the first laser light and the second laser light, and the third laser light. A step of housing a light receiving element having a second light receiving region in a housing, the second laser light is irradiated to a predetermined region of the first light receiving region, and the third laser light is irradiated to a predetermined region of the second light receiving region. Adjusting the relative position of the laser device and the light receiving element so that the first laser light is irradiated to a predetermined region of the first light receiving region. Progress of laser light Adjusting the position of the optical correction element for inclining the direction, and in the step of adjusting the position of the optical correction element, a holder for holding the optical correction element is disposed in the middle of the optical path, By moving the holder accommodated in the housing by a pressing force, the first laser beam is irradiated onto a predetermined portion of the first light receiving region.

  According to the present invention, the optical correction device that absorbs the mounting error is provided in the optical pickup device while being held by the holder, and the holder is pressed and fixed by the elastic member and accommodated in the housing in a movable state. Thereby, the optical path of the laser beam can be corrected by the optical correction element by incorporating the holder for holding the optical element into the housing and then moving the holder. Therefore, even if the mounting error of the optical element is an arbitrary value, the laser beam emitted from the optical element can be irradiated to a predetermined portion of the light receiving element by a simple operation of moving the holder.

It is a figure which shows the optical system integrated in the optical pick-up apparatus of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the optical pick-up apparatus of this invention, (A) is sectional drawing which shows the laser apparatus contained in an optical pick-up apparatus, (B) is sectional drawing which shows the structure where each light emitting element is mounted. It is a figure which shows the optical pick-up apparatus of this invention, and is a figure which shows the optical path of each laser beam. It is a figure which shows the structure of the optical pick-up apparatus of this invention, (A) is a perspective view, (B) is a perspective view which shows the location where a holder is accommodated, (C) is sectional drawing which shows a holder. is there. 3 is a flowchart showing a method for manufacturing the optical pickup device of the present invention. It is a figure which shows the manufacturing method of the optical pick-up apparatus of this invention, and is a perspective view which shows the method of accommodating a holder in a housing. It is a figure which shows the manufacturing method of the optical pick-up apparatus of this invention, (A) And (B) is a figure which shows the method of adjusting the position where a DOE is moved and a laser beam is irradiated. It is a figure which shows the manufacturing method of the optical pick-up apparatus of this invention, (A), (B) and (C) are figures which show the method of adjusting the position of a spot by making DOE advance along an optical path straight. . It is a figure which shows the manufacturing method of the optical pick-up apparatus of this invention, (A), (B) and (C) are the figures which show the method of adjusting the position of a spot by making a DOE go straight and rotate along an optical path. It is.

<First Embodiment: Configuration of Optical Pickup Device>
With reference to FIG. 1, the structure of the optical system built in the optical pick-up apparatus 30 of this form is demonstrated.

  The optical pickup device 30 irradiates the disk 48 with laser light and detects laser light that is return light reflected from the information recording surface of the disk 48, thereby reading information from the disk 48 or information to the disk 48. Write. The optical pickup device 30 is mounted and used in an information recording / reproducing apparatus such as a disk reproducing apparatus.

  Specifically, the optical pickup device 30 includes a laser device 10, a diffraction grating 31, a half mirror 36, a collimating lens 34, a rising mirror 32, a quarter wavelength plate 35, an objective lens 37, A DOE 40 and a PDIC 42 are mainly provided.

  The laser device 10 has a function of emitting laser light having a predetermined frequency, and details thereof will be described later with reference to FIG.

  The diffraction grating 31 separates each laser beam emitted from the laser device 10 and passed through the optical correction element into a 0th-order diffracted light, a + 1st-order diffracted light, and a −1st-order diffracted light.

  The half mirror 36 reflects the laser light emitted from the laser device 10 and passing through the diffraction grating 31 and the like to the −X side, and transmits the laser light (returned light) reflected by the disk 48 to the + X side. The return light reflected by the disk 48 is once converted into circularly polarized light by the action of the quarter-wave plate 35 and then again converted into linearly polarized light. Therefore, the polarization direction is different from that emitted from the laser device 10. They are different and transmit in the + X direction.

