JP2013183052A - Surface-mounting inductor manufacturing method - Google Patents

Surface-mounting inductor manufacturing method Download PDF

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JP2013183052A
JP2013183052A JP2012046274A JP2012046274A JP2013183052A JP 2013183052 A JP2013183052 A JP 2013183052A JP 2012046274 A JP2012046274 A JP 2012046274A JP 2012046274 A JP2012046274 A JP 2012046274A JP 2013183052 A JP2013183052 A JP 2013183052A
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coil
tablet
core
sealing material
core portion
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JP5623446B2 (en
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Naoto Takahashi
直人 高橋
Masaaki Totsuka
昌明 戸塚
Kunio Sasamori
邦夫 佐々森
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Toko Inc
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Toko Inc
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Priority to TW102106383A priority patent/TWI553680B/en
Priority to KR1020130020940A priority patent/KR101981515B1/en
Priority to CN201310068218.6A priority patent/CN103295754B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/022Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2847Sheets; Strips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2847Sheets; Strips
    • H01F2027/2857Coil formed from wound foil conductor

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Insulating Of Coils (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a small surface-mounting inductor manufacturing method.SOLUTION: In a surface-mounting inductor manufacturing method according to the present invention, a sealing material is preliminary molded into a shape having a columnar projection at a peripheral edge of a plane shape to form a tablet. A flat wire is wound to form a coil. The coil is located on the tablet, and both ends of the coil are arranged on a molding die along an outside face of the columnar projection of the tablet. While both ends of the coil are sandwiched between the outside face of the columnar projection of the tablet and an inner wall of the molding die, the coil and the sealing material are integrated using a resin molding method or a powder compaction method, so as to form a core section. By polishing or cutting a surface of the core section except for a surface on which both ends of the coil are exposed, the core section is resized. An external electrode connected to a portion at which at least one part of both ends of the coil is provided on the surface of the core section.

Description

本発明は小型の面実装インダクタの製造方法に関する。   The present invention relates to a method for manufacturing a small surface-mount inductor.

線材を巻回したコイルをコア内に内包する面実装インダクタが広く利用されている。近年の携帯電話などの電子機器の小型化や薄型化に伴い、面実装インダクタのような電子部品も小型化や低背化が要求されている。そこで出願人は、先に出願した特許文献1において、平角導線をその端部の両方が外周に引き出されるように渦巻き状に巻回したコイルと予備成形されたタブレットを用いた小型の面実装インダクタとその製造方法を提案した。   2. Description of the Related Art Surface mount inductors that enclose a coil around which a wire is wound in a core are widely used. With recent downsizing and thinning of electronic devices such as mobile phones, electronic components such as surface mount inductors are also required to be downsized and low profiled. In view of this, the applicant has disclosed a small surface-mount inductor using a coil and a pre-formed tablet in which a flat conductor is wound in a spiral shape so that both ends thereof are drawn to the outer periphery in Patent Document 1 previously filed. And the manufacturing method was proposed.

特許文献1の面実装インダクタの製造方法では、まず樹脂と充填材とを含む封止材を平板形状の周縁部に柱状凸部を有する形状に予備成形してタブレットを作成する。次に、断面が平角形状の導線を巻回してコイルを作成し、そのコイルをタブレット上に載置する。このとき、コイルの両端部をタブレットの柱状凸部に沿わせるように配置し、コイルの両端部をタブレットの柱状凸部の外側側面と成型金型の内壁面との間に挟むようにコイルとタブレットを成型金型に配置し、さらに成型金型に予備成形封止材を装填する。つぎに、コイルの両端部がタブレットの柱状凸部の外側側面と成型金型の内壁面との間に挟まれた状態でコイルと封止材を樹脂成形法もしくは圧粉成形法を用いて一体化させて成形体と得る。最後に成形体の表面にコイルの両端部の少なくとも一部が露出する部分と接続する外部電極を成形体の表面または外周に設けて、面実装インダクタを得る。   In the method for manufacturing a surface-mount inductor disclosed in Patent Document 1, a tablet is first prepared by pre-molding a sealing material including a resin and a filler into a shape having columnar protrusions on a peripheral edge of a flat plate shape. Next, a coil having a rectangular cross section is wound to create a coil, and the coil is placed on the tablet. At this time, both ends of the coil are arranged along the columnar convex portion of the tablet, and both ends of the coil are sandwiched between the outer side surface of the columnar convex portion of the tablet and the inner wall surface of the molding die. The tablet is placed in a molding die, and a preforming sealing material is loaded into the molding die. Next, the coil and the sealing material are integrated using a resin molding method or a powder molding method with both ends of the coil sandwiched between the outer side surface of the columnar convex portion of the tablet and the inner wall surface of the molding die. To obtain a molded body. Finally, an external electrode connected to a portion where at least a part of both ends of the coil is exposed on the surface of the molded body is provided on the surface or outer periphery of the molded body to obtain a surface mount inductor.

