JP2013186710A - Non-contact ic medium with electromagnetic wave detector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for, even when an article including a non-contact IC medium for performing history management is erroneously put in a microwave oven, and the non-contact IC medium is irradiated with an electromagnetic wave causing a failure, leaving the trace of the irradiation to easily determine whether or not the non-contact IC medium is normal.SOLUTION: An electromagnetic wave detector constituted of a conductive substance layer which generates dielectric heat due to the irradiation of an electromagnetic wave and a heat detection layer which discolors or colors by sensing heat is attached to a non-contact IC medium constituted of an antenna formed on a support body and constituted of a dielectric layer, and an IC chip connected to the antenna.

Description

  The present invention relates to a non-contact IC medium used in an accounting system in a restaurant, and a function for detecting presence / absence of irradiation of electromagnetic waves of a microwave oven that causes a failure together with an adherend to which the non-contact IC medium is attached. It is related with the non-contact IC medium provided with.

  2. Description of the Related Art In recent years, a non-contact IC medium that includes an IC chip that holds information capable of identifying an individual and can read information in the chip in a non-contact manner by wireless communication is often used for distribution management and history management. As a system using a non-contact IC medium, for example, an accounting system in a rotating bowl or a restaurant is known (Patent Document 1).

  This system attaches a non-contact IC medium to a tableware such as a dish, records information on the payment amount set for each tableware on an IC chip, and communicates with a reading device in a state where a plurality of tableware are stacked. It can be collectively accounted for (Patent Document 2).

  When such a tableware or the like with a non-contact IC medium attached is used in a microwave oven, a large amount of current flows into the IC chip and destroys the circuit in the chip, so that communication as a non-contact IC medium becomes impossible. .

  Therefore, even if a non-contact IC medium is provided for the purpose of history management in a dish where a microwave oven is used, the function as the non-contact IC medium is lost when it is put in the microwave oven, but the trace is visually confirmed. Since this is not possible, there is a possibility that the history management will be hindered by using a non-contact IC medium that has failed.

JP-A-11-178694 JP 2004-145470 A

  Even if a non-contact IC medium for performing history management is provided and an article accidentally enters the microwave oven and electromagnetic waves that cause failure are irradiated to the non-contact IC medium, leaving a trace of irradiation, An object of the present invention is to provide a method for easily determining whether or not a non-contact IC medium is normal.

As means for solving the above-mentioned problems, the invention according to claim 1 is a non-contact IC comprising an antenna formed on a support and made of a conductive layer, and an IC chip electrically joined to the antenna. On the medium,
A non-contact IC medium with an electromagnetic wave detection body, wherein an electromagnetic wave detection body comprising a conductive material layer that generates dielectric heat when irradiated with an electromagnetic wave and a heat detection layer that changes color or develops color by sensing heat is pasted.

  The invention according to claim 2 is the non-contact IC medium with an electromagnetic wave detector according to claim 1, wherein the conductive material layer that generates dielectric heat is a metal thin film.

The invention according to claim 3 is the non-contact IC medium with an electromagnetic wave detector according to claim 2, wherein the metal thin film has a thickness of 40 to 100 mm.

  The invention according to claim 4 is the non-contact IC with an electromagnetic wave detector according to claim 2 or 3, wherein the metal thin film is a continuous metal thin film including a non-metal portion. It is a medium.

  The invention according to claim 5 is the electromagnetic wave detector according to claim 4, wherein the area ratio of the metal portion in the continuous metal thin film having the non-metal portion is 70 to 90%. It is a contactless IC medium.

  The non-contact IC medium with an electromagnetic wave detector according to the present invention includes a conductive material layer that converts electromagnetic wave energy into heat and a heat detection layer that reacts by heat on the base material. When the electromagnetic wave is irradiated, the conductive material layer generates heat, and the heat detection layer reacts with the heat to develop color. Therefore, the detection function does not hinder the communication characteristics as a non-contact IC medium, and can be easily observed visually. It becomes possible to confirm.

