JP2013162121A - 一体化多層式照明装置 - Google Patents

一体化多層式照明装置 Download PDF

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Publication number
JP2013162121A
JP2013162121A JP2012114525A JP2012114525A JP2013162121A JP 2013162121 A JP2013162121 A JP 2013162121A JP 2012114525 A JP2012114525 A JP 2012114525A JP 2012114525 A JP2012114525 A JP 2012114525A JP 2013162121 A JP2013162121 A JP 2013162121A
Authority
JP
Japan
Prior art keywords
light emitting
lighting device
integrated multilayer
chamber
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012114525A
Other languages
English (en)
Japanese (ja)
Inventor
Jon-Fwu Hwu
仲孚 胡
Yong-Fu Wu
永富 呉
Kui-Chiang Liu
奎江 劉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gem Weltronics TWN Corp
Original Assignee
Gem Weltronics TWN Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gem Weltronics TWN Corp filed Critical Gem Weltronics TWN Corp
Publication of JP2013162121A publication Critical patent/JP2013162121A/ja
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/857Interconnections, e.g. lead-frames, bond wires or solder balls
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/858Means for heat extraction or cooling
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
JP2012114525A 2012-02-07 2012-05-18 一体化多層式照明装置 Pending JP2013162121A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW101104003 2012-02-07
TW101104003A TW201333373A (zh) 2012-02-07 2012-02-07 一體化多層式照明裝置

Publications (1)

Publication Number Publication Date
JP2013162121A true JP2013162121A (ja) 2013-08-19

Family

ID=48084878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012114525A Pending JP2013162121A (ja) 2012-02-07 2012-05-18 一体化多層式照明装置

Country Status (5)

Country Link
JP (1) JP2013162121A (enrdf_load_stackoverflow)
KR (1) KR101301893B1 (enrdf_load_stackoverflow)
BR (1) BR102013002902A2 (enrdf_load_stackoverflow)
DE (2) DE102013100921A1 (enrdf_load_stackoverflow)
TW (1) TW201333373A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103398364B (zh) * 2013-07-23 2016-05-11 宁波市爱使电器有限公司 一种led灯

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008293966A (ja) * 2007-05-23 2008-12-04 Advance Connectek Inc 発光ダイオードランプ
JP2009164157A (ja) * 2007-12-28 2009-07-23 Nichia Corp 発光装置
JP2011014878A (ja) * 2009-06-01 2011-01-20 Toshiba Lighting & Technology Corp 発光モジュールおよび照明装置
JP2011222544A (ja) * 2010-04-02 2011-11-04 Stanley Electric Co Ltd 半導体発光装置の製造方法および色度が調整された半導体発光装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100593919B1 (ko) * 2004-07-01 2006-06-30 삼성전기주식회사 차량 전조등용 발광 다이오드 모듈 및 이를 구비한 차량전조등
JP2006267622A (ja) * 2005-03-24 2006-10-05 Sony Corp ランプ冷却装置及び投射型表示装置
KR100637476B1 (ko) 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
KR101317429B1 (ko) * 2007-01-31 2013-10-10 잘만테크 주식회사 히트파이프를 이용한 냉각장치를 구비한 led조명 조립체
KR200437242Y1 (ko) * 2007-03-06 2007-11-16 광성전기산업(주) 교류 전원용 발광 다이오드 램프
TWM330426U (en) * 2007-11-05 2008-04-11 Unity Opto Technology Co Ltd Heat dissipation structure of lamp
TWM332793U (en) * 2007-11-28 2008-05-21 Cooler Master Co Ltd Heat radiating structure and the lighting apparatus
TW200923262A (en) * 2007-11-30 2009-06-01 Tysun Inc High heat dissipation optic module for light emitting diode and its manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008293966A (ja) * 2007-05-23 2008-12-04 Advance Connectek Inc 発光ダイオードランプ
JP2009164157A (ja) * 2007-12-28 2009-07-23 Nichia Corp 発光装置
JP2011014878A (ja) * 2009-06-01 2011-01-20 Toshiba Lighting & Technology Corp 発光モジュールおよび照明装置
JP2011222544A (ja) * 2010-04-02 2011-11-04 Stanley Electric Co Ltd 半導体発光装置の製造方法および色度が調整された半導体発光装置

Also Published As

Publication number Publication date
TWI452229B (enrdf_load_stackoverflow) 2014-09-11
TW201333373A (zh) 2013-08-16
BR102013002902A2 (pt) 2015-07-14
KR101301893B1 (ko) 2013-09-04
DE202013100429U1 (de) 2013-03-11
KR20130091231A (ko) 2013-08-16
DE102013100921A1 (de) 2013-08-08

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