特開2010−245473JP 2010-245473 A

前述のとおり、特許文献1の方法では樹脂と充填材とを含む封止材を予め平面形状の周縁部に柱状凸部を有する形状のタブレットへと予備成形する。特に、コイルの位置だしを考慮すると図17に示すように、コイル101を囲うような柱状凸部102aを有する形状にタブレット102を形成するのが望ましい。しかしながら、2mm角以下のサイズの面実装インダクタを得ようとすると、タブレットのサイズも小さくなり、柱状凸部も薄くせざるを得ない。そのため、樹脂と充填材とを含むような封止材(特に充填材の含有量が60Vol%以上のもの)からなるタブレットでは、柱状凸部を有するような複雑な形状に予備成形すると、十分な機械的強度を確保することが困難になってくる。タブレットの機械的強度が低下すると、搬送や成型金型へ装填する際にタブレットの一部の欠損もしくは破損が生じやすくなる。タブレットの一部が欠損もしくは破損してしまうと、内部のコイルの位置ズレや成形不良が生じ、インダクタの特性不良やバラツキを生起する可能性がある。そのため、タブレットの柱状凸部はある程度の厚みを確保しなければならず、特許文献1の方法での小型化や低背化には限界があった。   As described above, in the method of Patent Document 1, a sealing material including a resin and a filler is preliminarily molded into a tablet having a shape having columnar protrusions on a flat peripheral edge. In particular, considering the position of the coil, as shown in FIG. 17, it is desirable to form the tablet 102 in a shape having a columnar convex portion 102 a surrounding the coil 101. However, when trying to obtain a surface-mount inductor having a size of 2 mm square or less, the size of the tablet is also reduced, and the columnar protrusions have to be thinned. Therefore, in a tablet made of a sealing material containing a resin and a filler (particularly, the content of the filler is 60 Vol% or more), it is sufficient to preform it in a complicated shape having a columnar protrusion. It becomes difficult to ensure mechanical strength. When the mechanical strength of the tablet is reduced, a part of the tablet is easily lost or damaged when it is transported or loaded into a molding die. If a part of the tablet is missing or damaged, the internal coil may be misaligned or molded, which may result in poor inductor characteristics or variations. Therefore, the columnar convex portion of the tablet has to secure a certain thickness, and there is a limit to the reduction in size and the reduction in height by the method of Patent Document 1.

ところで、磁性粉末と樹脂を混合して得た磁性材含有樹脂を封止材として用いてコイルを内包するコア部を形成すれば閉磁路構造となる。磁束はコイルの芯部から外周部へコイルの周りを囲うようにコア部内を通過する。このようなコイルを内包するコア部の磁気飽和を考慮すると、コア部におけるコイルの外周部はコイルの芯部の面積と同等程度確保されていればよい。ここで図18に従来の製造方法で作成したコア部の上面透過図を示すと、コア部103は芯部の面積S1よりも外周部の面積S2が大きく形成されている。これは、従来の製造方法の場合ではタブレットの柱状凸部にある程度の厚みを確保しなければならず、それに伴ってコア部103の外周部の面積S2を必要以上に大きく形成せざるを得ないからである。そして、コア部を小型化しようとすればするほど、コイル自体のサイズは小さくできるのにも拘わらず、タブレットの柱状凸部の厚みは一定以上薄くできないためこの傾向は顕著になってゆく。   By the way, if the core part which encloses a coil is formed using the magnetic material containing resin obtained by mixing magnetic powder and resin as a sealing material, it will become a closed magnetic circuit structure. The magnetic flux passes through the core part so as to surround the coil from the core part of the coil to the outer peripheral part. In consideration of the magnetic saturation of the core part including such a coil, the outer peripheral part of the coil in the core part may be secured to the same extent as the area of the core part of the coil. Here, FIG. 18 shows a top transparent view of the core portion produced by the conventional manufacturing method. The core portion 103 has an outer peripheral area S2 larger than the core area S1. In the case of the conventional manufacturing method, a certain amount of thickness must be secured in the columnar convex portion of the tablet, and accordingly, the area S2 of the outer peripheral portion of the core portion 103 must be formed larger than necessary. Because. This tendency becomes more prominent as the size of the coil itself can be reduced as the core portion is made smaller, but the thickness of the columnar convex portion of the tablet cannot be reduced more than a certain value.

