JP2013187728A - Solid state image sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve high sensitivity and a high dynamic range in a solid imaging element equipped with a pixel part in which pixels having different characteristics are mixed.SOLUTION: A lamp wave generation circuit outputs a signal in which electric potential changes in the order of a waveform Ref, a waveform Signal, and a waveform Ref, whenever a horizontal synchronization signal is outputted, as a lamp signal RAMP. In accordance with generation timing of the former two waveforms (the waveform Ref and then the waveform Signal), a row decoder outputs a pixel control signal to a first pixel, and a column ADC reads signals from the first pixel in the order of a noise component signal and a noise/signal component signal to perform AD conversion. Then, in accordance with the generation timing of the latter two waveforms (the waveform Signal and then the waveform Ref), the row decoder outputs the pixel control signal to a second pixel, and the column ADC reads the signals from the second pixel in the order of the noise/signal component signal and the noise component signal to perform AD conversion.

Description

  The present invention relates to a solid-state imaging device including a pixel portion in which two types of pixels having different characteristics are mixed.

  2. Description of the Related Art In recent years, solid-state imaging devices that have various effects by dividing a pixel portion into a plurality of regions or mixing pixels with different characteristics are known. In Patent Document 1, the pixel array section is divided into a first pixel group and a second pixel group, linear image signals are read from the first pixel group at a low frame rate, and a high frame is read from the second pixel group. A solid-state imaging device that reads an image signal having linear log characteristics at a rate is disclosed.

  Japanese Patent Laid-Open No. 2004-228688 aims to suppress the generation of false signals and saturation unevenness, and has a large size and high sensitivity first light receiving element and a small size and low sensitivity second light receiving element in a honeycomb shape. A CCD solid-state imaging device is disclosed which is arranged, adjusts the saturation level of the first light receiving element, and combines with the second light receiving element.

  Patent Document 3 discloses an imaging device that can obtain a non-uniform logarithmic characteristic output by driving a light receiving element constituting a pixel circuit in a zero bias mode (solar cell mode).

  Non-Patent Document 1 describes a solid-state imaging device that includes a single-slope AD converter and switches the voltage amplitude of the ramp waveform for each CF of the pixel.

JP 2009-272820 A JP 2000-125209 A EP 1354360 Tadashi Sugiki, 5 others, "CMOS image sensor with column AD converter without inter-column FPN", The Institute of Image Information and Television Engineers, June 23, 2000, Vol. 24, No. 37, p79-84

  However, in Patent Document 1, since the light receiving element of each pixel is driven in the reverse bias mode, which is a driving method generally used in a solid-state imaging device, in the second pixel group, variation in log characteristics occurs. There is a problem. Patent Document 2 relates to a CCD and does not have a photoelectric conversion characteristic of a linear log characteristic.

  Patent Document 3 has a problem that although a dynamic range can be ensured, an image signal with high sensitivity to the amount of incident light cannot be output.

  An object of the present invention is to provide a solid-state imaging device that includes a pixel portion in which pixels having different characteristics are mixed, realizes high sensitivity and high dynamic range, and has little variation.

  The solid-state imaging device according to the present invention includes a first pixel that outputs a signal potential indicating a noise component and a signal component after outputting a reference potential indicating a noise component, and a first pixel that outputs the reference potential after outputting the signal potential. A pixel unit in which two pixels are arranged in a matrix and provided for each column of the pixel unit, the reference potential is analog / digital converted using a first reference waveform, and the signal is output using a second reference waveform An AD converter for analog / digital conversion of a potential; a reference signal generator for generating and outputting a reference signal combining the first reference waveform and the second reference waveform; and the first reference waveform in the reference signal The reference potential and the signal potential are output to the first pixel during a period in which the second reference waveform comes later, and the first reference waveform after the second reference waveform in the reference signal Comprising a timing controller for outputting the signal potential and the reference potential with respect to the second pixel to come period, the.