It is a cross-sectional conceptual diagram which shows embodiment of the electromagnetic wave detection body affixed on the non-contact IC medium of this invention. It is a plane conceptual diagram which shows embodiment of the electromagnetic wave detection body affixed on the non-contact IC medium of this invention. It is a cross-sectional conceptual diagram which shows another embodiment of the electromagnetic wave detection body affixed on the non-contact IC medium of this invention. It is a plane conceptual diagram which shows another embodiment of the electromagnetic wave detection body affixed on the non-contact IC medium of this invention. It is a plane expansion conceptual diagram which shows embodiment of the electroconductive substance layer with the nonmetallic part of this invention. 1 is a conceptual cross-sectional view showing an embodiment of a non-contact IC medium with an electromagnetic wave detection body in which an electromagnetic wave detection body is attached to the non-contact IC medium of the present invention. It is a conceptual diagram which shows embodiment which the non-contact IC medium with an electromagnetic wave detection body of this invention was affixed on the to-be-adhered body.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. 1 and 2 of the present invention are conceptual diagrams showing an example of the electromagnetic wave detection body 10 of the present invention. The heat detection layer 2 is provided on one surface of the substrate 1, and the conductive material layer 3 is provided on the other surface. In addition, the adhesive layer 4 is further provided thereon.

  When the electromagnetic wave detection body 10 is put in a microwave oven or the like, electromagnetic wave energy is converted into heat in the conductive material layer 3 to generate heat, and the heat detection layer 2 reacts with the heat to develop color and change color. It can be confirmed visually.

  As shown in FIGS. 2, 3, and 4, the shapes of the heat detection layer 2 and the conductive material layer 3 can be changed.

  The heat detection layer 2 is preferably an ink that develops color when heated, and many inks have been proposed. The heat detection layer 2 is attached to a product as a heat detection label and used for quality control by tracking the temperature history. .

  FIG. 5 shows an example of the conductive material layer 3 made of a continuous metal thin film including the non-metal portion 5. This is because when the electromagnetic wave detector 10 is attached to the non-contact IC medium 20, the conductive material layer 3 made of a metal thin film affects communication, and good communication cannot be obtained, but the non-metal portion 5 is added. When the area ratio occupied by the metal is 70 to 90%, it is possible to obtain a heat generation amount that causes the heat detection layer 2 to react while maintaining communication characteristics. Further, the non-metal portion 5 may be formed by removing the metal thin film by etching.

  The thickness of the metal thin film is 40 to 100 mm, and the metal thin film having the non-metal portion 5 is formed so as to be connected. The size of one nonmetallic part 5 is about 0.1 to 0.5 mm in diameter. This has the purpose of maintaining the communication performance of the non-contact IC medium 20 by being attached to the non-contact IC medium 20 described later. On the other hand, when the metal thin film is formed discontinuously, the amount of heat obtained is reduced. Therefore, it is preferable to form a metal thin film having a continuously connected portion so as to obtain a sufficient amount of heat generation for the reaction of the heat detection layer 2 while maintaining the communication performance of the non-contact IC medium 20.

  FIG. 6 is a conceptual diagram of the non-contact IC medium 30 with an electromagnetic wave detector according to the present invention, in which the electromagnetic wave detector 10 is attached to the non-contact IC medium 20.

  As the substrate 1, for example, a resin-based substrate such as PET, PVC, or ABS, or a paper substrate such as coated paper can be used, but a material that does not deform or deteriorate at high temperatures is desirable.

  The conductive material layer 3 generates heat when irradiated with an electromagnetic wave of a microwave oven, particularly microwaves. Specifically, the conductive material layer 3 rises to about 170 to 250 ° C., and the surface in contact with the conductive material layer 3 is about 160 to 210 ° C. Until heated.