そこで本発明では、より小型の面実装インダクタの製造方法を提供することを目的とする。   Accordingly, an object of the present invention is to provide a method for manufacturing a smaller surface-mount inductor.

上記課題を解決するために本発明の面実装インダクタの製造方法は、成型金型を用いて樹脂と充填材とを含む封止材でコイルを封止する。封止材を平板形状の周縁部に柱状凸部を有する形状に予備成形してタブレットを形成する。断面が平角形状の導線を巻回してコイルを形成する。タブレットにコイルを載置し、コイルの両端部をタブレットの柱状凸部の外側側面に沿わせて成型金型に配置する。そして、コイルの両端部がタブレットの柱状凸部の外側側面と成型金型の内壁面との間に挟まれた状態でコイルと封止材を樹脂成形法もしくは圧粉成形法を用いて一体化させてコア部を形成する。コア部のコイルの両端部が露出する表面以外の少なくとも1つの表面を研磨もしくは切断してコア部をリサイズする。コア部の表面にコイルの両端部の少なくとも一部が露出する部分と接続する外部電極をコア部の表面または外周に設けることを特徴とする。   In order to solve the above-described problems, a method for manufacturing a surface-mount inductor according to the present invention uses a molding die to seal a coil with a sealing material including a resin and a filler. A tablet is formed by preforming the sealing material into a shape having columnar protrusions on the peripheral edge of a flat plate shape. A coil is formed by winding a conducting wire having a flat cross section. The coil is placed on the tablet, and both ends of the coil are arranged on the molding die along the outer side surface of the columnar convex portion of the tablet. The coil and the sealing material are integrated using a resin molding method or a powder molding method with both ends of the coil being sandwiched between the outer side surface of the columnar convex portion of the tablet and the inner wall surface of the molding die. To form a core part. The core part is resized by polishing or cutting at least one surface other than the surface where both ends of the coil of the core part are exposed. An external electrode connected to a portion where at least a part of both end portions of the coil is exposed on the surface of the core portion is provided on the surface or outer periphery of the core portion.

本発明の面実装インダクタの製造方法は、面実装インダクタの更なる小型化や低背化を実現する。もしくは、従来と同じサイズの面実装インダクタを作成すれば、従来よりも内蔵するコイルを大きくしたり、太い線材を選択することが可能となる。これより、直流抵抗の低減やインダクタンス値の向上などの面実装インダクタの特性向上を実現する。   The method for manufacturing a surface-mount inductor according to the present invention realizes further reduction in size and height of the surface-mount inductor. Alternatively, if a surface-mount inductor having the same size as the conventional one is created, it is possible to increase the size of the built-in coil or select a thick wire rod. As a result, improvement in characteristics of the surface mount inductor such as reduction of DC resistance and improvement of inductance value is realized.

本発明の第1の実施例で用いるコイルの斜視図である。It is a perspective view of the coil used in the 1st example of the present invention. 本発明の第1の実施例のコイルとタブレットと板状タブレットの配置を示す斜視図である。It is a perspective view which shows arrangement | positioning of the coil of 1st Example of this invention, a tablet, and a plate-shaped tablet. 本発明の第1の実施例の成型金型におけるコイルとタブレットの配置を示す上面図である。It is a top view which shows arrangement | positioning of the coil and tablet in the shaping die of the 1st Example of this invention. 本発明の第1の実施例の製造方法のコイルとタブレットを成型金型に配置する工程を説明する断面図であり、図3のA−B−C−D組み合わせ断面に対応する。It is sectional drawing explaining the process of arrange | positioning the coil and tablet of the manufacturing method of 1st Example of this invention to a shaping | molding die, and respond | corresponds to the ABCD combined cross section of FIG. 本発明の第1の実施例の製造方法のコア部の成形工程を説明する断面図であり、図3のA−B−C−D組み合わせ断面に対応する。It is sectional drawing explaining the formation process of the core part of the manufacturing method of the 1st Example of this invention, and respond | corresponds to the ABCD combined cross section of FIG. 本発明の第1の実施例のリサイズする前のコア部の斜視図である。It is a perspective view of the core part before resizing of the 1st Example of this invention. 本発明の第1の実施例のリサイズ後のコア部の上面透過図である。It is an upper surface penetration figure of the core part after resizing of the 1st example of the present invention. 本発明の第1の実施例のリサイズ後のコア部の斜視図である。It is a perspective view of the core part after the resizing of 1st Example of this invention. 本発明の第1の実施例の面実装インダクタの斜視図である。1 is a perspective view of a surface-mount inductor according to a first embodiment of the present invention. 本発明の第2の実施例で用いるコイルの斜視図である。It is a perspective view of the coil used in the 2nd example of the present invention. 本発明の第2の実施例のコイルとタブレットの配置を示す斜視図である。It is a perspective view which shows arrangement | positioning of the coil and tablet of 2nd Example of this invention. 本発明の第2の実施例の成型金型におけるコイルとタブレットの配置を示す上面図である。It is a top view which shows arrangement | positioning of the coil and tablet in the shaping die of the 2nd Example of this invention. 本発明の第2の実施例の製造工程の一部を説明する断面図であり、図12のA−B−C−D組み合わせ断面における各段階の様子を示す。It is sectional drawing explaining a part of manufacturing process of 2nd Example of this invention, and shows the mode of each step in the ABCD combined cross section of FIG. 本発明の第2の実施例のリサイズ前のコア部の斜視図である。It is a perspective view of the core part before resizing of the 2nd Example of this invention. 本発明の第2の実施例のリサイズ後のコア部の斜視図である。It is a perspective view of the core part after the resizing of 2nd Example of this invention. 本発明の第2の実施例の面実装インダクタの斜視図である。It is a perspective view of the surface mount inductor of the 2nd example of the present invention. 従来のタブレットを説明する斜視図である。It is a perspective view explaining the conventional tablet. 従来のコア部の上面透過図である。It is an upper surface penetration figure of the conventional core part.

