JP2013165402A - Solid-state imaging device and electronic apparatus equipped with the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a solid-state imaging device having high accuracy of positioning of a solid-state imaging element and an optical mechanism and to provide an electronic apparatus equipped with the solid-state imaging device.SOLUTION: A solid-state imaging device includes: a projection 13 which is formed on an imaging surface 11a by avoiding an imaging section and projects in an optical axis direction from the imaging surface 11a; and a storage section 32 for storing at least a part of the projection 13. The projection 13 is stored in the storage section 32. Thus, optical axis positioning of the solid-state imaging element and the optical mechanism is performed.

Description

  The present invention relates to a solid-state imaging device and an electronic device including the solid-state imaging device, and more specifically, for example, a solid-state imaging device that can be suitably used for various electronic devices such as a camera-equipped mobile phone, a digital still camera, and a security camera. The present invention relates to an electronic apparatus including the solid-state imaging device.

  An imaging camera module used for a mobile phone or the like has a structure in which a solid-state imaging device (CCD or CMOS sensor IC), an infrared filter, a wiring board having terminals, and a lens and a lens holder are integrated. Recently, the miniaturization of the process of the solid-state imaging device is progressing. For this reason, in order to obtain the designed desired resolution, the alignment (optical axis alignment) between the light receiving portion of the solid-state imaging device and the optical member is important.

  In recent years, there has been a background in which resin molding technology has advanced and molding can be performed with an accuracy of about 100 μm, and stud bump (electrode) molding accuracy has been improved to about 5 μm to 10 μm.

  In view of these, Patent Document 1 discloses a technique related to alignment between a solid-state imaging device and an optical member.

  FIG. 11 is a cross-sectional view of the solid-state imaging device (camera module) 200 of Patent Document 1. The solid-state imaging device 200 includes a lens 203 accommodated in a holder 202 and an imaging element 204 disposed on the substrate 201. The image sensor 204 is disposed at a predetermined distance from the lens 203. The holder 202 is fixed on the substrate 201, and a top plate 205 in which an opening 206 is formed above the image sensor 204 (on the optical path) and a protrusion 207 formed so as to project in the direction of the image sensor 204 are integrated. Have. The image sensor 204 is arranged at a predetermined distance from the lens 203 with the lower surface of the protrusion 207 of the holder 202 in contact with the upper surface of the image sensor 204.

  On the other hand, FIG. 12 is a figure which shows the optical device 300 of patent document 2, (a) is a top view, (b) is sectional drawing cut | disconnected along A1-A1 in (a). In the optical device 300, a solid-state imaging element 301 and a transparent member 303 provided on the imaging region 302 of the solid-state imaging element 301 are bonded with a transparent adhesive 304. Furthermore, one or more support columns 305 are arranged at positions outside the imaging region 302 of the solid-state imaging device 301 and along at least the sides that are opposite to each other among the four sides of the transparent member 303. The support column 305 is formed of a stud bump, and prevents the displacement of the transparent member 303.

JP 2007-147729 A (released on June 14, 2007) JP 2009-158873 A (released on July 16, 2009)

  However, since the conventional solid-state imaging device is not aligned in the planar direction of the image sensor, there is a problem that the accuracy of optical axis alignment is low.

  Specifically, as shown in FIG. 11, in the solid-state imaging device 200 of Patent Document 1, the distance between the lens 203 and the imaging element 204 is increased by bringing the lower surface of the protrusion 207 into contact with the upper surface of the imaging element 204. It is prescribed. That is, alignment in the optical axis direction is possible. However, alignment in the vertical direction with respect to the optical axis (alignment in the planar direction of the image sensor 204) cannot be performed simply by bringing the protrusion 207 into contact with the image sensor 204 in this way. Therefore, in the solid-state imaging device 200, the accuracy of optical axis alignment between the lens 203 and the imaging element 204 is lowered.

  On the other hand, as described above, the column 305 in the optical device 300 of Patent Document 2 prevents the displacement of the transparent member 303. That is, the column 305 contributes to the alignment of the solid-state imaging device 301 (imaging region 302) and the transparent member 303, but completely contributes to the optical axis alignment of the lens (not shown) and the solid-state imaging device 301. do not do. Further, Patent Document 2 has no description regarding optical axis alignment between the solid-state imaging device 301 and the lens.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a solid-state imaging device with high alignment accuracy between a solid-state imaging element and an optical mechanism, and an electronic apparatus including the same. It is in.

  In order to solve the above-described problems, a solid-state imaging device according to the present invention includes a solid-state imaging device, an optical mechanism that guides external light to the solid-state imaging device, a housing that holds the optical mechanism, and the solid-state imaging device. A projection that is formed on the imaging surface including the imaging unit so as to avoid the imaging unit and protrudes from the imaging surface in the optical axis direction, and a storage unit that is formed on the housing and stores at least a part of the projection. And the projection is stored in the storage unit, so that the optical axis alignment between the solid-state imaging device and the optical mechanism is performed.

  According to the above invention, the solid-state imaging device and the optical mechanism are aligned with reference to the protrusion formed on the imaging surface of the solid-state imaging device. As a result, the solid-state imaging device and the optical mechanism are aligned in the direction perpendicular to the optical axis (that is, in the in-plane direction of the imaging surface). Therefore, it is possible to provide a solid-state imaging device with high alignment accuracy between the solid-state imaging element and the optical mechanism.