  The collimating lens 34 converts the laser light reflected by the half mirror 36 into parallel light. The collimating lens 34 is provided so as to be movable in the X direction. By doing so, it is possible to correct the deterioration of the optical characteristics of the objective lens 37 based on the temperature change. Further, when the collimating lens 34 is moved, spherical aberration caused by the difference in the thickness of the cover layer covering the information recording layer of the disk 48 or the difference in the cover thickness of each information recording layer in the optical recording medium having a multilayer structure. It is corrected.

  The raising mirror 32 has a function of reflecting the laser light, which is incident on the laser light transmitted through the collimating lens 34 and travels in the −X direction, in the + Y direction.

  The quarter-wave plate 35 has an action of converting the laser light reflected by the rising mirror 32 from linearly polarized light to circularly polarized light, and conversely, returns light reflected by the disk 48 is converted from the circularly polarized light. It has a function to convert to linearly polarized light.

  The objective lens 37 is disposed immediately above the raising mirror 32 and has a function of focusing the laser beam raised in the Y direction by the raising mirror 32 onto the signal recording surface of the disk 48. In this embodiment, the objective lens 37 is shared by the first laser beam, the second laser beam, and the third laser beam that are used for recording / reproducing BD, DVD, and CD.

  The DOE 40 (Diffractive Optical Element) has a function of irradiating a predetermined portion of the PDIC 42 with laser light by inclining the traveling direction of laser light having a predetermined wavelength. In this embodiment, the DOE 40 tilts the traveling direction of the first laser beam of the BD standard at a predetermined angle, and simply transmits the second laser beam and the third laser beam of other standards (DVD standard and CD standard). The direction of travel is not inclined. Details of the DOE 40 will be described later with reference to FIG.

  The PDIC 42 is a signal detection photodiode integrated circuit element that functions as a photodetector, detects laser light of each standard (BD standard, DVD standard, and CD standard), and is used for focus servo and tracking servo. .

  Next, a read operation and a write operation of the optical pickup device 30 configured as described above will be described. The laser device 10 emits three laser lights (BD standard, DVD standard or CD standard) having different standards, and the optical paths of these laser lights are the same as described below. Furthermore, the following operations are the same for reading and writing.

  First, laser light emitted from the laser device 10 is separated into zero-order diffracted light, + 1st-order diffracted light, and −1st-order diffracted light by passing through the diffraction grating 31. This is because the PDIC 42 performs tracking servo and focus servo.

  The laser light that has passed through the diffraction grating 31 is reflected in the −X direction by the half mirror 36, then converted into parallel light by the collimating lens 34, reflected by the rising mirror 32, and thereby perpendicular to the disk 48. Progress in the direction (+ Y direction).

  Further, the laser light is converted into circularly polarized light by passing through the ¼ wavelength plate 35, and then focused on the signal recording surface of the disk 48 by the refractive action and diffraction action of the objective lens 37.

  The laser light (returned light) reflected by the signal recording surface of the disk 48 passes through the objective lens 37, the quarter wavelength plate 35, the rising mirror 32, and the collimating lens 34 and reaches the half mirror 36. Here, the return laser light is converted from circularly polarized light to linearly polarized light when passing through the quarter-wave plate 35, and passes through the half mirror 36.

  Astigmatism is given when the laser beam passes through the half mirror 36, and then reaches the PDIC 42 via the DOE 40. When the laser light passes through the DOE 40, the traveling direction of the BD standard laser light is inclined at a predetermined angle by the DOE 40, and the DVD standard and CD standard laser light passes straight through without being inclined. Thereafter, information is read out by irradiating the PDIC 42 with laser light, and focus servo and tracking servo are performed.

  The above is the description of the configuration and operation of the optical pickup device 30.

  With reference to FIG. 2, the laser apparatus 10 incorporated in the above optical pickup apparatus will be described. 2A is a cross-sectional view showing the laser device 10 incorporated in the optical pickup device 30, and FIG. 2B is a cross-sectional view showing a light emitting element built in the laser device 10. FIG.

  Here, description will be made using the X axis, the Y axis, and the Z axis that are orthogonal to each other. The Y axis is an axis parallel to the direction in which the laser light emitted from the laser device 10 travels, and the X axis is an axis parallel to the direction in which the first light emitting element 20 and the second light emitting element 22 are aligned.