以下に、図面を参照しながら、本発明の面実装インダクタの製造方法を説明する。   Below, the manufacturing method of the surface mount inductor of this invention is demonstrated, referring drawings.

(第1の実施例)
図1〜図9を参照しながら、本発明の面実装インダクタの製造方法の第1の実施例について説明する。まず、第1の実施例で用いるコイルについて説明する。図1に第1の実施例で用いるコイルの斜視図を示す。図1に示すように、平角線を両端部1bが最外周となるように2段の外外巻きに巻回して巻回部1aを形成してコイル1を得る。端部1bは巻回部1aを挟んで対向するように引き出されるようにした。
(First embodiment)
A first embodiment of a method for manufacturing a surface mount inductor according to the present invention will be described with reference to FIGS. First, the coil used in the first embodiment will be described. FIG. 1 shows a perspective view of a coil used in the first embodiment. As shown in FIG. 1, a coil 1 is obtained by winding a flat wire around two stages of outer and outer windings so that both end portions 1b are at the outermost periphery to form a wound portion 1a. The end portion 1b was pulled out so as to face each other with the winding portion 1a interposed therebetween.

次に、第1の実施例で用いる封止材について説明する。本実施例では封止材として、鉄系金属磁性粉末とエポキシ樹脂とを混合したものを用いる。この封止材を用いてタブレットを作成する。図2に第1の実施例のコイルとタブレットと板状タブレットの配置関係を示す。タブレット2と板状タブレット3は加圧成型で作成する。本実施例ではタブレット2の強度を高めるために、さらに熱処理をして封止材を半硬化状態とした。図2に示すように、タブレット2はコイル1を囲うように平面部の周縁に2つの柱状凸部2aを有する形状に形成する。コイル1の両端部1bは柱状凸部2aの外側側面に沿うように配置する。   Next, the sealing material used in the first embodiment will be described. In this embodiment, as the sealing material, a mixture of iron-based metal magnetic powder and epoxy resin is used. A tablet is produced using this sealing material. FIG. 2 shows the positional relationship among the coil, tablet, and plate tablet of the first embodiment. The tablet 2 and the plate-like tablet 3 are created by pressure molding. In this example, in order to increase the strength of the tablet 2, the heat treatment was further performed to make the sealing material semi-cured. As shown in FIG. 2, the tablet 2 is formed in a shape having two columnar convex portions 2 a on the periphery of the flat portion so as to surround the coil 1. Both end portions 1b of the coil 1 are arranged along the outer side surface of the columnar convex portion 2a.

