JP2013171748A - Led lighting device - Google Patents

Led lighting device Download PDF

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JP2013171748A
JP2013171748A JP2012035731A JP2012035731A JP2013171748A JP 2013171748 A JP2013171748 A JP 2013171748A JP 2012035731 A JP2012035731 A JP 2012035731A JP 2012035731 A JP2012035731 A JP 2012035731A JP 2013171748 A JP2013171748 A JP 2013171748A
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led
light
voltage
lighting device
led lighting
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Kunio Narumiya
国雄 成宮
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NARUMIYA KK
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Abstract

PROBLEM TO BE SOLVED: To provide a fluorescent lamp type LED lighting device capable of shining a whole surface of a cylindrical pipe member.SOLUTION: An LED lighting device (100) of a first viewpoint includes: a drive circuit (70) capable of being connected with an AC power source and obtaining pulsating voltage by rectifying AC voltage of the AC power source; m pieces of LEDs (40) directly connected with the drive circuit; a long-size LED substrate (50) for arranging m pieces of LEDs in a first direction; a cylindrical light-transmitting member (10) storing the LED substrate and extended in the first direction; and a support member (60) extended in a second direction crossing the first direction so as to support the LED substrate in a cylinder of the light-transmitting member.

Description

本発明は、レーザ発光ダイオード(以下、LEDという。)を用いた蛍光灯型のLED照明装置に関する。   The present invention relates to a fluorescent lamp type LED lighting apparatus using a laser light emitting diode (hereinafter referred to as LED).

LEDを用いた照明装置の一例としては、例えば既存の蛍光灯の規格と互換性のある円筒形状を有するとともに、LEDから発生された熱を外部へ放熱する放熱部を備えたLED照明装置がある。LED照明装置用の電源は、一般に、家庭用電源など交流を電源として用いることが望まれる。一方、LEDは直流駆動素子であり、順方向の電流でのみ発光する。また、照明用途として現在多用されているLEDの順方向電圧Vfは3V〜5V程度である。LEDはVfに達しなければ発光しない。このため、LED照明装置は、交流をブリッジ回路で全波整流し、平滑コンデンサで平滑した後、定電流回路やスイッチング電源回路等の駆動回路でLEDを駆動している。LED及び駆動回路から多くの熱が発生するため、LED照明装置は、金属材料等の放熱板を有している。   As an example of an illuminating device using an LED, for example, there is an LED illuminating device having a cylindrical shape that is compatible with an existing fluorescent lamp standard and a heat radiating part that radiates heat generated from the LED to the outside. . As for the power source for the LED lighting device, it is generally desirable to use an alternating current as a power source such as a household power source. On the other hand, the LED is a DC drive element and emits light only with a forward current. Moreover, the forward voltage Vf of LED currently used extensively as a lighting use is about 3V to 5V. The LED does not emit light unless Vf is reached. For this reason, the LED lighting device performs full-wave rectification of alternating current using a bridge circuit, smoothes it using a smoothing capacitor, and then drives the LED using a drive circuit such as a constant current circuit or a switching power supply circuit. Since a lot of heat is generated from the LED and the drive circuit, the LED lighting device has a heat radiating plate made of a metal material or the like.

例えば、特許文献1のLED照明装置は、半透明の合成樹脂などからなるパイプ部材内に、LED基板を支持する支持基板を取り付ける凹み部を有している。支持基板は、その凹み部に挿入されパイプ部材内に取り付けられている。支持基板は、アルミの押出型材が使用されている。この支持基板には放熱板(フィン)が配置されている。LED基板には、複数のLED、コンデンサ及びインダクタンスなどからなる駆動回路が搭載されている。そして、支持基板は、LED基板に載置されたLED及び駆動回路からの熱を、支持基板のLEDの載置面とは反対側の空隙(パイプ部材の筒円の半分以下の空間)に放熱している。そして、反対側の空隙は、支持基板及び放熱板でLEDの光が遮られている。   For example, the LED illumination device of Patent Document 1 has a recess for attaching a support substrate for supporting the LED substrate in a pipe member made of a translucent synthetic resin or the like. The support substrate is inserted into the recess and attached in the pipe member. An aluminum extrusion mold is used for the support substrate. A heat sink (fin) is disposed on the support substrate. A drive circuit including a plurality of LEDs, a capacitor, an inductance, and the like is mounted on the LED substrate. Then, the support substrate dissipates heat from the LED mounted on the LED substrate and the drive circuit to a space on the opposite side of the LED from the LED mounting surface of the support substrate (a space equal to or less than half of the pipe member cylindrical circle). doing. And the space | gap of the other side is interrupted | blocked by the light of LED with the support substrate and the heat sink.

特開2009−266432号公報JP 2009-266432 A

既存の蛍光灯は、円筒の全面が輝くため、蛍光灯を取り付ける照明機器には、照明方向とは反対側に反射板が取り付けられている。しかし、特許文献1のLED照明装置は、既存の蛍光灯の規格と互換性のある円筒形状であるが、円筒形のLED載置面の反対側にはLEDの光が届かない。このため、使用者は、特許文献1に開示される蛍光灯型のLED照明装置を部屋の天井などに取り付けて使用すると、LED照明装置の真下方向は明るいが、天井面及びその周辺が暗くなってしまい、部屋全体が暗いと感じてしまっていた。さらにアルミの押出型材を使用すると製造コストがかかり及びLED照明装置の重量がかさむことになる。   In the existing fluorescent lamp, since the entire surface of the cylinder shines, a lighting plate to which the fluorescent lamp is attached is provided with a reflector on the side opposite to the illumination direction. However, the LED illumination device of Patent Document 1 has a cylindrical shape that is compatible with existing fluorescent lamp standards, but the LED light does not reach the opposite side of the cylindrical LED mounting surface. For this reason, if a user attaches and uses the fluorescent lamp type LED lighting apparatus disclosed in Patent Document 1 on the ceiling of a room or the like, the direction directly below the LED lighting apparatus is bright, but the ceiling surface and its surroundings become dark. I felt that the whole room was dark. Further, when an aluminum extrusion mold is used, the manufacturing cost is increased and the weight of the LED lighting device is increased.

