JP2013173184A - Flux for lead-free solder, lead-free solder paste and lead-free wire solder - Google Patents
Flux for lead-free solder, lead-free solder paste and lead-free wire solder Download PDFInfo
- Publication number
- JP2013173184A JP2013173184A JP2013009493A JP2013009493A JP2013173184A JP 2013173184 A JP2013173184 A JP 2013173184A JP 2013009493 A JP2013009493 A JP 2013009493A JP 2013009493 A JP2013009493 A JP 2013009493A JP 2013173184 A JP2013173184 A JP 2013173184A
- Authority
- JP
- Japan
- Prior art keywords
- flux
- lead
- component
- acid
- free
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004907 flux Effects 0.000 title claims abstract description 72
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 56
- 239000002253 acid Substances 0.000 claims abstract description 20
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 10
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 9
- 239000000539 dimer Substances 0.000 claims abstract description 9
- 150000002148 esters Chemical class 0.000 claims abstract description 9
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 4
- 239000012190 activator Substances 0.000 claims abstract description 3
- 239000000843 powder Substances 0.000 claims description 15
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Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
本発明は、鉛フリーはんだ用フラックス、鉛フリーソルダペーストおよび鉛フリー糸はんだ The present invention relates to a flux for lead-free solder, a lead-free solder paste, and a lead-free yarn solder.
はんだ付用のフラックスは、例えばＩＣやコンデンサ、抵抗器等の電子部品をプリント基板等に表面実装する際に用いる材料であり、ロジン類をベース材としたものが一般的に使用されている。これは、ロジン類が適度な活性を有しており、フラックスの粘度を調整し易いなどの理由による。 The soldering flux is a material used when surface mounting electronic parts such as ICs, capacitors, resistors, etc. on a printed circuit board or the like, and a rosin base material is generally used. This is because rosins have an appropriate activity and it is easy to adjust the viscosity of the flux.
フラックスは、電極に直接塗布する場合もあれば、糸はんだのコア材として、或いははんだ合金粉末と混合しソルダペーストとして使用される場合もある。例えばソルダペーストは通常、プリント基板の電極上にスクリーン印刷やディスペンサー等によって供給され、その上に電子部品を載置し、当該基板をはんだ金属の融点以上に加熱することによって、電子部品と電極が接合される。 The flux may be applied directly to the electrode, or may be used as a solder paste core material or as a solder paste mixed with solder alloy powder. For example, the solder paste is usually supplied by screen printing or a dispenser on the electrode of the printed circuit board, and the electronic component is placed on the electrode and heated to a temperature higher than the melting point of the solder metal. Be joined.
ところで、従前主流であった鉛共晶はんだ合金と比較して、現在主流の錫−銀系や錫−亜鉛系の鉛フリーはんだ合金は融点が高く酸化し易いため、フラックスを原料とする鉛フリーソルダペーストには、はんだ付時に電子部品と電極の鉛フリーはんだ合金が電極上で十分に濡れ広がらない問題がある。 By the way, compared to lead eutectic solder alloys, which have been the mainstream, the current mainstream tin-silver and tin-zinc lead-free solder alloys have a high melting point and are easy to oxidize. The solder paste has a problem that the lead-free solder alloy of the electronic component and the electrode does not sufficiently wet and spread on the electrode during soldering.
また、電子部品と電極の接合部は、はんだ付後に生ずるフラックス残渣で覆うことによりその後の酸化を防止できるが、ベース材であるロジン類や他の成分（硬化剤等）の種類によっては残渣に大小のクラックが生じることがある。しかし、こうしたクラックに水分が付着すると、例えば金属イオン等の電解質が移動する所謂マイグレーション現象が生じ、実装基板の信頼性が損なわれてしまう。そのため、クラックを有するフラックス残渣は通常、洗浄剤によって除去しなければならないが、製品の高コスト化を招く。 In addition, the junction between the electronic component and the electrode can be prevented from being oxidized by covering it with a flux residue generated after soldering. However, depending on the type of rosins and other components (such as curing agents) that are base materials, Large and small cracks may occur. However, when moisture adheres to such cracks, for example, a so-called migration phenomenon occurs in which an electrolyte such as metal ions moves, and the reliability of the mounting substrate is impaired. Therefore, the flux residue having cracks usually has to be removed by a cleaning agent, but this leads to an increase in the cost of the product.
フラックス残渣の耐クラック性を向上させたフラックスとしては、アビエチン酸型樹脂酸の含有量が所定の範囲に調整したロジン類（水添ロジン、不均化ロジン等）をベース材として用いたものが知られているが（特許文献１参照）、クラックの低減効果は十分でなく、濡れ性にも劣る。 The flux that improves the crack resistance of the flux residue is one that uses rosins (hydrogenated rosin, disproportionated rosin, etc.) whose content of abietic acid resin acid is adjusted to a predetermined range as a base material. Although known (see Patent Document 1), the effect of reducing cracks is not sufficient, and the wettability is also poor.