  The reference signal generation unit generates and outputs one reference signal that is a combination of the first reference waveform used when AD converting the reference potential and the second reference waveform used when AD converting the signal potential. Therefore, even in a pixel unit in which pixels having different characteristics are mixed, such as a first pixel that outputs a signal potential after a reference potential and a second pixel that outputs a reference potential after the signal potential, the timing control unit Appropriate AD conversion can be performed by controlling the output timing of the reference potential and the signal potential of the pixel in accordance with the appearance of the first reference waveform and the second reference waveform of the reference signal.

  In addition, it is possible to prevent an increase in power consumption and chip area as compared to the case where a plurality of reference signals corresponding to the characteristics of each pixel are generated.

  Further, in the above configuration, the reference signal generation unit performs the first reference waveform, the second reference waveform, and the first reference waveform every time a vertical scanning circuit that sequentially selects each row of the pixel unit scans one row. It is preferable to generate and output a reference signal configured in this order. Alternatively, the reference signal generation unit is configured in the order of the second reference waveform, the first reference waveform, and the second reference waveform every time a vertical scanning circuit that sequentially selects each row of the pixel unit scans one row. The generated reference signal is preferably generated and output.

  According to these configurations, appropriate AD conversion can be performed even in a pixel portion in which pixels having different characteristics are mixed.

  In the above structure, it is preferable that the first pixel has a buried photodiode and the second pixel has a surface photodiode.

  According to this configuration, a pixel signal that is less affected by dark current is obtained from the first pixel that is an embedded photodiode, and a high-sensitivity pixel that has a high S / N ratio from the second pixel that is a surface photodiode. A signal can be obtained.

  In the above structure, it is preferable that the first pixel and the second pixel include embedded photodiodes.

  According to this configuration, a high-quality image signal with little influence of dark current can be obtained from the pixel portion.

  In the above configuration, it is preferable that the AD conversion unit is a single slope type, and the reference signal generation unit generates the reference signal using the first reference waveform and the second reference waveform as a ramp waveform.

  According to this configuration, since the AD conversion unit is of a single slope type, the circuit can be simplified and AD conversion that is not easily affected by noise can be performed.

  In the above configuration, it is preferable that the first pixel has a linear characteristic and the second pixel has a log characteristic.

  According to this configuration, a pixel signal having a highly sensitive linear characteristic can be obtained from the first pixel having the linear characteristic, and a pixel signal having little variation can be obtained from the second pixel having the log characteristic.

  According to the present invention, even in a pixel portion in which pixels having different characteristics are mixed, such as a first pixel that outputs a signal potential after a reference potential and a second pixel that outputs a reference potential after the signal potential, A timing control unit that generates and outputs a single reference signal that is a combination of a first reference waveform used when the signal potential is AD converted to the reference potential and a second reference waveform used when the signal potential is AD converted. However, by controlling the output timing of the reference potential and the signal potential of each pixel in accordance with the appearance of the first reference waveform and the second reference waveform of the reference signal, appropriate AD conversion can be performed.

The block diagram which shows the structure of a solid-state imaging device and an external device. The block diagram which shows the structure of a solid-state image sensor. The circuit diagram of the pixel circuit of the 1st pixel. The graph which showed the photoelectric conversion characteristic of the 1st pixel. The timing chart of the 1st pixel. The circuit diagram of the pixel circuit of the 2nd pixel. The graph which showed the photoelectric conversion characteristic of the 2nd pixel. The timing chart of the 2nd pixel. The figure which showed an example of arrangement | positioning of the 1st pixel and 2nd pixel in a pixel array part. The figure which showed the timing chart of a 1st pixel, a 2nd pixel, and the waveform of a ramp signal. The figure which showed the waveform of the horizontal synchronizing signal and the ramp signal.

  FIG. 1 is a block diagram showing an overall configuration of a solid-state imaging device 1 according to an embodiment of the present invention. The solid-state imaging device 1 includes an imaging element 110 and an image processing unit 120. The image sensor 110 and the image processing unit 120 may be configured in one IC chip or may be configured as separate IC chips.

  The image processing unit 120 includes an image signal processing unit 121 and an image sensor control unit 122. The image sensor control unit 122 outputs SYSCLK and the register control signal to the image sensor 110 to control the image sensor 110. SYSCLK is a clock signal having a predetermined frequency (for example, 54 MHz) generated by an oscillation circuit (not shown), for example. The register control signal is a signal for writing data to various registers included in the timing control unit 22 shown in FIG.