  In the solid-state imaging device according to the present invention, the housing includes a protruding portion that protrudes from the surface facing the imaging surface toward the imaging surface, and the storage portion is formed at a distal end portion of the protruding portion. The length of the protruding portion in the optical axis direction is preferably equal to the distance between the solid-state imaging device and the optical mechanism.

  According to said invention, the length of the optical axis direction of the protrusion part formed in the housing is the same as the distance of a solid-state image sensor and an optical mechanism. Thereby, a focal length is prescribed | regulated by the length of the optical axis direction of a protrusion part. Moreover, the storage part is formed in the front-end | tip part of a protrusion part. For this reason, by storing the protrusion in the storage unit, the solid-state imaging device and the optical mechanism are aligned both in the optical axis direction and in the direction perpendicular to the optical axis direction. Therefore, it is possible to provide a solid-state imaging device with higher alignment accuracy between the solid-state imaging element and the optical mechanism.

  In the solid-state imaging device according to the present invention, it is preferable that the protrusion is configured as a stud bump.

  According to the above invention, the protrusion is configured as a stud bump that is widely used in an IC mounting process or an LSI manufacturing process. Therefore, it is possible to easily form the protrusion using existing technology.

  Further, the stud bump has a different shape from the main circuit provided on the imaging surface of the solid-state imaging device, and the stud bump is usually gold. For this reason, the visibility of the stud bump is high and can be easily distinguished from other circuits. Therefore, alignment between the solid-state imaging device and the optical mechanism can be performed easily and with high accuracy.

  In the solid-state imaging device according to the present invention, an input / output terminal and at least one of an NC terminal and a ground terminal, which are arranged in the same row, are formed on the imaging surface of the solid-state imaging element, It is preferably formed on the NC terminal or the ground terminal.

  According to said invention, the projection part is formed on the terminal (NC terminal or grounding terminal) which is normally provided in the solid-state image sensor and is not connected externally. Moreover, the NC terminal or the ground terminal is arranged in the same row as the input / output terminals. For this reason, it is not necessary to consider a special terminal layout or to form a special terminal only for forming the protrusion. Therefore, the protrusion can be formed with a simple configuration.

  In the solid-state imaging device according to the present invention, the input / output terminal and at least one of the NC terminal and the ground terminal are arranged so that the NC terminal or the ground terminal on which the protrusion is formed is disposed at the end. Preferably it is.

  According to the above invention, the protrusion is formed on the NC terminal or the ground terminal arranged at the end among the terminals arranged on the imaging surface. Accordingly, the protruding portion and the storage portion can be easily formed. In addition, the protrusions can be formed without hindering external connection of the input / output terminals.

  In the solid-state imaging device according to the present invention, the protruding portion may be stored in the storage portion with a part of the protruding portion exposed.

  According to the above invention, in a state where the solid-state imaging device and the optical mechanism are aligned, a part of the protrusion is partially exposed from the storage unit. Thereby, compared with the case where the whole protrusion part is stored in the inside of a storage part, the shaping | molding precision of a storage part becomes low. Therefore, it is possible to reduce the manufacturing cost of the housing, and hence the manufacturing cost of the solid-state imaging device.

  In the solid-state imaging device according to the present invention, the storage unit may be provided apart from the imaging surface of the solid-state imaging device while abutting against the protrusion.

  According to the above invention, since the storage portion is not in contact with the imaging surface of the solid-state imaging device, it is possible to prevent the malfunction of the solid-state imaging device and the generation of noise that causes a problem with the image. On the other hand, since the storage portion is in contact with the protrusion, the alignment accuracy in the optical axis direction between the solid-state imaging device and the optical mechanism does not decrease.

  In the solid-state imaging device according to the present invention, it is preferable that the stud bump has a multilayer structure.

  According to the above invention, since the stat bump has a multilayer structure, the length of the stud bump in the optical axis direction (thickness of the stud bump) becomes longer (thicker) than that of the single layer structure. That is, the length of the stat bump stored in the storage unit is set to be long. Thereby, since the protrusion of the protrusion on the storage portion is improved, the protrusion can be reliably stored in the storage portion. Therefore, alignment between the solid-state imaging device and the optical mechanism can be easily performed. In addition, it is possible to prevent displacement after alignment.

  The solid-state imaging device according to the present invention preferably includes a wiring board on which the solid-state imaging element is mounted, and the casing is bonded to the wiring board, but is not bonded to the solid-state imaging element.

  According to said invention, the housing is adhere | attached on the wiring board, and is not adhere | attached on the solid-state image sensor. Accordingly, it is possible to prevent malfunction of the solid-state imaging device due to the adhesive.

  In the solid-state imaging device according to the present invention, it is preferable that the protruding portion is formed of a stud bump, and the solid-state imaging element and the wiring board are wire-bonded.

  According to the above invention, the protrusion is configured as a stud bump that is widely used in an IC mounting process or an LSI manufacturing process. Therefore, it is possible to easily form the protrusion using existing technology.

  And according to said invention, a stud bump can be formed at the time of wire bonding with a solid-state image sensor and a wiring board. That is, the electrical connection between the solid-state imaging device and the wiring board and the formation of the protrusion can be performed in a common process. Therefore, the manufacturing process of the solid-state imaging device can be simplified.