そこで、本発明は、円筒のパイプ部材の全面が輝くLED照明装置を提供する。
第1の観点のLED照明装置は、交流電源に接続可能で該交流電源の交流電圧を整流した脈流電圧を得る駆動回路と、駆動回路に直接に接続されたm個のLEDと、m個のLEDを第1方向に配置し第1方向と交差する第2方向の第1幅を有する長尺状のLED基板と、光透過性部材からなりLED基板を収容する第1方向に伸び第2方向に第1幅の二倍以上の幅の第2幅を有する円筒状の光透過性部材と、LED基板を光透過性部材の円筒内で支えるように第2方向に伸びた支持部材と、を備える。
Therefore, the present invention provides an LED lighting device in which the entire surface of a cylindrical pipe member shines.
An LED lighting apparatus according to a first aspect includes a drive circuit that can be connected to an AC power source and obtains a pulsating voltage obtained by rectifying the AC voltage of the AC power source, m LEDs directly connected to the drive circuit, and m The LED is disposed in the first direction and has a long LED substrate having a first width in the second direction intersecting the first direction, and a second member that extends in the first direction that accommodates the LED substrate. A cylindrical light-transmitting member having a second width that is twice or more the first width in the direction, and a support member extending in the second direction so as to support the LED substrate in the cylinder of the light-transmitting member; Is provided.

第2の観点のLED照明装置において、m個のLEDは、以下のように決定される。
Vac*0.8/Vf <m< Vmax*0.8/Vf
なお、Vac;供給される交流の実効電圧、Vmax;供給される交流の最大電圧、Vf;LEDの順方向電圧である。
第3の観点のLED照明装置において、光透過性部材の内周面は、第1方向に伸びる細溝を均等に複数有しており、支持部材の一端は溝に入り込む。
In the LED lighting device according to the second aspect, m LEDs are determined as follows.
Vac * 0.8 / Vf <m <Vmax * 0.8 / Vf
Here, Vac is the supplied AC effective voltage, Vmax is the supplied AC maximum voltage, and Vf is the forward voltage of the LED.
In the LED lighting device of the third aspect, the inner peripheral surface of the light transmissive member has a plurality of narrow grooves extending in the first direction evenly, and one end of the support member enters the groove.

第4の観点のLED照明装置において、光透過性部材の内周面は、第1方向に伸びる一対の保持溝を有しており、支持部材の一端は保持溝に入り込む。
第5の観点のLED照明装置において、支持部材は、透明または半透明部材で形成され、LEDの発光点を光透過性部材の断面中心に位置するように配置する。
第6の観点のLED照明装置において、駆動回路は、交流電圧を整流する整流回路と脈流電圧を一定電流にする定電流回路とを有する。
また第7の観点のLED照明装置において、駆動回路は、さらに脈流電圧を平滑化するコンデンサを有する。
In the LED lighting device according to the fourth aspect, the inner peripheral surface of the light transmissive member has a pair of holding grooves extending in the first direction, and one end of the support member enters the holding groove.
In the LED lighting device according to the fifth aspect, the support member is formed of a transparent or translucent member, and is arranged so that the light emitting point of the LED is located at the center of the cross section of the light transmissive member.
In the LED lighting device according to the sixth aspect, the drive circuit includes a rectifier circuit that rectifies the AC voltage and a constant current circuit that sets the pulsating voltage to a constant current.
In the LED lighting device of the seventh aspect, the drive circuit further includes a capacitor that smoothes the pulsating voltage.

蛍光灯型のLED照明装置は、円筒のパイプ部材の全面が輝く。   In the fluorescent lamp type LED lighting device, the entire surface of the cylindrical pipe member shines.

(a)は、蛍光灯型LEDランプの一部を切欠して示す平面図(XZ面)である。 (b)は、蛍光灯型LEDランプの一部を切欠して示す平面図(YZ面)である。(A) is a top view (XZ surface) which cuts and shows a part of fluorescent lamp type LED lamp. (B) is a top view (YZ surface) which cuts and shows a part of fluorescent lamp type LED lamp. LED照明灯100のA−A断面拡大図である。It is an AA cross-sectional enlarged view of the LED lighting 100. LED照明灯100の駆動回路70である。It is the drive circuit 70 of the LED lighting 100. 駆動回路70による電圧波形である。It is a voltage waveform by the drive circuit 70. 平滑化コンデンサで平滑化された駆動回路70による電圧波形である。It is a voltage waveform by the drive circuit 70 smoothed by the smoothing capacitor. LED照明灯110の断面拡大図である。It is a cross-sectional enlarged view of the LED illumination lamp 110.

<第1実施形態>
(照明装置の全体構成)
図1(a)は、蛍光灯型の照明装置であるLED照明灯100の一構成例を模式的に示している。なお、LED照明灯100の長軸方向両側ともに同一構造及び同一部材を有しているため、この第1実施形態では片側の構造及び部材のみを説明する。
<First Embodiment>
(Whole structure of lighting device)
Fig.1 (a) has shown typically the example of 1 structure of the LED illumination light 100 which is a fluorescent lamp type illuminating device. Since both sides of the LED illumination lamp 100 in the long axis direction have the same structure and the same members, only the structure and members on one side will be described in the first embodiment.

このLED照明灯100の外観構成は、図1に示されるように、円筒形状のパイプ部材10と、パイプ部材10の長軸方向の両端開口を閉蓋するキャップ状の第1及び第2の口金20と、パイプ部材10及び口金20を連結固定する円筒状の第1及び第2のジョイント部材30とから構成されている。このパイプ部材10の内部には、複数の発光素子であるLED40を搭載したLED基板50が気密に収容されている。   As shown in FIG. 1, the appearance configuration of the LED illumination lamp 100 includes a cylindrical pipe member 10 and cap-shaped first and second caps that close both ends of the pipe member 10 in the long axis direction. 20 and cylindrical first and second joint members 30 for connecting and fixing the pipe member 10 and the base 20. Inside the pipe member 10, an LED substrate 50 on which LEDs 40 as a plurality of light emitting elements are mounted is housed in an airtight manner.

