JP2013177600A - Epoxy resin, epoxy resin composition and cured product thereof - Google Patents
Epoxy resin, epoxy resin composition and cured product thereof Download PDFInfo
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本発明は粘度が低く耐熱性の高い硬化物を与えるエポキシ樹脂及びエポキシ樹脂組成物に関する。 The present invention relates to an epoxy resin and an epoxy resin composition that give a cured product having low viscosity and high heat resistance.
エポキシ樹脂は種々の硬化剤で硬化させることにより、一般的に機械的性質、耐水性、耐薬品性、耐熱性、電気的性質などに優れた硬化物となり、接着剤、塗料、積層板、成形材料、注型材料などの幅広い分野に利用されている。従来工業的に最も使用されている液状エポキシ樹脂としてはビスフェノールＡにエピクロルヒドリンを反応させて得られる化合物が知られている。また、耐熱性が要求される分野においてはオルソクレゾールノボラック型エポキシ樹脂やトリフェニルメタン型エポキシ樹脂などが用いられている。 Epoxy resins are generally cured with various curing agents, resulting in cured products with excellent mechanical properties, water resistance, chemical resistance, heat resistance, electrical properties, etc., adhesives, paints, laminates, moldings It is used in a wide range of fields such as materials and casting materials. Conventionally, as a liquid epoxy resin most used industrially, a compound obtained by reacting bisphenol A with epichlorohydrin is known. In fields where heat resistance is required, orthocresol novolac type epoxy resins, triphenylmethane type epoxy resins, and the like are used.
前記したようなオルソクレゾールノボラック型エポキシ樹脂やトリフェニルメタン型エポキシ樹脂はその硬化物の耐熱性は高いものの、樹脂そのものの状態は常温において半固形、もしくは軟化点５０〜９０℃の固形である。半固形の場合は作業性に問題があり、軟化点が７０〜９０℃の場合は溶融粘度も１５０℃において０．４〜３．０Ｐａ・ｓと高いため高フィラー充填による線膨張率や吸水率の低減化が困難である。 Although the orthocresol novolak type epoxy resin and triphenylmethane type epoxy resin as described above have high heat resistance, the resin itself is semi-solid at room temperature or solid with a softening point of 50 to 90 ° C. In the case of semi-solid, there is a problem in workability. When the softening point is 70 to 90 ° C., the melt viscosity is as high as 0.4 to 3.0 Pa · s at 150 ° C. Is difficult to reduce.
本発明のエポキシ樹脂は従来一般的に使用されてきたエポキシ樹脂と比較して溶融粘度が低く、これを含有するエポキシ樹脂組成物は耐熱性に優れた硬化物を与える。
従って、本発明のエポキシ樹脂組成物は電気・電子材料、成型材料、注型材料、積層材料、塗料、接着剤、レジスト、光学材料などの広範囲の用途にきわめて有用である。
The epoxy resin of the present invention has a low melt viscosity as compared with conventionally used epoxy resins, and an epoxy resin composition containing the epoxy resin gives a cured product having excellent heat resistance.
Therefore, the epoxy resin composition of the present invention is extremely useful for a wide range of applications such as electric / electronic materials, molding materials, casting materials, laminated materials, paints, adhesives, resists, optical materials and the like.
本発明者らはこうした実状に鑑み、耐熱性が高く、しかも適度な軟化点を保ちながら溶融粘度の低いエポキシ樹脂を求めて鋭意検討した結果、特定の構造を有するエポキシ樹脂が、これらの特性を満たすことを見出し、本発明を完成させるに至った。 In light of these circumstances, the present inventors have intensively studied for an epoxy resin having high heat resistance and a low melt viscosity while maintaining an appropriate softening point, and as a result, an epoxy resin having a specific structure has these characteristics. As a result, the present invention has been completed.