本発明は、鉛フリーはんだ合金の濡れ性を良くし、かつフラックス残渣にクラックを生じ難いフラックス組成物を提供することを課題とする。 An object of the present invention is to provide a flux composition that improves the wettability of a lead-free solder alloy and hardly causes cracks in a flux residue.
本発明者らは鋭意検討した結果、所定の添加剤を配合したフラックスにより前記課題を解決し得ることを見出した。 As a result of intensive studies, the present inventors have found that the above-mentioned problems can be solved by a flux containing a predetermined additive.
すなわち本発明は、ダイマー酸ジアルキルエステル（Ａ）を含有する鉛フリーはんだ用フラックス（以下、単にフラックスという）、当該フラックスと鉛フリーはんだ粉末を含有する鉛フリーはんだペースト、および当該フラックスを用いて得られる鉛フリー糸はんだに関する。 That is, the present invention is obtained using a lead-free solder flux containing dimer acid dialkyl ester (A) (hereinafter simply referred to as flux), a lead-free solder paste containing the flux and lead-free solder powder, and the flux. Related to lead-free thread solder.
本発明のフラックスによれば、はんだ付時における鉛フリーはんだ金属の十分な濡れ性を確保できる。また、フラックス残渣にクラックが生じ難いため、実装基板の信頼性を確保できる。このクラック低減効果は、フラックス原料として残渣にクラックを生じさせ易い材料（ベース材、硬化剤等）を使用した際に特に顕著である。また、このフラックス残渣は適度に柔かいため、はんだ接合部にピンを接触させ導電性を確認するための試験（ピンコタクト試験）の実施が容易になる。また、このフラックスは残渣を洗浄除去する必要が特に無いため、特に無洗浄タイプの実装基板に適している。 According to the flux of the present invention, sufficient wettability of the lead-free solder metal during soldering can be ensured. In addition, since the crack is hardly generated in the flux residue, the reliability of the mounting substrate can be ensured. This crack reduction effect is particularly remarkable when a material (base material, curing agent, etc.) that easily causes cracks in the residue is used as the flux material. Moreover, since this flux residue is moderately soft, it becomes easy to perform a test (pin contact test) for checking conductivity by bringing a pin into contact with a solder joint. Further, since this flux does not require any residue to be removed, it is particularly suitable for a non-cleaning type mounting substrate.
本発明のフラックスに添加するダイマー酸ジアルキルエステル（Ａ）（以下、（Ａ）成分という）は、各種公知のものを特に制限なく用いることができる。（Ａ）成分は、具体的には、ダイマー酸（ａ１）（以下、（ａ１）成分という）とモノアルコール（ａ２）（以下、（ａ２）成分という）とから得られるエステル化合物である。（Ａ）成分の製造法は特に限定されず、各種公知の方法を採用できる。 As dimer acid dialkyl ester (A) (hereinafter referred to as component (A)) to be added to the flux of the present invention, various known ones can be used without particular limitation. Specifically, the component (A) is an ester compound obtained from dimer acid (a1) (hereinafter referred to as component (a1)) and monoalcohol (a2) (hereinafter referred to as component (a2)). The manufacturing method of (A) component is not specifically limited, Various well-known methods are employable.
（ａ１）成分は、不飽和脂肪酸の二量化物であり、該不飽和脂肪酸としては、各種公知のものを特に制限なく用いることができる。具体的には、炭素数８〜３６程度の不飽和脂肪酸として、例えばリノレン酸やトール油脂肪酸、オレイン酸、リノール酸等が好適である。また、（ａ２）成分としては、各種公知のものを特に制限なく用いることができ、アルキル基の炭素数が通常１〜２０程度、好ましくは２〜１０の直鎖状、分岐状または環状のモノアルコールが好適である。 The component (a1) is a dimerized product of unsaturated fatty acids, and various known ones can be used without particular limitation as the unsaturated fatty acid. Specifically, for example, linolenic acid, tall oil fatty acid, oleic acid, linoleic acid and the like are preferable as the unsaturated fatty acid having about 8 to 36 carbon atoms. Moreover, as (a2) component, various well-known things can be used without a restriction | limiting, The carbon number of an alkyl group is about 1-20 normally, Preferably it is a linear, branched, or cyclic | annular thing of about 2-10. Alcohol is preferred.