  In order to solve the above problems, an electronic apparatus according to the present invention includes any one of the solid-state imaging devices. Therefore, it is possible to provide an electronic apparatus with high alignment accuracy between the solid-state imaging device and the optical mechanism.

  The solid-state imaging device and the electronic apparatus according to the present invention have a configuration in which the optical axis alignment between the solid-state imaging element and the optical mechanism is performed by storing the protrusion in the storage unit. Therefore, there is an effect that it is possible to provide a solid-state imaging device and an electronic apparatus with high alignment accuracy between the solid-state imaging element and the optical mechanism.

It is sectional drawing of the contact part of a solid-state image sensor and a protrusion part in the solid-state imaging device concerning one Embodiment of this invention. It is sectional drawing which shows schematic structure of the solid-state imaging device which concerns on one Embodiment of this invention. It is a top view of the solid-state image sensor in the solid-state imaging device concerning one embodiment of the present invention. It is a top view which shows the example of a connection of a solid-state image sensor and a wiring board in the solid-state imaging device which concerns on one Embodiment of this invention. It is the schematic which shows the bonding method of a wire, and the formation method of a stud bump in the solid-state imaging device concerning one embodiment of the present invention. 1 shows a housing in a solid-state imaging device according to an embodiment of the present invention, in which (a) is a cross-sectional view seen from the direction in which wire bonding is applied to an input / output terminal of the solid-state imaging device, and (b) shows (a). It is sectional drawing seen from the direction rotated 90 degree | times centering on the up-down direction of the figure. It is the top view which looked at the housing in the solid imaging device concerning one embodiment of the present invention from the solid imaging device side. 2A and 2B show a solid-state imaging device according to another embodiment of the present invention, in which FIG. 1A is a plan view of a housing as viewed from the solid-state imaging device side, FIG. 2B is a cross-sectional view of a storage unit, and FIG. It is. FIG. 6 shows a solid-state imaging device according to still another embodiment of the present invention, in which (a) is a cross-sectional view of a storage unit, and (b) is a diagram of a direction from the direction in which wire bonding is applied to input / output terminals of the solid-state imaging device. It is sectional drawing of the housing of the solid-state imaging device seen from the direction rotated 90 degree | times centering on the up-down direction. It is sectional drawing of the storage part of the solid-state imaging device which concerns on another embodiment of this invention. It is sectional drawing of the solid-state imaging device of patent document 1. It is a figure which shows the optical device of patent document 2, (a) is a top view, (b) is sectional drawing cut | disconnected along A1-A1 in (a).

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. For convenience of explanation, members having the same function are denoted by the same reference numerals and description thereof is omitted.

[First Embodiment]
A first embodiment of the present invention will be described with reference to FIGS.

<Solid-state imaging device 100>
FIG. 2 is a cross-sectional view illustrating a schematic configuration of the solid-state imaging device 100 according to the present embodiment. As shown in FIG. 2, the solid-state imaging device 100 includes a solid-state imaging device 1, an optical mechanism 2, a housing 3, a translucent lid 4, and a wiring board 5. In the following, for convenience of explanation, the optical mechanism 2 side is referred to as the upper side, and the solid-state imaging device 1 (wiring board 5) side is referred to as the lower side.

  The solid-state imaging device 1 is disposed in the center of the wiring substrate 5 and is a semiconductor substrate (for example, a silicon single crystal substrate) on which a semiconductor circuit is formed formed in a rectangular shape in plan view. The solid-state imaging device 1 is, for example, a CCD (charge-coupled device) image sensor, a CMOS (complementary metal-oxide semiconductor) image sensor, or a VMIS (Threshold Voltage Modulation Image Sensor). An imaging unit 11 is formed on the upper surface (imaging surface 11 a) of the solid-state imaging device 1. The imaging unit 11 has a plurality of light receiving elements (pixels) arranged in a matrix. The light receiving element converts the subject image (light transmitted through the translucent lid 4) formed on the imaging unit 11 into an electrical signal.

  The optical mechanism 2 guides light from the outside to the imaging unit 11. As shown in FIG. 2, the optical mechanism 2 is held by a housing 3. In FIG. 2, the optical mechanism 2 is shown by one lens. However, the optical mechanism 2 may be composed of a movable part such as macro, zoom, and autofocus and a plurality of lenses.

  The housing 3 holds the optical mechanism 2 inside. The housing 3 has an opening 31 for light to pass between the solid-state imaging device 1 and the optical mechanism 2. That is, the opening 31 is formed on the optical path. The housing 3 includes a protruding portion 34 that protrudes from the surface facing the imaging surface 11a toward the imaging surface 11a. Further, the housing 3 includes a peripheral edge 35 extending from the surface facing the upper surface of the wiring board 5 toward the imaging surface 11a. That is, the housing 3 is formed with the protruding portion 34 and the peripheral edge portion 35 downward from the surface facing the imaging surface 11a. Since the peripheral edge 35 is provided outside the solid-state imaging device 1, the peripheral edge 35 is disposed outside the protruding portion 34. The peripheral portion 35 is formed on the upper surface of the wiring substrate 5 so as to surround the solid-state imaging device 1. The bottom of the protrusion 34 is an abutting portion 33 that abuts on the imaging surface 11 a of the solid-state imaging device 1. The housing 3 is bonded onto the wiring substrate 5 by an adhesive portion 36 made of an adhesive. On the other hand, the protruding portion 34 (contact portion 33) of the housing 3 and the solid-state imaging element 1 may be bonded. However, in the solid-state imaging device 100, the protruding portion 34 (contact portion 33) of the housing 3 and the solid-state imaging are used. The element 1 is not bonded.