すなわち本発明は
（１）式（１）
That is, the present invention relates to (1) formula (1)
で表される成分を４０重量％以上含むエポキシ樹脂、
（２）上記（１）記載のエポキシ樹脂及び硬化剤を含有してなるエポキシ樹脂組成物、
（３）硬化促進剤を含有する上記（２）記載のエポキシ樹脂組成物、
（４）無機充填剤を含有する上記（２）または（３）記載のエポキシ樹脂組成物、
（５）上記（２）、（３）または（４）のいずれか１項に記載のエポキシ樹脂組成物を硬化してなる硬化物
を提供するものである。
An epoxy resin containing 40% by weight or more of the component represented by
(2) An epoxy resin composition comprising the epoxy resin according to the above (1) and a curing agent,
(3) The epoxy resin composition according to the above (2), which contains a curing accelerator,
(4) The epoxy resin composition according to the above (2) or (3), which contains an inorganic filler,
(5) The present invention provides a cured product obtained by curing the epoxy resin composition according to any one of (2), (3), and (4).
式（１）で表される成分を４０重量％以上、好ましくは４５重量％以上含むエポキシ樹脂は例えば下記式（２） An epoxy resin containing 40% by weight or more, preferably 45% by weight or more of the component represented by the formula (1) is, for example, the following formula (2)
で表される化合物とエピハロヒドリンとの反応をアルカリ金属水酸化物の存在下で行うことにより得ることが出来る。 It can obtain by performing reaction of the compound represented by and epihalohydrin in presence of an alkali metal hydroxide.
前記式（２）で表される化合物を得るには例えば以下の方法が採用できる。即ち、アルカリ性条件下でパラクレゾール１モルに対し２モル以上のホルマリンを反応させジメチロール化した後、過剰のパラクレゾールと酸性条件下で脱水縮合反応させ未反応のパラクレゾールを除去することにより式（２）の化合物を主成分とした粗クレゾール樹脂が得られる。この粗クレゾール樹脂をトルエン、ｎ−ヘキサン、メチルイソブチルケトン等の溶媒を用いて再結晶させる工程を繰り返すことにより式（２）で表される化合物を単離精製することが出来る。こうして得られた式（２）で表される化合物は融点が２００℃前後の白色結晶である。 For example, the following method can be employed to obtain the compound represented by the formula (2). That is, after reacting 2 mol or more of formalin with 1 mol of paracresol under alkaline conditions to form dimethylol, dehydration condensation reaction with excess paracresol under acidic conditions is performed to remove unreacted paracresol. A crude cresol resin mainly composed of the compound of 2) is obtained. By repeating the step of recrystallizing this crude cresol resin using a solvent such as toluene, n-hexane, methyl isobutyl ketone, etc., the compound represented by the formula (2) can be isolated and purified. The compound represented by the formula (2) thus obtained is a white crystal having a melting point of around 200 ° C.
本発明のエポキシ樹脂を得る反応において、アルカリ金属水酸化物はその水溶液を使用してもよく、その場合は該アルカリ金属水酸化物の水溶液を連続的に反応系内に添加すると共に減圧下、または常圧下連続的に水及びエピハロヒドリンを流出させ、更に分液し水は除去しエピハロヒドリンは反応系内に連続的に戻す方法でもよい。アルカリ金属水酸化物の使用量は式（２）で表される化合物の水酸基１当量に対して通常０．９〜１．２モルであり、好ましくは０．９５〜１．１モルである。 In the reaction for obtaining the epoxy resin of the present invention, an aqueous solution of the alkali metal hydroxide may be used. In that case, the aqueous solution of the alkali metal hydroxide is continuously added to the reaction system and under reduced pressure. Alternatively, water and epihalohydrin are allowed to flow out continuously under normal pressure, followed by liquid separation, removal of water, and epihalohydrin being continuously returned to the reaction system. The usage-amount of an alkali metal hydroxide is 0.9-1.2 mol normally with respect to 1 equivalent of hydroxyl groups of the compound represented by Formula (2), Preferably it is 0.95-1.1 mol.
