JP2013179272A - Solar battery module manufacturing method and resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a solar battery module efficiently by using a resin composition layer smaller in thickness than a conventionally used filling resin sheet to restrict material costs and eliminate the yield problem in a resin encapsulation process, and by cutting back on complicated work such as alignment between solar battery cells and wiring members and alignment in the resin encapsulation process, as well as a resin composition used in the solar battery module.SOLUTION: The solar battery module manufacturing method includes a process in which a resin composition coated layer is formed by using a resin composition, which is then turned into a B stage to form a resin composition layer. The solar battery module includes at least a solar battery cell, a resin composition layer, and a first solar battery back sheet having a first wiring member on the surface thereof in that order. The solar battery cell includes an electrode on at least the reverse side thereof which is opposite to the light receiving face at which sunlight is received, and the reverse side of the solar battery cell and the surface of the first solar battery back sheet on which the first wiring member is had are opposed to each other.

Description

  The present invention relates to a method for producing a solar cell module and a resin composition.

  The solar cell module is generally a step of electrically connecting the wiring member and the conductive layer by forming a conductive layer made of a conductive member on an electrode called a bus bar arranged on the light receiving surface and the back surface of the solar cell. The solar battery cell connected to the wiring member is sandwiched between a glass sheet and a solar battery back sheet, and is manufactured through a process of resin-sealing the inside.

  So far, ethylene vinyl acetate copolymer resin has been used for sealing the entire solar cell, bonding between the solar cell and the wiring member, and bonding between the solar cell and the back sheet for solar cell. Filling resin sheets containing as a main component have been used.

With the rapid spread of solar cells, the cost reduction of solar cell module production has become a major proposition, and there is a strong demand for reduction of material costs used in solar cell modules, simplification and shortening of assembly processes. Yes. However, for example, the method for connecting the wirings with a conductive adhesive including a conductive member as described in Patent Documents 1 to 4 has the following problems. For example, when filling between the solar cell and the wiring member with the filling resin sheet, the filling resin sheet is molded into a pattern shape with a mold or the like so as to avoid the solar cell electrode. The electrode pattern of the battery cell must be aligned and bonded together, and the operation has been extremely complicated.
Moreover, the resin sealing process which seals a solar cell with resin often performs a several cell collectively from process efficiency, and the filling resin supplied with a sheet form becomes very big. For this reason, there have been problems in that process errors frequently occur in molding using a mold, and the yield decreases. Further, since the sheet is enormous, it is difficult to align after molding, and there is also a problem that the yield decreases even in this step.

Furthermore, the thickness of the filling resin sheet is as thick as 200 to 500 μm, which is a cause of various problems. For example, the volume of the filling resin occupying in the module increases and the material cost increases. Furthermore, since other members, for example, the conductive material layer, need to be applied by adjusting the thickness according to the thickness of the filling resin sheet, the material cost related to the other members due to the thick filling resin sheet. In addition, there is a problem that the manufacturing cost may increase.
Further, since the sheet is supplied in the form of a sheet, a sheet having a different thickness must be prepared for each film thickness design, and there is a problem that management in the manufacturing process tends to be complicated.

  By the way, a resin composition to be applied by printing, for example, as a printing die bond material for a junction coating film for power devices in semiconductor applications, a stress relaxation material for wafer level CSP, or for the purpose of reducing manufacturing costs, for example, for screen printing Resin compositions are known. In these applications, the coating film of the resin composition is generally B-staged by heat drying, and then cured by further heating. For example, as a screen printing ink composition capable of forming a high-definition pattern, a screen printing ink composition containing at least a binder component and fine particles dispersed in the binder component is known ( For example, see Patent Document 5).

  In the application of a resin composition applied by a printing method, for example, a resin composition for die bonding used in a printing die bond material is obtained by applying a resin composition on a support substrate by a screen printing method, and applying the applied resin composition. B-stage is performed by heating in an oven and drying the solvent. Next, a semiconductor chip is pressure-bonded to the B-staged resin composition, and the resin composition is further cured by heating in an oven.

  However, when a resin composition is used by the above method, heating time is required to dry the solvent in the resin composition. On the other hand, if the heating time is shortened, drying of the solvent in the resin composition becomes insufficient, which may lead to generation of voids, contamination of the semiconductor chip, and insufficient curing. Therefore, it has been difficult to achieve both reduction in process time and package reliability.

JP 2000-286436 A JP 2001-357897 A Japanese Patent No. 3448924 JP 2005-101519 A JP 2003-238876 A

The object of the present invention has been made in view of such a problem, and it is thinner than a conventionally used filling resin sheet, and a solar cell module can be assembled by a layer using a resin composition. It is providing the manufacturing method of a solar cell module.
In addition, the object of the present invention is to provide a resin composition that can be applied by a printing method, so that there is no problem of yield in the resin sealing step, alignment between the solar cell and the wiring member, and a resin sealing step. It is to provide a resin composition and a method for manufacturing a solar cell module, which can reduce troublesome operations such as alignment in the process and greatly shorten the process time.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors have found that the problem can be solved by the following invention. That is, this invention provides the manufacturing method of the following solar cell module, the cell for solar cells, and the resin composition.

1. The solar cell has at least a solar cell, a resin composition layer, and a first solar cell back sheet having a first wiring member on the surface thereof, the solar cell having at least the following steps: The solar cell module has an electrode on the back surface opposite to the light receiving surface that receives light, and the back surface and the surface including the first wiring member of the first solar cell back sheet are opposed to each other. Production method.
Step (1) The resin composition is formed by screen printing on the back surface of the solar cell cell or the surface of the first solar cell back sheet having the first wiring member so as to have a through hole corresponding to the electrode. Step of forming the first resin composition coating layer to be applied (2) B-stage forming step 2 of forming the first B-staged resin composition layer by converting the first resin composition coating layer into a B-stage . 2. The production method according to 1 above, comprising the following step (3) after the step (1) and before the step (2) or after the step (2).
Step (3) Conductive layer formation in which a first conductive layer for connecting the electrode and the first wiring member of the first solar cell back sheet is formed in the through hole using a conductive member. Step 3. Furthermore, the manufacturing method of said 1 which has the following processes.
Step (1 ′) Step of forming a third resin composition coating layer for applying the resin composition over the entire light-receiving surface of the solar cell cell Step (2 ′) B of the third resin composition coating layer 3. B-stage forming step for forming a third resin composition layer by staging The solar cell module further includes a second resin composition layer on the light receiving surface of the solar cell and a second solar cell front sheet having a second wiring member on the surface thereof. It has in order that the light-receiving surface of the cell and the surface provided with the second wiring member of the front sheet for the second solar cell face each other, and the cell for solar cell also has an electrode on the light-receiving surface The manufacturing method of said 1 or 2 which has the following processes.
Step (1 ″) Step of forming a second resin composition coating layer (2) by applying the resin composition to the light receiving surface of the solar cell by screen printing so as to have a through hole corresponding to the electrode. '') B-stage forming step of forming the second resin composition layer by forming the second resin composition coating layer into a B-stage. The production according to 4 above, which has the following step (3 '') after the step (1 '') and before the step (2 '') or after the step (2 '') Method.
Step (3 ″) A conductive layer forming step of forming a second conductive layer for connecting the electrode and the wiring member in the through hole using a conductive member. (A) a photopolymerizable component, (B) a photopolymerization initiator, (C) a thermopolymerizable component, (D) a thermosetting agent, (E) a filler, and (F) a thermoplastic resin, The content of the component (A), the component (C), and the component (F) with respect to the total amount of the component, the component (C), and the component (F) is 10 to 70% by mass, and 5 to 70% by mass, respectively. And the content of the component (B) is 3 to 10 parts by mass with respect to 100 parts by mass of the component (A), and the content of the component (D) is the (C ) 0.01-20 parts by mass with respect to 100 parts by mass of the component, and the content of the (E) component is 100 parts by mass of the total amount of the (A) component, the (C) component, and the (F) component. 2 to 50 parts by weight with respect to parts, the tackiness after B-stage heat treatment or exposure is not more than 4.9 × 10 ⁴ Pa, the B-stage Curing reaction starting temperature resin composition is 0.99 ° C. or less of a resin obtained composition.

According to the present invention, a layer using a resin composition, which is thinner than a conventionally used resin sheet for filling, suppresses material costs, eliminates the problem of yield in the resin sealing process, and allows cells and wiring for solar cells. A complicated operation such as alignment with a member and alignment in a resin sealing process can be reduced, and a solar cell module can be manufactured more efficiently.
Further, according to the present invention, a resin composition that can significantly reduce the time required for the B-stage and can greatly reduce the process time can be obtained. And in the manufacturing method of the solar cell module of this invention, a solar cell module can be manufactured still more efficiently by using the resin composition of this invention.

It is the figure which represented typically the light-receiving surface of the cell for solar cells. It is the figure which represented the back surface of the cell for solar cells typically. It is the figure which represented typically the screen printing plate at the time of screen-printing a resin composition. It is sectional drawing of the formation process of the resin composition coating layer which apply | coats a resin composition to the cell for solar cells by screen printing. It is sectional drawing of the cell for solar cells after apply | coating the resin composition by screen printing. It is sectional drawing of the cell for solar cells after apply | coating an electroconductive member on the electrode of the cell for solar cells with a resin composition of FIG. It is a schematic diagram when the cell for solar cells of FIG. 6 is seen from the back surface. It is the schematic diagram after connecting a wiring member to the conductive layer of the cell for solar cells shown in FIG. It is the figure which represented typically the cross section in the (A) line | wire described in FIG. It is sectional drawing after resin-sealing the cell for solar cells which connected the wiring member of FIG. 9 using the glass sheet, the resin sheet for filling, and the back sheet for solar cells. FIG. 6 is a cross-sectional view after the resin sealing step and the connecting step are performed in a lump without performing the connecting step between the conductive layer and the wiring member in the solar cell shown in FIG. 5. It is a schematic diagram of the back sheet for solar cells which installed the wiring member in the back sheet for solar cells previously. It is a schematic diagram of the back sheet for solar cells after apply | coating an electroconductive member on the wiring member of the back sheet for solar cells with a wiring member of FIG. It is sectional drawing of the solar cell module assembled using the back sheet for solar cells with a wiring member of FIG. It is the schematic diagram after connecting a conductive layer and a wiring member in case the cell for solar cells has an electrode in a light-receiving surface and a back surface.

[Method for manufacturing solar cell module]
The method for manufacturing a solar cell module of the present invention comprises at least a solar cell, a resin composition layer, and a first solar cell back sheet having a first wiring member on the surface thereof, and the solar cell. The cell has an electrode on at least the back surface opposite to the light receiving surface that receives sunlight, and the back surface is opposed to the surface having the first wiring member of the back sheet for the first solar cell. , A method for producing a solar cell module, wherein the resin composition is formed by screen printing on the back surface of the cell for solar cell or the surface of the first solar cell back sheet having the first wiring member, Step of forming the first resin composition coating layer to be applied so as to have a through hole corresponding to the electrode, and Step (2) B resinating the first resin composition coating layer to form the first resin composition Has a B-stage process to form layers It is characterized in.
Hereinafter, a preferred embodiment of a method for producing a solar cell module according to the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiments.

[Step (1)]
In the step (1), the resin composition is formed by screen printing on the back surface of the solar cell or the surface of the first solar cell back sheet having the first wiring member, and the through hole corresponding to the electrode is provided. It is the formation process of the 1st resin composition coating film layer apply | coated.
The solar cell converts light incident on the light receiving surface as shown in FIG. 1 into electric power inside the solar cell module, and the generated electric power is opposite to the light receiving surface of the cell shown in FIG. It is recovered from the electrode 02 arranged on the rear surface of the side or the electrode 01 arranged on the light receiving surface shown in FIG. The solar cell is typically a silicon wafer. A circuit may already be formed in the solar cell.

  In the first resin composition coating layer forming step, the resin composition is formed by screen printing on the back surface of the solar cell cell or on the surface of the first solar cell back sheet having the first wiring member. Printed. In the present invention, the first resin composition is formed by applying the resin composition to the back surface of the solar cell so that the resin composition layer 07 applied as shown in FIG. 5 is fixed to the back surface of the solar cell. It is preferable to provide a physical coating layer.

  The first resin composition coating layer provided by screen printing the resin composition on the back surface of the solar cell shown in FIG. 2 is a through hole corresponding to the electrode 02 provided on the back surface of the solar cell. A layer provided on the entire surface of the region other than the electrode 02 or a part thereof. At this time, it is preferable that the area | region where an electrode does not exist and the area | region of the 1st resin composition coating film layer formed by apply | coating a resin composition correspond. Since the electric power generated in the solar cell can be effectively utilized from the electrode 02 to the first wiring member through the first conductive layer, it is preferable from the viewpoint of power loss. On the other hand, when the positional accuracy and yield in the subsequent formation process of the first conductive layer are taken into consideration, the region where no electrode exists and the region of the first resin composition coating layer may not exactly match. That is, the first conductive layer may be provided so as to protrude from the region of the electrode 02, the resin composition layer may protrude from the inside of the electrode region, or the conductive member and the resin composition layer may be in contact with each other. You don't have to. Therefore, the “through-hole corresponding to the electrode” in the present invention may be provided so that the electrode 02 and the first wiring member pass through the first conductive layer, and may coincide with the electrode 02. Further, it may be formed so as to protrude from the region of the electrode 02, or may protrude from the region of the electrode 02.