  As a material, a metal thin film made of aluminum, nickel, gold, silver, zinc, platinum or the like is preferable because it efficiently generates heat, but any material having electrical conductivity may be used.

  The heat detection layer 2 is made of a material that changes its hue by receiving predetermined heat or chemically reacts by the action of heat. As a color developed using a chemical reaction, utilizing a reaction between an electron-donating usually colorless or light-colored dye precursor and an electron-accepting compound that reacts when heated to develop the dye precursor, There is a method in which both coloring components are brought into contact with heat to cause color development.

  For example, an irreversible thermosensitive color ink composed mainly of a leuco dye that develops color by applying heat and a developer such as bisphenol can be used. The color develops when the leuco dye dispersed in the ink and the developer are combined by heat stimulation. As the leuco dye, a colorless or light-colored material is usually used, and it is suitable to be manifested as a color tone when reacted with thermal.

  The coloring materials used in the thermosensitive coloring layer are triphenylmethane, fluoran, spiropyran, auramine, phenothiazine and other normally colorless or slightly light leuco dyes, which are used for the production of conventional thermosensitive recording materials. Use known leuco dyes. Among them, 3,3-bis (P-dimethylaminophenyl) -phthalide, 3,3-bis- (p-dimethylaminophenyl) -6-dimethylaminophthalide (also known as crystal violet) is typical. Lactone), 3,3-bis (P-dimethylaminophenyl) -6-dimethylaminophenyl, 3-cyclohexylamino-6-chlorofluorane, 3- (N, N-diethylamino) -5-methyl-7- (N, N-dibenzylamino) fluorane, 2- (2-chloroanilino) -6-dinitylaminofluorane, 2- (2-chloroanilino) -6-n-butylaminofluorane, benzoylleucomedilem -1N-phenylrhodamine-β-lactam, amidorhodamine-β-sultone, benzo-β-naphthospiropyran, 6'-c B -87- Medline Kishi benzoin drill Roh benzo spiropyran, 6'-bromo-8'-methoxy - can be mentioned benzoin drill Roh benzo spiro erosion, etc., but is not limited thereto.

  Examples of color developing substances that bind to these leuco dyes and cause color development include 44'-isopropylidenediphenol (bisphenol A), 44'-inopropylidenebis (2-10 lofenol), 4.4'-isopropylidene. Denbis (2-methylphenol), 44'-isopropylidenebis (2-tert-butylphenol), 4.4'-cyclohexolinitol diphenol, 4-tert-butylphenol, 4-tert-octylphenol, 4 Phenolic compounds such as tert-octyl catechol, α-naphthol, β-naphthol, 4-hydroxy-acetophenol, novolac-type phenol resins, halogenated novolac-type phenol resins and other phenol polymers, benzoic acid, salicylic acid, tartaric acid, Leuco Like the dye, it is not limited to this.

  Further, as a coloring method other than the above, a method of coloring by containing a substance that changes state such as dissolution / dispersion at a predetermined temperature, or a material in which a dye is put in a capsule that dissolves at a predetermined temperature is used. The method of making it color is also mentioned.

  The heat detection layer 2 converts each of the above special inks into one of silk printing ink, offset printing ink, gravure printing ink, flexographic printing UV curing ink, oxidation polymerization ink, and heat drying ink. Dispersed and provided on the entire surface of the label substrate as part of the tint block printing by various printing methods (screen, offset, gravure, letterpress, etc.).

  The heat detection layer 2 is usually desirably colorless or light-colored. This makes it difficult to visually recognize that the detection process has been performed. Further, it is provided on the front surface of the substrate 1 as part of the tint block printing. As a result, when color develops due to heat, characters and the like appear on the label, and the trace can be clearly confirmed. It is also possible to print the heat detection layer 2 with the same pattern as the light color printing, or by mixing the heat detection ink with the light color printing ink. In either case, the conductive material layer 3 described above is provided on the entire surface of the electromagnetic wave detector 10.