（Ａ）成分の物性は特に限定されないが、通常は常温で液状であり、また酸価が通常１以下である。また、（Ａ）成分の市販品としては、例えばＫＡＫ ＤＡＰＩＰ−Ｒ（高級アルコール工業（株）製）や、ＥＭＥＲＹ２９００（ヘンケル（株）製）、ＥＭＥＲＹ２９０５（ヘンケル（株）社製）、ハリダイマー２００（ハリマ化成（株）製）、ハリダイマー５００（ハリマ化成（株）製）などを例示できる。 Although the physical property of (A) component is not specifically limited, Usually, it is liquid at normal temperature, and an acid value is 1 or less normally. Moreover, as a commercial item of (A) component, for example, KAK DAPIP-R (manufactured by Higher Alcohol Industry Co., Ltd.), EMERY2900 (manufactured by Henkel Co., Ltd.), EMERY2905 (manufactured by Henkel Co., Ltd.), Halidimer 200 ( Harima Chemical Co., Ltd.), Hari Dimer 500 (Harima Chemical Co., Ltd.) and the like can be exemplified.
本発明のフラックスには更にロジン類（Ｂ）（以下、（Ｂ）成分という）、活性剤（Ｃ）（以下、（Ｃ）成分という）、チキソトロピック剤（Ｄ）（以下、（Ｄ）成分という）、フラックス用溶剤（Ｅ）（以下、（Ｅ）成分という）、及び酸化防止剤（Ｆ）（以下、（Ｆ）成分という）を含めることができる。 The flux of the present invention further includes rosins (B) (hereinafter referred to as component (B)), activator (C) (hereinafter referred to as component (C)), thixotropic agent (D) (hereinafter referred to as component (D)). A flux solvent (E) (hereinafter referred to as component (E)) and an antioxidant (F) (hereinafter referred to as component (F)).
（Ｂ）成分としては、各種公知のものを特に制限なく使用できる。具体的には、例えばガムロジンやウッドロジン等のロジン類；α，β−不飽和カルボン酸（アクリル酸、メタクリル酸、マレイン酸、無水マレイン酸、フマル酸等）とロジン類とから得られるディールスアルダー反応物やその水素化物、重合ロジンやその水素化物、ロジン類の水素化物（水添ロジン）、ロジン類の不均化物（不均化ロジン）等の変性ロジン類；該ロジン類や変性ロジン類と、グリセリンやペンタエリスリトール等のポリオールとから得られるロジンエステル等を例示でき、これらは１種を単独で、又は２種以上を組み合わせて使用できる。これらの中でも前記ディールスアルダー反応物やその水素化物は、分子内に複数のカルボキシル基を有しており、濡れ性等のフラックス性能に優れるため好ましい。なお、該ディールスアルダー反応物やその水素化物はフラックス残渣にクラックを生じさせ易いが、本発明のフラックスには前記（Ａ）成分が含まれているため、クラックが生じ難い。 As the component (B), various known compounds can be used without particular limitation. Specifically, for example, rosins such as gum rosin and wood rosin; Diels-Alder reaction obtained from α, β-unsaturated carboxylic acid (acrylic acid, methacrylic acid, maleic acid, maleic anhydride, fumaric acid, etc.) and rosins And hydrides thereof, modified rosins such as polymerized rosin and hydrides thereof, hydrogenated rosins (hydrogenated rosins), disproportionates of rosins (disproportionated rosins); and the rosins and modified rosins Examples thereof include rosin esters obtained from polyols such as glycerin and pentaerythritol, and these can be used alone or in combination of two or more. Among these, the Diels-Alder reactant and its hydride are preferable because they have a plurality of carboxyl groups in the molecule and are excellent in flux performance such as wettability. The Diels-Alder reactant and its hydride easily cause cracks in the flux residue. However, since the flux (A) is contained in the flux of the present invention, cracks are unlikely to occur.
（Ｃ）成分としては、各種公知のものを特に制限なく使用できる。具体的には、例えばコハク酸、アジピン酸、アゼライン酸、グルタル酸、セバシン酸、ドデカン２酸、ダイマー酸、フマル酸、マレイン酸、イタコン酸等の飽和又は不飽和の脂肪族二塩基酸類；ｔｒａｎｓ−２，３−ジブロモ−１，４−ブテンジオールやｃｉｓ−２，３−ジブロモ−１，４−ブテンジオール、１−ブロモ−２−ブタノール、１−ブロモ−２−プロパノール、３−ブロモ−１−プロパノール、３−ブロモ−１，２−プロパンジオール、１，４−ジブロモ−２−ブタノール、１，３−ジブロモ−２−プロパノール、２，３−ジブロモ−１−プロパノール等のブロモアルコール類；３−ブロモプロピオン酸、２−ブロモ吉草酸、５−ブロモ−ｎ−吉草酸、２−ブロモイソ吉草酸、２，３−ジブロモコハク酸、２−ブロモコハク酸、２，２−ジブロモアジピン酸等のブロモジカルボン酸類；カプリン酸、ラウリン酸、ミリスチン酸、パルミチン酸、ステアリン酸、ステアリン酸、オレイン酸、リノール酸等の飽和又は不飽和の脂肪族一塩基酸類；ベンゾイル安息香酸、安息香酸、ヒドロキシ安息香酸、ピコリン酸、フランカルボン酸等の芳香環又は複素環を有する一塩基酸類；ジブロモサリチル酸等のブロモヒドロキシカルボン酸類；エチルアミン臭素酸塩やジエチルアミン臭素酸塩、ジエチルアミン塩化水素酸塩、メチルアミン臭素酸塩等のアミン系ブロモ化合物；１−ブロモ−３−メチル−１−ブテンや１，４−ジブロモブテン、１−ブロモ−１−プロペン、２，３−ジブロモプロペン、１，２−ジブロモ−１−フェニルエタン、１，２−ジブロモスチレン、４−ステアロイルオキシベンジルブロマイド、４−ステアリルオキシベンジルブロマイド、４−ステアリルベンジルブロマイド、４−ブロモメチルベンジルステアレート、４−ステアロイルアミノベンジルブロマイド、２，４−ビスブロモメチルべンジルステアレート、４−パルミトイルオキシベンジルブロマイド、４−ミリストイルオキシベンジルブロマイド、４−ラウロイルオキシべンジルブロマイド、４−ウンデカノイルオキシベンジルブロマイド等の活性水素非含有ブロモ化合物；ステアリルアミンやジステアリルアミン、ジブチルアミン等のハロゲン原子非含有アミン類などを例示でき、これらは１種を単独で、又は２種以上を組み合わせて使用できる。