また式（２）で表される化合物とエピハロヒドリンの混合物にテトラメチルアンモニウムクロライド、テトラメチルアンモニウムブロマイド、トリメチルベンジルアンモニウムクロライド等の４級アンモニウム塩を触媒として添加し５０〜１５０℃で０．５〜８時間反応させて得られる式（２）の化合物のハロヒドリンエーテル化物にアルカリ金属水酸化物の固体または水溶液を加え、２０〜１２０℃で１〜１０時間反応させ脱ハロゲン化水素（閉環）させる方法でもよい。 Further, a quaternary ammonium salt such as tetramethylammonium chloride, tetramethylammonium bromide, trimethylbenzylammonium chloride or the like is added as a catalyst to a mixture of the compound represented by formula (2) and epihalohydrin at 0.5 to 8 at 50 to 150 ° C. Add a solid or aqueous solution of an alkali metal hydroxide to the halohydrin etherified compound of the formula (2) obtained by reacting for a period of time, and react at 20 to 120 ° C. for 1 to 10 hours to dehydrohalogenate (ring closure). The method may be used.
通常これらの反応において使用されるエピハロヒドリンの量は式（２）の化合物の水酸基１当量に対し通常０．８〜１２モル、好ましくは０．９〜１１モルである。この際、反応を円滑に進行させるためにメタノール、エタノールなどのアルコール類、ジメチルスルホン、ジメチルスルホキシド等の非プロトン性極性溶媒などを添加して反応を行うことが好ましい。 Usually, the amount of epihalohydrin used in these reactions is usually 0.8 to 12 mol, preferably 0.9 to 11 mol, based on 1 equivalent of the hydroxyl group of the compound of formula (2). In this case, it is preferable to carry out the reaction by adding an alcohol such as methanol or ethanol, an aprotic polar solvent such as dimethyl sulfone or dimethyl sulfoxide, etc. in order to make the reaction proceed smoothly.
アルコール類を使用する場合、その使用量はエピハロヒドリンの量に対し通常２〜２０重量％、好ましくは４〜１５重量％である。また非プロトン性極性溶媒を用いる場合はエピハロヒドリンの量に対し通常５〜１５０重量％、好ましくは１０〜１４０重量％である。 When using alcohol, the amount of its use is 2-20 weight% normally with respect to the quantity of epihalohydrin, Preferably it is 4-15 weight%. Moreover, when using an aprotic polar solvent, it is 5-150 weight% normally with respect to the quantity of epihalohydrin, Preferably it is 10-140 weight%.
これらのエポキシ化反応の反応物を水洗後、または水洗無しに加熱減圧下でエピハロヒドリンや溶媒等を除去する。また更に加水分解性ハロゲンの少ないエポキシ樹脂とするために、回収したエポキシ樹脂をトルエン、メチルイソブチルケトンなどの溶剤に溶解し、水酸化ナトリウム、水酸化カリウムなどのアルカリ金属水酸化物の水溶液を加えて反応を行い、閉環を確実なものにすることも出来る。この場合アルカリ金属水酸化物の使用量はエポキシ化に使用した式（２）の化合物の水酸基１当量に対して通常０．０１〜０．３モル、好ましくは０．０５〜０．２モルである。反応温度は通常５０〜１２０℃、反応時間は通常０．５〜２時間である。 After the reaction product of these epoxidation reactions is washed with water or without washing with water, the epihalohydrin, the solvent and the like are removed under heating and reduced pressure. In order to make the epoxy resin less hydrolyzable halogen, the recovered epoxy resin is dissolved in a solvent such as toluene or methyl isobutyl ketone, and an aqueous solution of an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide is added. The reaction can be carried out to ensure the ring closure. In this case, the amount of alkali metal hydroxide used is usually 0.01 to 0.3 mol, preferably 0.05 to 0.2 mol, based on 1 equivalent of the hydroxyl group of the compound of formula (2) used for epoxidation. is there. The reaction temperature is usually 50 to 120 ° C., and the reaction time is usually 0.5 to 2 hours.
反応終了後、生成した塩を濾過、水洗などにより除去し、更に加熱減圧下溶剤を留去することにより式（１）で表されるエポキシ樹脂を４０重量％以上含むエポキシ樹脂が得られる。 After completion of the reaction, the produced salt is removed by filtration, washing with water, etc., and the solvent is further distilled off under heating and reduced pressure to obtain an epoxy resin containing 40% by weight or more of the epoxy resin represented by the formula (1).