  The image sensor 110 outputs an image signal to the image signal processing unit 121. The image signal processing unit 121 performs various image processing on the image signal and outputs the image signal as an image output signal to an external device. Here, the external device corresponds to a display device such as a liquid crystal panel or an organic EL panel, a memory for holding an image output signal, or the like.

  FIG. 2 is a block diagram showing a detailed configuration of the image sensor 110 shown in FIG. The image sensor 110 includes a pixel array unit 21 (pixel unit), a timing control unit 22, a row decoder 23, a column ADC array unit 24, a column decoder 25, a sense amplifier 26, an LVDS serializer 27, an output terminal 28, and a ramp generation circuit 29. (Reference signal generator) and input terminals 210 and 211 are provided.

  The pixel array unit 21 includes a plurality of pixels arranged in a matrix with M (integer of 2 or more) rows × N (integer of 2 or more) columns, and includes first and second pixels having different characteristics. Are mixed. The first pixel is a pixel having a complete transfer type photodiode (PD) and having linear characteristics. The second pixel has a surface type PD and has a log characteristic. The second pixel is driven in the solar cell mode. Each pixel will be described in detail later.

  The timing control unit 22 includes a PLL, a timing generator (TG), and a register, and controls the row decoder 23, the column ADC array unit 24, the column decoder 25, the sense amplifier 26, the LVDS serializer 27, and the ramp wave generation circuit 29. The PLL multiplies (for example, doubles) SYSCLK as necessary and supplies it to the TG. The TG generates timing signals such as a horizontal synchronization signal and a vertical synchronization signal according to the signal supplied from the PLL, and generates a row decoder 23, a column ADC array unit 24, a column decoder 25, a sense amplifier 26, an LVDS serializer 27, and a ramp wave. The circuit 29 is supplied to synchronize these operations.

  The register holds data for defining the waveforms of various pixel control signals output from the row decoder 23 to each pixel, for example. Here, data held by the register is written by a register control signal output from the image sensor control unit 122.

  The row decoder 23 includes, for example, a vertical scanning circuit and a driver circuit. The vertical scanning circuit is configured by, for example, a shift register, and cyclically selects each row of the pixel array unit 21 using a vertical synchronization signal output from the TG of the timing control unit 22 as a trigger, and vertically scans the pixel array unit 21. To do. The driver circuit generates a pixel control signal according to the data written in the register of the timing control unit 22, and supplies the pixel control signal to drive each pixel. The timing controller 22 and the row decoder 23 function as a timing controller in the present invention.

  The column ADC array unit 24 includes N column ADCs 212 (AD conversion units) corresponding to the respective columns of the pixel array unit 21. The column ADC 212 is connected to the pixels of each column via the vertical signal line L_1 corresponding to each column of the pixel array unit 21, and reads the pixel signal from the pixels of the row selected by the vertical scanning circuit.

  Each pixel of the pixel array unit 21 outputs a pixel signal composed of only a noise component and a pixel signal obtained by adding a signal component to the noise component in one horizontal period. Here, a pixel signal including only a noise component is described as a noise component signal, and a pixel signal obtained by adding a signal component to the noise component is described as a noise / signal component signal.

  When an analog pixel signal is input from a pixel, the column ADC 212 performs AD conversion by counting the time until the level of the ramp signal output from the ramp wave generation circuit 29 exceeds the level of the pixel signal. It is a slope type AD converter.

  The column decoder 25 is composed of, for example, a shift register, and cyclically selects the column ADC 212 of each column in one horizontal scanning period by outputting a column selection signal synchronized with the horizontal synchronization signal. As a result, the column ADC array unit 24 is horizontally scanned and sequentially outputs digital image signals held by the column ADC 212 of each column to the sense amplifier 26.

  The sense amplifier 26 amplifies the digital image signal output from the column ADC array unit 24 via the horizontal signal line L_2 and outputs the amplified signal to the LVDS serializer 27.