（Ｃ）成分としては、主に濡れ性の観点より前記脂肪族二塩基酸類、ブロモアルコール類およびブロモジカルボン酸類なる群より選ばれる少なくとも１種が好ましい。 As the component (C), various known compounds can be used without particular limitation. Specifically, for example, saturated or unsaturated aliphatic dibasic acids such as succinic acid, adipic acid, azelaic acid, glutaric acid, sebacic acid, dodecanedioic acid, dimer acid, fumaric acid, maleic acid and itaconic acid; -2,3-dibromo-1,4-butenediol, cis-2,3-dibromo-1,4-butenediol, 1-bromo-2-butanol, 1-bromo-2-propanol, 3-bromo-1 Bromoalcohols such as -propanol, 3-bromo-1,2-propanediol, 1,4-dibromo-2-butanol, 1,3-dibromo-2-propanol, 2,3-dibromo-1-propanol; 3 -Bromopropionic acid, 2-bromovaleric acid, 5-bromo-n-valeric acid, 2-bromoisovaleric acid, 2,3-dibromosuccinic acid, 2-bromosuccinic acid, Bromodicarboxylic acids such as 2,2-dibromoadipic acid; saturated or unsaturated aliphatic monobasic acids such as capric acid, lauric acid, myristic acid, palmitic acid, stearic acid, stearic acid, oleic acid, linoleic acid; benzoylbenzoic acid Monobasic acids having an aromatic ring or heterocyclic ring such as acid, benzoic acid, hydroxybenzoic acid, picolinic acid, furancarboxylic acid; bromohydroxycarboxylic acids such as dibromosalicylic acid; ethylamine bromate, diethylamine bromate, diethylamine hydrogen chloride Amine-based bromo compounds such as acid salts and methylamine bromates; 1-bromo-3-methyl-1-butene, 1,4-dibromobutene, 1-bromo-1-propene, 2,3-dibromopropene, 1 , 2-dibromo-1-phenylethane, 1,2-dibromostyrene, 4-ste Royloxybenzyl bromide, 4-stearyloxybenzyl bromide, 4-stearylbenzyl bromide, 4-bromomethylbenzyl stearate, 4-stearoylaminobenzyl bromide, 2,4-bisbromomethylbenzyl stearate, 4-palmitoyloxy Active hydrogen-free bromo compounds such as benzyl bromide, 4-myristoyloxybenzyl bromide, 4-lauroyloxybenzyl bromide, 4-undecanoyloxybenzyl bromide; non-halogen atoms such as stearylamine, distearylamine, dibutylamine Containing amines etc. can be illustrated and these can be used individually by 1 type or in combination of 2 or more types. The component (C) is preferably at least one selected from the group consisting of the aliphatic dibasic acids, bromoalcohols and bromodicarboxylic acids mainly from the viewpoint of wettability.
（Ｄ）成分としては、各種公知のものを特に制限なく使用できる。具体的には、主に鉛フリーソルダペーストの印刷適性の点より、特にポリアミド系チキソトロピック剤及び／又は動植物系チキソトロピック剤が好ましい。ポリアミド系チキソトロピック剤としてはステアリン酸アミドや１２−ヒドロキシステアリン酸エチレンビスアミド等が、また、動植物系チキソトロピック剤成分としては硬化ひまし油や蜜ロウ、カルナバワックス等を例示でき、これらは１種を単独で、又は２種以上を組み合わせて使用できる。 As the component (D), various known compounds can be used without particular limitation. Specifically, polyamide thixotropic agents and / or animal and plant thixotropic agents are particularly preferred from the viewpoint of printability of lead-free solder pastes. Examples of the polyamide thixotropic agent include stearic acid amide and 12-hydroxystearic acid ethylene bisamide, and examples of the animal and plant type thixotropic agent component include hardened castor oil, beeswax, carnauba wax, and the like. Or in combination of two or more.