  Referring to FIG. 2A, the laser device 10 is a CAN type package, and has a substantially disc-shaped substrate portion 12 and a plate-like stem fixed to the upper surface of the substrate portion 12 perpendicular to the substrate. 16, two light emitting elements (first light emitting element 20 and second light emitting element 22) mounted on the stem 16, a covering part 14 (CAN type case) covering these light emitting elements, It mainly includes a cover 15 made of a glass plate that closes an opening provided in the upper portion, and a terminal portion 18 that is electrically connected to the light emitting element and leads out to the outside.

  In FIG. 2, the board | substrate part 12 is arrange | positioned in a Z direction, and the stem 16 is extended and fixed in the shape of a tongue piece from the board | substrate to + Y direction.

  The laser apparatus 10 emits laser light having a predetermined wavelength from the first light emitting element 20 or the second light emitting element 22 by supplying a drive current from the outside via the terminal unit 18. The emitted laser light passes through the cover 15 and is emitted to the outside.

  Further, the laser device 10 emits three types of laser beams having different wavelengths, which are used for reading or writing each disk. Specifically, a first laser beam, DVD (Digital Versatile Disc) used for reading or writing a BD (Blu-ray Disc) standard or HD-DVD (High-Definition Digital Versatile Disc) standard disc (optical recording medium). ) A second laser beam used for a standard disc and a third laser beam used for a CD (Compact Disc) standard disc are emitted.

  Here, the first laser light has a blue-violet wavelength band of 400 nm to 420 nm, the second laser light has a red wavelength band of 645 nm to 675 nm, and the third laser light has an infrared wavelength band of 765 nm to 805 nm.

  Referring to FIG. 2B, the first light emitting element 20 and the second light emitting element 22 are mounted on the mounting surface of the stem 16 with a predetermined distance therebetween. These light emitting elements are adhered to the mounting surface via an adhesive after the upper surface is adsorbed and transported by a collet having an adsorption pad.

  The first light emitting element 20 is a laser diode made of a semiconductor such as zinc selenide or gallium nitride, and is fixed to the upper surface of the stem 16 via an adhesive such as a conductive paste. A first light emitting source 24 is provided on the end face of the first light emitting element 20, and the first laser light is emitted from the first light emitting source 24.

  The second light emitting element 22 is a laser diode made of a semiconductor such as GaAs or silicon, and is fixed to the upper surface of the stem 16 using a conductive adhesive as in the first light emitting element 20. Two light emitting sources (second light emitting source 26 and third light emitting source 28) are provided on the end face of the first light emitting element 20. The second laser beam is emitted from the second light source 26, and the third laser beam is emitted from the third light source 28.

  The distance L10 between the second light emission source 26 and the third light emission source 28 is 90 μm, which is a general design value, and the distance L10 is 89 μm or more and 91 μm or less when manufacturing errors (± 1 μm) are taken into consideration. Since the 1st light emission source 24 and the 2nd light emission source 26 are built in the same 1st light emitting element 20, the distance L10 of both has very high precision.

  The design value of the distance L12 between the first light emitting source 24 and the second light emitting source 26 provided in the first light emitting element 20 is 90 μm, which is the same as L10. However, this accuracy is inferior to the distance L10 due to the accuracy of the previous process (diffusion process) and includes an error of ± 10 μm because it conforms to the accuracy of the bonder used for fixing both light emitting elements. Therefore, the distance L12 is 80 μm or more and 100 μm or less.

  As described above, the distance L12 between the first light emitting source 24 and the second light emitting source 26 includes a large error as compared with L10 due to an error generated when the element is mounted. It is difficult for a single PDIC to receive the laser light emitted from the light source. In this embodiment, as described above with reference to FIG. 1, the DOE 40 is provided in the vicinity of the PDIC 42 to correct the optical path of the first laser light to solve this problem.

  With reference to FIG. 3, the matter which adjusts the optical path of a 1st laser beam by DOE40 is demonstrated. In this figure, a first light emitting element 20 and a second light emitting element 22 that emit laser light of a predetermined wavelength, a PDIC 42 that receives laser light emitted from these light emitting elements, and a DOE 40 disposed between them. Is shown.

  As described above, since the first light emitting element 20 and the second light emitting element 22 are individually mounted, their relative positions include an error of about ± 10 μm at the time of mounting. The mounting error is an error in the distance between the first light emitting source 24 provided in the first light emitting element 20 and the second light emitting source 26 and the third light emitting source 28 included in the second light emitting element 22. For this reason, it is not easy to receive the laser light emitted from these light emitting sources in the light receiving region formed in the PDIC 42 made of one semiconductor element. Furthermore, when the first laser light 25 emitted from the first light emission source 24 and the second laser light 27 emitted from the second light emission source 26 are received in common by one light receiving region 44, either It is necessary to incline the optical path of one laser beam on the way.