次に、第1の実施例の製造方法のコイルとタブレットを成型金型へ配置する工程を説明する。図3と図4に成型金型におけるコイルとタブレットの配置について示す。なお、図4は図3のA−B−C−D組み合わせ断面に対応する断面図である。図3と図4に示すように、第1の実施例では割型ダイ4aと割型ダイ4bとからなるダイ4と、下型5と、パンチ6とを有する成型金型を用いる。この成型金型内にコイル1が配置されたタブレット2と、その上に板状タブレット3を装填する。このようにコイル1とタブレット2を配置すれば、コイル1はタブレット2の平面部の厚みによって成型金型内で適正な高さに配置される。そして、コイル1の両端部1bはタブレット2の柱状凸部2aとダイ4bの内壁面とで挟まれた状態となり、コイル1の両端部1bが適正な位置で固定される。そして、パンチ6をセットして成型金型を予熱する。本実施例では成型金型を封止材の軟化温度以上に予熱しており、タブレット2と板状タブレット3は軟化状態となるようにした。   Next, the process of arranging the coil and tablet of the manufacturing method of the first embodiment in a molding die will be described. 3 and 4 show the arrangement of coils and tablets in the molding die. FIG. 4 is a cross-sectional view corresponding to the cross section taken along the line ABCD in FIG. As shown in FIGS. 3 and 4, in the first embodiment, a molding die having a die 4 composed of a split die 4a and a split die 4b, a lower die 5 and a punch 6 is used. The tablet 2 in which the coil 1 is arranged in this molding die and the plate-like tablet 3 are loaded thereon. If the coil 1 and the tablet 2 are arranged in this way, the coil 1 is arranged at an appropriate height in the molding die depending on the thickness of the flat portion of the tablet 2. And the both ends 1b of the coil 1 will be in the state pinched | interposed by the columnar convex part 2a of the tablet 2, and the inner wall face of the die | dye 4b, and the both ends 1b of the coil 1 are fixed in an appropriate position. Then, the punch 6 is set and the mold is preheated. In this embodiment, the molding die is preheated to a temperature higher than the softening temperature of the sealing material, and the tablet 2 and the plate-like tablet 3 are in a softened state.

次に、第1の実施例の製造方法のコア部を形成する工程を説明する。図5に第1の実施例の製造方法のコア部の成形工程を説明する断面図を示す。なお、図5の断面は図3のA−B−C−D組み合わせ断面に対応する。図5に示すように、パンチ6を用いて加圧してタブレット2と板状タブレット3を一体化させ、封止材を硬化させる。このとき、タブレット2と板状タブレット3は軟化状態であり、容易にコイル1を封止する。そして、コイル1の両端部1bは位置ズレすることなく、少なくともその一部が封止材中に埋没した状態で封止される。そして封止材を硬化させて得たコア部7を成型金型から取り出す。図6に示すようにコア部7の表面にはコイル1の端部1bの平面が露出した状態となる。   Next, the process of forming the core part of the manufacturing method of the first embodiment will be described. FIG. 5 is a cross-sectional view for explaining a core part forming step of the manufacturing method of the first embodiment. In addition, the cross section of FIG. 5 respond | corresponds to the AB-C-D combined cross section of FIG. As shown in FIG. 5, pressurization is performed using a punch 6 to integrate the tablet 2 and the plate-like tablet 3, and the sealing material is cured. At this time, the tablet 2 and the plate-like tablet 3 are in a softened state, and the coil 1 is easily sealed. And the both ends 1b of the coil 1 are sealed in a state where at least a part thereof is buried in the sealing material without being displaced. And the core part 7 obtained by hardening a sealing material is taken out from a shaping die. As shown in FIG. 6, the surface of the end portion 1 b of the coil 1 is exposed on the surface of the core portion 7.

次に、コア部のリサイズ工程について説明する。図7と図8にリサイズした後のコア部を示す。図7と図8に示すように、第1の実施例ではコア部7のコイルの端部1bが露出していない2つの側面について研磨を行い、コア部7をリサイズした。このとき、図7に示すように、コア部7においてコイル1の外周部の面積S2をコイル1の芯部の面積S1までの範囲となるようにコア部7をリサイズすればよく、S1とS2が同等程度となるようにリサイズするのがさらに好ましい。   Next, the core size resizing process will be described. The core part after resizing is shown in FIG. 7 and FIG. As shown in FIGS. 7 and 8, in the first embodiment, the two side surfaces of the core portion 7 where the end portion 1 b of the coil is not exposed are polished, and the core portion 7 is resized. At this time, as shown in FIG. 7, in the core portion 7, the core portion 7 may be resized so that the area S2 of the outer peripheral portion of the coil 1 is in a range up to the area S1 of the core portion of the coil 1, and S1 and S2 It is more preferable to resize so as to be equivalent.

