JP2013168508A - Surface mounting clip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent solder fixing a surface-mounting clip to a printed wiring board from hindering bending of a holding spring part, inhibit the deterioration of the noise shielding performance, and reduce the costs.SOLUTION: A surface-mounting clip includes: a fastening part 110 formed by bending a thin plate metal member and soldered to a printed wiring board 500; and holding spring parts 120 which are formed by being bent from the fastening part 110 and are disposed so as to make a pair in a facing state. A recessed vein 121 recess, serving as a solder blocking part preventing solder 700 from being sucked up when a surface-mounting clip 100 is soldered to the printed wiring board 500, is formed at each holding spring part 120. A tip of each holding spring part 120 is bent inward to form an inner spring part 122.

Description

  The present invention relates to a surface mount clip which is soldered to a printed wiring board and used for fixing a shield case, for example.

  Japanese Unexamined Patent Application Publication No. 2005-332953 discloses a surface mount clip that is soldered to a printed wiring board and used for fixing a shield case, for example.

JP 2005-332953 A

However, the surface mount clip described in Patent Document 1 has the following problems.
In this surface mount clip, in order to prevent solder from being sucked up by the sandwiching spring part, it is lifted from other parts by bending the fixing part under the sandwiching spring part so that it floats from the printed wiring board. Yes. For this reason, there exists a problem that it will be in the state which separated from the printed wiring board by the part corresponding to the part which the lower end edge part of the side wall of the shield case clamped raised, and noise shielding performance falls.
Furthermore, this surface mount clip is formed by bending a thin plate-like metal member such as a phosphor bronze plate, but the bottom surface of the fixed portion of the surface mount clip is fixed to the printed wiring board by soldering, so that the holding spring portion The inner surface of each is gold-plated for contact with a shield case or the like. That is, it is necessary to perform gold plating on both the front and back surfaces of the metal member, which causes a cost increase.

  The present invention was devised in view of the above circumstances, and the holding spring portion is not easily bent by the solder for fixing the surface mount clip to the printed wiring board, and the cost of the noise is not reduced and the cost is reduced. It is an object of the present invention to provide a surface mount clip that can be used.

The surface mount clip according to the present invention is formed by bending a thin plate-like metal member, and is formed by being soldered to a printed wiring board and formed by bending from this fixed portion, and is arranged in a face-to-face state. A surface mounting clip comprising a clamping spring portion,
The adhering portion is formed flat, and the holding spring portion is formed with a solder blocking portion that prevents the solder from sucking up when the surface mounting clip is soldered to the printed wiring board,
The tip of the clamping spring portion is bent inward to form an inner spring portion.

Since the surface mount clip according to the present invention prevents the solder from being sucked up above the sandwiching spring portion by the solder blocking portion of the sandwiching spring portion, the solder case adheres and solidifies on the sandwiching spring portion. This prevents a situation in which the side walls of the door are not smoothly pinched.
Even if the solder adheres to the holding spring portion and solidifies, the holding of the side wall of the shield case by the inner spring portion is ensured.
Further, unlike the prior art, there is no need to lift up to prevent the solder from being sucked into the holding spring portion. Therefore, when the side wall of the shield case is sandwiched, the lower end edge of the side wall of the shield case is closer to the printed wiring board, so that there is no problem of a reduction in noise shielding performance.
Further, in this surface mount clip, the gold plating of the thin plate-like metal member only needs to be performed on one side, so that the cost can be reduced as compared with the conventional surface mount clip of this type which requires gold plating on both sides.