  In this invention, a 1st resin composition coating-film layer is a resin composition by screen printing on the back surface of the cell for solar cells, or the surface which comprises the 1st wiring member of the back sheet for 1st solar cells. It is provided by coating. By providing the first coating layer in this way, when using a filled resin sheet, it is necessary to perform two steps of positioning after drilling a through hole with a mold or the like, and then bonding, Since the first coating layer is formed by applying the resin composition at a predetermined position using the aligned screen printing plate, it is possible to integrate the alignment and the formation of the first coating layer. Thus, the solar cell module can be manufactured more efficiently.

The screen printing employed in the present invention is roughly divided into two, and any method may be used. The first screen printing method is a method using a so-called metal printing plate provided with a patterned opening on a flat metal plate. Here, the patterned opening is an opening other than a region where a through hole is to be provided in the first resin composition coating layer.
In this method using a metal printing plate, a metal printing plate is set on the object to be printed, preferably on the back surface of a solar cell, and the resin composition mounted on the metal printing plate is swept with a metal plate called a squeegee. Thus, the resin composition is applied onto an object to be printed, and a pattern of the first resin composition coating layer is formed. By this step, the resin composition is applied onto the solar cell according to the shape of the opening pattern provided on the metal printing plate.

As another screen printing method, a mesh prepared by knitting a thread of stainless steel, nylon, polyester, etc., where a portion not applied, that is, a portion corresponding to the through hole corresponding to the electrode 02, is filled with a resin or the like. There is a construction method using a so-called mesh printing plate. FIG. 3 shows a schematic diagram of the mesh printing plate, and FIG. 4 shows a cross-sectional view of the first resin composition coating layer forming step by screen printing using the mesh printing plate.
In the screen printing using the mesh printing plate, as shown in FIG. 4, the resin composition 07 mounted on the mesh printing plate is swept with a resin or metal plate called a scraper, and the resin composition 07 is a mesh printing plate. Infiltrate the openings 05 not filled with the resin, and then sweep over the mesh printing plate using a squeegee 06 made of polyurethane or silicone rubber. By this step, as shown in FIG. 5, the resin composition 07 that has permeated into the opening 05 is transferred to a region other than the electrode 02 of the solar battery cell to form a pattern.

In the present invention, the resin composition can be selectively applied only to a desired position and region, regardless of whether it is screen printing using a metal printing plate or a mesh printing plate. The material yield is excellent.
When screen printing using a metal printing plate is attempted to perform printing in a relatively wide range, since there is no member in the opening 05, no stress is generated from the printing plate against the pressure of the squeegee 06 in the opening 05. Therefore, the pressure concentrates on the center of the squeegee 06, the central portion of the squeegee 06 is strongly pushed into the opening 05, and the film thickness tends to decrease at the center of the opening 05. That is, generally, the wider the opening portion 05, the stronger the central portion of the squeegee 06 is pushed, and the coating thickness at the center tends to decrease. In addition, when a metal printing plate is used in a region other than the electrode as shown in FIG. 2, it is physically impossible to produce a printing plate that matches the electrode, and it may be difficult to apply depending on the electrode pattern. There is a case.

On the other hand, in screen printing using a mesh printing plate, since there is a mesh yarn in the opening portion 05, stress from the mesh printing plate with respect to the pressure of the squeegee 06 is generated. That is, even in the center portion of the squeegee 06, the mesh yarn in the opening 05 functions as a support member, so that the squeegee 06 is not strongly pushed into the opening 05. For this reason, a film thickness does not fall also in the center part of the squeegee 06, and a uniform 1st resin composition coating-film layer can be obtained.
In the present embodiment, mesh printing is performed from the viewpoint of providing the first resin composition coating layer (and the first resin composition layer) having a uniform film thickness over a relatively wide range of the entire surface of the solar cell. Screen printing using a plate is preferred.

[Step (2)]
Step (2) is a B-staging step in which the first resin composition coating layer formed in step (1) is B-staged to form the first resin composition layer.
The first resin composition coating layer is preferably B-staged by heat treatment or exposure treatment. For example, the 1st resin composition coating layer provided in the back surface of the cell for solar cells can be B-staged using oven or exposure apparatus, and a 1st resin composition layer can be formed.
In the present invention, many cells for solar cells are composed of members having different thermal elongation characteristics, and considering the possibility of warping and damage due to heating, it is preferable to perform B-stage by exposure processing.

The heat treatment can be performed using, for example, an oven. The temperature condition in the oven is preferably 160 to 180 ° C, more preferably 80 to 150 ° C. Further, the heating time is preferably 10 to 240 minutes, more preferably 60 to 240 minutes. By heating under such conditions, the first resin composition layer can be obtained efficiently and reliably to be B-staged.
The exposure process can be performed using, for example, an exposure apparatus equipped with a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, a carbon arc lamp, or the like as an ultraviolet ray source. The cumulative amount of ultraviolet (UV) light is preferably about 400 to 1500 mJ / cm ² , more preferably 800 to 1200 mJ / cm ² . By performing the exposure treatment under such conditions, it becomes possible to obtain a first resin composition layer by efficiently and reliably forming a B stage.

The first resin composition layer is preferably a layer having low tackiness suitable for the conductive layer forming step described later and adhesiveness that provides sufficient reliability in the resin sealing step. From such a viewpoint, the tack force at 30 ° C. of the first resin composition layer is preferably 4.9 × 10 ⁴ Pa or less, and more preferably 1.96 × 10 ⁴ Pa or less. 0.98 × 10 ⁴ Pa or less is more preferable. By setting it as the said range, it can confirm that the 1st resin composition layer was B-staged.
Moreover, since the tack force at 30 ° C. is 4.9 × 10 ⁴ Pa or less, the adhesiveness of the surface of the resin composition layer at room temperature (15 ° C. to 35 ° C., the same shall apply hereinafter) can be suppressed. The handleability in the conductive layer forming step can be improved.

Here, the said tack force is a thing after carrying out B-stage by heat processing or exposure processing, and is the value measured as follows.
The resin composition is applied by screen printing onto a support member such as a glass epoxy substrate, a silicon wafer, or a back sheet, and the resulting coating film is made into a B stage. When B-stage is formed by heat treatment, the resin composition applied to the support member is B-staged by heating in an oven at 80 ° C. for 4 hours. When the B stage is formed by exposure processing, the B composition is formed by exposing the resin composition applied to the support member under the condition of a light amount of 1000 mJ / cm ² . Thereafter, using a probe tacking tester (manufactured by Reska), the probe diameter was 5.1 mm, the peeling speed was 10 mm / s, the contact load was 9.8 × 10 ³ Pa, and the contact time was 1 s, 30 The tack force on the surface of the resin composition layer at ° C is measured, and the measured value is taken as the tack force.

<Resin composition>
The resin composition used in this step is preferably a resin composition having adhesiveness to the adherend after being B-staged. By forming a first resin composition coating layer using such a resin composition and making it into a B-stage, volatilization of the solvent in the first resin composition coating layer, and the resin composition Partial curing of the curable resin component in the product occurs. And the 1st resin composition layer formed by making into B stage is a layer which has low adhesiveness suitable in the conductive layer formation process mentioned below, and adhesiveness which brings sufficient reliability in the resin sealing process, Because it becomes.

From such a viewpoint, in the production method of the present invention, the resin composition includes (A) a photopolymerizable component, (B) a photopolymerization initiator, (C) a thermopolymerizable component, (D) a thermosetting agent, (E) a filler, and (F) a thermoplastic resin, and the component (A), the component (C), and the component (A) relative to the total amount of the component (A), the component (C), and the component (F) F) The content of the component is 10 to 70% by mass, 5 to 70% by mass, and 5 to 40% by mass, respectively, and the content of the (B) component is 3 with respect to 100 parts by mass of the (A) component. 10 parts by mass, the content of the component (D) is 0.01-20 parts by mass with respect to 100 parts by mass of the component (C), and the content of the component (E) is the component (A). 2 to 50 parts by mass with respect to 100 parts by mass of the total amount of the component, the component (C), and the component (F). Tackiness (hereinafter, sometimes simply referred to as the tackiness of the resin composition.) After turned into is not more than 4.9 × 10 ⁴ Pa, the curing reaction starting temperature of the resin composition obtained by the B-stage is It is preferable to use a resin composition having a temperature of 150 ° C. or lower.

The tack force of the resin composition is 4.9 × 10 ⁴ Pa or less. Here, the tack force of the resin composition is measured by the same measurement method as the tack force after being B-staged by the above heat treatment or exposure treatment. Within this range, when an operator or another member touches the surface of the resin composition layer during work, it is difficult to bond, and excellent work efficiency can be obtained. Also, from the viewpoint of workability when applying other members to the exposed portion of the substrate on the surface of the resin composition layer or in the surface of the resin composition layer, it should be 3.92 × 10 ⁴ Pa or less. Is preferred.

Moreover, it is preferable that the curing reaction start temperature of the resin composition after being B-staged by exposure treatment is 150 ° C. or lower. By setting the curing reaction start temperature to 150 ° C. or lower, heat curing can be performed at a low temperature, so that heat resistance is not required for the material used in combination with the resin composition, and the range of material selection is sufficiently expanded. Can do. The curing reaction start temperature is preferably 120 ° C. or less from the viewpoint of shortening the curing time and improving productivity, and is preferably 100 ° C. or less from the viewpoint of outgas reduction and safety.
As a method of setting the curing reaction start temperature to 150 ° C. or lower, for example, the use of a thermal polymerization initiator that cures at 150 ° C. or lower can lower the curing start temperature.

In the present invention, the curing reaction start temperature of the resin composition is measured as follows. First, a resin composition (A) and a resin composition (B _t ) (t is a curing temperature) which has been B-staged by exposure treatment and then cured by heating for 5 minutes are subjected to an inspection scanning calorimeter (DSC). Using TA Instrument Japan, measurement is performed at a heating rate of 5 ° C./min, and the reaction rate is calculated from the obtained exothermic peak area using the following formula.
Reaction rate in curing reaction at t ° C. for 5 minutes = (((A) peak area) − ((B _t ) peak area)) / ((A) peak area)
The curing temperature at which the reaction rate in the curing reaction at t ° C. for 5 minutes is 80% or more is defined as the curing start temperature.

  The resin composition is preferably used for pattern printing by screen printing. As a characteristic of such a resin composition, the viscosity at 25 ° C. of the resin composition is preferably 1 to 80 Pa · s. In addition, when a mesh or the like is stretched at the mask opening, such as a screen mesh plate, it is more preferably 10 to 60 Pa · s from the viewpoint of detachment of the mesh portion, and from printing to B stage. From the viewpoint of shape retention, it is more preferably 15 to 50 Pa · s. When the viscosity is 1 Pa · s or more, when the resin composition is supplied and applied by screen printing, the occurrence of dripping can be suppressed and the printed shape tends to be maintained. Further, by setting the viscosity to 80 Pa · s or less, it is possible to sufficiently suppress printing defects and rubbing when supplying and applying by screen printing.

  Further, as a characteristic of the resin composition preferably used for pattern printing by screen printing, the thixotropy index is preferably 1.0 to 8.0, and 1.5 to 8.0 from the viewpoint of preventing printing defects and blurring. More preferably, it is more preferably 2.0 to 4.0 from the viewpoint of patterning properties.

  When the thixotropy index is 1.0 or more, when the resin composition is supplied and applied by screen printing, it is possible to suppress the occurrence of dripping and to maintain the printed shape. In addition, by setting the thixotropy index to 8.0 or less, chipping or rubbing of printing can be sufficiently suppressed when supplying and applying by screen printing. From the viewpoint of obtaining a resin composition capable of screen printing and obtaining a good printed shape, the resin composition has a viscosity of 1 to 80 Pa · s at 25 ° C. and a thixotropic index of 1.0 to 8 0.0 is preferred.

  In the present invention, the viscosity at 25 ° C. is measured as follows. Using a viscometer (“HBDV-III U CP (model number)”, manufactured by Brookfield Engineering Laboratories) and a cone spindle (“CPE-51 (model)”, manufactured by Brookfield Engineering Laboratories)), 0.5 mL of resin composition The measurement is performed with a measurement time of 3 minutes. The viscosity value of the present invention is the value measured at a rotational speed of 5.0 rpm.