（Ｅ）成分としては、各種公知のものを特に制限なく使用できる。具体的には、ブチルカルビトールやヘキシルジグリコール、ヘキシルカルビトール等のエーテル系アルコール類；エタノールやｎ−プロパノール、イソプロパノール、イソブタノール等の低級アルコール類；酢酸イソプロピルやプロピオン酸エチル、安息香酸ブチル、アジピン酸ジエチル等のエステル類；ｎ−ヘキサンやドデカン、テトラデセン等の炭化水素類などを例示でき、これらは１種を単独で、又は２種以上を組み合わせて使用できる。これらの中でも、鉛フリーソルダペーストの粘度安定性や印刷性等の点より、高沸点溶剤であるエーテル系アルコール類が好ましい。 As the component (E), various known compounds can be used without particular limitation. Specifically, ether alcohols such as butyl carbitol, hexyl diglycol, and hexyl carbitol; lower alcohols such as ethanol, n-propanol, isopropanol, and isobutanol; isopropyl acetate, ethyl propionate, butyl benzoate, Esters such as diethyl adipate; hydrocarbons such as n-hexane, dodecane, and tetradecene can be exemplified, and these can be used alone or in combination of two or more. Among these, ether alcohols which are high boiling point solvents are preferable from the viewpoint of viscosity stability and printability of the lead-free solder paste.
（Ｆ）成分としては、各種公知のものを特に制限なく使用できる。具体的には、例えばペンタエリスリチル−テトラキス〔３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート〕、トリエチレングリコール−ビス〔３−（３−ｔ−ブチル−５−メチル−４−ヒドロキシフェニル）プロピオネート〕、１，６−ヘキサンジオール−ビス−〔３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート〕、２，４−ビス−（ｎ−オクチルチオ）−６−（４−ヒドロキシ−３，５−ジ−ｔ−ブチルアニリノ）−１，３，５−トリアジン、２，２−チオ−ジエチレンビス〔３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート〕、オクタデシル−３−（３，５−ジ−ｔ−ブチル−４−ヒドロキシフェニル）プロピオネート、Ｎ，Ｎ’−ヘキサメチレンビス（３，５−ジ−ｔ−ブチル−４−ヒドロキシ−ヒドロシンアミド）、３，５−ジ−ｔ−ブチル−４−ヒドロキシベンジルフォスフォネート−ジエチルエステル、１，３，５−トリメチル−２，４，６−トリス（３，５−ジ−ｔ−ブチル−４−ヒドロキシベンジル）ベンゼンのヒンダードフェノール系酸化防止剤；２，６−ジ−ｔ−ブチル−ｐ−クレゾール、２，４−ジメチル−６−ｔ−ブチル−フェノール、スチレネートフェノール、２，４−ビス［（オクチルチオ）メチル］−ｏ−クレゾール等の他のフェノール系酸化防止剤；トリフェニルフォスファイト、トリエチルフォスファイト、トリラウリルトリチオフォスファエト、トリス（トリデシル）フォスファイト等のリン系酸化防止剤；系酸化防止剤としてジラウリルチオジプロピオネート、ジラウリルサルファイド、２−メルカプトベンゾイミダゾール、ラウリルステアリルチオジプロピオネート等の硫黄系酸化防止剤などを例示でき、これらは１種を単独で、又は２種以上を組み合わせて使用できる。これらの中でも、濡れ性やフラックス残渣の色調等の点よりヒンダードフェノール系酸化防止剤が好ましい。フラックス残渣の色調がよいとはんだ接合部の目視検品（濡れ広がりの確認等）が容易になる。 As the component (F), various known compounds can be used without particular limitation. Specifically, for example, pentaerythrityl-tetrakis [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], triethylene glycol-bis [3- (3-t-butyl-5- Methyl-4-hydroxyphenyl) propionate], 1,6-hexanediol-bis- [3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate], 2,4-bis- (n- Octylthio) -6- (4-hydroxy-3,5-di-t-butylanilino) -1,3,5-triazine, 2,2-thio-diethylenebis [3- (3,5-di-t-butyl -4-hydroxyphenyl) propionate], octadecyl-3- (3,5-di-t-butyl-4-hydroxyphenyl) propionate, N, N'-hexamethylenebis ( , 5-di-tert-butyl-4-hydroxy-hydrocinamide), 3,5-di-tert-butyl-4-hydroxybenzylphosphonate-diethyl ester, 1,3,5-trimethyl-2,4 , 6-Tris (3,5-di-t-butyl-4-hydroxybenzyl) benzene hindered phenolic antioxidant; 2,6-di-t-butyl-p-cresol, 2,4-dimethyl- Other phenolic antioxidants such as 6-t-butyl-phenol, styrenate phenol, 2,4-bis [(octylthio) methyl] -o-cresol; triphenyl phosphite, triethyl phosphite, trilauryl trithiophos Phosphoric antioxidants such as phaeto, tris (tridecyl) phosphite; dilauryl thiodipropionate as antioxidant , Dilauryl sulfide, can be exemplified 2-mercaptobenzimidazole, and sulfur-based antioxidants such as lauryl stearyl thiodipropionate, they alone, or in combination of two or more can be used. Among these, a hindered phenol antioxidant is preferable from the viewpoint of wettability and color tone of the flux residue. If the color tone of the flux residue is good, visual inspection (confirmation of wetting spread etc.) of the solder joint becomes easy.