BRIEF DESCRIPTION OF THE DRAWINGS It is drawing of the surface mount clip concerning the 1st Embodiment of this invention, Comprising: The figure (A) is a schematic front view, The figure (B) is a schematic plan view, The figure (C) is schematic. A side view and the same figure (D) are the II sectional schematic sectional drawing of the same figure (B). It is a schematic developed view of the surface mount clip according to the first embodiment of the present invention. It is a schematic plan view which shows the state by which the surface mount clip concerning the 1st Embodiment of this invention was fixed to the printed wiring board with the solder. It is a schematic side view which shows the state which the solder adhered to the clamping spring part, when the surface mount clip concerning the 1st Embodiment of this invention was fixed to the printed wiring board with the solder. It is a schematic side view which shows the state which clamps the side wall of a shield case with the surface mount clip which concerns on the 1st Embodiment of this invention in the state which the solder adhered to the clamping spring part. It is a schematic side view which shows the modification of the surface mount clip which concerns on the 1st Embodiment of this invention. It is drawing of the surface mount clip concerning the 2nd Embodiment of this invention, Comprising: The figure (A) is a schematic front view, The figure (B) is a schematic plan view, The figure (C) is schematic. The side view and FIG. 4D are schematic cross-sectional views taken along the line II-II in FIG. It is drawing of the surface mount clip concerning the 3rd Embodiment of this invention, Comprising: The figure (A) is a schematic front view, The figure (B) is a schematic plan view, The figure (C) is schematic. A side view and FIG. (D) are schematic sectional views taken along line III-III of FIG. It is drawing of the surface mount clip concerning the 4th Embodiment of this invention, Comprising: The figure (A) is a schematic front view, The figure (B) is a schematic plan view, The figure (C) is schematic. A side view and the figure (D) are the IV-IV line schematic sectional drawing of the figure (B).

  The surface mount clip 100 according to the embodiment of the present invention is formed by bending a thin plate-like metal member, soldered to the printed wiring board 500, and formed by bending from the fixed portion 110. A clamping spring part 120 arranged in a pair in a state, and the fixing part 110 is formed flat, and when the surface mounting clip 100 is soldered to the printed wiring board 500 on the clamping spring part 120 The concave vein 121 is formed as a solder blocking portion that prevents the solder 700 from being sucked up. The sandwiching spring portion 120 is bent toward the inside to form an inner spring portion 122.

  What is fixed on the printed wiring board 500 by the surface mounting clip 100 is composed of a conductive metal plate, and a lid-like shield case 600 is put on the printed wiring board 500.

For example, a phosphor bronze plate material is used as the thin metal member. And this metal member is gold-plated only on one side. This metal member is punched into a deformed key shape as shown in FIG. 2, and each part is bent to complete the surface mount clip 100.
Two pairs of spring front portions 120Z corresponding to a total of four sandwiching spring portions 120 project from a pair of long side portions of the elongated strip 110Z corresponding to the fixing portion 110, respectively.

As shown in FIG. 2, the belt-like portion 110 </ b> Z has an end soldering portion 111 at both ends without the spring front portion 120 </ b> Z and a central soldering portion 112 at the center. The solder 700 is attached to both the soldering portions 111 and 112 to fix the surface mounting clip 100 to the printed wiring board 500.
In order to prevent the solder 700 attached to both the soldering portions 111 and 112 from penetrating to the sandwiching spring portion 120, substantially U-shaped defective portions 111A and 112A are formed in the vicinity of both the soldering portions 111 and 112. Has been.

  Moreover, the spring front part 120Z which is a part corresponded to the clamping spring part 120 is extended from four places of the strip | belt-shaped part 110Z, as shown in FIG. In the spring front portion 120Z, a trapezoidal portion 125Z whose two opposite sides are narrowed from the belt-like portion 110Z side and a rectangular portion 126Z whose two sides are parallel from the trapezoidal portion 125Z are continuous. Is formed. The rectangular portion 126Z is a portion corresponding to the inner spring portion 122.

  Moreover, the corner | angular part at the front end side of the rectangular part 126Z is formed in a round shape. The rectangular portion 126Z is formed with a substantially semicircular cut and raised portion 123 in which the arc portion is cut and the string portion is not cut. In addition, the cut and raised portion 123 protrudes toward the side on which the gold plating is applied. Accordingly, when the spring front portion 120Z is formed as the sandwiching spring portion 120, the cut-and-raised portion 123 protrudes inward at the inner spring portion 122, and is thus sandwiched between the opposing sandwiching spring portions 120. It bites into the side wall 610 of the shield case 600.