  The translucent lid 4 is disposed so as to close the opening 31 of the housing 3, and is disposed to face the imaging unit 11. Since the translucent lid 4 closes the opening 31, it is possible to prevent dust from entering and adhering to the imaging unit 11, and it is possible to prevent occurrence of defects in the imaging unit 11. The translucent cover part 4 is comprised from translucent members, such as glass and resin which have translucency. Note that the translucent lid 4 may be formed with an optical filter such as an infrared cut filter that cuts infrared rays incident on the imaging unit 11. Thereby, the translucent cover part 4 comes to have a function which interrupts the infrared rays from the outside.

  The wiring board 5 is used to take out an electrical signal from the solid-state imaging device 1 and has a patterned wiring (not shown). The wiring board 5 is, for example, a printed board, a glass epoxy board, or a ceramic board. Note that an electrode (not shown) for external connection is formed on the lower surface (back surface) of the wiring substrate 5 and can be electrically connected to an external device. FIG. 4 is a plan view showing an example of connection between the solid-state imaging device 1 and the wiring board 5 in the solid-state imaging device 100 of the present embodiment. As shown in FIG. 4, the wiring and the solid-state imaging device 1 are connected by a bonding wire. Thereby, transmission and reception of electrical signals are possible.

  Various electronic components (not shown) for driving the solid-state imaging device 100 may be mounted on the wiring board 5. Such an electronic component is, for example, a signal processing circuit that performs signal processing of the solid-state imaging device 1. Specifically, this signal processing circuit functions as a control unit (image processing device) that controls the operation of the solid-state imaging device 1 and appropriately processes signals output from the solid-state imaging device 1 to generate necessary signals. To do. For example, the signal processing circuit amplifies the electric signal converted by the light receiving element of the image pickup unit 11 and outputs the electric signal as an analog signal. The analog signal is converted into a digital signal. Analog / digital conversion processing circuit unit, driver unit that controls the operation of the solid-state imaging device 1, and signal processing (mainly improving the color of the image or enhancing the outline to make it clear) It includes electronic components such as a DSP (digital signal processor), a CPU that performs various logical operation processes and operations of the above-described units according to a program, a ROM that stores the program, and a RAM that stores data of each process. This electronic component includes a resistor and a capacitor.

  Such a solid-state imaging device 100 takes in external light through the optical mechanism 2 and the translucent lid 4 and receives an image image by the imaging unit 11 of the solid-state imaging device 1.

<Characteristic Configuration of Solid-State Imaging Device 100>
(Protrusion 13)
FIG. 3 is a plan view of the solid-state imaging device 1 (imaging surface 11a) in the solid-state imaging device 100. FIG. FIG. 3 shows the imaging surface 11a. As shown in FIG. 3, the imaging surface 11a is rectangular. Recent solid-state imaging devices 1 have a small number of input / output terminals 12a. For this reason, for example, as shown in FIG. 3, input / output terminals 12 a and solid-state image sensor side terminals 12 for alignment are provided along two opposite sides. The input / output terminals 12a on each side and the solid-state image sensor side terminals 12 for alignment are arranged in the same row. In the solid-state imaging device 100, terminals at both ends of each side are solid-state imaging device side terminals 12 for alignment. Projections 13 are formed in the optical axis direction from the respective solid-state image sensor side terminals 12. The protrusion 13 is formed so as to avoid the imaging unit 11. In addition, the broken-line part in FIG. 3 has shown the area | region where the bottom part (contact part 33) of the protrusion part 34 of the housing 3 contacts.

  In the solid-state imaging device 100, the protrusion 13 is configured as a stud bump on the imaging surface 11a. However, the protrusion 13 may be formed of any material as long as it protrudes from the imaging surface 11a of the solid-state imaging device 1 toward the housing 3 side. In addition to the stud bumps, a wafer substrate prepared separately from the wiring substrate 5 may be cut into a columnar shape and bonded to the imaging surface 11a to form the protruding portion 13, or a cover glass that partially protects the imaging surface 11a is deposited. Thus, the protrusion 13 may be formed. However, as will be described later, the protrusion 13 is preferably formed by a stud bump.

(Storage unit 32)
FIG. 1 is a cross-sectional view of a contact portion between the solid-state imaging device 1 and the protruding portion 34 in the solid-state imaging device 100 of the present embodiment. As shown in FIG. 1, a storage portion 32 that stores the protruding portion 13 formed on the imaging surface 11 a is formed at the bottom of the protruding portion 34 of the housing 3. In FIG. 1, the storage portion 32 is formed with a space for storing the entire protrusion 13 (encloses the protrusion 13). That is, the storage portion 32 has a space that is substantially the same shape as the protruding portion 13. However, the storage unit 32 only needs to have a space in which at least a part of the protrusion 13 can be stored. That is, the storage part 32 should just accommodate at least one part of the projection part 13. FIG.