In the present invention, the thixotropy index is measured as follows. First, the thixotropy index is measured at a rotational speed of 0.5 rpm and a rotational speed of 5 rpm by the viscosity measuring method. Next, the thixotropy index was calculated by the following formula.
Thixotropic index = (0.5 rpm viscosity) / (5.0 rpm viscosity)

When the resin composition used in the present invention is the above-described resin composition, pattern printing by screen printing can be performed more easily, and the manufacturing process can be simplified and shortened in various applications. Cost can be reduced.
Hereinafter, each component which comprises a resin composition is demonstrated in detail.

  The component (A) is a photopolymerizable component and is preferably a compound having an ethylenically unsaturated group. Preferred examples of the ethylenically unsaturated group include a vinyl group, an allyl group, a propargyl group, a butenyl group, an ethynyl group, a phenylethynyl group, a maleimide group, a nadiimide group, and a (meth) acryl group. As a photopolymerizable component, it is preferable that a (meth) acryl group is included as an ethylenically unsaturated group from the viewpoint of reactivity, and a monofunctional (meth) acrylate is used from the viewpoint of pressure-bonding after B-stage formation. Is more preferable, and monofunctional acrylate is more preferable.

  (A) The photopolymerizable component preferably has a 5% mass reduction temperature of 120 ° C. or higher, more preferably 150 ° C. or higher, and 180 ° C. or higher from the viewpoint of reducing outgas. It is particularly preferred that Here, the 5% mass reduction temperature means a monofunctional (meth) acrylate using a differential thermothermal gravimetric simultaneous measurement device (“TG / DTA6300 (model number)”, manufactured by SII Nano Technology) at a temperature rising rate of 10 ° C. / Min, 5% mass loss temperature when measured under a nitrogen flow (400 ml / min). By applying a monofunctional (meth) acrylate having a high 5% mass reduction temperature, it is possible to suppress volatilization of unreacted monofunctional (meth) acrylate remaining after B-staging by exposure during thermocompression bonding or thermosetting. .

  In addition, the (A) photopolymerizable component is preferably in a liquid state at −40 ° C. to 30 ° C., and the viscosity is 1000 mPa · s or less in consideration of the ability of the resin composition to be removed from the mesh printing plate. Preferably, in consideration of flattening by self-flow after printing, it is more preferably 500 mPa · s or less. When the viscosity is within the above range, the viscosity of the resin composition does not increase and good printability is obtained.

  Such monofunctional (meth) acrylate is not particularly limited, but includes glycidyl group-containing (meth) acrylate, phenol EO-modified (meth) acrylate, phenol PO-modified (meth) acrylate, nonylphenol EO-modified (meth) acrylate, and nonylphenol. Besides aromatic (meth) acrylates such as PO-modified (meth) acrylate, phenolic hydroxyl group-containing (meth) acrylate, hydroxyl group-containing (meth) acrylate, phenylphenol glycidyl ether (meth) acrylate, and phenoxyethyl (meth) acrylate , Imide group-containing (meth) acrylate, carboxyl group-containing (meth) acrylate, isoboronyl-containing (meth) acrylate, dicyclopentadienyl group-containing (meth) acrylate, and isoboro Such as Le (meth) acrylate are preferably mentioned.

  The monofunctional (meth) acrylate preferably has a urethane group, an isocyanuric group, an imide group, or a hydroxyl group from the viewpoints of adhesion to an adherend after B-stage formation, adhesion after curing, and heat resistance, In particular, a monofunctional (meth) acrylate having an imide group in the molecule is preferable. Moreover, the monofunctional (meth) acrylate which has an epoxy group can also be used preferably.

Although it does not specifically limit as monofunctional (meth) acrylate which has an epoxy group, In addition to glycidyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate glycidyl ether, the functional group and ethylenic unsaturated which react with an epoxy group Preferable examples include compounds obtained by reacting a group-containing compound with a polyfunctional epoxy resin.
Although it does not specifically limit as a functional group which reacts with an epoxy group, An isocyanate group, a carboxyl group, a phenolic hydroxyl group, a hydroxyl group, an acid anhydride, an amino group, a thiol group, an amide group etc. are mentioned preferably. These compounds can be used individually by 1 type or in combination of 2 or more types.

  Furthermore, the monofunctional (meth) acrylate having an epoxy group has a high purity in which impurity ions such as alkali metal ions, alkaline earth metal ions, halogen ions, especially chlorine ions and hydrolyzable chlorine are reduced to 1000 ppm or less. It is preferable to use a product from the viewpoint of preventing electromigration and preventing corrosion of a metal conductor circuit. For example, the impurity ion concentration can be satisfied by using a polyfunctional epoxy resin with reduced alkali metal ions, alkaline earth metal ions, halogen ions, and the like as a raw material. The total chlorine content can be measured according to JIS K7243-3 (2005).

  Although it does not specifically limit as a monofunctional (meth) acrylate component which has the epoxy group which satisfy | fills the said purity, The glycidyl ether of bisphenol A type (or AD type, S type, F type), the glycidyl ether of water addition bisphenol A type Glycidyl ether of ethylene oxide adduct bisphenol A and / or F type, propylene oxide adduct bisphenol A and / or F type glycidyl ether, glycidyl ether of phenol novolac resin, glycidyl ether of cresol novolac resin, glycidyl of bisphenol A novolac resin Ether, glycidyl ether of naphthalene resin, trifunctional (or tetrafunctional) glycidyl ether, glycidyl ether of dicyclopentadienephenol resin, glycidyl ester of dimer acid Le, 3, etc. functional type (or tetrafunctional) glycidyl amines and glycidyl amines of naphthalene resins those as raw materials are preferably exemplified.

In particular, in order to improve thermocompression bonding, low stress properties, and adhesiveness, the number of epoxy groups and ethylenically unsaturated groups is preferably 3 or less, respectively, and in particular, the number of ethylenically unsaturated groups is 2. It is preferable that it is one or less. Although it does not specifically limit as such a compound, The compound etc. which are represented by following General formula (1), (2), (3), (4) or (5) are used preferably. In the following general formulas (1) to (5), R ¹² and R ¹⁶ represent a hydrogen atom or a methyl group, R ¹⁰ , R ¹¹ , R ¹³ and R ¹⁴ represent a divalent organic group, R ¹⁵ , R ¹⁷ and R ¹⁸ represent an organic group having an epoxy group or an ethylenically unsaturated group. F represents an integer, for example, an integer of 1 to 10.

  (A) As a photopolymerizable component, you may contain bifunctional or more (meth) acrylate. Such (meth) acrylate is not particularly limited, but diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, trimethylolpropane di (meth) acrylate, Trimethylolpropane tri (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, di Pentaerythritol hexa (meth) acrylate, styrene, divinylbenzene, 4-vinyltoluene, 4-vinylpyridine, N-vinylpyrrolidone, 2-hydroxyethyl (meth) acrylate, 1, -(Meth) acryloyloxy-2-hydroxypropane, 1,2- (meth) methacryloyloxy-2-hydroxypropane, methylenebis (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-methylol (meth) acrylamide , Tris (β-hydroxyethyl) isocyanurate tri (meth) acrylate, a compound represented by the following general formula (6), urethane (meth) acrylate, urea acrylate and the like are preferable.

In the general formula (6), R ¹⁹ and R ²⁰ each independently represent a hydrogen atom or a methyl group, and g and h each independently represent an integer of 1 to 20.
These photopolymerizable compounds can be used individually by 1 type or in combination of 2 or more types. Among them, the photopolymerizable compound having a glycol skeleton represented by the general formula (6) is preferable in that it can sufficiently impart solvent resistance after curing, has low viscosity, and has a high 5% mass reduction temperature. .

  Content of (A) component with respect to the total amount of (A) component, (C) component, and (F) component is 10-70 mass%, and 30-50 mass from a viewpoint of the shape maintenance after B-stage formation. % Is preferred.

  (B) A component is a photoinitiator and is a component used in order to adjust B staging. (B) The photopolymerization initiator is preferably a compound that generates radicals upon exposure, preferably having absorption at 300 to 500 nm, and more preferably bleaching by light irradiation.

  Examples of such a photopolymerization initiator include 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2,2-dimethoxy-1,2-diphenylethane-1- ON, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone-1, 2,4-diethylthioxanthone, 2-ethylanthraquinone, phenanthrenequinone, etc. Aromatic ketones; benzyl derivatives such as benzyldimethyl ketal; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) Imidazole dimer, 2- (o-fluorophenyl) -4,5-phenylimidazole dimer, -(O-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl) -5 -2,4,5-triarylimidazole dimers such as phenylimidazole dimer, 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer; 9-phenylacridine, 1,7 -Acridine derivatives such as bis (9,9'-acridinyl) heptane; bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2- (dimethylamino) -2-[(4-methylphenyl) methyl] [4- (4- Preferred examples include compounds that undergo photobleaching by UV irradiation, such as alkylphenones such as (morpholinyl) phenyl] -1-butanone, bisacylphosphine oxides such as bis (2,4,6, -trimethylbenzoyl) -phenylphosphine oxide, and the like. It is done. These can be used alone or in combination of two or more.

  Among the photopolymerization initiators, in consideration of solubility in a resin composition containing no solvent, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2-benzyl-2-dimethylamino-1 -(4-morpholinophenyl) -butanone-1,2,2-dimethoxy-1,2-diphenylethane-1-one and 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropane -1-one is preferred. Also, from the viewpoint of enabling the B-stage of the resin composition by exposure treatment in an air atmosphere, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2 , 2-dimethoxy-1,2-diphenylethane-1-one and 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropan-1-one are preferred.

Examples of the (B) photopolymerization initiator include a photobase generator that generates a base by exposure treatment, a photoacid generator that generates an acid by exposure treatment, and the like. A generator is preferred.
By using a photobase generator, the adhesiveness (high temperature adhesiveness) and moisture resistance of the resin composition to the adherend can be improved. This is because the base generated from the photobase generator can act as a curing catalyst for the later-described (C) thermopolymerizable component, for example, an epoxy resin, thereby further increasing the crosslinking density, or For example, the produced curing catalyst is less likely to corrode the substrate. By containing a photobase generator as a photopolymerization initiator (B) in the resin composition, the crosslink density of the resin composition can be improved, and the outgas during standing at high temperature can be further reduced. Furthermore, it is considered that the temperature of the curing process can be lowered and shortened.

The photobase generator is not particularly limited as long as it is a compound that generates a base during the exposure treatment, and can be used.
The base generated by such exposure treatment is preferably a strongly basic compound from the viewpoint of reactivity and curing speed. For example, imidazole derivatives such as imidazole, 2,4-dimethylimidazole and 1-methylimidazole; piperazine and 2 Piperazine derivatives such as 1,5-dimethylpiperazine; piperidine derivatives such as piperidine and 1,2-dimethylpiperidine; proline derivatives; trialkylamine derivatives such as trimethylamine, triethylamine and triethanolamine; 4-methylaminopyridine and 4-dimethylamino Pyridine derivatives substituted with an amino group or alkylamino group at the 4-position such as pyridine; pyrrolidine derivatives such as pyrrolidine and n-methylpyrrolidine; dihydropyridine derivatives; triethylenediamine and 1,8 Jiazabisushikuro (5,4,0) undecene -1 (DBU) cycloaliphatic amine derivatives such as benzil methylamine, benzylamine derivatives such as benzyl dimethyl amine and benzyl diethyl amine are preferably exemplified.

Examples of photobase generators that generate the above-mentioned bases by exposure treatment include, for example, Journal of Photopolymer Science and Technology 12, 313-314 (1999), Chemistry of Materials 11, 170-176 (19 The quaternary ammonium salt derivatives described in (Year) etc. are also preferred. Since these produce a highly basic trialkylamine by exposure treatment, when an epoxy resin is employed as the (C) thermopolymerizable component, it is optimal for curing the epoxy resin.
As the photobase generator, carbamic acid derivatives described in Journal of American Chemical Society 118, 12925 (1996), Polymer Journal 28, 795 (1996), and the like are also preferable.

  Furthermore, photobase generators that generate a base upon exposure treatment include 2,4-dimethoxy-1,2-diphenylethane-1-one, 1,2-octanedione, 1- [4- (phenylthio) -2. Oxime derivatives such as-(o-benzoyloxime)] and ethanone and 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] -1- (o-acetyloxime); 2-Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2,2-dimethoxy-1,2-diphenylethane-1-one commercially available as a photoradical generator -Methyl-1- (4- (methylthio) phenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinopheny ) - butanone-1, hexaarylbisimidazole derivatives (halogen, alkoxy group, substituents such as nitro and cyano groups may be substituted with phenyl group); and benzisoxazole pyrazolone derivatives preferably.

  As the photobase generator, a compound in which a group capable of generating a base is introduced into the main chain and / or side chain of the polymer can also be used. The molecular weight in this case is preferably a weight average molecular weight of 1,000 to 100,000, more preferably 5,000 to 30,000, from the viewpoints of adhesiveness, fluidity and heat resistance of the resin composition.