本発明のフラックスにおける（Ａ）成分〜（Ｆ）成分の含有量は特に限定されないが、通常は以下の通りである。
（Ａ）成分：通常２〜３０重量％程度、好ましくは５〜２０重量％
（Ｂ）成分：通常３０〜７０重量％程度、好ましくは３５〜６０重量％
（Ｃ）成分：通常０．５〜１０重量％程度、好ましくは３〜７重量％
（Ｄ）成分：通常０〜２０重量％程度、好ましくは５〜１０重量％
（Ｅ）成分：通常０〜５０重量％程度、好ましくは２０〜４０重量％
（Ｆ）成分：通常０〜５重量％程度、好ましくは０．５〜２重量％
Although content of (A) component-(F) component in the flux of this invention is not specifically limited, Usually, it is as follows.
Component (A): Usually about 2 to 30% by weight, preferably 5 to 20% by weight
Component (B): Usually about 30 to 70% by weight, preferably 35 to 60% by weight
Component (C): Usually about 0.5 to 10% by weight, preferably 3 to 7% by weight
Component (D): Usually about 0 to 20% by weight, preferably 5 to 10% by weight
Component (E): Usually about 0 to 50% by weight, preferably 20 to 40% by weight
Component (F): Usually about 0 to 5% by weight, preferably 0.5 to 2% by weight
本発明のフラックスは、そのままでもポストフラックス、ディップはんだ付用のフラックス等として利用できる。また、各種の鉛フリーはんだ合金粉末と混合し、鉛フリーソルダペーストとしても利用できる他、各種糸はんだ用途にも供することができる。 The flux of the present invention can be used as it is as a post flux, a dip soldering flux or the like. Moreover, it can be mixed with various lead-free solder alloy powders and used as a lead-free solder paste, and can also be used for various types of thread soldering.
本発明の鉛フリーソルダペーストは、本発明のフラックスと鉛フリーはんだ合金粉末との使用量は特に限定されないが、通常、前者が５〜３０重量％程度、後者が７０〜９５重量％程度である。鉛フリーはんだ合金粉末としては、鉛を含有しないものであれば各種公知のものを特に制限なく使用できるが、Ｓｎをベースとする鉛フリーはんだ粉末、例えばＳｎ−Ａｇ系、Ｓｎ−Ｃｕ系、Ｓｎ−Ｓｂ系、Ｓｎ−Ｚｎ系の鉛フリーはんだ粉末が好ましい。また、鉛フリーはんだ粉末は、Ａｇ、Ａｌ、Ａｕ、Ｂｉ、Ｃｏ、Ｃｕ、Ｆｅ、Ｇａ、Ｇｅ、Ｉｎ、Ｎｉ、Ｐ、Ｐｔ、Ｓｂ、Ｚｎの１種又は２種以上の元素がドープされたものであってよい。鉛フリーはんだ粉末の具体例としては、Ｓｎ９５Ｓｂ５、Ｓｎ９９．３Ｃｕ０．７、Ｓｎ９７Ｃｕ３、Ｓｎ９２Ｃｕ６Ａｇ２、Ｓｎ９９Ｃｕ０．７Ａｇ０．３、Ｓｎ９５Ｃｕ４Ａｇ１、Ｓｎ９７Ａｇ３、Ｓｎ９６．３Ａｇ３．７等を例示できる。また、鉛フリーはんだ粉末の平均粒子径は特に限定されないが、通常は１〜５０μｍ程度、好ましくは１５〜４０μｍである。また、粉末の形状も特に限定されず、球形や不定形であってもよい。なお、球形とは、好ましくは、粉末の縦横のアスペクト比が１．２以内であることを意味する。 In the lead-free solder paste of the present invention, the amount of the flux of the present invention and the lead-free solder alloy powder is not particularly limited, but the former is usually about 5 to 30% by weight and the latter is about 70 to 95% by weight. . As the lead-free solder alloy powder, various known ones can be used as long as they do not contain lead, but lead-free solder powders based on Sn, for example, Sn-Ag, Sn-Cu, Sn -Sb-based and Sn-Zn-based lead-free solder powders are preferred. The lead-free solder powder is doped with one or more elements of Ag, Al, Au, Bi, Co, Cu, Fe, Ga, Ge, In, Ni, P, Pt, Sb, and Zn. It may be a thing. Specific examples of the lead-free solder powder include Sn95Sb5, Sn99.3Cu0.7, Sn97Cu3, Sn92Cu6Ag2, Sn99Cu0.7Ag0.3, Sn95Cu4Ag1, Sn97Ag3, Sn96.3Ag3.7 and the like. Moreover, although the average particle diameter of lead-free solder powder is not specifically limited, Usually, about 1-50 micrometers, Preferably it is 15-40 micrometers. Further, the shape of the powder is not particularly limited, and may be spherical or irregular. The spherical shape preferably means that the aspect ratio of the powder is within 1.2.