  The LVDS serializer 27 is a serializer conforming to the LVDS (Low Voltage differential signaling) standard, and differentially amplifies a signal output in parallel via the horizontal signal line L_2 from the sense amplifier 26 to obtain a predetermined bit signal. And output to the output terminal 28.

  The output terminal 28 outputs the image signal from the LVDS serializer 27 to the image signal processing unit 121.

  The ramp wave generation circuit 29 generates a ramp signal that changes linearly with a certain slope and outputs the ramp signal to the column ADC 212. This ramp signal will be described in detail later.

  The input terminal 210 receives SYSCLK supplied from the image sensor control unit 122 and outputs it to the timing control unit 22. The input terminal 211 receives a register control signal supplied from the image sensor control unit 122 and outputs the register control signal to the timing control unit 22.

  FIG. 3 is a circuit diagram of a pixel circuit of the first pixel. The pixel circuit shown in FIG. 3 includes a light receiving element (hereinafter referred to as “PD”), a transfer transistor TX (hereinafter referred to as “TX”), a reset transistor RST (hereinafter referred to as “RST”), and amplification. A transistor SF (hereinafter referred to as “SF”), a row selection transistor SEL (hereinafter referred to as “SEL”), and a floating diffusion layer FD (hereinafter referred to as “FD”; FD: Floating Diffusion). Yes.

  The PD is composed of a buried type (complete transfer type) photodiode, and a drive voltage PVSS (hereinafter referred to as “PVSS”) is applied to the anode, and a drive voltage PVDD (hereinafter referred to as “PVDD”) is applied to the cathode. Is done.

  The TX is configured by, for example, an nMOS (negative channel metal oxide semiconductor), and transfers signal charges accumulated by the PD to the FD. A transfer control signal φTX1 (an example of a pixel control signal, hereinafter referred to as “φTX1”) for turning on / off TX is input to the gate of TX. The drain of TX is connected to RST via FD. When φTX1 becomes low level (hereinafter referred to as “Lo”), the TX gate closes and TX turns off. When φTX1 becomes high level (hereinafter referred to as “Hi”), the TX gate opens. TX turns on. Note that φTX1 is output from the row decoder 23.

  The FD accumulates signal charges transferred from the PD. As a result, a voltage corresponding to the signal charge appears in the FD.

  The RST is composed of, for example, an nMOS, resets the FD, and discharges signal charges accumulated in the FD to the outside of the FD. A reset signal φRST1 (an example of a pixel control signal, hereinafter referred to as “φRST1”) for turning on / off RST is input to the gate of RST, PVDD is input to the drain, and the source is connected via FD It is connected to the SF gate. The RST is turned on to reset the FD when φRST1 = Hi, and turned off when φRST1 = Lo.

  PVDD and PVSS are output from a voltage source (not shown), and φRST1 is output from the row decoder 23.

  SF is composed of, for example, an nMOS, the gate is connected to TX and RST via FD, PVDD is input to the drain, and the source is connected to SEL. The SF amplifies the voltage appearing on the FD and outputs it to the SEL.

  The SEL is composed of, for example, an nMOS, and a gate receives a row selection signal φVSEN1 (an example of a pixel control signal, hereinafter referred to as “φVSEN1”), a drain connected to SF, and a source via a vertical signal line L_1. Are connected to the column ADC 212 of the corresponding row. The SEL outputs the voltage amplified by the SF as an image signal to the column ADC 212 in the corresponding column via the vertical signal line L_1. Here, φVSEN 1 is output from the row decoder 23.

  FIG. 4 is a graph showing an example of the photoelectric conversion characteristics of the first pixel. The vertical axis (linear axis) indicates the signal component signal, and the horizontal axis (logarithmic axis) indicates the incident light intensity. As shown in FIG. 4, it can be seen that the first pixel has a linear photoelectric conversion characteristic in which the signal component signal increases linearly as the incident light intensity increases. Further, it can be seen that the signal component signal is saturated when the predetermined incident light intensity is exceeded. Since the horizontal axis of the graph shown in FIG. 4 is a logarithmic axis, a curve as shown in FIG. 4 becomes a linear output with respect to the incident light intensity. Therefore, it can be seen that the linear characteristic has a characteristic that the dynamic range is small but the sensitivity is high.