以下、本発明のエポキシ樹脂組成物について説明する。本発明のエポキシ樹脂は単独でまたは他のエポキシ樹脂と併用して使用することが出来る。併用する場合、本発明のエポキシ樹脂の全エポキシ樹脂中に占める割合は３０重量％以上が好ましく、特に４０重量％以上が好ましい。 Hereinafter, the epoxy resin composition of the present invention will be described. The epoxy resin of the present invention can be used alone or in combination with other epoxy resins. When used in combination, the proportion of the epoxy resin of the present invention in the total epoxy resin is preferably 30% by weight or more, particularly preferably 40% by weight or more.
本発明のエポキシ樹脂混合物と併用し得る他のエポキシ樹脂の具体例としては、ノボラック型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、トリフェニルメタン型エポキシ樹脂、ビフェニル型エポキシ樹脂、ジシクロペンタジエンフェノール共縮合型エポキシ樹脂、ビフェニルノボラック型エポキシ樹脂などが挙げられるがこれらは単独で用いてもよく、２種以上併用してもよい。 Specific examples of other epoxy resins that can be used in combination with the epoxy resin mixture of the present invention include novolac type epoxy resins, bisphenol A type epoxy resins, bisphenol F type epoxy resins, triphenylmethane type epoxy resins, biphenyl type epoxy resins, diphenyls. Cyclopentadienephenol co-condensation type epoxy resin, biphenyl novolac type epoxy resin and the like can be mentioned, but these may be used alone or in combination of two or more.
本発明のエポキシ樹脂組成物が含有する硬化剤としては、例えばアミン系化合物、酸無水物系化合物、アミド系化合物、フェノ−ル系化合物などが挙げられる。用い得る硬化剤の具体例としては、ジアミノジフェニルメタン、ジエチレントリアミン、トリエチレンテトラミン、ジアミノジフェニルスルホン、イソホロンジアミン、ジシアンジアミド、リノレン酸の２量体とエチレンジアミンとより合成されるポリアミド樹脂、無水フタル酸、無水トリメリット酸、無水ピロメリット酸、無水マレイン酸、テトラヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、無水メチルナジック酸、ヘキサヒドロ無水フタル酸、メチルヘキサヒドロ無水フタル酸、フェノ−ルノボラック、及びこれらの変性物、イミダゾ−ル、ＢＦ３−アミン錯体、グアニジン誘導体などが挙げられるがこれらに限定されるものではない。これらは単独で用いてもよく、２種以上併用してもよい。 Examples of the curing agent contained in the epoxy resin composition of the present invention include amine compounds, acid anhydride compounds, amide compounds, phenol compounds, and the like. Specific examples of the curing agent that can be used include diaminodiphenylmethane, diethylenetriamine, triethylenetetramine, diaminodiphenylsulfone, isophoronediamine, dicyandiamide, a polyamide resin synthesized from linolenic acid and ethylenediamine, phthalic anhydride, triethylene anhydride. Meritic acid, pyromellitic anhydride, maleic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, phenol novolac, and modified products thereof, Examples include, but are not limited to, imidazole, BF 3 -amine complexes, guanidine derivatives, and the like. These may be used alone or in combination of two or more.
本発明のエポキシ樹脂組成物において硬化剤の使用量は、エポキシ樹脂のエポキシ基１当量に対して０．７〜１．２当量が好ましい。エポキシ基１当量に対して、０．７当量に満たない場合、あるいは１．２当量を超える場合、いずれも硬化が不完全となり良好な硬化物性が得られない恐れがある。 In the epoxy resin composition of the present invention, the amount of the curing agent used is preferably 0.7 to 1.2 equivalents relative to 1 equivalent of the epoxy group of the epoxy resin. When less than 0.7 equivalent or more than 1.2 equivalent with respect to 1 equivalent of epoxy group, curing may be incomplete and good cured properties may not be obtained.