(パイプ部材の構成)
図1に示されたLED照明灯100のパイプ部材10は、例えばアクリル樹脂又はポリカーボネート樹脂などの合成樹脂からなる光透過性の円筒部材により構成されている。パイプ部材10は、押出成形により長軸方向(Z軸方向)に伸びて形成されており、既存の直管蛍光灯とほぼ同一の大きさ、寸法、及び外形形態を有している。パイプ部材10の内周側は、光拡散用に複数の細かい細溝12が形成されている(図2を参照。)
(Configuration of pipe member)
The pipe member 10 of the LED illuminating lamp 100 shown in FIG. 1 is composed of a light-transmitting cylindrical member made of a synthetic resin such as an acrylic resin or a polycarbonate resin. The pipe member 10 is formed to extend in the major axis direction (Z-axis direction) by extrusion molding, and has almost the same size, dimension, and outer shape as an existing straight tube fluorescent lamp. On the inner peripheral side of the pipe member 10, a plurality of fine narrow grooves 12 are formed for light diffusion (see FIG. 2).

パイプ部材10の内周側の細溝12は、押出成形により形成される溝である。その溝の形状は、図2に示されるように、波形状であってもよく、先の尖ったV字溝であってもよく、又は先が丸くなったU字溝であってもよい。また内壁からパイプ部材10の中心に向かった複数の突起壁であってもよい。細溝12の大きさは、パイプ部材10の内径及び光拡散に適するように適宜決められる。   The narrow groove 12 on the inner peripheral side of the pipe member 10 is a groove formed by extrusion molding. As shown in FIG. 2, the shape of the groove may be a wave shape, may be a sharp V-shaped groove, or may be a U-shaped groove with a rounded tip. Further, a plurality of protruding walls from the inner wall toward the center of the pipe member 10 may be used. The size of the narrow groove 12 is appropriately determined so as to be suitable for the inner diameter of the pipe member 10 and light diffusion.

パイプ部材10の材質は、光透過性を損なわずに適度な反射率及び光拡散性を有するものが好適である。パイプ部材10の一例としては、例えば合成樹脂に炭酸カルシウム及び酸化チタン等の光拡散剤微粒子を分散させて光拡散性を付与したもの、合成樹脂の表面に光拡散剤微粒子を塗布した塗布層を設けたもの等の光拡散性を付与したものなどが挙げられる。   The material of the pipe member 10 is preferably a material having an appropriate reflectance and light diffusivity without impairing light transmittance. As an example of the pipe member 10, for example, a synthetic resin in which light diffusing agent fine particles such as calcium carbonate and titanium oxide are dispersed to impart light diffusibility, or a coating layer in which the light diffusing agent fine particles are applied to the surface of the synthetic resin is used. Examples thereof include those provided with light diffusibility such as those provided.

(口金の構成)
LED照明灯100の口金20はその断面が円筒形状である。口金20の材質は、例えばベークライト、アルミニウム又はアルミニウム合金などの材料からなる。この口金20は、一対の端子ピン21を絶縁的に支持している。端子ピン21の突出端とは反対側の一端のそれぞれは、端子ピン21に接続された整流回路を介して複数のLED40と電気的に接続されている。なお、後述するように、LED照明灯100は熱の発生が少ないため、口金20を無くし、次に説明するジョイント部材30に口金20の役目をさせることもできる。
(Composition of base)
The base 20 of the LED illumination lamp 100 has a cylindrical cross section. The base 20 is made of a material such as bakelite, aluminum, or aluminum alloy. The base 20 supports a pair of terminal pins 21 in an insulating manner. One end of the terminal pin 21 opposite to the protruding end is electrically connected to the plurality of LEDs 40 via a rectifier circuit connected to the terminal pin 21. As will be described later, since the LED illumination lamp 100 generates less heat, the base 20 can be eliminated, and the joint member 30 described below can also serve as the base 20.

(ジョイント部材の構成)
口金20と接合するジョイント部材30は、その断面が円筒形状である。ジョイント部材30の材質は、例えばポリブチレンテレフタレート樹脂又はポリカーボネートからなる。ジョイント部材30は、パイプ部材10の端部外周面に接着剤により接着され、口金20の外周面に接着剤に接着されている。なお、図示しないが、パイプ部材10と口金20とを直接接続し、ジョイント部材30を省略してもよい。
(Composition of joint member)
The joint member 30 joined to the base 20 has a cylindrical cross section. The material of the joint member 30 is made of, for example, polybutylene terephthalate resin or polycarbonate. The joint member 30 is bonded to the outer peripheral surface of the end portion of the pipe member 10 by an adhesive, and is bonded to the outer peripheral surface of the base 20 to the adhesive. Although not shown, the pipe member 10 and the base 20 may be directly connected and the joint member 30 may be omitted.

(LED基板の構成)
図1及び図2に示されるように、パイプ部材10の長軸方向に延在するLED基板50は、支持部材60によりパイプ部材10内で支持される。図2は、図1(a)及び(b)のA−A断面拡大図である。このLED基板50の材質は、例えばガラスエポキシ基板、ポリエステル系コンポジット基材の材料からなる。LED40は、LED基板50の+X側に配置されている。
(Configuration of LED board)
As shown in FIGS. 1 and 2, the LED substrate 50 extending in the long axis direction of the pipe member 10 is supported in the pipe member 10 by a support member 60. FIG. 2 is an AA cross-sectional enlarged view of FIGS. 1 (a) and 1 (b). The material of this LED board 50 consists of material of a glass epoxy board | substrate and a polyester-type composite base material, for example. The LED 40 is disposed on the + X side of the LED substrate 50.