  In the conventional solid-state imaging device, in the first pixel shown in FIG. 3, the first pixel is exposed with an intermediate voltage having an intermediate level between Hi and Lo applied to the TX gate, thereby realizing linear log characteristics. It was. When an intermediate voltage is applied to the TX gate and the TX gate is in a half-open state, the signal charge accumulated in the PD cannot exceed the TX energy barrier until it exceeds a certain amount, and is accumulated with linear characteristics. Is done.

  On the other hand, if the signal charge accumulated in the PD exceeds a certain amount, a part of the signal charge leaks over the TX energy barrier and leaks to the TX side. Therefore, the PD accumulates while leaking the signal charge, and has log characteristics. Accumulate signal charge. As a result, the first pixel has a linear log characteristic in which the low luminance has a linear characteristic and the high luminance side has a log characteristic.

  FIG. 5 is a timing chart of the first pixel. Time t0 is during the exposure period. Since φRST = Hi, FD is always reset to PVDD.

  When φRST1 becomes Lo, the voltage of the FD decreases from the reset level V_PVDD to the noise level V_n. This is because signal charges are generated in the FD due to the influence of the parasitic capacitance between the FD and RST, the ktc noise of the FD, and the like due to the change of φRST1 from Hi to Lo. Since such parasitic capacitance between FD and RST and ktc noise vary from pixel to pixel, the noise level V_n varies from pixel to pixel. The reset level V_PVDD indicates the level of PVDD.

  At time t1, φVSEN1 = Hi, and the voltage of the noise level V_n generated in the FD is read out to the column ADC 212 as a noise component signal. The column ADC 212 performs AD conversion of the analog noise component signal by counting the time until the level of the signal RAMP1 exceeds the level of the noise component signal. The signal RAMP1 at this time has a waveform (waveform Ref) in which the potential decreases with a predetermined slope from the predetermined potential to the first reference potential Vr1.

  Here, the first reference potential Vr1 is preferably a potential that is lower than the assumed value of the noise component signal by a predetermined voltage. By setting the first reference potential Vr1 in this way, the AD conversion of the noise component signal can be speeded up.

  At time t2, φTX1 = Hi, and the signal charge accumulated in the PD is transferred to the FD. Therefore, at time t2, the voltage of the FD decreases from the noise level V_n to the signal level V_s according to the amount of signal charge transferred from the PD.

  At time t3, φTX1 = Lo, and the voltage of the signal level V_s generated in the FD is read to the column ADC 212 as a noise signal component signal. The column ADC 212 performs AD conversion of the analog noise signal component signal by counting the time until the level of the signal RAMP1 output from the ramp wave generation circuit 29 exceeds the level of the noise signal component signal. The signal RAMP1 at this time has a waveform (waveform Signal) in which the potential decreases with a predetermined slope from the predetermined potential to the second reference potential Vr2.

  The column ADC 212 removes the digital noise component signal from the digital noise signal component signal, and outputs the digital signal component signal as an image signal.

  At time t4, φRST1 = Hi and FD is reset. Thereafter, the drive sequence shown at times t0 to t4 is executed in one horizontal period, and this drive sequence is repeated to obtain image signals row by row.

  FIG. 6 is a circuit diagram of the pixel circuit of the second pixel. The second pixel includes PD, RST, two amplification transistors SF1, SF2 (hereinafter referred to as “SF1”, “SF2”) and SEL.

  The PD is composed of a surface-type photodiode, PVSS is input to the anode, and RST is connected to the cathode. Here, at the time of resetting the PD, RST is turned on, and PVSS is applied to both the cathode and the anode. As a result, the PD is reset in a zero bias state, and a current corresponding to the incident light intensity flows during exposure. This current changes the voltage between the anode and cathode of the PD.

  The RST is composed of an nMOS, and a reset signal φRST2 is applied to the gate and is connected in parallel with the PD. The RST is turned on when φRST2 = Hi, and the PD is reset in a zero bias state.