また本発明のエポキシ樹脂組成物においては硬化促進剤を使用しても差し支えない。用い得る硬化促進剤の具体例としては２−メチルイミダゾール、２−エチルイミダゾール、２−エチル−４−メチルイミダゾール等のイミダゾ−ル類、２−（ジメチルアミノメチル）フェノール、１，８−ジアザ−ビシクロ（５，４，０）ウンデセン−７等の第３級アミン類、トリフェニルホスフィン等のホスフィン類、オクチル酸スズ等の金属化合物等が挙げられる。硬化促進剤はエポキシ樹脂１００重量部に対して０．１〜５．０重量部が必要に応じ用いられる。 In the epoxy resin composition of the present invention, a curing accelerator may be used. Specific examples of curing accelerators that can be used include imidazoles such as 2-methylimidazole, 2-ethylimidazole, 2-ethyl-4-methylimidazole, 2- (dimethylaminomethyl) phenol, 1,8-diaza- And tertiary amines such as bicyclo (5,4,0) undecene-7, phosphines such as triphenylphosphine, and metal compounds such as tin octylate. The curing accelerator is used as necessary in an amount of 0.1 to 5.0 parts by weight based on 100 parts by weight of the epoxy resin.
本発明のエポキシ樹脂組成物は必要により無機充填剤を含有しうる。用いうる無機充填剤の具体例としてはシリカ、アルミナ、タルク等が挙げられる。無機充填剤は本発明のエポキシ樹脂組成物中において０〜９０重量％を占める量が用いられる。更に本発明のエポキシ樹脂組成物には、シランカップリング剤、ステアリン酸、パルミチン酸、ステアリン酸亜鉛、ステアリン酸カルシウム等の離型剤、顔料等の種々の配合剤を添加することができる。 The epoxy resin composition of the present invention may contain an inorganic filler as necessary. Specific examples of the inorganic filler that can be used include silica, alumina, talc and the like. The inorganic filler is used in an amount of 0 to 90% by weight in the epoxy resin composition of the present invention. Furthermore, various compounding agents such as silane coupling agents, mold release agents such as stearic acid, palmitic acid, zinc stearate, calcium stearate, and pigments can be added to the epoxy resin composition of the present invention.
本発明のエポキシ樹脂組成物は、各成分を均一に混合することにより得られる。本発明のエポキシ樹脂組成物は従来知られている方法と同様の方法で容易にその硬化物とすることができる。例えばエポキシ樹脂、硬化剤並びに必要により硬化促進剤、無機充填剤及び配合剤とを必要に応じて押出機、ニ−ダ、ロ−ル等を用いて均一になるまで充分に混合してエポキシ樹脂組成物を得、そのエポキシ樹脂組成物を溶融後注型あるいはトランスファ−成型機などを用いて成型し、さらに８０〜２００℃で２〜１０時間加熱することにより硬化物を得ることができる。 The epoxy resin composition of this invention is obtained by mixing each component uniformly. The epoxy resin composition of the present invention can be easily made into a cured product by a method similar to a conventionally known method. For example, an epoxy resin, a curing agent and, if necessary, a curing accelerator, an inorganic filler, and a compounding agent are thoroughly mixed using an extruder, a kneader, a roll, etc., as necessary, until they are uniform, and then an epoxy resin. A cured product can be obtained by obtaining a composition, molding the epoxy resin composition after casting using a casting or transfer molding machine, and heating at 80 to 200 ° C. for 2 to 10 hours.
また本発明のエポキシ樹脂組成物をトルエン、キシレン、アセトン、メチルエチルケトン、メチルイソブチルケトン等の溶剤に溶解させ、ガラス繊維、カ−ボン繊維、ポリエステル繊維、ポリアミド繊維、アルミナ繊維、紙などの基材に含浸させ加熱半乾燥して得たプリプレグを熱プレス成型して硬化物を得ることもできる。この際の溶剤は、本発明のエポキシ樹脂組成物と該溶剤の混合物中で通常１０〜７０重量％、好ましくは１５〜７０重量％を占める量を用いる。 In addition, the epoxy resin composition of the present invention is dissolved in a solvent such as toluene, xylene, acetone, methyl ethyl ketone, methyl isobutyl ketone, etc., and is applied to a substrate such as glass fiber, carbon fiber, polyester fiber, polyamide fiber, alumina fiber, paper, etc. A prepreg obtained by impregnation and heating and semi-drying can be subjected to hot press molding to obtain a cured product. The solvent used here is usually 10 to 70% by weight, preferably 15 to 70% by weight in the mixture of the epoxy resin composition of the present invention and the solvent.
次に本発明を実施例により更に具体的に説明するが、以下において部は特に断わりのない限り重量部である。 EXAMPLES Next, the present invention will be described more specifically with reference to examples. In the following, parts are parts by weight unless otherwise specified.