  6A and 6B show the housing 3 of the solid-state imaging device 100, where FIG. 6A is a cross-sectional view as viewed from the direction in which wire bonding is applied to the input / output terminals of the solid-state imaging device 1, and FIG. It is sectional drawing seen from the direction rotated 90 degree | times centering on the up-down direction. FIG. 7 is a plan view of the housing 3 in the solid-state imaging device 100 as viewed from the solid-state imaging device 1 side.

  As shown in FIGS. 6 and 7, in the solid-state imaging device 100 of the present embodiment, the protruding portion 34 of the housing 3 is configured as a plate-like protruding portion. That is, in order to facilitate wire bonding, the protrusion 34 is not formed in the region where the input / output terminal 12a is formed as shown in FIG. 6A, but as shown in FIG. 6B. A protrusion 34 is formed in a region where the input / output terminal 12a is not formed. Further, the abutting portion 33 of the projecting portion 34 with the imaging surface 11a is configured such that only the portion where the protrusion 13 is formed (only the portion where the storage portion 32 is formed) abuts the imaging surface 11a. . Thereby, the area contact | abutted on the solid-state image sensor 1 is small. Note that the protruding portion 34 may be a columnar protruding portion so as to contact only the portion where the protruding portion 13 is formed.

<Alignment of Solid-State Image Sensor 1 and Optical Mechanism 2>
The solid-state imaging device 100 increases the accuracy of alignment of the optical axis of the solid-state imaging device 100 as a whole by increasing the alignment accuracy of the solid-state imaging device 1 and the optical mechanism 2 in the planar direction (perpendicular to the optical axis). The biggest feature is to increase.

  Specifically, as illustrated in FIG. 1, in the solid-state imaging device 100, the protrusion 13 formed on the solid-state imaging device side terminal 12 of the imaging surface 11 a is stored in the storage unit 32, thereby 1 and the optical mechanism 2 are aligned with each other. That is, the storage unit 32 stores the protrusion 13 on the surface of the solid-state imaging device 1, so that the position of the housing 3 in the planar direction with respect to the solid-state imaging device 1 is fixed. As a result, the protrusion 13 is stored in the storage 32 so that the center (pixel center) of the imaging unit 11 of the solid-state imaging device 1 and the center (optical axis) of the optical mechanism 2 held by the housing 3 are obtained. Match. The solid-state image sensor side terminal 12 is connected to the internal wiring 14 inside the solid-state image sensor 1.

<Effect of the solid-state imaging device 100>
As described above, in the solid-state imaging device 100, the solid-state imaging device 1 and the optical mechanism 2 are aligned with reference to the protrusion 13 formed on the imaging surface 11 a of the solid-state imaging device 1. Thereby, the solid-state imaging device 1 and the optical mechanism 2 are aligned in the direction perpendicular to the optical axis (that is, in the in-plane direction of the imaging surface 11a). Accordingly, it is possible to provide the solid-state imaging device 100 with high alignment accuracy between the solid-state imaging element 1 and the optical mechanism 2.

  Further, in the solid-state imaging device 100, the storage portion 32 is formed at the distal end portion of the protruding portion 34, and the length of the protruding portion 34 in the optical axis direction is equal to the distance between the solid-state imaging device 1 and the optical mechanism 2. It has become. That is, the length in the optical axis direction of the protrusion 34 formed on the housing 3 is the same as the distance between the solid-state imaging device 1 and the optical mechanism 2. Thus, the focal length is defined by the length of the protrusion 34 in the optical axis direction. In addition, the storage portion 32 is formed at the distal end portion of the protruding portion 34. For this reason, by storing the protruding portion 13 in the storage portion 32, the solid-state imaging device 1 and the optical mechanism 2 are aligned both in the optical axis direction and in the direction perpendicular to the optical axis direction. Accordingly, the alignment accuracy between the solid-state imaging device 1 and the optical mechanism 2 is further increased.

  Further, in the solid-state imaging device 100, the protrusion 13 is configured as a stud bump. That is, the protrusion 13 is configured as a stud bump widely used in an IC mounting process or an LSI manufacturing process. The stud bump is formed on a terminal that has conventionally played a role of passing an electric signal to the outside, and the protrusion 13 can be formed without introducing a special technique. Therefore, the protrusion 13 can be easily formed using existing technology.

  The stud bump is different in shape from the main circuit provided on the imaging surface 11 a of the solid-state imaging device 1. Specifically, the outer shape of the stud bump (the outer shape viewed from the housing 3 side in the optical axis direction) is circular. On the other hand, the outer shape of the circuit arranged in the layout of the imaging surface 11a of the solid-state imaging device 1 is often rectangular. Moreover, the stud bump is usually gold. For this reason, the visibility of the stud bump is high and can be easily distinguished from other circuits. Therefore, alignment between the solid-state imaging device 1 and the optical mechanism 2 can be performed easily and with high accuracy. Thus, the stud bump is suitable as a target when mounting the housing 3 on the solid-state imaging device 1 (wiring substrate 5), that is, as a reference for alignment.

  The stud bump can be formed as follows. FIG. 5 is a schematic view showing a wire bonding and stud bump forming method in the solid-state imaging device 100.

  FIG. 5 shows wire bonding and stud bump forming methods. Wire bonding and stud bumps involve a common process. First, as shown in FIG. 5A, a gold wire ball 8 is formed at the tip of a capillary 7 of a bonding apparatus. The gold wire ball is formed by melting the gold wire by electric discharge. Next, as shown in FIG. 5 (b), the gold wire ball 8 is struck or pressed against the solid-state image sensor side terminal 12, and is further subjected to ultrasonic vibration so that the gold wire and the solid-state image sensor side terminal 12 are connected. Crimp.