  SF1 is composed of a pMOS, the gate is connected to the cathode of the PD, PVSS is input to one terminal, and the other terminal is connected to the vertical signal line L_1 via SEL. SF2 is composed of a pMOS, a bias voltage Bias (hereinafter referred to as “Bias”) is applied to the gate, SF1 is connected to one terminal, and PVDD is input to the other terminal. SF1 and SF2 amplify the voltage between the anode and cathode of the PD and supply the amplified voltage to the SEL.

  The SEL is composed of an nMOS, the gate is applied with φVSEN2, one terminal is connected to a connection point between SF1 and SF2, and the other terminal is connected to the vertical signal line L_1. The SEL is turned on when φVSEN2 = Hi, and outputs the voltage of the PD that has been amplified by SF1 and SF2 to the vertical signal line L_1 as an image signal.

  FIG. 7 is a graph showing the photoelectric conversion characteristics of the second pixel, where the vertical axis (linear axis) indicates the signal component signal and the horizontal axis (logarithmic axis) indicates the incident light intensity. As shown in FIG. 7, it can be seen that the second pixel has a logarithmic photoelectric conversion characteristic in which the signal component signal increases logarithmically as the incident light intensity increases. In FIG. 7, since the horizontal axis is a logarithmic axis, the logarithmic change is represented by a straight line.

  FIG. 8 is a timing chart of the second pixel. At time t0, the PD is exposed during the exposure period, and a voltage corresponding to the incident light intensity appears at the cathode of the PD. Thereby, the voltage of the cathode of PD falls from reset level V_PVSS to signal level V_s.

  At time t1, φVSEN2 = Hi, and the voltage of the signal level V_s generated at the cathode of the PD is read to the column ADC 212 as a noise signal component signal. The column ADC 212 performs AD conversion on the analog noise signal component signal by counting the time until the level of the signal RAMP2 exceeds the level of the noise signal component signal. The signal RAMP2 at this time has a waveform (waveform Signal) in which the potential decreases with a predetermined slope from a predetermined potential to Vr2.

  At time t2, φRST2 = Hi, RST and SEL are turned on, the PD cathode voltage rises from the signal level V_s to the reset level V_PVSS, and the reset level V_PVSS is read to the column ADC 212 as a noise component signal. The column ADC 212 performs AD conversion of the analog noise component signal by counting the time until the level of the signal RAMP2 output from the ramp wave generation circuit 29 exceeds the level of the noise component signal. The signal RAMP2 at this time has a waveform (waveform Ref) in which the potential decreases with a predetermined slope from the predetermined potential to Vr1.

  The column ADC 212 removes the digital noise component signal from the digital noise signal component signal, and outputs the digital signal component signal as an image signal.

  At time t3, φRST2 = Lo and φVSEN2 = Lo are set, and RST and SEL are turned off.

  Thereafter, the driving sequence shown at times t0 to t4 is performed in one horizontal period, and this driving sequence is repeated to sequentially obtain image signals row by row.

  FIG. 9 shows an example of the arrangement of the first pixel and the second pixel in the pixel array unit 21. In FIG. 9, PD indicates the first pixel, and SC indicates the second pixel. When the first pixel having the linear characteristic and the second pixel having the log characteristic are mixed, as shown in FIG. 9, four pixels composed of three first pixels and one second pixel are arranged in a tile shape. A pattern to do is conceivable. Hereinafter, although it demonstrates using the arrangement | positioning pattern shown in FIG. 9, another arrangement | positioning pattern may be sufficient.

  As described above, when the column ADC 212 AD-converts the noise signal signal read from the first pixel and the noise signal, the signal RAMP1 that changes from the waveform Ref to the waveform Signal is used, and the noise signal signal read from the second pixel is used. When the noise signal is AD-converted, a signal RAMP2 that changes from the waveform Signal to the waveform Ref is used.

  However, if two types of ramp signals are prepared for each pixel, it is necessary to consider the gain error and offset error of both ramp signals, and the circuit of the ramp wave generation circuit 29 becomes complicated. Furthermore, problems such as an increase in power consumption due to the output of two types of ramp signals and an increase in chip area due to an increase in signal lines occur.