実施例１
温度計、滴下ロート、冷却管、撹拌器を取り付けたフラスコに窒素ガスパージを施しながら式（２）で表される化合物１１６部（融点１９７℃）、エピクロルヒドリン３７０部、ジメチルスルホキシド９２．５部を仕込み撹拌下で４５℃まで昇温し、溶解させた。次いでフレーク状水酸化ナトリウム４０．４部を１００分かけて分割添加し、その後、更に４５℃で２時間、７０℃で１時間反応させた。反応終了後、ロータリーエバポレーターを使用して加熱減圧下、ジメチルスルホキシド及び過剰のエピクロルヒドリン等を留去し残留物に３４４部のメチルイソブチルケトンを加え溶解した。
Example 1
A flask equipped with a thermometer, a dropping funnel, a condenser, and a stirrer was charged with 116 parts of the compound represented by formula (2) (melting point: 197 ° C.), 370 parts of epichlorohydrin, and 92.5 parts of dimethyl sulfoxide while purging with nitrogen gas. The temperature was raised to 45 ° C. with stirring to dissolve. Subsequently, 40.4 parts of flaky sodium hydroxide was added in portions over 100 minutes, and then further reacted at 45 ° C. for 2 hours and at 70 ° C. for 1 hour. After completion of the reaction, dimethyl sulfoxide, excess epichlorohydrin and the like were distilled off under reduced pressure by heating using a rotary evaporator, and 344 parts of methyl isobutyl ketone was added to the residue and dissolved.
このメチルイソブチルケトンの溶液を７０℃に加熱し３０重量％の水酸化ナトリウム水溶液１０部を添加し、１時間反応させた後洗浄液が中性になるまで水洗を繰り返した。更に水層は分離除去し、エポキシ樹脂（Ａ）１５０部を得た。得られたエポキシ樹脂中に含まれる式（１）で表されるエポキシ樹脂の割合はゲルパーミエーションクロマトグラフィー分析によると４９．４重量％であり、残りは高分子量体であった。エポキシ樹脂（Ａ）の軟化点は６６．７℃、１５０℃における溶融粘度は０．１３Ｐａ・ｓであり、エポキシ当量は２２２ｇ／ｅｑであった。 This methyl isobutyl ketone solution was heated to 70 ° C., 10 parts of a 30% by weight aqueous sodium hydroxide solution was added, reacted for 1 hour, and then washed with water until the washing solution became neutral. Further, the aqueous layer was separated and removed to obtain 150 parts of an epoxy resin (A). The proportion of the epoxy resin represented by the formula (1) contained in the obtained epoxy resin was 49.4% by weight according to gel permeation chromatography analysis, and the rest was a high molecular weight product. The softening point of the epoxy resin (A) was 66.7 ° C., the melt viscosity at 150 ° C. was 0.13 Pa · s, and the epoxy equivalent was 222 g / eq.
実施例２、３ 比較例１、２
実施例２として得られたエポキシ樹脂（Ａ）に対し、又、比較例１としてＥＯＣＮ−１０２０（日本化薬（株）製、軟化点６６．５℃、１５０℃における溶融粘度０．２９Ｐａ・ｓ、エポキシ当量２０１ｇ／ｅｑ）に対し硬化剤としてフェノールノボラック（軟化点８３℃、水酸基当量１０６ｇ／ｅｑ）、硬化促進剤としてトリフェニルホスフィン（ＴＰＰ）、無機充填剤として球状シリカ（平均粒径３０ミクロン）及び破砕シリカ（平均粒径５ミクロン）を用いて表１の「配合物の組成の欄」に示す重量比で配合し、７０℃で１５分ロールで混練し、１７５℃、成型圧力７０Ｋｇ／ｃｍ２の条件でスパイラルフローを測定した（実施例２、比較例１）。また、無機充填剤を加えずに表１の「配合物の組成の欄」に示した組成物を１８０秒間トランスファー成型してその後１６０℃で２時間、更に１８０℃で８時間硬化せしめて試験片を作成し、下記の条件でガラス転移点を測定し表１の「硬化物の物性の欄」に示した（実施例３、比較例２）。
Examples 2 and 3 Comparative Examples 1 and 2
For the epoxy resin (A) obtained as Example 2, and as Comparative Example 1, EOCN-1020 (manufactured by Nippon Kayaku Co., Ltd., softening point 66.5 ° C., melt viscosity at 150 ° C. 0.29 Pa · s) , Epoxy novolak (softening point 83 ° C., hydroxyl group equivalent 106 g / eq), curing accelerator triphenylphosphine (TPP), spherical silica (average particle size 30 microns) ) And crushed silica (average particle size: 5 microns), and blended at a weight ratio shown in “Composition column” in Table 1, kneaded with a roll at 70 ° C. for 15 minutes, 175 ° C., molding pressure 70 kg / Spiral flow was measured under the conditions of cm 2 (Example 2, Comparative Example 1). Further, a test piece was prepared by transfer molding the composition shown in “Composition of composition” in Table 1 without adding an inorganic filler for 180 seconds and then curing at 160 ° C. for 2 hours and further at 180 ° C. for 8 hours. The glass transition point was measured under the following conditions, and the results are shown in “Physical properties of cured product” in Table 1 (Example 3, Comparative Example 2).