LED基板50には、複数のLED40を直列接続したLEDモジュールを実装するための図示しない配線パターンが形成されている。LED基板50の口金側の端部には、例えばヒューズ、抵抗及び整流用のダイオードなどからなる駆動回路70が搭載されている。これらの駆動回路70を介してLED基板50上に直列に実装された複数のLED40が電気的に接続されている。   A wiring pattern (not shown) for mounting an LED module in which a plurality of LEDs 40 are connected in series is formed on the LED substrate 50. A drive circuit 70 made of, for example, a fuse, a resistor, a rectifying diode, or the like is mounted on the end of the LED substrate 50 on the base side. A plurality of LEDs 40 mounted in series on the LED substrate 50 are electrically connected via these drive circuits 70.

LED基板50のY軸方向の幅W1は、パイプ部材10の内径φDの半分以下、特に1/3以下が好ましい。LED40から+X軸側に照射された光が、+X軸側にパイプ部材10の内周側の細溝12で反射され、LED基板50の−X側のパイプ部材10の細溝12に到達させるためである。LED基板50の幅W1がパイプ部材10の内径φDの半分より大きいと、LED40から+X軸側に照射された光がLED基板50の−X側にあまり到達しない。このため、LED40のY軸方向の幅W2は、できるだけ小さいことが好ましく、LED基板50の幅W1は、LED40の幅W2と同等又は若干大きい程度にする。   The width W1 of the LED substrate 50 in the Y-axis direction is preferably not more than half of the inner diameter φD of the pipe member 10, particularly preferably not more than 1/3. Light emitted from the LED 40 to the + X axis side is reflected by the narrow groove 12 on the inner peripheral side of the pipe member 10 toward the + X axis side and reaches the narrow groove 12 of the pipe member 10 on the −X side of the LED substrate 50. It is. When the width W1 of the LED substrate 50 is larger than half of the inner diameter φD of the pipe member 10, the light emitted from the LED 40 to the + X axis side does not reach the −X side of the LED substrate 50 so much. For this reason, it is preferable that the width W2 of the LED 40 in the Y-axis direction is as small as possible, and the width W1 of the LED substrate 50 is made equal to or slightly larger than the width W2 of the LED 40.

LED基板50に実装されるLED40の個数は、交流電源の電圧及びLED40の順方向電圧Vfを考慮して設定される。交流の実効電圧が100V、順方向電圧Vfが3.2Vであれば、32個から39個が配置され、好ましくはLED基板50に実装されるLED40の個数は、37個から39個である。LED40の配置は、図1(a)又は(b)に例示されるように、Y軸方向に一列、Z軸方向に一直線に配置されるだけでなく、Y2列に2列配置されてもよい。LED40が2列に配置されたときも、LED基板50のY軸方向の幅W1は、パイプ部材10の内径φDの半分以下にする。またLED基板50にLED40が所定の間隔をもって直線状に実装した構成を例示したが、それぞれの間隔が異なるように実装されてもよい。   The number of LEDs 40 mounted on the LED substrate 50 is set in consideration of the voltage of the AC power supply and the forward voltage Vf of the LEDs 40. If the AC effective voltage is 100 V and the forward voltage Vf is 3.2 V, 32 to 39 LEDs are arranged, and preferably the number of LEDs 40 mounted on the LED substrate 50 is 37 to 39. As illustrated in FIG. 1A or 1B, the LEDs 40 may be arranged not only in a single line in the Y-axis direction and in a straight line in the Z-axis direction, but also in two lines in the Y2 line. . Even when the LEDs 40 are arranged in two rows, the width W1 of the LED substrate 50 in the Y-axis direction is made equal to or less than half of the inner diameter φD of the pipe member 10. Further, the configuration in which the LEDs 40 are linearly mounted on the LED substrate 50 with a predetermined interval is illustrated, but the LEDs 40 may be mounted so that the intervals are different.

LED40は、例えばフラットトップのPLCC(Plastic leaded chip carrier)パッケージのLEDが使用される。また、LED40は例えば白色の単色のLEDから構成される、またLED40は、互いに異なる3色の赤色LED、緑色LED及び青色LEDを有するLED又は補色関係にある2色のLEDからなっていてもよい。これらの組み合わせであっても、LED照明灯100からの発光は、白色となる。LED40の順方向電圧は、色によって異なるが、赤色又は緑色LEDでは1.5Vから2.5V、白色又は青色LEDでは3.0Vから3.7Vである。以下、本実施形態では、特に白色の単色LEDを使用する場合について説明する。   As the LED 40, for example, a flat top PLCC (Plastic leaded chip carrier) package LED is used. Further, the LED 40 is composed of, for example, a white single color LED. The LED 40 may be composed of LEDs having three different colors of red LED, green LED and blue LED, or two colors of LEDs having a complementary color relationship. . Even with these combinations, the light emitted from the LED illumination lamp 100 is white. The forward voltage of the LED 40 varies depending on the color, but is 1.5V to 2.5V for a red or green LED, and 3.0V to 3.7V for a white or blue LED. Hereinafter, in this embodiment, a case where a white monochromatic LED is used will be described.

(支持部材の構成)
支持部材60は、LED基板50に搭載されたLED40の発光点がほぼパイプ部材10の断面中心に位置するように、LED基板50を支持する。支持部材60の両端は、パイプ部材10の内周側の細溝12に入り込み、支持部材60の中央付近にLED基板50が固定される。支持部材60の材質は、例えばアクリル樹脂又はポリカーボネートなど透明な素材又は半透明の素材からなる。特に半透明の場合には、光LEを遮光しないように、そのZ軸方向の幅は、LED基板50を支持できる範囲でできるだけ細くする。LED40から+X軸側に照射された光が、+X軸側にパイプ部材10の内周側の細溝12で反射され、LED基板50の−X側のパイプ部材10の細溝12に到達させるためである。
(Configuration of support member)
The support member 60 supports the LED substrate 50 so that the light emitting point of the LED 40 mounted on the LED substrate 50 is positioned substantially at the center of the cross section of the pipe member 10. Both ends of the support member 60 enter the narrow groove 12 on the inner peripheral side of the pipe member 10, and the LED substrate 50 is fixed near the center of the support member 60. The material of the support member 60 is made of a transparent material such as acrylic resin or polycarbonate, or a translucent material. Particularly in the case of semi-transparency, the width in the Z-axis direction is made as thin as possible within a range in which the LED substrate 50 can be supported so as not to block the light LE. Light emitted from the LED 40 to the + X axis side is reflected by the narrow groove 12 on the inner peripheral side of the pipe member 10 toward the + X axis side and reaches the narrow groove 12 of the pipe member 10 on the −X side of the LED substrate 50. It is.