  Since the photobase generator does not exhibit reactivity with the epoxy resin when not exposed to light, the storage stability at room temperature (25 ° C., the same applies hereinafter) is very excellent.

  (B) Content of a component is 3-10 mass parts with respect to 100 mass parts of (A) photopolymerizable components, Preferably it is 6-9 mass parts. When the content of component (B) is within the above range, the resin composition can be B-staged efficiently and reliably.

The component (C) is a thermopolymerizable component and is not particularly limited as long as it is a component composed of a reactive compound that causes a crosslinking reaction by heat.
Examples of such (C) thermopolymerizable component include epoxy resin, cyanate ester resin, maleimide resin, allyl nadiimide resin, phenol resin, urea resin, melamine resin, alkyd resin, acrylic resin, unsaturated polyester resin, Diallyl phthalate resin, silicone resin, resorcinol formaldehyde resin, xylene resin, furan resin, polyurethane resin, ketone resin, triallyl cyanurate resin, polyisocyanate resin, resin containing tris (2-hydroxyethyl) isocyanurate, triallyl Preferred examples include a resin containing trimellitate, a thermosetting resin synthesized from cyclopentadiene, and a thermopolymerizable component by trimerization of aromatic dicyanamide. Among these, epoxy resins, maleimide resins and allyl nadiimide resins are preferred in that they can have excellent adhesive strength at high temperatures in the combination with (F) thermoplastic resins, particularly polyimide resins, which will be described later. These may be used alone or in combination of two or more.

  As an epoxy resin, what contains at least 2 or more epoxy group in a molecule | numerator is preferable, and the glycidyl ether type epoxy resin of a phenol is more preferable from the point of sclerosis | hardenability and hardened | cured material characteristic. Examples of such resins include bisphenol A type (or AD type, S type, and F type) glycidyl ether, water-added bisphenol A type glycidyl ether, ethylene oxide adduct bisphenol A type glycidyl ether, and propylene oxide adduct. Bisphenol A type glycidyl ether, phenol novolac resin glycidyl ether, cresol novolac resin glycidyl ether, bisphenol A novolac resin glycidyl ether, naphthalene resin glycidyl ether, trifunctional (or tetrafunctional) glycidyl ether, dicyclo Preference is given to glycidyl ether of pentadienephenol resin, glycidyl ester of dimer acid, trifunctional (or tetrafunctional) glycidylamine and glycidylamine of naphthalene resin. And the like properly. These may be used alone or in combination of two or more.

  As the epoxy resin, it is possible to use a high-purity product in which impurity ions such as alkali metal ions, alkaline earth metal ions, halogen ions, particularly chlorine ions and hydrolyzable chlorine are reduced to 300 ppm or less. From the viewpoint of prevention and corrosion prevention of metal conductor circuits.

(C) As a heat-polymerizable component, the 5% mass reduction temperature is preferably 150 ° C. or higher, more preferably 180 ° C. or higher, and further preferably 200 ° C. or higher. Here, the 5% mass reduction temperature is a value measured in the same manner as the 5% mass reduction temperature of the photopolymerizable component (A).
By applying a thermopolymerizable component having a high 5% mass reduction temperature, volatilization of the thermopolymerizable component during thermocompression bonding or thermosetting can be suppressed. As such a heat-polymerizable component having heat resistance, an epoxy resin having an aromatic ring in the molecule is preferably mentioned, and in particular, trifunctional (or tetrafunctional) glycidylamine from the viewpoint of adhesion and heat resistance, Bisphenol A type (or AD type, S type, F type) glycidyl ether is preferably used.

  Content of (C) component with respect to the total amount of (A) component, (C) component, and (F) component is 5-70 mass%, and 20-50 mass% from a viewpoint of the reliability of a resin composition. It is preferable that When the content of the component (C) is within the above range, the viscosity of the resin composition does not increase, excellent printability is obtained, and sufficient thermocompression bondability and high-temperature adhesiveness are obtained.

(D) The thermosetting agent is not particularly limited as long as it cures the (C) thermopolymerizable component. For example, when an epoxy resin is used as the (C) thermopolymerizable component, the epoxy resin There is no particular limitation as long as it is cured. Examples of the (D) thermosetting agent include imidazoles, dicyandiamide derivatives, dicarboxylic acid dihydrazide, triphenylphosphine, tetraphenylphosphonium tetraphenylborate, 2-ethyl-4-methylimidazole-tetraphenylborate, 1, Preferable examples include 8-diazabicyclo [5.4.0] undecene-7-tetraphenylborate, a urethane base generator that generates a base by heating. These thermosetting agents may be used alone or in combination of two or more.
Moreover, it is preferable that the curing start temperature of the mixture of the (C) thermopolymerizable component and the (D) thermosetting agent is 150 ° C. or less, and in particular, the epoxy resin that can start curing at 150 ° C. or less is preferable.

  (D) Content of a component is 0.01-20 mass parts with respect to 100 mass parts of (C) component, Preferably it is 1-5 mass parts. When the content of the component (D) is within the above range, the resin composition can be B-staged efficiently and reliably.

  Examples of the filler (E) include conductive (metal) fillers such as silver powder, gold powder, and copper powder, and inorganic substance fillers such as silica, alumina, titania, glass, iron oxide, and ceramic. Among these fillers, conductive (metal) fillers such as silver powder, gold powder, and copper powder are added for the purpose of imparting conductivity, heat conductivity, or thixotropic property to the adhesive, and silica, alumina, titania, glass, and iron oxide. Inorganic fillers such as ceramics are added for the purpose of imparting low thermal expansion, low moisture absorption, and thixotropic properties to the adhesive. These can be used alone or in combination of two or more.

  (E) A component is a filler and can be properly used according to the desired function. For example, a metal filler is used for the purpose of imparting conductivity, thermal conductivity, thixotropy, etc. to a resin composition, and an inorganic filler is for the purpose of imparting thermal conductivity, low thermal expansion, low hygroscopicity, etc. to a resin composition. In addition, the organic filler is used for the purpose of imparting toughness to the resin composition.

  The above metal filler, inorganic filler, and organic filler may be used alone or in combination of two or more. Moreover, you may mix and use 1 or more types of a metal filler, 1 or more types of an inorganic filler, and 1 or more types of organic fillers in the range which does not impair a physical property.

  (E) The filler preferably has an average particle size of 10 μm or less and a maximum particle size of 30 μm or less, more preferably an average particle size of 5 μm or less and a maximum particle size of 20 μm or less. When the average particle size and the maximum particle size are within the above ranges, the effect of improving fracture toughness is sufficiently obtained. The lower limit of the average particle size and the maximum particle size is not particularly limited, but usually both are 0.001 μm or more.

  (E) Content of a component is 2-50 mass parts with respect to 100 mass parts of total amounts of (A) component, (C) component, and (F) component, Preferably it is 10-20 mass parts. is there. (E) By making content of a component into 2 mass parts or more, sufficient thixotropic property (thixotropic index: 1.5 or more) can be provided to a resin composition. Moreover, a resin composition can be produced by making the compounding quantity of a filler into 50 mass parts or less, without impairing the dispersion stability of the filler to a resin composition.

  The component (F) is a thermoplastic resin. Examples of the thermoplastic resin (F) include polyester resins, polyether resins, polyimide resins, polyamide resins, polyamideimide resins, polyetherimide resins, polyurethane resins, and polyurethaneimide resins. , Polyurethane amide imide resin, siloxane polyimide resin, polyester imide resin, copolymers thereof, precursors thereof (polyamide acid, etc.), polybenzoxazole resin, phenoxy resin, polysulfone resin, polyether sulfone resin, polyphenylene sulfide Resins, polyester resins, polyether resins, polycarbonate resins, polyether ketone resins, (meth) acrylic copolymers having a weight average molecular weight of 10,000 to 1,000,000, novolak resins and phenol resins are preferred. And the like. These can be used alone or in combination of two or more. In addition, the main chain and / or side chain of these resins may be provided with a glycol group such as ethylene glycol and propylene glycol, a carboxyl group, and / or a hydroxyl group.

  Among these, from the viewpoint of high-temperature adhesiveness and heat resistance, the (F) thermoplastic resin is preferably a resin having an imide group. Preferred examples of the resin having an imide group include polyimide resins, polyamideimide resins, polyetherimide resins, polyurethaneimide resins, polyurethaneamideimide resins, siloxane polyimide resins, polyesterimide resins, and copolymers thereof. For example, a polyimide resin can be obtained by subjecting tetracarboxylic dianhydride and diamine to a condensation reaction by a known method. That is, in the organic solvent, tetracarboxylic dianhydride and diamine are equimolar, or if necessary, the total of diamine is preferably 0.5 with respect to 1.0 mol of tetracarboxylic dianhydride in total. The composition ratio is adjusted in the range of -2.0 mol, more preferably 0.8-1.0 mol (addition order of each component is arbitrary), and the reaction temperature is preferably 80 ° C. or less, more preferably 0-60 ° C. Addition reaction. As the reaction proceeds, the viscosity of the reaction solution gradually increases, and polyamic acid, which is a polyimide resin precursor, is generated. In addition, in order to suppress the fall of the various characteristics of a resin composition, it is preferable that the said tetracarboxylic dianhydride is a refinement | purification process by recrystallization with acetic anhydride.

  About the composition ratio of the tetracarboxylic dianhydride and diamine in the said condensation reaction, it is preferable that the sum total of diamine is 0.5-2.0 mol with respect to the total 1.0 mol of tetracarboxylic dianhydride. . If it is 2.0 mol or less, the amount of the polyimide oligomer having an amine terminal is not increased in the obtained polyimide resin, and the weight average molecular weight of the polyimide resin is increased, which includes various heat resistances of the resin composition. The characteristics are improved. On the other hand, when the total of diamine is 0.5 mol or more with respect to 1.0 mol of tetracarboxylic dianhydride, the amount of the polyimide resin oligomer having an acid terminal (carboxyl terminal) does not increase. Since the weight average molecular weight of the polyimide resin is increased, various characteristics including heat resistance of the resin composition are improved.

  The polyimide resin can be obtained by dehydrating and ring-closing the reaction product (polyamic acid). The dehydration ring closure can be preferably performed by a thermal ring closure method in which heat treatment is performed, a chemical ring closure method using a dehydrating agent, or the like.

  There is no restriction | limiting in particular as tetracarboxylic dianhydride used as a raw material of a polyimide resin, For example, pyromellitic dianhydride, 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride, 2,2 ', 3,3'-biphenyltetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis (2,3-dicarboxyphenyl) propane Anhydride, 1,1-bis (2,3-dicarboxyphenyl) ethane dianhydride, 1,1-bis (3,4-dicarboxyphenyl) ethane dianhydride, bis (2,3-dicarboxyphenyl) ) Methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) sulfone dianhydride, 3,4,9,10-perylenetetracarbo Acid dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, benzene-1,2,3,4-tetracarboxylic dianhydride, 3,4,3 ′, 4′-benzophenone tetracarboxylic Acid dianhydride, 2,3,2 ′, 3′-benzophenone tetracarboxylic dianhydride, 3,3,3 ′, 4′-benzophenone tetracarboxylic dianhydride, 1,2,5,6-naphthalene Tetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,2,4,5-naphthalenetetracarboxylic Acid dianhydride, 2,6-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2,7-dichloronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 2 , 3,6,7-tetrac Loronaphthalene-1,4,5,8-tetracarboxylic dianhydride, phenanthrene-1,8,9,10-tetracarboxylic dianhydride, pyrazine-2,3,5,6-tetracarboxylic dianhydride , Thiophene-2,3,5,6-tetracarboxylic dianhydride, 2,3,3 ′, 4′-biphenyltetracarboxylic dianhydride, 3,4,3 ′, 4′-biphenyltetracarboxylic Acid dianhydride, 2,3,2 ′, 3′-biphenyltetracarboxylic dianhydride, bis (3,4-dicarboxyphenyl) dimethylsilane dianhydride, bis (3,4-dicarboxyphenyl) methyl Phenylsilane dianhydride, bis (3,4-dicarboxyphenyl) diphenylsilane dianhydride, 1,4-bis (3,4-dicarboxyphenyldimethylsilyl) benzene dianhydride, 1,3-bis ( , 4-Dicarboxyphenyl) -1,1,3,3-tetramethyldicyclohexane dianhydride, p-phenylenebis (trimellitic anhydride), ethylenetetracarboxylic dianhydride, 1,2,3,4- Butanetetracarboxylic dianhydride, decahydronaphthalene-1,4,5,8-tetracarboxylic dianhydride, 4,8-dimethyl-1,2,3,5,6,7-hexahydronaphthalene-1 , 2,5,6-tetracarboxylic dianhydride, cyclopentane-1,2,3,4-tetracarboxylic dianhydride, pyrrolidine-2,3,4,5-tetracarboxylic dianhydride, 1 , 2,3,4-cyclobutanetetracarboxylic dianhydride, bisexo-bicyclo [2,2,1] heptane-2,3-dicarboxylic dianhydride, bicyclo- [2,2,2] -oct-7 -En 2,3,5,6-tetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, 2,2-bis [4- (3,4-dicarboxyphenyl) ) Phenyl] propane dianhydride, 2,2-bis (3,4-dicarboxyphenyl) hexafluoropropane dianhydride, 2,2-bis [4- (3,4-dicarboxyphenyl) phenyl] hexafluoro Propane dianhydride, 4,4'-bis (3,4-dicarboxyphenoxy) diphenyl sulfide dianhydride, 1,4-bis (2-hydroxyhexafluoroisopropyl) benzenebis (trimellitic anhydride), 1 , 3-bis (2-hydroxyhexafluoroisopropyl) benzenebis (trimellitic anhydride), 5- (2,5-dioxotetrahydrofuryl) -3-methyl Ru-3-cyclohexene-1,2-dicarboxylic dianhydride, tetrahydrofuran-2,3,4,5-tetracarboxylic dianhydride, tetracarboxylic dianhydride represented by the following general formula (7), etc. Are preferred. In the following general formula (7), a represents an integer of 2 to 20.