ガラス転移点
熱機械測定装置（ＴＭＡ）：真空理工（株）製 ＴＭ−７０００
昇温速度：２℃／ｍｉｎ．
Glass transition point Thermomechanical measurement device (TMA): TM-7000, manufactured by Vacuum Riko Co., Ltd.
Temperature increase rate: 2 ° C./min.
このように本発明のエポキシ樹脂を用いたエポキシ樹脂組成物は表１に示されるように極めて低い粘度（無機充填剤含有量が８０％と比較的高いにも関わらすスパイラルフローが一般的に使用されるクレゾールノボラック型エポキシ樹脂よりも長いことから判断される）及びその硬化物は優れた耐熱性（ガラス転移点が高いことから判断される）を示した。 Thus, as shown in Table 1, the epoxy resin composition using the epoxy resin of the present invention generally uses a very low viscosity (spiral flow in spite of a relatively high inorganic filler content of 80%). The cured product showed excellent heat resistance (determined from the high glass transition point).
Claims (6)
式（１）
で表されるフェノール系三核体を２種以上でエポキシ樹脂の原料とする場合を除く。） Formula (2)
Formula (1)
The case where two or more types of phenolic trinuclear compounds represented by the above formula are used as raw materials for epoxy resins is excluded. )
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60210617A (en) * | 1984-04-04 | 1985-10-23 | Mitsui Petrochem Ind Ltd | Production of dehydration condensate from methylol group-containing phenol and phenol |
| JPS6155113A (en) * | 1984-08-24 | 1986-03-19 | Mitsubishi Petrochem Co Ltd | Cresol novolak epoxy resin and its production |
| JPH09127690A (en) * | 1995-10-30 | 1997-05-16 | Shin Etsu Chem Co Ltd | Positive type photoresist material |
| JP2001096926A (en) * | 1999-10-04 | 2001-04-10 | Showa Highpolymer Co Ltd | Phenolic three-core body composition and developer composed of the composition used for heat-sensitive recording material |
| JP2003237243A (en) * | 2002-02-13 | 2003-08-27 | Nippon Kayaku Co Ltd | Heat-sensitive recording material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60210617A (en) * | 1984-04-04 | 1985-10-23 | Mitsui Petrochem Ind Ltd | Production of dehydration condensate from methylol group-containing phenol and phenol |
| JPS6155113A (en) * | 1984-08-24 | 1986-03-19 | Mitsubishi Petrochem Co Ltd | Cresol novolak epoxy resin and its production |
| JPH09127690A (en) * | 1995-10-30 | 1997-05-16 | Shin Etsu Chem Co Ltd | Positive type photoresist material |
| JP2001096926A (en) * | 1999-10-04 | 2001-04-10 | Showa Highpolymer Co Ltd | Phenolic three-core body composition and developer composed of the composition used for heat-sensitive recording material |
| JP2003237243A (en) * | 2002-02-13 | 2003-08-27 | Nippon Kayaku Co Ltd | Heat-sensitive recording material |
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