  Therefore, the ramp wave generation circuit 29 generates one ramp signal in which both the waveform Ref and the waveform Signal are incorporated in a predetermined order, and the column ADC 212 performs AD conversion of the first pixel and the second pixel using the ramp signal. I do. By using one type of ramp signal, problems such as the above-described increase in power consumption and chip area can be avoided.

  FIG. 10 is a timing chart of the first pixel and the second pixel shown in FIGS. 5 and 8 and a waveform of the ramp signal RAMP. FIG. 11 is a diagram showing waveforms of the horizontal synchronizing signal and the ramp signal RAMP. As shown in FIG. 11, the ramp wave generation circuit 29 outputs a signal waveform whose potential changes in the order of the waveform Ref → the waveform Signal → the waveform Ref as the ramp signal RAMP every time the horizontal synchronization signal Hsync is output.

  Returning to FIG. As described above, since the signal RAMP changes in the order of the waveform Ref → the waveform Signal → the waveform Ref, first, in accordance with the generation timing of the two waveforms (the waveform Ref → the waveform Signal) immediately after the horizontal synchronization signal Hsync is output. The row decoder 23 outputs pixel control signals (φRST1, φVSEN1, and φTX1) for the first pixel. Thus, the column ADC 212 can read out each signal in the order of the noise component signal → the noise signal component signal from the first pixel during the period when the waveform Signal comes after the waveform Ref.

  Specifically, the time t0 is during the exposure period. Since φRST = Hi, FD is always reset to PVDD. When φRST1 becomes Lo, the voltage of the FD decreases from the reset level to the noise level V_n.

  At time t1, φVSEN1 = Hi, and the voltage of the noise level V_n generated in the FD is read out to the column ADC 212 as a noise component signal. The column ADC 212 AD converts the analog noise component signal using the waveform Ref of the signal RAMP.

  At time t2, φTX1 = Hi and the signal charge accumulated in the PD is transferred to the FD, so that the voltage of the FD decreases from the noise level V_n to the signal level V_s according to the amount of signal charge transferred from the PD. .

  At time t3, φTx1 = Lo is set, and the voltage of the signal level V_s generated in the FD is read out to the column ADC 212 as a noise signal component signal. The column ADC 212 AD converts the analog noise signal component signal using the waveform Signal of the signal RAMP. At time t4, φRST1 = Hi and FD is reset.

  Next, the second pixel will be described. As described above, first, the row decoder 23 outputs pixel control signals (φRST1, φVSEN1, and φTX1) for the first pixel in accordance with the generation timing of the previous two waveforms (waveform Ref → waveform Signal). Subsequently, the row decoder 23 outputs pixel control signals (φRST2 and φVSEN2) for the second pixel in accordance with the generation timing of the latter two waveforms (waveform Signal → waveform Ref). As a result, the column ADC 212 can read out each signal in the order of the noise signal component signal → the noise component signal from the second pixel during the period in which the waveform Ref comes after the waveform Signal.

  This will be specifically described. At time t2, during the exposure period, a voltage corresponding to the incident light intensity appears at the cathode of the PD. Thereby, the voltage of the cathode of PD falls from reset level V_PVSS to signal level V_s.

  At time t3, φVSEN2 = Hi, and the voltage of the signal level V_s generated at the cathode of the PD is read to the column ADC 212 as a noise / signal component signal. The column ADC 212 AD converts the analog noise signal component signal using the waveform Signal of the signal RAMP.

  At time t4, φRST2 = Hi, RST and SEL are turned on, the PD cathode voltage rises from the signal level V_s to the reset level V_PVSS, and the reset level V_PVSS is read to the column ADC 212 as a noise component signal. The column ADC 212 AD converts the analog noise component signal using the waveform Ref of the signal RAMP. At time t5, φRST2 = Lo and φVSEN2 = Lo are set, and RST and SEL are turned off.