  In this embodiment, the DOE 40 that changes the traveling direction of laser light having a specific wavelength is disposed in the middle of the optical path of the laser light. The DOE 40 diffracts the first laser beam 25 having the shortest wavelength to incline its path, and the second laser beam 27 and the third laser having a longer wavelength than the first laser beam 25 remain unchanged without changing the traveling direction. Make it transparent. Specifically, the DOE 40 diffracts the first laser light 25 traveling in parallel with the optical axis of the optical pickup device 30, and thereby the inclination angle θ <b> 1 so that the traveling direction approaches the second laser light 27. It is inclined at. The distance between the DOE 40 and the PDIC 42 is inevitably determined by the distance L12 between the first light source 24 and the second light source 26 and the angle at which the DOE 40 tilts the first laser light 25. However, as described above, the distance L12 varies within a range of ± 10 μm due to the mounting error of the light emitting element. In order to absorb this variation, in this embodiment, the position of the DOE 40 is changed after being incorporated in the housing. This matter will be described later with reference to FIG.

  The PDIC 42 includes two light receiving areas (light receiving areas 43 and 44). The light receiving region 43 is a region that receives the third laser light of the CD standard, and the light receiving region 44 is a region that receives the first laser light and the second laser light of the BD standard and the DVD standard. The PDIC 42 receives each laser beam and performs signal detection, and performs focus servo and tracking servo.

  The servo performed using the PDIC 42 includes a focus servo for focusing in the direction perpendicular to the recording surface of the disk and a tracking servo for positioning in the radial direction following the recording track of the disk. As a focus servo, an astigmatism method or a differential astigmatism method can be employed. As the tracking servo, a push-pull method, a differential push-pull method, an inline DPP, a DPP method, or a three-beam method can be employed.

  With reference to FIG. 4, a structure in which the above-described DOE is provided in the housing will be described. 4A is a perspective view showing a holder 64 provided with a DOE, FIG. 4B is a perspective view showing an optical pickup device 30, and FIG. 4C is a cross section showing a portion provided with the DOE. FIG.

  With reference to FIG. 4A, the DOE 40 described above is held by a holder 64. Accordingly, the position of the DOE 40 can be adjusted by moving the holder 64 within the housing.

  The holder 64 is made of a resin material integrally molded by injection molding, and has an upper surface portion 64F on which various grooves are formed, and a side wall portion 64G provided at an end portion on the + Y side of the upper surface portion 64F. ing. Although not shown, a side wall portion is also provided at an end portion on the −Y side of the upper surface portion 64F.

  The DOE 40 is fixed to the opening of the side wall 64G. As a method for fixing the DOE 40, press-fitting, adhesion, or a combination thereof is employed. Specifically, an opening having a size equivalent to that of the DOE 40 is provided in the vicinity of the center of the side wall 64G, and the DOE 40 is fitted and fixed in the opening. Similarly, an opening is also provided in the side wall provided at the end portion on the −Y side of the upper surface portion 64F, and the laser beam passes through this opening under use conditions.

  Both side portions of the lower portion of the side wall portion 64G form a contact surface 64A having a curved surface slightly convex toward the outside, with the width narrowing downward from both sides. Thereby, as will be described later, the holder 64 can be accommodated in the housing in a state in which the holder 64 can be rotated. A similar contact surface is also provided on a side wall portion (not shown) provided at the end of the holder 64 on the −Y side, and this shape is formed regardless of where it is cut from the contact surface 64A to the side wall portion. The cross section is like a kamaboko with this shape.

  The upper surface portion 64F is provided with a plurality of bonding or moving grooves. Specifically, an adhesive groove 64C is provided at an end on the + X side of the upper surface portion 64F, and an adhesive groove 64B is provided at an end on the −X side. These adhesive grooves 64 </ b> B and 64 </ b> C are portions to which an adhesive for fixing the holder 64 to the housing 50 is applied. The adjustment groove 64D is a groove for an adjustment means such as an eccentric pin to contact when the holder 64 is rotationally adjusted around the Y axis. Furthermore, the adjustment groove 64E is a part for the adjustment means to contact when the position of the holder 64 is moved in the optical path direction (Y direction).