Moreover, in the state where the cut-and-raised portion 123 is the surface mounting clip 100, the arc portion faces the fixing portion 110 side, so when sandwiching the side wall 610 of the shield case 600, it is sandwiched without much resistance. It can serve to prevent the side walls 610 of the sandwiched shield case 600 from being inadvertently pulled out.
In addition, if the opening which the cut-and-raised part 123 enters is provided in the side wall 610 which should be clamped of the shield case 600, the shield case 600 can be fixed more reliably.

  Of the front spring portion 120Z of the metal member punched out in such a shape, the rectangular portion 126Z is bent so that the surface on which the gold plating is performed becomes the outside. At this time, the rectangular portion 126Z is bent so as to have a substantially bowl-shaped convex toward the outside so as to function more as the inner spring portion 122. Note that the gap between the opposed inner spring portions 122 in a state where the surface mount clip 100 is completed is set to be smaller than the thickness dimension of the side wall 610 to be sandwiched by the shield case 600.

  Further, at the boundary between the trapezoidal portion 125Z and the belt-shaped portion 110Z, the trapezoidal portion 125Z is bent by about 90 ° so that the inner spring portion 122 faces inward. By this process, a pair of opposing sandwiching spring portions 120 is formed. The pair of sandwiching spring portions 120 are in a state where the inner spring portions 122 are opposed to each other.

  Moreover, the trapezoidal portion 125Z of the spring front portion 120Z that becomes the sandwiching spring portion 120 is formed with a concave vein 121 that is concave outward. The concave vein 121 is formed along the boundary as shown in FIG. The recess 121 functions as a solder blocking portion that prevents the solder 700 attached to the end soldering portion 111 and the central soldering portion 112 of the fixing portion 110 from being sucked up by the sandwiching spring portion 120.

The surface mount clip 100 configured as described above is configured such that solder is attached to the position indicated by hatching in FIG. 3 and the end soldering portion 111 and the central soldering portion 112 are placed on the solder 700 from above. Is fixed to the lint wiring board 500.
Therefore, if the solder 700 can be accurately attached only to both the soldering portions 111 and 112, the solder 700 does not adhere to the sandwiching spring portion 120 at all.
In some cases, the central soldering portion 112 may not be soldered.

  However, even if the solder 700 adheres to the sandwiching spring portion 120 and tries to suck up the sandwiching spring portion 120, as shown in FIG. 4, the solder 700 enters the recess 121 of the solder blocking portion, It does not rise above it and does not adhere. Therefore, the solid solder adheres to the outer surface of the sandwiching spring portion 120, and the sandwiching spring portion 120 becomes difficult to bend. As a result, the situation where the sandwiching of the side wall 610 of the shield case 600 does not occur smoothly does not occur.

  Further, even if a large amount of solder 700 adheres by the sandwiching spring portion 120 and the solder 700 gets over the concave vein 121 and sucks up, the solder 700 does not reach the inner spring portion 122, so at least the inner spring portion. By the deformation of 122, the side wall 610 of the shield case 600 is smoothly held.

In addition, the surface on which the gold plating of the metal member is performed is the back surface side of the fixing portion 110, the outside of the holding spring portion 120, and the inside of the inner spring portion 122 (the surface that does not contact the side wall 610 of the shield case 600). That is, the surface mount clip 100 is in contact with the printed wiring board 500 on the side of the fixing portion 110 that has been plated with gold, and sandwiches the side wall 610 of the shield case 600 on the side of the inner spring portion 122 that has been plated with gold. .
For this reason, unlike the conventional surface mount clip of this type, this surface mount clip 100 does not require gold plating on both the front and back surfaces, and it is only necessary to perform gold plating on only one surface, thereby reducing costs.

  The surface mount clip 100 configured as described above is taken out from the stored carrier tape by a vacuum chuck and installed at a predetermined position on the printed wiring board 500. The vacuum chuck adsorbs the central soldering portion 112 of the surface mount clip 100 when taking out from the carrier tape. This is because the balance may be lost if the end soldering portion 111 is sucked. The reason why the sandwiching spring part 120 is trapezoidal is also to make it easier for the vacuum chuck to enter the central soldering part 112 sandwiched between the two pairs of sandwiching spring parts 120.

  In the first embodiment described above, the solder blocking portion formed in the sandwiching spring portion 120 has been described as having a concave vein 121, but as shown in FIG. Needless to say, the convex vein 121 may be convex.