また、支持部材60の材質は、金属部材であってもよい。強度のある金属部材であれば、支持部材60は、例えばφ1mm以下の針金であってもよい。支持部材60が極めて細いため、+X軸側にパイプ部材10の内周側の細溝12で反射されたLED40の光を遮ることがないからである。支持部材60が針金である場合、LED基板50に針金をハンダ付けするためのランドを形成しておく。そして針金をランドにハンダ付けすればよい。   The material of the support member 60 may be a metal member. If it is a strong metal member, the support member 60 may be a wire having a diameter of, for example, φ1 mm or less. This is because the support member 60 is extremely thin and does not block the light of the LED 40 reflected by the narrow groove 12 on the inner peripheral side of the pipe member 10 on the + X axis side. When the support member 60 is a wire, a land for soldering the wire to the LED substrate 50 is formed in advance. Then, solder the wire to the land.

特に図示しないが、支持部材60は、アクリル樹脂又はポリカーボネートなど透明又は半透明な薄い平板であってもよい。この場合には、LED基板50に薄い平板を接着剤で接着すればよい。   Although not particularly illustrated, the support member 60 may be a transparent or translucent thin flat plate such as an acrylic resin or polycarbonate. In this case, a thin flat plate may be bonded to the LED substrate 50 with an adhesive.

(LED照明灯100の光の照射)
図2には、LED40から照射された光が、矢印LEで示されている。矢印LEは、パイプ部材10の内部の光を点線で、パイプ部材10から外へ照射された光を実線で示してある。
(Light irradiation of LED lighting 100)
In FIG. 2, the light emitted from the LED 40 is indicated by an arrow LE. An arrow LE indicates light inside the pipe member 10 by a dotted line, and light emitted from the pipe member 10 to the outside by a solid line.

一般に、LED40の指向特性(X軸上から傾いた方向から見える光度が50%となる角度を半値角*2)は、120°程度である。LED40から+X軸側に照射された光LEは、まず120°方向に広がり、パイプ部材10の内周側の細溝12に到達する。一部の光LEは、パイプ部材10の+X軸の外側に透過し、残りの光LEはパイプ部材10の内周側の細溝12で乱反射される。反射された光LEは、−X軸側パイプ部材10の内周側の細溝12に到達する。そこでは、一部の光LEは、パイプ部材10の−X軸の外側に透過し、残りの光LEはパイプ部材10の内周側の細溝12で乱反射される。光LEは、透過・反射を繰り返すことで、光LEは、パイプ部材10の外側全方向に照射される。   In general, the directivity characteristic of LED 40 (the half-value angle * 2 at which the luminous intensity seen from the direction inclined from the X axis is 50%) is about 120 °. The light LE emitted from the LED 40 toward the + X-axis side first spreads in the 120 ° direction and reaches the narrow groove 12 on the inner peripheral side of the pipe member 10. A part of the light LE is transmitted outside the + X axis of the pipe member 10, and the remaining light LE is diffusely reflected by the narrow groove 12 on the inner peripheral side of the pipe member 10. The reflected light LE reaches the narrow groove 12 on the inner peripheral side of the −X-axis side pipe member 10. Here, a part of the light LE is transmitted to the outside of the −X axis of the pipe member 10, and the remaining light LE is diffusely reflected by the narrow groove 12 on the inner peripheral side of the pipe member 10. The light LE is repeatedly transmitted and reflected, so that the light LE is irradiated in all directions outside the pipe member 10.

(LED照明灯100の放熱)
LED照明灯100は、家庭用の交流100Vの電源が使用される。一方、LED40は直流駆動素子であり、順方向の電流でのみ発光する。また、LED40の順方向電圧Vfは3.0Vから3.7Vである。LED40はVfに達しなければ発光せず、逆にVfを超えると過度の電流が流れてしまう特性を有する。交流100Vは実効値であり、全波整流された後の最大電圧は141Vとなる。この電源にLED40を接続し、定電流回路で駆動する場合、仮にVf=3.2VのLEDを20個のみ接続し、定電流回路で駆動すれば、電源電圧が64Vを超える範囲でLEDはONとなる。しかしながら、電力の大部分は熱となるため、放熱対策が必要となる。また余分な熱は、LED40自体、又はパイプ部材10などの寿命が低下するという問題もある。
(Heat dissipation of LED lighting 100)
The LED illumination lamp 100 uses a household AC 100V power source. On the other hand, the LED 40 is a DC drive element and emits light only with a forward current. Further, the forward voltage Vf of the LED 40 is 3.0V to 3.7V. The LED 40 does not emit light unless it reaches Vf, and on the contrary, if Vf exceeds Vf, an excessive current flows. AC 100V is an effective value, and the maximum voltage after full-wave rectification is 141V. When the LED 40 is connected to this power source and driven by a constant current circuit, if only 20 LEDs of Vf = 3.2V are connected and driven by the constant current circuit, the LED is turned on in a range where the power source voltage exceeds 64V. It becomes. However, since most of the electric power is heat, measures to dissipate heat are necessary. Further, the extra heat has a problem that the life of the LED 40 itself or the pipe member 10 is reduced.

第1実施形態のLED照明灯100は、LED基板50にアルミ合金などで形成された放熱板等は取り付けられていない。また、パイプ部材10にも放熱板等は取り付けられていない。そして、LED照明灯100は、光LEをパイプ部材10の外側全方向から照射している。つまり、LED照明灯100は、放熱対策のための部材を特に備えていない。   The LED illuminating lamp 100 of the first embodiment is not attached with a heat sink or the like formed of an aluminum alloy or the like on the LED substrate 50. Further, no heat sink or the like is attached to the pipe member 10. The LED illumination lamp 100 irradiates the light LE from all directions outside the pipe member 10. That is, the LED lighting 100 does not particularly include a member for measures against heat dissipation.