本発明の鉛フリー糸はんだは、本発明のフラックスを用いて得られるものである。具体的には、前記した鉛フリーはんだ合金粉末と同様の組成からなる糸はんだ母材に本発明のフラックスを組み合わせたものである。組み合わせの態様は特に限定されず、糸はんだ母材に本発明のフラックス塗布したり、その長さ方向に沿って当該フラックスを配置したりすることができる。また、配置の態様としては、例えば、筒状の糸はんだ母材の中心（コア）に組み込んだり、糸はんだ母材の表面に長さ方向に沿って設けた凹部に組み込んだりするパターンが挙げられる。 The lead-free yarn solder of the present invention is obtained using the flux of the present invention. Specifically, the flux of the present invention is combined with a thread solder base material having the same composition as the above lead-free solder alloy powder. The mode of combination is not particularly limited, and the flux of the present invention can be applied to a thread solder base material, or the flux can be disposed along the length direction thereof. Moreover, as an aspect of arrangement | positioning, the pattern incorporated in the center (core) of a cylindrical thread solder base material, for example, or is integrated in the recessed part provided along the length direction on the surface of the thread solder base material is mentioned. .
以下に本発明を実施例により更に具体的に説明する。ただし、本発明はこれら実施例に限定されるものではない。また実施例中、「％」及び「部」は特に断りのない限り「重量％」、「重量部」を意味する。 Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples. In the examples, “%” and “part” mean “% by weight” and “part by weight” unless otherwise specified.
＜フラックスの調製＞
実施例１
市販のダイマー酸ジアルキルエステル（商品名「ＫＡＫ ＤＡＰＩＰ−Ｒ」、高級アルコール工業（株）製、ジリノール酸のジイソプロピルエステル）を５部、アクリル化ロジン水素化物（商品名「ＫＥ−６０４」、荒川化学工業（株）製）を４０部、グルタル酸（ＧＡ）を３部、ｔｒａｎｓ−２，３−ジブロモ−１，４−ブテンジオール（ＤＢＢＤ）を１．５部、ポリアミド系チキソトロピック剤（商品名「ＭＡ−ＷＡＸ−Ｏ」、川研ファインケミカル（株）社製）を５部、ヘキシルジグリコール（ＨｅＤＧ）を４５部、及び酸化防止剤（商品名「Ｉｒｇａｎｏｘ１０１０」、チバ・ジャパン（株）製）を５部、加熱下に良く混合し、フラックスを調製した。
<Preparation of flux>
Example 1
5 parts of commercially available dimer acid dialkyl ester (trade name “KAK DAPIP-R”, high alcohol industry, diisopropyl ester of dilinoleic acid), acrylated rosin hydride (trade name “KE-604”, Arakawa Chemical) Kogyo Co., Ltd.), 40 parts, glutaric acid (GA) 3 parts, trans-2,3-dibromo-1,4-butenediol (DBBD) 1.5 parts, polyamide thixotropic agent (trade name) “MA-WAX-O” (manufactured by Kawaken Fine Chemical Co., Ltd.) 5 parts, hexyl diglycol (HeDG) 45 parts, and antioxidant (trade name “Irganox 1010”, manufactured by Ciba Japan Co., Ltd.) Was mixed well under heating to prepare a flux.
実施例２〜６、比較例１〜４
実施例１の原料を表１、表２に示す部数で加熱下に良く混合し、フラックスを調製した。
Examples 2-6, Comparative Examples 1-4
The raw materials of Example 1 were mixed well under heating in the parts shown in Tables 1 and 2 to prepare a flux.