  On the other hand, as shown in FIG. 6, the above-described heat detection layer 2 may be provided on the entire surface of the base material 1, and the conductive material layer 3 may be provided on the back surface of the base material 1 in a pattern. In this case, the communication characteristics of the non-contact IC medium 20 are more difficult to inhibit, and only the portion of the conductive material layer 3 is colored, so that clear visual detection is possible.

  An adhesive layer (adhesive material) 4 is provided on the back surface of the substrate 1 to be attached to the adherend. The adhesive material for the adhesive layer 4 does not change or corrode the heat detection layer 2, and it is necessary to use a material having high heat resistance. For example, vinyl chloride-vinyl acetate copolymer, polyester Polyamide, acrylic, butyl rubber, natural rubber, silicone, polyisobutyl adhesives alone or aggregating components such as alkyl methacrylate, vinyl ester, acrylonitrile, styrene, vinyl monomer, unsaturated carboxylic acid, hydroxy A modification component typified by a group-containing monomer, acrylonitrile and the like, a polymerization initiator, a plasticizer, a curing agent, a curing accelerator, an antioxidant, and other additives added as necessary can be used.

  As shown in FIG. 6, the non-contact IC medium 30 with an electromagnetic wave detector of the present invention has an electromagnetic wave detector stacked on a non-contact IC medium 20 for wireless communication. Is a passive type that does not have a battery for driving the IC chip 6.

  Instead of the passive type, an active type having a driving battery for the IC chip 6 may be used. In this case, the structure of the non-contact IC medium 20 is complicated, but there is an effect that the reading distance is extended.

  This non-contact IC medium 20 is mounted on the base film extending as a band as the support 7, the antenna 8 made of a conductive layer formed of a metal such as aluminum or copper, and the longitudinal center of the antenna 8. And an IC chip 6 electrically connected to the antenna 8.

  The antenna 8 is formed to extend in a band shape or a circuit shape. The non-contact IC medium 20 receives a radio wave from an information reading device (not shown) by an antenna 8 and supplies a potential difference generated in the longitudinal direction of the antenna to the IC chip 6.

  The IC chip 6 is formed in a square shape, and its side portion has a length dimension of 0.5 mm and a height dimension of 0.1 mm. Note that the length of the side portion can be changed as appropriate instead of 0.5 mm.

  When the electromagnetic wave detection medium 10 is provided on the non-contact IC medium 20, a method such as sticking as a label is used. At this time, the electrically conductive material used for the conductive substance layer 3 is preferably formed so as to have the non-metallic portion 5 as described above in order to inhibit the communication function of the non-contact IC medium 20. In this case, the conductive material layer 3 in the electromagnetic wave detector 10 can be provided so as to cover the antenna 8 of the non-contact IC medium 20. Alternatively, as shown in FIG. 6, the antenna 8 of the non-contact IC medium 20 can be attached to a portion that is not covered.

  Further, an adhesive layer (adhesive material) 4 is provided on the support 7 to be attached to the adherend. As the adhesive material for the adhesive layer 4, a material having high heat resistance is used.

  Further, a release sheet that can be easily peeled is temporarily adhered to the surface of the adhesive layer 4. As the release sheet, a separator in which a release agent layer such as silicone resin is laminated on a paper or plastic sheet by coating or the like is used.

  As described above, the non-contact IC medium 30 with an electromagnetic wave detection body according to the present invention includes the base material 1 including the conductive material layer 3 that is dielectrically heated by electromagnetic energy and the heat detection layer 2 that reacts by heat. When the conductive material layer 3 generates heat when irradiated with electromagnetic waves, the heat detection layer 2 reacts with the heat and develops color, so that the trace can be visually confirmed.