  The tetracarboxylic dianhydride represented by the general formula (7) can be synthesized from, for example, trimellitic anhydride monochloride and the corresponding diol. Specifically, 1,2- (ethylene) bis (trimellitic anhydride), 1,3- (trimethylene) bis (trimellitic anhydride), 1,4- (tetramethylene) bis (trimellitic anhydride), 1,5 -(Pentamethylene) bis (trimellitic anhydride), 1,6- (hexamethylene) bis (trimellitic anhydride), 1,7- (heptamethylene) bis (trimellitic anhydride), 1,8- (octamethylene) Bis (trimellitic anhydride), 1,9- (nonamethylene) bis (trimellitic anhydride), 1,10- (decamethylene) bis (trimellitic anhydride), 1,12- (dodecamethylene) bis (trimellitic anhydride), 1,16- (hexadecamethylene) bis (trimellitate anhydride) and 1,18- (octadecamethylene) bis (g Mellitate anhydride) are preferably used.

  The tetracarboxylic dianhydride is a tetracarboxylic acid represented by the following formula (8) or (9) from the viewpoint of imparting good solubility in solvents and moisture resistance, and transparency to light having a wavelength of 365 nm. Acid dianhydride is preferred.

  The above tetracarboxylic dianhydrides can be used singly or in combination of two or more.

  (F) As the thermoplastic resin, a carboxyl group and / or a phenolic hydroxyl group-containing polyimide resin can be preferably used in that the adhesive strength is further increased. The diamine used as a raw material for the carboxyl group and / or hydroxyl group-containing polyimide resin preferably contains an aromatic diamine represented by the following formula (10), (11), (12) or (13).

  There is no restriction | limiting in particular as another diamine used as a raw material of the said polyimide resin, For example, o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, 3,3'- diaminodiphenyl ether, 3,4'-diaminodiphenyl ether 4,4′-diaminodiphenyl ether, 3,3′-diaminodiphenylmethane, 3,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, bis (4-amino-3,5-dimethylphenyl) methane, bis ( 4-amino-3,5-diisopropylphenyl) methane, 3,3'-diaminodiphenyldifluoromethane, 3,4'-diaminodiphenyldifluoromethane, 4,4'-diaminodiphenyldifluoromethane, 3,3'-diaminodiphenyl Sulfon, 3 4'-diaminodiphenyl sulfone, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 4,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl Ketone, 3,4'-diaminodiphenyl ketone, 4,4'-diaminodiphenyl ketone, 2,2-bis (3-aminophenyl) propane, 2,2 '-(3,4'-diaminodiphenyl) propane, 2 , 2-bis (4-aminophenyl) propane, 2,2-bis (3-aminophenyl) hexafluoropropane, 2,2- (3,4'-diaminodiphenyl) hexafluoropropane, 2,2-bis ( 4-aminophenyl) hexafluoropropane, 1,3-bis (3-aminophenoxy) benzene, 1 4-bis (3-aminophenoxy) benzene, 1,4-bis (4-aminophenoxy) benzene, 3,3 ′-(1,4-phenylenebis (1-methylethylidene)) bisaniline, 3,4′- (1,4-phenylenebis (1-methylethylidene)) bisaniline, 4,4 ′-(1,4-phenylenebis (1-methylethylidene)) bisaniline, 2,2-bis (4- (3-aminophenoxy) ) Phenyl) propane, 2,2-bis (4- (3-aminophenoxy) phenyl) hexafluoropropane, 2,2-bis (4- (4-aminophenoxy) phenyl) hexafluoropropane, bis (4- ( 3-aminoethoxy) phenyl) sulfide, bis (4- (4-aminoethoxy) phenyl) sulfide, bis (4- (3-aminoethoxy) phen Nyl) sulfone, bis (4- (4-aminoethoxy) phenyl) sulfone, aromatic diamines such as 3,3′-dihydroxy-4,4′-diaminobiphenyl and 3,5-diaminobenzoic acid, 1,3- Bis (aminomethyl) cyclohexane, 2,2-bis (4-aminophenoxyphenyl) propane, aliphatic ether diamine represented by the following general formula (14), and siloxane diamine represented by the following general formula (15) Are preferred.

Among the above diamines, aliphatic ether diamines represented by the following general formula (14) are preferable, and ethylene glycol and / or propylene glycol-based diamines are more preferable in terms of imparting compatibility with other components. In the following general formula (14), R ¹ , R ² and R ³ each independently represents an alkylene group having 1 to 10 carbon atoms, and b represents an integer of 2 to 80.

  Examples of such aliphatic ether diamines include Jeffamine D-230, D-400, D-2000, D-4000, ED-600, ED-900, ED-2000, EDR-148 (above, Sun Techno Chemical). Preferably, aliphatic diamines such as polyoxyalkylene diamines such as polyetheramine D-230, D-400, and D-2000 (above, BASF) are used. These diamines are preferably 20 mol% or more of the total diamine, and are compatible with other compounding components such as (A) a photopolymerizable component and (C) a thermopolymerizable component, and thermocompression-bonding and high temperature. It is more preferably 50 mol% or more from the viewpoint that the adhesiveness is highly compatible.

As said diamine, the siloxane diamine represented by following General formula (15) is preferable at the point which provides the adhesiveness and adhesiveness in room temperature. In the following general formula (15), R ⁴ and R ⁹ each independently represent an alkylene group having 1 to 5 carbon atoms or a phenylene group which may have a substituent, and R ⁵ , R ⁶ , R ⁷ and R ⁸ each independently represents an alkyl group having 1 to 5 carbon atoms, a phenyl group or a phenoxy group, and d represents an integer of 1 to 5.

  These diamines are preferably 0.5 to 80 mol% of the total diamine, and more preferably 1 to 50 mol% in terms of achieving both high thermocompression bonding and high-temperature adhesiveness. When it is 0.5 mol% or more, the effect of adding siloxane diamine is obtained, and when it is 80 mol% or less, good compatibility with other components and high-temperature adhesiveness are obtained.

Specifically, as the siloxane diamine represented by the general formula (15), it is assumed that d in the formula (15) is 1, 1,1,3,3-tetramethyl-1,3-bis (4- Aminophenyl) disiloxane, 1,1,3,3-tetraphenoxy-1,3-bis (4-aminoethyl) disiloxane, 1,1,3,3-tetraphenyl-1,3-bis (2- Aminoethyl) disiloxane, 1,1,3,3-tetraphenyl-1,3-bis (3-aminopropyl) disiloxane, 1,1,3,3-tetramethyl-1,3-bis (2- Aminoethyl) disiloxane, 1,1,3,3-tetramethyl-1,3-bis (3-aminopropyl) disiloxane, 1,1,3,3-tetramethyl-1,3-bis (3- Aminobutyl) disiloxane and 1,3-dimethyl-1 And 3-dimethoxy-1,3-bis (4-aminobutyl) disiloxane and the like preferably.
Assuming that d in the formula (15) is 2, 1,1,3,3,5,5-hexamethyl-1,5-bis (4-aminophenyl) trisiloxane, 1,1,5,5-tetra Phenyl-3,3-dimethyl-1,5-bis (3-aminopropyl) trisiloxane, 1,1,5,5-tetraphenyl-3,3-dimethoxy-1,5-bis (4-aminobutyl) Trisiloxane, 1,1,5,5-tetraphenyl-3,3-dimethoxy-1,5-bis (5-aminopentyl) trisiloxane, 1,1,5,5-tetramethyl-3,3-dimethoxy -1,5-bis (2-aminoethyl) trisiloxane, 1,1,5,5-tetramethyl-3,3-dimethoxy-1,5-bis (4-aminobutyl) trisiloxane, 1,1, 5,5-tetramethyl-3,3-dimethoxy -1,5-bis (5-aminopentyl) trisiloxane, 1,1,3,3,5,5-hexamethyl-1,5-bis (3-aminopropyl) trisiloxane, 1,1,3,3 , 5,5-hexaethyl-1,5-bis (3-aminopropyl) trisiloxane and 1,1,3,3,5,5-hexapropyl-1,5-bis (3-aminopropyl) trisiloxane Are preferred.

The diamine mentioned above can be used individually by 1 type or in combination of 2 or more types.
Moreover, the said polyimide resin can be used individually by 1 type or in mixture of 2 or more types as needed.

  As described above, when determining the composition of the polyimide resin, it is preferably designed so that the Tg of the polyimide resin is 150 ° C. or less. As the diamine that is a raw material of the polyimide resin, the general formula (14) It is particularly preferred to use the aliphatic ether diamine represented.

  By synthesizing a monofunctional acid anhydride such as a compound represented by the following formula (16), (17) or (18) and / or a monofunctional amine into the condensation reaction solution during the synthesis of the polyimide resin, a polymer is obtained. A functional group other than acid anhydride or diamine can be introduced at the terminal. In addition, this can lower the molecular weight of the polymer, reduce the viscosity of the resin composition, and improve the thermocompression bonding property.

  The (D) thermosetting agent may have a functional group having a function of accelerating the curing of an epoxy resin such as imidazole as its main chain and / or side chain. For example, an imidazole-containing polyimide can be obtained as follows. A part of the diamine component shown above can be obtained using an imidazole group-containing diamine as represented by the following structural formula.

  From the point that the resin composition coating layer can be uniformly B-staged, the imide resin preferably has a transmittance of 10% or more for light having a wavelength of 365 nm when the thickness is formed to 30 μm, and lower exposure. It is more preferably 20% or more from the standpoint that the B stage can be achieved by the amount. Such a polyimide resin is represented by, for example, an acid anhydride represented by the general formula (7), an aliphatic ether diamine represented by the general formula (14), and / or the general formula (15). It can be synthesized by reacting with siloxane diamine.

  (F) As the thermoplastic resin, it is preferable to use a liquid thermoplastic resin that is liquid at room temperature (25 ° C.) from the viewpoint of suppressing an increase in viscosity and further reducing undissolved residue in the resin composition. Such a thermoplastic resin can be reacted by heating without using a solvent, and in a resin composition to which a solvent is not applied as in the present embodiment, reduction of the solvent removal step, reduction of the remaining solvent, This is useful in terms of reducing the reprecipitation process. Further, the liquid thermoplastic resin can be easily taken out from the reaction furnace. Such a liquid thermoplastic resin is not particularly limited, but is a rubbery polymer such as polybutadiene, acrylonitrile-butadiene oligomer, polyisoprene and polybutene, polyolefin, acrylic polymer, silicone polymer, polyurethane, polyimide, and polyamideimide. Is mentioned. Of these, a polyimide resin is preferably used.

  The liquid polyimide resin can be obtained, for example, by reacting the acid anhydride with an aliphatic ether diamine or siloxane diamine. As a synthesis method, an acid anhydride is dispersed in an aliphatic ether diamine or siloxane diamine without adding a solvent and heated.

  The resin composition is exposed using a high-precision parallel exposure machine (“EXM-1172-B-∞” (trade name), manufactured by Oak Manufacturing Co., Ltd.), and then has a minimum melt viscosity of 30000 Pa at 20 ° C. to 300 ° C. -It is preferable that it is below s. A parallel exposure machine ("ML-210FM mask aligner" (trade name), manufactured by Luminous Co., Ltd.) may be used instead of the above high-precision parallel exposure machine.

Here, the “minimum melt viscosity” is a value obtained when a sample after being exposed to light with a light amount of 1000 mJ / cm ² is measured using a viscoelasticity measuring device ARES (manufactured by Rheometrics Scientific F.E.). The minimum value of melt viscosity at 20 ° C to 300 ° C is shown. Note that a parallel plate having a diameter of 8 mm is used as the measurement plate. The temperature rise rate is 5 ° C./min, the measurement temperature is 20 ° C. to 300 ° C., and the frequency is 1 Hz.