  The row decoder 23 that outputs the horizontal synchronization signal Hsync and the pixel control signal and the ramp wave generation circuit 29 that outputs the signal RAMP are controlled by the timing control unit 22. That is, the timing control unit 22 causes the ramp wave generation circuit 29 to output the signal RAMP in the order of the waveform Ref → the waveform Signal → the waveform Ref during one scan by the row decoder 23 and the period of the waveform Ref → the waveform Signal. The pixel control signal for the first pixel is output to the row decoder 23, and control is performed to output the pixel control signal for the second pixel to the row decoder 23 during the period of the waveform Signal → the waveform Ref.

  As described above, pixels having different characteristics are mixed, such as the first pixel that outputs the noise signal component signal after the noise component signal and the second pixel that outputs the noise component signal after the noise signal component signal. Even in the pixel unit, the ramp wave generation circuit 29 generates the signal RAMP in the order of the waveform Ref → the waveform Signal → the waveform Ref, and the timing control unit 22 outputs the noise component signal and the noise signal component signal of each pixel. By controlling the timing according to the appearance of the waveform Ref and the waveform Signal, appropriate AD conversion can be performed. Further, it is possible to realize a solid-state imaging device that outputs image signals with high sensitivity, high dynamic range, and low variation at high speed, high resolution, and low noise.

  In the present embodiment, the case where the signal RAMP changes in the order of the waveform Ref → the waveform Signal → the waveform Ref has been described, but the order of the waveform Signal → the waveform Ref → the waveform Signal may be used.

  Further, in the present embodiment, the first pixel has an embedded PD and the second pixel has a surface PD. However, the present invention is not limited to this, and the first pixel and the second pixel are not limited to this. Both may be constituted by an embedded PD. Since the embedded PD is not easily affected by dark current, a high-quality image signal can be obtained when the first pixel and the second pixel are configured by the embedded PD. In the case where the second pixel is constituted by an embedded PD, this can be realized by inserting a transfer transistor between the cathode of the PD and the gate of SF1 in FIG.

  In the timing chart of FIG. 13, the case where AD conversion of pixels for one row is performed in one horizontal scanning period (1H period) is described. The present embodiment can be applied even when a 2H period is required for conversion.

DESCRIPTION OF SYMBOLS 1 Solid-state image sensor 110 Image sensor 120 Image processing part 121 Image signal processing part 122 Image sensor control part 21 Pixel array part 22 Timing control part 24 Column ADC array part 212 Column ADC
29 Ramp wave generation circuit

Claims (7)

A first pixel that outputs a signal potential indicating a noise component and a signal component after outputting a reference potential indicating a noise component, and a second pixel that outputs the reference potential after outputting the signal potential are arranged in a matrix. A pixel portion,
An AD conversion unit that is provided for each column of the pixel unit and performs analog / digital conversion of the reference potential using a first reference waveform and analog / digital conversion of the signal potential using a second reference waveform;
A reference signal generation unit that generates and outputs a reference signal that combines the first reference waveform and the second reference waveform;
The reference potential and the signal potential are output to the first pixel during a period in which the second reference waveform comes after the first reference waveform in the reference signal, and after the second reference waveform in the reference signal A timing control unit for outputting the signal potential and the reference potential to the second pixel during a period of the first reference waveform;
A solid-state imaging device.   The reference signal generation unit is configured in the order of the first reference waveform, the second reference waveform, and the first reference waveform every time a vertical scanning circuit that sequentially selects each row of the pixel unit scans one row. The solid-state imaging device according to claim 1, wherein a reference signal is generated and output.   The reference signal generation unit is configured in the order of the second reference waveform, the first reference waveform, and the second reference waveform every time a vertical scanning circuit that sequentially selects each row of the pixel unit scans one row. The solid-state imaging device according to claim 1, wherein a reference signal is generated and output.   4. The solid-state imaging device according to claim 1, wherein the first pixel includes an embedded photodiode, and the second pixel includes a surface photodiode. 5.   The solid-state imaging device according to claim 1, wherein each of the first pixel and the second pixel includes a buried photodiode. The AD converter is a single slope type,
The solid-state imaging device according to any one of claims 1 to 5, wherein the reference signal generation unit generates and outputs the reference signal using the first reference waveform and the second reference waveform as a ramp waveform.   The solid-state imaging device according to claim 1, wherein the first pixel has linear characteristics, and the second pixel has log characteristics.

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