(LED照明灯100の駆動回路)
図3は、LED照明灯100の駆動回路70である。駆動回路70は、全波整流するダイオードブリッジからなるブリッジ回路72、及びトランジスタと抵抗で構成された定電流回路73で構成されている。駆動回路70は、交流電源をブリッジ回路72で全波整流した後、平滑コンデンサで平滑化を行わず、定電流回路73で複数のLED40を駆動している。定電流回路73は、例えば抵抗74、電流検出用のnpnトランジスタ75、電流制御用のnpnトランジスタ76、電流検出用の抵抗77で構成されている。また、複数のLED40と直列に、逆電流防止用のダイオード78及び電流制御用に抵抗79が配置されている。抵抗79は、LED40に過度の電流が流れないようにするとともに、LED40の個数に応じて抵抗値を変える。
(Drive circuit for LED lighting 100)
FIG. 3 shows a drive circuit 70 for the LED lighting 100. The drive circuit 70 includes a bridge circuit 72 composed of a diode bridge for full-wave rectification, and a constant current circuit 73 composed of a transistor and a resistor. The drive circuit 70 drives the plurality of LEDs 40 with the constant current circuit 73 without performing smoothing with the smoothing capacitor after full-wave rectification of the AC power source with the bridge circuit 72. The constant current circuit 73 includes, for example, a resistor 74, a current detection npn transistor 75, a current control npn transistor 76, and a current detection resistor 77. Further, a diode 78 for preventing reverse current and a resistor 79 for current control are arranged in series with the plurality of LEDs 40. The resistor 79 prevents an excessive current from flowing through the LED 40 and changes the resistance value according to the number of the LEDs 40.

この駆動回路70は半導体素子で構成されるため、LED40との動作温度範囲が共通であり小型化に適している。また、駆動回路70は、定電圧回路を有していないため、小型化が可能であるため、図1(a)で示されたように、細い幅LED基板50の裏側(−X軸側)であっても、実装できる。   Since this drive circuit 70 is composed of a semiconductor element, it has a common operating temperature range with the LED 40 and is suitable for miniaturization. Further, since the drive circuit 70 does not have a constant voltage circuit, it can be miniaturized. Therefore, as shown in FIG. 1A, the back side (−X axis side) of the narrow width LED substrate 50. But it can be implemented.

電流制御用のnpnトランジスタ76のゲート電極は、エミッタ電流が電流検出用の抵抗77を通るときの電圧降下検出点Aと接続されている。npnトランジスタ76は、このA点の電位に応じたコレクタ電流を流し、電流検出用のnpnトランジスタ75のベース電流を減少させる。その結果、電流検出用のnpnトランジスタ75のエミッタ電流Ie1が減少し、コレクタ電流Ic1が減少する。従って、電流制御用のnpnトランジスタ76のコレクタ電流Ic1がほぼ一定に制御される。   The gate electrode of the current control npn transistor 76 is connected to a voltage drop detection point A when the emitter current passes through the current detection resistor 77. The npn transistor 76 causes a collector current corresponding to the potential at the point A to flow, and decreases the base current of the npn transistor 75 for current detection. As a result, the emitter current Ie1 of the npn transistor 75 for current detection decreases and the collector current Ic1 decreases. Therefore, the collector current Ic1 of the current control npn transistor 76 is controlled to be substantially constant.

図4は、駆動回路70による電圧波形である。平滑化を行わないため、電圧値は周期的に変化する。一方、各LEDは図3に示すように相互に直列接続されている。このため、印加電圧がLED40の順方向電圧Vfの合計値を超えて初めて点灯する。一方、順方向電圧Vfの合計値を超えた電圧は電力損失となり、放熱の必要がある。   FIG. 4 shows voltage waveforms generated by the drive circuit 70. Since smoothing is not performed, the voltage value changes periodically. On the other hand, the LEDs are connected to each other in series as shown in FIG. For this reason, it is lit only when the applied voltage exceeds the total value of the forward voltage Vf of the LED 40. On the other hand, a voltage exceeding the total value of the forward voltage Vf becomes a power loss and needs to be radiated.

そこで、適切な直列接続されるLED40の個数mを以下の数式1で定義する。LED40の個数m、供給される交流の実効電圧Vac、供給される交流の最大電圧Vmax及びLEDの順方向電圧Vfの関係は以下の式になる。
Vac*/Vf <m< Vmax*0.9/Vf …数式1
Therefore, an appropriate number m of LEDs 40 connected in series is defined by the following Equation 1. The relationship among the number m of LEDs 40, the supplied AC effective voltage Vac, the supplied AC maximum voltage Vmax, and the forward voltage Vf of the LED is as follows.
Vac * / Vf <m <Vmax * 0.9 / Vf Equation 1

例えば、実効電圧Vac=100V、最大電圧Vmax=141V、順方向電圧Vf=3.2Vとすると、LED40の個数mは32個から39個である。LED40の個数mが37〜39個であると、ほとんど電力損失がなく且つ発熱量も小さいので放熱板等は不要となる。図4において、網掛けしている時間電圧領域は、LED40の個数mが32個の際に、LED40が点灯している領域を示している。   For example, assuming that the effective voltage Vac = 100V, the maximum voltage Vmax = 141V, and the forward voltage Vf = 3.2V, the number m of LEDs 40 is 32 to 39. If the number m of LEDs 40 is 37 to 39, there is almost no power loss and the amount of heat generation is small, so that a heat sink or the like is not necessary. In FIG. 4, the shaded time voltage region indicates a region where the LEDs 40 are lit when the number m of LEDs 40 is 32.