  The minimum melt viscosity is preferably 20000 Pa · s or less, more preferably 18000 Pa · s or less, and even more preferably 15000 Pa · s or less. By having the lowest melt viscosity within the above range, it is possible to ensure sufficient low-temperature thermocompression bonding, and it is possible to impart good adhesion even to uneven substrates. The lower limit of the minimum melt viscosity is not particularly provided, but is preferably 10 Pa · s or more from the viewpoint of handling properties.

  Moreover, a resin composition contains a thermal radical generator as needed. The thermal radical generator is preferably an organic peroxide. The organic peroxide preferably has a 1 minute half-life temperature of 80 ° C. or higher, more preferably 100 ° C. or higher, and most preferably 120 ° C. or higher. The organic peroxide is selected in consideration of the preparation conditions of the resin composition, the film forming temperature, the curing (bonding) conditions, other process conditions, storage stability, and the like. The organic peroxide that can be used is not particularly limited. For example, 2,5-dimethyl-2,5-di (t-butylperoxyhexane), dicumyl peroxide, t-butylperoxy- 2-ethylhexanate, t-hexylperoxy-2-ethylhexanate, 1,1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-bis (t-hexylper Oxy) -3,3,5-trimethylcyclohexane and bis (4-t-butylcyclohexyl) peroxydicarbonate, and one of these may be used alone or two or more of them may be used in combination. . By containing the organic peroxide, the unreacted photopolymerizable component remaining after the exposure treatment can be reacted, and the outgas can be reduced (lower outgassing) and the adhesion can be increased.

  The amount of the thermal radical generator is preferably 0.01 to 20% by mass, more preferably 0.1 to 10% by mass, and most preferably 0.5 to 5% by mass with respect to the total amount of the photopolymerizable component. If it is less than 0.01% by mass, the curability is lowered and the effect of addition becomes small, and if it exceeds 5% by mass, the amount of outgas increases and the storage stability tends to be reduced.

  The thermal radical generator is not particularly limited as long as it has a 1 minute half-life temperature of 80 ° C. or higher. For example, perhexa 25B (manufactured by NOF Corporation), 2,5-dimethyl-2,5-di Preferable examples include (t-butylperoxyhexane) (1-minute half-life temperature: 180 ° C.), Parkmill D (manufactured by NOF Corporation) and dicumyl peroxide (1-minute half-life temperature: 175 ° C.).

  A sensitizer can be used for the resin composition used by this invention as needed. Examples of the sensitizer include camphorquinone, benzyl, diacetyl, benzyldimethyl ketal, benzyl diethyl ketal, benzyl di (2-methoxyethyl) ketal, 4,4′-dimethylbenzyl-dimethyl ketal, anthraquinone, 1-chloroanthraquinone. 2-chloroanthraquinone, 1,2-benzanthraquinone, 1-hydroxyanthraquinone, 1-methylanthraquinone, 2-ethylanthraquinone, 1-bromoanthraquinone, thioxanthone, 2-isopropylthioxanthone, 2-nitrothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chloro-7-trifluoromethylthioxanthone, Oxanthone-10,10-dioxide, thioxanthone-10-oxide, benzoin methyl ether, benzoin ethyl ether, isopropyl ether, benzoin isobutyl ether, benzophenone, bis (4-dimethylaminophenyl) ketone, 4,4′-bisdiethylaminobenzophenone and A compound containing an azide group is preferred. These can be used alone or in combination of two or more.

When the first resin composition coating layer is B-staged by heat treatment, the viscosity of the resin composition can be adjusted using an organic solvent.
Examples of the organic solvent include N-methyl-2-pyrrolidinone, diethylene glycol dimethyl ether (also referred to as diglyme), triethylene glycol dimethyl ether (also referred to as triglyme), diethylene glycol diethyl ether, 2- (2-methoxyethoxy) ethanol, and γ-butyrolactone. , Isophorone, carbitol, carbitol acetate, 1,3-dimethyl-2-imidazolidinone, 2- (2-butoxyethoxy) ethyl acetate, ethyl cellosolve, ethyl cellosolve acetate, butyl cellosolve, dioxane, cyclohexanone, anisole, A solvent mainly composed of petroleum distillate used as a solvent for printing ink can be mentioned. These can be used individually by 1 type or in mixture of 2 or more types.
When bubbles and voids are conspicuous during the printing of the resin composition, it is effective to add additives such as a defoaming agent, a defoaming agent and a defoaming agent to the solvent. The added amount thereof is preferably 0.01% by mass or more based on the total amount of the solvent and the additive from the viewpoint of exerting the foam suppression effect, and 10% by mass from the viewpoint of the viscosity stability of the resin composition. % Or less is preferable.

  In addition, the resin composition used in the present invention is polymerized with quinones, polyhydric phenols, phenols, phosphites, sulfurs and the like in order to impart storage stability, process adaptability or antioxidant properties. An inhibitor or an antioxidant may be further added as long as the curability of the resin composition is not impaired.

  When the resin composition used in the present invention is the above resin composition, pattern printing by screen printing can be performed more easily, and the manufacturing process can be simplified and shortened and the material cost can be reduced in various applications. be able to. From the viewpoint of effectively utilizing such an effect, this resin composition is suitably used in the method for producing the solar cell module of the present invention, and also a stress coating for power device junction coat film and wafer level CSP in semiconductor applications. It is also preferably used for applications as a material or a die bond material, and in any application, the manufacturing process can be simplified and shortened and the material cost can be reduced. In addition, by adopting screen printing, it is possible to control the film thickness by changing the thickness of the printing plate, and it is not necessary to have a large number of films with different film thicknesses, which facilitates material management.

[Step (3)]
In the step (3), the first conductive layer connecting the electrode and the first wiring member of the first back sheet for solar cell is electrically conductive in the through hole of the first resin composition layer. It is a conductive layer formation process formed using a member, and is a process performed after the process (1) and before the process (2) or after the process (2).
More specifically, in the above-described step (1) or (2), the first surface provided on the back surface of the solar cell cell or the first solar cell back sheet provided with the first wiring member. In the through hole of the first resin composition layer, the resin composition coating layer or the first resin composition coating layer is B-staged to form a first resin composition layer. It is a process of forming the 1st conductive layer which connects the electrode 02 and the 1st wiring member of the 1st solar cell backsheet using (FIGS. 6 and 7). For example, FIG. 6 is a cross-sectional view of the solar battery cell after the conductive member is disposed on the electrode 02, and FIG. 7 is the back surface side of the solar battery cell after the conductive member is disposed on the electrode 02. It is a schematic diagram when it sees from.
In addition, the first conductive layer can be provided on the first wiring member of the first solar cell backsheet provided with the first wiring member, and this method will be described later.

  Examples of the conductive member include solder, gold, silver, aluminum, nickel, copper, platinum, palladium, ruthenium oxide and other electrode materials made of metal oxides. In addition to the metal bumps, for example, Preferred examples include those containing at least conductive particles and a resin component, such as metal-containing conductive films and metal-containing conductive members. As the conductive particles, for example, conductive particles such as metals such as gold, silver, nickel, copper, platinum, palladium, ruthenium oxide and metal oxides thereof, or organometallic compounds are preferably used. Moreover, as a resin component, a thermosetting resin and a thermoplastic resin are used individually or in combination of 2 or more types, respectively.

  Examples of the thermosetting resin used in the conductive member include epoxy resin, cyanate ester resin, maleimide resin, allyl nadiimide resin, phenol resin, urea resin, melamine resin, alkyd resin, acrylic resin, unsaturated polyester resin, Diallyl phthalate resin, silicone resin, resorcinol formaldehyde resin, xylene resin, furan resin, polyurethane resin, ketone resin, triallyl cyanurate resin, polyisocyanate resin, resin containing tris (2-hydroxyethyl) isocyanurate, triallyl Preferred examples include a resin containing trimellitate, a thermosetting resin synthesized from cyclopentadiene, and a thermosetting resin obtained by trimerization of aromatic dicyanamide.

  Examples of the thermoplastic resin used for the conductive member include polyurethane imide resin, polyester resin, polyether resin, polyimide resin, polyamide resin, polyamide imide resin, polyether imide resin, polyurethane resin, polyurethane amide imide resin, and siloxane polyimide. Resin, polyesterimide resin, copolymers thereof, precursors thereof (polyamide acid, etc.), polybenzoxazole resin, phenoxy resin, polysulfone resin, polyethersulfone resin, polyphenylene sulfide resin, polyester resin, polyether resin Preferred examples include polycarbonate resin, polyether ketone resin, (meth) acrylic copolymer having a weight average molecular weight of 10,000 to 1,000,000, novolac resin, and phenol resin.

In addition, the main chain and / or side chain of these resins may be provided with a glycol group such as ethylene glycol or propylene glycol, a carboxyl group, and / or a hydroxyl group. In particular, a paste using silver is excellent in electrical conductivity and widely known for electronic applications such as semiconductors. In recent years, development of materials using copper or solder has been advanced from the viewpoint of material cost.
For the installation of the first conductive layer by the conductive member, it is preferable to select a material suitable for these materials. For example, the screen printing or the injection needle is formed similarly to the formation of the first resin composition coating layer. A method such as a dispensing method by dropping from a syringe provided with such a tip is preferably employed.

  For example, when a conductive paste is used as the conductive member, the screen printing already described in the first resin composition coating layer forming step can be applied. For example, as shown in FIG. 5, when the first resin composition coating layer is provided in a region other than the electrode 02 on the back surface of the solar battery cell, the first conductive layer is the first coating layer. It is preferable that the conductive paste is printed and applied after forming a B-stage into the first resin composition layer. Thereby, when screen-printing the conductive paste, even if the back side of the printing plate comes into contact with the first resin composition layer, the resin composition is stably transferred without being transferred to the back side of the printing plate, and A conductive paste can be printed stably.

  For applying the conductive paste, a so-called dispensing method in which the conductive paste is applied in the form of dots from a syringe-shaped tip can also be applied. In the dispensing method, a certain distance is taken between the electrode and the syringe tip, the conductive paste is pushed out from the syringe tip, and the conductive paste is placed on the electrode 02 in the through hole. In this case, since the tip of the syringe does not touch the first resin composition coating layer already formed on the solar cell, the B-stage of the first resin composition coating layer described above is used. It is also possible to provide a conductive layer in advance. However, since the dispensing method needs to form a conductive layer by extruding a conductive paste from a syringe to each electrode, work efficiency tends to be inferior to screen printing.

  Also, if the conductive paste is a material that can reduce the tack force by being B-staged like the resin composition used in the present invention, after conducting the conductive layer forming step, The first resin composition layer may be formed on a stage. That is, the order of the conductive layer forming step and the resin composition layer forming step (B-stage forming step) may be used.

  When a conductive film is used as the conductive member, a first conductive layer is formed by installing a conductive film punched out with a mold or the like in the same shape as the electrode 02 (through hole) on the electrode 02. The process is common. Alternatively, a conductive material is applied to the electrode by pasting a film on which a conductive material is previously arranged in the same shape as the electrode on a base material such as polyethylene terephthalate, and then peeling off the base material. It can also be installed on the first conductive layer.

  Furthermore, when what has a photosensitive characteristic is used for an electroconductive film, an electroconductive film is first bonded together to the whole back surface of the cell for solar cells. Then, the photoreactive compound in a conductive film is made to react, for example by irradiating an ultraviolet-ray, in the state which shielded the predetermined area | region of the conductive film in the same shape as an electrode using a photomask. Furthermore, the electroconductive film of parts other than an electrode is removed by performing a image development process using the organic alkali developing solution, generally about 1.0-5.0 mass% tetramethylammonium hydroxide aqueous solution. In the above process using a conductive film, since it is considered that the tack force is sufficiently low because it is a supply form in the form of a film, after performing this conductive layer forming process, the resin composition layer forming process is performed. You may go. That is, you may make it the order of a conductive layer formation process and a resin composition layer formation process.

(Connection process)
The manufacturing method of the solar cell module of this invention may have a connection process further. The connecting step is a step of electrically connecting the first conductive layer of the solar cell and the first wiring member via the first conductive layer (see FIG. 7).
For the formation of the first wiring member, a foil material called tab wire generally made of plated aluminum, copper foil, conductor, or the like is used.

For example, as shown in FIG. 8, the connecting step is performed on the first conductive layer already installed on the conductive layer of the solar battery cell provided with the resin composition layer as shown in FIG. A wiring member is arranged, the first conductive layer and the first wiring member are brought into contact with each other, and the first conductive layer is melted by heating, so that it is electrically joined like so-called soldering. .
When a general solder material is used for the first conductive layer, heating at about 200 ° C. is required, but this is caused by a difference in thermal expansion / contraction characteristics between the solar cell and the first wiring member. From the viewpoint of reducing the warpage of the solar cell module, it is preferable to join at a temperature as low as possible, for example, 150 ° C. or less. For example, if the heating temperature is lowered to reduce the warpage of the solar cell module, there is a risk that electrical connection cannot be obtained only by the spontaneous flow of the first conductive layer by heating and melting. In this case, it is effective to further improve connectivity by applying a load simultaneously with heating.