In addition to the first embodiment described above, there is also a surface mount clip 100B according to a second embodiment as follows.
As shown in FIG. 7, the surface mount clip 100 </ b> B is such that the solder blocking portion is a slit 121 </ b> S formed along the boundary between the fixing portion 110 and the sandwiching spring portion 120.
If there is this slit 121S, even if the solder 700 sucks up the sandwiching spring portion 120, it will enter the inside from this slit 121S, so the solder 700 will not be sucked up above the slit 121S.
For this reason, it is difficult for the sandwiching spring portion 120 to be bent by the solder 700, and a situation in which the sandwiching of the side wall 610 of the shield case 600 does not go smoothly can be avoided.
In addition, there is an advantage that the slit 121S is easier to form than the concave vein 121 or convex convex 121 described above.

  Needless to say, even if a plurality of continuous openings such as perforations are provided instead of the slit 121S as the solder blocking portion, the same effect can be obtained.

Both the surface mount clip 100 according to the first embodiment and the surface mount clip 100B according to the second embodiment are formed with a substantially semicircular cut and raised portion 123 on the inner spring portion 122 of the sandwiching spring portion 120. It was.
However, the cut and raised portion 123 is not indispensable. For example, as shown in FIG. 8, the surface mount clip 100C obtained by removing the cut and raised portion 123 from the surface mount clip 100 according to the first embodiment is of course included in the invention according to the present patent application.

The surface mounting clip 100D according to the fourth embodiment is significantly different from the above in the holding spring portion 120.
The sandwiching spring portion 120D in the surface mount clip 100D according to the fourth embodiment is opposed to the sandwich spring portion 120 in the surface mount clips 100, 100B, and 100C according to the first to third embodiments. Instead, they are formed in a staggered pattern as shown in FIG.
Further, the tip of the inner spring portion 122D of the sandwiching spring portion 120D is formed in a sawtooth shape.

By forming the tip of the inner spring portion 122D in a sawtooth shape, it is possible to prevent the side wall 610 of the sandwiched shield case 600 from being carelessly removed. In addition, unlike the above-described cut and raised portion 123, it is formed at the tip of the inner spring portion 122D, so that there is an advantage that the formation is easier.
In this surface mount clip 100D, the tip of the inner spring portion 120D intersects when viewed from the side. This is because the side wall 610 of the shield case 600 is clamped more firmly.

  In the surface mount clip 100D according to the fourth embodiment shown in FIG. 9, the concave vein 121 is used as the solder blocking portion. However, the convex vein 121 and the slit 121S described above are connected to the opening. It is also possible to adopt.

100 surface mount clip 110 fixing part 120 clamping spring part 121 concave concave vein (solder blocking part)
500 Printed wiring board 700 Solder

Claims (6)

Surface mounting provided with a fixing portion formed by bending a thin metal member and soldered to a printed wiring board, and a sandwiching spring portion formed by bending from this fixing portion and arranged in a face-to-face relationship In the clip,
The adhering portion is formed flat, and the holding spring portion is formed with a solder blocking portion that prevents the solder from sucking up when the surface mounting clip is soldered to the printed wiring board,
The surface mounting clip, wherein the sandwiching spring part has an inner spring part with a tip bent toward the inside.   The surface mount clip according to claim 1, wherein the solder blocking portion is a convex pulse or a concave pulse formed along a bent portion that is a boundary between the fixing portion and the sandwiching spring portion.   2. The surface mount clip according to claim 1, wherein the solder blocking portion is a slit or a plurality of continuous openings formed along a boundary between the fixing portion and the sandwiching spring portion.   2. The thin plate-like metal member is gold-plated only on one surface, and the gold-plated surface is a lower surface side of the fixing portion and an opposite surface side of the inner spring portion. The surface mount clip according to 2 or 3.   The surface mounting clip according to claim 1, 2, 3, or 4, wherein the inner spring portion is formed with a cut-and-raised portion protruding inward.   The surface mount clip according to claim 1, 2, 3, or 4, wherein a tip of the inner spring portion is formed in a sawtooth shape.

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