<変形例>
図3では、ブリッジ回路72からの脈流電圧は平滑化されなかったが、脈流電圧が平滑化されてもよい。脈流電圧を平滑化する際には、図3に点線で示される平滑化コンデンサCPを、ブリッジ回路72に並列に配置すればよい。
<Modification>
In FIG. 3, the pulsating voltage from the bridge circuit 72 is not smoothed, but the pulsating voltage may be smoothed. When smoothing the pulsating voltage, a smoothing capacitor CP indicated by a dotted line in FIG. 3 may be arranged in parallel with the bridge circuit 72.

図5は、平滑化コンデンサCPで平滑化された駆動回路70による電圧波形である。図5において、網掛けしている時間電圧領域は、LED40の個数mが32個の際に、LED40が点灯している領域を示している。平滑化されることにより、電圧が大きく下がらなくなり、LED40を常時点灯させることも可能である。   FIG. 5 shows a voltage waveform by the drive circuit 70 smoothed by the smoothing capacitor CP. In FIG. 5, the shaded time voltage region indicates a region where the LED 40 is lit when the number m of LEDs 40 is 32. By smoothing, the voltage does not drop greatly, and the LED 40 can be always lit.

<第2実施形態>
図6は、第2実施形態のLED照明灯110の一構成例を模式的に示している。このLED照明灯110の外観構成は、第1実施形態のLED照明灯110と同じである。但し、LED照明灯110の円筒形状のパイプ部材10’と支持部材60’とが異なっている。LED照明灯110も、放熱対策のための部材を特に備えていない。
Second Embodiment
FIG. 6 schematically shows a configuration example of the LED illumination lamp 110 of the second embodiment. The appearance configuration of the LED illumination lamp 110 is the same as that of the LED illumination lamp 110 of the first embodiment. However, the cylindrical pipe member 10 ′ and the support member 60 ′ of the LED illumination lamp 110 are different. The LED illuminating lamp 110 also does not particularly include a member for heat dissipation.

(パイプ部材の構成)
パイプ部材10’の内周側には、細かな溝が形成されていない。パイプ部材10’の材質は、光透過性を損なわずに適度な反射率及び光拡散性を有する合成樹脂である。パイプ部材10’は、例えば合成樹脂に炭酸カルシウム及び酸化チタン等の光拡散剤微粒子を分散させて光拡散性を有する。
(Configuration of pipe member)
A fine groove is not formed on the inner peripheral side of the pipe member 10 '. The material of the pipe member 10 ′ is a synthetic resin having an appropriate reflectance and light diffusivity without impairing light transmittance. The pipe member 10 ′ has light diffusibility by dispersing light diffusing agent fine particles such as calcium carbonate and titanium oxide in a synthetic resin, for example.

パイプ部材10’の内周側には、一対の保持溝15が長軸方向(Z軸方向)に形成されている。保持溝15はパイプ部材10’の中心に対して対向する位置に形成される。   A pair of holding grooves 15 are formed in the long axis direction (Z-axis direction) on the inner peripheral side of the pipe member 10 ′. The holding groove 15 is formed at a position facing the center of the pipe member 10 '.

支持部材60’は、LED基板50に搭載されたLED40の発光点がほぼパイプ部材10’の断面中心に位置するように、LED基板50を支持する。支持部材60’の一端は、保持溝15に入り込む。支持部材60’の他端は、二股に分かれており、その二股がLED基板50を挟み込む。支持部材60’の材質は、例えばアクリル樹脂又はポリカーボネートなど透明又は半透明な素材からなる。   The support member 60 ′ supports the LED substrate 50 so that the light emitting point of the LED 40 mounted on the LED substrate 50 is positioned substantially at the center of the cross section of the pipe member 10 ′. One end of the support member 60 ′ enters the holding groove 15. The other end of the support member 60 ′ is divided into two forks, and the forks sandwich the LED substrate 50. The material of the support member 60 ′ is made of a transparent or translucent material such as acrylic resin or polycarbonate.

図6でも、LED40から照射された光が、矢印LEで示されている。矢印LEは、パイプ部材10’の内部の光を点線で、パイプ部材10’から外へ照射された光を実線で示してある。   Also in FIG. 6, the light emitted from the LED 40 is indicated by an arrow LE. The arrow LE indicates the light inside the pipe member 10 ′ by a dotted line and the light emitted from the pipe member 10 ′ by a solid line.

LED40から+X軸側に照射された光LEは、まず120°方向に広がり、パイプ部材10’の内周面14に到達する。一部の光LEは、パイプ部材10’の+X軸の外側に透過し、残りの光LEはパイプ部材10’の内周面14で反射される。反射された光LEは、−X軸側パイプ部材10’の内周面14に到達する。そこでは、一部の光LEは、パイプ部材10’の−X軸の外側に透過し、残りの光LEはパイプ部材10’の内周面14で反射される。光LEは、透過・反射を繰り返すことで、光LEは、パイプ部材10’の外側全方向に照射される。   The light LE emitted from the LED 40 toward the + X-axis side first spreads in the 120 ° direction and reaches the inner peripheral surface 14 of the pipe member 10 ′. A part of the light LE is transmitted outside the + X axis of the pipe member 10 ′, and the remaining light LE is reflected by the inner peripheral surface 14 of the pipe member 10 ′. The reflected light LE reaches the inner peripheral surface 14 of the −X-axis side pipe member 10 ′. In this case, a part of the light LE is transmitted outside the −X axis of the pipe member 10 ′, and the remaining light LE is reflected by the inner peripheral surface 14 of the pipe member 10 ′. The light LE is repeatedly transmitted and reflected, so that the light LE is irradiated in all directions outside the pipe member 10 '.