<Heat detection layer ink>
Leuco dye: PSD-290 (manufactured by Nippon Soda Co., Ltd.) 6.7 wt% developer: D-8 (manufactured by Nippon Soda Co., Ltd.) 27.0 wt% offset ink 66.3 wt% is dispersed and kneaded and heated A detection layer ink was prepared.

  As the base material 1, aluminum was vapor-deposited on a PEN (polyethylene terephthalate) film having a thickness of 38 μm to a thickness of 60 mm. By using an alkali etching method, a metal thin film having an area ratio of 85% of the aluminum portion and a pattern-like nonmetallic portion having a 0.2 mm diameter as shown in FIG. 5 is formed, and a silicon-based adhesive is further formed on the surface. (KR-101-10 (manufactured by Shin-Etsu Silicone)) was applied. On the opposite surface, the heat detection layer ink was printed by offset printing (thickness: 3 to 4 μm) to produce an electromagnetic wave detector 10.

  The antenna 8 of the non-contact IC medium 20 was formed on a PEN support having a thickness of 50 μm by screen printing using a silver paste (AGEP201X: manufactured by Sumitomo Electric Industries, Ltd.). A non-contact IC medium 20 was manufactured by using an anisotropic conductive adhesive at the connecting portion between the antenna 8 and the IC chip 6 having a gold bump and bonding them by thermocompression bonding. Furthermore, the above-mentioned electromagnetic wave detection body 10 was affixed to this non-contact IC medium 20, and further a silicon-based adhesive was applied to obtain a non-contact IC medium 30 with an electromagnetic wave detection body.

<Comparative Example 1>
In the following, a non-contact IC medium 20 was produced in the same manner as in the example for explaining the comparative example of the present invention. A silicon-based adhesive (KR-101-10 (manufactured by Shin-Etsu Silicone)) was applied thereto.

  The non-contact IC medium 30 with the electromagnetic wave detector of the example produced in this way and the non-contact IC medium without the electromagnetic wave detector of the comparative example were attached to a plate as shown in FIG. Both confirmed that communication was possible. Then warmed the dishes in the microwave.

  Communication between the non-contact IC medium 30 with the electromagnetic wave detector and the non-contact IC medium without the electromagnetic wave detector was disabled because the IC chip 6 was destroyed. In the non-contact IC medium 30 with the electromagnetic wave detector, since the conductive material layer 3 in the electromagnetic wave detector 10 generates heat, the heat detection layer 2 is colored and the trace can be visually confirmed. It was found that there is a possibility that has been destroyed. On the other hand, the non-contact IC medium having no electromagnetic wave detector did not change its appearance, and its trace could not be confirmed.

DESCRIPTION OF SYMBOLS 1 ... Base material 2 ... Heat detection layer 3 ... Conductive substance layer 4 ... Adhesive layer 5 ... Non-metal part 6 ... IC chip 7 ... Support body 10 ... Electromagnetic wave detection body 20... Non-contact IC medium 30... Non-contact IC medium 40 with electromagnetic wave detection body.

Claims (5)

In a non-contact IC medium comprising an antenna made of a conductive layer provided on a support and an IC chip electrically joined to the antenna,
A non-contact IC medium with an electromagnetic wave detection body, wherein an electromagnetic wave detection body comprising a conductive material layer that generates dielectric heat when irradiated with an electromagnetic wave and a heat detection layer that changes color or develops color by sensing heat is pasted.   The non-contact IC medium with an electromagnetic wave detector according to claim 1, wherein the conductive material layer that generates dielectric heat is a metal thin film.   The non-contact IC medium with an electromagnetic wave detector according to claim 2, wherein the metal thin film has a thickness of 40 to 100 mm.   The non-contact IC medium with an electromagnetic wave detector according to claim 2 or 3, wherein the metal thin film is a continuous metal thin film including a non-metal portion.   The non-contact IC medium with an electromagnetic wave detector according to claim 4, wherein an area ratio of the metal portion in the continuous metal thin film having the non-metal portion is 70 to 90%.