＜フラックス残渣のクラック有無の確認：糸はんだ態様＞
市販の鉛フリー糸はんだ合金（９６．５Ｓｎ／３Ａｇ／０．５Ｃｕ、商品名「ＦＬＦ ０１−１．６−Ｗ」、松尾はんだ（株）製、直径１．６ｍｍ、フラックスは組み込まれていない。）を０．２ｇ計りとり、円状に丸めて銅板上に載置し、その内側に実施例１のフラックスを０．０５ｇ塗布し、該銅板を２７０℃で３０秒間加熱した。その後該銅板を室温まで急冷し、濡れ広がったはんだ合金を覆っているフラックス残渣膜のクラックの程度を以下の基準で目視判断した。また、実施例２〜４及び比較例１のフラックスについても同様にクラックの程度を目視判断した。なお、実施例２〜６、比較例１〜４のフラックスはいずれも、はんだ合金の濡れ性が良好であった（表１および２中、○で示す）。
<Confirmation of the presence or absence of cracks in the flux residue: thread solder mode>
Commercially available lead-free thread solder alloy (96.5Sn / 3Ag / 0.5Cu, trade name “FLF 01-1.6-W”, manufactured by Matsuo Solder Co., Ltd., diameter 1.6 mm, flux is not incorporated. ) Was measured, rounded into a circular shape, placed on a copper plate, 0.05 g of the flux of Example 1 was applied on the inside, and the copper plate was heated at 270 ° C. for 30 seconds. Thereafter, the copper plate was rapidly cooled to room temperature, and the degree of cracks in the flux residue film covering the wet and spread solder alloy was visually judged according to the following criteria. In addition, the degree of cracking was also visually determined for the fluxes of Examples 2 to 4 and Comparative Example 1. In addition, as for the flux of Examples 2-6 and Comparative Examples 1-4, the wettability of the solder alloy was favorable (it shows with (circle) in Table 1 and 2).
（クラックの程度）
◎：フラックス残渣膜にはクラックが全く生じていない
○：フラックス残渣膜にはクラックがほぼ生じていない
×：フラックス残渣膜に無数のクラックが生じている
(Degree of crack)
A: No cracks are generated in the flux residue film B: Almost no cracks are generated in the flux residue film X: Innumerable cracks are generated in the flux residue film
＜フラックス残渣のクラック有無の確認：ソルダペースト態様＞
市販の鉛フリーはんだ合金粉末（９６．５Ｓｎ／３Ａｇ／０．５Ｃｕ、三井金属（株）製、粒径２０〜３８μｍ、通常品）を８９ｇ、実施例１のフラックスを順に８９重量％および１１重量％となるようソフナーにて混練し、ソルダペーストを調製した。次いでこのソルダペーストを銅板上に０．４ｇ、直径５ｍｍ程度のドーム状となるように載せ、２７０℃で３０秒加熱溶融させた。次いで、濡れ広がったはんだ合金を覆っているフラックス残渣膜のクラックの程度を前記した基準において目視判断した。また、実施例２〜４及び比較例１のフラックスについても同様にクラックの程度を目視判断した。なお、実施例２〜６、比較例１〜４のフラックスはいずれも、はんだ合金の濡れ性が良好であった（表１および２中、○で示す）。
<Confirmation of presence or absence of cracks in flux residue: Solder paste mode>
89 g of commercially available lead-free solder alloy powder (96.5Sn / 3Ag / 0.5Cu, manufactured by Mitsui Kinzoku Co., Ltd., particle size 20-38 μm, normal product), the flux of Example 1 in order of 89% by weight and 11% by weight %, Kneaded with a softener to prepare a solder paste. Next, this solder paste was placed on a copper plate in a dome shape with a diameter of about 5 mm and melted by heating at 270 ° C. for 30 seconds. Next, the degree of cracking of the flux residue film covering the wet and spread solder alloy was visually judged based on the above-mentioned criteria. In addition, the degree of cracking was also visually determined for the fluxes of Examples 2 to 4 and Comparative Example 1. In addition, as for the flux of Examples 2-6 and Comparative Examples 1-4, the wettability of the solder alloy was favorable (it shows with (circle) in Table 1 and 2).
＊１・・・市販のダイマー酸ジアルキルエステル（ヘンケル社製）：不飽和脂肪酸（炭素数１８）の二量体の２−エチルヘキシルジエステル
＊２・・・市販のダイマー酸ジアルキルエステル（ヘンケル社製）：不飽和脂肪酸（炭素数３６）の二量体の２−エチルヘキシルジエステル
* 1 ... Commercial dimer acid dialkyl ester (Henkel): diethyl 2-ethylhexyl diester of unsaturated fatty acid (carbon number 18) * 2 ... Commercial dimer acid dialkyl ester (Henkel) : 2-ethylhexyl diester of dimer of unsaturated fatty acid (36 carbon atoms)
＊３・・・セバシン酸モノメチル（豊国製油（株）社製）
＊４・・・グルタル酸モノエチル（東京化成工業（株）社製）
* 3: Monomethyl sebacate (manufactured by Toyokuni Oil Co., Ltd.)
* 4 ... Monoethyl glutarate (manufactured by Tokyo Chemical Industry Co., Ltd.)
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