  Thereafter, when forming the stud bump, the gold wire is cut as shown in FIG. As a method of pulling the gold wire, the gold wire may be pulled while the capillary 7 is fixed, or the gold wire and the capillary 7 may be pulled rapidly. After the capillary 7 is released, a gold stud bump is formed.

  On the other hand, when wire bonding the solid-state imaging device 1 and the wiring board 5, the steps (a) and (b) in FIG. 5 are the same. However, the solid-state image sensor side terminal 12 in FIG. 5A is an input / output terminal 12a (see FIG. 3). Next, as shown in FIG. 5D, the capillary 7 is released so that the gold wire is not cut. The gold wire ball 8 crimped to the input / output terminal 12a is pressed against the wiring board side terminal (see FIG. 4, not shown in FIG. 5), and ultrasonic vibration is applied to rub the gold wire. Pull it out like so.

  Thus, when the solid-state imaging device 1 and the wiring substrate 5 are wire-bonded, stud bumps can be formed at the time of wire bonding between the solid-state imaging device 1 and the wiring substrate 5. That is, the electrical connection between the solid-state imaging device 1 and the wiring board 5 and the formation of the protrusion 13 can be performed in a common process. Therefore, the manufacturing process of the solid-state imaging device 100 can be simplified.

  On the other hand, in the solid-state imaging device 100, the protrusion 13 is not particularly limited as long as it is formed on the imaging surface 11a so as to avoid the imaging unit 11. As shown in FIG. 3, an NC terminal and a ground terminal (GND terminal) are usually formed on the imaging surface 11a of the solid-state imaging device 1 in addition to the input / output terminal 12a. An NC (NC: Non Connection) terminal is a terminal that is used for testing the solid-state imaging device 1 (IC chip) and is not connected to the outside. Similarly, the GND terminal is a terminal that may not be connected to the outside.

  The protrusion 13 is preferably formed on the NC terminal or the ground terminal. That is, the solid-state image sensor side terminal 12 in FIG. 3 is preferably an NC terminal or a ground terminal. In this case, the protrusion 13 is formed on a terminal (solid-state image sensor side terminal 12: NC terminal or ground terminal) that is normally provided on the solid-state image sensor 1 and is not externally connected. Moreover, as shown in FIG. 3, the solid-state imaging device side terminal 12 (NC terminal or ground terminal) is arranged in the same row as the input / output terminal 12a. For this reason, it is not necessary to consider a special terminal layout or to form a special terminal only for forming the protrusion 13. Therefore, the protrusion 13 can be formed with a simple configuration. When an NC terminal or a ground terminal is used as the solid-state image sensor side terminal 12, any terminal that is convenient for alignment may be selected from a plurality of NC terminals or unused ground terminals.

  In Patent Document 2, in order to support the transparent member 303 that covers the imaging region 302, it is necessary to form a column 305 in the vicinity of the transparent member 303. Furthermore, the electrode pad 306a on which the support column 305 is formed must also be provided in the vicinity of the transparent member 303. For this reason, it is usually necessary to provide an electrode pad 306 a for forming the support column 305 separately from the electrode pad 306 formed on the outer edge of the solid-state imaging device 301. However, in the IC layout, since the electrode pads 306 and 306a require a relatively large area (200 μm × 200 μm), the electrode pads 306a cannot normally be formed at irregular positions.

  The electrode pad 306 is a terminal connected to the outside as an IC output terminal. For this reason, a protective circuit is formed so that the circuit inside the IC (inside the solid-state imaging device 301) is not destroyed by external static electricity, or a wire is bonded (a gold wire is applied to the electrode pad 306 to apply ultrasonic vibration). ) The structure is not affected by the impact (away from the internal circuit of the IC). Therefore, the electrode pad 306 needs to be formed on the outer edge portion of the solid-state imaging element 301 in order to quickly release the static electricity to the outside (to make it difficult to transmit the static electricity into the IC). Also from this point, it is difficult to provide the electrode pad 306a at an irregular position (a position different from the electrode pad 306 provided on the outer edge portion of the solid-state imaging device 301).

  Further, the arrangement position of the solid-state image sensor side terminal 12 is not particularly limited, but it is preferable that the solid-state image sensor side terminal 12 is arranged at the end as shown in FIG. That is, the input / output terminal 12a and the solid-state image sensor side terminal 12 are arranged so that the solid-state image sensor side terminal 12 (NC terminal or ground terminal) on which the protrusion 13 is formed is arranged at the end. It is preferable. In other words, it is preferable that at least two protrusions 13 are formed at the corners on the imaging surface 11a.

  In this case, among the terminals arranged on the imaging surface 11a (input / output terminal 12a, solid-state image sensor side terminal 12), the protrusion 13 is formed on the solid-state image sensor side terminal 12 arranged at the end. The Accordingly, the protruding portion 13 and the storage portion 32 can be easily formed. Further, the protrusion 13 can be formed without hindering external connection of the input / output terminal 12a (without interfering with wire bonding).

  In the solid-state imaging device 100, the protrusion 13 may be formed on a dedicated terminal (dummy pad) separately formed instead of being formed on an existing terminal such as an NC terminal or a ground terminal.