最後に、コア部7の表面に露出した端部1bと接続するように、コア部7の表面に導電性樹脂を塗布する。本実施例では端部1bが露出する2つの側面と底面の一部に印刷法を用いて対向するようにL字状に塗布した。続いて、めっき処理を行い外部電極8を形成して図9に示す面実装インダクタを得る。なお、めっき処理によって形成される電極は、Ni、Sn、Cu、Au、Pdなどから1つもしくは複数を適宜選択して形成すれば良い。   Finally, a conductive resin is applied to the surface of the core portion 7 so as to be connected to the end portion 1 b exposed on the surface of the core portion 7. In this embodiment, the two side surfaces where the end portion 1b is exposed and a part of the bottom surface are applied in an L shape so as to face each other using a printing method. Subsequently, plating is performed to form the external electrode 8 to obtain the surface mount inductor shown in FIG. Note that the electrode formed by plating may be formed by appropriately selecting one or a plurality of electrodes such as Ni, Sn, Cu, Au, and Pd.

(第2の実施例)
図10〜図16を参照して、本発明の面実装インダクタの製造方法の第2の実施例について説明する。第2の実施例では、第1の実施例で用いた封止材と同組成のものを用いる。なお、第1の実施例と共通する部分の説明は割愛する。
(Second embodiment)
With reference to FIGS. 10-16, the 2nd Example of the manufacturing method of the surface mount inductor of this invention is described. In the second embodiment, the same composition as that of the sealing material used in the first embodiment is used. The description of the parts common to the first embodiment is omitted.

まず、第2の実施例で用いるコイルについて説明する。図10に第2の実施例で用いるコイルの斜視図を示す。図10に示すように、コイル1は、平角線を2段の外外巻きに巻回して得る。端部1bはコイル1の同側面側に引き出されるようにした。   First, the coil used in the second embodiment will be described. FIG. 10 shows a perspective view of a coil used in the second embodiment. As shown in FIG. 10, the coil 1 is obtained by winding a rectangular wire around two stages of outer and outer windings. The end 1b was drawn out to the same side of the coil 1.

次に、第2の実施例で用いるタブレットについて説明する。図11に第2の実施例のコイルとタブレットの配置を説明する斜視図を示す。封止材を加圧成形を用いてタブレット12を作成する。本実施例ではタブレット12は未硬化状態のまま用いる。図11に示すように、タブレット12コイル11を囲うように平面部の周縁に柱状凸部12aを有する形状に形成する。コイル11の両端部11bは柱状凸部2aの外側側面に沿わせてタブレット12の同じ側面の引き出されるように配置する。   Next, the tablet used in the second embodiment will be described. FIG. 11 is a perspective view for explaining the arrangement of the coil and tablet of the second embodiment. The tablet 12 is created using pressure molding of the sealing material. In this embodiment, the tablet 12 is used in an uncured state. As shown in FIG. 11, it forms in the shape which has the columnar convex part 12a in the periphery of a plane part so that the tablet 12 coil 11 may be enclosed. Both end portions 11b of the coil 11 are arranged along the outer side surface of the columnar convex portion 2a so that the same side surface of the tablet 12 is pulled out.

次に、第2の実施例の製造方法のコイルとタブレットを成型金型へ配置する工程とコア部を形成する工程について説明する。図12に成型金型におけるコイルとタブレットの配置について示す。図13に第2の実施例の製造工程の一部を説明する断面図を示す。なお、図13の断面は図12のA−B−C−D組み合わせ断面に対応する。図12と図13(a)に示すように、第2の実施例では割型ダイ14aと割型1ダイ4bとからなるダイ14と、下型15と、パンチ16とを有する成型金型を用いる。この成型金型内にコイル11が配置されたタブレット12を装填する。   Next, the process of arranging the coil and tablet in the molding method of the second embodiment and the process of forming the core part will be described. FIG. 12 shows the arrangement of coils and tablets in the molding die. FIG. 13 is a sectional view for explaining a part of the manufacturing process of the second embodiment. The cross section of FIG. 13 corresponds to the cross section A-B-C-D of FIG. As shown in FIGS. 12 and 13A, in the second embodiment, a molding die having a die 14 composed of a split die 14a and a split die 1b 4b, a lower die 15 and a punch 16 is used. Use. The tablet 12 in which the coil 11 is arranged is loaded into this molding die.

次に図13(b)に示すように、コイル11とタブレット12の上に所定量秤量した粉末状封止材13を投入し、パンチ16をセットする。本実施例では粉末状封止材として、タブレット12を作成したときと同組成の封止材を粉末状にしたものを用いた。そして、粉末状封止材はタブレットと同様に未硬化、または半硬化状態に成形すれば良い。   Next, as shown in FIG. 13 (b), a predetermined amount of the powdery sealing material 13 is put on the coil 11 and the tablet 12, and the punch 16 is set. In this example, a powdery sealing material having the same composition as that of the tablet 12 was used. And a powdery sealing material should just shape | mold to a non-hardened or semi-hardened state similarly to a tablet.