  Here, the contact surface 64A described above has a shape that is a part of the same cylindrical surface. Accordingly, referring to FIG. 4B, it becomes easy to rotate holder 64 while an inclined surface 60A of housing 50 described later and a contact surface 64A of holder 64 are in contact with each other. The contact portion 64H described above also has a shape that is a part of the cylindrical surface. Thereby, referring to FIG. 4B, it becomes easy to rotate the holder 64 while bringing a later-described spring plate 62 into contact with the contact portion 64H. Further, the contact surface 64A and the contact portion 64H may have a shape that is a part of the same cylindrical surface, or a shape that is a part of a concentric cylindrical shape having different radii. Thereby, the rotation of the holder 64 is further facilitated.

  4B, the housing 50 includes a plate-like bottom surface portion 52 and a side wall portion 54 extending in the thickness direction from the bottom surface portion 52, and an optical element constituting the optical pickup device is a space surrounded by the side wall portion 54. It is stored in. Here, the holder 64 holding the DOE 40 is stored in a storage area 60 surrounded by the side wall, and the upper surface of the holder 64 is pressed by the spring plate 62.

  The spring plate 62 presses a contact portion 64H (see FIG. 4A), which is curved so as to be convex upward, on the upper surface portion 64F of the holder 64 from below. Further, in the manufacturing process, the holder 64 is pressed against the housing 50 by the spring plate 62 and temporarily secured, and then the position of the holder 64 is adjusted. Therefore, the shape of the spring plate 62 will be described with reference to FIG. Each groove is not covered. Further, when looking at the optical pickup device as a product, an adhesive is applied between the adhesive grooves 64B and 64C described with reference to FIG. 4A and the side wall of the housing 50. The DOE 40 to be held is positioned with respect to the housing 50.

  Referring to FIG. 4C, the storage area 60 of the housing 50 is provided with an inclined surface 60 </ b> A that is inclined so that the width increases upward from the dotted line of the center line. When the holder 64 is stored in the storage area 60, the contact surface 64 </ b> A of the holder 64 comes into contact with the inclined surface 60 </ b> A of the storage area 60. In this state, when the spring plate 62 is fixed to the housing 50, the lower surface of the spring plate 62 comes into contact with the contact portion 64H of the holder 64, whereby the contact surface 64A of the holder 64 is moved into the storage area by the elastic force of the spring plate 62. It is pressed against 60 inclined surfaces 60A.

  Thus, the contact portion 64H of the holder that contacts the spring plate 62 is a curved surface, and the contact surface 64A that contacts the inclined surface 60A of the holder is also a curved surface. Therefore, even when the holder 64 is temporarily held by the spring plate 62, the holder 64 can rotate around the Y axis and can also rotate in the Y direction.

  Further, a contact surface 64A is also provided on the side wall portion disposed at the end of the holder 64 shown in FIG. 4A on the −Y side, and the inclined surface 60A in contact with the contact surface 64A is a storage region 60 of the housing 50. Is provided.

Second Embodiment: Manufacturing Method of Optical Pickup Device
A method of manufacturing the optical pickup device whose configuration has been described in the first embodiment will be described.

  Referring to the flowchart of FIG. 5, in the method of manufacturing the optical pickup device of this embodiment, step S11 for incorporating various optical elements including DOE 40 into the housing, step S12 for positioning the laser device and the PDIC, and the DOE are fitted. Step S13 for adjusting the position of the holder, and Step S14 for bonding the holder to the housing are mainly provided.

  In step S11, first, various optical elements constituting the optical pickup device are assembled in the housing. Specifically, the optical elements (laser device 10, diffraction grating 31, half mirror 36, collimator lens 34, rising mirror 32, quarter wavelength plate 35, objective lens 37, DOE 40 and PDIC 42) shown in FIG. Install in the housing. Here, the optical element such as the laser device 10 is fixed to the housing using an adhesive, while the DOE 40 is fitted in the holder and is provided in the housing in a position adjustable state.