(Resin sealing process)
It is preferable that the manufacturing method of the solar cell module of this invention has a resin sealing process. Here, the resin sealing step is a step of resin-sealing the entire solar cell using a glass sheet, a filling resin, and a solar cell back sheet, and more specifically, shown in FIG. This is a step of resin-sealing the entire solar cell using the glass sheet 12, the filling resin 13, and the first solar cell back sheet 14 (FIG. 10). Here, FIG. 9 has the first resin composition layer 07 shown in FIG. 8, the first conductive layer 10, and the first wiring member 11 provided to conduct with the first conductive layer. Sectional drawing in the (A) line | wire of the cell for solar cells is shown.

The 1st solar cell back sheet 14 is installed in the 1st wiring member 11 and the 1st resin composition layer 07 side of the cell for solar cells. Furthermore, the glass sheet 12 is arrange | positioned at the light-receiving surface 081 side which receives the sunlight of the cell for solar cells. The filling resin 13 is generally disposed between the glass sheet 12 and the light receiving surface 081. If the space between the glass sheet 12 and the first solar cell back sheet 14 can be filled without any gap, the first resin 13 is filled. The solar battery back sheet 14 and the solar battery cell, or between the glass sheet 12 and the light receiving surface 081 and between the first solar battery back sheet 14 and the solar battery cell. May be.
Thereafter, the whole is pressurized while being heated, so that the filling resin 13 having fluidity by heat treatment is filled between the glass sheet 12 and the first solar cell back sheet 14 without any gap, and further, The filling resin is cured by heating at a temperature, and the resin sealing step is completed with a structure as shown in FIG.
The step of filling the filling resin 13 by heating and pressurization and the step of curing the filling resin 13 may be continued and integrated.

Moreover, you may perform the connection process of the 1st conductive layer 10 and the 1st wiring member 11 collectively by this resin sealing process. That is, the first wiring member 11 is installed on the first conductive layer 10 shown in FIGS. 6 and 7 as shown in FIGS. 8 and 9, and the first conductive layer 10 is heated and pressurized in the resin sealing process. The wiring member 11 and the first conductive layer 10 can be connected together.
In this case, since the first resin composition layer 07 and the first conductive layer 10 provided in the solar battery cell are considered to have fluidity by heating, the resin sealing step is, for example, as shown in FIG. In addition, the resin composition layer 07 and the conductive layer 10 are pushed into the wiring member 11.
Here, the glass sheet 12 is a general thin glass plate or a flexible sheet that can be bent. Among them, from the viewpoint of improving the power efficiency of the solar cell, a highly transparent material that does not disturb the incident light is preferable, and an antireflection film (AR film) provided so as not to damage the incident light by reflection or the like. More preferred.

As the filling resin 13, transparency that does not impair incident light on the solar cell, durability that does not deteriorate due to long-term light reception, and adhesion to the glass sheet or the first solar cell back sheet What is excellent in is preferable. Although it does not restrict | limit especially as filling resin to be used, Generally, the filling resin sheet which has ethylene vinyl acetate copolymer resin as a main component is used.
Since the first solar cell back sheet 14 is exposed outdoors as a solar cell module, it is excellent in weather resistance such as light resistance, heat resistance, moisture resistance, etc., and may be in contact with the wiring member. It is excellent in that it has excellent adhesion to the filling resin. Although it does not restrict | limit especially as a back sheet for solar cells to be used, Generally, the single film which consists of polyethylene terephthalate and a polyethylene naphthalate, or what laminated | stacked the said film multiple sheets is used.

  In the above description, the step of forming the first conductive layer on the electrode of the solar cell has been described as the assembly step of the solar cell module. However, the first conductive layer is formed on the first solar cell back sheet. You can also In this case, a first wiring member is set in advance at a desired position on the surface of the first solar cell back sheet (see FIG. 12), and the conductive layer is placed on the first wiring member. The first conductive layer is formed in the same manner as described for the formation step.

  FIG. 13 schematically shows the first solar cell back sheet after the first conductive layer is formed on the first solar cell back sheet. That is, in the method for manufacturing a solar cell module of the present invention, the first wiring member is previously installed on the first solar cell back sheet, the first conductive layer is installed thereon, and the first conductive member is provided. The first conductive layer and the electrode can also be connected by matching the layer and the position of the electrode of the solar cell. Thereby, the electrical connection of the electrode of the cell for solar cells and the 1st wiring member is attained via the 1st conductive layer.

Regarding the connection process between the electrode of the solar cell and the conductive layer, as described in (Connection process), the conductive layer is melted by heating, and connected by pressurization as necessary. It is possible as well.
About the resin sealing step, since the solar cell and the solar battery back sheet are already bonded with the conductive layer and the resin composition, the filling resin is inevitably the glass sheet and the solar cell. Will be placed between.

FIG. 14 shows a cross-sectional view of a solar cell module assembled using such a back sheet for solar cells with wiring members.
The first solar cell backsheet provided with the first wiring member, and the bonding temperature between the first conductive layer and the first wiring member, the filling temperature of the filling resin, the filling resin If the curing temperature is possible at a single temperature, the resin sealing process can be integrated from the connection process.

[Steps (1 ′) to (2 ′)]
The method for producing a solar cell module of the present invention further includes a step (1 ′) a step of forming a third resin composition coating layer that coats the resin composition over the entire light-receiving surface of the solar cell. (2 ′) It is preferable to have a B-stage forming step in which the third resin composition coating layer is B-staged to form a third resin composition layer.
In the case of a back electrode type (back contact type) solar cell having an electrode only on the back surface of the solar cell, the light receiving surface side of the solar cell is usually filled mainly with an ethylene vinyl acetate copolymer resin. A resin sheet is provided. However, since the resin sheet for filling is thick, there may be cases where the material cost and manufacturing cost related to other members are increased. In such a case, providing a resin composition layer using a resin composition as an alternative to the filling resin sheet is effective from the viewpoint of suppressing the thickness of the layer. Moreover, it is extremely effective to use the above resin composition as a resin composition for forming the resin composition layer.

  Steps (1 ') and (2') may be appropriately selected from the embodiments described for steps (1) and (2) above, except that a through hole is provided. That is, the steps (1 ′) and (2 ′) are performed when the light receiving surface of the solar cell has no electrode, and the third resin composition layer provided over the entire surface of the light receiving surface is provided. This is because it is not necessary to have a through hole.

  Steps (1 ') and (2') may be performed after or before steps (1) to (3), and the order thereof is not particularly limited. It is also conceivable that the steps (1 ') and (2') after the steps (1) and (2) are performed, and then the step (3) is performed.

[Process (1 ″) to (3 ″)]
In the present invention, the solar cell may have an electrode on its light receiving surface, and the solar cell module further includes a second resin composition layer on the light receiving surface of the solar cell and a surface on the surface. A second wiring member in order so that the light receiving surface of the solar cell and the second wiring member are opposed to each other, and the solar cell has an electrode on the light receiving surface; Become. In that case, the manufacturing method of the present invention further comprises a step (1 ″) of applying a resin paste on the light receiving surface of the solar cell by screen printing so as to have a through hole corresponding to the electrode. It is preferable to include a coating layer forming step and (2 ″) a B-stage forming step in which the second resin paste coating layer is B-staged to form a second resin composition layer. Further, after the step (1 ″) and before the step (2 ″), or after the step (2 ″), the step (3 ″) in the through hole, the electrode It is preferable to include a conductive layer forming step of forming a second conductive layer that connects the first wiring member and the second wiring member using the conductive member. The solar cell module obtained through the steps (1) to (3) and the steps (1 ″) to (3 ″) is shown in FIG.

  The solar cell module shown in FIG. 15 employs a solar cell having an electrode 01 on the light receiving surface 081 as well as the back surface 082 of the solar cell, and the second conductive layer, The second resin composition layer and the second wiring member are provided in the same manner as the first conductive layer, the first resin composition layer, and the first wiring member for the electrode 02. The second conductive layer, the second resin composition layer, and the second wiring member each include the aspects described for the first conductive layer, the first resin composition layer, and the first wiring member. is there. The second conductive layer, the second resin composition layer, and the second wiring member may be the same as or different from the first conductive layer, the first resin composition layer, and the first wiring member, respectively. Good. The second solar cell front sheet is not particularly limited as long as it has the aspect described for the first solar cell back sheet, and is the same as or different from the first solar cell back sheet. Also good.

  Steps (1 ″) to (3 ″) may be appropriately selected from the embodiments described for steps (1) to (3). In addition, the steps (1 ″) to (3 ″) may be performed after or before the steps (1) to (3), and the order is not particularly limited. From the viewpoint of work efficiency, it is preferable to perform the step (1 ″) after the step (1) and simultaneously perform the steps (2) and (2 ″).

(Resin composition)
The resin composition of the present invention comprises (A) a photopolymerizable component, (B) a photopolymerization initiator, (C) a thermopolymerizable component, (D) a thermosetting agent, (E) a filler, and (F) a thermoplastic. The content of the component (A), the component (C), and the component (F) with respect to the total amount of the component (A), the component (C), and the component (F) is 10 to 70. The content of the component (B) is 3 to 10 parts by mass with respect to 100 parts by mass of the component (A), and the component (D) is 5% by mass, 5 to 70% by mass, and 5 to 40% by mass. The content of the component is 0.01 to 20 parts by mass with respect to 100 parts by mass of the (C) component, and the content of the (E) component is the (A) component, the (C) component, and the ( F) 2 to 50 parts by mass relative to the total 100 parts by mass of the component, the tackiness after B-stage heat treatment or exposure process 4.9 × 10 ⁴ Pa or less There is a resin composition characterized by curing reaction starting temperature of the resin composition obtained by the B-stage is 0.99 ° C. or less.

  The components (A) to (F) are the same as the components of the resin composition that is preferably used as the resin composition in the method for producing the solar cell module of the present invention. The curing reaction start temperature is also the same. In addition to the above components, the components that can be added and the properties of other resin compositions are also the same.

  The resin composition of the present invention can more easily perform pattern printing by screen printing, and can simplify and shorten the manufacturing process and reduce material costs in various applications. From the viewpoint of effectively utilizing such an effect, the resin composition of the present invention is suitably used in the method for producing the solar cell module of the present invention, as well as a junction coat film for power devices and a wafer level CSP in semiconductor applications. It is preferably used for applications as a stress relieving material or a die bonding material, and in any application, the manufacturing process can be simplified and shortened and the material cost can be reduced. In addition, by using screen printing, it is possible to control the film thickness by changing the thickness of the printing plate, and it is not necessary to have a large number of films having different film thicknesses, thus facilitating material management.

  EXAMPLES The present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.

<Preparation of resin solution I>
(Examples 1-6, 8-12, 17-21, Comparative Examples 1, 2, 4, 6-11)
In a flask equipped with a stirrer, a condenser, a thermometer, and a nitrogen displacement device, (C) a thermally polymerizable component is charged into (A) a photopolymerizable component at a ratio shown in Tables 1 to 3, and in an oil bath. And dissolved at 70 ° C.
Next, the flask is taken out from the oil bath, and a thermal radical generator (Dicumyl peroxide, “Park Mill D (trade name)”, manufactured by NOF Corporation) is charged at a rate shown in Tables 1 and 2 with residual heat. After dissolution, the mixture was allowed to cool to room temperature to obtain a resin solution I.

<Preparation of resin solution II>
(Example 7, 13-16)
In a flask equipped with a stirrer, a condenser, a thermometer, and a nitrogen substitution device, after the thermopolymerizable component was charged into the photopolymerizable component at a ratio shown in Table 1, and dissolved in an oil bath at 70 ° C., The mixture was allowed to cool to room temperature to obtain a resin solution II.

<Production I of Resin Composition>
(Examples 1-21, Comparative Examples 1-3, 6-11)
The ratio shown in Tables 1 to 3 ((A) photopolymerizable component, (C) thermopolymerizable component and park mill D, or (A) photopolymerizable component and (C ) The heat-polymerizable component was prepared in advance in the above-mentioned resin solution preparations I and II.) The materials were prepared in the above and mixed at normal pressure for 15 minutes. Kneading was performed for 2 hours under reduced pressure. After kneading, filtration was performed with a 25 μm mesh to obtain a resin composition.

<Preparation II of resin composition>
(Comparative Examples 4 and 5)
In a flask equipped with a stirrer and a temperature control unit (oil bath), 2- (dimethylamino) -2- (4-methylbenzyl) -1- (4-morpholinophenyl) butan-1-one (“I- 379EG (trade name) ”(manufactured by Ciba Japan Co., Ltd.) was added to the photopolymerizable component at the ratio shown in Table 3, stirred and dissolved at 50 ° C. and 100 rpm, taken out from the oil bath, allowed to cool to room temperature, Next, the remaining materials in Table 3 are charged and stirred and mixed at room temperature and 100 rpm.