  In the solid-state imaging device 100, the peripheral edge 35 of the housing 3 is bonded to the wiring substrate 5, but is not bonded to the imaging surface 11 a of the solid-state imaging device 1. That is, the housing 3 is bonded to the wiring board 5 and is not bonded to the solid-state imaging device 1. Accordingly, it is possible to prevent malfunction of the solid-state imaging device due to the bonding portion 36. Further, since the peripheral portion 35 surrounds the solid-state imaging device 1, it is possible to prevent intrusion of minute dust and foreign matter and unnecessary light into the imaging unit 11.

[Second Embodiment]
A second embodiment of the present invention will be described with reference to FIG. 8A is a plan view of the housing 3 viewed from the solid-state imaging device 1 side, FIG. 8B is a cross-sectional view of the storage portion 32, and FIG. 8C is a cross-sectional view of the protruding portion 13.

  In the solid-state imaging device 100 of the first embodiment, the storage portion 32 formed at the tip portion of the protruding portion 34 is formed so as to correspond to each protruding portion 13. Further, each storage portion 32 is configured to accommodate the entire protrusion 13.

  On the other hand, in the solid-state imaging device according to the present embodiment, as shown in FIG. 8, the storage portion 32 at the tip of the protruding portion 34 has a cutout shape, and the protruding portion 13 is partially exposed from the storage portion 32. . This point is different from the first embodiment.

  Specifically, as indicated by W in FIG. 8C, the diameter of the projection 13 is 70 to 120 μm, which is the limit of the current resin molding. For this reason, when the storage portion 32 has a shape that accommodates the entire protrusion 13 as in the first embodiment, high accuracy is required for molding the storage portion 32. As a result, the manufacturing cost of the housing 3 may be expensive.

  Therefore, in the present embodiment, the protruding portion 13 is stored in the storage portion 32 with a part of the protruding portion 13 exposed. In other words, in a state where the solid-state imaging device 1 and the optical mechanism 2 are aligned, a part of the protruding portion 13 is exposed from the storage portion 32. Thereby, compared with the case where the projection part 13 whole is stored in the inside of the storage part 32, the shaping | molding precision of the storage part 32 becomes low. Therefore, it is possible to reduce the manufacturing cost of the housing 3 and consequently the manufacturing cost of the solid-state imaging device.

[Third Embodiment]
A third embodiment of the present invention will be described with reference to FIG. 9A is a cross-sectional view of the storage portion 32, and FIG. 9B is viewed from a direction rotated 90 degrees around the vertical direction of the drawing from the direction in which wire bonding is applied to the input / output terminals of the solid-state imaging device 1. It is sectional drawing of the housing 3 of a solid-state imaging device.

  The solid-state imaging device according to the present embodiment is different from the first embodiment in that the contact portion 33 is in contact with the protrusion 13 as shown in FIG. That is, in the solid-state imaging device according to the present embodiment, the storage unit 32 is in contact with the protrusion 13 and is provided apart from the imaging surface 11 a of the solid-state imaging device 1.

  The solid-state imaging device 1 is a member on an IC chip. On the imaging surface 11a, a light receiving element (imaging unit), a circuit for transferring an electrical signal converted from light by the light receiving element, and amplifying the transferred electrical signal And a circuit for processing these electrical signals (improving color development of the image as an image signal or emphasizing the outline for clarity). Since these circuits perform analog operations, they are affected by the periphery of the solid-state imaging device 1. In particular, if there is a contact object on the imaging surface 11a, the capacitance of the contact object is added as a capacitor (capacitor) to the circuit in the contacted portion. If the package is normally sealed with resin, the resin contacts the entire solid-state imaging device 1 evenly, so that the entire circuit is equally loaded, so that the effect is not relatively obvious. However, if a capacitance is added to a part of the circuit, it affects the part of the circuit, and even if the solid-state imaging device 1 itself does not malfunction, color unevenness occurs in the captured image or linear noise occurs in the image. There is a case.

  In addition, when a pressure is applied during the operation of the solid-state imaging device 1, the pressure causes the solid-state imaging device 1 to be deformed. When the deformed portion corresponds to a transistor in the circuit of the solid-state imaging device 1, the transistor is There is a case where the circuit malfunctions and the circuit malfunctions.

  For this reason, as in the present embodiment, if the storage unit 32 is not in contact with the imaging surface 11a of the solid-state imaging device 1, it is possible to prevent the malfunction of the solid-state imaging device 1 and the generation of noise that causes problems in the image. Can do. Moreover, when the bottom part (contact part 33) of the protrusion part 34 is made to contact directly on the surface of the solid-state image sensor 1, when the contact part is contaminated by adhesion of Na or K, etc., the solid-state image sensor 1 May be adversely affected. In the present embodiment, the abutting portion 33 does not directly abut on the imaging surface 11a of the solid-state imaging device 1, so that the influence on the solid-state imaging device 1 can be prevented.

  On the other hand, since the storage portion 32 is in contact with the protrusion 13, the alignment accuracy in the optical axis direction between the solid-state imaging device 1 and the optical mechanism 2 does not decrease.