  Referring to FIG. 6, in this step, holder 64 having DOE 40 is housed in housing 50 in a position adjustable state. Specifically, the DOE 40 is prepared by being held by a holder 64, and the holder 64 is stored in the storage area 60 of the housing 50. Further, the spring plate 62 is fixed to the housing 50 by using a screw 46 so as to cover the holder 64. As a result, the holder 64 is temporarily held in a state where it can move to the storage area 60 by the elastic force of the spring plate 62. The configuration in which the holder 64 is stored in the storage area 60 is as described above with reference to FIG.

  In step S12, positioning is performed so that laser light emitted from the laser device is irradiated to a predetermined position of the PDIC. Specifically, referring to FIG. 3, the second laser light 27 emitted from the second light emitting source 26 of the second light emitting element 22 is irradiated to the light receiving region 44 of the PDIC 42, and from the third light emitting source 28. The position of the PDIC 42 is adjusted so that the emitted third laser light 29 is irradiated to the light receiving region 43 of the PDIC 42. The positional accuracy of the second light emitting source 26 and the third light emitting source 28 provided in the same element is very high, about ± 1 μm, and the positional accuracy of the light receiving regions 43 and 44 formed in the same PDIC 42 is also high. Therefore, it is possible to adjust this process by adjusting the position of the PDIC 42. After the position adjustment is completed, the PDIC 42 is fixed to the housing using an adhesive. In this step, the second laser beam 27 and the third laser beam pass through the DOE 40, but the DOE 40 does not affect the traveling direction of these laser beams.

  In step S13, the position of the holder that holds the DOE is adjusted, and a predetermined light receiving region of the PDIC is irradiated with a BD-standard first laser beam.

  First, the initial position of the DOE 40 will be described with reference to FIG. The position where the DOE 40 is to be disposed is determined by the relative positional relationship between the first light emitting element 20, the second light emitting element 22, and the PDIC 42. In this figure, the position of the DOE 40 calculated from the positional relationship between these elements is indicated by a dotted line. If the DOE 40 is temporarily installed at this location, the mounting error between the light emitting elements occurs with a width of ± 10 μm. Therefore, there is an error between when the mounting error occurs on the plus side and when it occurs on the minus side. When adjusting, the direction which should move DOE40 will differ. If it becomes like this, there exists a possibility that a manufacturing process may become complicated.

  Therefore, in this embodiment, in order to make the direction in which the position of the DOE 40 is adjusted in this step constant, the DOE 40 is offset in advance toward the PDIC 42 side. Accordingly, referring to FIG. 7B, the mounting error between the first light emitting element 20 and the second light emitting element is a positive value or a negative value. By moving the DOE 40, the mounting error can be absorbed and the light receiving region 44 can be irradiated with the first laser beam 25. In FIG. 7B, the direction in which the DOE 40 is moved to absorb mounting errors is indicated by arrows.

  With reference to FIG. 8 and FIG. 9, the matter which positions-adjusts the holder 64 holding DOE40 is demonstrated. FIG. 8 shows a case where the position is adjusted by moving the holder 64 straight in only the Y direction, and FIG. 9 shows a case where the position is adjusted by moving the holder 64 in both the rotational direction and the straight direction.

  With reference to FIG. 8, the matter which adjusts the spot of a 1st laser beam to a predetermined position by moving the holder 64 only to a rectilinear direction is demonstrated. 8A shows a light receiving region formed in the PDIC, FIG. 8B is a sectional view showing a holder 64 for holding the DOE 40, and FIG. 8C is a perspective view showing the holder 64 extracted. is there.

  Referring to FIG. 8A, here, the first laser light is received by the three light receiving regions (44A, 44B, 44C), and the second laser light is received only by the light receiving region 44A, and the third laser light is received. Is received by the light receiving region 43. Since the first laser beam employs an operating push-pull method (DPP) as a servo system, three light receiving regions (44A, 44B, 44C) are used.

  On the other hand, in the second laser beam and the third laser beam, a phase difference method using one light receiving region is adopted as a servo system. Therefore, the servo is performed using only the light receiving area 44A for the second laser light, and the servo is performed using only the light receiving area 43 for the third laser light. Here, the servo system employed is not limited to that described above, and a servo system using one light receiving area may be employed as the servo system of the first laser light, or the second laser light and the third laser light may be employed. A servo system using three light receiving areas may be employed.