第1実施形態に係るLED照明灯100、及び第2実施形態に係るLED照明灯110によると、次の効果が得られる。
(1) 放熱板等を有していなくても、LED40の自己発熱による熱量が小さく、熱によるパイプ部材10又は10’の変形を防止することができる。
(2) アルミなどの放熱板が不要になり、軽くなるとともにコストを低減することができる。また、駆動回路70は、ブリッジ回路72と定電流回路73とからなり、定電圧回路が不要であるため、小型化できるとともにコストを低減することができる。駆動回路70が平滑化コンデンサCPを有する際には、LEDの点滅を無くし常時点灯させることもできる。
(3) LED基板50の幅を狭くすることができ、LED基板50とパイプ部材10又は10’との間に空間が形成されるため、LED40の発光点とは反対側からも光が照射される。
According to the LED illumination lamp 100 according to the first embodiment and the LED illumination lamp 110 according to the second embodiment, the following effects are obtained.
(1) Even if it does not have a heat sink or the like, the amount of heat due to self-heating of the LED 40 is small, and deformation of the pipe member 10 or 10 ′ due to heat can be prevented.
(2) A heat radiating plate such as aluminum is not required, and the weight can be reduced and the cost can be reduced. In addition, the drive circuit 70 includes a bridge circuit 72 and a constant current circuit 73, and does not require a constant voltage circuit. Therefore, the drive circuit 70 can be reduced in size and cost can be reduced. When the drive circuit 70 includes the smoothing capacitor CP, the LED can be turned on constantly without blinking.
(3) Since the width of the LED substrate 50 can be reduced and a space is formed between the LED substrate 50 and the pipe member 10 or 10 ′, light is irradiated from the side opposite to the light emitting point of the LED 40. The

10,10’ … パイプ部材
12 … 細溝、 14 … 内周面、 15 … 保持溝
20 … 口金
30 … ジョイント部材
40 … LED
50 … LED基板
60、60’ … 支持部材
70 … 駆動回路、 72 … ブリッジ回路、 73 … 定電流回路
CP … 平滑化コンデンサ
DESCRIPTION OF SYMBOLS 10,10 '... Pipe member 12 ... Narrow groove, 14 ... Inner peripheral surface, 15 ... Holding groove 20 ... Base 30 ... Joint member 40 ... LED
DESCRIPTION OF SYMBOLS 50 ... LED board 60, 60 '... Support member 70 ... Drive circuit, 72 ... Bridge circuit, 73 ... Constant current circuit CP ... Smoothing capacitor

Claims (7)

交流電源に接続可能で、該交流電源の交流電圧を整流した脈流電圧を得る駆動回路と、
前記駆動回路に直接に接続されたm個のLEDと、
前記m個のLEDを第1方向に配置し、前記第1方向と交差する第2方向の第1幅を有する長尺状のLED基板と、
光透過性部材からなり、前記LED基板を収容する前記第1方向に伸び前記第2方向に前記第1幅の二倍以上の幅の第2幅を有する円筒状の光透過性部材と、
前記LED基板を前記光透過性部材の円筒内で支えるように、前記第2方向に伸びた支持部材と、
を備えるLED照明装置。
A drive circuit that can be connected to an AC power source and obtains a pulsating voltage obtained by rectifying the AC voltage of the AC power source;
M LEDs directly connected to the drive circuit;
An elongate LED substrate having the m LEDs arranged in a first direction and having a first width in a second direction intersecting the first direction;
A cylindrical light-transmitting member made of a light-transmitting member, extending in the first direction to accommodate the LED substrate, and having a second width that is twice or more the first width in the second direction;
A support member extending in the second direction so as to support the LED substrate in a cylinder of the light transmissive member;
LED lighting device comprising:
m個のLEDは、以下のように決定される請求項1に記載のLED照明装置。
Vac*0.8/Vf <m< Vmax*0.8/Vf
なお、Vac;供給される交流の実効電圧、Vmax;供給される交流の最大電圧、Vf;LEDの順方向電圧、とする。
The LED lighting device according to claim 1, wherein the m LEDs are determined as follows.
Vac * 0.8 / Vf <m <Vmax * 0.8 / Vf
Note that Vac is the supplied AC effective voltage, Vmax is the supplied AC maximum voltage, and Vf is the forward voltage of the LED.
前記光透過性部材の内周面は、前記第1方向に伸びる細溝を均等に複数有しており、
前記支持部材の一端は前記溝に入り込む請求項1又は請求項2に記載のLED照明装置。
The inner peripheral surface of the light transmissive member has a plurality of narrow grooves extending in the first direction equally,
The LED lighting device according to claim 1, wherein one end of the support member enters the groove.
前記光透過性部材の内周面は、前記第1方向に伸びる一対の保持溝を有しており、
前記支持部材の一端は前記保持溝に入り込む請求項1又は請求項2に記載のLED照明装置。
The inner peripheral surface of the light transmissive member has a pair of holding grooves extending in the first direction,
The LED lighting device according to claim 1, wherein one end of the support member enters the holding groove.
前記支持部材は、透明または半透明部材で形成され、前記LEDの発光点を前記光透過性部材の断面中心に位置するように配置する請求項1から請求項4のいずれか一項に記載のLED照明装置。   The said support member is formed with a transparent or semi-transparent member, and arrange | positions so that the light emission point of the said LED may be located in the cross-sectional center of the said light transmissive member. LED lighting device. 前記駆動回路は、前記交流電圧を整流する整流回路と前記脈流電圧を一定電流にする定電流回路とを有する請求項1から請求項5のいずれか一項に記載のLED照明装置。   6. The LED lighting device according to claim 1, wherein the drive circuit includes a rectifier circuit that rectifies the AC voltage and a constant current circuit that makes the pulsating voltage constant. 前記駆動回路は、さらに前記脈流電圧を平滑化するコンデンサを前記整流回路に並列に配置する請求項6に記載のLED照明装置。
The LED lighting device according to claim 6, wherein the drive circuit further includes a capacitor that smoothes the pulsating voltage in parallel with the rectifier circuit.
JP2012035731A 2012-02-22 2012-02-22 Led lighting device Pending JP2013171748A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021520619A (en) * 2018-04-06 2021-08-19 オーミオ セルビシオス インテグラレス,エス.エル. Encapsulated LED strip without power supply

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021520619A (en) * 2018-04-06 2021-08-19 オーミオ セルビシオス インテグラレス,エス.エル. Encapsulated LED strip without power supply

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