  In the first embodiment, the contact portion 33 further protrudes in the direction of the solid-state image sensor 1 from the plate-like protrusion so that the contact with the solid-state image sensor 1 becomes smaller (see FIG. 6). However, in this embodiment, as shown in FIG. 9A, the contact portion 33 does not directly contact the surface of the solid-state imaging device 1, so even if the protruding portion 34 is a plate-like projection, further solid-state imaging. It is not necessary to project in the element 1 direction. For this reason, in the present embodiment, as shown in FIG. 9B, the bottom of the protrusion 34 is apparently flush.

  9A, the protrusion 13 is a stud bump. However, the protrusion 13 is not limited to a stud bump as long as the contact portion 33 can be in contact with the protrusion 13. The stud bump shown in FIG. 9 (a) has a convex section having a large-diameter portion on the terminal side and a small-diameter portion on the tip side following the large-diameter portion, and the contact portion 33 is abutted on the large-diameter portion. It touches.

[Fourth Embodiment]
A fourth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a cross-sectional view of the storage unit 32 according to the present embodiment.

  The solid-state imaging device according to the present embodiment is different from the first embodiment in that the protrusion 13 is formed of a multilayer bump (two-layer formation in FIG. 10) stud bump.

  In this embodiment, since the stat bump (projection portion 13) has a multilayer structure, the length of the stud bump in the optical axis direction (thickness of the stud bump) is longer (thicker) than in the case of the single layer structure. . That is, the length of the stat bump stored in the storage unit 32 is set long. As a result, the protrusion 13 is easily hooked to the storage portion 32, so that the protrusion 13 can be reliably stored in the storage portion 32. Therefore, alignment between the solid-state imaging device 1 and the optical mechanism 2 can be easily performed. Further, it is possible to prevent the displacement of the housing 3 after the alignment.

  In order to form a stud bump having a multilayer structure, the steps shown in FIGS. 5A to 5C may be repeated a plurality of times. As an example, a method for forming a stud bump having a two-layer structure will be described below. First, a stud bump having a single layer structure is formed by the steps shown in FIGS. After that, a gold wire ball 8 is further pressure-bonded onto the single-layer structure stud bump by the steps shown in FIGS. Then, the gold wire is pulled off as shown in FIG. After the capillary 7 is released, a stud bump having a two-layer structure is formed.

  As described above, according to the present invention, a solid-state imaging device, a wiring board, a lens, a translucent lid (glass substrate), and a solid-state imaging device (camera module) having a housing as a package, and conventionally, external Electrodes (stud bumps) that have been used to pass electrical signals to the lens are used as a guide for positioning the lens holder. Thereby, relative position alignment of an image sensor and a lens holder (namely, lens) can be accurately performed by a simple method, and a solid-state imaging device can be assembled. The lens may have optical functions such as zoom and autofocus. The solid-state imaging device of the present invention can be suitably used for various electronic devices such as a camera-equipped mobile phone, a digital still camera, and a security camera.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The present invention can be used for various electronic devices such as a mobile phone with a camera, a digital still camera, and a security camera.

DESCRIPTION OF SYMBOLS 1 Solid-state image sensor 2 Optical mechanism 3 Housing 5 Wiring board 11 Imaging part 11a Imaging surface 12 Solid-state image sensor side terminal (NC terminal or ground terminal)
12a Input / output terminal 13 Projection (Stud bump)
32 Storage unit 34 Projection unit 100 Solid-state imaging device

Claims (11)

A solid-state image sensor;
An optical mechanism for guiding external light to the solid-state imaging device;
A housing for holding the optical mechanism;
On the imaging surface including the imaging unit of the solid-state imaging device, a projection that is formed avoiding the imaging unit and protrudes in the optical axis direction from the imaging surface;
A storage portion that is formed on the housing and stores at least a part of the protrusion,
The solid-state imaging device, wherein the projection is stored in the storage unit, so that the optical axis alignment between the solid-state imaging device and the optical mechanism is performed. The housing includes a protruding portion that protrudes from the surface facing the imaging surface to the imaging surface side,
The storage portion is formed at the tip of the protruding portion,
The solid-state imaging device according to claim 1, wherein a length of the protruding portion in the optical axis direction is equal to a distance between the solid-state imaging element and an optical mechanism.   The solid-state imaging device according to claim 1, wherein the protrusion is configured as a stud bump. An input / output terminal and at least one of an NC terminal and a ground terminal are formed on the imaging surface of the solid-state imaging device, and are arranged in the same row.
The solid-state imaging device according to claim 1, wherein the protrusion is formed on the NC terminal or the ground terminal.   5. The input / output terminal and at least one of the NC terminal and the ground terminal are arranged so that the NC terminal or the ground terminal on which the protrusion is formed is arranged at the end. The solid-state imaging device described in 1.   6. The solid-state imaging device according to claim 1, wherein the protruding portion is stored in a storage portion in a state in which a part of the protruding portion is exposed.   6. The solid-state imaging according to claim 1, wherein the storage unit is in contact with the protrusion and is provided apart from an imaging surface of the solid-state imaging device. apparatus.   The solid-state imaging device according to claim 3, wherein the stud bump has a multilayer structure. A wiring board on which the solid-state imaging device is mounted,
9. The solid-state imaging device according to claim 1, wherein the casing is bonded to the wiring substrate, but is not bonded to the solid-state imaging element. The protrusion is composed of a stud bump,
The solid-state imaging device according to claim 9, wherein the solid-state imaging element and the wiring board are wire-bonded.   The electronic device provided with the solid-state imaging device of any one of Claims 1-10.

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