  Further, referring to FIG. 8A, when the first laser light is emitted from the laser device to the PDIC, before the position adjustment of the DOE 40, the spot 66A of the first laser light above the light receiving area 44A on the paper surface. Is formed. As described above, the reason why the spot 66A deviates from the light receiving area 44A is that the position of the PDIC is adjusted so that the spot of the second laser light is irradiated onto the light receiving area 44A. Further, refer to FIG. This is because the second light emitting source 26 that emits the second laser light and the first light emitting source 24 that emits the first laser light are separated from each other. Another reason for this is that mounting errors between the first light emitting element 20 and the second light emitting element 22 occur.

  Furthermore, the spot 66A before the position adjustment is disposed above the light receiving area 44A on the paper surface. The reason for this is that the DOE 40 is set in advance as described above with reference to FIG. This is because they are offset in the direction.

  As shown in FIG. 8B, the holder 64 that holds the DOE 40 is housed in the housing area 60 of the housing 50, and the upper surface of the holder 64 is pressed downward by the spring plate 62. The curved contact surface 64A is in contact with the inclined surface 60A of the housing 50. Thereby, the holder 64 is stored in the storage area 60 in a movable state.

  Referring to FIG. 8C, in this step, the spot 66A is moved to a predetermined location in the light receiving region 44A by moving the holder 64 holding the DOE 40 in the + Y direction. The position of the holder 64 is adjusted by moving the holder 64 in the + Y direction by pressing an adjustment groove 64E provided on the upper surface of the holder with an adjusting means such as an eccentric pin until the output from the light receiving region 44A reaches a predetermined value. Is done.

  With the above adjustment, referring to FIG. 8A, the first laser beam forms a spot 66 at a predetermined location in the light receiving region 44A. At the same time, the diffracted light of the first laser beam also forms a spot in a predetermined region of the light receiving regions 44B and 44C.

  After the above-described position adjustment of the holder 64 is completed, the position of the holder 64 in the storage region 60 is fixed by applying an adhesive to the bonding grooves 64B and 64C shown in FIG. Step S14).

  With reference to FIG. 9, a method for adjusting the spot of the first laser beam by moving the holder 64 in both the rotational direction and the straight direction will be described. 9A is a view showing the positions of the respective light receiving regions and spots, FIG. 9B is a cross-sectional view showing the holder 64, and FIG. 9C is a cross-sectional view showing the holder 64.

  With reference to FIG. 9A, the first laser beam forms a spot 66A or a spot 66C in a stage before adjustment of this process. On the paper surface, the spot 66A or 66C is shifted in the upward direction and the left-right direction with respect to the light receiving region 44A. Therefore, in order for the first laser beam to form the spot 66 in the light receiving region 44A, as shown by the arrow in FIG. 9C, the holder 64 holding the DOE 40 is moved in the + Y direction and the Y axis is the center. It is necessary to rotate the holder 64.

  As illustrated in FIG. 9B, the holder 64 is pressed downward by the elastic force of the spring plate 62, so that the curved contact surface 64 </ b> A provided at the lower portion of the holder 64 is in the storage area 60 of the housing 50. It is in contact with the provided inclined surface 60A. Further, the upper end portion of the holder 64 pressed by the spring plate 62 is a curved contact portion 64H. Therefore, the holder 64 can rotate around the Y axis inside the storage area 60 and can also move in the Y direction.

  In the adjustment method of this step, first, the holder 64 is rotated around the Y axis, and the first laser beam forms a spot 66B on the paper surface of FIG. 9A immediately above the light receiving region 44A. To. Specifically, the eccentric pin is brought into contact with the adjustment groove 64D shown in FIG. 9C, and the holder 64 is rotated about the Y axis. As described above, since the holder 64 is disposed in the storage area 60 in a rotatable state, the holder 64 easily rotates inside the storage area 60. Here, with reference to FIG. 9A, the direction in which the holder 64 is rotated for adjustment in the case where the first laser light before adjustment is irradiated to the spot 66A and the case where the spot 66C is irradiated. Is the opposite.

  Next, referring to FIG. 9A, the holder 64 is moved straight in the + Y direction to move the spot 66B of the first laser light to the spot 66 near the center of the light receiving region 44A. Specifically, referring to FIG. 9C, the holder 64 is moved in the + Y direction by pressing the adjustment groove 64E in the + Y direction with an eccentric pin or the like.