<Measurement of viscosity and thixotropy index>
The viscosity and thixotropy index of the resin composition were measured by the following methods. Using a Brookfield viscometer ("HBDV-III U CP (model number)", manufactured by Brookfield Engineering Laboratories), and a cone spindle ("CPE-51 (model)" manufactured by Brookfield Engineering Laboratories), 0.5 mL of resin composition The value at a temperature of 25 ° C. and a measurement time of 3 minutes was taken as the viscosity, and the viscosity at a rotational speed of 0.5 rpm and 5 rpm was measured. The thixotropy index was calculated from the following formula.
Thixotropy index = 0.5 rpm viscosity / 5 rpm viscosity The viscosities and thixotropy indices measured for the resin compositions of Examples and Comparative Examples are shown in Tables 1 and 2.

<Measurement of tack force after B-stage>
50 mm × on a substrate (“MCL-E-679F substrate (trade name)”, manufactured by Hitachi Chemical Co., Ltd.) coated with a resist composition (“Aus-308 resist (trade name)”, manufactured by Taiyo Ink Manufacturing Co., Ltd.) The resin composition was applied at 50 mm × 0.010 mm (width × length × thickness), and exposed at 1000 mJ / cm ² in the air using a mask aligner (ML-210FM, manufactured by Mikasa Corporation) equipped with a mercury lamp. A test piece was prepared by performing the treatment to form a B stage.
After making the B stage, using a probe tacking tester (manufactured by Reska Co., Ltd.), probe diameter: 5.1 mm, peeling speed: 10 mm / s, contact load: 100 gf / cm ² (0.98 × 10 ⁴ Pa) The tack force of the resin composition at 30 ° C. was measured under the condition of contact time: 1 s. Tables 1 and 2 show tack forces after the B-stage of the resin compositions of the examples and comparative examples.

<Evaluation of substrate warpage after B-stage>
A resin composition is applied to the entire surface of a 50 mm × 50 mm × 37 μm PET film in a thickness of 20 μm to form a B stage. Examples 1-22, Comparative Examples 1-5, and 7-11 are 1000 mJ / cm < ² > under air | atmosphere using the mask aligner ("ML-210FM (model number)" by Mikasa Co., Ltd.) provided with the mercury lamp. The B stage was formed by exposure processing (UV irradiation) under the conditions, and in Comparative Example 6, the B stage was formed by heat treatment at 150 ° C. for 1 hour.
After the B stage, the substrate was visually checked to determine the presence or absence of warpage. The warpage means that there is a difference in height on the substrate after the B-stage. “◯” indicates that there was no warp, and “×” indicates that there was a warp.

<Measurement of curing start temperature by DSC>
Measurement of the curing reaction start temperature of the resin composition by DSC was performed as follows. First, a resin composition (A) and a resin composition (B _t ) (t is a curing temperature) cured by heating for 5 minutes after being B-staged by exposure treatment (UV irradiation) are shown by a scanning scanning calorimeter ( DSC) (manufactured by TA Instrument Japan) is measured at a heating rate of 5 ° C./min, and the reaction rate is calculated from the obtained exothermic peak area using the following formula.
Reaction rate in curing at t ° C. for 5 minutes = (((A) peak area) − ((B _t ) peak area)) / ((A) peak area)
The curing temperature at which the reaction rate in curing at t ° C. for 5 minutes is 80% or more is defined as the curing start temperature.
In the examples, the measurement was performed at a curing temperature of 150 ° C.

Abbreviations in Tables 1 to 3 are as follows.
FA-512A: manufactured by Hitachi Chemical Co., Ltd., dicyclopentadiene acrylate FA-314A: manufactured by Hitachi Chemical Co., Ltd., nonylphenol ethylene oxide modified acrylate FA-310A: manufactured by Hitachi Chemical Co., Ltd., phenoxyethyl acrylate M-140: N -Acryloyloxyethyl hexahydrophthalimide A-LEN-10: Ethoxylated o-phenylphenol acrylate FA-512M: Dicyclopentenyloxyethyl methacrylate 1032H60: Multifunctional epoxy resin YDCN700-7 manufactured by Japan Epoxy Resin Co., Ltd .: Toto Kasei Co., Ltd. Company-made, cresol novolac-type epoxy resin CTBNX-1009-SP: Ube Industries, Ltd., trade name, carboxylic acid-terminated liquid polybutadiene Poly bd: Idemitsu Ko Manufactured by Sangyo Co., Ltd., hydroxyl-terminated polybutadiene R-972: manufactured by Nippon Aerosil Co., Ltd. 2P4MHZ: manufactured by Shikoku Chemicals Co., Ltd., 2-phenyl-4-methyl-5-hydroxymethylimidazole C17Z: Shikoku Chemicals Co., Ltd., 2-hepta Decylimidazole park mill D: Dicumyl peroxide perbutyl O: NOF Corporation, t-butylperoxy-2-ethylhexanoate I-379EG: Ciba Japan Co., Ltd., 2- (dimethylamino)- 2- (4-Methylbenzyl) -1- (4-morpholinophenyl) butan-1-one

  As shown in Tables 1 and 2, it was found that the resin composition of the present invention hardly shows any warping of the substrate even when it is B-staged. In addition, the resin composition of the present invention can greatly reduce the B-stage time, and can greatly shorten the process time. It has also been found that by lowering the thermosetting temperature of the resin, the range of material selection can be expanded and the warpage of the substrate can be reduced.

According to the present invention, the resin composition layer thinner than the conventionally used filling resin sheet suppresses material costs, yields no problem in the resin sealing process, and positions of the solar cell and the wiring member. It is possible to reduce the complicated work such as alignment and alignment in the resin sealing process, and to manufacture the solar cell module more efficiently. In addition, according to the present invention, by performing the B-stage by UV irradiation, the time required for the B-stage can be significantly reduced, and a resin composition that can greatly reduce the process time can be obtained. In the manufacturing method of the solar cell module of the present invention, the solar cell module can be manufactured more efficiently by using the resin composition of the present invention.
Furthermore, the resin composition of the present invention can more easily perform pattern printing by screen printing, and can simplify and shorten the manufacturing process and reduce material costs in various applications. From the viewpoint of effectively utilizing such an effect, the resin composition of the present invention is suitably used in the method for producing the solar cell module of the present invention, as well as a junction coat film for power devices and a wafer level CSP in semiconductor applications. It is preferably used for applications as a stress relieving material or a die bonding material, and in any application, the manufacturing process can be simplified and shortened and the material cost can be reduced. In addition, by using screen printing, it is possible to control the film thickness by changing the thickness of the printing plate, and it is not necessary to have a large number of films having different film thicknesses, thus facilitating material management.

01 Electrode arranged on solar cell receiving surface 02 Electrode arranged on back surface of solar cell 03 Printing plate outer frame 04 Part embedded in resin in screen printing plate 05 Opening in screen printing plate 06 Squeegee 07 Resin composition (first resin composition layer, second resin composition layer, and third resin composition layer)
081 Photosensitive surface 082 of solar cell cell Back surface of solar cell 09 Silicon substrate 10 of solar cell cell Conductive member (first conductive layer and second conductive layer 11 first wiring member, second Wiring member (tab wire)
12 glass sheet 13 filling resin 14 first solar cell back sheet

Claims (18)

The solar cell has at least a solar cell, a resin composition layer, and a first solar cell back sheet having a first wiring member on the surface thereof, the solar cell having at least the following steps: The solar cell module has an electrode on the back surface opposite to the light receiving surface that receives light, and the back surface and the surface including the first wiring member of the first solar cell back sheet are opposed to each other. Production method.
Step (1) The resin composition is formed by screen printing on the back surface of the solar cell cell or the surface of the first solar cell back sheet having the first wiring member so as to have a through hole corresponding to the electrode. Step of forming the first resin composition coating layer to be applied (2) B-staging step of forming the first B-staged resin composition layer by B-staging the first resin composition coating layer   The manufacturing method according to claim 1, wherein in the step (2), the first resin composition coating layer is B-staged by an exposure treatment or a heat treatment. The manufacturing method of Claim 1 or 2 which has the following processes (3) after the said process (1), before the said process (2), or after this process (2).
Step (3) Conductive layer formation in which a first conductive layer for connecting the electrode and the first wiring member of the first solar cell back sheet is formed in the through hole using a conductive member. Process Furthermore, the manufacturing method in any one of Claims 1-3 which has the following processes.
Step (1 ′) Step of forming a third resin composition coating layer for applying the resin composition over the entire light-receiving surface of the solar cell cell Step (2 ′) B of the third resin composition coating layer B-stage process for forming a third resin composition layer by staging   The manufacturing method according to claim 4, wherein in the step (2 ′), the third resin composition coating layer is B-staged by an exposure treatment or a heat treatment. The solar cell module further includes a second resin composition layer on the light receiving surface of the solar cell and a second solar cell front sheet having a second wiring member on the surface thereof. It has in order that the light-receiving surface of the cell and the surface provided with the second wiring member of the front sheet for the second solar cell face each other, and the cell for solar cell also has an electrode on the light-receiving surface The manufacturing method in any one of Claims 1-3 which has the following processes.
Step (1 ″) Step of forming a second resin composition coating layer (2) by applying the resin composition to the light receiving surface of the solar cell by screen printing so as to have a through hole corresponding to the electrode. '') B-stage forming step of forming the second resin composition layer by forming the second resin composition coating layer into a B-stage   The manufacturing method according to claim 6, wherein, in the step (2 ″), the second resin composition coating layer is B-staged by an exposure treatment or a heat treatment. 8. The method according to claim 6, further comprising the following step (3 '') after the step (1 '') and before the step (2 '') or after the step (2 ''): The manufacturing method as described.
Step (3 ″) A conductive layer forming step of forming a second conductive layer for connecting the electrode and the second wiring member in the through hole using a conductive member. The resin composition comprises (A) a photopolymerizable component, (B) a photopolymerization initiator, (C) a thermopolymerizable component, (D) a thermosetting agent, (E) a filler, and (F) a thermoplastic resin. And the content of the component (A), the component (C), and the component (F) with respect to the total amount of the component (A), the component (C), and the component (F) is 10 to 70% by mass. 5 to 70% by mass, and 5 to 40% by mass, and the content of the component (B) is 3 to 10 parts by mass with respect to 100 parts by mass of the component (A). Content is 0.01-20 mass parts with respect to 100 mass parts of this (C) component, Content of this (E) component is this (A) component, this (C) component, and this (F) 2 to 50 parts by mass relative to the total 100 parts by mass of the component, the tackiness after B-stage heat treatment or exposure process 4.9 × 10 ⁴ Pa or less der , The curing reaction starting temperature of the B-staged so the resin composition is 0.99 ° C. or less, the production method according to claim 1. (A) a photopolymerizable component, (B) a photopolymerization initiator, (C) a thermopolymerizable component, (D) a thermosetting agent, (E) a filler, and (F) a thermoplastic resin, The content of the component (A), the component (C), and the component (F) with respect to the total amount of the component, the component (C), and the component (F) is 10 to 70% by mass, and 5 to 70% by mass, respectively. And the content of the component (B) is 3 to 10 parts by mass with respect to 100 parts by mass of the component (A), and the content of the component (D) is the (C ) 0.01-20 parts by mass with respect to 100 parts by mass of the component, and the content of the (E) component is 100 parts by mass of the total amount of the (A) component, the (C) component, and the (F) component. 2 to 50 parts by weight with respect to parts, the tackiness after B-stage heat treatment or exposure is not more than 4.9 × 10 ⁴ Pa, the B-stage Curing reaction starting temperature resin composition is 0.99 ° C. or less of a resin obtained composition.   The resin composition according to claim 10, wherein (A) the photopolymerizable component is a monofunctional acrylate.   The resin composition according to claim 10 or 11, wherein (C) the thermally polymerizable component is a glycidyl ether type epoxy resin.   (F) The resin composition according to any one of claims 10 to 12, wherein the thermoplastic resin is at least one selected from rubbery polymers and polyimide resins.   Furthermore, the resin composition in any one of Claims 10-13 containing 0.01-20 mass parts (G) thermal radical generator with respect to 100 mass parts of (A) photopolymerizable components.   The resin composition according to any one of claims 10 to 14, wherein the curing start temperature of the mixture of (C) the thermopolymerizable component and (D) the thermosetting agent is 150 ° C or lower.   The resin composition according to any one of claims 10 to 15, which has a viscosity at 25 ° C of 1 to 80 Pa · s.   The thixotropic index is 1.0 to 8.0, The resin composition according to any one of claims 10 to 16.   The resin composition according to any one of claims 10 to 17, which is used for production of a solar cell module.