次に図13(c)に示すように、パンチ16を用いて圧粉成形法にてタブレット12と粉末状封止材13を一体化させコア部17を形成する。このとき、タブレット12は再成形されて、粉末状封止材13とともにコイル11を封止する。そして、コイル11の端部11bは位置ズレすることなく、少なくともその一部がコア部17中に埋没した状態で封止される。封止材を硬化させた後成型金型から取り出し、図14に示すコア部17を得る。本実施例のコア部は、図14に示すようにコア部17の1つの側面にコイル11の端部11bの平面が露出した状態となる。   Next, as shown in FIG.13 (c), the tablet part 12 and the powdery sealing material 13 are integrated by the compacting method using the punch 16, and the core part 17 is formed. At this time, the tablet 12 is reshaped to seal the coil 11 together with the powdery sealing material 13. The end portion 11 b of the coil 11 is sealed with at least a portion thereof buried in the core portion 17 without being displaced. After the sealing material is cured, it is taken out from the molding die to obtain the core portion 17 shown in FIG. As shown in FIG. 14, the core portion of the present embodiment is in a state where the plane of the end portion 11 b of the coil 11 is exposed on one side surface of the core portion 17.

次に、コア部のリサイズ工程について説明する。図15にリサイズ後のコア部の斜視図を示す。第2の実施例ではコア部17のコイルの端部11bが露出していない3つの側面と上下面について切断を行い、コア部17をリサイズした。本実施例では、コア部の更なる小型化とともに低背化を実現する。このとき、切除される側面は、第1の実施例と同様に、コイルの外周部の面積をコイルの芯部の面積までの範囲となるようにコア部をリサイズすればよい。そして、上下面に対しては磁束の通過する最小の断面積分を確保すればよく、コイルの芯部の周囲長にコイルから上面または底面の高さを積した面積が、コイルの芯部の面積と同等以上あれば良い。本実施例の場合では、楕円の芯部の周囲長とコイルから上面または底面までの高さの積が、コイルの芯部の面積と等しくなるようにコア部を切除した。   Next, the core size resizing process will be described. FIG. 15 is a perspective view of the core portion after resizing. In the second embodiment, the core portion 17 is resized by cutting the three side surfaces and the upper and lower surfaces where the end portion 11b of the coil of the core portion 17 is not exposed. In the present embodiment, the core portion is further reduced in size and reduced in height. At this time, similarly to the first embodiment, the side surface to be cut may be resized so that the area of the outer peripheral portion of the coil is in the range up to the area of the core portion of the coil. In addition, it is sufficient to ensure the minimum cross-sectional integral through which the magnetic flux passes for the upper and lower surfaces, and the area obtained by multiplying the circumference of the coil core by the height of the top surface or the bottom surface from the coil is the area of the coil core. Equivalent to or better than. In the case of this example, the core portion was cut so that the product of the circumference of the elliptical core portion and the height from the coil to the top surface or the bottom surface was equal to the area of the core portion of the coil.

最後に、端部1bと接続するように、コア部17の表面に導電性樹脂を塗布する。続いて、めっき処理を行い外部電極18を形成して図16に示す面実装インダクタを得る。   Finally, a conductive resin is applied to the surface of the core portion 17 so as to be connected to the end portion 1b. Subsequently, a plating process is performed to form the external electrode 18 to obtain the surface mount inductor shown in FIG.

上記実施例では、封止材として充填物に鉄系金属磁性粉末、樹脂にエポキシ樹脂を用いた。鉄系金属磁性粉末を用いることで直流重畳特性の優れた表面実装インダクタを作製することができる。しかしながら、これに限らず例えば、充填物としてフェライト系磁性粉末やガラス粉末などを用いても良い。そして、樹脂としてポリイミド樹脂やフェノール樹脂などの熱硬化性樹脂やポリエチレン樹脂やポリアミド樹脂などの熱可塑性樹脂を用いても良い。また、フェライトコアなどの異種材料を用いたコアを組み合わせてコア部を形成しても良いが、研磨等を行う際に同一の材料でコア部の表面を形成しておいた方が、コア部にかかる応力が均一になるため加工性に優れる。   In the said Example, the iron-type metal magnetic powder was used for the filler as a sealing material, and the epoxy resin was used for resin. By using iron-based metal magnetic powder, a surface-mount inductor having excellent DC superposition characteristics can be produced. However, not limited to this, for example, ferrite magnetic powder or glass powder may be used as the filler. Further, a thermosetting resin such as a polyimide resin or a phenol resin, or a thermoplastic resin such as a polyethylene resin or a polyamide resin may be used as the resin. In addition, the core part may be formed by combining cores using different materials such as ferrite cores. However, when the surface of the core part is formed of the same material when polishing or the like, Since the stress applied to is uniform, it is excellent in workability.