  Through the above process, the first laser beam appropriately forms the spot 66 in the light receiving region 44A. In addition, the diffracted light of the first laser light is also irradiated to predetermined portions of the light receiving regions 44B and 44C by the above adjustment. Here, in the above description, the holder 64 is rotationally adjusted around the Y axis and then moved straight in the + Y direction. However, the same effect can be obtained even if this order is reversed.

  After the above process is completed, the position of the holder 64 is fixed inside the storage region 60 by applying an adhesive to the adhesive grooves 64B and 64C and curing the adhesive.

  Through the above steps, the optical pickup device of this embodiment is manufactured.

DESCRIPTION OF SYMBOLS 10 Laser apparatus 12 Board | substrate part 14 Covering part 15 Cover 16 Stem 18 Terminal part 20 1st light emitting element 22 2nd light emitting element 24 1st light emission source 25 1st laser light 26 2nd light emission source 27 2nd laser light 28 3rd light emission Source 29 Third laser beam 30 Optical pickup device 31 Diffraction grating 32 Rising mirror 34 Collimator lens 35 1/4 wavelength plate 36 Half mirror 37 Objective lens 40 DOE
42 PDIC
43 Light receiving area 44, 44A, 44B, 44C Light receiving area 46 Screw 48 Disk 50 Housing 52 Bottom face 54 Side wall 60 Storage area 60A Inclined surface 62 Spring plate 64 Holder 64A Contact surface 64B Adhesive groove 64C Adhesive groove 64D Adjustment groove 64E Adjustment groove 64F Upper surface part 64G Side wall part 64H Contact part 66, 66A, 66B, 66C Spot

Claims (9)

A housing;
A first light emitting element that emits a first laser light from a first light emitting source, and a second laser light and a third laser light having different wavelengths from the first laser light are emitted from the second light emitting source and the third light emitting source. A laser device having a second light emitting element;
A light receiving element having a first light receiving region for receiving the first laser light and the second laser light, and a second light receiving region for receiving the third laser light;
An optical correction element that is disposed between the laser device and the light receiving element and inclines the traveling direction of the first laser light so that the first laser light is irradiated onto the first light receiving region of the light receiving element. When,
A holder for holding the optical correction element,
The holder is housed in the housing in a movable state by being pressed by an elastic member. The holder facing the housing is provided with a contact surface having a shape that narrows toward the housing,
The housing in which the contact surface of the holder is housed is provided with an inclined surface having a shape that widens toward the holder,
The optical pickup device according to claim 1, wherein the contact surface of the holder is in contact with the inclined surface of the housing by a pressing force of the elastic member.   3. The optical pickup device according to claim 1, wherein the holder pressed by the elastic member is movable in a direction along an optical path of the laser beam.   The optical pickup device according to any one of claims 1 to 3, wherein the holder pressed by the elastic member is rotatable around an optical path of the laser beam.   The optical pickup device according to claim 1, wherein a groove is provided on a surface of the holder that is not covered with the elastic member.   The optical pickup device according to claim 1, wherein the elastic member is a spring plate fixed to the housing. The first light emitting element that emits the first laser light from the first light emitting source, and the second laser light and the third laser light having different wavelengths from the first laser light are emitted from the second light emitting source and the third light emitting source. A laser device having a second light emitting element; a light receiving element having a first light receiving region for receiving the first laser light and the second laser light; and a second light receiving region for receiving the third laser light. Storing in the housing;
The relative relationship between the laser device and the light receiving element is such that the second laser beam is irradiated onto a predetermined region of the first light receiving region, and the third laser beam is irradiated onto a predetermined region of the second light receiving region. Adjusting the correct position,
Adjusting the position of the optical correction element for inclining the traveling direction of the first laser beam so that the first laser beam is irradiated onto a predetermined region of the first light receiving region,
In the step of adjusting the position of the optical correction element, a holder for holding the optical correction element is disposed in the middle of the optical path, and the holder housed in the housing is moved by the pressing force of an elastic member, thereby A method of manufacturing an optical pickup device, comprising: irradiating a predetermined portion of the first light receiving region with one laser beam.   8. The optical pickup device according to claim 7, wherein the holder is moved along an optical path of the first laser light to irradiate the first laser light to a predetermined portion of the first light receiving region. Production method. 9. The method of manufacturing an optical pickup device according to claim 7, wherein the first laser beam is irradiated to a predetermined portion of the first light receiving region by rotating the holder. 10.

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