上記実施例ではコイルとして2段の外外巻きに巻回した空芯コイルを用いたが、これに限らず、例えばエッジワイズ巻きなどの巻回方法や円形や矩形、台形などの形状のコイルを用いても良い。   In the above embodiment, an air-core coil wound in two stages of outer and outer windings is used as the coil. However, the present invention is not limited to this. For example, a winding method such as edgewise winding or a coil having a circular, rectangular, or trapezoidal shape is used. It may be used.

第1の実施例において、板状タブレットを用いたが、板状に限ることなくT型やE型などの形状に予備成形しても良い。また、未硬化状態ではなく半硬化状態でも良い。そして、その成形方法も加圧成形法やシート状成形物から切り出すなど用途に合わせて適宜選択すれば良い。   In the first embodiment, a plate-like tablet is used, but it may be preformed into a shape such as a T shape or an E shape without being limited to a plate shape. Moreover, not a non-hardened state but a semi-hardened state may be sufficient. The molding method may be appropriately selected according to the application such as a pressure molding method or cutting out from a sheet-like molded product.

1、11:コイル(1a、11a:巻回部、1b、11b:端部)
2、12:タブレット
3:板状タブレット
4、14:ダイ(4a、4b、14a、14b:割型ダイ)
5、15:下型
6、16:パンチ
7、17:コア部
8、18:外部電極
13:粉末状封止材
1, 11: Coil (1a, 11a: winding part, 1b, 11b: end part)
2, 12: Tablet 3: Plate-shaped tablet 4, 14: Die (4a, 4b, 14a, 14b: Split die)
5, 15: Lower mold 6, 16: Punch 7, 17: Core part 8, 18: External electrode 13: Powdery sealing material

Claims (3)

成型金型を用いて樹脂と充填材とを含む封止材でコイルを封止した面実装インダクタの製造方法において、
該封止材を平板形状の周縁部に柱状凸部を有する形状に予備成形してタブレットを形成する工程と、
断面が平角形状の導線を巻回して該コイルを形成する工程と、
該タブレットに該コイルを載置し、該コイルの両端部を該タブレットの柱状凸部の外側側面に沿わせて該成型金型に配置する工程と、
該コイルの両端部が該タブレットの柱状凸部の外側側面と該成型金型の内壁面との間に挟まれた状態で該コイルと該封止材を樹脂成形法もしくは圧粉成形法を用いて一体化させてコア部を形成する工程と、
該コア部の該コイルの両端部が露出する表面以外の少なくとも1つの表面を研磨もしくは切断して該コア部をリサイズする工程と、
該コア部の表面に該コイルの両端部の少なくとも一部が露出する部分と接続する外部電極を該コア部の表面または外周に設ける工程を有する面実装インダクタの製造方法。
In a method for manufacturing a surface mount inductor in which a coil is sealed with a sealing material including a resin and a filler using a molding die,
A step of preforming the sealing material into a shape having a columnar convex portion at a peripheral edge portion of a flat plate shape to form a tablet;
Forming a coil by winding a conducting wire having a flat cross section; and
Placing the coil on the tablet, placing both ends of the coil along the outer side surface of the columnar convex portion of the tablet in the mold,
Using the resin molding method or the powder molding method for the coil and the sealing material with both end portions of the coil being sandwiched between the outer side surface of the columnar convex portion of the tablet and the inner wall surface of the molding die And forming a core part by integrating them,
Polishing or cutting at least one surface of the core portion other than the surface where both ends of the coil are exposed, and resizing the core portion;
A method for manufacturing a surface-mount inductor, comprising a step of providing, on the surface or outer periphery of the core portion, an external electrode connected to a portion where at least a part of both ends of the coil is exposed on the surface of the core portion.
前記充填材が磁性粉末であることを特徴とする請求項1に記載の面実装インダクタの製造方法。   The method for manufacturing a surface-mount inductor according to claim 1, wherein the filler is magnetic powder. 前記コア部をリサイズする工程において、
前記コア部における前記コイルの外周部の面積が前記コイルの芯部の面積よりも小さくならないように該コア部をリサイズすることを特徴とする請求項1または請求項2に記載の面実装インダクタの製造方法。
In the step of resizing the core part,
3. The surface-mount inductor according to claim 1, wherein the core portion is resized so that an area of an outer peripheral portion of the coil in the core portion is not smaller than an area of a core portion of the coil. Production method.
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